Contact resistance calculation method, device and photovoltaic system

Abstract

The application is suitable for the technical field of photovoltaic systems, and specifically provides a contact resistance calculation method and device and a photovoltaic system. The method comprises the following steps: obtaining working condition parameters of a target component in a non-electric contact state, and calculating first pressure data between a first conductive body and a second conductive body in the target component; obtaining working condition parameters of the target component in an electric contact state, and calculating second pressure data between the first conductive body and the second conductive body; and calculating actual contact resistance between the first conductive body and the second conductive body according to the second pressure data and the first pressure data. The application calculates the first pressure data and the second pressure data between the first conductive body and the second conductive body in the non-electric contact state and the electric contact state respectively, and then calculates the actual contact resistance, thereby reducing errors caused by testing, obtaining a contact resistance closer to the actual contact resistance, and effectively improving the precision of the contact resistance between the first conductive body and the second conductive body.

Description

Technical Field

[0001] This invention belongs to the field of photovoltaic system technology, and in particular relates to a contact resistance calculation method, device and photovoltaic system. Background Technology

[0002] A photovoltaic (PV) power generation system is a power generation system that uses the photovoltaic effect of photovoltaic cells to directly convert solar radiation energy into electrical energy.

[0003] Photovoltaic cells typically consist of glass, silicon wafers, circuit boards, solder ribbons, EVA, and tedlar. In practical applications, accurate values ​​of the contact resistance between the circuit board and the solder ribbons are crucial. Traditionally, this is done using testing equipment. However, this method is challenging because the circuit board and solder ribbons are encapsulated within the module after encapsulation, requiring disassembly and reassembly for measurement. Furthermore, the contact resistance between the solder ribbon and the circuit board is affected by thermoelectric coupling. The power supplied by the electric field per unit volume is dissipated as Joule heat on the resistance of the conductive medium. Simultaneously, the temperature of the photovoltaic module rises under solar irradiation, causing structural deformation due to the combined effects of heat and electricity. In actual operation, the pressure at the contact surface between the solder ribbon and the circuit board varies with temperature and structural changes, leading to variations in contact resistance. This results in measurement results being highly susceptible to environmental influences, leading to low accuracy. Summary of the Invention

[0004] This invention provides a method for calculating contact resistance, which solves the problem that testing the contact resistance between circuit boards and solder strips using testing equipment is difficult and has low accuracy.

[0005] This invention is implemented as follows: a method for calculating contact resistance, comprising:

[0006] Obtain the operating parameters of the target component under non-electrical contact conditions, and calculate the first pressure data between the first conductor and the second conductor in the target component;

[0007] The operating parameters of the target component under the condition of electrical contact are obtained, and the second pressure data between the first conductor and the second conductor is calculated.

[0008] The actual contact resistance between the first conductor and the second conductor is calculated based on the second pressure data and the first pressure data.

[0009] Optionally, before the step of obtaining the operating parameters of the target component in a non-electrical contact state and calculating the first pressure data between the first conductor and the second conductor in the target component, the method further includes:

[0010] In response to the user's model creation operation, a simulation model of the target component is generated, wherein the simulation model includes a model of the contact surface between the first conductor and the second conductor.

[0011] Optionally, the step of calculating the actual contact resistance between the first conductor and the second conductor based on the second pressure data and the first pressure data includes:

[0012] According to the preset piezoresistive data list, obtain the second contact resistance and the first contact resistance corresponding to the second pressure data and the first pressure data respectively;

[0013] The actual contact resistance is obtained by subtracting the first contact resistance from the second contact resistance.

[0014] Optionally, the operating parameters include the material parameters of the first conductor and the second conductor, as well as the environmental parameters of the environment in which the first conductor and the second conductor are located.

[0015] Optionally, material parameters include electrical conductivity, constant pressure heat capacity, density, thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and surface emissivity.

[0016] Secondly, this application also provides a contact resistance calculation device, the device comprising:

[0017] The first data acquisition unit is used to acquire the operating parameters of the target component under the state of no electrical contact, and to calculate the first pressure data between the first conductor and the second conductor in the target component.

[0018] The second data acquisition unit is used to acquire the operating parameters of the target component under the state of electrical contact, and to calculate the second pressure data between the first conductor and the second conductor.

[0019] The contact resistance calculation unit is used to calculate the actual contact resistance between the first conductor and the second conductor based on the second pressure data and the first pressure data.

[0020] Optionally, the device further includes:

[0021] The model building unit is used to generate a simulation model of the target component in response to the user's model building operation. The simulation model includes a model of the contact surface between the first conductor and the second conductor.

[0022] Optionally, the contact resistance calculation unit includes;

[0023] The contact resistance acquisition subunit is used to acquire the second contact resistance and the first contact resistance corresponding to the second pressure data and the first pressure data, respectively, according to a preset piezoresistive data list.

[0024] The contact resistance calculation subunit is used to obtain the actual contact resistance by subtracting the first contact resistance from the second contact resistance.

[0025] Optionally, the operating parameters include the material parameters of the first conductor and the second conductor, as well as the environmental parameters of the environment in which the first conductor and the second conductor are located.

[0026] Thirdly, this application also provides a photovoltaic system, which includes the contact resistance calculation device as described above.

[0027] The beneficial effects of this invention are that by acquiring first and second pressure data between the first and second conductors in both the non-electrical contact state and the electrically contact state of the target component, and then calculating the actual contact resistance between the first and second conductors based on the second and first pressure data, this invention eliminates factors that affect the detection effect during actual use, thereby reducing the error caused by the test and obtaining a contact resistance that is closer to the actual value, effectively improving the accuracy of the contact resistance between the first and second conductors. Attached Figure Description

[0028] Figure 1 This is a flowchart illustrating an embodiment of the contact resistance calculation method provided in this application;

[0029] Figure 2 This is a schematic flowchart illustrating the creation of a simulation model for one embodiment of the contact resistance calculation method provided in this application;

[0030] Figure 3 This is a schematic flowchart illustrating the calculation of actual contact resistance in one embodiment of the contact resistance calculation method provided in this application.

[0031] Figure 4 This is a schematic diagram of the module structure of one embodiment of the contact resistance calculation device provided in this application;

[0032] Figure 5 This is a schematic diagram of a photovoltaic module structure according to an embodiment of the contact resistance calculation method provided in this application;

[0033] Figure 6 This is a schematic diagram of the disassembled structure of a photovoltaic module, representing an embodiment of the contact resistance calculation method provided in this application;

[0034] Figure 7 This is a schematic diagram of the structure of the contact surface of the solder strip in one embodiment of the contact resistance calculation method provided in this application;

[0035] Figure 8 This is a schematic diagram of the structure of the contact surface of the weld strip curved surface in one embodiment of the contact resistance calculation method provided in this application;

[0036] Figure 9 This is a schematic diagram of the structure of an electrical contact pair in one embodiment of the contact resistance calculation method provided in this application;

[0037] Figure 10 This is a schematic diagram of the calculation process of an embodiment of the contact resistance calculation method system provided in this application. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0039] The explanations of some of the English abbreviations in this application are as follows:

[0040] EVA is a hot melt adhesive with a thickness between 0.4 mm and 0.6 mm. It has a smooth surface, uniform thickness, and contains a cross-linking agent. It is non-sticky and has anti-stick properties at room temperature. After being adjusted and hot-pressed, it melts, bonds, cross-links, and cures, becoming completely transparent.

[0041] Tedlar is ethylene fluoride, a material used for encapsulation, specifically the backsheet of a solar cell.

[0042] CAD (Computer Aided Drafting) is an interactive computer-aided design and drafting system that is widely used in many industries such as machinery, architecture, home furnishing, and textiles.

[0043] SolidWorks is a 3D CAD system developed based on Windows.

[0044] Windows refers to Microsoft Windows, an operating system developed based on a graphical user interface.

[0045] This invention obtains first and second pressure data between the first and second conductors of the target component in both non-electrical contact and electrically contact states. Then, it calculates the actual contact resistance between the first and second conductors based on the second and first pressure data. This eliminates factors that affect the detection effect during actual use, thereby reducing errors caused by testing and obtaining a contact resistance that is closer to the actual value, effectively improving the accuracy of the contact resistance between the first and second conductors.

[0046] Example 1

[0047] like Figure 1 As shown, this embodiment provides a method for calculating contact resistance, including:

[0048] S1100: Obtain the operating parameters of the target component under the state of no electrical contact, and calculate the first pressure data between the first conductor and the second conductor in the target component;

[0049] S1200: Obtain the operating parameters of the target component under the state of electrical contact, and calculate the second pressure data between the first conductor and the second conductor;

[0050] S1300: Calculate the actual contact resistance between the first conductor and the second conductor based on the second pressure data and the first pressure data.

[0051] In practice, the target component refers to the part whose contact resistance needs to be measured. The target component includes a first conductor and a second conductor, which are in contact with each other to form a contact resistance. Optionally, the target component includes, but is not limited to, photovoltaic modules, and is not limited thereto.

[0052] Optionally, the first pressure data between the first conductor and the second conductor can be calculated by establishing a simulation model using simulation software. Optionally, the simulation software includes, but is not limited to, CAD, SolidWorks, etc., and is not limited here.

[0053] Optionally, the simulation software is installed on a computer, which has a processor. The steps of the contact resistance calculation method provided in this application are executed by this processor. Optionally, the processor can be an actual processor installed on the computer or a virtual processor in the cloud; no specific limitation is made here.

[0054] Optionally, the simulation software can generate various geometric models based on user operations. For example, taking the contact resistance calculation method provided in this application for detecting the contact resistance between the solder strip and the circuit board of a photovoltaic module, the photovoltaic module is the target module, and the solder strip and circuit board are the first conductor and the second conductor, respectively. Figure 5 and Figure 6 As shown, a model of a photovoltaic module can be generated in simulation software first. The photovoltaic module consists of glass, silicon wafer, solder ribbon, circuit board, EVA, and Tedlar. The photovoltaic module is 100, the glass is 101, the silicon wafer is 102, the solder ribbon is 103, the circuit board is 104, the EVA is 105, and the Tedlar is 106. The solder ribbon and the circuit board are in contact, and the resistance at the contact surface between the solder ribbon and the circuit board is the contact resistance between the solder ribbon and the circuit board.

[0055] It should be noted that the contact resistance calculation method provided in this application for calculating the contact resistance between the solder ribbon and the circuit board of a photovoltaic module is an example of one embodiment of this application, and not a specific limitation of this application. In other embodiments, the contact resistance calculation method provided in this application can also be applied to the calculation of contact resistance at the contact points of other conductor circuits, and is not limited here.

[0056] Optionally, operating parameters are set in the simulation model. Specifically, the operating parameters include the parameters of the first conductor and the second conductor in the state of no electrical contact and the state of electrical contact. For ease of understanding, the parameters of the first conductor and the second conductor in the state of no electrical contact are defined as the no-electricity operating parameters, and the parameters of the first conductor and the second conductor in the state of electrical contact are defined as the electrical-connected operating parameters.

[0057] Optionally, the no-electrical-contact state refers to a state in which no current flows through the first and second conductors. In implementation, taking a photovoltaic module as an example, the photovoltaic module can convert light energy into electrical energy and output it. Current will flow through the first conductor (soldering ribbon) and the second conductor (circuit board). As conductive mediums, the first and second conductors have a certain resistance. When current flows, the first and second conductors generate heat, causing changes in their structure and resulting in pressure changes between them. Consequently, the contact resistance between the first and second conductors also changes.

[0058] By setting a state of no electrical contact, the first and second conductors do not deform due to heat generated by the current flow, allowing for the effective detection of the steady-state contact pressure between them. Specifically, the simulation software possesses certain data processing and computational capabilities, enabling it to directly acquire the initial pressure data between the first and second conductors under the no-electrical-contact state.

[0059] Optionally, "electric contact state" refers to the flow of current between the first conductor and the second conductor. Taking a photovoltaic module as an example, the first conductor and the second conductor are the solder ribbon and the circuit board, respectively. When current flows, the solder ribbon and the circuit board will deform due to the heat generated. By inputting the operating parameters under the "electric contact state," more accurate second pressure data can be obtained.

[0060] In some possible embodiments, the operating parameters also include other environmental condition parameters, such as illumination. Taking photovoltaic modules as an example again, photovoltaic modules need to be illuminated to generate electricity, and sunlight will cause the temperature of the photovoltaic module to rise, thereby changing the contact pressure and contact resistance between the first conductor and the second conductor. Therefore, environmental condition parameters can also be taken into account to improve the detection accuracy.

[0061] Optionally, the operating parameters of the target component in the non-electrical contact state are input by the user into the simulation software. After obtaining the operating parameters of the target component in the non-electrical contact state, the simulation software can calculate the first pressure data between the first conductor and the second conductor. Then, the user inputs the operating parameters of the target component in the electrically contact state into the simulation software to obtain the second pressure data between the first conductor and the second conductor in the electrically contact state.

[0062] Optionally, the operating parameters include the material parameters of the first conductor and the second conductor. In some embodiments, the material parameters include, but are not limited to, electrical conductivity, constant pressure heat capacity, density, thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and surface emissivity, etc., which are not limited here.

[0063] In some possible embodiments, the operating parameters also include environmental parameters of the environment in which the first and second conductors are located. Optionally, the environmental parameters refer to the parameters of the setting of the thermal / electrical / mechanical field of the photovoltaic module and the coupling of multiple physical fields during actual use. Among them, the thermal physical field mainly considers the heat generated by solar irradiation and the heat generated by current. Both solar irradiation heating and current heating will cause structural deformation, resulting in changes in contact pressure, thereby obtaining the human pressure data under actual operating conditions.

[0064] After obtaining the first pressure data and the second pressure data, the actual contact resistance between the first conductor and the second conductor can be calculated based on the second pressure data and the first pressure data. Optionally, the first contact resistance and the second contact resistance between the first conductor and the second conductor can be calculated first using the first pressure data and the second pressure data respectively, and then the actual contact resistance between the first conductor and the second conductor can be calculated by subtracting the first contact resistance from the second contact resistance.

[0065] This invention obtains first and second pressure data between the first and second conductors of the target component in both non-electrical contact and electrically contact states. Then, it calculates the actual contact resistance between the first and second conductors based on the second and first pressure data. This eliminates factors that affect the detection effect during actual use, thereby reducing errors caused by testing and obtaining a contact resistance that is closer to the actual value, effectively improving the accuracy of the contact resistance between the first and second conductors.

[0066] Example 2

[0067] In some alternative embodiments, such as Figure 2 As shown, before the steps of obtaining the operating parameters of the target component under non-electrical contact conditions and calculating the first pressure data between the first conductor and the second conductor in the target component, the method further includes:

[0068] S1010. Responding to the user's model creation operation, generate a simulation model of the target component, wherein the simulation model includes a contact surface model between the first conductor and the second conductor.

[0069] In practice, the contact resistance calculation method provided in this application follows these steps: Figure 10 As shown, the simulation process includes model simplification: a simplified geometric model of the photovoltaic module can be imported into the preset simulation software or a three-dimensional model can be drawn directly in the software.

[0070] The simplified model of the contact surface between the solder ribbon and the circuit board is used, treating it as a planar contact. A planar contact surface is as follows: Figure 7 As shown.

[0071] In some embodiments, planar contact or curved surface contact can be selected according to actual needs. If curved surface contact considering roughness is used, the modeling method for roughness-considered surfaces can generate surfaces from point cloud data or generate random surfaces using formulas. Specifically, the formula for generating curved surface contact considering surface roughness is:

[0072] x=s1, y=S, z=k*sum(sum(if((m!=0)||(n!=0),((m^2+n^2)^(-b / 2))*g1(

[0073] The expression `m,n)*cos(2*pi*(m*s1+n*s2)+u1(m,n)),0),m,-N,N),n,-N,N)` is a double sum of integer parameters `m` and `n`, each ranging from -N to N, where N is the defined spatial frequency resolution value, `b` is the spectral exponent value, `k` is the shape factor, `g1` is a Gaussian random function, and `u1` is a normally distributed random function. This parameterized surface is used to cut the solder strip plane into surfaces. The established surfaces are as follows... Figure 8 As shown.

[0074] Assign material parameters to each geometry: Assign material parameters to each geometry according to the actual material. During implementation, the material parameters include electrical conductivity, constant pressure heat capacity, density, thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, surface emissivity, and other parameters.

[0075] The setup of thermal / electrical / mechanical fields and the coupling of multiple physics fields are considered. The thermal physics field mainly considers the heat generated by solar irradiation and electric current. The structure deforms under the action of heat, resulting in changes in contact pressure.

[0076] The calculated pressure value is set as a variable and used as the initial calculated pressure value for the contact pair. This pressure value Ni is updated iteratively at each step of the calculation process, where i is the pressure value of the contact pair calculated in the i-th iteration. When i = 0, N0 is the steady-state contact pressure value between the solder ribbon and the circuit board calculated under electrical contact conditions, i.e., the first calculated pressure data.

[0077] The arrangement of electrical contact pairs, such as Figure 9 As shown, this includes electrical contact pair 1041 and electrical contact pair 1042. The Cooper-Mikic-Yovanovich correlation model is selected by setting the shrinkage conductivity. Surface roughness, average roughness height, and average roughness slope are set. Hardening is defined using microhardness as the hardening parameter. The contact pressure is set to be user-defined, and the contact pressure is updated to the calculated pressure value Ni-1 of the variables from the previous step, where when i=1, N0 is the contact pressure value calculated under the above-mentioned non-electrical contact state. The pressure value converges through iterative calculation to obtain the contact pressure under actual working conditions, thus obtaining the second pressure data under actual working conditions.

[0078] Then, the resistance values ​​are calculated, and the actual contact resistance value at the contact surface between the solder ribbon and the circuit board is calculated based on the calculated resistance values.

[0079] After calibrating the simulation data through actual testing, the contact resistance of circuits based on different design shapes can be calculated quickly, reducing the error caused by testing and providing a theoretical basis for solder strip shape design.

[0080] Example 3

[0081] In some alternative embodiments, such as Figure 3 As shown, the steps for calculating the actual contact resistance between the first conductor and the second conductor based on the second pressure data and the first pressure data include:

[0082] S1310. Obtain the second contact resistance and the first contact resistance corresponding to the second pressure data and the first pressure data respectively according to the preset piezoresistive data list;

[0083] S1320. Subtract the first contact resistance from the second contact resistance to obtain the actual contact resistance.

[0084] During implementation, the processor stores a piezoresistive data list, which contains several contact pressure values ​​and corresponding contact resistance values. After acquiring the first and second pressure data, the corresponding contact resistances can be quickly found using the piezoresistive data list. This yields the first and second contact resistances corresponding to the first and second pressure data, respectively. Subtracting the first contact resistance from the second contact resistance gives the actual contact resistance between the first and second conductors.

[0085] Example 4

[0086] In some embodiments, such as Figure 4 As shown, this application also provides a contact resistance calculation device, the device comprising:

[0087] The first data acquisition unit 100 is used to acquire the operating parameters of the target component under the state of no electrical contact, and to calculate the first pressure data between the first conductor and the second conductor in the target component.

[0088] The second data acquisition unit 200 is used to acquire the operating parameters of the target component under the state of electrical contact, and to calculate the second pressure data between the first conductor and the second conductor.

[0089] The contact resistance calculation unit 300 is used to calculate the actual contact resistance between the first conductor and the second conductor based on the second pressure data and the first pressure data.

[0090] In practice, the target component refers to the part whose contact resistance needs to be measured. The target component includes a first conductor and a second conductor, which are in contact with each other to form a contact resistance. Optionally, the target component includes, but is not limited to, photovoltaic modules, and is not limited thereto.

[0091] Optionally, the first pressure data between the first conductor and the second conductor can be calculated by establishing a simulation model using simulation software. Optionally, the simulation software includes, but is not limited to, CAD, SolidWorks, etc., and is not limited here.

[0092] Optionally, the simulation software is installed on a computer, which has a processor. The steps of the contact resistance calculation method provided in this application are executed by this processor. Optionally, the processor can be an actual processor installed on the computer or a virtual processor in the cloud; no specific limitation is made here.

[0093] Optionally, the simulation software can generate various geometric models based on user operations. For example, taking the contact resistance calculation method provided in this application for detecting the contact resistance between the solder strip and the circuit board of a photovoltaic module, the photovoltaic module is the target module, and the solder strip and circuit board are the first conductor and the second conductor, respectively. Figure 5 and Figure 6 As shown, a model of a photovoltaic module can be generated in simulation software first. The photovoltaic module consists of glass, silicon wafer, solder ribbon, circuit board, EVA, and Tedlar. The photovoltaic module is 100, the glass is 101, the silicon wafer is 102, the solder ribbon is 103, the circuit board is 104, the EVA is 105, and the Tedlar is 106. The solder ribbon and the circuit board are in contact, and the resistance at the contact surface between the solder ribbon and the circuit board is the contact resistance between the solder ribbon and the circuit board.

[0094] It should be noted that the contact resistance calculation method provided in this application for calculating the contact resistance between the solder ribbon and the circuit board of a photovoltaic module is an example of one embodiment of this application, and not a specific limitation of this application. In other embodiments, the contact resistance calculation method provided in this application can also be applied to the calculation of contact resistance at the contact points of other conductor circuits, and is not limited here.

[0095] Optionally, operating parameters are set in the simulation model. Specifically, the operating parameters include the parameters of the first conductor and the second conductor in the state of no electrical contact and the state of electrical contact. For ease of understanding, the parameters of the first conductor and the second conductor in the state of no electrical contact are defined as the no-electricity operating parameters, and the parameters of the first conductor and the second conductor in the state of electrical contact are defined as the electrical-connected operating parameters.

[0096] Optionally, the no-electrical-contact state refers to a state in which no current flows through the first and second conductors. In implementation, taking a photovoltaic module as an example, the photovoltaic module can convert light energy into electrical energy and output it. Current will flow through the first conductor (soldering ribbon) and the second conductor (circuit board). As conductive mediums, the first and second conductors have a certain resistance. When current flows, the first and second conductors generate heat, causing changes in their structure and resulting in pressure changes between them. Consequently, the contact resistance between the first and second conductors also changes.

[0097] By setting a state of no electrical contact, the first and second conductors do not deform due to heat generated by the current flow, allowing for the effective detection of the steady-state contact pressure between them. Specifically, the simulation software possesses certain data processing and computational capabilities, enabling it to directly acquire the initial pressure data between the first and second conductors under the no-electrical-contact state.

[0098] Optionally, "electric contact state" refers to the flow of current between the first conductor and the second conductor. Taking a photovoltaic module as an example, the first conductor and the second conductor are the solder ribbon and the circuit board, respectively. When current flows, the solder ribbon and the circuit board will deform due to the heat generated. By inputting the operating parameters under the "electric contact state," more accurate second pressure data can be obtained.

[0099] In some possible embodiments, the operating parameters also include other environmental condition parameters, such as illumination. Taking photovoltaic modules as an example again, photovoltaic modules need to be illuminated to generate electricity, and sunlight will cause the temperature of the photovoltaic module to rise, thereby changing the contact pressure and contact resistance between the first conductor and the second conductor. Therefore, environmental condition parameters can also be taken into account to improve the detection accuracy.

[0100] Optionally, the operating parameters of the target component in the non-electrical contact state are input by the user into the simulation software. After obtaining the operating parameters of the target component in the non-electrical contact state, the simulation software can calculate the first pressure data between the first conductor and the second conductor. Then, the user inputs the operating parameters of the target component in the electrically contact state into the simulation software to obtain the second pressure data between the first conductor and the second conductor in the electrically contact state.

[0101] Optionally, the operating parameters include the material parameters of the first conductor and the second conductor. In some embodiments, the material parameters include, but are not limited to, electrical conductivity, constant pressure heat capacity, density, thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and surface emissivity, etc., which are not limited here.

[0102] In some possible embodiments, the operating parameters also include environmental parameters of the environment in which the first and second conductors are located. Optionally, the environmental parameters refer to the parameters of the setting of the thermal / electrical / mechanical field of the photovoltaic module and the coupling of multiple physical fields during actual use. Among them, the thermal physical field mainly considers the heat generated by solar irradiation and the heat generated by current. Both solar irradiation heating and current heating will cause structural deformation, resulting in changes in contact pressure, thereby obtaining the human pressure data under actual operating conditions.

[0103] After obtaining the first pressure data and the second pressure data, the actual contact resistance between the first conductor and the second conductor can be calculated based on the second pressure data and the first pressure data. Optionally, the first contact resistance and the second contact resistance between the first conductor and the second conductor can be calculated first using the first pressure data and the second pressure data respectively, and then the actual contact resistance between the first conductor and the second conductor can be calculated by subtracting the first contact resistance from the second contact resistance.

[0104] This invention obtains first and second pressure data between the first and second conductors of the target component in both non-electrical contact and electrically contact states. Then, it calculates the actual contact resistance between the first and second conductors based on the second and first pressure data. This eliminates factors that affect the detection effect during actual use, thereby reducing errors caused by testing and obtaining a contact resistance that is closer to the actual value, effectively improving the accuracy of the contact resistance between the first and second conductors.

[0105] Optionally, the device further includes:

[0106] The model building unit is used to generate a simulation model of the target component in response to the user's model building operation. The simulation model includes a model of the contact surface between the first conductor and the second conductor.

[0107] Optionally, the contact resistance calculation unit 300 includes;

[0108] The contact resistance acquisition subunit is used to acquire the second contact resistance and the first contact resistance corresponding to the second pressure data and the first pressure data, respectively, according to a preset piezoresistive data list.

[0109] The contact resistance calculation subunit is used to obtain the actual contact resistance by subtracting the first contact resistance from the second contact resistance.

[0110] Optionally, the operating parameters include the material parameters of the first conductor and the second conductor, as well as the environmental parameters of the environment in which the first conductor and the second conductor are located.

[0111] Those skilled in the art will clearly understand that, for the sake of convenience and indirectness, the structure and implementation principle of the contact resistance calculation device described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments one to three, and will not be repeated here.

[0112] Example 5

[0113] In some embodiments, this application also provides a photovoltaic system, which includes the contact resistance calculation device as described above.

[0114] Those skilled in the art will clearly understand that, for the sake of convenience and indirectness, the structure and implementation principle of the photovoltaic system described above can be referred to the corresponding structure and implementation principle in the aforementioned embodiments one to four, and will not be repeated here.

[0115] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for calculating contact resistance, characterized in that, The method includes: The operating parameters of the target component under the state of no electrical contact are obtained, and the first pressure data between the first conductor and the second conductor in the target component is calculated. Specifically, after obtaining the operating parameters of the target component under the state of no electrical contact, the simulation software calculates the first pressure data between the first conductor and the second conductor. The operating parameters of the target component under the state of electrical contact are obtained, and the second pressure data between the first conductor and the second conductor is calculated. Specifically, the simulation software obtains the operating parameters of the target component under the state of electrical contact in order to obtain the second pressure data between the first conductor and the second conductor under the state of electrical contact. The actual contact resistance between the first conductor and the second conductor is calculated based on the second pressure data and the first pressure data; specifically, the second contact resistance and the first contact resistance corresponding to the second pressure data and the first pressure data are obtained respectively according to a preset piezoresistive data list; the actual contact resistance is obtained by subtracting the first contact resistance from the second contact resistance.

2. The contact resistance calculation method as described in claim 1, characterized in that, Before the step of acquiring the operating parameters of the target component under non-electrical contact conditions and calculating the first pressure data between the first conductor and the second conductor in the target component, the method further includes: In response to the user's model-building operation, a simulation model of the target component is generated, wherein the simulation model includes a contact surface model between the first conductor and the second conductor.

3. The contact resistance calculation method as described in claim 1 or 2, characterized in that, The operating parameters include the material parameters of the first conductor and the second conductor, as well as the environmental parameters of the environment in which the first conductor and the second conductor are located.

4. The contact resistance calculation method as described in claim 3, characterized in that, The material parameters include electrical conductivity, constant pressure heat capacity, density, thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and surface emissivity.

5. A contact resistance calculation device, characterized in that, The device includes: The first data acquisition unit is used to acquire the operating parameters of the target component under the state of no electrical contact, and to calculate the first pressure data between the first conductor and the second conductor in the target component; specifically, the first data acquisition unit is also used to calculate the first pressure data between the first conductor and the second conductor after the simulation software acquires the operating parameters of the target component under the state of no electrical contact. The second data acquisition unit is used to acquire the operating parameters of the target component under the state of electrical contact, and to calculate the second pressure data between the first conductor and the second conductor. Specifically, the second data acquisition unit is also used to acquire the operating parameters of the target component under the state of electrical contact through simulation software, so as to acquire the second pressure data between the first conductor and the second conductor under the state of electrical contact. A contact resistance calculation unit is used to calculate the actual contact resistance between the first conductor and the second conductor based on the second pressure data and the first pressure data. Specifically, the contact resistance calculation unit includes a contact resistance acquisition subunit and a contact resistance calculation subunit. The contact resistance acquisition subunit is used to acquire the second contact resistance and the first contact resistance corresponding to the second pressure data and the first pressure data, respectively, according to a preset piezoresistive data list. The contact resistance calculation subunit is used to subtract the first contact resistance from the second contact resistance to obtain the actual contact resistance.

6. The contact resistance calculation device as described in claim 5, characterized in that, The device further includes: The model building unit is used to generate a simulation model of the target component in response to the user's model building operation, wherein the simulation model includes a contact surface model between the first conductor and the second conductor.

7. The contact resistance calculation device as described in claim 5 or 6, characterized in that, The operating parameters include the material parameters of the first conductor and the second conductor, as well as the environmental parameters of the environment in which the first conductor and the second conductor are located.

8. A photovoltaic system, characterized in that, The photovoltaic system includes a contact resistance calculation device as described in any one of claims 5 to 7.

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