三维集成电路热应力计算方法、装置、存储介质及处理器
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ACAD OF MATHEMATICS & SYSTEMS SCIENCE - CHINESE ACAD OF SCI
- Filing Date
- 2023-03-14
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies cannot quickly and efficiently calculate the thermal stress results of three-dimensional integrated circuits at the full chip scale, resulting in a large amount of computation and making it impossible to effectively analyze the reliability and performance of the chip.
By constructing the original problem model and transforming it into a background problem model and multiple auxiliary sub-problem models, the displacements of these models are solved using the finite element method, and the thermal stress value of the three-dimensional integrated circuit is calculated using the superposition method, thus simplifying the calculation process.
It enables rapid and efficient calculation of thermal stress in three-dimensional integrated circuits at the entire chip scale, improving computational efficiency and accuracy, and effectively analyzing chip reliability and performance.
Smart Images
Figure CN116384181B_ABST