Multilayer electronic component

Abstract

A multilayer electronic component has a main body and a non-conductive resin layer. The non-conductive resin layer includes a main body covering portion provided in a region of an outer surface of the main body in which an electrode layer of an external electrode is not provided, and an extension portion extending from the main body covering portion between the electrode layer of the external electrode and a conductive resin layer, thereby suppressing arc discharge, improving bending strength, and improving moisture resistance.

Description

[0001] This application is a divisional application of the invention patent application "Multilayer Electronic Components" filed on July 16, 2020, with application number 202010688179.X. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs) are multilayer electronic components and can be plate capacitors mounted on printed circuit boards of various electronic products, such as imaging devices including liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, mobile phones, etc., for charging or discharging from them.

[0004] Such multilayer ceramic capacitors can be used as components in various electronic devices due to their relatively small size, relatively high capacitance, and relatively easy installation. With the miniaturization of various electronic devices (such as computers, mobile devices, etc.) and the increase in output, the demand for miniaturized and high-capacitance multilayer ceramic capacitors is increasing.

[0005] Furthermore, with the recent increase in interest in vehicle electrical / electronic components, multilayer ceramic capacitors are also beginning to require relatively high reliability and strength characteristics for use in vehicles or infotainment systems.

[0006] To ensure high reliability and high strength, a method has been proposed to replace the traditional external electrode, which includes an electrode layer, with a double-layer structure that includes an electrode layer and a conductive resin layer.

[0007] In a two-layer structure comprising an electrode layer and a conductive resin layer, a resin composition including a conductive material is coated onto the electrode layer to absorb external impacts and prevent plating solution penetration. As a result, reliability is improved.

[0008] However, with the development of electric vehicles, autonomous vehicles, and other technologies in the automotive industry, there is a greater need for multilayer ceramic capacitors, and the multilayer ceramic capacitors used in automobiles and other applications need to ensure more stringent moisture resistance, reliability, and flexural strength characteristics. Summary of the Invention

[0009] One aspect of this disclosure is to provide a multilayer electronic component capable of suppressing arc discharge.

[0010] One aspect of this disclosure is to provide a multilayer electronic component with improved flexural strength characteristics.

[0011] One aspect of this disclosure is to provide a multilayer electronic component with improved moisture-proof properties.

[0012] One aspect of this disclosure is to provide a multilayer electronic component in which the electrical connection between the electrode layer and the conductive resin layer is improved to ensure a low equivalent series resistance (ESR).

[0013] However, the purpose of this disclosure is not limited to the foregoing, but more generally includes the ideas described below.

[0014] According to one aspect of this disclosure, a multilayer electronic component includes a body having a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and a corresponding dielectric layer being interposed between the first inner electrode and the second inner electrode, and the body having a first surface and a second surface opposite to each other in a stacking direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other. A first outer electrode includes a first electrode layer connected to the first inner electrode and a first conductive resin layer disposed on the first electrode layer, and is divided into a first connecting portion disposed on the third surface of the body and a first strip portion extending from the first connecting portion to a portion of each of the first surface, the second surface, the fifth surface and the sixth surface. A second outer electrode includes a second electrode layer connected to the second inner electrode and a second conductive resin layer disposed on the second electrode layer, and is divided into a second connecting portion disposed on the fourth surface of the body and a second strip portion extending from the second connecting portion to a portion of each of the first surface, the second surface, the fifth surface and the sixth surface. The non-conductive resin layer has a main body cover, a first extension, and a second extension. The main body cover is disposed in a region on the outer surface of the main body where neither the first electrode layer nor the second electrode layer is disposed. The first extension is configured to extend from the main body cover between the first electrode layer and the first conductive resin layer in the first strip portion. The second extension is configured to extend from the main body cover between the second electrode layer and the second conductive resin layer in the second strip portion.

[0015] According to another aspect of this disclosure, a multilayer electronic component includes: a body having a first internal electrode and a second internal electrode, the first internal electrode and the second internal electrode being alternately stacked to overlap each other and a dielectric layer interposed between the first internal electrode and the second internal electrode; and a first external electrode and a second external electrode, respectively connected to the first internal electrode and the second internal electrode, each of the first external electrode and the second external electrode including an electrode layer connected to the first internal electrode or the second internal electrode, and each including a conductive resin layer disposed on the electrode layer. The first external electrode and the second external electrode are disposed on respective opposing outer surfaces of the body, and each extends from the respective opposing outer surface of the body to an adjacent outer surface and a corner between the respective opposing outer surface and the adjacent outer surface, and a non-conductive resin layer is disposed on the outer surface of the body in a region where the electrode layers of the first external electrode and the second external electrode are not disposed, and in each of the opposing outer surface and the adjacent outer surface where the first external electrode and the second external electrode are disposed, the non-conductive resin layer is also disposed between the electrode layer of each of the first external electrode and the second external electrode and the conductive resin layer. Attached Figure Description

[0016] The above and other aspects, features, and advantages of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 This is a schematic perspective view of a multilayer electronic assembly according to embodiments of the present disclosure;

[0018] Figure 2 It is along Figure 1 A cross-sectional view taken from line I-I' in the diagram;

[0019] Figure 3 This is a schematic exploded perspective view of a body in which a dielectric layer and an inner electrode are stacked, according to an embodiment of the present disclosure.

[0020] Figure 4 yes Figure 2 A magnified view of region P in the image;

[0021] Figure 5 This is a schematic perspective view of a multilayer electronic assembly according to another embodiment of the present disclosure;

[0022] Figure 6 It is along Figure 5 A cross-sectional view taken from line II-II' in the diagram;

[0023] Figure 7 The results of an arc discharge test are shown for a sample sheet (comparative example) in which no non-conductive resin layer is provided.

[0024] Figure 8 Measurement results of an arc discharge test on a sample sheet (invention example) having a non-conductive resin layer disposed therein, according to an embodiment of the present disclosure, are shown; and

[0025] Figure 9 It is along the process of adding a coating. Figure 1 The cross-sectional view taken from line I-I' in the diagram. Detailed Implementation

[0026] In the following description, embodiments of the present disclosure will be illustrated with reference to specific examples and accompanying drawings. However, embodiments of the present disclosure may be modified to have various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure may be provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements indicated by the same reference numerals in the drawings may be the same elements.

[0027] In the accompanying drawings, to make this disclosure clear, parts irrelevant to the description will be omitted, and thicknesses may be enlarged to clearly show layers and areas. The same reference numerals will be used to denote the same components. Furthermore, throughout the specification, unless otherwise specified, when an element is referred to as "comprising" or "including" another element, it means that the element may also include other elements, but does not exclude other elements.

[0028] In the accompanying drawings, the X direction can be defined as a second direction, the L direction, or the length direction; the Y direction can be defined as a third direction, the W direction, or the width direction; and the Z direction can be defined as a first direction, the stacking direction, the T direction, or the thickness direction.

[0029] Multilayer electronic components

[0030] Figure 1 This is a schematic perspective view of a multilayer electronic assembly according to an embodiment.

[0031] Figure 2 It is along Figure 1 The cross-sectional view taken from line I-I' in the diagram.

[0032] Figure 3 This is a schematic exploded perspective view of a body in which a dielectric layer and an internal electrode are stacked, according to an embodiment.

[0033] Figure 4 yes Figure 2 A magnified view of region P in the image.

[0034] In the following text, reference will be made to Figures 1 to 4 A multilayer electronic assembly 100 according to an embodiment is described.

[0035] The multilayer electronic assembly 100 according to an embodiment may include: a body 110, including a dielectric layer 111 and a first inner electrode 121 and a second inner electrode 122, wherein the first inner electrode 121 and the second inner electrode 122 are alternately stacked and the corresponding dielectric layer 111 is interposed therebetween, and the body 110 has a first surface 1 and a second surface 2 opposite to each other in the stacking direction (Z direction), a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other; a first outer electrode 131, including a first electrode layer 131a connected to the first inner electrode 121 and a first conductive resin layer 131b disposed on the first electrode layer 131a, and having a first connecting portion A1 disposed on the third surface 3 of the body 110 and a first strip extending from the first connecting portion A1 to a portion of each of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6. Part B1; the second outer electrode 132 includes a second electrode layer 132a connected to the second inner electrode 122 and a second conductive resin layer 132b disposed on the second electrode layer 132a, and has a second connecting portion A2 disposed on the fourth surface 4 of the body 110 and a second strip portion B2 extending from the second connecting portion A2 to a portion of each of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6; and a non-conductive resin layer 140 having a main body cover portion 143, a first extension portion 141 and a second extension portion 142, the main body cover portion 143 being disposed in a region on the outer surface of the body 110 where the first electrode layer 131a and the second electrode layer 132a are not disposed, the first extension portion 141 being configured to extend from the main body cover portion 143 between the first electrode layer 131a and the first conductive resin layer 131b of the first strip portion B1, and the second extension portion 142 being configured to extend from the main body cover portion 143 between the second electrode layer 132a and the second conductive resin layer 132b of the second strip portion B2.

[0036] In the main body 110, dielectric layer 111 and internal electrodes 121 and 122 are alternately stacked.

[0037] The body 110 is not limited in shape, but may have a hexahedral shape or a similar shape. Because the ceramic powder particles included in the body 110 shrink during sintering, the body 110 may have a generally hexahedral shape, rather than a hexahedral shape with perfectly straight lines or straight edges.

[0038] The main body 110 may have: a first surface 1 and a second surface 2, which are opposite to each other in the thickness direction (Z direction); a third surface 3 and a fourth surface 4, which are connected to the first surface 1 and the second surface 2 and are opposite to each other in the length direction (X direction); and a fifth surface 5 and a sixth surface 6, which are connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4 and are opposite to each other in the width direction (Y direction).

[0039] The multiple dielectric layers 111 constituting the main body 110 are in a sintered state, and the dielectric layers 111 can be integrated with each other, so that the boundaries between them are not easily obvious without the use of a scanning electron microscope (SEM).

[0040] According to the embodiments, the raw materials used to form the dielectric layer 111 are not limited, as long as sufficient capacitance can be obtained. For example, barium titanate-based materials, lead-based perovskite composite materials, strontium titanate-based materials, etc., can be used.

[0041] For the purposes of this disclosure, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc., can be added to powders such as barium titanate (BaTiO3) as materials for forming dielectric layer 111.

[0042] The main body 110 may have: a capacitor forming portion disposed in the main body 110, wherein a first inner electrode 121 and a second inner electrode 122 are arranged to be stacked alternately on each other and a dielectric layer 111 is disposed between them to form a capacitor; an upper protective layer 112 disposed above the capacitor forming portion; and a lower protective layer 113 disposed below the capacitor forming portion.

[0043] The capacitor forming section can help form the capacitor, and can be formed by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 with a dielectric layer 111 between them.

[0044] The upper protective layer 112 and the lower protective layer 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor forming portion in the vertical direction, and can substantially prevent the internal electrode from being damaged due to physical or chemical stress.

[0045] The upper protective layer 112 and the lower protective layer 113 may not include internal electrodes and may include the same material as the dielectric layer 111.

[0046] Multiple internal electrodes 121 and 122 may be configured to be stacked on top of each other with a dielectric layer 111 between them.

[0047] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122, which are arranged to be stacked alternately on each other and with a corresponding dielectric layer between them.

[0048] The first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4, respectively.

[0049] Reference Figure 2 The first inner electrode 121 may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4. The first outer electrode 131 may be disposed on the third surface 3 of the body 110 to be connected to the first inner electrode 121, and the second outer electrode 132 may be disposed on the fourth surface 4 of the body 110 to be connected to the second inner electrode 122.

[0050] For example, the first inner electrode 121 is connected to the first outer electrode 131 instead of the second outer electrode 132, and the second inner electrode 122 is connected to the second outer electrode 132 instead of the first outer electrode 131. Therefore, the first inner electrode 121 is formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second inner electrode 122 is formed to be spaced apart from the third surface 3 by a predetermined distance.

[0051] The first inner electrode 121 and the second inner electrode 122 can be electrically isolated from each other by a dielectric layer 111 disposed between them.

[0052] Reference Figure 3 The main body 110 can be formed by alternately stacking dielectric layers 111 on which a first internal electrode 121 is printed and dielectric layers 111 on which a second internal electrode 122 is printed in the thickness direction (Z direction) and sintering the alternately stacked dielectric layers 111.

[0053] The materials used to form the first internal electrode 121 and the second internal electrode 122 are not limited. For example, the first internal electrode 121 and the second internal electrode 122 can be formed using a conductive paste containing noble metal materials (such as palladium (Pd), palladium-silver (Pd-Ag) alloy, etc.), nickel (Ni), and copper (Cu).

[0054] The methods for printing conductive paste can include screen printing, gravure printing, etc., but are not limited to these.

[0055] External electrodes 131 and 132 are disposed on the main body 110, and respectively include electrode layers 131a and 132a and conductive resin layers 131b and 132b.

[0056] The external electrodes 131 and 132 may include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122.

[0057] The first external electrode 131 includes a first electrode layer 131a and a first conductive resin layer 131b, and the second external electrode 132 includes a second electrode layer 132a and a second conductive resin layer 132b.

[0058] When the first external electrode 131 refers to its setting position Figure 2 When divided, the first external electrode 131 has a first connecting portion A1 disposed on the third surface 3 of the main body and a first strip portion B1 extending from the first connecting portion A1 to a portion of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6.

[0059] The area between the first connecting portion A1 and the first strip portion B1 can be defined as the first corner portion C1.

[0060] When the second external electrode 132 is divided according to its setting position, the second external electrode 132 has a second connecting portion A2 provided on the fourth surface 4 of the main body and a second strip portion B2 extending from the second connecting portion A2 to a portion of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6.

[0061] The area between the second connecting part A2 and the second strip part B2 can be defined as the second corner part C2.

[0062] The first electrode layer 131a and the second electrode layer 132a can be formed from any material, as long as it is a conductive material (such as a metal), and the specific material can be determined by taking into account electrical properties, structural stability, etc.

[0063] For example, the first electrode layer 131a and the second electrode layer 132a may include conductive metal and glass.

[0064] The conductive metal used for electrode layers 131a and 132a is not limited, as long as it can be electrically connected to the respective internal electrode to form a capacitor, and may include at least one selected from the group consisting of, for example, copper (Cu), silver (Ag), nickel (Ni) and alloys thereof.

[0065] Electrode layers 131a and 132a can be formed by coating a conductive paste prepared by adding glass frit to conductive metal powder particles and sintering the conductive paste.

[0066] When the first electrode layer 131a and the second electrode layer 132a comprise conductive metal and glass, the corners where the connecting portions A1 and A2 intersect with the strip portions B1 and B2 may be thin, or the ends of the strip portions B1 and B2 may detach from the body 110. Therefore, when the first electrode layer 131a and the second electrode layer 132a comprise conductive metal and glass, moisture-proof reliability may be problematic, while the present invention may be more effective in improving moisture-proof reliability.

[0067] The first electrode layer 131a and the second electrode layer 132a can be formed by atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, etc.

[0068] Furthermore, the first electrode layer 131a and the second electrode layer 132a can be formed by transferring a sheet including a conductive metal onto the body 110.

[0069] The conductive resin layers 131b and 132b may include a conductive metal and a matrix resin.

[0070] The conductive metal included in the conductive resin layers 131b and 132b is used to electrically connect the conductive resin layers 131b and 132b to the plating formed thereon.

[0071] The conductive metal included in the conductive resin layers 131b and 132b is not limited, as long as it is electrically connectable to the plating, and may include at least one selected from the group consisting of, for example, copper (Cu), silver (Ag), nickel (Ni) and alloys thereof.

[0072] The conductive metal included in the conductive resin layers 131b and 132b may include at least one of spherical powder particles and flake powder particles. For example, the conductive metal may consist only of flake powder particles, or it may consist only of spherical powder particles, or it may include a mixture of flake powder particles and spherical powder particles.

[0073] Spherical powder particles may have an imperfect spherical shape and may have a shape in which, for example, the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) is 1.45 or less.

[0074] Flake-shaped powder particles refer to powder particles that have a flat and elongated shape, and are not limited to a specific shape. For example, the ratio of the length of the long axis to the length of the short axis (long axis / short axis) can be 1.95 or greater.

[0075] The lengths of the major and minor axes of spherical and flake-shaped powder particles can be measured from images obtained by scanning a cross-section (LT section) taken from the central portion of a multilayer electronic component in the width (Y) direction along the X and Z directions.

[0076] The matrix resin included in the conductive resin layers 131b and 132b is used to ensure adhesion and to absorb impact.

[0077] The matrix resin included in the conductive resin layers 131b and 132b is not limited, as long as it has adhesive and shock-absorbing properties and is mixed with conductive metal powder particles to prepare a paste, and may include, for example, epoxy resins.

[0078] In addition, the conductive resin layer may include multiple metal particles, intermetallic compounds, and a matrix resin.

[0079] According to this disclosure, a non-conductive resin layer (e.g., 140) may be configured to extend between an electrode layer (e.g., 131a and 132a) and a conductive resin layer (e.g., 131b and 132b), or multiple island-shaped adhesive portions may be disposed on the first electrode layer of the first connecting portion and the second electrode layer of the second connecting portion. Therefore, the contact area between the electrode layer and the conductive resin layer may be reduced. Consequently, the electrical connectivity between the electrode layer and the conductive resin layer may deteriorate.

[0080] However, according to embodiments, stable electrical connectivity can be ensured when the conductive resin layer comprises multiple metal particles, intermetallic compounds, and a matrix resin.

[0081] Intermetallic compounds can be used to connect multiple metal particles to improve electrical connectivity, and can also be used to surround multiple metal particles and connect multiple metal particles to each other.

[0082] In this case, the intermetallic compound may include a metal with a melting point lower than the curing temperature of the matrix resin.

[0083] For example, since the intermetallic compound includes a metal with a melting point lower than the curing temperature of the matrix resin, the metal with a melting point lower than the curing temperature of the matrix resin melts during the drying and curing process and forms an intermetallic compound with a portion of the metal particles to surround the metal particles. In this case, the intermetallic compound may specifically include a metal with a low melting point of 300°C or lower.

[0084] For example, intermetallic compounds may include tin (Sn) with a melting point of 213°C to 220°C. During the drying and curing process, Sn melts. The molten Sn wets high-melting-point metal particles such as Ag, Ni, or Cu due to capillary action and reacts with a portion of the Ag, Ni, or Cu metal particles to form intermetallic compounds such as Ag3Sn, Ni3Sn4, Cu6Sn5, Cu3Sn, etc. The unreacted Ag, Ni, or Cu remains as metal particles.

[0085] Therefore, the multiple metal particles may include one or more of Ag, Ni and Cu, and the intermetallic compound may include one or more of Ag3Sn, Ni3Sn4, Cu6Sn5 and Cu3Sn.

[0086] Reference Figure 9 The plating layers 131c and 132c can be separately disposed on the conductive resin layers 131b and 132b, respectively, to improve the mounting characteristics of the external electrodes 131 and 132.

[0087] For example, plating layers 131c and 132c may be Ni plating layers or Sn plating layers, or may include Ni plating layers and Sn plating layers formed sequentially on the conductive resin layer, respectively. Optionally, plating layers 131c and 132c may include multiple Ni plating layers and / or multiple Sn plating layers.

[0088] The non-conductive resin layer 140 has: a main body cover 143 disposed on the outer surface of the main body 110 in a region where the first electrode layer 131a and the second electrode layer 132a are not disposed; a first extension 141 configured to extend from the main body cover 143 between the first electrode layer 131a and the first conductive resin layer 131b of the first strip portion B1; and a second extension 142 configured to extend from the main body cover 143 between the second electrode layer 132a and the second conductive resin layer 132b of the second strip portion B2.

[0089] The non-conductive resin layer 140 is used to prevent stress generated when the substrate deforms due to heat and physical shock when the multilayer electronic component 100 is mounted on the substrate from being transmitted to the body 110, and to prevent cracking.

[0090] In addition, the non-conductive resin layer 140 is used to improve moisture resistance by blocking the path of moisture penetration.

[0091] The matrix resin included in the conductive resin layers 131b and 132b also plays a role in absorbing impact, but the role of the matrix resin is limited.

[0092] Furthermore, when the lengths of the first conductive resin layer 131b and the second conductive resin layer 132b are increased to enhance bending strength, under high voltage, an arc discharge may occur between the ends of the first conductive resin layer 131b and the second conductive resin layer 132b, thus a short circuit may occur between the first conductive resin layer 131b and the second conductive resin layer 132b.

[0093] Furthermore, since the main body cover 143 has insulating properties, it is disposed in the area on the outer surface of the main body 110 where the first electrode layer 131a and the second electrode layer 132a are not disposed. Therefore, the main body cover 143 is disposed in a wider area to more effectively absorb impact and suppress stress propagation.

[0094] The main body cover 143 can prevent moisture from penetrating into the main body 110 through the outer surface of the main body 110 by sealing the pores or cracks of the main body 110.

[0095] Furthermore, by providing the main body cover 143, it is not necessary to increase the length of the first conductive resin layer 131b and the second conductive resin layer 132b, so as to prevent arc discharge caused therefrom.

[0096] The first extension 141 is configured to extend from the main body cover 143 between the first electrode layer 131a and the first conductive resin layer 131b of the first strip B1, for suppressing stress propagation to the main body 110 and for preventing cracking.

[0097] In addition, the first extension 141 is used to suppress the separation between the end of the first electrode layer 131a disposed in the first strip B1 and the main body 110, so as to improve the moisture-proof reliability.

[0098] The second extension 142 is configured to extend from the main body cover 143 between the second electrode layer 132a and the second conductive resin layer 132b of the second strip B2, for suppressing stress propagation to the main body 110 and for preventing cracking.

[0099] Furthermore, the second extension 142 is used to improve moisture-proof reliability by suppressing the separation between the end of the second electrode layer 132a disposed in the second strip B2 and the main body 110.

[0100] The non-conductive resin layer 140 can be formed by: forming a first electrode layer 131a and a second electrode layer 132a on a body 110 including a dielectric layer and an inner electrode; forming the non-conductive resin layer 140 on the exposed outer surface of the body 110 and on the first electrode layer 131a and the second electrode layer 132a; and removing the non-conductive resin layer 140 formed on the connection portion A1 of the first electrode layer 131a and the connection portion A2 of the second electrode layer 132a.

[0101] Methods for removing the non-conductive resin layer 140 may include, for example, laser processing, mechanical polishing, dry etching, wet etching, or masking deposition with a protective layer.

[0102] The non-conductive resin layer 140 may include a matrix resin.

[0103] The matrix resin included in the non-conductive resin layer 140 is not limited, as long as it provides adhesion and shock absorption, and can be, for example, an epoxy resin.

[0104] The non-conductive resin layer 140 may include a matrix resin and may include one or more of silicon dioxide, aluminum oxide, glass, and zirconium dioxide (ZrO2).

[0105] Silica, alumina, glass, and zirconium dioxide (ZrO2) are used to improve the coating shape of the non-conductive resin layer 140. Furthermore, silica, alumina, glass, and zirconium dioxide (ZrO2) can also be used to improve heat resistance.

[0106] Figure 7 The results are shown by preparing a total of ten sample pieces (comparative examples, #1 to #10) in which the non-conductive resin layer 140 is not provided and repeatedly measuring the arc discharge generation voltage of each sample piece (comparative examples, #1 to #10) five times.

[0107] Figure 8 The results are shown by preparing a total of ten sample pieces (invention examples, #11 to #20) in which a non-conductive resin layer 140 according to an embodiment is disposed and repeatedly measuring the arc discharge generation voltage of each sample piece (invention examples, #11 to #20) five times.

[0108] refer to Figure 7 There were four cases where the arc discharge occurred at a voltage of 2kV or lower, and the average voltage at which the arc discharge occurred was about 2.5kV.

[0109] In addition, refer to Figure 8 In the case of the inventive example, no arc discharge occurred up to a voltage of 2.5 kV in a total of 50 experiments, and the average arc discharge voltage was 3.0 kV or greater. As a result, the inventive example demonstrates excellent arc discharge suppression performance.

[0110] The first extension 141 may be configured as a first corner C1 covering the first electrode layer 131a, and the second extension 142 may be configured as a second corner C2 covering the second electrode layer 132a.

[0111] When electrode layers 131a and 132a comprise conductive metal and glass, the electrode layers 131a and 132a at the corners C1 and C2 (e.g., in the region between the connecting portions A1 and A2 and the strip portions B1 and B2) can be formed as thin. Therefore, the corners C1 and C2 can act as major moisture penetration paths, thus degrading the moisture-proof reliability.

[0112] In this respect, the extensions 141 and 142 can be configured to cover the corners C1 and C2 of the electrode layers 131a and 132a, thereby blocking the moisture penetration path to improve moisture resistance reliability.

[0113] Furthermore, the first extension 141 may be configured to extend between the first electrode layer 131a and the first conductive resin layer 131b of the first connection portion A1, and the second extension 142 may be configured to extend between the second electrode layer 132a and the second conductive resin layer 132b of the second connection portion A2, thereby reliably blocking the moisture penetration path to further improve the moisture-proof reliability.

[0114] The length of the first strip B1 of the first conductive resin layer 131b and the length of the second strip B2 of the second conductive resin layer 132b can both be 10% to 20% of the length of the main body 110.

[0115] Reference Figure 2 and Figure 4 The length of the main body can represent the distance between the third and fourth surfaces of the main body. The length of the first strip portion B1 of the first conductive resin layer 131b can be the distance B1b from the third surface of the main body to the end of the first conductive resin layer 131b. The length of the second strip portion B2 of the second conductive resin layer 132b can be the distance from the fourth surface of the main body to the end of the second conductive resin layer 132b.

[0116] When the non-conductive resin layer 140 is not provided, the length of the first strip B1 of the first conductive resin layer 131b and the length of the second strip B2 of the second conductive resin layer 132b can both be maintained at 20% to 30% of the length of the main body 110 to ensure bending strength.

[0117] Furthermore, when the non-conductive resin layer 140 according to the embodiment is provided, sufficient bending strength can be ensured even if the length of the first strip portion B1 of the first conductive resin layer 131b and the second strip portion B2 of the second conductive resin layer 132b are both 10% to 20% of the length of the main body 110. Therefore, the arc discharge suppression effect can be further improved.

[0118] Furthermore, to further improve bending strength, the distance B1b from the third surface of the body 110 to the end of the first conductive resin layer 131b can be larger than the distance B1a from the third surface of the body 110 to the end of the first electrode layer 131a. Similarly, the distance from the fourth surface of the body 110 to the end of the second conductive resin layer 132b can be larger than the distance from the fourth surface of the body 110 to the end of the second electrode layer 132a.

[0119] Figure 5 This is a schematic perspective view of a multilayer electronic assembly according to another embodiment.

[0120] Figure 6 It is along Figure 5 The cross-sectional view taken from line II-II' in the diagram.

[0121] In the following text, reference will be made to Figure 5 and Figure 6 A multilayer electronic assembly 100' according to another embodiment is described. However, descriptions common to the multilayer electronic assembly 100 according to the embodiment will be omitted to avoid repetition.

[0122] According to another embodiment, the multilayer electronic assembly 100' has a plurality of island-shaped adhesive portions 151 and 152, which are disposed on a first connecting portion A1 of a first electrode layer 131a and a second connecting portion A2 of a second electrode layer 132a.

[0123] Reference Figure 6 Multiple island-shaped adhesive portions 151 may be disposed between the first electrode layer 131a and the first conductive resin layer 131b of the first connecting portion A1, and multiple island-shaped adhesive portions 152 may be disposed between the second electrode layer 132a and the second conductive resin layer 132b of the second connecting portion A2.

[0124] Multiple island-shaped adhesive portions 151 and 152 are used to improve the adhesion between the electrode layer and the conductive resin layer. Because the adhesion between the electrode layer and the conductive resin layer is improved, defects such as electrode detachment can be prevented.

[0125] Each of the plurality of island-shaped adhesive portions 151 and 152 may include a base resin and may include isolated segments of the plurality of adhesive portions spaced apart from each other on the electrode layer 131a of the connector A1 or the electrode layer 132a of the connector A2.

[0126] The matrix resin included in each of the plurality of island adhesive portions 151 and 152 is not limited, as long as it provides adhesion and shock absorption, and may be, for example, an epoxy resin.

[0127] Each of the plurality of island-shaped adhesive portions 151 and 152 may include a matrix resin and may include one or more of silica, alumina, glass, and zirconium dioxide (ZrO2). Silica, alumina, glass, or zirconium dioxide (ZrO2) may be used to improve the coating shape of each of the plurality of island-shaped adhesive portions 151 and 152 and to improve heat resistance.

[0128] Multiple island-shaped adhesive portions 151 and 152 can be formed by: forming a first electrode layer 131a and a second electrode layer 132a on a body 110 including a dielectric layer and an inner electrode; forming a non-conductive resin layer 140 on the exposed outer surface of the body 110 and on the first electrode layer 131a and the second electrode layer 132a; and removing only a portion of the non-conductive resin layer 140 formed on the connecting portions A1 and A2 of the first electrode layer 131a and the second electrode layer 132a.

[0129] Therefore, the multiple island-shaped adhesive portions 151 and 152 can be formed using the same material as the non-conductive resin layer 140.

[0130] The area of ​​the plurality of island-shaped adhesive portions 151 may be 20% to 40% of the area of ​​the first connecting portion A1 of the first electrode layer 131a, or the area of ​​the plurality of island-shaped adhesive portions 152 may be 20% to 40% of the area of ​​the second connecting portion A2 of the second electrode layer 132a.

[0131] Table 1 shows the ESR and adhesion evaluation results based on the ratio (S2 / S1) of the area S2 of the adhesive portion to the area S1 of the electrode layer connection portion.

[0132] Adhesion was evaluated by measuring the energy required to remove the conductive resin layer from the electrode layer using an adhesion tester. Compared to the case where the area S2 of the bonded portion is 0, an improvement in adhesion of less than 5% was indicated by △, an improvement of 5% or more but less than 20% by ○, and an improvement of 20% or more by ◎.

[0133] ESR evaluation was performed by measuring the ESR of 100 samples at magnetic resonance frequency using an LCR meter. A coefficient of variation (CV) greater than or equal to 10% was indicated by △, a CV greater than or equal to 3% and less than 10% by ○, and a CV less than 3% by ◎.

[0134] Table 1

[0135] serial number S2 / S1 ESR Adhesiveness 1 0.1 ◎ △ 2 0.2 ○ ○ 3 0.3 ○ ○ 4 0.4 ○ ○ 5 0.5 △ ◎

[0136] In test number 1, where the ratio (S2 / S1) of the area of ​​the adhesive portion S2 to the area of ​​the electrode layer connection portion is 0.1, the ESR characteristics are excellent, but the adhesion is poor.

[0137] In test number 5, where the ratio (S2 / S1) of the area of ​​the adhesive portion S2 to the area of ​​the electrode layer connection portion is 0.5, the adhesion is excellent, but the ESR characteristics are poor.

[0138] Therefore, the area of ​​each of the plurality of island-shaped adhesive portions 151 and 152 can be set to 20% to 40% of the area of ​​the first connecting portion A1 of the first electrode layer 131a or the area of ​​the second connecting portion A2 of the second electrode layer 132a, thereby ensuring both excellent adhesion and excellent ESR properties.

[0139] As described above, the multilayer electronic assembly may include a non-conductive resin layer, which includes a body cover portion disposed on the outer surface of the body in a region where no electrode layer is disposed, and an extension portion extending from the body cover portion between the electrode layer of the outer electrode and the conductive resin layer. Therefore, the multilayer electronic assembly can suppress arc discharge.

[0140] In addition, the non-conductive resin layer can be configured to improve flexural strength properties.

[0141] Although embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body includes a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and the corresponding dielectric layer being between the first inner electrode and the second inner electrode, and the body having a first surface and a second surface opposite to each other in the stacking direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other; The first external electrode includes a first electrode layer connected to the first internal electrode and a first conductive resin layer disposed on the first electrode layer, and is divided into a first connecting portion disposed on the third surface of the body and a first strip portion extending from the first connecting portion to a portion of each of the first surface, the second surface, the fifth surface and the sixth surface; The second external electrode includes a second electrode layer connected to the second internal electrode and a second conductive resin layer disposed on the second electrode layer, and is divided into a second connecting portion disposed on the fourth surface of the body and a second strip portion extending from the second connecting portion to a portion of each of the first surface, the second surface, the fifth surface and the sixth surface; as well as A non-conductive resin layer has a main body cover, a first extension, and a second extension. The main body cover is disposed in a region on the outer surface of the main body where neither the first electrode layer nor the second electrode layer is disposed. The first extension extends from the main body cover between the first electrode layer and the first conductive resin layer in the first strip portion. The second extension extends from the main body cover between the second electrode layer and the second conductive resin layer in the second strip portion. In this configuration, the first electrode layer and the first conductive resin layer are in contact with each other in at least a portion of the first connecting portion, and the second electrode layer and the second conductive resin layer are in contact with each other in at least a portion of the second connecting portion. Wherein, the portion of the first external electrode located between the first connecting portion and the first strip portion is defined as a first corner portion, and the portion of the second external electrode located between the second connecting portion and the second strip portion is defined as a second corner portion. Wherein, the first extension is configured to cover the first electrode layer at the first corner and extend on a portion of the third surface of the body to cover a portion of the body in the length direction, the first extension not covering the first inner electrode and the second inner electrode in the length direction, and The second extension is configured to cover the second electrode layer at the second corner and extend on a portion of the fourth surface of the body to cover a portion of the body in the length direction, wherein the second extension does not cover the first inner electrode and the second inner electrode in the length direction.

2. The multilayer electronic component according to claim 1, wherein, The first conductive resin layer and the second conductive resin layer comprise a conductive metal and a matrix resin.

3. The multilayer electronic component according to claim 1, wherein, The first conductive resin layer and the second conductive resin layer comprise a plurality of metal particles, an intermetallic compound, and a matrix resin.

4. The multilayer electronic component according to claim 3, wherein, The plurality of metal particles include at least one of Ag, Ni, and Cu, and The intermetallic compound includes at least one of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

5. The multilayer electronic component according to claim 1, wherein, The non-conductive resin layer includes a matrix resin and includes one or more of silicon dioxide, aluminum oxide, glass, and zirconium dioxide.

6. The multilayer electronic assembly according to claim 1, further comprising: The first coating and the second coating are respectively disposed on the first conductive resin layer and the second conductive resin layer.

7. The multilayer electronic assembly according to claim 1, wherein, The first extension is configured to extend to the portion of the first connection located between the first electrode layer and the first conductive resin layer, and The second extension is configured to extend into the portion between the second electrode layer and the second conductive resin layer of the second connection portion.

8. The multilayer electronic component according to claim 1, wherein, The length of the first conductive resin layer of the first strip portion and the length of the second conductive resin layer of the second strip portion are both 10% to 20% of the length of the main body.

9. The multilayer electronic assembly according to claim 1, wherein, Multiple adhesive segments spaced apart from each other are also provided on the first electrode layer of the first connecting portion and the second electrode layer of the second connecting portion.

10. The multilayer electronic component according to claim 9, wherein, Each of the adhesive segments includes a base resin.

11. The multilayer electronic assembly according to claim 9, wherein, Each of the adhesive segments includes a matrix resin and one or more of silica, alumina, glass, and zirconium dioxide.

12. A multilayer electronic component, comprising: The body includes a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and the corresponding dielectric layer being between the first inner electrode and the second inner electrode, and the body having a first surface and a second surface opposite to each other in the stacking direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other; The first external electrode includes a first electrode layer connected to the first internal electrode and a first conductive resin layer disposed on the first electrode layer, and is divided into a first connecting portion disposed on the third surface of the body and a first strip portion extending from the first connecting portion to a portion of each of the first surface, the second surface, the fifth surface and the sixth surface; The second external electrode includes a second electrode layer connected to the second internal electrode and a second conductive resin layer disposed on the second electrode layer, and is divided into a second connecting portion disposed on the fourth surface of the body and a second strip portion extending from the second connecting portion to a portion of each of the first surface, the second surface, the fifth surface and the sixth surface; as well as A non-conductive resin layer has a main body cover, a first extension, and a second extension. The main body cover is disposed in a region on the outer surface of the main body where neither the first electrode layer nor the second electrode layer is disposed. The first extension extends from the main body cover between the first electrode layer and the first conductive resin layer in the first strip portion. The second extension extends from the main body cover between the second electrode layer and the second conductive resin layer in the second strip portion. In this configuration, the first electrode layer and the first conductive resin layer are in contact with each other in at least a portion of the first connecting portion, and the second electrode layer and the second conductive resin layer are in contact with each other in at least a portion of the second connecting portion. Among them, multiple adhesive segments spaced apart from each other are further provided on the first electrode layer of the first connecting portion and the second electrode layer of the second connecting portion, and Each of the adhesive segments is formed using the same material as the non-conductive resin layer.

13. A multilayer electronic component, comprising: The body includes a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being alternately stacked and the corresponding dielectric layer being between the first inner electrode and the second inner electrode, and the body having a first surface and a second surface opposite to each other in the stacking direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other; The first external electrode includes a first electrode layer connected to the first internal electrode and a first conductive resin layer disposed on the first electrode layer, and is divided into a first connecting portion disposed on the third surface of the body and a first strip portion extending from the first connecting portion to a portion of each of the first surface, the second surface, the fifth surface and the sixth surface; The second external electrode includes a second electrode layer connected to the second internal electrode and a second conductive resin layer disposed on the second electrode layer, and is divided into a second connecting portion disposed on the fourth surface of the body and a second strip portion extending from the second connecting portion to a portion of each of the first surface, the second surface, the fifth surface and the sixth surface; as well as A non-conductive resin layer has a main body cover, a first extension, and a second extension. The main body cover is disposed in a region on the outer surface of the main body where neither the first electrode layer nor the second electrode layer is disposed. The first extension extends from the main body cover between the first electrode layer and the first conductive resin layer in the first strip portion. The second extension extends from the main body cover between the second electrode layer and the second conductive resin layer in the second strip portion. In this configuration, the first electrode layer and the first conductive resin layer are in contact with each other in at least a portion of the first connecting portion, and the second electrode layer and the second conductive resin layer are in contact with each other in at least a portion of the second connecting portion. Among them, multiple adhesive segments spaced apart from each other are further provided on the first electrode layer of the first connecting portion and the second electrode layer of the second connecting portion, and Wherein, the area of ​​the adhesive segment located on the first electrode layer of the first connecting portion is 20% to 40% of the area of ​​the first electrode layer of the first connecting portion, or the area of ​​the adhesive segment located on the second electrode layer of the second connecting portion is 20% to 40% of the area of ​​the second electrode layer of the second connecting portion.

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