A spring structure of a relay and an electromagnetic relay

Abstract

The application discloses a spring structure of a relay and an electromagnetic relay, which comprises a spring, a contact, a QC terminal and a PC terminal, the contact is arranged on the spring, and the QC terminal is integrally formed with the spring or electrically connected with the spring; the PC terminal and the QC terminal are separate from each other, and the PC terminal and the QC terminal or the spring are electrically connected together. The application makes the PC terminal and the QC terminal be separately formed, thereby improving the phenomenon that the PC terminal and the QC terminal are integrally punched to cause copper material waste, achieving the purposes of saving materials and reducing costs. In addition, the application makes the relay be assembled in the mode that the PC terminal and the QC terminal are respectively assembled into a base of the relay first, and then the PC terminal and the QC terminal or the spring are connected and fixed, thereby reducing the spring structure from rubbing off plastic chips, and the connection of the PC terminal and the QC terminal or the spring can be simultaneously completed in the process of assembling products by using a production line, the consistency of product assembly is ensured while batch production is met.

Description

Technical Field

[0001] This invention relates to the field of relay technology, and in particular to a reed structure for a relay and an electromagnetic relay. Background Technology

[0002] Electromagnetic relays are automatic switching components with input and output isolation functions, widely used in communications, automobiles, automatic control, home appliances, and many other fields, and are one of the most important control components. In current electromagnetic relay technology, cost control is extremely stringent in the home appliance sector to maintain market share. Copper is an indispensable part of the relay raw materials, and effectively controlling copper waste can reduce product costs to a certain extent. Currently, for electromagnetic relays with a reed structure (either a static or dynamic spring structure) and both QC (quick-connect) and PC (PCB) terminals, copper waste is quite high. This is because the existing reed structure uses a one-piece stamped structure for the QC and PC terminals, and the QC terminal is much wider than the PC terminal. Therefore, stamping both QC and PC terminals from the same sheet of copper inevitably produces a lot of copper scrap, resulting in significant copper waste and hindering cost reduction. In addition, the QC terminal and PC terminal of the reed structure are integrally molded, which requires very high molding angle. Otherwise, when the electromagnetic relay base is installed later, plastic shavings are easily scraped off the base, thus affecting the product performance. Summary of the Invention

[0003] This invention addresses the technical problems existing in the prior art by providing a reed structure for a relay and an electromagnetic relay. By improving the reed structure, it achieves the goal of saving materials and reducing costs.

[0004] The technical solution adopted by the present invention to solve its technical problem is: a relay spring structure, including a spring, a contact, a QC terminal and a PC terminal, wherein the contact is disposed on the spring, and the QC terminal is integrally formed with the spring or electrically connected; the PC terminal and the QC terminal are separate from each other, and the PC terminal is electrically connected to the QC terminal or the spring.

[0005] Furthermore, the PC terminal is made of copper wire.

[0006] Furthermore, the copper wire has a flat cross-section, and its surface is electroplated with a tin layer.

[0007] Furthermore, the PC terminal is provided with a positioning bend.

[0008] Furthermore, the electrical connection between the PC terminal and the QC terminal or spring contact includes any one or more of welding, riveting, and snap-fitting.

[0009] Furthermore, the contact includes a contact substrate and a silver alloy layer. The contact substrate is disposed on the spring and has a first surface away from the spring. The silver alloy layer is disposed on the first surface and completely covers the first surface. The silver alloy layer has a second surface away from the first surface, and the periphery of the second surface is provided with an inward step, so that the silver alloy layer forms a structure with a thick middle area and a thin periphery area.

[0010] Furthermore, the ratio of the area of ​​the middle region of the silver alloy layer to the area of ​​the second surface is greater than or equal to 50%.

[0011] Furthermore, the thickness of the peripheral edge region of the silver alloy layer is less than or equal to 0.05 mm.

[0012] Furthermore, the spring is a movable spring and is electrically connected to the QC terminal, and the PC terminal is electrically connected to the QC terminal; or, the spring is a stationary spring and is integrally formed with the QC terminal, and the PC terminal is electrically connected to the stationary spring.

[0013] The present invention also provides an electromagnetic relay, including a base and a plurality of reed structures as described above, wherein a portion of the reed structures are moving spring structures and the remaining reed structures are stationary spring structures, the moving spring structures and the stationary spring structures are respectively mounted on the base and cooperate with each other.

[0014] Furthermore, the PC terminal, QC terminal, and spring are respectively laterally snapped into the base, and the PC terminal and the QC terminal or spring are electrically connected in the base.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. Because the PC terminal and QC terminal are separate from each other, and the PC terminal is electrically connected to the QC terminal or spring contact, the PC terminal and QC terminal can be formed separately. This improves the situation where copper material is wasted due to integral stamping of the PC terminal and QC terminal, thus saving materials and reducing costs. Furthermore, because the PC terminal and QC terminal are separate, during relay assembly, the PC terminal and QC terminal can be installed into the relay base separately first, and then the PC terminal can be connected and fixed to the QC terminal or spring contact. This reduces plastic debris from the spring contact structure rubbing against the base, and the connection between the PC terminal and QC terminal or spring contact can be completed simultaneously during product assembly on the production line, ensuring the reliability of the PC terminal and QC terminal insertion and removal, and ensuring product assembly consistency while mass-producing products.

[0016] 2. The PC terminal is preferably made of copper wire, which eliminates the need for punching process to form the PC terminal, thereby further reducing copper waste and lowering product costs.

[0017] 3. The preferred method for electrically connecting the PC terminal to the QC terminal or spring contact is welding, which provides a strong connection and simplifies the process.

[0018] 4. The contacts utilize cap contacts, reducing the volume of the silver alloy layer and thus the amount of silver alloy used, further lowering product costs. Specifically, the silver alloy layer forms a structure that is thicker in the middle and thinner at the edges, effectively ensuring the bonding strength between the silver alloy layer and the contact substrate. If the silver alloy layer lacked edges and relied solely on the middle area for bonding, peeling would easily occur around the middle area, leading to increased temperature and poor electrical life during product use. Furthermore, the silver alloy layer completely covers the first surface of the contact substrate, improving the aesthetics of the contacts and preventing oxidation and discoloration of areas on the first surface of the contact substrate not covered by the silver alloy layer due to prolonged exposure to air.

[0019] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments; however, the reed structure of the relay and the electromagnetic relay of the present invention are not limited to the embodiments. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the reed structure of the present invention in Embodiment 1; Figure 2 This is a three-dimensional structural diagram of the contact point of the present invention in Embodiment 1; Figure 3 This is a cross-sectional view of the contact point of the present invention in Embodiment 1; Figure 4 This is Example 1 Figure 3 An enlarged schematic diagram of part A in the middle; Figure 5 This is a three-dimensional structural diagram of the reed structure of the present invention in Embodiment 2; Figure 6 This is a three-dimensional structural diagram of the electromagnetic relay of the present invention, as shown in Embodiment 3. Figure 1 ; Figure 7 This is a three-dimensional structural schematic diagram of the base of the present invention in Embodiment 3; Figure 8 This is a three-dimensional structural schematic diagram of the electromagnetic relay of the present invention in Embodiment 3. Detailed Implementation

[0021] Example 1 Please see Figures 1-4As shown, a relay spring structure of the present invention includes a spring, contacts, a QC terminal 3, and a PC terminal 4. The contacts are disposed on the spring, and the QC terminal 3 is integrally formed with or electrically connected to the spring. The PC terminal 4 and the QC terminal 3 are separate from each other, and the PC terminal 4 is electrically connected to the QC terminal 3 or the spring. Specifically, the spring is a movable spring 1, which is generally Z-shaped and has a certain degree of flexibility, and the contacts are movable contacts 2. Therefore, the spring structure of the present invention constitutes a movable spring structure. The movable spring 1 is electrically connected to the QC terminal 3, specifically, the two are connected by riveting, but not limited to this. The PC terminal 4 is electrically connected to the QC terminal 3, specifically, the two are connected by welding, but not limited to this. In other embodiments, the PC terminal and the QC terminal are connected by riveting or snap-fitting. The welding method includes any one of laser welding, argon welding, ultrasonic welding, resistance welding, etc.

[0022] In this embodiment, the PC terminal 4 is a copper wire with a flat cross-section, but this is not a limitation; in other embodiments, the copper wire may have a circular cross-section, etc. The surface of the copper wire is electroplated with a tin layer to improve its soldering bond with the QC terminal 3. In other embodiments, the PC terminal is made from a sheet of copper material smaller than the width of the QC terminal. The PC terminal 4 has a positioning bend 41 to facilitate positioning in conjunction with the base. The positioning bend 41 is approximately located in the middle of the PC terminal 4 and is V-shaped.

[0023] In this embodiment, as Figure 2 As shown. The moving contact 2 is a capped contact, including a contact base 21 and a silver alloy layer 22. The contact base 21 is specifically connected to the moving spring 1 by riveting. The contact base 21 has a first surface away from the moving spring 1. The silver alloy layer 22 is disposed on the first surface and completely covers the first surface. The silver alloy layer 22 has a second surface away from the first surface. The perimeter of the second surface is provided with an inwardly recessed step 221, so that the silver alloy layer 22 forms a structure with a thick middle region 222 and a thin perimeter region 223, as shown. Figure 3 , Figure 4As shown. This effectively ensures the bonding force between the silver alloy layer 22 and the contact substrate 21. If the silver alloy layer 22 lacks a perimeter area 223 and relies solely on the central area 222 to bond with the contact substrate 21, peeling is likely to occur around the central area 222, leading to increased temperature and poor electrical life during product use. Furthermore, the silver alloy layer 22 completely covers the first surface of the contact substrate 21, improving the aesthetics of the moving contact 2 and preventing oxidation and discoloration of areas on the first surface of the contact substrate 21 not covered by the silver alloy layer due to prolonged exposure to air. The contact substrate 21 is copper-based, and its longitudinal section is T-shaped. The central portion of the second surface of the silver alloy layer 22 is a convex spherical surface. The first surface is the contact substrate 21 on... Figure 2 , Figure 3 The upper surface from the perspective of the second surface is the silver alloy layer 22. Figure 2 , Figure 3 The upper surface as seen from a certain angle.

[0024] In this embodiment, the ratio of the area of ​​the middle region 222 of the silver alloy layer 22 to the area of ​​the first surface of the contact substrate 21 is greater than or equal to 50% to meet product performance requirements. The thickness of the peripheral edge region 223 of the silver alloy layer 22 is less than or equal to 0.05 mm, so that the silver alloy layer 22 of the present invention can minimize its volume while completely covering the first surface of the contact substrate 21, thereby minimizing the amount of silver alloy used.

[0025] This invention discloses a relay spring structure in which the PC terminal 4 and QC terminal 3 are designed as separate components, allowing for separate molding. This improves upon the copper waste caused by integral stamping of the PC terminal and QC terminal, achieving material savings and cost reduction. Specifically, the PC terminal 4 is preferably made of copper wire, eliminating the need for stamping and further reducing copper waste and product cost. Furthermore, since the PC terminal 4 and QC terminal 3 are separate, assembly can be performed by first inserting them into the relay base, and then connecting and fixing them together. This reduces plastic debris from friction between the moving spring structure and the base, and allows for simultaneous connection of the PC terminal 4 and QC terminal 3 during production line assembly, ensuring consistency in product assembly while meeting mass production requirements. The moving contact 2 uses a cap contact, reducing the volume of the silver alloy layer 22 and thus reducing the amount of silver alloy used, further lowering product cost.

[0026] Example 2 Please see Figure 5As shown, the reed structure of the relay of the present invention differs from that of the first embodiment described above in that: the reed is a stationary reed 5, integrally formed with the QC terminal 6; the PC terminal 7 is electrically connected to the stationary reed 5, specifically by welding, but not limited to this; the contact is a stationary contact. Therefore, the reed structure of the present invention constitutes the stationary spring structure of the relay. The PC terminal 7 also has a V-shaped positioning bend 71 in the middle. The structure of the stationary contact is the same as or substantially the same as the structure of the moving contact 2, and will not be described further here.

[0027] The spring structure of the relay of the present invention can also improve the phenomenon of copper waste caused by the integral stamping of PC terminals and QC terminals, reduce the amount of silver alloy used, and achieve the purpose of reducing product cost.

[0028] Example 3 Please see Figures 1-8 As shown, an electromagnetic relay of the present invention includes a base 8 and a plurality of spring structures as described above. Some of the spring structures are moving spring structures, and the remaining spring structures are stationary spring structures. The moving spring structures and stationary spring structures are respectively mounted on the base 8 and cooperate with each other. Specifically, there are two spring structures, one of which is a moving spring structure as described in Embodiment 1 above, and the other is a stationary spring structure as described in Embodiment 2 above.

[0029] In this embodiment, the PC terminal 4 / 7, QC terminal 3 / 6, moving spring 1, and stationary spring 5 are respectively laterally snapped into the base 8. The PC terminal 4 and the QC terminal 3 are electrically connected in the base 8, and the PC terminal 7 and the stationary spring 5 are electrically connected in the base 8. That is, the present invention adopts a method of first laterally snapping the PC terminal, QC terminal, and spring 5 into the base 8, and then electrically connecting the PC terminal to the QC terminal or the spring 5. The electrical connection method is specifically a soldering method, but is not limited to this. The QC terminal 3 / 6 extends upward, and its top end is higher than the top end of the base 8. The PC terminal 4 / 7 extends downward, and its bottom end is lower than the bottom end of the base 8. The base 8 is provided with a slot 81 corresponding to the positioning bend 41 / 71 of the PC terminal 4 / 7, located at the lateral insertion opening of the base 8. This allows the slot 81 to effectively position the PC terminal 4 / 7 when it is laterally inserted into the base 8, exposing the connection point between the PC terminal and the QC terminal or spring contact at the lateral insertion opening of the base 8 for subsequent soldering. Therefore, this invention allows for the initial lateral insertion of the PC terminal and QC terminal into the base 8, followed by connection and fixation of the PC terminal with the QC terminal or spring contact, thereby reducing plastic debris from friction between the spring contact structure and the base. In particular, this invention allows for simultaneous connection of the PC terminal and QC terminal or spring contact during product assembly on a production line, ensuring consistency in product assembly while meeting mass production requirements, and guaranteeing the reliability of the PC terminal and QC terminal insertion / removal.

[0030] In this embodiment, the electromagnetic relay of the present invention further includes a magnetic circuit system 9, which is horizontally placed in the base 8. Specifically, the base 8 is divided into upper and lower layers. The moving spring 1 of the moving spring structure and the stationary spring 5 of the stationary spring structure are disposed in the upper space of the base 8, and the magnetic circuit system 9 is horizontally placed in the lower space of the base 8. Figure 8 As shown, the magnetic circuit system 9 specifically includes a coil frame 91, an enameled wire 92 wound around the coil frame 91, an iron core installed in the coil frame 91, a yoke 93, an armature 94, a compression spring 95, and a pusher block 96. The yoke 93 is L-shaped, with its vertical side fixedly connected to one end of the iron core, and its horizontal side fitting above the coil frame 91. The armature 94 is approximately L-shaped, with its vertical side magnetically engaged with the other end of the iron core, and its horizontal side fitting above the horizontal side of the yoke 93. The horizontal side of the yoke 93 is connected to a compression spring 95, which abuts against the horizontal side of the armature 94 to limit the armature 94. The pusher block 96 is located on the horizontal side of the armature 94 and fits below the movable spring 1 to push the movable spring 1 upward, thereby closing the contact.

[0031] The present invention relates to an electromagnetic relay. For details regarding the structure of the relay's reed, please refer to the preceding description; further details will not be repeated here.

[0032] The present invention discloses a relay reed structure and an electromagnetic relay. The parts not described herein are the same as or can be implemented using existing technologies.

[0033] The above embodiments are only used to further illustrate the reed structure of a relay and an electromagnetic relay of the present invention. However, the present invention is not limited to the embodiments. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. An electromagnetic relay, comprising a base, and further comprising a moving spring structure and a stationary spring structure, wherein the moving spring structure and the stationary spring structure are respectively mounted on the base and cooperate with each other; Its features are: The moving spring structure or the stationary spring structure is formed as a spring structure with a positioning bend in the PC terminal as follows: The spring structure includes a spring, a contact, a QC terminal, and a PC terminal. The contact is disposed on the spring. The QC terminal is integrally formed with the spring or electrically connected. The PC terminal and the QC terminal are separate from each other and are designed separately. The PC terminal is electrically connected to the QC terminal or the spring by welding. The PC terminal is provided with a positioning bend to facilitate engagement with the base and achieve positioning. During assembly, the PC terminal, QC terminal, and spring of the spring structure are respectively laterally snapped into the base. Correspondingly, the base has a slot at the opening in the lateral snapping direction that corresponds to the positioning bend of the PC terminal and can effectively position the PC terminal at the opening in the lateral snapping direction. In specific assembly, the PC terminal and QC terminal are first inserted into the base in a lateral snapping manner, so that the PC terminal is effectively positioned by the slot and the positioning bend at the opening in the lateral snapping direction, and at this time the connection part between the PC terminal and the QC terminal or the spring is exposed. Then, the PC terminal and the QC terminal or the spring are electrically connected together in the base by welding.

2. The electromagnetic relay according to claim 1, characterized in that: The PC terminal is made of copper wire.

3. The electromagnetic relay according to claim 2, characterized in that: The copper wire has a flat cross-section and is electroplated with a tin layer.

4. The electromagnetic relay according to claim 1, characterized in that: The contact of the reed structure includes a contact base and a silver alloy layer. The contact base is disposed on the reed and has a first surface away from the reed. The silver alloy layer is disposed on the first surface and completely covers the first surface. The silver alloy layer has a second surface away from the first surface, and the periphery of the second surface is provided with an inward step, so that the silver alloy layer forms a structure that is thick in the middle area and thin at the periphery.

5. The electromagnetic relay according to claim 4, characterized in that: The ratio of the area of ​​the middle region of the silver alloy layer to the area of ​​the first surface is greater than or equal to 50%. The thickness of the silver alloy layer at its periphery is less than or equal to 0.05 mm.

6. The electromagnetic relay according to claim 1, characterized in that: The spring in the spring structure is a movable spring and is electrically connected to the QC terminal; the PC terminal is electrically connected to the QC terminal. Alternatively, the spring in the spring structure is a stationary spring, integrally formed with the QC terminal, and the PC terminal is electrically connected to the stationary spring.

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