Gas supply assembly

Abstract

The present invention relates to a gas supply assembly, and more particularly, to a gas supply assembly capable of uniformly supplying process gas to the center and the edge of a substrate while supplying process gas to the substrate.

Description

Technical Field

[0001] The present invention relates to a gas supply assembly, and more specifically to a gas supply assembly that can uniformly supply process gas to the center and edges of a substrate when supplying process gas to the substrate. Background Technology

[0002] Generally, a substrate processing apparatus has a gas supply assembly that supplies process gas to the upper part of a chamber, and a substrate is mounted on a substrate support portion located on the lower inner side of the chamber for processing.

[0003] Figure 7 This is an exploded perspective view showing a gas supply assembly according to conventional technology. (Example) Figure 7 As shown, the gas supply assembly 60 may include: a manifold 10 having an inlet 12 for supplying process gas; a connecting plate 20 connected to the lower part of the manifold 10 and forming a single connection hole 22 for supplying process gas; a baffle 30 disposed on the lower part of the connecting plate 20; a block plate 40 connected to the lower part of the connecting plate 20; and a spray head 50 connected to the lower part of the block plate 40.

[0004] Figure 8 This is a side cross-sectional view of the gas supply assembly 60 based on conventional technology.

[0005] Reference Figure 7 and Figure 8 The process gas supplied to the split pipe 10 through the inlet 12 is supplied to the single connection hole 22 formed in the connection portion 24 of the connecting plate 20 through the single outlet (not shown) of the split pipe 10.

[0006] In the conventional gas supply assembly 60, since the process gas is supplied through a single connection hole 22, if the baffle 30 is omitted, the process gas can be supplied directly toward the center of the substrate through the plug plate 40 and the spray head 50. Therefore, to prevent this, while the baffle 30 is configured, there is a region without the through hole 42 in the center of the plug plate 40.

[0007] Therefore, at the lower part of the single connection hole 22, the process gas is dispersed to the edge through the baffle 30, and then refills the central part through the through hole 42 of the plug 40 and is supplied to the edge.

[0008] Therefore, when process gas is supplied through the supply hole 52 of the spray head 50, process gas is first supplied towards the substrate through the central portion, and then supplied towards the substrate through the edge.

[0009] Ultimately, in the gas supply assembly 60 according to the prior art, when supplying process gas to the substrate, the process gas cannot be supplied uniformly towards the center and edges of the substrate, thus hindering the smooth processing of the substrate. If, in the deposition process, the process gas is first supplied to the center of the substrate and then to the edges, the thickness of the film deposited on the substrate may vary. Summary of the Invention

[0010] [The problem the invention aims to solve]

[0011] In order to solve the problems mentioned above, the present invention aims to provide a gas supply assembly that uniformly supplies process gas toward the center and edges of a substrate when supplying process gas to a substrate.

[0012] [Technical means to solve the problem]

[0013] As described above, the objective of the present invention is achieved by a gas supply assembly, characterized in that it comprises: a splitter pipe forming a process gas inlet for supplying process gas and a process gas outlet for discharging process gas, and forming an internal flow path connecting the process gas inlet and the process gas outlet; a connecting plate forming a plurality of connecting holes connected to the process gas outlet and supplying process gas downward through the plurality of connecting holes, and connected to a chamber top cover; a blocking plate connected to the lower part of the connecting plate and providing a buffer space between the blocking plate and the connecting plate for dispersing the process gas, and forming a plurality of through holes for supplying the process gas; and a spray head connected to the lower part of the blocking plate and forming a plurality of supply holes for supplying process gas toward the substrate.

[0014] Here, the plurality of connection holes can be arranged radially apart from the centerline of the process gas inlet of the split pipe.

[0015] In addition, the process gas outlet of the split pipe is formed with a plurality of holes corresponding to the plurality of connection holes of the connecting plate, and inside the split pipe, the internal flow path can extend from the inside to connect the process gas inlet and the plurality of process gas outlets.

[0016] Furthermore, a connection portion for connecting the shunt pipe can be formed in the connecting plate, and the plurality of connection holes are formed by passing through the connection portion and spaced apart from each other.

[0017] [The effects of the invention]

[0018] According to the present invention having the above-described configuration, by equipping the splitter tube and the connecting plate with multiple flow paths to disperse and supply process gas, process gas can be uniformly supplied toward the center and edge of the substrate when supplying process gas to the substrate, and the process for the substrate can be performed smoothly. Attached Figure Description

[0019] Figure 1 This is a side view of a substrate processing apparatus using a gas supply component according to an embodiment of the present invention.

[0020] Figure 2 This is a perspective view of a gas supply assembly according to an embodiment of the present invention.

[0021] Figure 3 This is an exploded perspective view of a gas supply assembly according to an embodiment of the present invention.

[0022] Figure 4 (A) Figure 4 (B) shows the side view and lower perspective view of the manifold.

[0023] Figure 5 This is a side cross-sectional view of the gas supply assembly.

[0024] Figure 6 This is a top perspective view of the connecting plate according to another embodiment.

[0025] Figure 7 It is an exploded three-dimensional diagram of the gas supply component based on previous technologies.

[0026] Figure 8 It is a side cross-sectional view of the gas supply assembly based on previous technology.

[0027] [Explanation of Symbols]

[0028] 100: Diverter pipe;

[0029] 110: Process gas inlet;

[0030] 130: Process gas exhaust port;

[0031] 200, 200': Connecting plate;

[0032] 210: Plate section;

[0033] 220: Connecting part;

[0034] 232: Connecting hole;

[0035] 300: Blocking plate;

[0036] 310: Through hole;

[0037] 400: Spray head;

[0038] 410: Supply hole;

[0039] 1000: Gas supply assembly;

[0040] 2000: Substrate processing apparatus;

[0041] 2100: Chamber. Detailed Implementation

[0042] Hereinafter, the structure of the gas supply assembly according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0043] Figure 1 This is a side view of a substrate processing apparatus 2000 that uses a gas supply component 1000 according to an embodiment of the present invention.

[0044] The substrate processing apparatus 2000 may have a chamber 2100. The chamber 2100 may be formed by a chamber body 2160 and a chamber top cover 2150 that seals the upper part of the opening of the chamber body 2160.

[0045] The chamber 2100 has a substrate support portion 2200 for supporting the substrate S on its inner side. In addition, a gas supply assembly 1000 for supplying process gas toward the substrate S can be disposed on the upper inner side of the chamber 2100.

[0046] With the substrate S mounted on the substrate support 2200, the gas supply assembly 1000 supplies process gas toward the substrate S and performs processes such as deposition and etching on the substrate S.

[0047] However, when supplying process gas to the substrate S as described above, if the process gas is not supplied uniformly towards the center and edges of the substrate S, the processing of the substrate S cannot be performed smoothly. For example, in a deposition process on the substrate S, if the process gas is first supplied to the center of the substrate S and then to the edges, the thickness of the film deposited on the substrate S may vary. Hereinafter, the structure of the gas supply assembly 1000 according to the present invention, which solves the above-mentioned problems, will be described.

[0048] Figure 2 This is a perspective view of a gas supply assembly 1000 according to an embodiment of the present invention, and Figure 3 This is an exploded perspective view of the gas supply assembly 1000.

[0049] Reference Figure 2 and Figure 3The gas supply assembly 1000 may include: a splitter pipe 100 forming a process gas inlet 110 for supplying process gas and a process gas outlet 130 for discharging the process gas (see reference). Figure 4 And forms an internal flow path 140 connecting the process gas inlet 110 and the process gas outlet 130 (see reference). Figure 4 The connecting plate 200 forms a plurality of connecting holes 232 that connect to the process gas outlet 130, and supplies the process gas downward through the plurality of connecting holes 232, and is connected to the chamber top cover 2150; the blocking plate 300 is connected to the lower part of the connecting plate 200 and provides a buffer space 320 between the blocking plate 300 and the connecting plate 200 for dispersing the process gas (see reference). Figure 5 The plate has a plurality of through holes 310 for supplying the process gas, and a spray head 400 connected to the lower part of the plate 300 and having a plurality of supply holes 410 for supplying the process gas toward the substrate S.

[0050] According to the gas supply assembly 1000 of the present invention, when supplying process gas to the spray head 400 and the baffle plate 300, the supply is not through a single flow path, but through multiple flow paths. Therefore, in the gas supply assembly 1000 according to the present invention, the process gas can be supplied in a manner that is as uniform as possible. As a result, the process gas can be supplied uniformly towards the center and edge of the substrate S.

[0051] First, the diversion pipe 100 is located at the uppermost part of the gas supply assembly 1000. The diversion pipe 100 protrudes to the outside of the chamber 2100 and supplies process gas supplied from the outside of the chamber 2100 to the diversion pipe 100. For this purpose, a process gas inlet 110 is formed at the upper part of the diversion pipe 100, and a process gas outlet 130 for discharging the process gas is formed at the lower part.

[0052] Figure 4 (A) Figure 4 (B) is a diagram showing the shunt 100. Figure 4 (A) is a side sectional view of the diverter 100, and Figure 4 (B) is a lower perspective view of the shunt tube 100.

[0053] Reference Figure 4 The process gas outlet 130 of the diversion pipe 100 may be formed with a plurality of holes corresponding to the plurality of connection holes 232 of the connecting plate 200.

[0054] That is, a plurality of connection holes 232 are formed in the connecting plate 200 to supply process gas to the lower blocking plate 300. In this case, a plurality of process gas outlets 130 corresponding to the plurality of connection holes 232 are formed in the diversion pipe 100 connected to the upper part of the connecting plate 200.

[0055] In this invention, the process gas is supplied by dispersing it from a diversion pipe 100 that is as far away as possible from the spray head 400 and the blocking plate 300, so that the process gas supplied through the spray head 400 can be uniformly supplied toward the substrate S.

[0056] like Figure 4 As shown, the process gas inlet 110 is formed at the upper part of the main body 120 of the branch pipe 100, and the process gas outlet 130 is formed at the lower part of the main body 120.

[0057] In this case, as described above, the process gas outlet 130 can be formed in multiple ways, for example, four.

[0058] With the above configuration, an internal flow path 140 extending from the inner side can be formed inside the main body 120 of the branch pipe 100 to connect the process gas inlet 110 with the plurality of process gas outlets 130.

[0059] That is, the internal flow path 140 may be formed by: a first internal flow path 141, which is connected to the process gas inlet 110 and extends downward; and a plurality of second internal flow paths 142, which branch from the first internal flow path 141 and are respectively connected to the plurality of process gas outlets 130.

[0060] When the second internal flow path 142 is connected to the first internal flow path 141, the corner portions 148 and 149 are machined into a circular shape, thereby minimizing the flow resistance of the process gas.

[0061] On the other hand, refer to Figure 3 The connecting plate 200 can be connected to the lower part of the diversion pipe 100.

[0062] A plurality of connection holes 232 are formed in the connecting plate 200 to connect with the process gas outlet 130, and the process gas is supplied downward through the plurality of connection holes 232.

[0063] Specifically, the connecting plate 200 may include: a plate portion 210 having a fastening hole 212 formed along its edge for connection with the chamber top cover 2150; and a connecting portion 220 formed in the center of the plate portion 210 for connection with the diversion pipe 100.

[0064] The edge of the plate portion 210 can be installed on the upper part of the chamber top cover 2150 and connected by screws or the like through the fastening hole 212.

[0065] A connecting portion 220 for connection with the diverter pipe 100 may be formed in the center of the plate portion 210. In this case, a recess 214 may be formed in the upper part of the plate portion 210, and the connecting portion 220 may be formed in the center of the recess 214.

[0066] On the other hand, the plurality of connection holes 232 can be formed in the connection portion 220. The plurality of connection holes 232 can be formed through the connection portion 220. In addition, the plurality of connection holes 232 can be formed in the connection portion 220 at intervals from each other. Furthermore, the plurality of connection holes 232 can be arranged as far apart as possible in the radial direction from the center line of the process gas inlet 110 of the above-mentioned split pipe 100. By arranging the plurality of connection holes 232 as far apart as possible from the center line of the process gas inlet 110, the process gas supplied through the plurality of connection holes 232 can be dispersed as much as possible.

[0067] On the other hand, compared to the case of a gas supply assembly with a single connection hole in the prior art, the diameter of the connection hole 232 can be reduced by approximately 20% to 40% when multiple connection holes 232 are formed. This allows the gas supply volume to be kept as constant as possible and ensures smooth flow of the process gas. The diameter of the connection hole 232 can be adjusted according to the number and location of the connection holes 232.

[0068] On the other hand, the blocking plate 300 is connected to the lower part of the connecting plate 200. The space between the blocking plate 300 and the connecting plate 200 serves as a buffer space 320 for dispersing process gases.

[0069] In this case, a plurality of through holes 310 are formed in the blocking plate 300 to supply process gas toward the spray head 400 below.

[0070] On the other hand, as with conventional gas supply assemblies, when supplying gas through a single connection hole, a baffle is arranged below the single connection hole to prevent process gas from being directly supplied to the substrate through the baffle and spray head. Furthermore, the through hole can be omitted below the baffle of the baffle plate.

[0071] However, in this invention, process gas is supplied downward through multiple connection holes 232 in the connecting plate 200. Therefore, compared to the conventional case where the process gas is supplied through a single connection hole, the baffle can be omitted because the supply pressure of the process gas may decrease and the process gas is supplied in a dispersed manner, thereby allowing through holes 310 to be formed in the entire area of ​​the blocking plate 300.

[0072] A spray head 400 is connected to the lower part of the connecting plate 200. A plurality of supply holes 410 are formed in the spray head 400 to supply process gas supplied through the blocking plate 300 toward the substrate S.

[0073] on the other hand, Figure 5 This is a side cross-sectional view of the gas supply assembly 1000, showing the general flow of the process gas when it is supplied.

[0074] Reference Figure 5 The process gas supplied through the multiple connection holes 232 formed in the connection portion 220 of the connecting plate 200 is uniformly dispersed through the lower buffer space 320 and supplied to the blocking plate 300. Furthermore, the process gas is supplied to the lower spray head 400 through the through hole 310 of the blocking plate 300, and is supplied towards the substrate S through the supply hole 410 of the spray head 400.

[0075] By forming multiple connection holes 232 in the connecting plate 200 and arranging them spaced apart from each other, the process gas supplied through the connection holes 232 can be dispersed as much as possible in the buffer space 320. Therefore, the process gas can be supplied to the center and edges of the substrate S by the blocking plate 300 and the spray head 400.

[0076] Figure 6 This is a top perspective view of the connecting plate 200' according to another embodiment.

[0077] Reference Figure 6 According to this embodiment, the connecting plate 200' may include a central connecting hole 242 and an edge connecting hole 244 when it has a plurality of connecting holes 240.

[0078] That is, a central connecting hole 242 can be formed in the central portion of the connecting portion 220, and a plurality of edge connecting holes 244 can be formed along the edge of the central connecting hole 242. In this case, Figure 6 The diagram shows a total of five connection holes 240, but is not limited to this, and the number of edge connection holes 244 can be adjusted appropriately.

[0079] On the other hand, in this embodiment, since a central connecting hole 242 is formed in the connecting plate 200', a baffle that was omitted in the above embodiment can be attached. That is, a baffle is connected to the lower part of the connecting plate 200', and the baffle can be located vertically below the central connecting hole 242. This prevents the process gas supplied through the central connecting hole 242 from being immediately supplied to the substrate S through the baffle plate 300 and the spray head 400.

[0080] While the present invention has been described above with reference to preferred embodiments, those skilled in the art can make various modifications and alterations to the invention without departing from the spirit and scope of the invention as set forth in the foregoing claims. Therefore, it should be considered that any modifications that substantially include the constituent elements of the claims are included within the technical scope of the present invention.

Claims

1. A gas supply assembly, comprising: The splitter pipe has a process gas inlet for supplying process gas and a process gas outlet for discharging process gas, as well as an internal flow path connecting the process gas inlet and the process gas outlet. A connecting plate is formed with a plurality of connecting holes that are connected to the process gas outlet and supply the process gas downward through the plurality of connecting holes, and the connecting plate is connected to the top cover of the chamber; A blocking plate is connected to the lower part of the connecting plate and provides a buffer space between the blocking plate and the connecting plate in which the process gas is dispersed, and the blocking plate is formed with a plurality of through holes for supplying the process gas. as well as A spray head, connected to the lower part of the blocking plate, has multiple supply holes for supplying the process gas toward the substrate. The plurality of connection holes are arranged radially apart from the centerline of the process gas inlet of the split pipe. The process gas outlet of the diversion pipe is formed with a plurality of holes corresponding to the plurality of connection holes of the connecting plate. Inside the splitter tube, the internal flow path branches out from the inside to connect the process gas inlet to a plurality of process gas outlets. The connecting plate has a connecting portion for connecting the shunt pipe, and the plurality of connecting holes are formed through the connecting portion and spaced apart from each other.

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