Die ejection apparatus and die ejection method

Abstract

The die ejection method of the present disclosure includes: a step of providing suction pressure to the adhesive layer by a die ejector; a step of relatively moving the die ejector with respect to the adhesive layer during the step of providing suction pressure to the adhesive layer, so that the edge portion and the center portion of the die are overlapped with the die ejector in sequence; and a step of providing jet pressure to the adhesive layer by the die ejector.

Description

Technical Field

[0001] The technical concept disclosed herein relates to a bare core ejection device and a bare core ejection method, and more specifically, to a bare core ejection device for separating a bare core from an adhesive layer and a bare core ejection method using the bare core ejection device. Background Technology

[0002] To prevent multiple bare cores monolithically formed during the dicing process from detaching, an adhesive layer can be adhered to one surface of the wafer. Furthermore, multiple bare cores monolithically formed during the dicing process can be separated from the adhesive layer using a bare core ejection device. Recently, as the thickness of the bare cores adhered to the adhesive layer has gradually decreased, research is actively underway on bare core ejection devices and methods that can easily separate the bare cores from the adhesive layer while minimizing the risk of bare core breakage. Summary of the Invention

[0003] Technical problems to be solved

[0004] One of the problems to be solved by the technical concept of this disclosure is to provide a bare core ejection device and a bare core ejection method that can easily separate the bare core from the adhesive layer.

[0005] One of the problems to be solved by the technical concept of this disclosure is to provide a bare core ejection device and a bare core ejection method that can quickly separate the bare core from the adhesive layer.

[0006] Problem-solving methods

[0007] To achieve the above objectives, as an exemplary embodiment of this disclosure, a bare core ejection method is provided for separating a bare core from an adhesive layer, comprising: a step of disposing the adhesive layer on the bare core ejector such that a central portion of the bare core is horizontally spaced from the bare core ejector; a step of providing suction pressure to the adhesive layer through the bare core ejector; a step of moving the bare core ejector relative to the adhesive layer in a first direction such that a first edge portion, a central portion, and a second edge portion opposite to the first edge portion of the bare core sequentially overlap the bare core ejector in a vertical direction; a step of moving the bare core ejector relative to the adhesive layer in a second direction opposite to the first direction such that the bare core and the bare core ejector are aligned; and a step of providing jet pressure to the adhesive layer through the bare core ejector.

[0008] Additionally, as an exemplary embodiment of this disclosure, a bare core ejection method is provided for separating a bare core from an adhesive layer, comprising: providing a suction pressure to the adhesive layer via a bare core ejector; during the provision of the suction pressure to the adhesive layer, the bare core ejector moves relative to the adhesive layer such that an edge portion and a center portion of the bare core sequentially overlap the bare core ejector; and providing a jetting pressure to the adhesive layer via the bare core ejector.

[0009] Additionally, as an exemplary embodiment of this disclosure, a bare core ejection device is provided to separate a bare core from an adhesive layer, comprising: a housing disposed below the adhesive layer, providing an internal space; a bare core ejector disposed within the internal space of the housing, and providing at least one of an intake pressure and an ejection pressure to the adhesive layer; a pressure regulating device connected to the bare core ejector, and regulating at least one of a pressure type and an intensity provided by the bare core ejector to the adhesive layer; a bare core ejector driving device for moving the bare core ejector horizontally; and a lifting member disposed within the internal space of the housing, disposed below the adhesive layer to support a portion of the adhesive layer; and a lifting mechanism. A component driving device, connected to the lifting component, moves the lifting component vertically; and a controller, connected to the pressure regulating device, the bare core ejector driving device, and the lifting component driving device, wherein the controller controls the pressure regulating device to provide the suction pressure to the adhesive layer; while providing the suction pressure to the adhesive layer, the controller controls the bare core ejector driving device to move the bare core ejector horizontally so that the edge portion and the center portion of the bare core pass through the bare core ejector in sequence; and when the bare core and the bare core ejector are aligned, the controller controls the pressure regulating device to provide the injection pressure to the adhesive layer. Attached Figure Description

[0010] Figure 1 This is a cross-sectional view of a bare core ejection device according to an exemplary embodiment of this disclosure.

[0011] Figure 2 This is a signal flow diagram of a bare die ejection device according to an exemplary embodiment of this disclosure.

[0012] Figure 3 This is a flowchart illustrating the steps of a bare die ejection method according to an exemplary embodiment of the present disclosure.

[0013] Figures 4 to 11 This is a diagram illustrating the various steps of a bare core ejection method according to an exemplary embodiment of the present disclosure.

[0014] Figure 12This is a flowchart illustrating the steps of a bare die ejection method according to an exemplary embodiment of the present disclosure.

[0015] Figures 13 to 19 This is a diagram illustrating the various steps of a bare core ejection method according to an exemplary embodiment of the present disclosure. Detailed Implementation

[0016] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0017] Figure 1 This is a cross-sectional view of the bare core ejection device 10 according to an exemplary embodiment of this disclosure. Additionally, Figure 2 This is a signal flow diagram of the bare die ejection device 10 of an exemplary embodiment of this disclosure.

[0018] Simultaneously refer to Figure 1 and Figure 2 The bare core ejection device 10 of the exemplary embodiments of this disclosure may include a housing 110, a bare core ejector 120, a pressure regulating device 130, a bare core ejector drive device 140, a lifting member 150, a lifting member drive device 160, a platform 170, a platform drive device 180, an adhesive head 190, and a controller 200, etc.

[0019] The bare core ejection apparatus 10 of the exemplary embodiments of this disclosure is an apparatus for separating multiple bare cores D monolithically formed in a sawing process from the adhesive layer AL.

[0020] Recently, as the thickness of the bare core D adhered to the adhesive layer AL has gradually decreased, there is a need for a bare core ejection device that can easily and quickly separate the bare core D from the adhesive layer AL while reducing the risk of damage to the bare core D.

[0021] Hereinafter, the horizontal direction can be defined as the direction parallel to the direction in which the adhesive layer AL extends (e.g., the direction parallel to the direction in which the XY plane extends), and the vertical direction can be defined as the direction perpendicular to the direction in which the adhesive layer AL extends (e.g., the direction parallel to the Z direction).

[0022] The housing 110 is disposed below the adhesive layer AL and provides internal space for arranging the bare core ejector 120 and the lifting member 150, which will be described later.

[0023] In an exemplary embodiment, the area of ​​the upper surface of the housing 110 can be set to be larger than the area of ​​the bare core D. Thus, the bare core D can be disposed on the upper surface of the housing 110.

[0024] The bare core ejector 120 is disposed within the interior space of the housing 110 and can provide at least one of an intake pressure and an ejection pressure to a portion of the adhesive layer AL exposed to the bare core ejector 120 to separate the bare core D from the adhesive layer AL.

[0025] The suction pressure may be the pressure used to move the adhesive layer AL exposed to the bare core ejector 120 downwards, and the injection pressure may be the pressure used to move the adhesive layer AL exposed to the bare core ejector 120 upwards.

[0026] In an exemplary embodiment, the bare core ejector 120 may include a conduit that provides a path for air injected or drawn in from the pressure regulating device 130.

[0027] Furthermore, when viewed from a planar perspective, the bare core ejector 120 can be an annular shape with a hole. The shape of the hole in the bare core ejector 120 can be configured to correspond to the shape of the bare core D. For example, when the bare core D is square, the shape of the hole in the bare core ejector 120 can be square. However, the shape of the hole in the bare core ejector 120 is not limited to the aforementioned.

[0028] That is, the bare core ejector 120 can provide at least one of the suction pressure and the injection pressure to a portion of the adhesive layer AL exposed by the orifice of the bare core ejector 120.

[0029] The pressure regulating device 130 is connected to the bare core ejector 120 and regulates at least one of the pressure type and pressure intensity provided by the bare core ejector 120 to the adhesive layer AL.

[0030] In an exemplary embodiment, the pressure regulating device 130 may include at least one of a pressurizing pump, a depressurizing pump, a pressurizing line, a depressurizing line, a pressurizing valve, and a depressurizing valve to control the type and intensity of pressure supplied by the bare core ejector 120 to the adhesive layer AL.

[0031] In an exemplary embodiment, the pressure regulating device 130 can control the airflow inside the bare core ejector 120, so that the bare core ejector 120 provides either an intake pressure or an injection pressure to the adhesive layer AL.

[0032] For example, the pressure regulating device 130 can operate the pressure reducing pump and pressure reducing valve to allow air remaining in the pressure reducing line to be discharged to the outside, thereby providing the bare core ejector 120 with suction pressure to the adhesive layer AL. Additionally, the pressure regulating device 130 can operate the pressure boosting pump and pressure boosting valve to allow air to flow into the pressure boosting line, thereby providing the bare core ejector 120 with injection pressure to the adhesive layer AL.

[0033] The bare core ejector drive device 140 is connected to at least one of the bare core ejector 120 and the housing 110, causing the bare core ejector 120 to move in a horizontal direction (e.g., the direction extending in the XY plane).

[0034] In an exemplary embodiment, the bare core ejector drive 140 may include an electric motor and a conversion device. For example, the bare core ejector drive 140 may include a linear actuator that converts the rotational force of the electric motor into linear motion in the horizontal direction of the bare core ejector 120. For example, the conversion device may include a rack and pinion.

[0035] Since the bare core ejector 120 can move horizontally via the bare core ejector drive device 140, alignment can be achieved between the bare cores D and the bare core ejector 120. Furthermore, while the bare core ejector 120 moves horizontally, it can provide suction pressure and ejection pressure to the adhesive layer AL disposed below the plurality of bare cores D. Thus, the plurality of bare cores D can be sequentially separated from the adhesive layer AL.

[0036] A lifting member 150 is disposed within the interior space of the housing 110 and supports a portion of the adhesive layer AL disposed at the lower part of the bare core D based on vertical movement. In an exemplary embodiment, the lifting member 150 may be a lifting pin that moves vertically to support a portion of the adhesive layer AL.

[0037] The lifting component drive device 160 is connected to the lifting component 150, causing the lifting component 150 to move in the vertical direction (e.g., the direction of the Z-axis extension).

[0038] In an exemplary embodiment, the lifting member drive device 160 may include an electric motor and a conversion device. For example, the lifting member drive device 160 may include a linear actuator that converts the rotational force of the electric motor into linear motion in the vertical direction of the lifting member 150. For example, the conversion device may include a rack and pinion.

[0039] The stage 170 is disposed on the outside of the housing 110 and can support the adhesive layer AL to which the bare core D is adhered. In addition, the stage 170 can move horizontally via the stage drive device 180 while supporting the adhesive layer AL to which the bare core D is adhered.

[0040] The stage drive device 180 is connected to the stage 170, causing the stage 170 to move in a horizontal direction (e.g., the direction extending in the XY plane).

[0041] In an exemplary embodiment, the stage drive device 180 may include an electric motor and a conversion device. For example, the stage drive device 180 may include a linear actuator that converts the rotational force of the electric motor into linear motion in the horizontal direction of the stage 170.

[0042] The adhesive head 190 is positioned on top of the bare core ejector 120 to pick up the bare core D from the adhesive layer AL.

[0043] In an exemplary embodiment, the adhesive head 190 can adhere the bare core D, which has been separated from the adhesive layer AL, to a substrate disposed on an operating table. The substrate may be a wafer or a printed circuit board (PCB). However, the type of substrate is not limited to those described above.

[0044] In an exemplary embodiment, the adhesive head 190 can pick up the bare core D from the adhesive layer AL by providing vacuum pressure to the upper surface of the bare core D, and can adhere the picked-up bare core D to the substrate.

[0045] The controller 200 provides comprehensive control over the operation of the bare core ejection device 10. The controller 200 is connected to the pressure regulating device 130, the bare core ejector drive device 140, the lifting component drive device 160, and the platform drive device 180, and can control at least one of the pressure regulating device 130, the bare core ejector drive device 140, the lifting component drive device 160, and the platform drive device 180.

[0046] In an exemplary embodiment, the controller 200 may be implemented using hardware, firmware, software, or any combination thereof. For example, the controller 200 may be a computing device such as a workstation computer, desktop computer, laptop computer, or tablet computer. The controller 200 may also be a processor, dedicated hardware, or firmware composed of complex processors and software such as a simple controller, microprocessor, CPU, or GPU. The controller 200 may be implemented, for example, using general-purpose computers or application-specific hardware such as digital signal processors (DSPs), field-programmable gate arrays (FPGAs), and application-specific integrated circuits (ASICs).

[0047] In an exemplary embodiment, the operation of the controller 200 can be implemented by instructions stored on a machine-readable medium, which can be read and executed by more than one processor. Here, the machine-readable medium can include any mechanism for storing and / or transmitting information in a machine-readable (e.g., computing device) form. For example, the machine-readable medium can include read-only memory (ROM), random access memory (RAM), disk storage media, optical storage media, flash memory devices, electrical, optical, acoustic, or other forms of propagation signals (e.g., carrier waves, infrared signals, digital signals, etc.), and any other signals.

[0048] The controller 200 can be implemented using firmware, software, routines, and instructions for operating the bare die ejection device 10. For example, the controller 200 can be implemented using software that receives data for feedback, generates signals for operating the bare die ejection device 10, and performs predetermined calculations.

[0049] In an exemplary embodiment, the controller 200 may control the pressure regulating device 130 to adjust the type and intensity of pressure provided by the bare core ejector 120 to the adhesive layer AL.

[0050] In an exemplary embodiment, the controller 200 can control the pressure regulating device 130 to provide suction pressure to the adhesive layer AL by the bare core ejector 120. Additionally, the controller 200 can control the pressure regulating device 130 to adjust the intensity of the suction pressure provided by the bare core ejector 120 to the adhesive layer AL.

[0051] Additionally, the controller 200 can control the pressure regulating device 130 to provide injection pressure to the adhesive layer AL via the bare core ejector 120. Furthermore, the controller 200 can control the pressure regulating device 130 to adjust the intensity of the injection pressure provided by the bare core ejector 120 to the adhesive layer AL.

[0052] In an exemplary embodiment, the controller 200 can control the bare die ejector drive device 140 to move the bare die ejector 120 in a horizontal direction. For example, the controller 200 can control the bare die ejector drive device 140 to move the bare die ejector 120 in a horizontal direction so that the center portion of the bare die D and the center of the bare die ejector 120 overlap in the horizontal direction.

[0053] In an exemplary embodiment, the controller 200 can control the lifting component drive device 160 to move the lifting component 150 in the vertical direction.

[0054] Additionally, in an exemplary embodiment, the controller 200 can control the stage drive 180 to move the stage 170 in a horizontal direction. For example, the controller 200 can move the stage 170 by controlling the stage drive 180 so that the center portion of the bare core D and the center of the bare core ejector 120 overlap in the horizontal direction.

[0055] In an exemplary embodiment, the controller 200 can control at least one of the bare die ejector drive device 140 and the stage drive device 180. For example, the controller 200 can control the bare die ejector drive device 140 without controlling the stage drive device 180. Alternatively, the controller 200 can control the stage drive device 180 without controlling the bare die ejector drive device 140. However, the controller 200 is not limited to this; it can control both the bare die ejector drive device 140 and the stage drive device 180.

[0056] In an exemplary embodiment, the controller 200 may control the pressure regulating device 130 to provide suction pressure to the adhesive layer AL. Additionally, before the controller 200 controls the pressure regulating device 130 to provide suction pressure to the adhesive layer AL, the controller 200 controls at least one of the bare core ejector drive device 140 and the stage drive device 180 to arrange the central portion of the bare core D horizontally spaced from the center of the bare core ejector 120.

[0057] In addition, while the suction pressure is applied to the adhesive layer AL, the controller 200 can control the bare core ejector drive device 140 to move the bare core ejector 120 in the horizontal direction so that the edge portion and the center portion of the bare core D pass through the center of the bare core ejector 120 in sequence.

[0058] However, not limited to this, while the suction pressure is applied to the adhesive layer AL, the controller 200 moves the stage 170 horizontally via the stage drive device 180, causing the edge and center portions of the bare core D to pass sequentially through the center of the bare core ejector 120. This weakens the adhesive force between the bare core D and the adhesive layer AL for the first time.

[0059] In an exemplary embodiment, after the edge and center portions of the bare core D have successively passed the center of the bare core ejector 120, the controller 200 can control at least one of the bare core ejector drive device 140 and the stage drive device 180 to make the center portion of the bare core D and the center of the bare core ejector 120 overlap in the vertical direction. That is, the controller 200 can align the bare core D and the bare core ejector 120 by controlling at least one of the bare core ejector drive device 140 and the stage drive device 180.

[0060] In an exemplary embodiment, with the bare core D and the bare core ejector 120 aligned, the controller 200 can control the lifting member drive device 160 to move the adhesive layer AL, located at the lower part of the edge portion of the bare core D, upward via the lifting member 150. Furthermore, as the lifting member 150 moves upward, supporting a portion of the adhesive layer AL, the controller 200 can control the pressure regulating device 130 to continue providing suction pressure to the adhesive layer AL.

[0061] In addition, in an exemplary embodiment, with the bare core D and the bare core ejector 120 aligned, the controller 200 can control the pressure regulating device 130 to provide injection pressure to the adhesive layer AL.

[0062] In an exemplary embodiment of this disclosure, the bare core ejection device 10 moves the bare core ejector 120 relative to the adhesive layer AL in a horizontal direction during the period when the bare core ejector 120 provides suction pressure to the lower part of the adhesive layer AL, so that the edge portion and the center portion of the bare core D successively pass through the center of the bare core ejector 120. Thus, the bare core ejection device 10 can separate the bare core D from the adhesive layer AL for the first time.

[0063] In addition, after the bare core ejection device 10 separates the bare core D from the adhesive layer AL for the first time, it provides injection pressure to the lower part of the adhesive layer AL to separate the bare core D from the adhesive layer AL for the second time.

[0064] Therefore, the bare core ejection device 10 of this disclosure can easily separate the bare core D from the adhesive layer AL.

[0065] Figure 3 This is a flowchart illustrating the steps of the bare die ejection method S100 according to an exemplary embodiment of the present disclosure. Additionally, Figures 4 to 11 This is a diagram illustrating the various steps of the bare core ejection method S100 of an exemplary embodiment of the present disclosure.

[0066] The following is for reference Figures 3 to 11 The bare die ejection method S100 of the exemplary embodiments of this disclosure will be described. (Refer to...) Figure 3The bare core ejection method S100 of the exemplary embodiment of this disclosure may include: step S1100, disposing the adhesive layer AL on the bare core ejector 120, such that the center portion D_c of the bare core D is horizontally separated from the bare core ejector 120; step S1200, providing suction pressure to the adhesive layer AL through the bare core ejector 120; step S1300, the bare core ejector 120 moving relative to the adhesive layer AL in a first direction, such that the first edge portion D_e1, the center portion D_c, and the second edge portion D_e of the bare core D are separated. 2. In sequence, the bare core D overlaps with the bare core ejector 120 in the vertical direction; in step S1400, the bare core ejector 120 moves relative to the adhesive layer AL in the second direction, so that the bare core D and the bare core ejector 120 are aligned; in step S1500, a portion of the adhesive layer AL is moved upward by the vertical movement of the lifting member 150; in step S1600, the bare core D is provided to the adhesive layer AL by the bare core ejector 120; and in step S1700, the bare core D is picked up from the adhesive layer AL by the adhesive head 190 disposed on the bare core ejector 120.

[0067] Simultaneously refer to Figure 3 and Figure 4 The bare core ejection method S100 of the exemplary embodiments of this disclosure may include: step S1100, disposing an adhesive layer AL on the bare core ejector 120 such that the central portion D_c of the bare core D is separated from the bare core ejector 120 in the horizontal direction.

[0068] In the following text, the first edge portion D_e1 of the bare core D may be a part of the edge of the bare core D adjacent to the center of the bare core ejector 120, and the second edge portion D_e2 may be a part of the edge of the bare core D opposite to the first edge portion D_e1. Additionally, the center portion D_c of the bare core D may be a part of the bare core D disposed between the first edge portion D_e1 and the second edge portion D_e2.

[0069] Simultaneously refer to Figure 3 and Figure 5 The bare core ejection method S100 of the exemplary embodiments of this disclosure may include: step S1200, providing suction pressure to the adhesive layer AL through the bare core ejector 120.

[0070] In step S1200, controller 190 ( Figure 2The controller 200 can control the pressure regulating device 130 to provide suction pressure to the adhesive layer AL via the bare core ejector 120. Additionally, in step S1200, the controller 200 can control the pressure regulating device 130 to adjust the intensity of the suction pressure. For example, in step S1200, the controller 200 receives a signal related to the intensity of the suction pressure from a sensor (not shown) and controls the pressure regulating device 130 based on the signal, thereby adjusting the intensity of the suction pressure in real time.

[0071] Simultaneously refer to Figure 3 and Figures 6a to 6c The bare core ejection method S100 of the exemplary embodiment of this disclosure may include: step S1300, in which the bare core ejector 120 moves relative to the adhesive layer AL in a first direction, such that the first edge portion D_e1, the center portion D_c, and the second edge portion D_e2 of the bare core D sequentially overlap with the bare core ejector 120 in the vertical direction.

[0072] That is, step S1300 can be a step in which the bare core ejector 120 moves relative to the adhesive layer AL in a first direction, so that the first edge portion D_e1, the center portion D_c, and the second edge portion D_e2 of the bare core D pass through the center of the bare core ejector 120 in sequence.

[0073] Step S1300 may include: Step S1300a_I, in which the bare core ejector 120 moves horizontally via the bare core ejector drive device 140, causing the first edge portion D_e1 of the bare core D to overlap with the bare core ejector 120 in the vertical direction; Step S1300b_I, in which the bare core ejector 120 moves horizontally via the bare core ejector drive device 140, causing the center portion D_c of the bare core D to overlap with the bare core ejector 120 in the vertical direction; and Step S1300c_I, in which the bare core ejector 120 moves horizontally via the bare core ejector drive device 140, causing the second edge portion D_e2 of the bare core D to overlap with the bare core ejector 120 in the vertical direction. In steps S1300a_I to S1300c_I, the stage 170 supporting the adhesive layer AL can be fixed.

[0074] That is, in step S1300, while providing suction pressure to the lower part of the adhesive layer AL, the bare core ejector 120 moves horizontally, thereby separating the bare core D from the adhesive layer AL for the first time. As the bare core ejector 120 moves horizontally, the first edge portion D_e1, the center portion D_c, and the second edge portion D_e2 of the bare core D can be separated from the adhesive layer AL in sequence for the first time.

[0075] Simultaneously refer to Figure 3 and Figures 7a to 7cStep S1300 may include: step S1300a_II, where the stage 170 moves horizontally via the stage drive device 180, causing the first edge portion D_e1 of the bare core D to overlap with the bare core ejector 120 in the vertical direction; step S1300b_II, where the stage 170 moves horizontally via the stage drive device 180, causing the center portion D_c of the bare core D to overlap with the bare core ejector 120 in the vertical direction; and step S1300c_II, where the stage 170 moves horizontally via the stage drive device 180, causing the second edge portion D_e2 of the bare core D to overlap with the bare core ejector 120 in the vertical direction. In steps S1300a_II to S1300c_II, the bare core ejector 120 may be fixed.

[0076] That is, in step S1300, while providing suction pressure to the lower part of the adhesive layer AL, the stage 170 moves horizontally, thereby separating the bare core D from the adhesive layer AL for the first time. As the stage 170 moves horizontally, the first edge portion D_e1, the center portion D_c, and the second edge portion D_e2 of the bare core D can be separated from the adhesive layer AL in sequence for the first time.

[0077] Simultaneously refer to Figure 3 and Figure 8a The bare core ejection method S100 of the exemplary embodiments of this disclosure may include: step S1400, in which the bare core ejector 120 moves relative to the adhesive layer AL in a second direction opposite to the first direction, so that the bare core D and the bare core ejector 120 are aligned.

[0078] In an exemplary embodiment, step S1400 may include: step S1400_I, in which the bare die ejector 120 moves horizontally via the bare die ejector drive device 140, causing the center portion D_c of the bare die D to overlap with the bare die ejector 120 in the vertical direction. The moving direction of the bare die ejector 120 in step S1400_I, i.e., the second direction, may be the opposite direction to the moving direction of the bare die ejector 120 in steps S1300a_I to S1300c_I, i.e., the first direction.

[0079] In an exemplary embodiment, during step S1400, the bare core ejector 120 can continue to provide suction pressure to the central portion D_c of the bare core D via the pressure regulating device 130. As a result, the central portion D_c of the bare core D can be separated from the adhesive layer AL.

[0080] However, not limited to this, during the execution of step S1400, since the operation of the pressure regulating device 130 is interrupted, the bare core ejector 120 may not provide suction pressure to the central portion D_c of the bare core D.

[0081] Simultaneously refer to Figure 3and Figure 8b Step S1400 may include: Step S1400_II, where the stage 170 moves horizontally via the stage drive device 180, causing the center portion D_c of the bare core D to overlap with the bare core ejector 120 in the vertical direction. The direction of movement of the stage 170 in step S1400_II, i.e., the second direction, may be the opposite direction to the direction of movement of the stage 170 in steps S1300a_II to S1300c_II, i.e., the first direction.

[0082] Simultaneously refer to Figure 3 and Figure 9 The bare core ejection method S100 of the exemplary embodiments of this disclosure may include: step S1500, moving a portion of the adhesive layer AL upward by moving the lifting member 150 in the vertical direction.

[0083] In an exemplary embodiment, step S1500 may include: step S1500, moving a portion of the adhesive layer AL upward by moving the lifting member 150 in the vertical direction.

[0084] In an exemplary embodiment, in step S1500, the lifting member 150 can be moved upward by the lifting member drive device 160, causing the adhesive layer AL disposed at the lower part of the first edge portion D_e1 and the second edge portion D_e2 of the bare core D to move upward.

[0085] In an exemplary embodiment, during the execution of step S1500, the bare core ejector 120 may continue to provide suction pressure to the central portion D_c of the bare core D via the pressure regulating device 130.

[0086] However, step S1500 can be omitted in the bare core ejection method S100 of the exemplary embodiments of this disclosure.

[0087] Simultaneously refer to Figure 3 and Figure 10 The bare core ejection method S100 of the exemplary embodiments of this disclosure may include: step S1600, providing injection pressure to the adhesive layer AL through the bare core ejector 120.

[0088] In step S1600, controller 190 ( Figure 2 The controller 200 can control the pressure regulating device 130 to provide injection pressure to the adhesive layer AL via the bare core ejector 120. Additionally, in step S1600, the controller 200 can control the pressure regulating device 130 to adjust the intensity of the injection pressure. For example, in step S1600, the controller 200 receives a signal related to the intensity of the injection pressure from a sensor (not shown) and controls the pressure regulating device 130 based on the signal, thereby adjusting the intensity of the injection pressure in real time.

[0089] By performing step S1600, the first edge portion D_e1 and the second edge portion D_e2 of the bare core D can be separated from the adhesive layer AL.

[0090] Simultaneously refer to Figure 3 and Figure 11 The bare core ejection method S100 of the exemplary embodiments of this disclosure may include: step S1700, picking up the bare core D from the adhesive layer AL by an adhesive head 190 configured on the bare core ejector 120.

[0091] In step S1700, the adhesive head 190 applies vacuum pressure to the upper surface of the bare die D, thereby picking up the bare die D from the adhesive layer AL. Additionally, the adhesive head 190 can adhere the picked-up bare die D to a substrate on the worktable. For example, the substrate may include a wafer or a printed circuit board (PCB).

[0092] In the bare core ejection method S100 of the exemplary embodiment of this disclosure, during the period when the bare core ejector 120 provides suction pressure to the lower part of the adhesive layer AL, the bare core ejector 120 can be moved relative to the adhesive layer AL in a horizontal direction, so that the edge portion and the center portion of the bare core D successively pass through the center of the bare core ejector 120. Thus, the bare core ejection method S100 of this disclosure can separate the bare core D from the adhesive layer AL for the first time.

[0093] In addition, after the bare core D is separated from the adhesive layer AL for the first time, the bare core ejection method S100 of this disclosure can provide injection pressure to the lower part of the adhesive layer AL to separate the bare core D from the adhesive layer AL for the second time.

[0094] Therefore, the bare core ejection method S100 of this disclosure can easily separate the bare core D from the adhesive layer AL.

[0095] Figure 12 This is a flowchart illustrating the steps of the bare die ejection method S200 according to an exemplary embodiment of the present disclosure. Additionally, Figures 13 to 19 This is a diagram illustrating the various steps of the bare core ejection method S200 of an exemplary embodiment of the present disclosure.

[0096] The following is for reference Figures 12 to 19 The bare core ejection method S200 of the exemplary embodiments of the present disclosure will be described.

[0097] Reference Figure 12The bare core ejection method S200 of the exemplary embodiment of this disclosure may include: step S2100, disposing the adhesive layer AL on the bare core ejector 120 such that the center portion D_c of the bare core D is horizontally spaced from the bare core ejector 120; step S2200, providing suction pressure to the adhesive layer AL through the bare core ejector 120; and step S2300, moving the bare core ejector 120 relative to the adhesive layer AL such that the first edge portion D_e1 and the center portion D_e1 of the bare core D are separated. _c overlaps with bare core ejector 120 in sequence; in step S2400, the movement of bare core ejector 120 is interrupted, so that bare core D and bare core ejector 120 are aligned; in step S2500, a portion of adhesive layer AL is moved upward by the vertical movement of lifting member 150; in step S2600, spray pressure is provided to adhesive layer AL by bare core ejector 120; and in step S2700, bare core D is picked up from adhesive layer AL by adhesive head 190 configured on bare core ejector 120.

[0098] Simultaneously refer to Figure 12 and Figure 13 The bare core ejection method S200 of the exemplary embodiments of this disclosure may include: step S2100, disposing an adhesive layer AL on the bare core ejector 120 such that the center portion D_c of the bare core D is separated from the bare core ejector 120 in the horizontal direction.

[0099] As described above, the first edge portion D_e1 of the bare core D may be a part of the edge of the bare core D adjacent to the center of the bare core ejector 120, and the second edge portion D_e2 may be a part of the edge of the bare core D opposite to the first edge portion D_e1. Additionally, the center portion D_c of the bare core D may be a part of the bare core D disposed between the first edge portion D_e1 and the second edge portion D_e2.

[0100] Simultaneously refer to Figure 12 and Figure 14 The bare core ejection method S200 of the exemplary embodiments of this disclosure may include: step S2200, providing suction pressure to the adhesive layer AL through the bare core ejector 120.

[0101] In step S2200, controller 190 ( Figure 2 The controller 200 can control the pressure regulating device 130 to provide suction pressure to the adhesive layer AL via the bare core ejector 120. Additionally, in step S2200, the controller 200 can control the pressure regulating device 130 to adjust the intensity of the suction pressure. For example, in step S2200, the controller 200 receives a signal related to the intensity of the suction pressure from a sensor (not shown) and controls the pressure regulating device 130 based on the signal, thereby adjusting the intensity of the suction pressure in real time.

[0102] Simultaneously refer to Figure 12 and Figure 15 The bare core ejection method S200 of the exemplary embodiment of this disclosure may include: step S2300, in which the bare core ejector 120 moves relative to the adhesive layer AL, so that the first edge portion D_e1 and the center portion D_c of the bare core D overlap the bare core ejector 120 in the vertical direction in sequence.

[0103] That is, step S2300 can be a step in which the bare core ejector 120 moves relative to the adhesive layer AL, so that the first edge portion D_e1 and the center portion D_c of the bare core D pass through the center of the bare core ejector 120 in sequence.

[0104] In step S2300, with the stage 170 fixed, the bare core ejector 120 can move horizontally via the bare core ejector drive device 140. However, this is not the only possibility; in step S1300, with the bare core ejector 120 fixed, the stage 170 can move horizontally via the stage drive device 180. Furthermore, in step S1300, the bare core ejector 120 and the stage 170 can move simultaneously.

[0105] In step S2300, while suction pressure is provided to the lower part of the adhesive layer AL, the bare core D can separate from the adhesive layer AL for the first time because the bare core ejector 120 can move relative to the adhesive layer AL. That is, as the bare core ejector 120 moves relative to the adhesive layer AL in the horizontal direction, the first edge portion D_e1 and the center portion D_c of the bare core D can sequentially separate from the adhesive layer AL for the first time.

[0106] Simultaneously refer to Figure 12 and Figure 16 The bare core ejection method S200 of the exemplary embodiments of this disclosure may include: step S2400, interrupting the relative movement of the bare core ejector 120 with respect to the adhesive layer AL, so that the bare core D and the bare core ejector 120 are aligned.

[0107] In an exemplary embodiment, step S2400 may include interrupting the relative horizontal movement of the bare core ejector 120 when the center portion D_c of the bare core D overlaps with the bare core ejector 120 in the vertical direction. In other words, in step S2300, when the bare core ejector 120 moves in the first direction, in step S2400, the bare core ejector 120 may interrupt the movement in the first direction, causing the bare core D and the bare core ejector 120 to align.

[0108] Simultaneously refer to Figure 12 and Figure 17The bare core ejection method S200 of the exemplary embodiments of this disclosure may include: step S2500, moving a portion of the adhesive layer AL upward by moving the lifting member 150 in the vertical direction.

[0109] In an exemplary embodiment, step S2500 may include: step S2500, moving a portion of the adhesive layer AL upward by moving the lifting member 150 in the vertical direction.

[0110] In an exemplary embodiment, in step S2500, the lifting member 150 can be moved upward by the lifting member drive device 160, causing the adhesive layer AL disposed at the lower part of the first edge portion D_e1 and the second edge portion D_e2 of the bare core D to move upward.

[0111] In an exemplary embodiment, during the execution of step S2500, the bare core ejector 120 may continue to provide suction pressure to the central portion D_c of the bare core D via the pressure regulating device 130.

[0112] However, step S2500 can be omitted in the bare core ejection method S200 of the exemplary embodiments of this disclosure.

[0113] Simultaneously refer to Figure 12 and Figure 18 The bare core ejection method S200 of the exemplary embodiments of this disclosure may include: step S2600, providing injection pressure to the adhesive layer AL through the bare core ejector 120.

[0114] In step S2600, controller 190 ( Figure 2 The controller 200 can control the pressure regulating device 130 to provide injection pressure to the adhesive layer AL via the bare core ejector 120. Additionally, in step S2600, the controller 200 can control the pressure regulating device 130 to adjust the intensity of the injection pressure. For example, in step S2600, the controller 200 receives a signal related to the intensity of the injection pressure from a sensor (not shown) and controls the pressure regulating device 130 based on the signal, thereby adjusting the intensity of the injection pressure in real time.

[0115] By performing step S2600, the first edge portion D_e1 and the second edge portion D_e2 of the bare core D can be separated from the adhesive layer AL.

[0116] Simultaneously refer to Figure 12 and Figure 19 The bare core ejection method S200 of the exemplary embodiments of this disclosure may include: step S2600, picking up the bare core D from the adhesive layer AL by means of the adhesive head 190 configured on the bare core ejector 120.

[0117] In step S2600, the adhesive head 190 applies vacuum pressure to the upper surface of the bare die D, thereby picking up the bare die D from the adhesive layer AL. Additionally, the adhesive head 190 can adhere the picked-up bare die D to a substrate on the worktable. For example, the substrate may include a wafer or a printed circuit board (PCB).

[0118] In the bare core ejection method S200 of the exemplary embodiment of this disclosure, during the period when the bare core ejector 120 provides suction pressure to the lower part of the adhesive layer AL, the bare core ejector 120 can be moved relative to the adhesive layer AL in a horizontal direction so that the edge portion and the center portion of the bare core D successively pass through the center of the bare core ejector 120. Thus, the bare core ejection method S200 of this disclosure can separate the bare core D from the adhesive layer AL for the first time.

[0119] In addition, after the bare core D is separated from the adhesive layer AL for the first time, the bare core ejection method S200 of this disclosure can provide injection pressure to the lower part of the adhesive layer AL to separate the bare core D from the adhesive layer AL for the second time.

[0120] Therefore, the bare core ejection method S200 of this disclosure can easily separate the bare core D from the adhesive layer AL.

[0121] Furthermore, the bare core ejection method S200 of the exemplary embodiments of this disclosure can provide suction pressure and jetting pressure to the adhesive layer AL while moving the bare core ejector 120 only in a specific direction (e.g., the +X direction), thereby separating the bare core D from the adhesive layer AL. Thus, the bare core ejection method S200 of this disclosure can quickly separate the bare core D from the adhesive layer AL.

Claims

1. A method for ejecting a bare core, used to separate a bare core from an adhesive layer, characterized in that, include: The step of placing the adhesive layer on the bare core ejector, such that the central portion of the bare core is separated from the bare core ejector in the horizontal direction; The step of providing suction pressure to the adhesive layer through the bare core ejector; The bare core ejector moves relative to the adhesive layer in a first direction, such that the first edge portion, the center portion, and the second edge portion opposite to the first edge portion of the bare core sequentially overlap the bare core ejector in the vertical direction. The bare core ejector moves relative to the adhesive layer in a second direction opposite to the first direction, thereby aligning the bare core and the bare core ejector. as well as, The step of applying injection pressure to the adhesive layer via the bare core ejector.

2. The bare core ejection method as described in claim 1, characterized in that, The step of moving the bare core ejector relative to the adhesive layer in a first direction includes: The step of moving the bare core ejector in the horizontal direction while the adhesive layer is fixed on the stage.

3. The bare core ejection method as described in claim 1, characterized in that, The step of moving the bare core ejector relative to the adhesive layer in a first direction includes: The step of moving the stage supporting the adhesive layer in the horizontal direction while the bare core ejector is fixed.

4. The bare core ejection method as described in claim 1, characterized in that, Prior to the step of applying injection pressure to the adhesive layer via the bare core ejector, the method further includes: The step of moving a portion of the adhesive layer located below the first and second edge portions of the bare core upward by moving the lifting member configured at the lower part of the adhesive layer in the vertical direction.

5. The bare core ejection method as described in claim 4, characterized in that, During the step of moving a portion of the adhesive layer upward via the lifting member, the bare core ejector provides suction pressure to the adhesive layer disposed below the central portion of the bare core.

6. The bare core ejection method as described in claim 1, characterized in that, Also includes: The step of picking up the bare core from the adhesive layer by an adhesive head configured on the bare core ejector.

7. The bare core ejection method as described in claim 1, characterized in that, During the step of aligning the bare cores and the bare core ejector, the bare core ejector provides suction pressure to the adhesive layer.

8. The bare core ejection method as described in claim 1, characterized in that, During the step of aligning the bare cores and the bare core ejector, the bare core ejector interrupts the supply of suction pressure to the adhesive layer.

9. A method for ejecting a bare core, used to separate a bare core from an adhesive layer, characterized in that, include: The step of applying suction pressure to the adhesive layer via a bare core ejector; During the application of the suction pressure to the adhesive layer, the bare core ejector moves relative to the adhesive layer such that the edge portion and the center portion of the bare core successively overlap the bare core ejector; The step of moving a portion of the adhesive layer located below the edge portion of the bare core upward by moving the lifting member disposed at the lower part of the adhesive layer in the vertical direction; as well as, The step of applying injection pressure to the adhesive layer via the bare core ejector; The step of moving the bare core ejector relative to the adhesive layer includes: The step of moving the stage supporting the adhesive layer in the horizontal direction while the bare core ejector is fixed.

10. The bare core ejection method as described in claim 9, characterized in that, Also includes: When the central portion of the bare core overlaps with the bare core ejector in the vertical direction, the relative movement of the bare core ejector is interrupted, allowing the bare core and the bare core ejector to align. The step of providing injection pressure to the adhesive layer through the bare core ejector is performed after the step of aligning the bare core and the bare core ejector.

11. The bare core ejection method as described in claim 10, characterized in that, During the process of aligning the bare core and the bare core ejector, the bare core ejector provides suction pressure to the adhesive layer.

12. The bare core ejection method as described in claim 9, characterized in that, The step of moving the bare core ejector relative to the adhesive layer includes: The step of moving the bare core ejector in the horizontal direction while the adhesive layer is fixed on the stage.

13. The bare core ejection method as described in claim 9, characterized in that, Also includes: The step of picking up the bare core from the adhesive layer by an adhesive head configured on the bare core ejector.

14. A bare core ejection device for separating a bare core from an adhesive layer, characterized in that, include: A housing, disposed below the adhesive layer, provides internal space; A bare core ejector is disposed in the internal space of the housing and provides at least one of a suction pressure and a jet pressure to the adhesive layer; A pressure regulating device is connected to the bare core ejector and regulates at least one of the pressure type and intensity provided by the bare core ejector to the adhesive layer; A bare core ejector drive device moves the bare core ejector horizontally; A lifting component is disposed in the internal space of the housing and is disposed below the adhesive layer to support a portion of the adhesive layer; A lifting component drive device is connected to the lifting component, enabling the lifting component to move in the vertical direction; The controller is connected to the pressure regulating device, the bare core ejector drive device, and the lifting component drive device. A platform that supports the adhesive layer; as well as A platform drive device, connected to the controller, moves the platform horizontally. The controller controls the pressure regulating device to provide the suction pressure to the adhesive layer. While the adhesive layer is subjected to the suction pressure, the controller controls the bare core ejector drive to move the bare core ejector horizontally, causing the edge and center portions of the bare core to pass through the bare core ejector sequentially. With the bare core and the bare core ejector aligned, the controller controls the pressure regulating device to provide injection pressure to the adhesive layer.

15. The bare core ejection device as described in claim 14, characterized in that, As the lifting member moves vertically and supports a portion of the adhesive layer disposed at the lower part of the edge portion of the bare core, the controller controls the pressure regulating device to provide the suction pressure to a portion of the adhesive layer disposed at the lower part of the center portion of the bare core.

16. The bare core ejection device as described in claim 14, characterized in that, Before the suction pressure is supplied to the adhesive layer by the pressure regulating device, the controller controls the bare core ejector drive device to arrange the central portion of the bare core separately from the bare core ejector in a horizontal direction.

17. The bare core ejection device as described in claim 14, characterized in that, Also includes: An adhesive head, configured on the bare core ejector, picks up the bare core from the adhesive layer.

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