Multispectral tdi ccd with bidirectional pushbroom imaging function

Abstract

The application relates to a multispectral TDICCD with a bidirectional push-broom imaging function and belongs to the field of solid image sensors. The multispectral TDICCD comprises two panchromatic spectrum segments and N multispectral spectrum segments; the N multispectral spectrum segments are horizontally arranged in the middle of a chip, wherein N is a positive integer determined by an imaging system; two horizontal shift registers are symmetrically arranged on the upper and lower sides of each multispectral spectrum segment; two panchromatic spectrum segments are arranged in parallel on the two sides of the entire multispectral spectrum segment, and one horizontal shift register is arranged on the side far from the multispectral spectrum segment, thereby forming mirror symmetry. Bidirectional photoelectric charge transfer can be realized, and bidirectional push-broom imaging can be finally realized.

Description

Technical Field

[0001] This invention belongs to the field of solid-state image sensors and relates to a multispectral TDICCD with bidirectional pushbroom imaging function. Background Technology

[0002] A charge-coupled device (CCD) is a solid-state semiconductor imaging device that uses the principle of charge coupling.

[0003] A Time Delay Integrating CCD (TDICCD) is a special type of CCD, similar to multiple linear CCDs grouped together. During operation, a TDICCD uses a push-broom method, synchronizing the imaging position with the movement of the charge packets. This allows for the accumulation of signals from multiple linear arrays of the same scene. When the TDICCD has M stages, the output signal is M times that of a single stage. The biggest advantage of TDICCD is its significantly improved signal-to-noise ratio compared to conventional CCDs. When the TDICCD has M stages, the signal-to-noise ratio is increased to... Therefore, TDICCD is particularly suitable for imaging high-speed moving objects in industrial inspection and for satellite-based Earth remote sensing imaging.

[0004] Multiple TDICCDs are integrated onto a single chip. The spectral response range of each TDICCD is achieved by depositing narrowband filters of the required spectral range at corresponding positions on the window glass, thus forming a multispectral TDICCD. A multispectral TDICCD contains photosensitive units with multiple spectral bands, combining imaging and spectral measurement technologies. This spectral image data has the characteristic of "image and spectrum integration," providing richer target scene information compared to traditional single-band wide-band photoelectric detection technologies. It has extremely important applications in target detection technologies such as target material identification, abnormal target detection, camouflaged target identification, and complex background suppression.

[0005] For some applications, such as rapid satellite orbit changes, where satellites need to quickly switch pushbroom imaging directions, multispectral TDICCDs need to achieve bidirectional charge accumulation. However, existing typical multispectral TDICCDs consist of one full-spectral band and four multispectral bands, each with its own horizontal shift register to receive signal charge packets transferred from the photosensitive pixel area. But this type of multispectral TDICCD can only achieve unidirectional charge accumulation and cannot achieve bidirectional charge accumulation. Summary of the Invention

[0006] In view of this, the purpose of the present invention is to provide a multispectral TDICCD with bidirectional pushbroom imaging function, which can be used to adapt to applications such as rapid satellite orbit changes that require rapid switching of imaging direction.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A multispectral TDICCD with bidirectional push-broom imaging capability includes two full-spectral bands and four multispectral bands;

[0009] N multispectral bands are horizontally arranged in the middle of the chip; two horizontal shift registers are symmetrically arranged on the upper and lower sides of each multispectral band; where N is a positive integer determined by the imaging system.

[0010] Two full-spectral segments are set in parallel on both sides of the entire multispectral band, and a horizontal shift register is set on the side away from the multispectral band, forming a mirror symmetry.

[0011] Furthermore, two horizontal shift registers for each multispectral band are symmetrically positioned on the upper and lower sides of the multispectral band pixel array.

[0012] Furthermore, the horizontal shift register for the upper full-chromatographic segment is located on the upper side of the full-chromatographic segment pixel array; the horizontal shift register for the lower full-chromatographic segment is located on the lower side of the full-chromatographic segment pixel array.

[0013] Furthermore, the output ports of the multispectral bands are all located at the left and right ends of the multispectral band horizontal shift register.

[0014] Furthermore, the output ports of the entire chromatographic segment are set at both ends and multiple locations in the middle of the horizontal shift register of the entire chromatographic segment; and the output ports in the middle are set in pairs.

[0015] Furthermore, the output ports for both the full-spectrum and multi-spectral bands are located on the edge side near the chip's bonding pads.

[0016] Furthermore, when the device push-broom imaging direction is vertically upward from bottom, the bottommost full-spectrum band and N multispectral bands are working, and the photogenerated charge transfer direction is vertically downward from top, transferring from the photosensitive area to the bottom horizontal shift register, and then to the output port.

[0017] When the device push-broom imaging direction is vertically upward, the uppermost full-spectrum band and N multispectral bands are working, and the photogenerated charge transfer direction is vertically upward, from the photosensitive area to the upper horizontal shift register, and then to the output port.

[0018] The beneficial effects of this invention are as follows: Based on a typical multispectral TDICCD, this invention achieves bidirectional photogenerated charge transfer by setting a full chromatographic segment on the other side and setting two symmetrical horizontal shift registers in each multispectral segment, ultimately realizing bidirectional push-broom imaging.

[0019] Other advantages, objectives, and features of the invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination, or may be learned from practice of the invention. The objectives and other advantages of the invention can be realized and obtained through the following description. Attached Figure Description

[0020] To make the objectives, technical solutions, and advantages of the present invention clearer, the preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, wherein:

[0021] Figure 1 A schematic diagram of a multispectral TDICCD consisting of a full chromatographic band and four multispectral bands;

[0022] Figure 2 This is a schematic diagram of the multispectral TDICCD with bidirectional push-broom imaging function of the present invention;

[0023] Figure 3 This is a schematic diagram of the charge transfer direction when the device push-broom imaging direction is vertically upward from bottom to top.

[0024] Figure 4 This is a schematic diagram of the charge transfer direction when the device push-broom imaging direction is vertically downward.

[0025] Figure reference numerals: 101-Full-chromatographic horizontal shift register, 102-Multi-spectral horizontal shift register, 201-Full-chromatographic pixel array, 202-Multi-spectral pixel array, 301-Full-chromatographic output port, 302-Multi-spectral output port, chip bonding pad. Detailed Implementation

[0026] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0027] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual pictures. They should not be construed as limiting the invention. To better illustrate the embodiments of the invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual product dimensions. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0028] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," "front," and "rear" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting the present invention. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0029] Please see Figures 1-4 A typical multispectral TDICCD consists of one full chromatographic band and four multispectral bands, and its structure is as follows: Figure 1 As shown, the full-spectrum band has more pixels in the horizontal direction than the multispectral band, thus corresponding to more output ports. Both the full-spectrum and multispectral bands are equipped with horizontal shift registers to receive signal charge packets transferred from the photosensitive pixel areas.

[0030] This invention proposes a multispectral TDICCD with bidirectional pushbroom imaging capability, the structure of which is as follows: Figure 2 As shown.

[0031] For the full-spectrum segment, since the output ports are located on the left and right sides, the signal leads related to the output ports can be led out to the chip bonding pads nearby. A horizontal shift register is set at each of the upper and lower ends of the full-spectrum segment to receive the charge packets transferred from the photosensitive pixel array during bidirectional transfer.

[0032] For full-spectrum spectral bands, an output port needs to be set in the central region of the pixel array. When using a method similar to setting a horizontal shift register for multi-spectral bands, i.e., setting the horizontal shift register on the other side of the photosensitive pixel array, the signal lead corresponding to the port near the central region cannot be led out to the chip bonding pad nearby.

[0033] Therefore, this invention proposes to set up an identical full-color segment on the other side of the chip, with its horizontal shift register located on the other side of the photosensitive pixel array, forming a mirror symmetry with another full-color segment.

[0034] The working principle of the device is as follows Figure 3 , Figure 4 As shown.

[0035] Figure 3In the middle, the device push-broom imaging direction is vertically upward from bottom to top. The bottommost full-spectrum band and four multispectral bands are working (more multispectral bands can be added, such as six or eight multispectral bands, depending on the spectral resolution requirements of the imaging system). The photogenerated charge transfer direction is vertically downward from top to bottom, from the photosensitive area to the lower horizontal shift register, and then to the output port.

[0036] Figure 4 In the middle, the device push-broom imaging direction is vertically upward. The uppermost full-spectrum band and four multispectral bands are working, and the photogenerated charge transfer direction is vertically upward, from the photosensitive area to the upper horizontal shift register, and then to the output port.

[0037] This invention enables bidirectional photogenerated charge transfer by mirroring a full chromatographic segment on the other side and simultaneously setting two symmetrical horizontal shift registers in each multispectral segment, ultimately achieving bidirectional push-broom imaging.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A multispectral TDICCD with bidirectional push-broom imaging function, characterized in that, It includes two full-spectral-band pixel arrays and N multi-spectral-band pixel arrays; N multispectral band pixel arrays are horizontally arranged in the middle of the chip; two horizontal shift registers are symmetrically arranged on the upper and lower sides of each multispectral band pixel array; where N is a positive integer determined by the imaging system; Two full-spectrum pixel arrays are arranged in parallel on the top and bottom sides of the entire multispectral pixel array, and a horizontal shift register is set on the side away from the multispectral pixel array, forming a mirror symmetry; When the device push-broom imaging direction is vertically upward from bottom, the bottommost full-spectrum pixel array and N multi-spectral pixel arrays work, and the photogenerated charge transfer direction is vertically downward from top, from the photosensitive area to the bottom horizontal shift register, and then to the output port; When the device push-broom imaging direction is vertically downward from top, the topmost full-spectrum pixel array and N multispectral pixel arrays work, and the photogenerated charge transfer direction is vertically upward from bottom, from the photosensitive area to the upper horizontal shift register, and then to the output port.

2. The multispectral TDICCD according to claim 1, characterized in that, Two horizontal shift registers for each multispectral pixel array are symmetrically positioned on the top and bottom sides of the multispectral pixel array.

3. The multispectral TDICCD according to claim 1, characterized in that, The horizontal shift register of the upper full-chromatographic pixel array is located on the upper side of the full-chromatographic pixel array; the horizontal shift register of the lower full-chromatographic pixel array is located on the lower side of the full-chromatographic pixel array.

4. The multispectral TDICCD according to claim 1, characterized in that, The output ports of the multispectral pixel array are all located at the left and right ends of the multispectral pixel array horizontal shift register.

5. The multispectral TDICCD according to claim 1, characterized in that, The output ports of the full-spectrum pixel array are located at the left and right ends and multiple locations in the middle of the horizontal shift register of the full-spectrum pixel array; and the output ports in the middle are set in pairs.

6. The multispectral TDICCD according to claim 1, 4 or 5, characterized in that, The output ports of both the full-spectrum pixel array and the multi-spectral pixel array are located on the edge side near the chip bonding pad.

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