A heat dissipation device suitable for CPU chip

Abstract

The application discloses a heat dissipation device suitable for a CPU chip, which comprises a fixed base and a heat dissipation component rotationally connected with the fixed base, a plurality of rotating shafts are arranged along the transverse direction of the fixed base, a plurality of mounting holes are arranged in the circumferential direction of the fixed base, a fixed plate is vertically arranged on one side of the fixed base, a driving motor is arranged on the fixed plate, and a through hole is formed in the fixed plate; the heat dissipation component comprises a plurality of parallel arranged heat dissipation fins and a cooling component rotationally connected with the top ends of the heat dissipation fins, a plurality of grooves are formed in the heat dissipation fins, the cooling component comprises a plurality of cooling pipes, and the two ends of the cooling pipes are connected with water storage bins respectively; one side of the heat dissipation fins close to the driving motor is rotationally connected with a moving plate, the moving plate is connected with the output shaft of the driving motor through a crank connecting rod mechanism, and the crank connecting rod mechanism penetrates through the through hole; in the application, different gradients of rotating speeds are designed to correspond to different gradients of temperatures, so that the heat dissipation fins form turbulence to the surrounding air at different swing speeds, the heat dissipation is accelerated, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This invention relates to the technical field of CPU chip heat sinks, and more particularly to a heat sink device suitable for CPU chips and its usage method. Background Technology

[0002] With the rapid development of technology, various electronic products are moving towards higher integration, higher intelligence, and miniaturization. Along with continuous functional advancements, the widespread adoption and application of large-scale integrated circuits has led to a further increase in internal heat generation per unit volume. A significant amount of heat cannot dissipate quickly enough within the relatively enclosed space, which can have a very negative impact on the machine, such as burning out components. Computer CPU chips are facing this challenge. The continuous upgrades of CPU chips have led to a dramatic increase in the number of transistors inside, from the initial 2300 to the 3 million transistors in the Pentium I and 9.5 million in the Pentium III, and the latest Core series, which has reached 580 million transistors. Increasing the number of wiring layers is one solution to accommodate such a massive transistor arrangement, but this significantly increases density, resulting in even higher heat generation. Furthermore, it has been concluded that over 55% of electronic device malfunctions are caused by overheating.

[0003] Existing CPU chip cooling methods can be divided into three types: air cooling, heat pipe cooling, and water cooling. The following problems exist during use: 1. During the operation of the heatsink, dust will adhere to the inside of the CPU. Dust entering the CPU can easily affect its use; 2. Air cooling requires the addition of components such as fans, which takes up a lot of space and is noisy; 3. Water cooling has low heat transfer efficiency and low heat exchange efficiency with the outside world. Summary of the Invention

[0004] This invention overcomes the shortcomings of the prior art and provides a heat dissipation device and its usage method suitable for CPU chips. It aims to solve the problem of how to reduce dust accumulation on the CPU caused by the heat sink and reduce noise during heat dissipation, while improving the heat dissipation efficiency of the heat sink.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a heat dissipation device suitable for CPU chips, comprising: a fixed base and a heat dissipation component rotatably connected to the fixed base.

[0006] The fixed base is a rectangular frame with several rotating shafts arranged horizontally along the rectangular frame and several mounting holes arranged circumferentially. A fixing plate is vertically installed on one side of the rectangular frame, and a drive motor is installed on the fixing plate and a through hole is opened there.

[0007] The heat dissipation component includes: a plurality of parallel heat dissipation fins and a cooling component rotatably connected to the top ends of the plurality of heat dissipation fins. The heat dissipation fins are provided with a plurality of grooves. The cooling component includes a plurality of cooling pipes, and the two ends of the plurality of cooling pipes are respectively connected to a water storage tank.

[0008] Several of the heat sinks are rotatably connected to a movable plate on the side near the drive motor, and the movable plate is connected to the output shaft of the drive motor through a crank-connecting rod mechanism, which passes through the through hole.

[0009] It should be noted that the water storage tank is also equipped with a cover for compensating for coolant, and the drive motor is a miniature motor.

[0010] In a preferred embodiment of the present invention, the top and bottom ends of the heat sink are provided with rotating tubes, which are respectively clearance-fitted with the cooling tube and the rotating shaft and rotatably connected.

[0011] In a preferred embodiment of the present invention, the liquid content in the water storage tank accounts for 70%-80% of the total volume of the water storage tank. The liquid is one of deionized water, methanol, ethanol or propanol. The water storage tank has extra space to facilitate heat exchange between the liquid and the outside. At the same time, when the heat sink swings, the liquid in the water storage tank also swings, further improving the heat exchange efficiency with the outside.

[0012] In a preferred embodiment of the present invention, the cooling pipe is a composite structure, including a water-absorbing core and a water-supplying core. The water-absorbing core and the water-supplying core of adjacent cooling pipes are arranged in reverse. The inverted arrangement can prevent the one-way transfer of liquid and allow it to accumulate in one water storage tank. At the same time, liquid exchange occurs in the two water storage tanks, thereby transferring heat. The heat generated by the friction between the liquid and the water storage tank is extremely small and can be ignored.

[0013] In a preferred embodiment of the present invention, the heat sink is made of aluminum alloy, brass or bronze, and the rotating tube at the connection with the cooling pipe is made of UPVC or galvanized steel pipe.

[0014] In a preferred embodiment of the present invention, the heat sink and the cooling component are respectively connected to a temperature controller, which is used to monitor the temperature at each component and thereby adjust the heat dissipation efficiency of the heat sink.

[0015] In a preferred embodiment of the present invention, the method for preparing the cooling pipe includes the following steps:

[0016] S1. Raw material mixing: After mixing copper powder with a particle size of 48-96μm and copper alloy powder with a particle size of 96-180μm with the colloid, spread them side by side in the groove of the heating furnace to a thickness of 2-3mm, and heat to 100℃-180℃ to make some of the contents of the colloid volatilize.

[0017] S2. High-temperature sintering: Baking is performed at a high temperature of 350℃-500℃ in an oxygen-free environment to burn off the polymer resin. After heating to 600℃-650℃, the mixture is cooled to allow the metal powder to form capillary plates with multiple pores in the grooves.

[0018] S3, Dissolving and creating pores: Place the capillary plate obtained in S2 into the solvent and dissolve for 3-5 minutes. After taking it out, dry it at a low temperature of 60℃-70℃.

[0019] S4. Cutting and garment making: Use a cutting machine with a blade spacing of 2-4mm to cut the capillary plate and divide it into several capillary segments with a length of 15-18cm. The copper powder side is the water absorption core, and the copper alloy powder side is the water supply core. At the same time, a waterproof membrane is wrapped around the surface of the capillary.

[0020] The waterproof membrane also has a certain degree of heat resistance and will not undergo physical or chemical changes in environments below 100℃. The solvents include water, benzene, carbon disulfide, carbon tetrachloride and other solvents, which make it easy for the pore-forming agent to dissolve in it and form capillary gaps between the metal powders.

[0021] In a preferred embodiment of the present invention, the colloid comprises a polymer resin, a pore-forming agent, and an alcoholic organic solvent. The pore-forming agent comprises soluble salts such as sodium carbonate and sodium chloride. The colloid can be fixed with metal powder during the sintering process to form a fixed shape.

[0022] This invention also provides a method for using a heat dissipation device suitable for CPU chips, comprising the following steps:

[0023] A1. Heat transfer: When the CPU chip is working, it generates heat, which is transferred upward through several heat sinks and grooves on the heat sinks. After contacting the cooling components, the local temperature decreases.

[0024] A2. Oscillating Heat Dissipation: The temperature controller measures the temperature of the heat sink and cooling components, and adjusts the motor speed accordingly based on different temperature gradients: ① When the temperature is 25℃-35℃, the motor rotation frequency is 7-11 r / s; ② When the temperature is 35℃-50℃, the motor rotation frequency is 12-19 r / s; ③ When the temperature is 50℃-75℃, the motor rotation frequency is 20-30 r / s; ④ When the temperature is above 75℃, the motor maintains 30 r / s, and the main unit activates an alarm.

[0025] A3 Cooling Circulation: The water-absorbing core with a smaller average aperture draws liquid from one side of the water storage tank into the cooling pipe, while the water-supply core with a larger average aperture supplies liquid to both sides, forming a unidirectional conduction; the two adjacent cooling pipes form a counter-conduction, sequentially exchanging liquid between the two water storage tanks. At the same time, the A2 swing will cause the liquid in the two water storage tanks to slosh, accelerating the heat exchange with the outside.

[0026] In a preferred embodiment of the present invention, the trajectory of liquid exchange in A3 is a U-shape / S-shape. Due to the placement pattern of the water-absorbing core and the water-supplying core, when the liquid is transferred to the water storage tank via the water-supplying core, a portion of the liquid will be absorbed by the water-absorbing cores on both sides of the water-supplying core and enter the cooling pipe, while the remaining majority of the liquid will enter the water storage tank for external heat exchange and heat dissipation.

[0027] This invention addresses the shortcomings of the prior art and has the following beneficial effects:

[0028] (1) In this invention, several grooves are opened on the surface of several heat sinks, which increases the contact area between the heat sinks and the air. Combined with the motor and crank-connecting rod mechanism, the back-and-forth swinging is formed, and the mechanical energy is converted into the potential energy and kinetic energy of the air, thereby forming forced convection. The heat sinks will collide and contact with different air in the gaps between adjacent heat sinks multiple times, improving the heat exchange efficiency between the heat sinks and the air. At the same time, the swinging will refresh the air in the gaps between the heat sinks. The hot air moves upward, and the bottom is filled with new cold air, which exchanges heat with the heat sinks again, forming heat transfer and heat dissipation in the vertical direction.

[0029] (2) In this invention, cooling components are provided at the top of several heat sinks. Based on the characteristic that the capillary force of the capillary increases as the average pore size decreases, two capillary wicks with different pore sizes are provided in the cooling tube to improve the unidirectional conduction capability of a single cooling tube to the liquid in the two water storage tanks. The liquid with a lower temperature in the water storage tank is transferred to another water storage tank for heat exchange after heat exchange with the heat sink. At the same time, the cooling tubes are set up in reverse so that the liquid exchange takes place in a U-shaped / S-shaped trajectory, which increases the frequency of liquid exchange. The water in the water storage tank is set to be not full so that it has room to move when it swings with the heat sink. The heat is conducted to the water storage tank shell through the liquid and air respectively, and then conducted to the outside, forming heat transfer and heat dissipation in the horizontal direction.

[0030] (3) In this invention, a variety of heat dissipation methods are used, and the motor speed is increased or decreased according to different temperature gradients. In the initial stage of power-on, the CPU can be cooled by water cooling and its own heat sink. After the temperature rises, the heat sink group moves synchronously when swinging, and the friction noise generated with the air is small. At the same time, the device of this invention will not generate wind pressure on the CPU surface and circumference, so it will not cause dust to accumulate on the CPU and adhere to the inside, thereby affecting the function of the CPU. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a perspective structural diagram of a preferred embodiment of the present invention;

[0033] Figure 2 This is a structural diagram of the motor connection point according to a preferred embodiment of the present invention;

[0034] Figure 3 This is a schematic diagram of the cooling component structure according to a preferred embodiment of the present invention;

[0035] In the diagram: 1. Water storage tank; 2. Cooling pipe; 3. Drive motor; 4. Fixing plate; 5. Groove; 6. Fixing base; 7. Heat sink; 8. Rotating pipe; 9. Heat dissipation component; 10. Rotating shaft; 11. Moving plate; 12. Through hole; 13. Crank connecting rod mechanism; 14. Water supply core; 15. Water suction core; 16. Cover. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein. Therefore, the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] like Figure 1 The diagram shows a three-dimensional structure of a heat dissipation device suitable for CPU chips and a structural diagram of the motor connection point, including a fixed base 6 and a heat dissipation component 9 rotatably connected to the fixed base 6.

[0041] The fixed base 6 is a rectangular frame with several rotating shafts 10 arranged horizontally along the rectangular frame. The rotating shafts 10 are installed in the rotating tube 8 and several mounting holes are arranged around the circumference. A fixed plate 4 is vertically installed on one side of the rectangular frame. A drive motor 3 is installed on the fixed plate 4 and a through hole 12 is opened.

[0042] The heat dissipation component 9 includes: a plurality of parallel heat dissipation fins 7 and a cooling component rotatably connected to the top ends of the plurality of heat dissipation fins 7. The heat dissipation fins 7 are provided with a plurality of grooves 5. The cooling component includes a plurality of cooling pipes 2, which are installed in the rotating pipe 8, and the two ends of the plurality of cooling pipes 2 are respectively connected to the water storage tank 1. The liquid content in the water storage tank 1 accounts for 70%-80% of the total volume of the water storage tank, and the liquid is one of deionized water, methanol, ethanol or propanol.

[0043] Several heat sinks 7 are rotatably connected to a movable plate 11 on the side near the drive motor 3, and the movable plate 11 is connected to the output shaft of the drive motor 3 through a crank-connecting rod mechanism 13, while the crank-connecting rod mechanism 13 passes through the through hole 12; the heat sink material 7 is one of aluminum alloy, brass or bronze, and the rotating pipe 8 at the connection with the cooling pipe 2 is made of UPVC or galvanized steel pipe; the heat sink 7 and the cooling components are respectively connected to the temperature controller.

[0044] like Figure 3 As shown, a schematic diagram of a cooling component structure for a heat dissipation device suitable for CPU chips is provided. The cooling pipe 2 is a composite structure, including a water-absorbing core 15 and a water-supplying core 14. The water-absorbing core 15 and the water-supplying core 14 of adjacent cooling pipes are arranged in reverse order, and the water storage tank 1 is provided with a cap 16 for replenishing coolant.

[0045] The present invention also provides a method for preparing the cooling pipe 2, comprising the following steps:

[0046] S1. Raw material mixing: Copper powder with a particle size of 48-96μm and copper alloy powder with a particle size of 96-180μm are mixed with colloids respectively. The colloids are polymer resin, pore-forming agent and alcohol organic solvent. The pore-forming agent is soluble salts such as sodium carbonate and sodium chloride. The mixtures are laid in parallel in the grooves of the heating furnace to a thickness of 2-3mm and heated to 100℃-180℃ to allow the organic solvents to evaporate.

[0047] S2. High-temperature sintering: Baking is carried out in an oxygen-free environment at a high temperature of 350℃-500℃ to burn off the polymer resin. After heating to 600℃-650℃, the mixture is cooled to form a capillary plate with multiple pores in the grooves.

[0048] S3, Dissolving and creating pores: Place the capillary plate obtained in S2 into the solvent and dissolve for 3-5 minutes. After taking it out, dry it at a low temperature of 60℃-70℃.

[0049] S4. Cutting and garment making: Use a cutting machine with a blade spacing of 2-4mm to cut the capillary plate and divide it into several capillary segments with a length of 15-18cm. The copper powder side is the water absorption core, and the copper alloy powder side is the water supply core. At the same time, a waterproof membrane is wrapped around the surface of the capillary.

[0050] It should be noted that the thickness, cutting width, and length of the composite capillary core should be adjusted according to the actual machine model requirements. Specific Implementation Example 1

[0052] A1. Heat transfer: When the CPU chip is working, it generates heat, which is transferred upwards through several heat sinks and grooves on the heat sinks. After contacting the cooling components, the local temperature decreases.

[0053] A2. Swinging heat dissipation: The temperature of the heat sink and cooling components is measured by a temperature controller. The temperature is 30℃ and the motor rotation frequency is 9r / s.

[0054] A3 Cooling Circulation: The water-absorbing core with a smaller average aperture draws liquid from one side of the water storage tank into the cooling pipe, while the water-supply core with a larger average aperture supplies liquid to both sides, forming a unidirectional conduction; the two adjacent cooling pipes form a counter-conduction, sequentially exchanging liquid between the two water storage tanks. At the same time, the A2 swing will cause the liquid in the two water storage tanks to slosh, accelerating the heat exchange with the outside.

[0055] A3, the temperature measured after 10 seconds was 25.7℃. Specific Implementation Example 2

[0057] A1. Heat transfer: When the CPU chip is working, it generates heat, which is transferred upwards through several heat sinks and grooves on the heat sinks. After contacting the cooling components, the local temperature decreases.

[0058] A2. Swinging heat dissipation: The temperature of the heat sink and cooling components is measured by a temperature controller. The temperature is 45℃ and the motor rotation frequency is 15r / s.

[0059] A3 Cooling Circulation: The water-absorbing core with a smaller average aperture draws liquid from one side of the water storage tank into the cooling pipe, while the water-supply core with a larger average aperture supplies liquid to both sides, forming a unidirectional conduction; the two adjacent cooling pipes form a counter-conduction, sequentially exchanging liquid between the two water storage tanks. At the same time, the A2 swing will cause the liquid in the two water storage tanks to slosh, accelerating the heat exchange with the outside.

[0060] A3, the temperature measured after 10 seconds was 41.2℃.

[0061] Comparative Example 1

[0062] A1. Heat transfer: When the CPU chip is working, it generates heat, which is transferred upwards through several heat sinks and grooves on the heat sinks.

[0063] A2. Fan cooling: The temperature of the heat sink is measured by a temperature controller. The temperature is 45℃ and the fan speed is 31r / s.

[0064] A3, the temperature measured after 10 seconds was 42.3℃.

[0065] It should be noted that the coolers used in the comparison are standard models, such as Deepcool IceBreaker, ASUS K8P1 X-Mars, ASUS Star Ice, or other commonly used air coolers.

[0066] The experimental results show that, within the same time frame, the cooling effect of Examples 1 and 2 is better than that of the comparative example. The lower rotation speed results in less power consumption and greater energy saving. At the same time, as heat dissipation proceeds, the temperature of the coolant will rise slightly. Therefore, the cooling effect of Example 2 is slightly worse than that of Example 1.

[0067] Meanwhile, the noise levels of Example 1, Example 2, and Comparative Example 1 were measured to be 15dB, 19dB, and 26dB, respectively. This indicates that Example 2 and Comparative Example 1 generated less noise under the same conditions. Furthermore, as heat dissipation proceeds, the generated noise gradually increases, but it remains lower than the noise generated by a pure fan.

[0068] In use, this invention increases the contact area between the heat sink and the air by creating grooves on the surface of several heat sinks. Combined with a motor and crank-connecting rod mechanism, it creates a back-and-forth oscillation, converting mechanical energy into the potential and kinetic energy of the air, thus forming forced convection. The heat sink will collide and come into contact with different air in the gaps between adjacent heat sinks multiple times, improving the heat exchange efficiency between the heat sink and the air. At the same time, the oscillation will refresh the air in the gaps between the heat sinks. Hot air moves upward, and new cold air fills the bottom, exchanging heat with the heat sink again, thus forming heat transfer and heat dissipation in the vertical direction.

[0069] Cooling components are installed at the top of several heat sinks. Based on the characteristic that the capillary force of the capillary wick increases as the average pore size decreases, two capillary wicks with different pore sizes are installed in the cooling tubes to improve the unidirectional conduction capability of a single cooling tube to the liquid in the two water storage tanks. The cooler liquid in the water storage tank exchanges heat with the heat sink and is then conducted to the other water storage tank for further heat exchange with the outside. At the same time, the cooling tubes are arranged in reverse so that the liquid exchange takes place in a U-shaped / S-shaped trajectory, which increases the frequency of liquid exchange. The water in the water storage tank is not full, so that it has room to move when it swings with the heat sink. Heat is conducted to the water storage tank shell through the liquid and air respectively, and then conducted to the outside, forming heat transfer and dissipation in the horizontal direction.

[0070] Multiple heat dissipation methods are adopted, and the motor speed is increased or decreased according to different temperature gradients. In the initial stage of power-on, the CPU can be cooled by water cooling and its own heat sink. After the temperature rises, the heat sink assembly moves synchronously when swinging, and the friction noise generated with the air is small. At the same time, the device of this invention does not generate wind pressure on the CPU surface and circumference, so it will not allow dust to accumulate on the CPU and adhere to the inside, thereby affecting the CPU's function.

[0071] Based on the preferred embodiments of the present invention described above, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A heat dissipation device suitable for CPU chips, comprising: The fixed base and the heat dissipation component rotatably connected to the fixed base are characterized in that, The fixed base is a rectangular frame with several rotating shafts arranged horizontally along the rectangular frame and several mounting holes arranged circumferentially. A fixing plate is vertically installed on one side of the rectangular frame, and a drive motor is installed on the fixing plate and a through hole is opened there. The heat dissipation component includes: a plurality of parallel heat dissipation fins and a cooling component rotatably connected to the top ends of the plurality of heat dissipation fins. The heat dissipation fins are provided with a plurality of grooves. The cooling component includes a plurality of cooling pipes, and the two ends of the plurality of cooling pipes are respectively connected to a water storage tank. A plurality of the heat sinks are rotatably connected to a movable plate on the side near the drive motor, and the movable plate is connected to the output shaft of the drive motor via a crank-connecting rod mechanism, the crank-connecting rod mechanism passing through the through hole; The heat sink is provided with a rotating tube at both the top and bottom, which is rotatably connected to the cooling tube and the rotating shaft, respectively. The liquid content in the water storage tank accounts for 70%-80% of the total volume of the water storage tank, and the liquid is one of deionized water, methanol, ethanol or propanol; The cooling pipe has a composite structure, including a water-absorbing core and a water-supplying core, and the water-absorbing core and the water-supplying core of adjacent cooling pipes are arranged in reverse order; The heat sink and the cooling component are respectively connected to the temperature controller; The heat sink and the grooves on the heat sink are used to transfer the heat generated by the CPU chip to the cooling component and to exchange heat through the cooling component. The temperature controller is used to measure the temperature of the heat sink and the cooling component, and to control the drive motor to rotate at a speed corresponding to the temperature gradient according to different temperature gradients. The host will activate an alarm when the temperature reaches the warning value. The average pore size of the water-absorbing core is smaller than that of the water-supplying core. The water-absorbing core is used to absorb liquid from one side of the water storage tank into the cooling pipe, and the water-supplying core is used to supply liquid to the other side of the water storage tank, so that a single cooling pipe forms a unidirectional conduction; two adjacent cooling pipes form a counter-conducting conduction due to the inverted arrangement of the water-absorbing core and the water-supplying core, so that liquid exchange occurs between the two water storage tanks; The drive motor drives several heat sinks to swing through the crank-connecting rod mechanism and the moving plate, causing the liquid in the two water storage tanks to sway with the swing of the heat sinks, thereby accelerating the heat exchange between the liquid and the outside environment.

2. The heat dissipation device suitable for CPU chips according to claim 1, characterized in that: The heat sink is made of aluminum alloy, brass, or bronze, and the rotating tube at the connection with the cooling pipe is made of UPVC or galvanized steel pipe.

3. A heat dissipation device suitable for CPU chips according to claim 1, characterized in that, The method for preparing the cooling pipe includes the following steps: S1. Raw material mixing: Different metal powders of different particle sizes are mixed with colloids separately and then laid side by side in the groove of the heating furnace and heated until the organic solvent evaporates. S2. High-temperature sintering: High-temperature baking is carried out in an oxygen-free environment to burn off the polymer resin. After continuous heating, cooling is performed to allow the metal powder to form a capillary plate with multiple pores in the groove. S3, Dissolving and creating pores: Dissolve the capillary plate obtained in S2 in a solvent, remove it and dry it at low temperature; S4. Cutting and preparation: Use a cutting machine to cut the capillary plate into several segments of capillary tubes, with one side being the water absorption core and the other side being the water supply core. At the same time, a waterproof membrane is wrapped around the surface of the capillary tubes.

4. A heat dissipation device suitable for CPU chips according to claim 3, characterized in that: The colloid comprises a polymer resin, a pore-forming agent, and an alcoholic organic solvent, wherein the pore-forming agent comprises soluble salts such as sodium carbonate and sodium chloride.

5. A heat dissipation device suitable for CPU chips according to claim 1, characterized in that: The arrangement of the water-absorbing core and the water-supplying core ensures that the liquid exchange trajectory between the two water storage tanks is either a U-shape or an S-shape.

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