Novel heat pipe construction

Abstract

A heat pipe of the type having a condenser section in which a gaseous refrigerant is condensed to produce a liquid refrigerant, the heat pipe comprising: (a) at least one enclosed tube comprising: (i) a condenser section; (ii) a first evaporator section in fluid communication with the condenser section; and (iii) at least a second evaporator section in fluid communication with the condenser section; (b) a refrigerant contained within the heat pipe; (c) at least a first liquid flow path directing a first portion of the liquid refrigerant condensed in the condenser section to the first evaporator section; and (d) at least a second liquid flow path directing a second portion of the liquid refrigerant condensed in the condenser section to the second evaporator section, wherein the second evaporator section comprises a reservoir containing liquid refrigerant at a location different from the first evaporator section.

Description

[0001] Cross-references

[0002] This application claims priority to PCT / CN2020 / 121546, filed on October 16, 2020, the entire text of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to a novel heat dissipation pipe structure, and more particularly to a method and system utilizing the heat dissipation pipe structure. Background Technology

[0004] As used herein, the term "heat pipe" refers to a heat transfer device comprising a liquid heat transfer fluid in an evaporation section and a vapor-like working fluid in a condensation section, which uses the driving force of evaporation to move the vapor-like fluid from the evaporation section to the condensation section and uses little or no energy input to move the liquid working fluid back to the evaporation section.

[0005] exist Figure A The image depicts one of the most common types of heat pipes, often referred to as gravity-return heat pipes or thermosiphon heat pipes. This type of heat pipe relies at least partially on gravity to return the liquid working fluid from the condensation section to the evaporation section. For example... Figure A As shown, in a typical configuration, the heat dissipation tube is a vertically arranged sealed container, with an evaporation section located in the lower part of the tube and a condensation section located in the upper part. The evaporation section contains a working fluid in liquid form that absorbs heat from the article, body, or fluid to be cooled and thus boils to form vapor. The boiling of the working fluid in the evaporation section creates a pressure differential and drives the vapor into the condensation section. The vaporized working fluid in the condensation section releases heat to a selected heat sink (e.g., ambient air) and is thereby condensed to form a liquid working fluid at or near the inner surface of the heat dissipation tube. This liquid then returns to the evaporation section under gravity and merges with the liquid working fluid contained in the evaporation section.

[0006] As described above, boiling increases the mass of steam in the evaporation section, and a pressure difference is generated due to the decrease in the mass of steam in the condensation section. This pressure difference drives the steam from the boiling section to the condensation section, thereby generating a continuous heat transfer cycle that does not require energy input (other than the heat absorbed during the cooling operation) to transport the working fluid from the evaporation section to the condensation section.

[0007] In some applications, it is desirable to arrange heat pipes horizontally or at an angle. When heat pipes are arranged completely horizontally, they are often referred to as capillary return heat pipes or wicking heat pipes, examples of which are shown in... Figure B As shown in the image.

[0008] exist Figure B In the arrangement shown, heat is absorbed into the evaporation section (e.g., Figure B In the liquid working fluid (shown on the left), this causes the liquid to boil, as described above, providing a pressure difference to move the vapor to the condensation section. However, instead of relying solely on gravity to return the condensed liquid working fluid, a wicking structure is provided near the container wall, which uses capillary action to return the condensed working fluid flow from the condensation section to the evaporation section. Although Figure B The capillary return heat pipes in the diagram are shown in a vertical position; however, it should be understood that capillary return heat pipes can be oriented in virtually any orientation depending on the needs and specific geometry and capillary force required for a given application. Therefore, as used herein, the term "capillary return" heat pipe includes a heat pipe with capillary return force, regardless of its orientation.

[0009] Other heat pipe constructions that use little or no additional energy to return the working fluid condensate to the evaporation section include electrohydrodynamic heat pipes (which use electric power), electroosmotic heat pipes, magnetohydrodynamic heat pipes (which use magnetic force), permeation heat pipes, and oscillating heat pipes.

[0010] Heat pipes are highly efficient heat conductors due to their extremely high heat transfer coefficients for boiling and condensation. They are therefore used in many applications, particularly for cooling electronic devices. One important application of heat pipe cooling is the removal of heat from multiple components mounted on a printed circuit board (PCB), including, for example, microchips. For illustrative purposes, a vertically mounted PCB C1 with three components C2, C3, and C4 to be cooled is shown. Components C2, C3, and C4 generate heat during operation and require heat removal from them via a gravity-return heat pipe C5, which is installed in thermal communication with each of components C2, C3, and C4. Due to limitations associated with existing heat pipes, it has been common practice to date to design PCBs such that the heat-generating components are located on the PCB to ensure they are adjacent to the lower part of the heat pipe, as this is where the liquid phase of the working fluid will be primarily present. Furthermore, according to current practice, it is not possible to significantly increase the size of the evaporator section without sacrificing the size and performance of the condenser section, which is also crucial for overall heat pipe performance.

[0011] The applicant also recognizes that improvements in PCB cooling performance, and even the process of designing PCB layouts, can be significantly improved by utilizing the novel heat pipe construction disclosed herein. Furthermore, the novel heat pipe construction of this invention can be advantageously used for cooling many types of devices and systems beyond PCBs and electronic systems. Summary of the Invention

[0012] This invention provides a heat dissipation pipe of the type having a condenser section in which gaseous refrigerant condenses to produce liquid refrigerant, the heat dissipation pipe comprising:

[0013] (a) At least one closed tube, the closed tube comprising:

[0014] (i) Condenser section;

[0015] (ii) a first evaporator section, which is in fluid communication with the condenser section; and

[0016] (iii) at least a second evaporator section, which is in fluid communication with the condenser section;

[0017] (b) A refrigerant contained in the heat dissipation pipe;

[0018] (c) At least a first liquid flow path that guides a first portion of the liquid refrigerant condensed in the condenser section to the first evaporator section;

[0019] and

[0020] (d) At least a second liquid flow path that guides a second portion of the liquid refrigerant condensed in the condenser section to the second evaporator section, wherein the second evaporator section includes a reservoir for containing the liquid refrigerant at a location different from that of the first evaporator section.

[0021] For convenience, the heat pipe referred to in this paragraph will be called heat pipe 1 in this document.

[0022] This invention provides a heat dissipation pipe of the type having a condenser section in which gaseous refrigerant condenses to produce liquid refrigerant, the heat dissipation pipe comprising:

[0023] (a) At least one closed tube, the closed tube comprising:

[0024] (i) Condenser section;

[0025] (ii) a first evaporator section, which is in fluid communication with the condenser section; and

[0026] (iii) at least a second evaporator section, which is in fluid communication with the condenser section;

[0027] (b) A refrigerant contained in the heat dissipation tube, wherein the heat dissipation tube is configured to at least partially utilize gravity to return liquid refrigerant from the condenser section to the first evaporator section and the second evaporator section;

[0028] (c) at least a first liquid flow path that guides a first portion of the liquid refrigerant condensed in the condenser section to the first evaporator section; and

[0029] (d) At least a second liquid flow path that guides a second portion of the liquid refrigerant condensed in the condenser section to the second evaporator section, wherein: (i) the second liquid flow path includes one or more obstructions oriented at an angle relative to the vertical direction and deflecting at least a portion of the liquid refrigerant from the condenser section toward the second evaporator; and wherein the second evaporator section includes a reservoir for receiving the liquid refrigerant at a location different from that of the first evaporator section.

[0030] For convenience, the heat pipe referred to in this paragraph will be called heat pipe 2 in this document.

[0031] This invention provides a heat dissipation pipe of the type having a condenser section in which gaseous refrigerant condenses to produce liquid refrigerant, the heat dissipation pipe comprising:

[0032] (a) At least one closed tube, the closed tube comprising:

[0033] (i) A condenser section that at least partially utilizes gravity to return liquid refrigerant from the condenser section to the evaporator section;

[0034] (ii) A first evaporator section, which is in fluid communication with the condenser section;

[0035] (iii) a second evaporator section, which is in fluid communication with the condenser section and is located between the first evaporator section and the condenser section; and

[0036] (iv) at least a third evaporator section, which is in fluid communication with the condenser section and is located between the first evaporator section and the condenser section;

[0037] (b) A refrigerant contained in the heat dissipation tube, wherein the heat dissipation tube is configured to at least partially utilize gravity to return liquid refrigerant from the condenser section to each of the first evaporator section, the second evaporator section, and the third evaporator section;

[0038] (c) At least a first liquid flow path that guides a first portion of the liquid refrigerant condensed in the condenser section to the first evaporator section;

[0039] (d) At least a second liquid flow path that guides a second portion of the liquid refrigerant condensed in the condenser section to the second evaporator section, wherein: (i) the second liquid flow path includes one or more obstructions oriented at an angle relative to the vertical direction and deflecting at least a portion of the liquid refrigerant from the condenser section toward the second evaporator; and wherein the second evaporator section includes a reservoir for receiving the liquid refrigerant at a location different from that of the first evaporator section; and

[0040] (e) at least a third liquid flow path that guides a third portion of the liquid refrigerant condensed in the condenser section to the third evaporator section, wherein: (i) the third liquid flow path includes one or more obstructions oriented at an angle relative to the vertical direction and deflecting at least a portion of the liquid refrigerant from the condenser section toward the third evaporator; and wherein the third evaporator section includes a reservoir for receiving liquid refrigerant at a location different from that of the first evaporator section and different from that of the second evaporator section. For convenience, the heat pipe according to this paragraph is referred to herein as heat pipe 3.

[0041] This invention provides a heat dissipation pipe of the type having a condenser section in which gaseous refrigerant condenses to produce liquid refrigerant, the heat dissipation pipe comprising:

[0042] (a) At least one closed tube, the closed tube comprising:

[0043] (i) Condenser section;

[0044] (ii) a first evaporator section, which is in fluid communication with the condenser section; and

[0045] (iii) at least a second evaporator section, which is in fluid communication with the condenser section;

[0046] (b) A refrigerant contained in the heat dissipation pipe;

[0047] (c) at least a first liquid flow path that guides a first portion of the liquid refrigerant condensed in the condenser section to the first evaporator section; and

[0048] (d) At least a second liquid flow path that guides a second portion of the liquid refrigerant condensed in the condenser section to the second evaporator section, wherein the second evaporator section includes a reservoir for containing the liquid refrigerant at a location different from the first evaporator section, wherein the second evaporator section has a total volume of about 70% or less, or about 60% or less, or about 50% or less, or about 40% or less of the volume of the first evaporator section.

[0049] For convenience, the heat pipe referred to in this paragraph will be called heat pipe 4 in this document.

[0050] This invention provides a printed circuit board (PCB) comprising:

[0051] (a) At least a first heating element, which is mounted to the PCB at a first location;

[0052] (b) at least a second heating element, which is mounted to the PCB at a second location different from the first location; and

[0053] (c) At least one heat dissipation pipe, the at least one heat dissipation pipe comprising a closed pipe, the closed pipe comprising:

[0054] (i) A condenser section that is in thermal communication with a cooling fluid located outside the heat dissipation pipe;

[0055] (ii) A first evaporator section, the first evaporator section including a first reservoir containing a liquid refrigerant in heat transfer contact with the first heating element;

[0056] (iii) A first liquid flow path that guides a first portion of the liquid refrigerant condensed in the condenser section to the reservoir in the first evaporator section;

[0057] (iii) at least a second evaporator section, the at least second evaporator section including a second reservoir located along the heat dissipation pipe at a position different from the first reservoir and containing a second portion of liquid refrigerant in heat transfer contact with the at least second heating element; and

[0058] (iv) at least a second liquid flow path that guides the second portion of the liquid refrigerant condensed in the condenser section to the reservoir in the second evaporator section.

[0059] For convenience, the PCB described in this paragraph is referred to as PCB 1 in this document.

[0060] This invention provides a printed circuit board (PCB) comprising:

[0061] (a) At least a first heating element, which is mounted to the PCB at a first location;

[0062] (b) at least a second heating element, which is mounted to the PCB at a second location different from the first location; and

[0063] (c) A heat dissipation pipe, comprising a closed tube, the closed tube comprising:

[0064] (i) A condenser section that is in thermal communication with a cooling fluid located outside the heat dissipation pipe, and in which gaseous refrigerant is condensed into liquid refrigerant;

[0065] (ii) A first evaporator section, the first evaporator section including a first reservoir containing liquid refrigerant in heat transfer contact with the first heating element, wherein gravity provides at least a portion of the force that causes liquid refrigerant condensed in the condenser section to return to the first evaporator section.

[0066] (iii) At least a first liquid flow path that guides a first portion of the liquid refrigerant condensed in the condenser section to the reservoir in the first evaporator section;

[0067] (iii) at least a second evaporator section, the at least second evaporator section including a second reservoir located along the heat dissipation pipe at a position different from the first reservoir and containing a second portion of liquid refrigerant in heat transfer contact with the at least second heating element, wherein gravity provides at least a portion of the force that returns the liquid refrigerant condensed in the condenser section to the second evaporator section; and

[0068] (iv) at least a second liquid flow path that guides the second portion of the liquid refrigerant condensed in the condenser section to the reservoir in the second evaporator section.

[0069] For convenience, the PCB referred to in this document is referred to as PCB 2.

[0070] This invention provides a printed circuit board (PCB) comprising:

[0071] (a) At least a first heating element, which is mounted to the PCB at a first location;

[0072] (b) A second heating element, which is mounted to the PCB at a second position above the first position;

[0073] (c) at least a third heating element, which is mounted to the PCB at a third position above the first position; and

[0074] (d) A heat dissipation pipe, comprising a closed tube, the closed tube comprising:

[0075] (i) A condenser section that is in thermal communication with a cooling fluid located outside the heat dissipation pipe, and in which gaseous refrigerant is condensed into liquid refrigerant;

[0076] (ii) A first evaporator section located below the condenser section and including a first reservoir containing liquid refrigerant in heat transfer contact with the first heating element, wherein gravity provides at least a portion of the force that causes the liquid refrigerant condensed in the condenser section to return to the first evaporator section.

[0077] (iii) At least a first liquid flow path that guides a first portion of the liquid refrigerant condensed in the condenser section to the reservoir in the first evaporator section;

[0078] (iii) A second evaporator section comprising a second reservoir located above the first reservoir along the heat dissipation pipe and containing a second portion of liquid refrigerant in heat transfer contact with the second heating element, wherein gravity provides at least a portion of the force that causes the liquid refrigerant condensed in the condenser section to return to the second evaporator section.

[0079] (iv) at least a second liquid flow path that guides the second portion of the liquid refrigerant condensed in the condenser section to the reservoir in the second evaporator section;

[0080] (v) at least a third evaporator section, the at least third evaporator section including a third reservoir located above the first reservoir along the heat dissipation pipe and containing a third portion of liquid refrigerant in heat transfer contact with the third heating element, wherein gravity provides at least a portion of the force that returns the liquid refrigerant condensed in the condenser section to the third evaporator section; and

[0081] (vi) at least a third liquid flow path that guides the third portion of the liquid refrigerant condensed in the condenser section to the reservoir in the third evaporator section.

[0082] For convenience, the PCB described in this paragraph is referred to as PCB 3 in this document.

[0083] This invention provides a printed circuit board (PCB) comprising:

[0084] (a) At least a first heating element, which is mounted to the PCB at a first location;

[0085] (b) at least a second heating element, which is mounted to the PCB at a second location different from the first location; and

[0086] (c) At least one heat dissipation pipe, the at least one heat dissipation pipe comprising a closed pipe, the closed pipe comprising:

[0087] (i) A condenser section that is in thermal communication with a cooling fluid located outside the heat dissipation pipe;

[0088] (ii) A first evaporator section, the first evaporator section including a first reservoir containing a liquid refrigerant in heat transfer contact with the first heating element;

[0089] (iii) A first liquid flow path that guides a first portion of the liquid refrigerant condensed in the condenser section to the reservoir in the first evaporator section;

[0090] (iii) at least a second evaporator section, the at least second evaporator section including a second reservoir located along the heat dissipation pipe at a position different from the first reservoir and containing a second portion of liquid refrigerant in heat transfer contact with the at least second heating element, wherein the second evaporator section has a total volume of about 70% or less, or about 60% or less, or about 50% or less, or about 40% or less of the volume of the first evaporator section; and

[0091] (iv) at least a second liquid flow path that guides the second portion of the liquid refrigerant condensed in the condenser section to the reservoir in the second evaporator section.

[0092] For convenience, the PCB referred to in this paragraph is referred to as such in this document.

[0093] PCB 4.

[0094] This invention provides a method for transferring heat, the method comprising: a heat dissipation pipe having a condenser section in which gaseous refrigerant condenses to produce liquid refrigerant, the method comprising:

[0095] (a) Providing a closed heat pipe, the closed heat pipe comprising:

[0096] (i) A condenser section that is in heat transfer communication with a heat sink located outside the heat sink tube;

[0097] (ii) a first evaporator section, which is in fluid communication with the condenser section and includes a first reservoir for containing liquid refrigerant; and

[0098] (iii) at least a second evaporator section, which is in fluid communication with the condenser section and includes a second reservoir for containing liquid refrigerant;

[0099] (iv) at least a first liquid flow path extending from the condenser section to the first reservoir; and

[0100] (v) at least a second liquid flow path, which extends from the condenser section to the second reservoir;

[0101] (b) Cooling the first component or device by thermal contact with the liquid refrigerant in the first reservoir to generate refrigerant vapor traveling to the condenser section;

[0102] (c) Cooling the second component or device by thermal contact with the liquid refrigerant in the second reservoir to generate refrigerant vapor traveling to the condenser section; and

[0103] (d) The refrigerant vapor is condensed in the condenser section to produce condensed liquid refrigerant, and a first portion of the condensed liquid refrigerant is returned to the first reservoir via the first liquid flow path, and a second portion of the condensed liquid refrigerant is returned to the second reservoir via the second liquid flow path.

[0104] For convenience, the heat transfer method described in this paragraph is referred to herein as heat transfer method 1. This invention provides a method for transferring heat, the method comprising:

[0105] (a) Providing a closed heat pipe, the closed heat pipe comprising:

[0106] (i) A condenser section that is in heat transfer communication with a heat sink located outside the heat sink tube, and in which gaseous refrigerant is condensed into liquid refrigerant;

[0107] (ii) A first evaporator section, which is in fluid communication with the condenser section and includes a first reservoir for containing liquid refrigerant;

[0108] (iii) A second evaporator section, which is in fluid communication with the condenser section and includes a second reservoir for containing liquid refrigerant;

[0109] (v) At least a first liquid flow path that guides at least a portion of the condensed liquid refrigerant from the condenser section to the first reservoir, wherein gravity provides at least a portion of the force that causes the liquid refrigerant condensed in the condenser section to return to the first evaporator section.

[0110] (vi) At least a second liquid flow path that guides at least a portion of the liquid refrigerant from the condenser section to the second reservoir, wherein gravity provides at least a portion of the force that causes the liquid refrigerant condensed in the condenser section to return to the second evaporator section;

[0111] (b) Cooling the first component or device by thermal contact with the liquid refrigerant in the first reservoir to generate refrigerant vapor traveling to the condenser section;

[0112] (c) Cooling at least a second component or device by thermal contact with the liquid refrigerant in the second reservoir to generate refrigerant vapor traveling to the condenser section; and

[0113] (e) The refrigerant vapor is condensed in the condenser section to produce the condensed liquid refrigerant.

[0114] For convenience, the heat transfer method described in this paragraph will be referred to as heat transfer method 2 in this paper.

[0115] This invention provides a method for transferring heat, the method comprising:

[0116] (a) Providing a closed heat pipe, the closed heat pipe comprising:

[0117] (i) A condenser section that is in heat transfer communication with a heat sink located outside the heat sink tube, and in which gaseous refrigerant is condensed into liquid refrigerant;

[0118] (ii) A first evaporator section, which is in fluid communication with the condenser section and includes a first reservoir for containing liquid refrigerant;

[0119] (iii) A second evaporator section, which is in fluid communication with the condenser section and includes a second reservoir for containing liquid refrigerant;

[0120] (iv) at least a third evaporator section, which is in fluid communication with the condenser section and includes a third reservoir for containing liquid refrigerant;

[0121] (v) At least a first liquid flow path that guides at least a portion of the condensed liquid refrigerant from the condenser section to the first reservoir, wherein gravity provides at least a portion of the force that causes the liquid refrigerant condensed in the condenser section to return to the first evaporator section.

[0122] (vi) At least a second liquid flow path that guides at least a portion of the liquid refrigerant from the condenser section to the second reservoir, wherein gravity provides at least a portion of the force that causes the liquid refrigerant condensed in the condenser section to return to the second evaporator section;

[0123] (vii) At least a third liquid flow path that guides liquid refrigerant from the condenser section to the third reservoir, wherein gravity provides at least a portion of the force that returns the liquid refrigerant condensed in the condenser section to the third evaporator section;

[0124] (b) Cooling the first component or device by thermal contact with the liquid refrigerant in the first reservoir to generate refrigerant vapor traveling to the condenser section;

[0125] (c) Cooling at least a second component or device by thermal contact with the liquid refrigerant in the second reservoir to generate refrigerant vapor traveling to the condenser section;

[0126] (d) Cooling at least a third component or device by thermal contact with the liquid refrigerant in the third reservoir to generate refrigerant vapor traveling to the condenser section; and

[0127] (e) The refrigerant vapor is condensed in the condenser section to produce the condensed liquid refrigerant.

[0128] For convenience, the heat transfer method described in this paragraph will be referred to as heat transfer method 3 in this paper.

[0129] This invention provides a method for transferring heat, the method comprising: a heat dissipation pipe having a condenser section in which gaseous refrigerant condenses to produce liquid refrigerant, the method comprising:

[0130] (a) Providing a closed heat pipe, the closed heat pipe comprising:

[0131] (i) A condenser section that is in heat transfer communication with a heat sink located outside the heat sink tube;

[0132] (ii) a first evaporator section, which is in fluid communication with the condenser section and includes a first reservoir for containing liquid refrigerant; and

[0133] (iii) at least a second evaporator section, which is in fluid communication with the condenser section and includes a second reservoir for containing liquid refrigerant, wherein the second evaporator section has a total volume of about 70% or less, or about 60% or less, or about 50% or less, or about 40% or less of the volume of the first evaporator section.

[0134] (iv) at least a first liquid flow path extending from the condenser section to the first reservoir; and

[0135] (v) at least a second liquid flow path, which extends from the condenser section to the second reservoir;

[0136] (b) Cooling the first component or device by thermal contact with the liquid refrigerant in the first reservoir to generate refrigerant vapor traveling to the condenser section;

[0137] (c) Cooling the second component or device by thermal contact with the liquid refrigerant in the second reservoir to generate refrigerant vapor traveling to the condenser section; and

[0138] (d) The refrigerant vapor is condensed in the condenser section to produce condensed liquid refrigerant, and a first portion of the condensed liquid refrigerant is returned to the first reservoir via the first liquid flow path, and a second portion of the condensed liquid refrigerant is returned to the second reservoir via the second liquid flow path.

[0139] For convenience, the heat transfer method described in this paragraph will be referred to as heat transfer method 4 in this paper. Attached Figure Description

[0140] Figure A This is a schematic diagram of the gravity-return-return heat pipe.

[0141] Figure B This is a schematic diagram of a capillary return heat pipe.

[0142] Figure C This is a schematic diagram of a printed circuit board containing three heat-generating components.

[0143] Figure 1This is a schematic diagram of a heat sink according to one embodiment of the present invention.

[0144] Figure 1A This is a schematic diagram of the cross-section of the heat pipe used in Example 1.

[0145] Figure 1B This is a schematic diagram of the cross-section of the heat pipe used in Example 1.

[0146] Figure C1 This is a schematic diagram representing an existing heat pipe.

[0147] Figure C2 This is a schematic diagram of the cross-section of the heat pipe used in Comparative Example 1.

[0148] Figure C3 This is a schematic diagram of the cross-section of the heat pipe used in Comparative Example 2.

[0149] Figure C4 This is a schematic diagram of the cross-section of the heat pipe used in Comparative Example 3.

[0150] Figure 2 This is a schematic diagram of a heat sink according to one embodiment of the present invention.

[0151] Figure 2A This is a schematic diagram of a heat pipe according to one embodiment of the present invention, and its performance is described in Example 2A.

[0152] Figure 2B This is a schematic diagram of a heat pipe according to one embodiment of the present invention, and its performance is described in Example 2B.

[0153] Figures 3A to 3F This is a schematic diagram of a heat dissipation pipe according to an embodiment of the present invention.

[0154] Figure 4 These are photographs of a heat pipe according to an embodiment of the present invention and a heat pipe not covered by the present invention. Detailed Implementation

[0155] The applicant has unexpectedly discovered that the aforementioned needs and advantages, and / or low-cost cooling efficiency and effectiveness, can be achieved by using heat pipes, devices, systems and / or methods as described herein.

[0156] heat pipes

[0157] This invention includes a heat dissipation pipe that provides excellent thermal performance and, in a preferred embodiment, has the ability to efficiently and effectively cool at least two heat sources located at different locations. As an example, refer to this document... Figure 1The diagram schematically illustrates the cross-section of a heat pipe generally designated 10. Although the heat pipe 10 is schematically shown as having a rectangular cross-section, those skilled in the art will understand that a variety of internal and external shapes and sizes consistent with the teachings of the invention can be used, and all such shapes and sizes are within the scope of the invention.

[0158] The heat dissipation pipe 10 preferably includes a receiving area defined by a pipe wall 11, which includes an outer surface 11A and an inner surface 11B. The heat dissipation pipe includes a first evaporator section 12A located at one end and a condenser section 13 located at the other end. It should be understood that although the evaporator section 12A is shown as being located at one end of the heat dissipation pipe and the condenser section is shown as being located at the other end, according to the invention, these sections are not necessarily located at either end of the heat dissipation pipe.

[0159] The heat dissipation pipe 10 includes at least a second evaporator section 12B located between the condenser section and the first evaporator section. Again, those skilled in the art will understand that, although Figure 1 The heat dissipation pipe 10 shown is depicted with substantially straight sidewalls, and thus the evaporator section 12B is positioned above the first evaporator section 12A and below the condenser section 13; however, this arrangement is not mandatory. Figure 1 The illustrated configuration shows that the top of the first evaporator section 12A is indicated by a horizontal line 30 located at approximately 30% by volume of the heat dissipation tube; however, those skilled in the art should understand that this position is for illustrative purposes and not necessarily limiting. Furthermore, line 30 indicates an approximate liquid level in the heat dissipation tube when it is not in operation, referred to herein as the fill level; however, it should be understood that the liquid level may not correspond to this position during operation. During operation, heat is transferred from the first heat source (heater 1) through the tube wall 11 to the liquid refrigerant reservoir in the first evaporator section 12A to generate refrigerant vapor, which... Figure 1 It is shown as refrigerant bubbles 21 and usually flows upward to the condenser section 13.

[0160] In the condenser section 13, the outer surface of the heat dissipation pipe is exposed to a relatively cool temperature of the heat sink (e.g., as...). Figure 1The ambient air (illustrated schematically shown blowing across the top of the heat sink) cools and condenses refrigerant vapor in contact with the inner surface 11B of the heat sink wall 11 in the condenser section 13. A first portion of the condensed refrigerant liquid returns along a first flow path (e.g., generally indicated as path 14A) to a reservoir contained in the first evaporator section 12A. Those skilled in the art will understand that in many heat sink configurations according to the invention, there will be multiple flow paths from the condenser section to the evaporator section 12A, and flow path 14A is shown as only one possible general flow path. Another possible flow path may include the general path indicated as 14B. Thus, while it is contemplated that at least the first portion of the refrigerant liquid may flow through many different flow paths as it returns to the first evaporator section, the first flow path may simply consist of a series of droplets falling from the condenser section 13 to the first evaporator section 12A under the influence of gravity.

[0161] A key and critical aspect of this invention is providing a second flow path, typically designated as item 15, that guides or directs at least a second portion of the refrigerant liquid condensed in condenser section 13 to a reservoir contained in evaporator section 12B. As those skilled in the art will understand, the heat sink may include a number of features to capture a portion of the condensed liquid and guide it from the condenser section to the reservoir. One such feature may include, for example, a series of angled platforms, plates, tiles, or the like 16 located in the general flow path of the liquid refrigerant as it falls from condenser section 13 under the influence of gravity. These platforms or plates are positioned and angled such that such droplets flow toward the inner wall of the heat sink and into the reservoir contained in the second evaporator section 12B. In a preferred embodiment, small gaps are preferably included between adjacent platforms, plates, etc., to allow some of the refrigerant vapor to pass upwards. Additionally, the lower edges of each plate are preferably aligned to overlap with the upper edges of the next flow plate, platform, etc., in the direction of liquid flow. Given the teachings contained herein, those skilled in the art will be able to select both the degree of vertical separation and the degree of vertical overlap to achieve the desired refrigerant flow rate into the reservoir of evaporator section 12B and the desired level of refrigerant vapor flow rate for each individual application. In this way, the desired liquid refrigerant supply is provided at a point midway between the first evaporator section and the condenser section, and in a preferred embodiment, the second evaporator section is located close to the heat source to be cooled (e.g., Figure 1 The heater 2) is positioned in the middle, thus providing superior cooling to this second heat source because it will be cooled by phase change heat transfer of the refrigerant, which is more efficient and effective than the heat transfer from the second heat source that may occur according to the existing heat pipe construction.

[0162] Those skilled in the art will understand that, although Figure 1 Gravity-driven heat sinks have been disclosed, but the present invention can be readily applied to heat sinks having other forces or multiple forces, thereby driving the condensed liquid back in a generally directional direction in the first evaporator section. Therefore, the present invention includes heat sinks having any one or a combination of the above-described liquid refrigerant driving forces, and particularly preferably includes capillary return heat sinks and gravity / capillary return heat sinks.

[0163] Figure 2 A heat dissipation tube 10 is depicted, having a generally honeycomb grid pattern of hexagonal cells to allow refrigerant vapor to flow freely upward from the bottom region of the heat dissipation tube, which typically contains a first evaporator section 12A, to a condenser section 13. The top of the first evaporator section 12A is typically indicated by a horizontal line located at approximately 30% by volume of the heat dissipation tube. In operation, heat is transferred from a heat source (not shown) through the tube wall to a reservoir of liquid refrigerant in the first evaporator section 12A. Refrigerant vapor is generated and flows upward through open vertical and diagonal channels in the heat dissipation tube, i.e., channels not blocked by one or more tiles 16, to the condenser section 13. In the condenser section 13, the outer surface of the heat dissipation tube is exposed to the relatively cool temperature of a heat sink (e.g., ambient air), which cools and condenses the refrigerant vapor in contact with the inner surface of the heat dissipation tube wall in the condenser section 13. A first portion of the condensed liquid refrigerant returns along a first flow path (such as, for example, 14A) to the reservoir contained in the first evaporator section 12A. As described above, upon returning to the first evaporator section 12A, the liquid refrigerant may also flow along alternative and / or additional flow paths, such as flow paths 14B and 14C. Therefore, while it is envisioned that this first portion of the liquid refrigerant may flow through many different flow paths upon its return to the first evaporator section 12A, the first flow path may simply comprise a series of droplets falling from the condenser section 13 under the influence of gravity through one or more open channels (such as, for example, outlets between columns 5 and 6 and between the lower portions of columns 4 and 5) and many other potential channels (including, but not limited to, those represented by flow paths 14B and 14C) into the first evaporator section 12A.

[0164] An important and key aspect of this invention is providing at least a second flow path, in Figure 2This is typically referred to as item 15, and the second flow path guides at least a second portion of the refrigerant liquid condensed in the condenser section 13 to a reservoir 12B' contained in the evaporator section 12B. As those skilled in the art will understand, the heat sink may include a number of structures to capture a portion of the condensed liquid and guide it from the condenser section to the reservoir. One such structure may include, for example, a series of angled platforms, plates, tiles, or the like 16 located in the general flow path through which the liquid refrigerant flows as it falls generally along the flow path 14 under the influence of gravity from the condenser section 13. These platforms or plates are preferably positioned and angled, or configured such that such droplets flow toward the inner wall of the heat sink and into the reservoir 12B' contained in the second evaporator section 12B. In a preferred embodiment, small vertical gaps are included between the platforms or plates to allow some of the refrigerant vapor to pass upwards, and small vertical overlaps are included between adjacent platforms or plates to help guide the liquid refrigerant along the desired flow path into the reservoir of the evaporator section 12B. In this way, the desired liquid refrigerant supply is provided to at least one point between the first evaporator section and the condenser section, and in a preferred embodiment, a second heat source (not shown) may be located near the second evaporator section, thereby providing superior cooling performance to the heat exchange tube of the invention, particularly and preferably when the second heat source is present, as it will cool via phase change heat transfer of the refrigerant, which is more effective and efficient than the heat transfer that may occur according to existing heat exchange tube constructions.

[0165] Therefore, in a preferred aspect of this heat sink (including heat sinks 1-4), the interior of the heat sink includes a honeycomb grid, which is not completely uniform but includes a series of modifications to the grid structure, such as, for example, one or more angled tiles, plates, platforms, or similar barriers formed in the grid structure, which tend to guide at least a portion of the condensed liquid refrigerant along the flow path leading to the second evaporator section. For example, such an exemplary structure is arranged to form a flow path or channel that guides a portion of the condensed liquid refrigerant to the second evaporator section. In particular, Figure 2 The disclosed general honeycomb pattern comprises six (6) columns of hexagonal cells or islands 20 around which liquid typically flows downward, the spaces between the columns of cells allowing for the typical downward flow of liquid and the upward flow of vapor. For example, liquid flowing out from the upper rows 5 and 6 would be able to flow to the bottom of the heat sink and to the first evaporator section. If all the rows and spaces were substantially the same as in an existing heat sink, all the liquid would flow in this manner to the first evaporator section at the bottom of the heat sink. However, according to embodiments of the invention, several rows are constructed into overlapping and angled tiles or plates interrupting the honeycomb structure. For example, in Figure 2Some of the liquid refrigerant flowing downward between columns 4 and 5 will encounter angled tiles or plates in the 9th row of cells, thus turning at least a portion of the liquid refrigerant toward the side of the heat dissipation tube above the first evaporator section toward the location of the second reservoir, so as to maintain a selected amount of liquid refrigerant in heat transfer contact with the inner surface of the heat dissipation tube, preferably adjacent to the second heat source.

[0166] exist Figures 3A to 3E Each of these shows alternative radiator constructions of different shapes and sizes for use in units or islands, steam passages, tiles or platforms, and reservoirs.

[0167] exist Figure 3A In the middle, rows of hexagonal cells 20 are aligned in a manner known as a rectangular grid arrangement, wherein each cell in a row is vertically aligned and each cell in a column is horizontally aligned, and includes a series of angled plates or tiles 16 to guide a portion of the condensed refrigerant fluid to a reservoir in the intermediate evaporator 12B.

[0168] exist Figure 3B In the middle, rows of hexagonal cells 20 are aligned in a manner known as a honeycomb grid arrangement and have a series of angled plates or tiles 16 for guiding a portion of the condensed refrigerant fluid to a reservoir in the intermediate evaporator 12B.

[0169] exist Figure 3C In the intermediate evaporator 12B, a row of circular units 20 with a series of angled plates or tiles 16 are used to guide a portion of the condensed refrigerant fluid to a reservoir.

[0170] exist Figure 3D In the middle, a row of square units 20 with a series of angled plates or tiles 16 are used to guide a portion of the condensed refrigerant fluid to a reservoir in the intermediate evaporator 12B.

[0171] exist Figure 3E In the middle, there are rows of angled and overlapping rectangular units 20 (some of which are combined below). Figure 3F (As explained, the truncated sections) are used to create flow paths that guide the condensed refrigerant fluid to several intermediate reservoirs in the intermediate evaporator section. As can be seen in this embodiment, angled rectangular units provide protrusions, tiles, plates, etc., to provide the necessary intermediate refrigerant flow paths, such as in combination with... Figure 3F A more detailed explanation.

[0172] Figure 3F Provided Figure 3EAn enlarged view of the top portion of the heat sink tubes is shown, with five columns of angled rectangular units 20 labeled from left to right as columns 20A-20E. These columns create flow paths that guide the condensed refrigerant fluid to several intermediate reservoirs in the intermediate evaporator section. As shown, rows 20A and 20E are located on the left and right sides of the heat sink tubes, and each of these rectangular units is partially truncated along its left and right edges, respectively. In operation, most of the refrigerant condensing at the top of the heat sink tubes between rows 20A and 20B, and some refrigerant condensing above rows 20B and 20C, will tend to enter the reservoir of evaporator 12B along flow path 15A. Similarly, most of the refrigerant condensing at the top of the heat sink tubes between rows 20B and 20C, and some refrigerant condensing above rows 20C and 20D, will tend to enter the reservoir of evaporator 12C along flow path 15B. From these descriptions, those skilled in the art will understand that... Figure 3E The structure provides a series of multiple flow paths leading to a series of intermediate evaporation sections 12B-12J.

[0173] Although it is contemplated that the tiles and plates used in the heat pipes of the present invention (including each of the heat pipes 1-4 and the heat pipes included in each of the PCBs 1-4 and the heat transfer methods 1-4) can be angled at a variety of angles, in a preferred embodiment, the tiles have an angle of about 10° to about 70° relative to a plane perpendicular to the generally flowing direction of the refrigerant liquid from the condenser section to the first evaporator section (relative to a horizontal plane in many applications involving gravity return heat pipes).

[0174] The present invention includes tiles and plates used in the heat sinks of the present invention, including each of heat sinks 1-4 and the heat sinks included in each of PCBs 1-3 and heat transfer methods 1-4, these tiles and plates forming an angle of approximately 20° to approximately 50° with respect to a plane perpendicular to the generally flowing direction of the refrigerant liquid from the condenser section to the first evaporator section (relative to a horizontal plane in many applications involving gravity return heat sinks). In a preferred embodiment of heat sink 4, heat transfer method 4, and PCB 4, the second evaporator section does not include any flow path or channel leading to another evaporator section, such as Figure 2B As shown.

[0175] Although it is anticipated that the charge ratio used in the heat pipes of the present invention (including each of the heat pipes 1-4 and the heat pipes included in each of the PCBs 1-4 and the heat transfer methods 1-4) can vary widely, in a preferred embodiment, the charge ratio is from about 20% to about 90% by volume.

[0176] In a preferred embodiment, the charge ratio used in the heat pipes of the present invention (including each of the heat pipes 1-4 and the heat pipes included in each of the PCBs 1-4 and the heat transfer methods 1-4) is in the range of about 20% to about 60% by volume.

[0177] Devices and systems

[0178] The present invention includes devices and systems that require cooling during operation, including each of PCB1 to PCB4.

[0179] The present invention includes a telecommunications device and system, the telecommunications device and system including printed circuit boards, including each of PCB1 to PCB4.

[0180] The present invention includes a telecommunications device and system, the telecommunications device and system including a printed circuit board, including each of PCB1 to PCB4, including a 5G chip.

[0181] The present invention includes a 5G chip cooled by the heat pipes of the present invention, including each of heat pipes 1 to 4.

[0182] The present invention includes a system or apparatus that includes the heat dissipation pipes of the present invention, including each of heat dissipation pipes 1 to 4.

[0183] method

[0184] The present invention includes a method of cooling an apparatus or system or a component of an apparatus or system using the methods of the present invention (including each of heat transfer methods 1 to 4).

[0185] The present invention includes methods for cooling telecommunications devices or systems using the methods of the present invention, including each of heat transfer methods 1 to 4.

[0186] The present invention includes methods for cooling telecommunications devices or systems using the methods of the present invention, including each of heat transfer methods 1 to 4.

[0187] The present invention includes a method for cooling a telecommunications device and system comprising a 5G chip using the methods of the present invention (including each of heat transfer methods 1 to 4).

[0188] The present invention includes a method for cooling at least a portion of a printed circuit board, the method comprising contacting at least a portion of the printed circuit board with a heat pipe of the present invention, the heat pipe comprising each of heat pipe 1 to heat pipe 4.

[0189] The present invention includes a method for cooling at least a portion of a printed circuit board comprising a 5G chip by contacting the 5G chip with a heat pipe comprising each of heat pipe 1 to heat pipe 5.

[0190] Example

[0191] Comparative Examples 1A-1F

[0192] Roughly corresponding to this article Figure C1 The heat sink is formed by two aluminum plates, and a total of three heating bands are used instead of... Figure C1 Two heaters are shown. Each of the three heaters has a power of 13.33 watts to produce a total power of 40 watts. For example, this arrangement simulates the situation if three components to be cooled were vertically arranged at these locations on a printed circuit board. Thermocouples are positioned on the heat sink wall at the following locations, measured vertically from the bottom of the heat sink: 70mm, 150mm, 210mm, 270mm, and 330mm.

[0193] As shown in Table C1 below, six different heat pipe loading ratios were tested using the heat pipe construction described in the examples.

[0194] like Figure C2 As shown, the cross-section of the heat sink reveals that the channel between the two aluminum plates has a substantially uniform honeycomb structure, and therefore, during operation, the working fluid R-1233zd(E) contained in the reservoir of the evaporation section is heated, evaporated, and flows generally upward through the heat sink to the condenser section. When the working fluid is condensed in the condenser section, it flows only generally downward back to the evaporator section containing the liquid working fluid. The heat sink was operated at room temperature of approximately 23.7°C, and the temperatures measured at equilibrium are recorded in Table C1 below:

[0195] Table C1

[0196]

[0197] As can be seen from the data reported in Table C1, the charge ratio that produces the lowest average temperature during operation is 60% (Example C1C), and the charge ratio that produces the minimum temperature difference is 80% (Example C1B).

[0198] Examples 1A-1F

[0199] A heat dissipation tube is formed having the same overall dimensions as described in Comparative Example 1, as well as the same heater and thermocouple, except that the cross-section of the heat dissipation tube is approximately as described in the combined... Figure 1 As described, and specifically as follows Figure 1AAs shown in Table 1 below, six different heat pipe loading ratios were tested using the heat pipe construction described in the examples.

[0200] like Figure 1A As shown, the cross-section of the heat dissipation pipe reveals a honeycomb structure in the channel between the two aluminum plates. This honeycomb structure captures a portion of the condensed liquid and guides it from the condenser section to the reservoir in each of the evaporator sections 12B-12E. As the refrigerant condenses in the condenser section, a portion of the condensed working fluid flows downwards to each of the evaporator sections 12B-12E.

[0201] The heatsink was operated at a room temperature of approximately 23.7°C, and the temperatures measured at equilibrium, along with the results from Comparative Example 1, are recorded in Table 1 below:

[0202] Table 1

[0203]

[0204] The vertical positions at 70mm, 150mm, 210mm, 270mm and 330mm are designated as positions 1-5 in the table.

[0205] As can be seen from the results reported in Table 1 above, the construction according to the embodiments described in the present invention produces a lower average temperature and a smaller temperature difference for each charge ratio tested. Furthermore, the best performance of existing heat sinks occurs at charge ratios of 80% (measured by average temperature) and 60% (measured by temperature difference). In contrast, the best performance of the heat sink of the present invention occurs at much lower charge ratios, i.e., 50% for both the lowest average temperature and the lowest temperature difference. Therefore, this embodiment illustrates that the heat sink of the present invention provides at least three important advantages: (1) a lower average temperature, which is a measure of cooling efficiency; (2) a smaller temperature difference, which helps avoid unwanted extreme temperatures in the heat sink, thereby improving operability and equipment life; and (3) better performance achieved by reducing the cost of the working fluid through a lower charge ratio.

[0206] Comparative Example 2

[0207] Roughly corresponding to this article Figure C1 The heat sink is formed by two aluminum plates, and uses a total of five heating bands instead of... Figure C1 The two heaters shown.

[0208] The heat pipe is approximately 935mm from bottom to top, and the five heating bands are approximately... Figure C3The positioning is shown. Each heater has a power of 11 watts to generate a total power of 55 watts to the heat pipe. Thermocouples are placed on the heat pipe wall at the following locations, measured vertically from the bottom of the heat pipe: 100 mm, 460 mm, 600 mm, 740 mm, and 880 mm. For example, this arrangement simulates the situation if five components to be cooled were vertically arranged at these locations on a printed circuit board. The charge ratio of the working fluid R1233zd(E) is set to approximately 90%, assuming that the heat input will be present along substantially the entire length of the heat pipe. This level is approximately indicated by line 12A when all heaters are turned off.

[0209] like Figure C3 As shown, the cross-section of the heat sink reveals that the channel between the two aluminum plates has a substantially uniform honeycomb structure, and therefore, during operation, the working fluid R-1233zd(E) contained in the reservoir of the evaporation section is heated, evaporated, and flows generally upward through the heat sink to the condenser section. When the working fluid is condensed in the condenser section, it flows only generally downward back to the evaporator section containing the liquid working fluid. The heat sink was operated at room temperature of approximately 26.6°C, and the temperatures measured at equilibrium are recorded in Table C2 below:

[0210] Table C2

[0211] 880 49.2 740 49.8 600 50.2 460 51.3 100 47.4

[0212] This embodiment shows that the temperature of the heat pipe at the 100mm position is 47.4°C, the difference between the 100mm and 460mm positions is 3.9°C, and this is the maximum measured temperature difference when operating the heat pipe.

[0213] Example 2

[0214] A heat dissipation tube is formed having the same overall dimensions as described in Comparative Example 2, as well as the same heater and thermocouple, the difference being that the cross-section of the heat dissipation tube is approximately as described in the combined... Figure 1 As described, and specifically as follows Figure 1B As shown. Because of the more efficient and effective construction of the heat pipe of the present invention, a charge ratio of 40% was used in the test, which is less than half of the charge ratio used in Comparative Example 2. Figure 1B As shown, the structure between the two aluminum plates captures a portion of the condensate and guides it from the condenser section to the reservoir in each of the evaporator sections 12B-12E. When the refrigerant condenses in the condenser section, a portion of the condensed working fluid flows downwards to each of the evaporator sections 12B-12E.

[0215] The heatsink was operated at a room temperature of approximately 26.6°C, and the temperatures measured at equilibrium are shown in Table 2 below, together with the results from Comparative Example 2:

[0216] Table 2

[0217]

[0218]

[0219] As can be seen from the results reported in Table 2 above, the construction according to the invention produces a cooler temperature at each location along the heat sink, indicating that for the same conditions, the heat sink according to the invention provides more cooling, even if the charge ratio is less than half that used in Comparative Example 2. Furthermore, compared to the existing heat sink construction, the temperature difference between certain sections of the heat sink is lower. For example, the temperature increases by only 3.1°C from the 100mm position to the 460mm position, while in the existing heat sink construction, the temperature increases by 3.9°C, indicating a superior level of cooling efficiency between those locations. This embodiment exhibits the same advantages as Embodiment 1 described above.

[0220] Comparative Example 3A

[0221] Roughly corresponding to this article Figure C1 And specifically corresponds to Figure C4 The heat sink is formed by two aluminum plates of the same size and two heat sources that generate heat, wherein heater 1 is located on one side adjacent to the lower half of the heat sink and heater 2 is located on the same side but along the upper half of the heat sink.

[0222] Individual thermocouples are installed at each of seven locations on the heatsink wall, spaced approximately evenly from bottom to top. The working fluid in the heatsink is R1233zd(E), and the amount of R1233zd(E) required to provide optimal performance in the heatsink is determined to be 63.1 grams.

[0223] Additionally, a 1mm aluminum plate was tested under the same operating conditions as those used for heat pipes. The results of these two tests are provided below:

[0224]

[0225] Examples 2A and 2B

[0226] Two heat dissipation tubes are formed having the same overall dimensions as described in Comparative Example 3, as well as the same heater and thermocouple, the difference being that the cross-section of the heat dissipation tubes is approximately as described in the combined... Figure 1 As described, and specifically as follows Figure 2A and 2BAs shown. In particular, according to the present invention, Figure 2A The heat pipe shown has nine (9) evaporator sections and associated flow path channels, as shown in the figure. Figure 2B The heat pipes have a basic structure as Figure 2A The upper section of the heat dissipation pipe, that is, Figure 2A and Figure 2B The top five (5) evaporator sections and associated flow channels of each heat dissipation tube in the heat dissipation tubes are substantially the same in size and construction, as shown in the figure. However, Figure 2A The bottom four (4) flow paths of the heat pipe are based on Figure 2B The heat dissipation pipes are replaced by a single evaporator section. Importantly, the dimensions of this single lower evaporator section are designed to be smaller than [the required size]. Figure 2A The total volume of the four lower evaporator sections of the heat dissipation pipe is half of the total volume. Figure 2A and 2B The optimized material and performance of the heat pipes, as well as the results of the replication of Comparative Example 3, are recorded in the table below:

[0227]

[0228] As can be seen from the above results, Figure 2A The heat pipe performed best, with the lowest average temperature difference at 33.4℃, and the lowest maximum temperature rise was only 5.4℃. Compared to a 1mm aluminum plate and... Figure C4 Compared to the heatsink shown as comparative example C3, this performance is unexpectedly superior. Furthermore, Figure 2B The performance of the heat pipes was also unexpectedly better than Figure C4 The heat pipes exhibit an average temperature difference of 34°C and a maximum temperature difference of 8°C; both values ​​are unexpectedly superior to... Figure C4 The heat pipes. Furthermore, although according to Figure 2B The implementation scheme of the indicated type has inferior performance in terms of temperature difference measurement. Figure 2A That's good, but the performance is still surprisingly good, especially when compared to all the heat pipes in the table above. Figure 2B The optimal loading time for the implementation plan is actually less. Figure 2B The heat pipes of the present invention of the type shown have the ability to achieve excellent heat transfer performance at a relatively low cost, due to the low charge required to achieve such excellent heat transfer performance.

Claims

1. A heat dissipation pipe of the type having a condenser section, in which gaseous refrigerant condenses to produce liquid refrigerant, the heat dissipation pipe comprising: (a) At least one closed tube, said closed tube comprising: (i) Condenser section; (ii) a first evaporator section, which is in fluid communication with the condenser section; and (iii) At least a second evaporator section, the at least second evaporator section being in fluid communication with the condenser section; (b) A refrigerant, wherein the refrigerant is contained in the closed tube; (c) at least a first liquid flow path that guides a first portion of the liquid refrigerant condensed in the condenser section to the first evaporator section; and (d) At least a second liquid flow path that guides a second portion of the liquid refrigerant condensed in the condenser section to the second evaporator section, wherein the second evaporator section includes a reservoir for containing the liquid refrigerant at a location different from that of the first evaporator section. The heat dissipation pipes are configured to at least partially utilize gravity to return liquid refrigerant from the condenser section to the first evaporator section and the second evaporator section. The second liquid flow path includes multiple obstacles located within the heat dissipation pipe, oriented at an angle relative to the vertical direction, and diverting at least a portion of the liquid refrigerant from the condenser section toward the second evaporator section. The lower edges of the barriers are aligned to overlap with the upper edges of adjacent barriers in the direction of liquid refrigerant flow toward the second evaporator section, but adjacent barriers are separated by gaps to allow refrigerant vapor to pass upward.

2. The heat dissipation pipe according to claim 1, further comprising at least a third liquid flow path, the at least third liquid flow path guiding a third portion of the liquid refrigerant condensed in the condenser section to a third evaporator section, wherein: (i) The third liquid flow path includes one or more obstacles that are oriented at an angle relative to the vertical direction and deflect at least a portion of the liquid refrigerant from the condenser section toward the third evaporator; (ii) The third evaporator section includes a reservoir for containing liquid refrigerant at a location different from that of the first evaporator section and different from that of the second evaporator section.

3. The heat dissipation pipe according to claim 2, wherein at least one of the second evaporator section and / or the third evaporator section has a total volume that is 0.7 times or less than the volume of the first evaporator section.

4. The heat dissipation pipe according to claim 1, wherein the refrigerant exists in the gas phase in the condenser section and the refrigerant condenses into a liquid refrigerant in the condenser section.

5. The heat dissipation pipe according to claim 1, wherein the first evaporator section includes a first reservoir for containing liquid refrigerant.

6. The heat dissipation tube according to any of the preceding claims, wherein the liquid refrigerant is substantially composed of R-1233zd(E).

7. A printed circuit board, the printed circuit board comprising: (a) At least a first heating element, said at least a first heating element being mounted to the printed circuit board at a first location; (b) At least a second heating element, said at least a second heating element being mounted to the printed circuit board at a second location different from the first location; and (c) At least one heat pipe as defined in any one of claims 1-5.

8. The printed circuit board according to claim 7, wherein the liquid refrigerant in the heat sink is substantially composed of R-1233zd(E).

9. A telecommunications device comprising a printed circuit board according to claim 7, wherein at least one of the first heating element or the second heating element is a 5G chip on the printed circuit board.

Images