Water treatment system

Abstract

The present invention relates to water treatment systems. A UV reactor for disinfecting water and including a UV source printed circuit board assembly transfers heat to a heat sink in the form of a water-facing thermal coupler. The UV source printed circuit board assembly can include a metal clad printed circuit board having a thermal contact area in thermal communication with the heat sink.

Description

Technical Field

[0001] This invention relates to water treatment systems, and more particularly to point-of-use water treatment systems for residential or commercial applications. Background Technology

[0002] Traditional water treatment systems are typically used to treat water for human consumption. These systems can be configured to remove pathogens, chemical contaminants, and turbidity from the water. Many traditional treatment methods can be broadly categorized as solids separation using physical and / or chemical processes, or sterilization using heat, radiation, or chemical additives. For example, traditional water treatment systems typically include carbon filtration, carbon-free filtration, distillation, ozone treatment, reverse osmosis, ion exchange units, chlorination units, aeration units, advanced oxidation process units, coagulation units, sedimentation units, or ultraviolet radiation units.

[0003] Traditional point-of-use water treatment systems are designed for use at a single water outlet, such as a sink or water dispenser. Traditional point-of-use water treatment systems connect to a pressurized water source to treat the water as it is dispensed. In some applications, the water treatment system is located on a countertop near the sink. In countertop applications, the water treatment system is often connected to the end of the faucet so that water leaving the faucet passes through the water treatment system before being dispensed.

[0004] In some traditional point-of-use water treatment systems, ultraviolet (UV) energy is used for basic disinfection of fluids. Exposure to UV light is thought to harmfully alter the genetic material (DNA) in cells, thereby reducing the population of potentially pathogenic microorganisms such as bacteria, viruses, molds, and algae. Typically, water flows through UV lamps in a UV disinfection system, exposing the microorganisms in the water to a dose of UV energy sufficient to essentially kill them. Typical water disinfection systems and equipment emit UV light at approximately 254 nm, which is believed to penetrate the outer cell membrane of microorganisms, pass through the cell body, reach the DNA, and alter the microorganisms' genetic material.

[0005] In some cases, the ultraviolet light-emitting diodes (UV-LEDs) provided in conventional ultraviolet disinfection systems generate heat during operation. This heat can sometimes be detrimental to the lifespan of the UV-LEDs. To dissipate this heat, conventional ultraviolet disinfection systems utilize convection cooling in conjunction with the surrounding air. Metal heat sinks can be provided to facilitate heat transfer to the surrounding air. These types of cooling systems can be ineffective, especially in enclosed spaces with very low airflow, such as when the system is installed in a cabinet under a sink.

[0006] Traditional UV reactors used in water treatment systems rely on inefficient heat transfer configurations. For example, conventional UV reactors utilize standard FR4 printed circuit board assemblies and heat sinks mounted in one of two ways: 1) the heat sink can be mounted directly onto the component being cooled. Sometimes this involves mechanical support connections to the board or chassis and thermal connections to the component, both of which increase costs; 2) if the component itself does not allow for direct heat sink mounting, additional pads can be placed near the component where the heat sink can be soldered to the outer layer of the printed circuit board. Summary of the Invention

[0007] A UV reactor for water disinfection is provided. In summary, an innovative aspect of the subject matter described herein can be embodied in an ultraviolet (UV) reactor for irradiating a water stream with UV radiation. The UV reactor may include a treatment assembly comprising an inlet and an outlet, wherein the treatment assembly is operable to direct water received through the inlet toward a point of use downstream of the outlet. The UV reactor may include a printed circuit board (PCB) comprising a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate. The first substrate may include a first surface having circuit regions.

[0008] In one embodiment, the UV reactor may include a UV light-emitting diode (UV-LED) operatively connected to the PCB, wherein the UV-LED may be oriented to direct UV energy into the processing component.

[0009] The thermal contact area of ​​the thermally conductive substrate can be exposed such that the thermal contact area is free of the dielectric and the first substrate, wherein the thermal contact area is in thermal communication with the water flowing through the UV reactor.

[0010] The above and other embodiments may optionally include one or a combination of the following features. In particular, one embodiment may include all of the following features in combination.

[0011] In some embodiments, the UV reactor may include a thermally conductive material having a fluid contact surface arranged to define at least a portion of a fluid path for water flowing through the UV reactor. The thermally conductive material may be thermally bonded to the thermal contact area of ​​the thermally conductive substrate to facilitate thermal communication between the water flowing through the UV reactor and the thermal contact area.

[0012] In some embodiments, the thermal contact area can be thermally connected to the water flowing through the UV reactor via the thermally conductive material.

[0013] In some embodiments, a thermally conductive intermediate material may be provided between the thermal contact area and the thermally conductive material to promote thermal connectivity between the water flowing through the UV reactor and the thermal contact area.

[0014] In some embodiments, the fluid contact surface of the thermally conductive material may be located downstream of the processing assembly.

[0015] In some embodiments, the treatment assembly may include a water treatment chamber having a first end and a second end, the water treatment chamber having a longitudinal axis extending between the first end and the second end. The water treatment chamber may include a chamber inlet in fluid communication with the inlet to receive water to be purified, and a plurality of chamber outlets including a longitudinal axis operable to guide water substantially non-parallel to the water treatment chamber.

[0016] The UV-LED can be configured to provide UV energy to the water treatment chamber, wherein the UV energy can be directed substantially parallel to the longitudinal axis of the water treatment chamber.

[0017] The cooling chamber is in fluid communication with the plurality of chamber outlets of the water treatment chamber. The cooling chamber is in thermal communication with the UV-LED to facilitate the transfer of heat from the UV-LED to the water in fluid communication with the outlet. The cooling chamber is operable to direct water to the outlet.

[0018] In some embodiments, the fluid contact surface defines at least a portion of the fluid path of the cooling chamber.

[0019] In some embodiments, the UV reactor may include a reactor body having a reactor body inlet and a reactor body outlet. The UV reactor may include a top cover disposed on the reactor body outlet and include the cooling chamber and the UV-LED.

[0020] The top cover may include a UV transmission window configured to facilitate a watertight seal between the UV-LED and the water treatment chamber. The UV transmission window may include a water chamber side and a UV source side, and may be positioned to facilitate the transmission of UV light from the UV-LED to the water treatment chamber.

[0021] The top cover may include an inner support surface operable to support the water chamber side of the UV transmission window in place relative to the UV-LED.

[0022] The top cover may include a plurality of outlet channels, each outlet channel forming at least a portion of each of the plurality of chamber outlets.

[0023] The cooling chamber may be configured to be in direct fluid communication with each of the plurality of chamber outlets. The cooling chamber may be defined at least by an outlet collection trough, the UV transmission window, and the thermally conductive material.

[0024] In some embodiments, the cooling chamber may at least partially surround the reactor body outlet.

[0025] In some implementations, the PCB may be a metal-clad printed circuit board.

[0026] In some embodiments, the UV-LED may be disposed on a first surface of the first substrate.

[0027] In some embodiments, a solder mask may be disposed on a first surface of the first substrate.

[0028] In some embodiments, the upper and lower surfaces of the thermally conductive substrate may be completely free of solder masks.

[0029] In some embodiments, the thermally conductive substrate may include an upper surface defining the thermal contact area.

[0030] In some embodiments, the extension of the thermally conductive substrate may extend from the main surface of the thermally conductive substrate, and the dielectric is disposed on the main surface. The extension may include the upper surface. The plane of the first substrate may intersect with the extension.

[0031] In some embodiments, the first substrate and the dielectric may define a first edge. The thermally conductive substrate may be disposed adjacent to the first edge and extend from both sides of the first edge, such that the thermal contact area is disposed near one side of the first edge, and the thermally conductive substrate is bonded to the dielectric near the other side of the first edge.

[0032] In summary, one innovative aspect of the subject matter described herein can be embodied in a water treatment system for treating water. The water treatment system may include a treatment component inlet and a treatment component outlet, wherein the treatment component inlet is operable to receive water and the treatment component outlet is operable to discharge water from the water treatment system.

[0033] The water treatment system may include a printed circuit board (PCB) comprising a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate. The first substrate may include a first surface having circuit regions. Thermal contact regions of the thermally conductive substrate may be exposed such that the thermal contact regions are free of the dielectric material and the first substrate. A UV source may be operatively connected to the circuit regions of the printed circuit board, wherein the UV source may be configured to provide UV energy for disinfecting the water.

[0034] The water treatment system may include a UV reactor configured to promote water disinfection by applying UV energy to water flowing through the UV reactor. The UV reactor may include an inlet operatively coupled to the inlet of the treatment assembly to receive water, and an outlet for discharging water from the UV reactor. The UV reactor may include a water treatment chamber having a first end and a second end, the water treatment chamber having a longitudinal axis extending between the first end and the second end, wherein the water treatment chamber may include a chamber inlet in fluid communication with the inlet to receive water to be purified. The water treatment chamber may include a plurality of chamber outlets operable to guide water substantially non-parallel to the longitudinal axis of the water treatment chamber, wherein the UV source is arranged to provide UV energy to the water treatment chamber in a direction substantially parallel to the longitudinal axis. The UV reactor may include a cooling chamber in fluid communication with the plurality of chamber outlets of the water treatment chamber, wherein the cooling chamber may be in thermal communication with the thermal contact area of ​​the thermally conductive substrate to facilitate the transfer of heat energy from the UV source to the water in fluid communication with the outlet. The cooling chamber is operable to guide water to the outlet.

[0035] The above and other embodiments may each optionally include one or a combination of the following features. In particular, one embodiment may include all of the following features in combination.

[0036] In some embodiments, the water treatment system may include a thermally conductive material having a fluid contact surface arranged to define at least a portion of a fluid path for water flowing through the water treatment system. The thermally conductive material may be thermally bonded to the thermal contact area of ​​the thermally conductive substrate to facilitate thermal communication between the water flowing through the water treatment system and the thermal contact area.

[0037] In some embodiments, the thermal contact area can be thermally connected to the water flowing through the water treatment system via the thermally conductive material.

[0038] In some embodiments, a thermally conductive intermediate material may be provided between the thermal contact area and the thermally conductive material to promote thermal connectivity between the water flowing through the UV reactor and the thermal contact area.

[0039] In some embodiments, the fluid contact surface of the thermally conductive material may be located downstream of the water treatment chamber.

[0040] In some embodiments, the water treatment system may include a reactor body having a reactor body inlet and a reactor body outlet. The water treatment system may include a top cover disposed on the reactor body outlet and include the cooling chamber and the UV source.

[0041] The top cover may include a UV transmission window configured to facilitate a watertight seal between the UV source and the water treatment chamber. The UV transmission window may include a water chamber side and a UV source side. The UV transmission window may be positioned to facilitate the transmission of UV light from the UV source to the water treatment chamber. The top cover may include an inner support surface operable to support the water chamber side of the UV transmission window in place relative to the UV source. The top cover may include a plurality of outlet channels, each outlet channel forming at least a portion of each of the plurality of chamber outlets.

[0042] The cooling chamber may be configured to be in direct fluid communication with each of the plurality of chamber outlets, wherein the cooling chamber may be defined at least by an outlet collection trough, the UV transmission window, and the thermally conductive material.

[0043] In some embodiments, the cooling chamber may at least partially surround the reactor body outlet.

[0044] In some implementations, the PCB may be a metal-clad printed circuit board.

[0045] In some embodiments, the UV source may be disposed on the first surface of the first substrate.

[0046] In some embodiments, a solder mask may be disposed on a first surface of the first substrate.

[0047] In some embodiments, the upper and lower surfaces of the thermally conductive substrate may be completely free of solder masks.

[0048] In some embodiments, the thermally conductive substrate may include an upper surface defining the thermal contact area.

[0049] In some embodiments, the thermally conductive substrate may include a lower surface defining the thermal contact area. The thermal contact area may be thermally coupled to a heat sink, such as the heat sink described herein or an alternative configuration, including heat sinks with different geometries relative to one or more heat sinks depicted in the illustrated embodiments (e.g., a stainless steel heat sink contacting the lower surface of the thermally conductive substrate or contacting both the upper and lower surfaces of the thermally conductive substrate).

[0050] In some embodiments, the extension of the thermally conductive substrate may extend from the main surface of the thermally conductive substrate, and the dielectric is disposed on the main surface. The extension may include the upper surface. The plane of the first substrate may intersect with the extension.

[0051] In some embodiments, the first substrate and the dielectric may define a first edge, wherein the thermally conductive substrate may be disposed adjacent to the first edge and extend from both sides of the first edge, such that the thermal contact area is disposed near one side of the first edge, and the thermally conductive substrate is bonded to the dielectric near the other side of the first edge.

[0052] In summary, one innovative aspect of the subject matter described herein can be embodied in a method for disinfecting water. The method may include providing a treatment assembly comprising an inlet and an outlet, and guiding water from the inlet through the treatment assembly to the outlet and towards a point of use downstream of the outlet. The method may include providing a UV source connected to a circuit area of ​​a printed circuit board (PCB), wherein the PCB includes a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate, and the first substrate may include a first surface having the circuit area. A thermal contact area of ​​the thermally conductive substrate may be exposed such that the thermal contact area is free of the dielectric material and the first substrate. The method may include conducting heat from the UV source to the thermal contact area of ​​the PCB, and conducting heat from the thermal contact area of ​​the PCB to water flowing towards the outlet.

[0053] The above and other embodiments may each optionally include one or a combination of the following features. In particular, one embodiment may include all of the following features in combination.

[0054] In some implementations, the PCB may be a metal-clad printed circuit board.

[0055] In some embodiments, the method may include supplying UV energy from the UV source to water flowing through the treatment component.

[0056] Before explaining the embodiments of the present invention in detail, it should be understood that the present invention is not limited to the operational details or the details of the construction and arrangement of components set forth in the following description or shown in the accompanying drawings. The present invention may be practiced or performed in various other embodiments and may be practiced or performed in alternative ways not explicitly disclosed herein. Furthermore, it should be understood that the wording and terminology used herein are for descriptive purposes and should not be considered limiting. The use of “comprising” and “including” and variations thereof is intended to cover the items listed thereafter and their equivalents, as well as additional items and their equivalents. In addition, enumeration may be used in the description of various embodiments. Unless otherwise expressly stated, the use of enumeration should not be construed as limiting the present invention to any particular order or number of components. The use of enumeration should also not be construed as excluding from the scope of the present invention any additional steps or components that may be combined with or incorporated into the enumerated steps or components. Attached Figure Description

[0057] Figure 1 A printed circuit board assembly and a heat sink according to one embodiment are shown.

[0058] Figure 2 A printed circuit board assembly and a heat sink according to another embodiment are shown.

[0059] Figure 3 A printed circuit board assembly and a heat sink according to yet another embodiment are shown.

[0060] Figure 4 A perspective view of a water treatment system according to one embodiment is shown.

[0061] Figure 5 It shows Figure 1 An exploded view of the water treatment system.

[0062] Figure 6 It shows Figure 1 An exploded view of the water treatment system.

[0063] Figure 7 A perspective view of a UV reactor according to one embodiment is shown.

[0064] Figure 8 It shows Figure 1 A side view of the UV reactor.

[0065] Figure 9 It shows Figure 1 Another side view of the UV reactor.

[0066] Figure 10 It shows Figure 1 Partial exploded view of the UV reactor.

[0067] Figure 11 It shows Figure 1 Exploded view of the UV reactor.

[0068] Figure 12 It shows Figure 1 Cross-sectional view of the UV reactor.

[0069] Figure 13 It shows Figure 1 Cross-sectional view of the UV reactor.

[0070] Figure 14 It shows Figure 1 Cross-sectional view of the UV reactor.

[0071] Figure 15 It shows Figure 14 An enlarged view of the mid-section.

[0072] Figure 16 A printed circuit board assembly according to one embodiment of the present invention is shown. Detailed Implementation

[0073] A UV reactor is provided for disinfecting water, and includes a UV source printed circuit board assembly configured to transfer heat to a heat sink in the form of a water-facing thermal coupling. The UV source printed circuit board assembly may include a metal-clad printed circuit board having a thermally contacted area in thermal communication with the heat sink.

[0074] In one embodiment, a connection may be provided between a metal-clad PCB or a similar board with a thermally conductive inner layer and components mounted on the metal-clad PCB. These components may generate heat, which the metal-clad PCB may conduct to a heat-reducing material (e.g., air or water) through one or more intermediate materials or layers.

[0075] In a traditional FR4 PCB, the core is made of glass fiber, which is non-conductive and not a good thermal conductor. Therefore, most of the heat transfer is provided in the outer (one or more) thin copper layers. Consequently, to remove heat from an FR4 PCB, a heatsink is typically thermally bonded to the outer copper layer of the board.

[0076] Compared to a conventional FR4 PCB, one embodiment of the present invention may include a metal-clad PCB comprising three conductive layers: top and bottom copper layers and a core layer (e.g., a copper or aluminum core). For a metal-clad PCB, a core can be provided because the core provides significantly greater thermal conductivity than the top and bottom layers to a location where, in one embodiment, the thermal pads of a component (e.g., an LED) can be directly soldered to the core layer instead of to the top or bottom layers. To enhance heat transfer to a heatsink mounted on the board, the heatsink may also be directly coupled to the core layer.

[0077] In one implementation, components can be soldered to an outer layer (e.g., the top or bottom layer) of a metal-clad PCB. This arrangement may provide one or more additional, potentially insulating layers between the heatsink and the main heat carrier. While soldering components to the top or bottom layer of a metal-clad PCB may be less efficient for heat transfer than implementations where components are directly soldered to the core layer, in either case, the heat conduction efficiency is significantly greater than that of a conventional FR4 PCB arrangement.

[0078] A metal-clad PCB according to one embodiment may include a board having a solder mask in which a core layer is absent, the board including a portion of a core layer exposed according to one or more embodiments described herein. An external conductive layer may or may not include a solder mask. The external conductive layer may be thermally bonded to the core layer via a dielectric layer having high thermal conductivity. The core layer may be a primary heat-carrying layer, such that additional layers (e.g., the external conductive layer and the dielectric) besides the solder mask can be considered more insulating rather than promoting heat transfer.

[0079] In one implementation, the metal-clad PCB can be configured to remove (or not place, depending on the manufacturing process) an additional layer, which would otherwise be located between the heatsink and the core layer (e.g., a copper core layer).

[0080] In one implementation, the core layer of a metal-clad PCB can be assigned to a common power grid for all electrical components intended for active cooling via heat sinks. This power grid can be a grounded grid; however, the core layer can be assigned to other grids or a floating grid that is not electrically connected. Components intended for heat transfer can then be directly soldered to the core. Heat sinks can be connected to the same core via mechanical contact, thermal bonding, soldering, or other methods.

[0081] In one embodiment, the LED provided as a UV source may include a thermal pad that can be attached to the core layer. A heat sink may be mechanically (metal-to-metal contact) or thermally bonded to the core layer.

[0082] In an alternative implementation, the LED may not have thermal pads; instead, heat transfer may be achieved using specific pins, pads, or meshes connected to the die. In this case, the die layer may be connected to those specific pins, pads, or meshes.

[0083] In one embodiment, if the heat sink is not connected to the mesh used as a thermal connection for the component, the dielectric layer of the metal cladding plate can remain in place, and the heat flux can flow from the mesh to the outer conductive layer and through the dielectric layer to the core layer.

[0084] In one embodiment, the cooled component and the heatsink connection can be located on the same side of the metal-clad PCB. Alternatively, the component and the heatsink can be located on opposite sides of a double-sided PCB, the PCB stack comprising two dielectric layers, two copper layers, and a silkscreen layer between the component thermal pads and the heatsink. In one embodiment, mounting the heatsink to either side of the component or the opposite side of the core layer does not result in additional heat flux loss by eliminating all layers except the core layer between the component and the heatsink.

[0085] I. Water Treatment System Overview

[0086] A water treatment system 100 according to an embodiment of the present invention... Figures 4-6 The water treatment system 100, as shown in the diagram and generally designated 100, includes a treatment assembly 130 and a base assembly 110. The water treatment system 100 may include a removable cover (not shown) configured to intersect with the base assembly 110 to conceal one or more or all aspects of the treatment assembly 130. In one embodiment, the removable cover may conceal the treatment assembly 130 to provide an aesthetic function for the water treatment system 100, allowing it to be positioned on a countertop or visible during everyday use.

[0087] Removable covers can provide a detachable, aesthetically pleasing housing structure that allows for updates or changes to the shape, material, and color of the water treatment system 100. For example, in one application, a removable cover can be replaced with another removable cover having one or more different aspects related to its shape, material, or color, or a combination thereof.

[0088] In one embodiment, the water treatment system 100 may include UV disinfection capability. The water treatment system 100 may include a UV disinfection component or UV reactor 200 as described herein that provides such UV disinfection capability. In one embodiment, the UV reactor 200 may include a long-life / permanent LED reactor component mounted in a suitable location within the base assembly 110.

[0089] Figures 4-6In the illustrated embodiment, the processing component 130 can be removed from the base assembly 110 to facilitate the storage or placement of the water treatment system 100 for operation in a space that restricts access to one or more sides or portions of the water treatment system 100 (e.g., upper 102, rear 103, side 104, or base 105, or combinations thereof). As an example, the space between the upper 102 and another object (e.g., an upper cabinet) can be small enough to restrict access to the upper 102 or vertical displacement of one or more components of the water treatment system 100 (e.g., processing component 130). In one embodiment, the water treatment system 100 can be considered to have a “flat” aspect ratio that preserves available workspace when mounted on a countertop and substantially minimizes intrusion into storage space when arranged under a countertop.

[0090] Example water treatment structures are described in more detail in U.S. Application No. 62 / 839,145 entitled "WATER TREATMENT SYSTEM" filed April 26, 2019 by Lautzenheiser et al. and U.S. Application No. 16 / 857,253 entitled "WATER TREATMENT SYSTEM" filed April 24, 2020 by Lautzenheiser et al.—the disclosures of the aforementioned applications are incorporated herein by reference in their entirety.

[0091] In one embodiment, the removable cover can engage and disengage from the base assembly 110 in a direction substantially parallel to the surface on which the base assembly 110 is arranged. Thus, when the water treatment system 100 is located in a space-constrained position, as described herein, that restricts access to one or more sides or portions of the water treatment system 100, the removable cover can facilitate access to the treatment assembly 130.

[0092] The water treatment system 100 is operable to receive untreated water from a water source, such as a cold water service line configured to supply water under pressure, via an inlet pipe 112. The water treatment system 100 is also operable to treat the untreated water received from the water source and deliver the treated water to an outlet pipe 114, which can be connected to a faucet to deliver the treated water to a point of use. In one embodiment, water connections for the inlet pipe (or inlet line) and outlet pipe (or outlet line) are accommodated or disposed in a space beneath the unit accessible to the installer. The connections provide rotational capability to align system components during installation.

[0093] The treatment assembly 130 may include an inlet operable to receive water from the inlet pipe 112 through the base assembly inlet passage. The inlet of the treatment assembly 130 may include a one-way valve or check valve coupled thereto (e.g., arranged to correspond with the inlet of the treatment container 134) to substantially prevent leakage of residual water from the treatment assembly 130 during transport to a service location (e.g., typically a water collection container or more commonly a kitchen sink).

[0094] The processing assembly 130 may include a closure assembly 132 having a handle assembly 136 operable to secure the processing assembly 130 to a bag portion provided by the base assembly 110. Operation of the handle assembly 136 from a disengaged position to an engaged position can create a watertight connection between the base assembly 110 and the processing assembly 130, making them resistant to water-tight bonding tendencies.

[0095] In the illustrated embodiment, the primary filter (also described as a pre-filter) of the treatment assembly 130 can provide filtration for particles in untreated water received through the inlet of the treatment assembly. Water flowing through the primary filter can be connected to a downstream filter, such as a filter assembly, which can be operated to further treat the water that has passed through the primary filter. In one embodiment, the primary filter can be configured to provide filtration for particles that, if not removed upstream of the filter assembly, could significantly reduce the lifespan of the filter assembly. For example, the filter assembly can be configured to filter particles considered fine or small for the target flow rate, and the primary filter can be configured to filter particles considered larger (e.g., 30-500 micrometers) at the target flow rate. Without a primary filter, such larger particles could clog or reduce the effective filtration and lifespan of the filter assembly.

[0096] The filter media of the filter assembly may include a carbon block filter, which is operable to adsorb or filter (or both) particulate matter and contaminants contained in the water, such that the water discharged from the filter media is considered to be filtered and ready for disinfection downstream through the UV reactor 200.

[0097] As described herein, a base assembly 110 according to one embodiment includes an upper portion 102, a rear portion 103, a side portion 104, and a base 105. The base assembly 110 is operable to be removably coupled to a treatment assembly 130, for example, by facilitating the formation of a watertight seal between a water supply connection and a treatment assembly connection, and between the treatment assembly outlet and the treatment assembly connection of the base assembly 110. In one embodiment, the base assembly 110 may include a body providing a detachable structure for retaining and connecting the treatment assembly 130.

[0098] The base assembly 110 in the illustrated embodiment includes a cover 310 that can be removed from the frame assembly 313 to expose internal components 312 of the base assembly 110, including, for example, a sensor unit 316 (e.g., a flow sensor) and a control system 318. The frame assembly 313 can provide the structural core of the water treatment system 100, providing a platform for locating a modular set of components and facilitating the treatment of one or more aspects of the water consumed. This configuration allows for the continuous evolution of the water treatment system 100 (e.g., changing components of the water treatment system, such as a display or control unit) while maintaining a substantially similar form factor. Therefore, the water treatment system 100 can be updated to remain up-to-date in the future.

[0099] The base assembly 110 may include a display unit 314 having a display 315, which can provide visual feedback to the user regarding the operation of the water treatment system 100. In the illustrated embodiment, the cover 310 conceals the display 315 and the display unit 314. Alternatively, the display 315 and the cover 310 may be configured such that the display 315 is partially or completely concealed by the cover 310.

[0100] Lens 311 can be optically connected between display 315 and the external area of ​​water treatment system 100 to enable optical communication between display 315 and the external area.

[0101] The base assembly 110 may include a base or base 105 operable to stabilize the base assembly 110 on a horizontal surface (e.g., a countertop) or inside a cabinet. The base 105 may be configured with a peripheral edge that contacts the horizontal surface while supporting the frame assembly 313 in a spaced-apart relationship relative to the horizontal surface, such that the frame assembly 313 can remain spaced above water or other elements present on the horizontal surface. The base 105 may include one or more access points operable to receive an inlet pipe 112 and an outlet pipe 114 for connection to a supply inlet 334 and a treated outlet, respectively.

[0102] The control system 318 in the illustrated embodiment may include circuitry configured to guide the operation of the water treatment system 100, including circuitry to guide the display unit 314 to provide visual feedback to the user, and circuitry to receive sensor information obtained from the sensor unit 316. As described herein, the control system 318 may also be operated to guide the operation of the UV reactor 200 to disinfect water discharged from the treatment assembly 130 and discharge treated water to the treated outlet 360. Water discharged from the UV reactor 200 may flow through the sensor unit 316 to reach the treated outlet 360, which is in fluid communication with the outlet pipe 114.

[0103] In the illustrated embodiment, the internal components of the base assembly 110 mounted on the frame assembly 313, such as the wet assembly and electrical unit assembly, can be covered by a rear cover assembly (e.g., cover 310) that can provide an aesthetic look and feel, potentially protect the internal components, and accommodate a light-conducting structure that provides system health indication as an extension of the display unit 314.

[0104] The base 105 (e.g., the base base portion) can be fixed to the unit body assembly to provide aesthetically pleasing piping management and a stable, structured, or protective housing to assist in the desired positioning.

[0105] As discussed herein, the internal components of the base assembly 110 may include a display unit 314, a control system 318, a sensor unit 316, and a UV reactor 200. In the illustrated embodiment, the UV reactor 200 includes a UV reactor inlet 232 configured in fluid communication with a treated water outlet 360 to receive water discharged from the treatment assembly 130. The UV reactor 200 is operable to supply UV energy to the water received through the UV reactor inlet 232, thereby disinfecting the water. The disinfected water may be discharged or output through the UV reactor outlet 230, which is in fluid communication with the inlet 385 of the sensor unit 316.

[0106] In the illustrated embodiment, these components include an RFID communicator or wireless communication circuit 390, which is capable of wirelessly communicating with one or more components external to the base assembly 110. As an example, the wireless communication circuit 390 may communicate with an RFID component (e.g., an RFID tag) disposed within the filter assembly.

[0107] In one embodiment, the wireless communication circuit 390 may include an RFID antenna attached to the frame assembly 313 near the processing assembly 130 and connected to the control system 318 (or main electronics) via a detachable cable.

[0108] The electrical and control systems are not limited to the system described in the illustrated embodiment of the water treatment system 100; it should be understood that the electrical and control systems may be updated, replaced or substituted independently of other system components with other technical systems as defined.

[0109] The water passage components of the base assembly 110 (e.g., sensor unit 316 and UV reactor 200) can be arranged and secured to the frame assembly 313. Sensor unit 316 can monitor and measure water flow. Additionally or alternatively, sensor unit 316 can measure water temperature.

[0110] In one embodiment, after a connection has been established between the wireless communication circuitry 390, the display unit 314, and any sensors (e.g., sensor unit 316) and the control system 318, the control system 318 can be directly inserted into or connected to the UV reactor 200. The connection to the UV reactor 200 can be formed via a connection panel on the underside of the control system 318. This connection panel also provides connectors for the wireless communication circuitry 390, the display unit 314, and any sensors. The connection panel located on the underside of the control system 318 facilitates concealment of the connections from any angle, thereby enhancing the overall aesthetics of the assembly and substantially shielding the electronic connections from any accidental water splashes.

[0111] II. UV reactor

[0112] A UV reactor according to one embodiment of the present invention, such as Figure 7-15 As shown, and generally designated as 200. The UV reactor 200 of the illustrated embodiment includes a UV reactor inlet 232 and a UV reactor outlet 230. The UV reactor 200 may include one or more of the following components:

[0113] • Reactor body 201;

[0114] • An end cap 202 having at least one outlet in fluid communication with the UV reactor outlet 230;

[0115] • UV transmission window 205;

[0116] • Water-facing thermal coupling 406;

[0117] • A first seal 210 is arranged at least between the water-facing thermal coupling 406 and the end cap 202 to substantially prevent leakage across the sealing interface between the water-facing thermal coupling 406 and the end cap 202.

[0118] • A second seal 203 is arranged between the water-facing thermal coupling 406 and the UV transmission window 205 to substantially prevent leakage across the sealing interface between the second seal 203 and the UV transmission window 205.

[0119] • A UV source assembly 400 having one or more UV sources 402 as described herein;

[0120] • Support cover 209, which is arranged to intersect with end cover 202 and operable to hold the UV source assembly 400, the first seal 210 and the second seal 203, the UV transmission window 205, and the water-facing thermal coupling 406 in place.

[0121] • Reactor body support 211, operable to hold reactor body 201 to facilitate the formation of water treatment chamber 245;

[0122] • Flow element 216, which can be arranged within water treatment chamber 245 to influence water flow according to application (e.g., to generate laminar flow); and

[0123] • Fastener 214, operable to interface with support cover 209, end cover 202 and reactor body support 211 to maintain a watertight seal within water treatment chamber 245 from UV reactor inlet 232 to UV reactor outlet 230.

[0124] In the illustrated embodiment, the reactor body support 211 and end cap 202 are joined together in a substantially permanent, sealed manner. As an example, the reactor body support 211 and end cap 202 may be screw-welded together to form a seal 204. This type of connection between the reactor body support 211 and end cap 202 can provide a sealed connection without the need for a removable seal—although such a removable seal could be incorporated into alternative embodiments of the UV reactor 200.

[0125] The UV reactor 200 can be configured such that water enters a UV reactor inlet 232, at least partially defined by a reactor body support 211. The UV reactor inlet 232 may include a hose barb connection 233 (e.g., by spin welding) coupled to the reactor body support 211 to define at least a portion of the UV reactor inlet 232, thereby facilitating water entry into the UV reactor 200 and through a water treatment chamber 245. Water may flow through one or more flow paths provided by flow elements 216 before entering the water treatment chamber 245. Water may exit the UV reactor 200 through a UV reactor outlet 230, which may include a hose barb connection 237 (e.g., by spin welding) coupled to an end cap 202 to define at least a portion of the UV reactor outlet 230.

[0126] In the illustrated embodiment, the UV reactor inlet 232 and UV reactor outlet 230 are configured to guide water in a direction transverse to the longitudinal axis 240 of the UV reactor 200. This configuration reduces the vertical profile of the UV reactor 200.

[0127] The water treatment chamber 245 may include an inner surface 290 of the reactor body 201 that generally extends from a first end 291 to a second end 292 of the water treatment chamber 245, and has a longitudinal axis 240 extending between the first end 291 and the second end 292. The inner surface 290 of the water treatment chamber 245 may not define the entire inner surface of the water treatment chamber. For example, one or more portions of the end cap 202, the reactor body support 211, and the flow element 216 may define one or more portions of the inner surface of the water treatment chamber 245.

[0128] The reactor body 201 may include a first opening and a second opening, respectively, near a first end 291 and a second end 292 of the water treatment chamber 245. For example, the reactor body 201 may be configured as a hollow cylinder, with the first end and the second end corresponding to the bottom and top of the reactor body 201, respectively. Figures 12-14 As shown. However, the reactor body 201 can be any type of cylinder and is not limited to the cylindrical structure depicted in the illustrated embodiment. For example, the cross-sectional shape of the reactor body 201 may vary depending on the application, such as being a hexagonal cylinder or an octagonal cylinder. As another example, the reactor body 201 may include more than one longitudinal axis, such that the reactor body 201 includes multiple segments having non-collinear longitudinal axes.

[0129] The reactor body 201 can be constructed from one or more materials depending on the application. For example, the reactor body 201 may include a first material and a second material arranged concentrically, such as a first material forming a sleeve around a second inner material, the surface of which is in contact with water as water flows through the water treatment chamber 245. As another example, the reactor body 201 may be formed entirely of a UV-reflective material (e.g., PTFE or ePTFE). The reflection of UV light within the water treatment chamber 245 of the reactor body 201 can help maintain the intensity of UV light within the water treatment chamber 245 and substantially prevent UV light leakage to the outside of the water treatment chamber 245.

[0130] In the illustrated embodiment, the UV source assembly 400 may be arranged near the second end 292 of the water treatment chamber 245. The UV source assembly 400 may include a printed circuit board (PCB) assembly 480 and may be configured to guide UV light through a UV transmission window 205, which may be formed of quartz, into the water treatment chamber 245. As described herein, the UV source assembly 400 may include the PCB assembly 480 and a UV source device including a plurality of UV sources 402, which may be UV LEDs. The UV source assembly 400 may include a connector 223 configured to supply power to the circuitry of the UV source assembly 400.

[0131] During use, within the water treatment chamber 245, due to the UV reactor 200, such as Figures 7-15 As shown, the water is vertically positioned, flowing upwards towards the UV source 402 of the PCB assembly 480 of the UV source assembly 400, and then exiting the water treatment chamber 245 through at least one outlet path defined at least partially by the end cap 202. The at least one outlet path may be fluidly connected to a UV reactor outlet 230 for discharging treated water from the UV reactor 200. The at least one outlet path may include a plurality of chamber outlets 246, in... Figures 10-11 These chamber outlets 246 are shown in further detail in the illustrated embodiment. The plurality of chamber outlets 246 may be fluidly connected to a heat exchange region 236 (described herein as a tank or cooling chamber), in which water transfers thermal energy (e.g., ...) before exiting through the UV reactor outlet 230. Figure 12 and Figure 14 The heat (indicated by the dashed arrow) is conducted away from the water-facing thermal connector 406.

[0132] The plurality of chamber outlets 246 may be defined at least partially by a plurality of corresponding holes in the inner surface 290 of the water treatment chamber 245, thereby allowing water to be discharged radially relative to the longitudinal axis 240 of the water treatment chamber 245. More specifically, the plurality of chamber outlets 246 may be defined by corresponding channels provided in the end cap 202 and a portion of the chamber-facing surface of the UV transmission window 205. The plurality of chamber outlets 246 may be configured differently from those described in conjunction with the plurality of chamber outlets 246.

[0133] In the embodiment of the UV reactor 200 shown, a flow path defined by a plurality of chamber outlets 246 may be formed adjacent to a second end 292 of the end cap 202. The plurality of chamber outlets 246 may lead to a collection tank or heat exchange region 236 in fluid communication with a UV reactor outlet 230 provided by the end cap 202. The collection tank or heat exchange region 236 may extend around a portion or all of the inner circumference of the end cap 202, such as... Figures 10-11 As shown in the embodiment.

[0134] exist Figure 1 and Figures 7-15 In the illustrated embodiment, the UV source assembly 400 is thermally coupled to a water-facing thermal connector 406, which may be a metal, such as steel, aluminum, or copper. The water-facing thermal connector 406 can serve as a radiator that absorbs heat energy from the UV source assembly 400 and facilitates the transfer of that energy to one or more other media (e.g., ultimately to water passing through the UV reactor outlet 230). The UV source assembly 400 may include a thermal contact region 440 that is thermally coupled to or in direct thermal contact with the water-facing thermal connector 406. In one embodiment, a thermally conductive intermediate material (e.g., hot glue, hot grease, or thermal paste) may be provided between the thermal contact region 440 and the water-facing thermal connector 406.

[0135] UV source assembly 400 may include an integral source-based thermal coupling that is thermally coupled to a water-facing thermal coupling 406. As an example, the source-based thermal coupling and the water-facing thermal coupling 406 may be in contact with each other, such that water flowing through heat exchange region 236 can absorb heat from UV source assembly 400. This may allow water flowing through collection tank or heat exchange region 236 to cool the water-facing thermal coupling 406, thereby cooling the source-based thermal coupling and one or more UV sources 402 of UV source assembly 400.

[0136] In the illustrated embodiment, the UV reactor 200 may include a flow element 216 arranged to form a first end of the water treatment chamber 245. In one embodiment, the flow element 216 may be a baffle for promoting the formation of laminar flow from the first end 291 to the second end 292. The flow element 216 may include multiple fluid paths communicating fluid received by the UV reactor inlet 232 to the water treatment chamber 245. The UV reactor 200 may include a flow guide or deflector 266 (optionally integrated with the flow element 216) to promote the generation of turbulent flow near the multiple fluid paths of the flow element 216 on the side opposite the water treatment chamber 245.

[0137] In the illustrated embodiment, the UV source assembly 400 is spaced apart from the UV transmission window 205. As described herein, the second seal 203 can be configured as a spacer operable to fill at least a portion or most of the space between the UV source assembly 400 and the UV transmission window 205. By filling this space (which may otherwise contain air or other gases), the second seal 203 can reduce the amount of air or other gases within the space.

[0138] As described herein, the second seal 203 may include a plurality of openings 213 corresponding to each of the plurality of UV sources (e.g., UV LEDs) of the UV source assembly 400, thereby allowing light from the UV sources to enter the water treatment chamber 245 through the UV transmission window 205. The second seal 203 may include alignment features operable to angularly align the second seal 203 relative to the UV source assembly 400 and the UV sources 402 disposed on the UV source assembly 400, thereby enabling light to be directed from the UV source assembly 400 to the UV transmission window 205 and into the water treatment chamber 245.

[0139] In the illustrated embodiment, the second seal 203 is made of a silicon-based material. However, it should be understood that the invention is not limited thereto. The second seal 203 can be made of any type of material or combination of materials. For example, the second seal 203 can be formed from a first material and a second material different from the first material.

[0140] The UV reactor 200, including the water treatment chamber 245, can be constructed in a variety of ways as described herein. Additional example constructions are described in U.S. Publication US 2021 / 0032127 entitled WATER TREATMENT SYSTEM, published by Wu et al. on February 4, 2021—the disclosure of the aforementioned publication is incorporated herein by reference in its entirety.

[0141] III. Water treatment room materials

[0142] Figures 7-15 The water treatment chamber 245 in the illustrated embodiment can be constructed using various materials and in various ways. The material forming the water treatment chamber 245 can provide a UV-reflective surface. The entire inner surface of the water treatment chamber 245 can be reflective of UV light, or multiple portions of the inner surface can be reflective of UV light.

[0143] UV-reflective surfaces can be positioned to reflect UV radiation back to the water to be purified, thereby increasing the UV radiation level within the water sample or more effectively utilizing UV radiation generated by a UV radiation source. Compositions providing a target level of UV reflectivity for the water treatment system can be used. In the illustrated embodiment, a composition suitable for direct contact with the water to be purified can be provided.

[0144] For example, such as Figure 10 As shown in the embodiment, the water treatment chamber 245 may include a reactor body 201 and a flow element 216, which is made of a diffuse reflective material such as PTFE that provides at least 80%-90% reflectivity. The diffuse reflective material can promote the reflection of light or other waves or particles from the surface, such that light incident on the surface is scattered at multiple angles (instead of being scattered at only one angle as in the case of specular reflection).

[0145] As another example, the water treatment chamber 245 may be partially constructed of a quartz tube (which may be pure quartz) and a stainless steel sleeve forming a casing around the quartz tube. Alternatively, the stainless steel sleeve may be replaced with a PTFE sleeve surrounding the quartz tube.

[0146] In an alternative embodiment, one or two components defining the inner surface of the water treatment chamber 245 may be coated to promote the reflection of UV light within the water treatment chamber 245. For example, in Figure 9In the illustrated embodiment, the reactor body 201 may be metal-coated quartz (e.g., alumina-coated quartz). Coatings on one or more components may be arranged to define the inner surface of the water treatment chamber 245. Alternatively or additionally, coatings on one or more components may be arranged on a surface of the component opposite to a surface of the component defining a portion of the inner surface of the water treatment chamber 245. For example, in the illustrated embodiment, the metal-coated quartz for the reactor body 201 may be coated on its outer surface such that the inner surface of the quartz tube is in direct contact with the water supplied in the water treatment chamber 245. Coatings applied to components defining at least a portion of the inner surface of the water treatment chamber 245 may be applied internally to the component, for example, in the case where the component is formed of two or more laminated materials, where one or more laminated materials may be coated on one or both sides.

[0147] In one embodiment, the flow element 216 may be formed of or provided with a reflective material. For example, the reflective material may be disposed on or coated on a substrate component of the flow element 216.

[0148] In one embodiment, a UV transmission window 205 forming at least a portion of the inner surface of the water treatment chamber 245 can be configured to allow UV light to enter the water treatment chamber 245 but reflect the light internally within the water treatment chamber 245.

[0149] By utilizing the reflective components provided in the components of the water treatment chamber 245, the UV light intensity within the water treatment chamber 245 can be effectively maintained at a significant level.

[0150] IV. Water flow path and UV light path

[0151] As discussed herein, the UV reactor 200 can be configured to use water flowing through the UV reactor 200 as a medium for cooling the UV source 402, which performs basic disinfection of the water. Figures 7-16 In the embodiment shown, the water flow path 238 is shown as from the UV reactor inlet 232 to the UV reactor outlet 230, and the UV light path 239 is within the water treatment chamber 245.

[0152] Flow element 216 is positioned within the water flow path within the UV reactor 200 to guide water flow downstream of flow element 216 within the UV light path 239 in the water treatment chamber 245. The UV light path 239 and its intensity can be a function of the number and position of UV source 402 relative to UV transmission window 205 and UV source assembly 400.

[0153] For example, the UV source 402 can be placed near the middle of the radius of the reactor body 201 (or within 20% of the middle). In other words, the UV source 402 can be arranged at a radius 405 that is half the radius of the reactor body 201.

[0154] In one embodiment, the UV source 402 may be uniformly arranged around radius 405 (e.g., a uniformly spaced pattern). In one embodiment, this configuration may provide an optimized disinfection configuration. In one embodiment, changing the position of the UV source 402 relative to radius 405 may affect performance. For example, the UV source 402 may be placed directly at the center of the UV source assembly 400.

[0155] In the illustrated embodiment, the UV reactor 200 includes deflectors 266A, 266B disposed in a water flow path 238 upstream of the water treatment chamber 245 to generate turbulence within a turbulent region 296 prior to flow through the flow element 216. In one embodiment discussed herein, the deflectors 266A, 266B may include: a protrusion 263 operably located directly within the flow path of water passing through the UV reactor inlet 232 to facilitate a turbulent change in flow direction; and one or more vents arranged around the periphery of the protrusion 263 to facilitate turbulent guidance of water into the turbulent region 296. The turbulent region 296 may be partially defined by a curved wall 294 to further enhance turbulence within the turbulent region 296.

[0156] By providing turbulence for the water in the turbulent region 296 directly upstream of the flow element 216, the water is distributed more evenly along the flow path of the flow element 216. As a result, the flow rate of the water flowing within the water treatment chamber 245 can be distributed more evenly.

[0157] In one embodiment, the flow element 216 can be configured to substantially prevent high-velocity regions within the water treatment chamber 245, particularly those near the UV transmission window 205. Such high-velocity regions can reduce the exposure time of any microorganisms present in the water flowing through these regions.

[0158] Turning Figures 7-15 In the illustrated embodiment, the water flow path 238 includes water flowing through multiple chamber outlets 246 into the heat exchange zone 236 and then to the UV reactor outlet 230. As discussed herein, the heat exchange zone 236 may be annular and surround the second end 292 of the water treatment chamber 245.

[0159] The heat exchange region 236 provides a water flow path 238 that is in direct contact with the water-facing thermal coupling 406, which in turn is thermally connected to the thermal contact region 440 of the UV source assembly 400. As discussed herein, the UV source assembly 400 is configured to facilitate the flow of heat from the UV source 402 to the water-facing thermal coupling 406 and ultimately to the water flowing through the heat exchange region 236. This heat flow path... Figure 12 and Figure 14 In the illustrated embodiment, dashed arrows are used to indicate the path from the UV source 402 to the heat exchange region 236 and from the UV reactor outlet 230.

[0160] In the illustrated embodiment, the heat flow path proceeds as follows: the back or rear side of the plurality of UV sources 402; the thermal components (e.g., metal cladding) of the UV source assembly 400; the water-facing thermal coupling 406, such as a support ring for the UV transmission window 205, which may be stainless steel or “lead-free” brass for direct contact with water without leaching large amounts of toxic substances into the water; and the heat exchange area 236, which is also described as an outlet water collection tank.

[0161] In one embodiment, the heat flow path proceeds as follows: the back or rear side of a plurality of UV sources 402; the thermal components (e.g., metal cladding) of the UV source assembly 400; thermal adhesive (or pads or binders); source-side thermal couplings (e.g., PCB assembly back support [e.g., aluminum or copper or thermoplastic]); water-facing thermal couplings 406, such as a support ring for the UV transmission window 205, which may be stainless steel or “lead-free” brass for direct contact with water without leaching large amounts of toxic substances into the water; and the heat exchange area 236, also described as an outlet water collection tank.

[0162] Alternatively, heat from the plurality of UV sources 402 can be dissipated via a convection cooling path. According to one embodiment, the convection cooling path for heat travels as follows: the back side or rear side of each of the plurality of UV sources 402; the thermal components (e.g., metal cladding) of the UV source assembly 400; hot glue (or pads or adhesive); source-side thermal couplings; and air or the environment through the thermal path.

[0163] In one or more embodiments, the UV source assembly 400 is configured such that a source-based thermal coupling is integrally disposed within the UV source assembly 400. The source-based thermal coupling may include a copper layer 457, which may be a thermally conductive layer operable to conduct heat from the plurality of UV sources 402 to the water-facing thermal coupling 406. It should be understood that the copper layer may be formed of any type of material or a plurality of materials operable to provide a thermally conductive layer to facilitate heat conduction from the plurality of UV sources 402 to the water-facing thermal coupling 406.

[0164] V. UV source components

[0165] Figure 1 and Figure 16 A UV source assembly 400 according to one embodiment of the invention is depicted. The UV source assembly 400 is depicted as having a water-facing thermal coupling 406, which, in the illustrated embodiment, is a heat sink in thermal contact with a thermal contact area 440 of the UV source assembly 400. The water-facing thermal coupling 406 includes a water contact area 407 configured to contact water flowing through a heat exchange area 236 of the UV reactor 200. The water-facing thermal coupling 406 can conduct heat energy into the water through the water contact area 407, which, in the illustrated embodiment, can form at least a portion of a water flow path for the water flowing through the UV reactor 200.

[0166] Figure 1 The UV source assembly 400 of the illustrated embodiment is depicted as having a single UV source 402 disposed on the printed circuit board assembly 480; however, it should be understood that, as Figure 16 As shown in the illustrated embodiment, the UV source assembly 400 may include a plurality of UV sources 402. Each UV source 402 includes electrical terminals 403 that can be soldered to a circuit region 435 of the UV source assembly 400. Each UV source 402 may include thermal contacts that can be thermally bonded to a conductive layer 414, a core layer 410, or any other conductive layer of the UV source assembly 400. The thermal contacts may be shared with the electrical contacts of the UV sources 402, for example, such that the electrical terminals 403 can provide electrical connections to the circuit region 435 of the printed circuit board assembly 480 and thermal connections to the conductive layer 414.

[0167] Despite Figure 1 In the illustrated embodiment, UV source 402 is depicted as electrically and thermally connected to conductive layer 414; however, it should be understood that UV source 402 may be electrically and / or thermally connected to any conductive layer of UV source assembly 400 (including core layer 410). For example, pads of UV source 402 may be directly soldered to core layer 410 to conduct heat flux, and another pad of UV source 402 may be connected to conductive layer 414 to receive electrical signals (e.g., power). As described herein, UV source 402 may be connected to UV source assembly 400 in a variety of ways.

[0168] The printed circuit board assembly 480 may include multiple layers, some of which may be conductive or electrically insulating, and may be thermally conductive or thermally insulating, or any combination thereof. The printed circuit board assembly 480 may include a circuit region 435 comprising a conductive material that electrically connects components such as the UV source 402 to other circuits or components, including external components such as control circuitry or power supply circuitry, or combinations thereof.

[0169] The circuit region 435 of the UV source assembly 400 may include a conductive layer 414, such as a copper layer, which may be covered by a solder mask 416. Areas of the solder mask 416 may be absent to expose areas of the conductive layer 414, for example, to enable electrical connection of components to the conductive layer 414 or thermal connection of components to the conductive layer 414, or both. Although not shown, the UV source assembly 400 may include a screen 417 disposed on the solder mask 416 to provide information about the UV source assembly 400.

[0170] Printed circuit board assembly 480 may include a dielectric layer 412 and a thermally conductive layer 410, wherein the dielectric layer 412 is disposed between the thermally conductive layer 410 and the conductive layer 414. The dielectric layer 412 may be configured to operate to conduct heat energy from the conductive layer 414 to the thermally conductive layer 410. In the illustrated embodiment, the thermally conductive layer 410 may be a core layer formed of copper or aluminum, with a thickness substantially greater than that of the conductive layer 414. The combination of the thermally conductive layer 410 with the dielectric layer 412 and the conductive layer 414 can define a metal-clad printed circuit board assembly.

[0171] The thermally conductive layer 410 may include a thermal contact region 440, which may be defined by an upper surface 436 of the thermally conductive layer 410, which may be exposed or without the dielectric layer 412 and the conductive layer 414. When the water-facing thermal connector 406 is in thermal contact with the thermal contact region 440, heat generated by the UV source 402 can pass through the conductive layer 414 and the dielectric layer 412 to reach the thermally conductive layer 410, and then through the thermal contact region 440 to reach the water-facing thermal connector 406.

[0172] In the illustrated embodiment, the thermally conductive layer 410 includes an upper surface 436 and a lower surface 438 opposite to the upper surface 436.

[0173] The printed circuit board assembly 480 may include a lower dielectric layer 422, a lower conductive layer 424, and a lower solder mask 426. The lower dielectric layer 422 may contact at least a portion of the lower surface 438 of the thermally conductive layer 410, and the lower conductive layer 424 is disposed on the lower dielectric layer 422, opposite to the thermally conductive layer 410. The lower solder mask 426 may be disposed on the lower conductive layer 424, opposite to the lower dielectric layer 422. It should be understood that the invention is not limited to this configuration; additional or fewer layers may be provided in combination with the stacking or construction of the printed circuit board assembly 480. For example, the lower dielectric layer 422 and the lower conductive layer 424 may be absent.

[0174] The circuit region 435 of the printed circuit board assembly 480 is primarily described in conjunction with conductive layer 414. However, circuit region 435 may include one or more additional layers of the printed circuit board assembly 480, such as the lower conductive layer 424. Although in Figure 1 The illustrated embodiment is not shown, but the printed circuit board assembly 480 may include one or more through-holes that electrically connect one conductive layer of the printed circuit board assembly 480 to another conductive layer thereon.

[0175] In the illustrated embodiment, conductive layer 414 or dielectric layer 412, or both, may define an edge 430 adjacent to the upper surface 436 of thermally conductive layer 410. Thermally conductive layer 410 may extend below edge 430 in two directions away from edge 430. Thermal contact region 440 may be disposed near one side of edge 430, and a portion of thermally conductive layer 410 on the other side of edge 430 may be bonded to dielectric layer 412. With this configuration, at least a portion of thermally conductive layer 410, including thermal contact region 440, may be exposed or absent at least one of dielectric layer 412, conductive layer 414, and solder mask 416 disposed on conductive layer 414.

[0176] The thickness of the thermally conductive layer 410, corresponding to its thermal mass, facilitates high thermal conductivity between the UV source 402 and the water-facing thermal connector 406. The thermal conductivity of this configuration (e.g., with an increased thermal mass relative to the conductive layer 414) can be significantly greater than that of an alternative configuration in which the heat sink is thermally bonded directly (or via hot glue) to the conductive layer 414 through a thermal contact area defined by the absence of a solder mask 416 on the conductive layer 414. The dielectric layer 412 can be electrically insulating while also having high thermal conductivity to facilitate efficient heat transfer from the conductive layer 414 to the thermally conductive layer 410.

[0177] In the illustrated embodiment, the conductive layer 414 may define a plane 432. This plane 432 may intersect with a water-facing thermally connected member 406, which is thermally connected to a thermal contact area 440. The plane 432 may also intersect with a water-facing thermally connected member 416 in this configuration, simply because both the water-facing thermally connected member 406 and the conductive layer 414 are arranged above the upper surface 436 of the thermally conductive layer 410 (e.g., Figure 1 The orientation shown in the illustrated embodiment is shown.

[0178] Alternative implementation methods for UV source components are as follows: Figure 2 As shown, and generally denoted by 500. UV source assembly 500 is similar to UV source assembly 400 in many respects, with a few exceptions. UV source assembly 500 includes a printed circuit board assembly 580 similar to printed circuit board assembly 480, which includes solder mask 516, conductive layer 514, dielectric layer 512, thermally conductive layer 510, lower dielectric layer 522, lower conductive layer 524, and lower solder mask 526, which are similar in many respects to solder mask 416, conductive layer 414, dielectric layer 412, thermally conductive layer 410, lower dielectric layer 422, lower conductive layer 424, and lower solder mask 426, respectively.

[0179] As an example, conductive layer 514 includes a circuit region 535 similar to circuit region 435, but for disclosure purposes, it is shown without a UV source. The conductive layer 514 in the illustrated embodiment may also define a plane 532 similar to the plane 432 described herein.

[0180] Similar to thermally conductive layer 410, thermally conductive layer 510 includes an upper surface 536, a lower surface 538, and a thermal contact region 540. However, in the illustrated embodiment, thermally conductive layer 510, unlike thermally conductive layer 410, includes an extension 550 extending from a plane defined by the upper surface 536. Extension 550 may include the upper surface defining the thermal contact region 540 and may extend from the upper surface 536 of thermally conductive layer 510 such that the extension intersects the plane 532 defined by the conductive layer 514. In one embodiment, extension 550 may be considered as a pillar extending from the upper surface 536 of thermally conductive layer 510.

[0181] The extension 550 and the thermal contact area 540 may be exposed or without the conductive layer 514 and dielectric layer 512, allowing the water-facing thermal connector 506 to be thermally connected to the thermal contact area 540. The water-facing thermal connector 506 may be similar to the water-facing thermal connector 406, for example, including a water contact area 507 similar to the water contact area 407.

[0182] The printed circuit board assembly 580 in the illustrated embodiment defines an edge 530 adjacent to the upper surface 536 of the thermally conductive layer 510. The thermally conductive layer 510 may extend laterally from below the edge 530 in two directions away from the edge 530.

[0183] The extension 550 may be disposed near one side of the edge 530, and a portion of the thermally conductive layer 510 on the other side of the edge 530 may be bonded to the dielectric layer 512. With this configuration, at least a portion of the thermally conductive layer 510 (including the extension 550 and the thermal contact area 540) may be exposed or absent from at least one of the dielectric layer 512, the conductive layer 514, and the solder mask 516 disposed on the conductive layer 514.

[0184] The printed circuit board assembly 580 may include one or more layers disposed on opposite sides of the extension 550. For example, in the illustrated embodiment, a conductive layer 514 and a dielectric layer 512 are disposed on opposite sides of the extension 550. The extension 550 may optionally be surrounded or partially surrounded by the conductive layer 514 and the dielectric layer 512.

[0185] Another alternative implementation of the UV source component is as follows: Figure 3 As shown, and generally denoted by 600. UV source assembly 600 is similar to UV source assembly 500 in many respects, with a few exceptions. UV source assembly 600 includes a printed circuit board assembly 680 similar to printed circuit board assembly 580, which includes solder mask 616, conductive layer 614, dielectric layer 612, thermally conductive layer 610, lower dielectric layer 622, lower conductive layer 624, and lower solder mask 626, which are similar in many respects to solder mask 516, conductive layer 514, dielectric layer 512, thermally conductive layer 510, lower dielectric layer 522, lower conductive layer 524, and lower solder mask 526, respectively.

[0186] As an example, conductive layer 614 includes a circuit region 635 similar to circuit region 535. The conductive layer 614 of the illustrated embodiment may also define a plane 632 similar to the plane 532 described herein.

[0187] Similar to thermally conductive layer 510, thermally conductive layer 610 includes an upper surface 636 and a lower surface 638. However, in the illustrated embodiment, thermally conductive layer 610, unlike thermally conductive layer 510, includes a plurality of extensions 650-1, 650-2, 650-3 extending from a plane defined by the upper surface 636. Each extension 650-1, 650-2, 650-3 may include an upper surface. These upper surfaces of extensions 650-1, 650-2, 650-3 may define thermal contact regions 640-1, 640-2, 640-3. These extensions 650-1, 650-2, 650-3 can extend from the plane defined by the upper surface 636 of thermally conductive layer 610 such that the extensions intersect with a surface 632 defined by conductive layer 614. Each of these extensions 650-1, 650-2, and 650-3 can be considered as a pillar extending from the upper surface 636 of the thermally conductive layer 610.

[0188] Multiple extensions 650-1, 650-2, 650-3 and thermal contact areas 640-1, 640-2, 640-3 may be exposed or without the conductive layer 614 and dielectric layer 612, allowing the water-facing thermal connector 606 to be thermally connected to the thermal contact areas 640-1, 640-2, and 640-3. The water-facing thermal connector 606 may be similar to the water-facing thermal connector 506, for example, including a water contact area 607 similar to the water contact area 507.

[0189] The printed circuit board assembly 680 in the illustrated embodiment defines at least one edge 630 adjacent to the upper surface 636 of the thermally conductive layer 610. The thermally conductive layer 610 may extend laterally below the edge 630 in two directions away from the edge 630. One or more of the extensions 650-1, 650-2, 650-3 may be disposed near the edge defined by the conductive layer 614 and the dielectric layer 612, such as the edge 630 shown in the illustrated embodiment. A portion of the thermally conductive layer 610 on the other side of such an edge may be bonded to the dielectric layer 612. With this configuration, at least a portion of the thermally conductive layer 610, including the plurality of extensions 650-1, 650-2, 650-3 and thermal contact regions 640-1, 640-2, 640-3, may be exposed or without at least one of the dielectric layer 612, the conductive layer 614, and the solder mask 616 disposed on the conductive layer 614.

[0190] The printed circuit board assembly 680 may include one or more layers disposed on opposite sides of the extensions 650-1, 650-2, and 650-3. For example, in the illustrated embodiment, a conductive layer 614 and a dielectric layer 612 are disposed on opposite sides of the extensions 650-1, 650-2, and 650-3. The extensions 650-1, 650-2, and 650-3 may optionally be surrounded or partially surrounded by the conductive layer 614 and the dielectric layer 612.

[0191] V. Room outlet and heat exchange area

[0192] According to one embodiment, a UV reactor 200 includes a plurality of chamber outlets 246 arranged according to a chamber outlet structure 235, which can be varied depending on the application. The chamber outlets 246 may be defined at least partially by holes in the inner surface of the water treatment chamber 245. In one embodiment, the holes may be arranged directly adjacent to a second end 292 of the water treatment chamber 245, while all portions of the inner surface 290 are not located between the holes and the second end 292. Figures 7-15 The illustrated embodiment corresponds to the water-facing side of the UV transmission window 205. In this way, the water flow path 238 is configured such that water travels through the orifice and enters the chamber outlet 246 in a radial path perpendicular to the longitudinal axis 240 of the UV reactor 200. This flow path can... Figure 15 As seen in the illustrated embodiment, water flows through the water treatment chamber 245, enters the heat exchange area 236 through one of the multiple chamber outlets 246, and passes through the UV reactor outlet 230.

[0193] The number and configuration of room exits 246 can vary depending on the application. For example, in Figures 13-14 In the illustrated embodiment, the chamber outlets 246 may be arranged adjacent to the periphery of the second end 292 of the water treatment chamber 245 and uniformly spaced around the periphery according to the chamber outlet structure 235. In one embodiment, the plurality of chamber outlets 246 may be uniformly radially distributed around the longitudinal axis 240. However, the invention is not limited thereto. The plurality of chamber outlets 246 may be arranged in any manner, including patterns of unevenly spaced areas, and interrupted or restricted areas as described herein.

[0194] In one embodiment, the total cross-sectional area of ​​the plurality of chamber outlets 246 may be greater than the cross-sectional area of ​​the UV reactor inlet 232 in order to avoid significant pressure drop and minimize pressure drop as much as possible.

[0195] In one implementation, such as Figure 10As shown, the first restricted area 249 of the chamber outlet 246 may be located near the UV reactor outlet 230. In one embodiment, the first restricted area 249 may help control the flow of water through the heat exchange zone 236, thereby affecting the thermal conductivity of the UV reactor 200.

[0196] In one implementation, such as Figure 10 As shown, the second restricted area 248 at the outlet of the chamber can be located away from the UV reactor outlet 230. Similar to the first restricted area 249, the second restricted area 248 can help control the flow of water through the heat exchange area 236, thereby affecting the thermal conductivity of the UV reactor 200.

[0197] It should be noted that the second restricted area 248, opposite to the UV reactor outlet 230, may be provided in relation to one or more chamber outlets 246 and heat exchange area 236. For example, in the illustrated embodiment of the second restricted area 248, there is no chamber outlet in the second restricted area 248, and there is no flow path available for the second restricted area 248 within the heat exchange area 236. In other words, the collection tank or heat exchange area 236 may not completely surround the water treatment chamber 245, such as... Figure 10 As shown in the embodiment, the second restricted area 248 can enclose the heat exchange area 236 to improve performance.

[0198] It should be noted that instead of the second restricted area 248 for the heat exchange region 236, a partial restricted area can be defined, wherein the flow path of the heat exchange region 236 is restricted relative to the portion of the heat exchange region 236 outside the partial restricted area.

[0199] exist Figures 7-15 In the illustrated embodiment, as discussed herein, the plurality of chamber outlets 246 are at least partially formed by holes in the inner surface of the water treatment chamber 245. The holes may be defined by channels in the end cap 202 and the surface of the UV transmission window 205. The channels in the end cap 202... Figures 10-11 and Figure 15 As shown in the embodiment. Alternatively, one or more of the plurality of chamber outlets 246 may be defined at least in part by an opening arranged in the first end 291 of the water treatment chamber 245.

[0200] like Figures 12-15As shown in the embodiment, the heat exchange zone 236 is defined by a groove in the end cap 202, a UV transmission window 205, and a water-facing thermal coupling 406. The heat exchange zone 236 itself can be considered a collection tank through which water exiting the multiple chamber outlets 246 can be collected and flow to the UV reactor outlet 230. The heat exchange zone 236 can be configured to allow water to directly contact the water-facing thermal coupling 406 for heat transfer. This heat can leave with the water as it exits the UV reactor 200 through the UV reactor outlet 230.

[0201] In one embodiment, a plurality of chamber outlets 246 surrounding the entire UV transmission window 205 direct fluid to a heat exchange region 236 (e.g., a collection tank) and uniformly distribute the fluid for uniform UV optical exposure. The water contact surface of the UV transmission window 205 may serve as a wall for each chamber outlet 246, such that the chamber outlet 246 is defined by a channel in the end cap 202 and the UV transmission window 205. Additionally or alternatively, a water-facing thermal coupling 406 may define at least a portion (e.g., a wall) of the chamber outlet 246.

[0202] In the illustrated embodiment, a water-facing thermal coupling 406 (e.g., a stainless steel cooling ring) serves as the wall of the heat exchange zone 236 (e.g., the reactor outlet trough) of the UV reactor 200.

[0203] exist Figure 15 In the illustrated embodiment, the water flow path 238 of water entering the chamber outlet 246 and entering the heat exchange region 236 is shown in more detail. The chamber outlet 246 in the illustrated embodiment includes a lower surface 252 that defines a plane that does not intersect with the heat exchange region 236—although it should be understood that the chamber outlet 246 may be configured differently. The heat exchange region 236 in the illustrated embodiment includes a lower surface 251 that defines a plane that is not coplanar with the lower surface 252 of the chamber outlet 246 and is arranged upward relative to the lower surface 252 in the direction of the water flow path 238. The end cap 202 in the illustrated embodiment includes a plurality of steps that define a wall of the chamber outlet 246. The end cap 202 has an upper surface 253 and a recessed area operable to receive a UV transmission window 205. The steps, combined with the upper surface 253, help maintain the position of the UV transmission window 205.

[0204] Directional terms, such as “vertical,” “horizontal,” “top,” “bottom,” “upper,” “lower,” “inner,” “inward,” “outer,” and “outward,” are used to aid in describing the invention based on the orientation of the embodiments shown in the illustrations. The use of directional terms should not be construed as limiting the invention to any particular orientation(s).

[0205] The above description is a description of the current embodiments of the invention. Various changes and modifications may be made without departing from the spirit and broader aspects of the invention as defined in the appended claims, and these changes and modifications shall be interpreted in accordance with the principles of patent law, including the principle of equivalence. This invention is presented for illustrative purposes and should not be construed as an exhaustive description of all embodiments of the invention or as limiting the scope of the claims to the specific elements shown or described in connection with these embodiments. For example, but not as a limitation, any individual element(s) of the described invention may be replaced by alternative elements that provide substantially similar functionality or otherwise provide suitable operation. This includes, for example, currently known alternative elements (e.g., those that may be currently known to a person skilled in the art) and alternative elements that may be developed in the future (e.g., those that a person skilled in the art might identify as alternatives during development). Furthermore, the disclosed embodiments include a number of features that are consistently described and may synergistically provide a range of benefits. The invention is not limited to those embodiments that include all of these features or provide all of the stated benefits, unless otherwise expressly stated in the published claims. For example, any reference to a claim element using the articles “a,” “an,” “the,” or “the” in the singular form should not be construed as limiting that element to the singular form. Any reference referring to a claim element as “at least one of X, Y, and Z” means including any one of X, Y, and Z individually, as well as any combination of X, Y, and Z, such as X, Y, Z; X, Y; X, Z; and Y, Z.

Claims

1. A UV reactor for irradiating a water flow with ultraviolet (UV) radiation, the UV reactor comprising: A processing component, the processing component including an inlet and an outlet, the processing component being operable to direct water received through the inlet toward a point of use downstream of the outlet; A printed circuit board (PCB) includes a solder mask, a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate. The first substrate includes a first surface having a circuit region, and the solder mask is disposed on the first surface of the first substrate. A UV-LED operatively connected to the PCB, the UV-LED being oriented to direct UV energy into the processing component; as well as The thermal contact area of ​​the thermally conductive substrate is exposed, such that the thermal contact area is free of the dielectric, the solder mask and the first substrate. The thermal contact area is in hydrothermal communication with the UV reactor, and at least a portion of the UV-LED is disposed on the first surface of the first substrate.

2. The UV reactor of claim 1, comprising a thermally conductive material including a fluid contact surface arranged to define at least a portion of a fluid path for water flowing through the UV reactor, the thermally conductive material being thermally coupled to the thermal contact area of ​​the thermally conductive substrate to promote thermal communication between the water flowing through the UV reactor and the thermal contact area.

3. The UV reactor as described in claim 2, wherein, The thermal contact area is thermally connected to the water flowing through the UV reactor via the thermally conductive material.

4. The UV reactor as described in claim 2, wherein, A thermally conductive intermediate material is provided between the thermal contact area and the thermally conductive material to promote thermal connectivity between the water flowing through the UV reactor and the thermal contact area.

5. The UV reactor as described in claim 2, wherein, The fluid contact surface of the thermally conductive material is located downstream of the processing assembly.

6. The UV reactor as claimed in claim 1, wherein, The PCB is a metal-clad printed circuit board.

7. The UV reactor as claimed in claim 1, wherein, The upper and lower surfaces of the thermally conductive substrate are completely free of solder masks.

8. The UV reactor as claimed in claim 1, wherein, The thermally conductive substrate includes an upper surface that defines the thermal contact area.

9. The UV reactor as claimed in claim 8, wherein: The extension of the thermally conductive substrate extends from the main surface of the thermally conductive substrate, and the dielectric is disposed on the main surface; The extension includes the upper surface; and The plane of the first substrate intersects with the extension.

10. The UV reactor of claim 1, wherein: The first substrate and the dielectric define a first edge; and The thermally conductive substrate is disposed adjacent to the first edge and extends from both sides of the first edge, such that the thermal contact area is disposed near one side of the first edge, and the thermally conductive substrate is bonded to the dielectric material near the other side of the first edge.

11. The UV reactor as claimed in claim 1, wherein, The portion of the UV-LED disposed on the first surface of the first substrate corresponds to the terminal of the UV-LED, and wherein at least a portion of the solder mask is disposed between the UV-LED and the first surface of the first substrate.

12. A water treatment system for treating water, the water treatment system comprising: A treatment component inlet and a treatment component outlet, wherein the treatment component inlet is operable to receive water and the treatment component outlet is operable to discharge water from the water treatment system; A printed circuit board (PCB) includes a solder mask, a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate. The first substrate includes a first surface having a circuit region. The solder mask is disposed on the first surface of the first substrate. The thermally conductive substrate has a thermally contacted region exposed, such that the thermally contacted region is free of the dielectric material, the solder mask, and the first substrate. A UV source, operatively connected to a circuit area of ​​the printed circuit board, at least a portion of the UV source being disposed on a first surface of the first substrate, and the UV source being configured to provide UV energy for disinfecting water. A UV reactor, configured to promote water disinfection by applying UV energy to water flowing through the UV reactor, the UV reactor comprising: An inlet that is operably connected to the inlet of the processing component to receive water; An outlet for discharging water from the UV reactor; A water treatment chamber having a first end and a second end, the water treatment chamber having an inlet in fluid communication with the inlet to receive water to be purified, and an outlet operable to guide water toward the outlet, wherein the UV source is arranged to provide UV energy to the water treatment chamber; and A cooling chamber in fluid communication with water, the cooling chamber being in thermal contact with the thermally conductive substrate to facilitate the transfer of heat energy from the UV source into the water.

13. The water treatment system of claim 12, comprising a thermally conductive material including a fluid contact surface arranged to define at least a portion of a fluid path for water flowing through the water treatment system, the thermally conductive material being thermally coupled to the thermal contact area of ​​the thermally conductive substrate to promote thermal communication between the water flowing through the water treatment system and the thermal contact area.

14. The water treatment system of claim 13, wherein, The thermal contact area is thermally connected to the water flowing through the water treatment system via the thermally conductive material.

15. The water treatment system of claim 13, wherein, A thermally conductive intermediate material is provided between the thermal contact area and the thermally conductive material to promote thermal connectivity between the water flowing through the UV reactor and the thermal contact area.

16. The water treatment system of claim 13, wherein, The fluid contact surface of the thermally conductive material is located downstream of the water treatment chamber.

17. The water treatment system of claim 12, wherein, The PCB is a metal-clad printed circuit board.

18. The water treatment system of claim 12, wherein, The upper and lower surfaces of the thermally conductive substrate are completely free of solder masks.

19. The water treatment system of claim 12, wherein, The thermally conductive substrate includes an upper surface that defines the thermal contact area.

20. The water treatment system of claim 19, wherein: The extension of the thermally conductive substrate extends from the main surface of the thermally conductive substrate, and the dielectric is disposed on the main surface; The extension includes the upper surface; and The plane of the first substrate intersects with the extension.

21. The water treatment system of claim 12, wherein: The first substrate and the dielectric define a first edge; as well as The thermally conductive substrate is disposed adjacent to the first edge and extends from both sides of the first edge, such that the thermal contact area is disposed near one side of the first edge, and the thermally conductive substrate is bonded to the dielectric material near the other side of the first edge.

22. The water treatment system of claim 12, wherein, The portion of the UV source disposed on the first surface of the first substrate corresponds to a terminal of the UV source, and at least a portion of the solder mask is disposed between the UV source and the first surface of the first substrate.

23. A method for disinfecting water, the method comprising: Provides treatment components including inlet and outlet; Water is directed from the inlet through the treatment assembly to the outlet and towards the point of use downstream of the outlet; A UV source is provided connected to a circuit region of a printed circuit board (PCB), wherein the PCB includes a solder mask, a first substrate, a thermally conductive substrate, and a dielectric material disposed between the first substrate and the thermally conductive substrate, wherein the first substrate includes a first surface having the circuit region, the solder mask is disposed on the first surface of the first substrate, and a thermal contact region of the thermally conductive substrate is exposed such that the thermal contact region is free of the dielectric material, the solder mask, and the first substrate, and at least a portion of the UV source is disposed on the first surface of the first substrate. Heat is conducted from the UV source to the thermal contact area of ​​the PCB; and The heat is further conducted from the thermal contact area of ​​the PCB to the water flowing toward the outlet.

24. The method of claim 23, wherein, The PCB is a metal-clad printed circuit board.

25. The method of claim 24, further comprising supplying UV energy from the UV source to water flowing through the treatment component.

26. The method of claim 23, wherein, The portion of the UV source disposed on the first surface of the first substrate corresponds to a terminal of the UV source, and at least a portion of the solder mask is disposed between the UV source and the first surface of the first substrate.

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