Method, apparatus, equipment and readable storage medium for determining the termination layer of back borehole

Abstract

This application discloses a method, apparatus, device, and readable storage medium for determining the termination layer of a back-drilled hole, relating to the field of printed circuit board technology. The method includes: obtaining any via from the vias to be determined as the current via, and obtaining the corresponding attributes of the current via, wherein the via to be determined is a via on the printed circuit board used to connect to a crimp connector, and the attributes of the current via include the diameter of the anti-pads of each layer through which the current via passes; obtaining the signal layer depth and minimum copper allowance length corresponding to the current via; and determining the termination layer of the back-drilled hole for the current via based on the signal layer depth and the minimum copper allowance length. By implementing the back-drilled hole termination layer determination method of this invention, the accuracy of the back-drilling depth of vias connected to crimp connectors can be improved; and the accuracy of the overall board connection can be ensured.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board technology, and in particular to a method, apparatus, device, and readable storage medium for determining the termination layer of a back-drilled hole. Background Technology

[0002] In the design and manufacturing of printed circuit boards (PCBs), crimp connectors are commonly used for signal interconnection. Because of the use of crimp connectors, the back-drilling holes for the corresponding vias need to consider the stability of the connector and the via to ensure proper signal connection. Therefore, the depth of the back-drilling holes for vias connecting crimp connectors requires additional adjustment. Typically, a single PCB has hundreds or even thousands of back-drilling data points; any omissions or errors will lead to malfunctions on the PCB. Summary of the Invention

[0003] To address the problem of incorrect back-drilling depth setting for through holes in existing technologies for crimp connectors, the present invention adopts the following technical solution:

[0004] In a first aspect, a method for determining the termination layer of a back-drilled hole is provided, comprising: obtaining any via from the vias to be determined as the current via, and obtaining the corresponding current via attributes, wherein the via to be determined is a via on a printed circuit board used for connecting a crimp connector, and the current via attributes include the anti-pad diameter of each layer through which the current via passes.

[0005] Obtain the signal layer depth and minimum copper length corresponding to the current via;

[0006] The back-drill termination layer of the current via is determined based on the signal layer depth and the minimum copper length.

[0007] Furthermore, in response to the difference between the signal layer depth and the minimum copper length being less than zero, the non-drillable layer of the current via is obtained, wherein the non-drillable layer corresponds to the model of the crimp connector.

[0008] In response to the difference in antipad diameter between adjacent layers above and below the non-drillable layer not being a preset value, the non-drillable layer is set as the back-drill termination layer for the current via.

[0009] Furthermore, the current signal layer depth of the via is obtained in the following way:

[0010] In response to the crimping direction from the top layer of the printed circuit board to the bottom layer of the printed circuit board, the signal layer depth is the distance between the top layer of the printed circuit board and the signal layer.

[0011] The crimping direction is from the bottom layer of the printed circuit board to the top layer of the printed circuit board, and the signal layer depth is the distance between the bottom layer and the signal layer of the printed circuit board.

[0012] Furthermore, the method also includes:

[0013] In response to a greater than zero difference between the signal layer depth and the minimum copper length, the back-drilling termination layer is set as the signal layer.

[0014] Furthermore, the current via properties also include a preset termination layer, and the method also includes:

[0015] In response to the difference in antipad diameter between adjacent layers above and below the non-drillable layer being a preset value, the preset termination layer is set as the back-drill termination layer.

[0016] Furthermore, after obtaining the back-drilling termination layer, the process also includes:

[0017] Update the anti-pad diameter for each layer based on the diameter of the via or back drill hole.

[0018] Furthermore, after determining the back-drilling termination layer of the current via, the following steps are also included:

[0019] The current via is removed from the vias to be determined, the vias to be determined are updated, and the back drill hole termination layer determination method is repeated.

[0020] Secondly, a back-drilling termination layer determination device is provided, comprising:

[0021] The via acquisition module is used to acquire any via from the vias to be determined as the current via, and to acquire the corresponding current via attributes. The vias to be determined are vias on the printed circuit board used to connect crimp connectors. The anti-soldering pad diameter is set according to the via diameter or back drill hole diameter.

[0022] The signal layer acquisition module is used to acquire the signal layer depth and minimum copper length corresponding to the current via.

[0023] The termination layer setting module is used to determine the back-drill termination layer of the current via based on the signal layer depth and the minimum copper length.

[0024] Thirdly, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the back-drilling termination layer determination method described in the first aspect.

[0025] Fourthly, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the back-drilling termination layer determination method described in the first aspect.

[0026] The beneficial effects of the technical solution provided by the embodiments of the present invention are as follows:

[0027] 1. By implementing the back-drilling hole termination layer determination method disclosed in the embodiments of the present invention, the accuracy of the back-drilling depth of the via connected to the crimp connector can be improved;

[0028] 2. Ensure the accuracy of the overall connection of the circuit board. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of a method for determining the termination layer of a back-drilled hole according to an embodiment of the present invention;

[0031] Figure 2 This is a schematic diagram of a back-drilling termination layer determination device provided in an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of a computer device for implementing a method for determining the termination layer of a back-drilled hole, provided in an embodiment of the present invention. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0034] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The numbers in the accompanying drawings are only used to distinguish individual functional parts or modules and do not indicate logical relationships between parts or modules. The terms “comprising,” “including,” or “including,” and similar terms mean that the element or object preceding the term encompasses the element or object listed following the term and its equivalents, without excluding other elements or objects. The terms “connected,” “linked,” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. “Above,” “below,” “left,” “right,” etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0035] The various embodiments according to this disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that in the drawings, the same reference numerals are assigned to components having substantially the same or similar structure and function, and repeated descriptions of them will be omitted.

[0036] To address the problem of incorrect back-drilling depth setting for connector through-holes on circuit boards in existing technologies, this invention provides the following technical solution:

[0037] In one embodiment, such as Figure 1 As shown, a method for determining the termination layer of a back-drilled hole includes:

[0038] S100: Obtain any via from the vias to be determined as the current via, and obtain the corresponding current via attributes. The vias to be determined are vias on the printed circuit board used to connect the crimp connectors. The anti-soldering pad diameter is set according to the via diameter or the back drill hole diameter.

[0039] S200: Obtain the signal layer depth and minimum copper length corresponding to the current via;

[0040] S300: Determine the back drill termination layer of the current via based on the signal layer depth and minimum copper length.

[0041] Specifically, S310: In response to the difference between the signal layer depth and the minimum copper length being less than zero, obtain the non-drillable layer of the current via, wherein the non-drillable layer corresponds to the model of the crimp connector.

[0042] S320: In response to the difference in antipad diameter between adjacent layers above and below the non-drillable layer not being a preset value, set the non-drillable layer as the back-drill termination layer for the current via.

[0043] The current via properties include: the antipad diameter of each layer through which the current via passes, and the preset termination layer. The crimping direction includes: from the top layer of the printed circuit board to the bottom layer of the printed circuit board, or from the bottom layer of the printed circuit board to the top layer of the printed circuit board.

[0044] Preferably, the signal layer depth of the current via is obtained in the following way:

[0045] S210: Responding to the crimping direction from the top layer of the printed circuit board to the bottom layer of the printed circuit board, the signal layer depth is the distance between the top layer of the printed circuit board and the signal layer.

[0046] S220: Responds to the crimping direction from the bottom layer of the printed circuit board to the top layer of the printed circuit board, and the signal layer depth is the distance between the bottom layer of the printed circuit board and the signal layer.

[0047] Preferably, after obtaining the signal layer depth of the current via based on the crimping direction of the crimp connector, the method further includes:

[0048] S310′: In response to the difference between the signal layer depth and the minimum copper length being greater than zero, set the back-drilling termination layer as the signal layer.

[0049] Preferably, after determining whether the difference in diameter between the anti-pad and the adjacent layers above and below the non-drillable layer is a preset value, the process further includes:

[0050] S320′: In response to the difference in antipad diameters between the upper and lower adjacent layers of the non-drillable layer corresponding to the current via being a preset value, the preset termination layer is set as the back-drill termination layer.

[0051] Preferably, after obtaining the back-drilled hole termination layer, the process further includes:

[0052] S400: Update the antipad diameter of each layer based on the diameter of the via or back drill hole.

[0053] Preferably, after setting the non-drillable layer as the back-drilling termination layer of the current via, the method further includes:

[0054] S500: Remove the current via from the vias to be determined, update the vias to be determined, and repeat the back drill hole termination layer determination method.

[0055] Printed circuit board manufacturers typically provide the following data:

[0056] Oversizebackdrilldiameter: Sets the back drill diameter. For the current through hole diameter, add a value as the back drill diameter. For example, if the original through hole diameter is 10mil, then the parameter here is 8, and the back drill diameter is 18mil. That is, the factory selects a back drill bit diameter of 18mil.

[0057] Oversizeantipadfornegativelayers: Generates a new antipad on the negative layer. The antipad diameter is determined by adding a value to the backdrill hole diameter. This antipad will only be generated on the negative layer along the backdrill hole path. For example, if the backdrill hole diameter is 18 mil, and 12 is entered here, the generated antipad diameter will be 30 mil.

[0058] The raw information for vias to be determined is directly exported from the PCB file, and then extracted and summarized using Excel functions (such as the VLOOKUP function) or programming languages ​​(such as C language pointer extraction commands). Items include: connector tag number, model, Edited PIN, face, minimum copper allowance, anti-pad diameter, and drill hole diameter.

[0059] The minimum copper length of crimp connectors of the same model is the same, and the layers of a printed circuit board are usually distributed in a mirror image. Based on this, the non-drillable layers of each via to be determined can be obtained.

[0060] For crimping directions from the top layer of the printed circuit board to the bottom layer, if the difference between the signal layer depth and the minimum copper allowance is greater than zero, the signal layer is located below the connector and via contact point, and there is no need to change the back drill settings.

[0061] If the difference between the signal layer depth and the minimum copper allowance is less than zero, it is necessary to further determine the difference in anti-pad diameters between the upper and lower adjacent layers of the non-drillable layer corresponding to the connector. When the back-drill termination layer is correctly set, the diameter of the lower anti-pad is larger than the diameter of the upper anti-pad, with the difference being a preset fixed value. This is because different diameter anti-pads need to be set for different via diameters; once set, the difference in anti-pad diameters is determined. Based on this difference, information can be obtained regarding whether the back-drill termination layer is set correctly. If it is not set correctly, the back-drill termination layer of the via needs to be changed, typically set to a non-drillable layer.

[0062] Similarly, for the crimping direction from the bottom layer of the printed circuit board to the top layer, if the difference between the signal layer depth and the minimum copper length is greater than zero, the signal layer is located at the contact point between the connector and the via, further away from the bottom layer of the printed circuit board, and there is no need to change the back drill settings.

[0063] If the difference between the signal layer depth and the minimum copper allowance is less than zero, it is necessary to further determine the difference in anti-pad diameters between the upper and lower adjacent layers of the non-drillable layer corresponding to the connector. When the back-drill termination layer is correctly set, the diameter of the lower anti-pad is smaller than the diameter of the upper anti-pad, with the difference being a preset fixed value. This is because different diameter anti-pads need to be set for different via diameters; once set, the difference in anti-pad diameters is determined. Based on this difference, information can be obtained regarding whether the back-drill termination layer is set correctly. If it is not set correctly, the back-drill termination layer of the via needs to be changed, typically set to a non-drillable layer.

[0064] Verifying each via individually ensures the correctness of the back-drilled holes in the crimp connector. Removing a via from the list of vias to be determined after processing it, and then re-executing the back-drilled hole termination layer determination method, improves the efficiency of this approach.

[0065] Printed circuit board manufacturers typically provide the following data:

[0066] Oversizebackdrilldiameter: Sets the back drill diameter. For the current through hole diameter, add a value as the back drill diameter. For example, if the original through hole diameter is 10mil, then the parameter here is 8, and the back drill diameter is 18mil. That is, the factory selects a back drill bit diameter of 18mil.

[0067] Oversizeantipadfornegativelayers: Generates a new antipad on the negative layer. The antipad diameter is determined by adding a value to the backdrill hole diameter. This antipad will only be generated on the negative layer along the backdrill hole path. For example, if the backdrill hole diameter is 18 mil, and 12 is entered here, the generated antipad diameter will be 30 mil.

[0068] The raw information for vias to be determined is directly exported from the PCB file, and then extracted and summarized using Excel functions (such as the VLOOKUP function) or programming languages ​​(such as C language pointer extraction commands). Items include: connector tag number, model, Edited PIN, face, minimum copper allowance, anti-pad diameter, and drill hole diameter.

[0069] The minimum copper length of crimp connectors of the same model is the same, and the layers of a printed circuit board are usually distributed in a mirror image. Based on this, the non-drillable layers of each via to be determined can be obtained.

[0070] For crimping directions from the top layer of the printed circuit board to the bottom layer, if the difference between the signal layer depth and the minimum copper allowance is greater than zero, the signal layer is located below the connector and via contact point, and there is no need to change the back drill settings.

[0071] If the difference between the signal layer depth and the minimum copper allowance is less than zero, it is necessary to further determine the difference in anti-pad diameters between the upper and lower adjacent layers of the non-drillable layer corresponding to the connector. When the back-drill termination layer is correctly set, the diameter of the lower anti-pad is larger than the diameter of the upper anti-pad, with the difference being a preset fixed value. This is because different diameter anti-pads need to be set for different via diameters; once set, the difference in anti-pad diameters is determined. Based on this difference, information can be obtained regarding whether the back-drill termination layer is set correctly. If it is not set correctly, the back-drill termination layer of the via needs to be changed, typically set to a non-drillable layer.

[0072] Similarly, for the crimping direction from the bottom layer of the printed circuit board to the top layer, if the difference between the signal layer depth and the minimum copper length is greater than zero, the signal layer is located at the contact point between the connector and the via, further away from the bottom layer of the printed circuit board, and there is no need to change the back drill settings.

[0073] If the difference between the signal layer depth and the minimum copper allowance is less than zero, it is necessary to further determine the difference in anti-pad diameters between the upper and lower adjacent layers of the non-drillable layer corresponding to the connector. When the back-drill termination layer is correctly set, the diameter of the lower anti-pad is smaller than the diameter of the upper anti-pad, with the difference being a preset fixed value. This is because different diameter anti-pads need to be set for different via diameters; once set, the difference in anti-pad diameters is determined. Based on this difference, information can be obtained regarding whether the back-drill termination layer is set correctly. If it is not set correctly, the back-drill termination layer of the via needs to be changed, typically set to a non-drillable layer.

[0074] Verifying each via individually ensures the correctness of the back-drilled holes in the crimp connector. Removing a via from the list of vias to be determined after processing it, and then re-executing the back-drilled hole termination layer determination method, improves the efficiency of this approach.

[0075] In another embodiment, such as Figure 2 As shown, a back-drilling termination layer determination device includes:

[0076] The via acquisition module is used to acquire any via from the vias to be determined as the current via, and to acquire the corresponding current via attributes. The vias to be determined are vias on the printed circuit board used to connect crimp connectors. The anti-soldering pad diameter is set according to the via diameter or back drill hole diameter.

[0077] The signal layer acquisition module is used to acquire the signal layer depth and minimum copper length corresponding to the current via.

[0078] The termination layer setting module is used to determine the back-drill termination layer of the current via based on the signal layer depth and the minimum copper length.

[0079] In another embodiment, such as Figure 3 As shown, a computer device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the back-drilling termination layer determination method described in the first aspect above.

[0080] In another embodiment, a computer-readable storage medium stores a computer program that, when executed by a processor, implements the back-drilling termination layer determination method described in the first aspect above.

[0081] By implementing the back-drilling hole termination layer determination method, apparatus, device, and readable storage medium disclosed in the embodiments of the present invention, the accuracy of the back-drilling depth of vias connected to crimp connectors can be improved, and the accuracy of the overall board connection can be ensured.

[0082] All of the above-mentioned optional technical solutions can be combined in any way to form optional embodiments of the present invention, and will not be described in detail here.

[0083] Example 1

[0084] The following is combined with Figure 1 The method for determining the termination layer of back boreholes is described below:

[0085] The system obtains any via from the undetermined vias as the current via and obtains the corresponding current via attributes. The undetermined via is a via on the printed circuit board used to connect the crimp connector. The anti-pad diameter is set according to the via diameter or the back drill diameter.

[0086] Obtain the signal layer depth and minimum copper length corresponding to the current via;

[0087] In response to the difference between the signal layer depth and the minimum copper length being less than zero, obtain the non-drillable layer corresponding to the crimp connector model of the current via crimp;

[0088] In response to the difference in antipad diameter between the upper and lower adjacent layers of the non-drillable layer corresponding to the current via not being a preset value, the non-drillable layer is set as the back-drill termination layer of the current via.

[0089] Example 2

[0090] The system obtains any via from the undetermined vias as the current via and obtains the corresponding current via attributes. The undetermined via is a via on the printed circuit board used to connect the crimp connector. The anti-pad diameter is set according to the via diameter or the back drill diameter.

[0091] Obtain the signal layer depth and minimum copper length corresponding to the current via;

[0092] In response to the crimping direction from the top layer of the printed circuit board to the bottom layer of the printed circuit board, the signal layer depth is the distance between the top layer of the printed circuit board and the signal layer.

[0093] The crimping direction is from the bottom layer of the printed circuit board to the top layer of the printed circuit board, and the signal layer depth is the distance between the bottom layer and the signal layer of the printed circuit board.

[0094] In response to the difference between the signal layer depth and the minimum copper length being less than zero, obtain the non-drillable layer corresponding to the crimp connector model of the current via crimp;

[0095] In response to a greater than zero difference between the signal layer depth and the minimum copper length, the back-drilling termination layer is set as the signal layer.

[0096] In response to the difference in antipad diameter between the upper and lower adjacent layers of the non-drillable layer corresponding to the current via not being a preset value, the non-drillable layer is set as the back-drill termination layer of the current via.

[0097] In response to the difference in antipad diameter between the upper and lower adjacent layers corresponding to the current via being a non-drillable layer being a preset value, the preset termination layer is set as the back-drill termination layer.

[0098] Update the corresponding anti-pad diameter based on the diameter of the vias or back drill holes in each layer.

[0099] Remove the current via from the list of vias to be determined, update the list of vias to be determined, and repeat the back drill hole termination layer determination method.

[0100] Example 3

[0101] The following is combined with Figure 2 The device for determining the termination layer of a back borehole is described, including:

[0102] The via acquisition module is used to acquire any via from the vias to be determined as the current via, and to acquire the corresponding current via attributes. The vias to be determined are vias on the printed circuit board used to connect crimp connectors. The anti-soldering pad diameter is set according to the via diameter or back drill hole diameter.

[0103] The signal layer acquisition module is used to acquire the signal layer depth and minimum copper length corresponding to the current via.

[0104] The termination layer setting module is used to determine the back-drill termination layer of the current via based on the signal layer depth and the minimum copper length.

[0105] Example 4

[0106] The following is combined with Figure 3 The document describes a computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the back-drilling termination layer determination method described in the first aspect above, specifically including:

[0107] The system obtains any via from the undetermined vias as the current via and obtains the corresponding current via attributes. The undetermined via is a via on the printed circuit board used to connect the crimp connector. The anti-pad diameter is set according to the via diameter or the back drill diameter.

[0108] Obtain the signal layer depth and minimum copper length corresponding to the current via;

[0109] In response to the crimping direction from the top layer of the printed circuit board to the bottom layer of the printed circuit board, the signal layer depth is the distance between the top layer of the printed circuit board and the signal layer.

[0110] The crimping direction is from the bottom layer of the printed circuit board to the top layer of the printed circuit board, and the signal layer depth is the distance between the bottom layer and the signal layer of the printed circuit board.

[0111] In response to the difference between the signal layer depth and the minimum copper length being less than zero, obtain the non-drillable layer corresponding to the crimp connector model of the current via crimp;

[0112] In response to a greater than zero difference between the signal layer depth and the minimum copper length, the back-drilling termination layer is set as the signal layer.

[0113] In response to the difference in antipad diameter between the upper and lower adjacent layers of the non-drillable layer corresponding to the current via not being a preset value, the non-drillable layer is set as the back-drill termination layer of the current via.

[0114] In response to the difference in antipad diameter between the upper and lower adjacent layers corresponding to the current via being a non-drillable layer being a preset value, the preset termination layer is set as the back-drill termination layer.

[0115] Update the corresponding anti-pad diameter based on the diameter of the vias or back drill holes in each layer.

[0116] Remove the current via from the list of vias to be determined, update the list of vias to be determined, and repeat the back drill hole termination layer determination method.

[0117] Example 5

[0118] A computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the back-drilling termination layer determination method described in the first aspect above, specifically including:

[0119] The system obtains any via from the undetermined vias as the current via and obtains the corresponding current via attributes. The undetermined via is a via on the printed circuit board used to connect the crimp connector. The anti-pad diameter is set according to the via diameter or the back drill diameter.

[0120] Obtain the signal layer depth and minimum copper length corresponding to the current via;

[0121] In response to the crimping direction from the top layer of the printed circuit board to the bottom layer of the printed circuit board, the signal layer depth is the distance between the top layer of the printed circuit board and the signal layer.

[0122] The crimping direction is from the bottom layer of the printed circuit board to the top layer of the printed circuit board, and the signal layer depth is the distance between the bottom layer and the signal layer of the printed circuit board.

[0123] In response to the difference between the signal layer depth and the minimum copper length being less than zero, obtain the non-drillable layer corresponding to the crimp connector model of the current via crimp;

[0124] In response to a greater than zero difference between the signal layer depth and the minimum copper length, the back-drilling termination layer is set as the signal layer.

[0125] In response to the difference in antipad diameter between the upper and lower adjacent layers of the non-drillable layer corresponding to the current via not being a preset value, the non-drillable layer is set as the back-drill termination layer of the current via.

[0126] In response to the difference in antipad diameter between the upper and lower adjacent layers corresponding to the current via being a non-drillable layer being a preset value, the preset termination layer is set as the back-drill termination layer.

[0127] Update the corresponding anti-pad diameter based on the diameter of the vias or back drill holes in each layer.

[0128] Remove the current via from the list of vias to be determined, update the list of vias to be determined, and repeat the back drill hole termination layer determination method.

[0129] Specifically, according to embodiments of this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of this application include a computer program product comprising a computer program loaded on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from memory, or installed from ROM. When the computer program is executed by an external processor, it performs the functions defined in the methods of embodiments of this application.

[0130] It should be noted that the computer-readable medium in the embodiments of this application can be a computer-readable signal medium or a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In the embodiments of this application, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. In the embodiments of this application, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium may be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wires, optical fibers, RF (Radio Frequency), etc., or any suitable combination thereof.

[0131] The aforementioned computer-readable medium may be included in the aforementioned server; or it may exist independently and not assembled into the server. The aforementioned computer-readable medium carries one or more programs that, when executed by the server, cause the server to: in response to detecting that the peripheral mode of the terminal is not activated, acquire the frame rate of the application on the terminal; when the frame rate meets the screen-off condition, determine whether the user is acquiring the terminal's screen information; and in response to the determination that the user is not acquiring the terminal's screen information, control the screen to enter an immediate dimming mode.

[0132] Computer program code for performing the operations of the embodiments of this application can be written in one or more programming languages ​​or a combination thereof. Programming languages ​​include object-oriented programming languages—such as Java, Smalltalk, and C++—and conventional procedural programming languages—such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0133] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for system or system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and relevant parts can be referred to the descriptions in the method embodiments. The systems and system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0134] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

[0135] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for determining the termination layer of a back-drilled hole, characterized in that, The method includes: The system obtains any via from the vias to be determined as the current via and obtains the corresponding current via attributes. The via to be determined is a via on the printed circuit board used to connect a crimp connector. The current via attributes include the anti-pad diameter of each layer through which the current via passes. Obtain the signal layer depth and minimum copper length corresponding to the current via; The back-drill termination layer of the current via is determined based on the signal layer depth and the minimum copper retention length.

2. The method for determining the termination layer of a back-drilled hole according to claim 1, characterized in that, In response to the difference between the signal layer depth and the minimum copper length being less than zero, the non-drillable layer of the current via is obtained, wherein the non-drillable layer corresponds to the model of the crimp connector; In response to the fact that the difference in diameter of the antipads of the upper and lower adjacent layers of the non-drillable layer is not a preset value, the non-drillable layer is set as the back-drill termination layer of the current via.

3. The method for determining the termination layer of a back-drilled hole according to claim 1, characterized in that, The current signal layer depth of the via is obtained in the following way: In response to the pressing direction pointing from the top layer of the printed circuit board to the bottom layer of the printed circuit board, the signal layer depth is the distance between the top layer of the printed circuit board and the signal layer; In response to the pressing direction being from the bottom layer of the printed circuit board to the top layer of the printed circuit board, the signal layer depth is the distance between the bottom layer of the printed circuit board and the signal layer.

4. The method for determining the termination layer of a back-drilled hole according to claim 1, characterized in that, The method further includes: In response to the difference between the signal layer depth and the minimum copper length being greater than zero, the back-drilling termination layer is set as the signal layer.

5. The method for determining the termination layer of a back-drilled hole according to claim 2, characterized in that, The current via properties also include a preset termination layer, and the method further includes: In response to the difference in antipad diameter between adjacent layers above and below the non-drillable layer being a preset value, the preset termination layer is set as the back-drill termination layer.

6. The method for determining the termination layer of a back-drilled hole according to any one of claims 1-5, characterized in that, After obtaining the back-drilling termination layer, the following is also included: Update the anti-pad diameter of each layer based on the diameter of the via or back drill hole.

7. The method for determining the termination layer of a back-drilled hole according to claim 1, characterized in that, After determining the back-drilling termination layer of the current via, the method further includes: The current via is removed from the vias to be determined to update the vias to be determined, and the back drill hole termination layer determination method is repeated.

8. A device for determining the termination layer of a back-drilled hole, characterized in that, The device includes: The via acquisition module is used to acquire any via from the vias to be determined as the current via, and to acquire the corresponding current via attributes, wherein the via to be determined is a via on the printed circuit board used to connect the crimp connector, and the anti-solder pad diameter is set according to the via diameter or the back drill hole diameter. The signal layer acquisition module is used to acquire the signal layer depth and minimum copper length corresponding to the current via. The termination layer setting module is used to determine the back drill termination layer of the current via based on the signal layer depth and the minimum copper length.

9. A computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the back-drilling termination layer determination method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the back-drilling termination layer determination method according to any one of claims 1 to 7.

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