Electronic device including heat dissipation structure

Abstract

A wearable electronic device according to one embodiment of the present invention includes a housing, a first printed circuit board (PCB), a second PCB disposed in parallel with the first PCB, a first adapter plate, and a second adapter plate. The housing can include at least one first opening in a first portion. The first adapter plate and the second adapter plate can be disposed between the first PCB and the second PCB. The first adapter plate and the second adapter plate are disposed such that a first end of the first adapter plate and a second end of the second adapter plate facing the first end are spaced apart by a predetermined distance. A first space between the first end and the second end can be connected to the at least one first opening of the housing. Various other embodiments are possible.

Description

Technical Field

[0001] One or more embodiments disclosed in this document generally relate to an electronic device including a heat dissipation structure. Background Technology

[0002] With the development of digital technology, electronic devices have been provided in various forms, such as smartphones, tablet PCs, and wearable electronic devices. Recently, electronic devices have been becoming smaller to improve user portability and accessibility.

[0003] As electronic devices become smaller, their functions become more diverse. Therefore, there is a trade-off between miniaturizing the device while having enough internal space to house various electronic components (e.g., processors, communication circuits, or memory) to perform the device's various functions.

[0004] Recently, electronic devices with a layered structure having multiple printed circuit boards are increasingly being used, employing interposers. This layered structure provides sufficient space for the electronic components housed within it. For example, by stacking multiple printed circuit boards and providing interposers between the stacked boards, including at least one path for electrically connecting these printed circuit boards, space can be guaranteed for housing the electronic components. Summary of the Invention

[0005] Technical issues

[0006] Electronic components mounted on layered printed circuit boards can generate heat during operation, causing the temperature of the electronic device to rise. Due to the high temperature, the performance of the electronic device may degrade, or the lifespan of individual components and the device itself may be reduced. Furthermore, the increased temperature may cause the surface temperature of the electronic device to rise, resulting in user inconvenience and discomfort.

[0007] When a layered structure of printed circuit boards is formed by using an adapter board, the space between the printed circuit boards can be enclosed by the adapter board, which may make heat dissipation difficult.

[0008] Technical solution

[0009] According to embodiments of this disclosure, a wearable electronic device may include: a housing; a first printed circuit board (PCB); a second PCB, the second PCB being disposed parallel to the first PCB; a first adapter plate; and a second adapter plate, wherein the housing may include at least one first opening formed on a first portion thereof, and the first adapter plate and the second adapter plate may be disposed between the first PCB and the second PCB, the first adapter plate and the second adapter plate may be configured such that a first end of the first adapter plate and a second end of the second adapter plate facing the first end are spaced apart by a specified distance, and a first space between the first end and the second end may be connected to the at least one first opening of the housing.

[0010] According to an embodiment, a wearable electronic device may include: a first PCB; a second PCB, the second PCB being disposed parallel to the first PCB; a first adapter board; and a second adapter board, wherein the first adapter board and the second adapter board may be disposed between the first PCB and the second PCB, the first adapter board and the second adapter board may be configured such that a first end of the first adapter board and a second end of the second adapter board facing the first end are spaced apart by a first specified distance, and a third end of the first adapter board may be configured such that a fourth end of the second adapter board facing the third end of the first adapter board is spaced apart by a second specified distance.

[0011] Beneficial effects

[0012] According to certain embodiments disclosed in this document, the wearable electronic device can effectively dissipate heat generated in the electronic components by connecting the space between the first adapter plate and the second adapter plate to an opening in the housing.

[0013] In addition, according to some embodiments, costs can be reduced because the number of separable adapter boards manufactured per area is greater than the number of integrated adapter boards.

[0014] This document can provide various other effects, either directly or indirectly, that can be obtained through this document. Attached Figure Description

[0015] Figure 1 This is a view showing the unfolded or folded state of a wearable electronic device according to an embodiment;

[0016] Figure 2a This is a view showing a printed circuit board assembly (PBA) disposed in a first support housing and / or a second support housing according to an embodiment;

[0017] Figure 2b It is shown that, according to the embodiment, it is added to Figure 2a The diagram shows a view of the third printed circuit board (PCB), the third adapter board, and the fourth adapter board of the embodiment shown.

[0018] Figure 3 This is a view showing a PBA with an additional heat dissipation structure connected according to an embodiment;

[0019] Figure 4 This is a view showing a PBA disposed in a first support housing and / or a second support housing according to another embodiment;

[0020] Figure 5a This is a view showing a heat dissipation structure that dissipates heat through the space between a first and second adapter plate that are spaced apart from each other, as well as an opening in the second support housing.

[0021] Figure 5b This is a view showing the second support housing as seen from the -y direction;

[0022] Figure 5c This is a view showing the second support housing as seen from the +x direction;

[0023] Figure 5d This is a view illustrating a heat dissipation structure according to an embodiment, the heat dissipation structure including adding... Figure 5a The thermal barrier component of the embodiment;

[0024] Figure 6 A view of the first PCB in the embodiment shown in Figure 5 is also shown;

[0025] Figure 7 This is a view showing the heat dissipation structure of the space between the first and second adapter plates that are spaced apart from each other, and the opening of the second support housing.

[0026] Figure 8a This is a view showing a first support housing including an opening of another form according to another embodiment;

[0027] Figure 8b This is a perspective view of the first supporting shell 120;

[0028] Figure 8c This is a view of the first supporting housing as seen from the -x direction;

[0029] Figure 9 This is a view showing a second support housing including an opening according to another embodiment;

[0030] Figure 10 This is a view comparing the number of manufactured integrated adapter boards and the number of manufactured separable adapter boards in a specific area according to an embodiment; and

[0031] Figure 11 This is a block diagram of an electronic device in a network environment according to various embodiments. Detailed Implementation

[0032] Some embodiments disclosed in this document can dissipate heat generated in electronic components by connecting the space between a first and a second adapter plate that are separate from each other to an opening included in a portion of the housing.

[0033] In the following description, certain embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. However, these are not intended to limit the present disclosure to the specific embodiments, but should be understood to include various modifications, equivalents, or alternatives to the embodiments.

[0034] Figure 1 The wearable electronic device according to an embodiment is shown in either an unfolded or folded state.

[0035] Reference Figure 1 According to an embodiment, the wearable electronic device 100 may include: a main housing 110; a first support housing 120 connected to the main housing 110 via a first connector 113; and a second support housing 130 connected to the main housing 110 via a second connector 114.

[0036] According to an embodiment, when a user wears the wearable electronic device 100, the main housing 110 can cover at least a portion of the user's face.

[0037] According to an embodiment, a configuration may be provided inside the first portion 121 of the first support housing 120 and / or the second portion 131 of the second support housing 130, as will be referred to below. Figure 2a The printed circuit board assembly (PBA) is described.

[0038] According to an embodiment, the first connector 113 can physically connect the main housing 110 and the first support housing 120, and can be configured such that the main housing 110 and the first support housing 120 are rotatable relative to the first connector 113 within a specified angular range (e.g., +90 degrees to -90 degrees). In an embodiment, the first connector 113 can be configured as a hinge structure for fixing the main housing 110 and the first support housing 120, and can be configured such that the main housing 110 and the first support housing 120 are rotatable relative to the first connector 113. Except for the direction of rotation, the above description of the first connector 113 can be equally applied to the second connector 114. For example, the second connector 114 can physically connect the main housing 110 and the second support housing 130, and can be configured such that the main housing 110 and the second support housing 130 are rotatable relative to the second connector 114 within a specified angular range (e.g., +90 degrees to -90 degrees). In an embodiment, the second connector 114 may be configured as a hinge structure for fixing the main housing 110 and the second support housing 130, and may be configured such that the main housing 110 and the second support housing 130 are rotatable relative to the second connector 114.

[0039] According to an embodiment, a first display 111 for left-eye images and / or a second display 112 for right-eye images may be housed within a main housing 110. In one example, the first display 111 and the second display 112 may comprise either a near-eye display (NED) or a head-mounted display (HMD). In another example, the first display 111 and the second display 112 may comprise a see-through display as a type of NED. For example, wearable electronics 100 may include an optical waveguide formed on at least a portion thereof, and a specific area of ​​the optical waveguide may correspond to the see-through display. The see-through display may be positioned very close to the user's eyes, and the user may wear the wearable electronics 100 including the see-through display like protective goggles. In another example, wearable electronics 100 may include a projector formed on at least a portion thereof to emit light and display objects.

[0040] According to an embodiment, the wearable electronic device 100 can display augmented reality (AR) images via a first display 111 and / or a second display 112. In an example, the first display 111 and / or the second display 112 can allow light from the real environment (or real objects) to pass through them, and when a user wears the wearable electronic device 100, the user can recognize the light from the real environment passing through the first display 111 and / or the second display 112.

[0041] According to another embodiment, the first display 111 and / or the second display 112 can be understood as transparent displays, which allow light from real objects to pass through and can display images of virtual objects. For example, the wearable electronic device 100 can display images of virtual objects through the first display 111 and / or the second display 112. Users can identify real and virtual objects through the first display 111 and / or the second display 112 of the wearable electronic device 100, thus the wearable electronic device 100 can provide AR to users.

[0042] According to an embodiment, the first display 111 and / or the second display 112 may include a transparent material such as glass or plastic.

[0043] Figure 1 The shape of the wearable electronic device 100 shown is merely an example, and the shape of the wearable electronic device 100 is not limited to this. Figure 1 The shape shown is described in the figure. According to an embodiment, the wearable electronic device 100 may be a wearable electronic device 100 manufactured in such a shape that it is worn on the user's head. For example, the wearable electronic device 100 may be constructed in the shape of at least one of glasses, goggles, a helmet, or a hat, but is not limited thereto.

[0044] Figure 2a This is a view showing the PBA disposed in the first support housing and / or the second support housing according to an embodiment.

[0045] Reference Figure 2a According to an embodiment, the printed circuit board assembly (PBA) 200 may include a first printed circuit board (PCB) 211, a second PCB 212 and / or an adapter board 220.

[0046] According to an embodiment, PBA 200 may include a first PCB 211 and a second PCB 212 disposed substantially parallel to the first PCB 211. According to an embodiment, PBA 200 may include an adapter board 220 disposed between the first PCB 211 and the second PCB 212, and the adapter board 220 may enclose the space between the first PCB 211 and the second PCB 212.

[0047] According to an embodiment, the adapter plate 220 may include a first adapter plate 221 and a second adapter plate 222. In an embodiment, a first end 221a of the first adapter plate 221 may be spaced apart from a second end 222a of the second adapter plate 222 by a specified distance (e.g., 0.2 mm) or longer. In this case, a first space 231 may be created between the first end 221a and the second end 222a to physically connect the internal space of the PBA 200 enclosed by the adapter plate 220 to a space outside the PBA 200. In an embodiment, a third end 221b of the first adapter plate 221 may be spaced apart from a fourth end 222b of the second adapter plate 222 by a specified distance (e.g., 0.2 mm) or longer. In this case, a second space 232 may be created between the third end 221b and the fourth end 222b to physically connect the internal space of the PBA 200 enclosed by the adapter plate 220 to a space outside the PBA 200. According to one embodiment, the first space 231 and the second space 232 may have substantially the same size and / or shape. According to another embodiment, the first space 231 and the second space 232 may have different sizes and / or shapes.

[0048] According to an embodiment, the first PCB 211 and the second PCB 212 can be connected to each other via an adapter plate 220. For example, the first PCB 211 and the second PCB 212 can be connected to each other via a plurality of conductive paths 250 included in the adapter plate 220. According to an embodiment, the first PCB 211 and the second PCB 212 can be electrically connected to each other via a plurality of conductive paths 250 included in the adapter plate 220 and / or side surface plating (e.g., gold (Au)).

[0049] According to an embodiment, the first PCB 211 and the second PCB 212 can be fixed by an adapter board 220. According to an embodiment, the first PCB 211 and the second PCB 212 can be connected to the adapter board 220 to form a layered structure. According to an embodiment, at least one electronic component (e.g., a processor, memory, interface) can be disposed on the first PCB 211 and / or the second PCB 212.

[0050] According to an embodiment, the adapter board 220 may include two or more adapter boards. For example, when the adapter board 220 includes three adapter boards, there are three spaces between the adapter boards, while when the adapter board 220 includes four adapter boards, there may be four spaces between the adapter boards.

[0051] Figure 2b It is shown that, according to the embodiment, it is added to Figure 2a The diagram shows a view of the third PCB, the third adapter board, and the fourth adapter board of the embodiment.

[0052] Reference Figure 2b According to an embodiment, the printed circuit board assembly (PBA) 200 may further include a third PCB 213, a third adapter board 241, and a fourth adapter board 242.

[0053] According to an embodiment, the third adapter board 241 and the fourth adapter board 242 can be disposed between the second PCB 212 and the third PCB 213 to enclose some space between the second PCB 212 and the third PCB 213. In an embodiment, the fifth end of the third adapter board 241 can be positioned at a specified distance (e.g., 0.2 mm) or longer from the sixth end of the fourth adapter board 242. In this case, a third space 233 can be created between the fifth end and the sixth end to physically connect the internal space of the PBA 200 to the external space of the PBA 200. In essentially the same manner, the seventh end of the fourth adapter board 242 can be positioned at a specified distance (e.g., 0.2 mm) or longer from the eighth end of the fourth adapter board 242, but they are partially obscured in the figures. In this case, a fourth space 234 can be created between the seventh end and the eighth end to physically connect the internal space of the PBA 200 to the external space of the PBA 200.

[0054] According to embodiments, the first space 231, the second space 232, the third space 233, and / or the fourth space 234 may be aligned relative to a specified axis. For example, the first space 231 and the second space 232 may be aligned along the y-axis. In another example, the third space 233 and the fourth space 234 may be aligned along the y-axis. In yet another example, the first space 231 and the third space 233 may be aligned along the x-axis, and the second space 232 and the fourth space 234 may be aligned along the x-axis. However, the alignment of the first space 231, the second space 232, the third space 233, and / or the fourth space 234 along a specified axis is merely an example, and in another embodiment, the first space 231, the second space 232, the third space 233, and / or the fourth space 234 may be formed in various locations. For example, in another embodiment, the first space 231 and the second space 232 may be configured not to be aligned along the y-axis.

[0055] Figure 3 This is a view showing a PBA coupled with an additional heat dissipation structure according to an embodiment.

[0056] In one embodiment, the wearable electronic device 100 may include an additional heat dissipation structure 320. In another embodiment, the additional heat dissipation structure 320 may include a shielding member 321, a heat transfer member 322, a heat sink 323, and / or a heat radiator 324.

[0057] According to an embodiment, at least one electronic component 310 (e.g., a processor, a wireless communication circuit) may be disposed on the first PCB 211. In an embodiment, a shielding member 321 may be configured to enclose the electronic component 310. For example, the electronic component 310 may be disposed along the shielding member 321 as shown in the image. Figure 3 The shielding member 321 is arranged in the second direction shown, and it can be arranged along the periphery of the first PCB 211 and can enclose the electronic component 310. In the embodiment, the shielding member 321 can be referred to as a shielding canister. The shielding member 321 can not only have a heat dissipation function, but also an electromagnetic interference shielding (EMI shielding) function.

[0058] According to an embodiment, the shielding member 321 may include a metal with high thermal conductivity. For example, the shielding member 321 (e.g., a shielding can) may include at least one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), and / or aluminum (Al).

[0059] According to an embodiment, the shielding member 321 may be a thermally conductive filler (e.g., a metal filler, a ceramic filler, a carbon filler), or a composite material such as a polymer.

[0060] According to an embodiment, the heat sink 323 can be disposed on the shielding member 321. For example, the heat sink 323 can be disposed on the shielding member 321 as shown in the embodiment. Figure 3 It is in contact with the shielding member 321 in the first direction shown.

[0061] According to an embodiment, the heat sink 323 may include an adhesive layer with adhesive properties, and the heat sink 323 may be attached to at least a portion of the shielding member 321 via the adhesive layer. In an embodiment, the heat sink 323 and the shielding member 321 may be bonded to each other using an adhesive member (e.g., conductive tape or conductive adhesive).

[0062] According to an embodiment, a heat transfer member 322 may be disposed between the electronic component 310 and the shielding member 321. In an embodiment, the heat transfer member 322 may be made of a solid and / or liquid material with high thermal conductivity. For example, the heat transfer member 322 may be a carbon polymer and / or ceramic material with high thermal conductivity. In an embodiment, the heat transfer member 322 may be disposed between the electronic component 310 and the shielding member 321 to enhance thermal coupling, thereby allowing heat generated by the electronic component 310 to be efficiently transferred to the shielding member 321. According to an embodiment, the heat transfer member 322 may have substantially the same size as the electronic component 310. For example, the surface of the heat transfer member 322 that contacts the electronic component 310 may be substantially the same as the surface of the electronic component 310 that contacts the heat transfer member 322. According to an embodiment, the shape of the heat transfer member 322 is not limited to the shape shown (e.g., rectangular) and may have various shapes and sizes.

[0063] According to an embodiment, a heat sink 324 may be disposed on a heat sink 323. For example, the heat sink 324 may be configured to contact the heat sink 323 in a first direction. In an embodiment, the heat sink 324 may comprise a material having high thermal conductivity. For example, the heat sink 324 may be constructed using at least one of copper (Cu) or aluminum (Al). In an embodiment, the heat sink 324 may comprise a metal water cooling device (e.g., a heat pipe, a steam chamber) and / or a heat dissipation plate. The heat sink 324 may absorb heat transferred from the heat sink 323 and may dissipate heat by diffusing it outwards.

[0064] Figure 4 This is a view showing a PBA disposed in a first support housing and / or a second support housing according to another embodiment.

[0065] Reference Figure 4 According to an embodiment, the printed circuit board assembly (PBA) 400 may include a first PCB (not shown), a second PCB 412, and / or an adapter board 420. In an embodiment, the first PCB and the second PCB of the PBA 400 may respectively correspond to... Figure 2a The first PCB 211 and the second PCB 212 are shown.

[0066] According to an embodiment, PBA 400 may include a first PCB and a second PCB 412 disposed substantially parallel to the first PCB. According to an embodiment, PBA 400 may include an adapter board 420 disposed between the first PCB and the second PCB 412, and the adapter board 420 may enclose at least a portion of the space between the first PCB and the second PCB 412.

[0067] According to an embodiment, the adapter board 420 may include a first adapter board 421 and a second adapter board 422. In an embodiment, a first end 421a of the first adapter board 421 may be spaced apart from a second end 422a of the second adapter board 422 by a specified distance (e.g., 0.2 mm) or longer. According to an embodiment, the first adapter board 421, the second adapter board 422, the first PCB, and the second PCB 412 may be interconnected to form a space 430 (e.g., a first space 431 and a second space 432) between the first end 421a and the second end 422a and between the third end 421b and the fourth end 422b. In this case, the first space 431 between the first end 421a and the second end 422a can physically connect the interior of the PBA 400 enclosed by the adapter board 420 to the space outside the PBA 400. In an embodiment, the third end 421b of the first adapter plate 421 can be configured to be spaced apart from the fourth end 422b of the second adapter plate 422 by a specified distance (e.g., 0.2 mm) or a longer distance. In this case, the second space 432 between the third end 421b and the fourth end 422b can physically connect the interior of the PBA 400 enclosed by the adapter plate 420 to the space outside the PBA 400.

[0068] Figure 5a This is a view showing a heat dissipation structure according to an embodiment that dissipates heat through the space between a first and a second adapter plate spaced apart from each other, and an opening in the second support housing.

[0069] Figure 5b This is a view showing the second support housing as seen from the -y direction.

[0070] Figure 5c This is a view showing the second support housing as seen from the +y direction.

[0071] Reference Figure 5a , Figure 5b and Figure 5cAccording to an embodiment, the second support housing 130 may include a first opening 511 disposed on a portion adjacent to the first space 231 within a specific distance, and the second support housing 130 may include a second opening 512 disposed on a portion adjacent to the second space 232 within a specific distance. In an embodiment, the first opening 511 may have a first width W1, and the second opening 512 may have a second width W2. For example, the first width W1 and the second width W2 may be the same as each other. In an embodiment, the first width W1 of the first opening 511 may be equal to or greater than the width of the first space 231 between the first end 221a and the second end 222a. In an embodiment, the second width W2 of the second opening 512 may be equal to or greater than the width of the second space 232 between the third end 221b and the fourth end 222b.

[0072] In an embodiment, the first opening 511 and / or the second opening 512 may be filled with a porous material. For example, a first film 511a made of a porous material may be disposed in the first opening 511. In another example, a second film 512a made of a porous material may be disposed in the second opening 512. In an embodiment, the first film 511a and / or the second film 512a made of porous material allow air to pass through and can achieve waterproofing and / or dustproofing by preventing water or dust from entering the wearable electronic device 100 from the outside.

[0073] According to an embodiment, the first space 231 can be connected to the first opening 511 via a first connecting pipe 531 (i.e., fluid communication). The second space 232 can be connected to the second opening 512 via a second connecting pipe 532. In an embodiment, multiple electronic components (e.g., ...) disposed on the second PCB 212 are used to... Figure 3 Heat generated by the electronic components 310 can be transferred to the outside through the first opening 511 and / or the second opening 512. For example, air in the adapter plate 220 that has a relatively high temperature due to heat can be discharged to the outside of the wearable electronic device 100 through the first space 231 and the first opening 511. In this case, air in the wearable electronic device 100 with a relatively low temperature can flow into the adapter plate 220 through the second space 232 and the second opening 512. Therefore, the wearable electronic device 100 can efficiently transfer internal heat to the outside of the wearable electronic device 100. Although in Figure 5aThe illustration shows external cold air flowing into the PBA 200 through the second space 232 and the second connecting pipe 532, and heat being discharged to the outside of the wearable electronic device 100 through the first space 231 and the first connecting pipe 531; however, this is merely an example. In another embodiment, external cold air can flow into the PBA 200 through the first space 231 and the first connecting pipe 531, while heat can be discharged to the outside of the wearable electronic device 100 through the second space 232 and the second connecting pipe 532.

[0074] According to another embodiment, in addition to Figure 5a In addition to the first opening 511 and the second opening 512 shown, the second support housing 130 may also include additional openings. For example, the second support housing 130 may also include a first additional opening disposed on a portion adjacent to the first space 231, and the first additional opening may be connected to the first space 231 via a first additional connecting conduit. Therefore, heat can be discharged to the outside through the first opening 511 and the first additional opening. In another example, the second support housing 130 may also include a second additional opening disposed on a portion adjacent to the second space 232, and the second additional opening may be connected to the second space 232 via a second additional connecting conduit. External air from the wearable electronic device 100 may flow into the internal space of the PBA 200 through the second opening 512 and the second additional opening. In another embodiment, in addition to the first additional opening and / or the second additional opening, the second support housing 130 may also include multiple additional openings, and as described above, the multiple additional openings may be connected to the first space 231 and / or the second space 232 via corresponding additional connecting conduits. Heat can be discharged to the outside through the multiple additional openings. In another example, external air may flow into the PBA 200 through the multiple additional openings.

[0075] Figure 5d It is shown that, according to an embodiment, it includes adding to Figure 5a A view of the heat dissipation structure of the heat-blocking member in an embodiment.

[0076] Reference Figure 5dThe wearable electronic device 100 according to an embodiment may include a heat-blocking member 540. A first heat-blocking member 541 and / or a second heat-blocking member 542 of the heat-blocking member 540 may be disposed on a side surface of the first connecting conduit 531. The first heat-blocking member 541 and / or the second heat-blocking member 542 can improve heat dissipation efficiency by preventing heat transfer to the side surface of the first connecting conduit 531 while heat is being transferred from the first space 231 to the first opening 511. In another example, a third heat-blocking member 543 and / or a fourth heat-blocking member 544 of the heat-blocking member 540 may be disposed on a side surface of the second connecting conduit 532. The third heat-blocking member 543 and / or the fourth heat-blocking member 544 can improve heat dissipation efficiency by preventing heat transfer to the side surface of the second connecting conduit 532 while heat is being transferred from the second space 232 to the second opening 512.

[0077] According to an embodiment, external air from the second support housing 130 can flow into the PBA 200 through the second opening 512, the second connecting pipe 532, and the second space 232, and the intake air can be discharged to the outside of the second support housing 130 through the first space 231, the first connecting pipe 531, and the first opening 511. Due to the airflow, the internal heat of the PBA 200 can be reduced.

[0078] Figure 6 A view of the first PCB in the embodiment shown in Figure 5 is also shown.

[0079] Reference Figure 6 According to an embodiment, a first PCB 211 is shown included in the second support housing 130. Compared to FIG. 5, which shows a second PCB 212 and an adapter board 220 but does not show the first PCB 211, Figure 6 A first PCB 211 coupled to adapter board 220 is shown. Therefore, in Figure 6 The intermediate board 220 and / or the second PCB 212 can be shielded by the first PCB 211.

[0080] Figure 7 This is a view showing a heat dissipation structure that dissipates heat through an opening in the second support housing according to an embodiment.

[0081] According to an embodiment, a PBA 700 may be disposed within the internal space of a first support housing 120. The PBA 700 may include a first PCB (not shown), a second PCB 712, a first adapter plate 721, and / or a second adapter plate 722. In an embodiment, a first space 731 may be formed between a first end of the first adapter plate 721 and a second end of the second adapter plate 722, while a second space 732 may be formed between a third end of the first adapter plate 721 and a fourth end of the second adapter plate 722.

[0082] Figure 2a The descriptions of PBA 200, first PCB 211, second PCB 212, first adapter board 221, second adapter board 222, first space 231, and second space 232 described herein can be applied to, respectively. Figure 7 The PBA 700, first PCB (not shown), second PCB 712, first adapter board 721, second adapter board 722, first space 731 and second space 732 described herein.

[0083] According to an embodiment, like Figure 5a Similar to the second support housing 130 shown, the first support housing 120 may include a third opening 513 disposed on a portion adjacent to the first space 731 at a specific distance, and the first support housing 120 may include a fourth opening 514 disposed on a portion adjacent to the second space 732 at a specific distance. In an embodiment, the third opening 513 may have a first width W1, and the fourth opening 514 may have a second width W2. For example, the first width W1 and the second width W2 may be the same as each other. In an embodiment, a porous material may be disposed in the third opening 513 and / or the fourth opening 514. For example, a third film 513a made of a porous material may be disposed in the third opening 513. In another example, a fourth film 514a made of a porous material may be disposed in the fourth opening 514. The third film 513a and / or the fourth film 514a made of porous material allow air to pass through and can achieve waterproofing and / or dustproofing by preventing water or dust from entering the wearable electronic device 100 from the outside.

[0084] According to an embodiment, the first space 731 can be connected to the third opening 513 via a third connecting conduit 533, while the second space 732 can be connected to the fourth opening 514 via a fourth connecting conduit 534. In this embodiment, heat generated by multiple electronic components (e.g., electronic component 310) disposed on the second PCB 212 can be transferred to the outside through the third opening 513 and / or the fourth opening 514. For example, air in the PBA 700 with a relatively high temperature due to heat can be discharged to the outside of the wearable electronic device 100 through the first space 731 and the third opening 513. In this case, air with a relatively low temperature in the wearable electronic device 100 can flow into the adapter plate 220 through the second space 732 and the fourth opening 514. Therefore, the wearable electronic device 100 can efficiently transfer internal heat to the outside of the wearable electronic device 100.

[0085] According to an embodiment, Figure 7 The PBA 700 is positioned within the first support housing 120 and is positioned in... Figure 5aand Figure 5b The PBA 200s in the second support housing 130 shown may differ from each other at least partially. For example, at least one of the sizes of at least one space (e.g., first space 731 and second space 732) and at least one opening (e.g., first opening 511, second opening 512, third opening 513 and fourth opening 514) may vary depending on the number and / or size of at least one electronic component (e.g., electronic component 310) located inside the PBA 700.

[0086] Figure 8a This is a view showing a first support housing including an opening of another form according to another embodiment.

[0087] Figure 8b This is a three-dimensional view of the first supporting shell 120.

[0088] Figure 8c This is a view of the first supporting housing as seen from the -x direction.

[0089] Reference Figure 8a , Figure 8b and Figure 8c According to an embodiment, the first support housing 120 may include components formed at a specific distance from the PBA (e.g., Figure 7 A first opening 811 is formed on a portion of the first space 731 adjacent to the first space 732 of the PBA 700. Similarly, the first support housing 120 may include a second opening 812 formed on a portion of the second space 732 of the PBA 700 within a certain distance. In embodiments, each first opening 811 may have a width smaller than the width of the first opening 511 (e.g., a third width W3). In embodiments, each second opening 812 may have a width smaller than the width of the second opening 512 (e.g., a fourth width W4). For example, the third width W3 and the fourth width W4 may be the same as each other.

[0090] According to an embodiment, the height (h) of a portion of the first support housing 120 forming the first opening 811 may correspond to the height of the adapter plate 720, the first PCB 711, and / or the second PCB 712. For example, the height (h) of the first support housing 120 forming the first opening 811 may be substantially the same as the height of the adapter plate 720. In another example, the height (h) of the first support housing 120 forming the first opening 811 may be substantially the same as the connection height of the adapter plate 720, the first PCB 711, and the second PCB 712.

[0091] According to an embodiment, a porous material may be provided in the first opening 811 and / or the second opening 812. For example, a first film 811a made of a porous material may be provided in the first opening 811. In another example, a second film 812a made of a porous material may be provided in the second opening 812. The first film 811a and / or the second film 812a made of porous material allow air to pass through and can achieve waterproofing and / or dustproofing by preventing water or dust from entering the wearable electronic device 100 from the outside.

[0092] In this embodiment, heat generated by multiple electronic components (e.g., electronic component 310) disposed on the second PCB 712 can be transferred to the outside through the first opening 811 and / or the second opening 812. For example, air in the adapter plate 720 that has a relatively high temperature due to heat can be discharged to the outside of the wearable electronic device 100 through the first space 731 and the first opening 811. In this case, air with a relatively low temperature can flow into the adapter plate 720 through the second space 732 and the second opening 812. Therefore, the wearable electronic device 100 can efficiently transfer internal heat to the outside of the wearable electronic device 100.

[0093] Figure 9 This is a view showing a second support housing including an opening according to another embodiment.

[0094] According to an embodiment, a PBA (e.g., Figure 2a The second support housing 130 may include a third opening 813 formed on a portion adjacent to the first space 231 of the PBA 200 at a certain distance. Similarly, the second support housing 130 may include a fourth opening 814 formed on a portion adjacent to the second space 232 at a certain distance. In embodiments, each third opening 813 may have a width smaller than the width of the first opening 511 (e.g., a third width W3). Similarly, each fourth opening 814 may have a width smaller than the width of the second opening 512 (e.g., a fourth width W4). For example, the third width W3 and the fourth width W4 may be the same as each other.

[0095] According to an embodiment, a porous material may be provided in the third opening 813 and / or the fourth opening 814. For example, a third film 813a made of a porous material may be provided in the third opening 813. In another example, a fourth film 814a made of a porous material may be provided in the fourth opening 814. The third film 813a and / or the fourth film 814a formed of porous material allow air to pass through and can achieve waterproofing and / or dustproofing by preventing water or dust from entering the wearable electronic device 100 from the outside.

[0096] According to an embodiment, the method for transferring internal heat of the wearable electronic device 100 to the outside through the third opening 813 and / or the fourth opening 814 is similar to... Figure 9 The method described in [the previous section] is the same, so it will not be described further.

[0097] Figure 10 It is a view comparing the number of integrated adapter boards manufactured in a specific area with the number of separable adapter boards manufactured.

[0098] Reference Figure 10 With integrated adapter boards, eight adapter boards can be manufactured per specified area.

[0099] According to an embodiment, in the case of detachable adapter boards, 12 adapter boards can be manufactured per specified area. Therefore, when using detachable adapter boards, more adapter boards can be manufactured per the same area compared to the case of integrated adapter boards.

[0100] In the following text, the electronic device 1101 may refer to the wearable electronic device 100.

[0101] Figure 11 This is a block diagram illustrating an electronic device 1101 in a network environment 1100 according to an embodiment. (Refer to...) Figure 11 In network environment 1100, electronic device 1101 can communicate with electronic device 1102 via a first network 1198 (e.g., a short-range wireless communication network), or with at least one of electronic device 1104 or server 1108 via a second network 1199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 1101 can communicate with electronic device 1104 via server 1108. According to an embodiment, electronic device 1101 may include a processor 1120, a memory 1130, an input module 1150, a sound output module 1155, a display module 1160, an audio module 1170, a sensor module 1176, an interface 1177, a connection terminal 1178, a haptic module 1179, a camera module 1180, a power management module 1188, a battery 1189, a communication module 1190, a Subscriber Identity Module (SIM) 1196, or an antenna module 1197. In various embodiments, at least one of the aforementioned components (e.g., connection terminal 1178) may be omitted from electronic device 1101, or one or more other components may be added to electronic device 1101. In some embodiments, some of the aforementioned components (e.g., sensor module 1176, camera module 1180, or antenna module 1197) may be implemented as a single component (e.g., display module 1160).

[0102] Processor 120 may run software (e.g., program 1140) to control at least one other component (e.g., hardware or software component) of electronic device 1101 coupled to processor 1120, and may perform various data processing or calculations. According to embodiments, as at least part of the data processing or calculations, processor 1120 may store commands or data received from another component (e.g., sensor module 1176 or communication module 1190) in volatile memory 1132, process the commands or data stored in volatile memory 1132, and store the result data in non-volatile memory 1134. According to embodiments, processor 1120 may include a main processor 1121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 1123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 1121. For example, when electronic device 1101 includes a main processor 1121 and an auxiliary processor 1123, the auxiliary processor 1123 can be adapted to consume less power than the main processor 1121, or adapted to be dedicated to a specific function. The auxiliary processor 1123 can be implemented separately from the main processor 1121, or implemented as part of the main processor 1121.

[0103] When the main processor 1121 is inactive (e.g., in sleep) state, the auxiliary processor 1123 (rather than the main processor 1121) can control at least some of the functions or states associated with at least one component of the electronic device 1101 (e.g., display module 1160, sensor module 1176, or communication module 1190), or when the main processor 1121 is active (e.g., running an application), the auxiliary processor 1123 can work with the main processor 1121 to control at least some of the functions or states associated with at least one component of the electronic device 1101 (e.g., display module 1160, sensor module 1176, or communication module 1190). According to embodiments, the auxiliary processor 1123 (e.g., an image signal processor or a communication processor) can be implemented as part of another component (e.g., camera module 1180 or communication module 1190) functionally associated with the auxiliary processor 1123. According to embodiments, the auxiliary processor 1123 (e.g., a neural processing unit) can include hardware structures dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 1101 where the artificial intelligence is executed, or via a separate server (e.g., server 1108). Learning algorithms can include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural networks can be, but are not limited to, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), or deep Q-networks, or combinations of two or more of these. Additionally or optionally, the artificial intelligence model can include software structures in addition to hardware structures.

[0104] Memory 1130 may store various data used by at least one component of electronic device 1101 (e.g., processor 1120 or sensor module 1176). The various data may include, for example, software (e.g., program 1140) and input or output data for commands associated with it. Memory 1130 may include volatile memory 1132 or non-volatile memory 1134.

[0105] The program 1140 can be stored as software in the memory 1130, and the program 1140 may include, for example, an operating system (OS) 1142, middleware 1144, or application 1146.

[0106] Input module 1150 can receive commands or data from outside electronic device 1101 (e.g., from a user) that will be used by another component of electronic device 1101 (e.g., processor 1120). Input module 1150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0107] The audio output module 1155 can output audio signals to the outside of the electronic device 1101. The audio output module 1155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver can be implemented separately from the speaker, or as part of the speaker.

[0108] Display module 1160 can visually provide information to the outside of electronic device 1101 (e.g., to a user). Display module 1160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 1160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0109] The audio module 1170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 1170 can obtain sound via the input module 1150, or output sound via the sound output module 1155 or via headphones of an external electronic device (e.g., electronic device 1102) that is directly (e.g., wired) coupled to the electronic device 1101 or wirelessly coupled to it.

[0110] Sensor module 1176 can detect the operating state of electronic device 1101 (e.g., power or temperature) or the environmental state outside electronic device 1101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 1176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0111] Interface 1177 may support one or more specific protocols used to couple (e.g., wired) or wirelessly to electronic device 1101 with external electronic device (e.g., electronic device 1102). According to embodiments, interface 1177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0112] Connection 1178 may include a connector, via which electronic device 1101 may be physically connected to an external electronic device (e.g., electronic device 1102). According to embodiments, connection 1178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0113] The haptic module 1179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 1179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0114] Camera module 1180 can capture still or moving images. According to embodiments, camera module 1180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0115] The power management module 1188 can manage the power supply to the electronic device 1101. According to an embodiment, the power management module 1188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0116] Battery 1189 can power at least one component of electronic device 1101. According to an embodiment, battery 1189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0117] Communication module 1190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 1101 and external electronic devices (e.g., electronic device 1102, electronic device 1104, or server 1108), and perform communication via the established communication channel. Communication module 1190 may include one or more communication processors capable of operating independently of processor 1120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 1190 may include wireless communication module 1192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 1194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). A corresponding one of these communication modules can communicate via a first network 1198 (e.g., a short-range communication network, such as Bluetooth). TMThe wireless communication module 1192 can communicate with external electronic devices via a Wi-Fi Direct or Infrared Data Association (IrDA) network or a second network 1199 (e.g., a long-range communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 1192 can identify and verify the electronic device 1101 in the communication network (such as a first network 1198 or a second network 1199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1196.

[0118] Wireless communication module 1192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 1192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 1192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 1192 can support various requirements specified in electronic device 1101, external electronic device (e.g., electronic device 1104), or network system (e.g., second network 1199). According to an embodiment, the wireless communication module 1192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0119] Antenna module 1197 can transmit or receive signals or power to or from the exterior of electronic device 1101 (e.g., external electronic device). According to an embodiment, antenna module 1197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 1197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 1198 or a second network 1199) can be selected from the multiple antennas by, for example, communication module 1190 (e.g., wireless communication module 1192). Signals or power can then be transmitted or received between communication module 1190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 1197.

[0120] According to various embodiments, antenna module 1197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0121] At least some of the aforementioned components can be coupled to each other and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0122] According to an embodiment, commands or data can be sent or received between electronic device 1101 and external electronic device 1104 via server 1108 coupled to the second network 1199. Each of electronic device 1102 or electronic device 1104 can be a device of the same type as electronic device 1101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 1101 can be performed on one or more of external electronic devices 1102, external electronic devices 1104, or server 1108. For example, if electronic device 1101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 1101 may request the one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 1101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. The one or more external electronic devices receiving the request may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 1101. Electronic device 1101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 1101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 1104 may include an Internet of Things (IoT) device. Server 1108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, external electronic device 1104 or server 1108 may be included in a second network 1199. Electronic device 1101 can be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0123] The wearable electronic device 100 according to an embodiment may include a main housing 110, a first printed circuit board (PCB) 211, a second PCB 212 disposed parallel to the first PCB 211, a first adapter plate 221, and a second adapter plate 222. The housing 110 may include at least one first opening 511 formed on a first portion thereof, and the first adapter plate 221 and the second adapter plate 222 may be disposed between the first PCB 211 and the second PCB 212. The first adapter plate 221 and the second adapter plate 222 may be configured such that a first end 221a of the first adapter plate 221 and a second end 222a of the second adapter plate 222 facing the first end 221a are spaced apart from each other by a first specified distance or a longer distance, and a first space 231 between the first end 221a and the second end 222a may be connected to at least one first opening 511 of the main housing 110.

[0124] According to an embodiment, the wearable electronic device 100 may further include a first connection conduit 531 for connecting the first space 231 and at least one first opening 511.

[0125] According to an embodiment, the wearable electronic device 100 may further include a first heat-blocking member 541 and a second heat-blocking member 542 disposed on the side surface of the first connecting conduit 531.

[0126] According to an embodiment, the main housing 110 may include a first opening 811 formed on a first portion and having a second width W2.

[0127] According to an embodiment, the main housing 110 may include a first opening 511 formed on the first portion and having a first width W1.

[0128] According to an embodiment, the third end 221b of the first adapter plate 221 can be configured to be spaced apart from the fourth end 222b of the second adapter plate 222 facing the third end 221b by a second specified distance or a longer distance, and a second space 232 can be formed between the third end 221b and the fourth end 222b.

[0129] According to an embodiment, the main housing 110 may further include at least one second opening 512 formed on its second portion.

[0130] According to an embodiment, the wearable electronic device 100 may further include a second connection conduit 532 for connecting the second space 232 and at least one second opening 512.

[0131] According to an embodiment, the wearable electronic device 100 may further include at least one electronic component 310 disposed on the first PCB 211, and a shielding member 321 disposed adjacent to the first PCB 211.

[0132] According to an embodiment, the wearable electronic device 100 may further include a heat transfer member 322 disposed between at least one electronic component 310 and a shielding member 321.

[0133] According to an embodiment, the wearable electronic device 100 may also include a heat sink 324 disposed adjacent to the first PCB 211.

[0134] According to an embodiment, the wearable electronic device 100 may also include a heat sink 323 disposed adjacent to the first PCB 211.

[0135] According to an embodiment, the wearable electronic device 100 may also include a heat sink disposed adjacent to the first PCB 211.

[0136] According to an embodiment, the wearable electronic device 100 may also include a thin film 511a disposed in at least one first opening 511 and formed of a porous material.

[0137] According to an embodiment, the wearable electronic device 100 may further include a third PCB 213 disposed parallel to the second PCB 212, and may also include a third adapter board 241 and a fourth adapter board 242. The third adapter board 241 and the fourth adapter board 242 may be disposed between the second PCB 212 and the third PCB 213, and the third adapter board 241 and the fourth adapter board 242 may be configured such that the fifth end of the third adapter board 241 and the sixth end of the fourth adapter board 242 facing the fifth end are spaced apart from each other by a third specified distance or a longer distance.

[0138] According to an embodiment, the wearable electronic device 100 may include a first PCB 211, a second PCB 212 disposed parallel to the first PCB 211, a first adapter plate 221 and a second adapter plate 222. The first adapter plate 221 and the second adapter plate 222 may be disposed between the first PCB 211 and the second PCB 212. The first adapter plate 221 and the second adapter plate 222 may be configured such that the first end 221a of the first adapter plate 221 and the second end 222a of the second adapter plate 222 facing the first end 221a are spaced apart from each other by a first specified distance or a longer distance. The third end 221b of the first adapter plate 221 may be configured to be spaced apart from the fourth end 222b of the second adapter plate 222 facing the third end 221b of the first adapter plate 221 by a second specified distance or a longer distance.

[0139] According to an embodiment, the wearable electronic device 100 may further include a main housing 110 forming the outer surface of the wearable electronic device 100. The main housing 110 may include: at least one first opening 511 formed on a first portion adjacent to a first space 231 between a first end 221a and a second end 222a; and at least one second opening 512 formed on a second portion adjacent to a second space 232 between a third end and a fourth end.

[0140] According to an embodiment, the wearable electronic device 100 may further include at least one electronic component 310 disposed on the first PCB 211, and a shielding member 321 disposed adjacent to the first PCB 211.

[0141] According to an embodiment, the wearable electronic device 100 may further include a heat transfer member 322 disposed between at least one electronic component 310 and a shielding member 321.

[0142] According to an embodiment, the wearable electronic device 100 may also include a heat sink 324, and the heat sink 324 may be disposed adjacent to the first PCB 211.

[0143] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0144] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the singular form of a noun corresponding to an item may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether or not the terms “operably” or “communically” are used, if an element (e.g., a first element) is referred to as “coupled to another element (e.g., a second element),” “coupled to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) coupled to the other element, wirelessly connected to the other element, or coupled to the other element via a third element.

[0145] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0146] Some embodiments set forth herein may be implemented as software (e.g., program 1140) comprising one or more instructions readable by a machine (e.g., electronic device 1101) stored in a storage medium (e.g., internal memory 1136 or external memory 1138). For example, under the control of a processor (e.g., processor 1120) of the machine (e.g., electronic device 1101), the processor may invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0147] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be distributed online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If it is distributed online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0148] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. A wearable electronic device, the wearable electronic device comprising: A housing, the housing including a first portion having at least one first opening and a first connecting conduit formed therein; A first printed circuit board (PCB) is disposed within the housing; The second PCB is disposed within the housing and is arranged parallel to the first PCB; First adapter board; as well as Second adapter board, The first adapter board and the second adapter board are disposed between the first PCB and the second PCB. Wherein, the first end of the first adapter plate and the second end of the second adapter plate facing the first end are spaced apart by a first specified distance, and The first space between the first end and the second end is connected to the at least one first opening of the housing via the first connecting pipe.

2. The wearable electronic device according to claim 1, further comprising: A heat-barrier component is disposed on the side surface of the first connecting pipe.

3. The wearable electronic device according to claim 1, wherein, The at least one first opening includes a plurality of openings formed in the first portion and having a first width.

4. The wearable electronic device according to claim 1, wherein, The at least one first opening includes an opening formed in the first portion and having a second width.

5. The wearable electronic device according to claim 1, wherein, The third end of the first adapter plate is configured to be spaced apart from the fourth end of the second adapter plate by a second specified distance. Wherein, the third end and the fourth end face each other, and A second space is formed between the third end and the fourth end.

6. The wearable electronic device according to claim 5, wherein, The housing also includes a second portion in which at least one second opening and a second connecting pipe are formed.

7. The wearable electronic device according to claim 6, wherein, The second connecting conduit is configured to connect the second space and the at least one second opening.

8. The wearable electronic device according to claim 1, further comprising: At least one electronic component, said at least one electronic component being disposed on the first PCB; as well as A shielding component is disposed adjacent to the first PCB.

9. The wearable electronic device according to claim 8, further comprising: A heat transfer component is disposed between the at least one electronic component and the shielding component.

10. The wearable electronic device according to claim 1, further comprising: A heat sink is disposed adjacent to the first PCB.

11. The wearable electronic device according to claim 1, further comprising: A heat sink is disposed adjacent to the first PCB.

12. The wearable electronic device according to claim 1, further comprising: A heat sink is disposed adjacent to the first PCB.

13. The wearable electronic device of claim 1, further comprising a porous material disposed in the at least one first opening.

14. The wearable electronic device according to claim 1, further comprising: The third PCB is arranged parallel to the second PCB. Third adapter board; as well as Fourth adapter board, The third adapter board and the fourth adapter board are disposed between the second PCB and the third PCB, and The fifth end of the third adapter plate is spaced a third specified distance from the sixth end of the fourth adapter plate facing the fifth end.

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