Hybrid chip cleaning apparatus and cleaning method

Abstract

This invention proposes a cleaning device and method for hybrid chips. The cleaning device includes a sprayer, a carrier plate, and a cleaning brush. The sprayer sprays cleaning fluid. The carrier plate is movably disposed within the cleaning fluid spraying area of ​​the sprayer and has multiple receiving slots for holding the hybrid chips to be cleaned. The cleaning brush abuts against and moves relative to the carrier plate to clean the chips. This invention enables batch cleaning of hybrid chips, significantly improving work efficiency; it effectively reduces the number of chip handling operations, lowers the probability of damage, and increases the yield; the cleaning device and technology used are low-cost and easy to operate; the design of the chip carrier plate is superior to commonly used industrial vacuum chucks, effectively preventing cleaning fluid from being sucked into the vacuum chuck, thus reducing the associated labor and time costs.

Description

Technical Field

[0001] This invention relates to the field of electronic component cleaning technology, and in particular to a cleaning apparatus and method for hybrid chips. Background Technology

[0002] With the rapid increase in demands for the size and performance of electronic components in modern society, the fabrication of hybrid device structures using flip-chip interconnect technology has become one of the most effective solutions for miniaturizing size and improving performance. The main body of a hybrid infrared detector consists of an infrared chip and a readout circuit, interconnected via indium pillars. Hybrid infrared chips have become an important development direction in semiconductor fabrication processes and are widely used in infrared detectors, MEMS, and other fields.

[0003] Cleaning is a crucial step in the thinning process of infrared detector chips, as it increases the cleanliness of the chip surface and determines the yield of subsequent processes such as etching. Currently, for cleaning hybrid infrared chips, process engineers often use tweezers to individually pick up the chips and repeatedly immerse them in various cleaning solutions, followed by wiping with long-fiber cotton. This manual operation increases the probability of chip damage, leading to reduced process efficiency. Furthermore, most commercially available cleaning machines for hybrid detector chips currently use a spray-based non-contact cleaning method, which has low cleaning efficiency and poor control of surface defects after cleaning. Summary of the Invention

[0004] The technical problem to be solved by the present invention is how to improve the cleaning effect of hybrid chips. The present invention proposes a cleaning device and cleaning method for hybrid chips.

[0005] A cleaning apparatus for hybrid chips according to an embodiment of the present invention includes:

[0006] Sprayer, used to spray cleaning solution;

[0007] A carrier plate is movably disposed in the cleaning liquid spraying area of ​​the sprayer, and the carrier plate is provided with multiple receiving slots for holding the hybrid chips to be cleaned.

[0008] A cleaning brush abuts against and moves relative to the carrier board to clean the chip to be cleaned.

[0009] According to some embodiments of the present invention, the carrier plate includes a main body, the receiving groove is disposed on the surface of the main body, the opening in the depth direction of the receiving groove is provided with a blocking portion to form a constriction, and the receiving groove has an opening in the length direction. The hybrid chip to be cleaned is placed in the receiving groove through the opening in the length direction of the receiving groove, the chip of the hybrid chip is exposed from the constriction, and the readout circuit of the hybrid chip is at least partially blocked by the blocking portion.

[0010] In some embodiments of the present invention, the surface of the main body is provided with a plurality of the receiving grooves.

[0011] According to some embodiments of the present invention, the receiving groove is provided on both opposite surfaces of the main body.

[0012] In some embodiments of the present invention, the cleaning device further includes a fixing strip, which at least partially abuts against the shielding portion and the readout circuit to fix the hybrid chip to be cleaned in the receiving groove.

[0013] According to some embodiments of the present invention, the cleaning brush rolls on the surface of the carrier plate, the cleaning brush comprising:

[0014] cylindrical body;

[0015] Brush bristles are evenly distributed on the outer peripheral wall of the cylinder.

[0016] In some embodiments of the invention, there are two cleaning brushes, which roll in opposite directions on two opposite surfaces of the carrier plate.

[0017] According to some embodiments of the present invention, the hybrid chip to be cleaned is a hybrid infrared chip.

[0018] According to an embodiment of the present invention, a cleaning method for hybrid chips is provided, wherein the cleaning method uses a hybrid chip cleaning apparatus as described above to clean the hybrid chip.

[0019] According to some embodiments of the present invention, the cleaning method includes:

[0020] S100, the hybrid chip to be cleaned is initially fixed by tweezers into the receiving groove, and then fixed a second time by using fixing adhesive strips;

[0021] S200, turn on the sprayer to make the cleaning liquid evenly cover the carrier plate;

[0022] S300 causes the carrier plate to move parallel at a preset speed, while the two cleaning brushes move in parallel with opposite directions.

[0023] S400, until the cleaning process standard of the hybrid chip to be cleaned is met, and the cleaning of the hybrid chip to be cleaned is completed.

[0024] Compared with existing technologies, the present invention has the following technical advantages:

[0025] 1) Enables batch cleaning of hybrid chips, significantly improving work efficiency; 2) Effectively reduces the number of chip handling operations, lowers the probability of damage, and increases the yield; 3) The equipment and technology used are inexpensive and easy to operate; 4) The design concept of the chip carrier board is superior to that of commonly used industrial vacuum chucks, which can effectively prevent cleaning fluid from being sucked into the vacuum chuck, reducing the resulting labor and time costs. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a cleaning apparatus for hybrid chips according to an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of a hybrid chip to be cleaned being loaded onto a carrier board according to an embodiment of the present invention.

[0028] Figure 3 This is a front view of the carrier plate of the cleaning apparatus according to an embodiment of the present invention;

[0029] Figure 4 for Figure 3 The diagram shows the AA interface.

[0030] Figure 5 This is a schematic diagram of the structure of the cleaning brush of the cleaning device according to an embodiment of the present invention.

[0031] Figure label:

[0032] Cleaning device 100,

[0033] Sprayer 10,

[0034] Carrier plate 20, main body 210, receiving groove 211, shielding part 220, depth direction opening A1, length direction opening A2.

[0035] Cleaning brush 30, cylinder 310, bristles 320, hybrid chip 40, chip 410, readout circuit 420, fixing strip 50. Detailed Implementation

[0036] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0037] The steps described in the specification and the flowcharts in the accompanying drawings of this invention are not necessarily to be strictly followed according to the step numbers; the execution order of the steps can be changed. Furthermore, certain steps can be omitted, multiple steps can be combined into one step, and / or one step can be broken down into multiple steps.

[0038] The cleaning apparatus 100 and cleaning method for hybrid chips proposed in this invention can solve the following technical problems:

[0039] 1) The existing cleaning process for hybrid infrared chips involves soaking and wiping a large number of chips in sequence, resulting in low work efficiency and poor process stability; 2) Repeated handling increases the probability of chip damage; 3) Manual cleaning processes and non-contact cleaning machines have poor cleaning effects and reliability; 4) The baskets used to hold the chips are mostly vacuum suction cups, which are prone to falling off under the spray of cleaning solution.

[0040] like Figure 1 As shown, the cleaning apparatus 100 for the hybrid chip 40 according to an embodiment of the present invention includes: a sprayer 10, a carrier plate 20, and a cleaning brush 30.

[0041] like Figure 1 As shown, the sprayer 10 is used to spray cleaning fluid. A carrier plate 20 is movably disposed in the cleaning fluid spraying area of ​​the sprayer 10, and the carrier plate 20 has multiple receiving slots 211 for holding the hybrid chips 40 to be cleaned. Figure 1 As shown, the sprayer 10 sprays cleaning fluid evenly downwards. The carrier plate 20, which holds the hybrid chip 40 to be cleaned, can move horizontally at a preset speed below the sprayer 10, so that the cleaning fluid is evenly sprayed onto the hybrid chip 40 to be cleaned. The cleaning brush 30 abuts against the carrier plate 20 and moves relative to it to clean the hybrid chip 40 to be cleaned.

[0042] The hybrid chip cleaning apparatus 100 according to an embodiment of the present invention can clean multiple hybrid chips 40 to be cleaned at once by placing them on a carrier plate 20, thereby achieving batch cleaning of the hybrid chips 40, improving cleaning efficiency, reducing labor costs, and minimizing damage to the hybrid chips 40 to be cleaned. Using a cleaning brush 30 can improve the cleaning effect of the hybrid chips 40 to be cleaned. Moreover, the cleaning apparatus 100 has a simple structure and low cost.

[0043] According to some embodiments of the present invention, such as Figure 2 As shown, the carrier plate 20 includes a main body 210, a receiving groove 211 is provided on the surface of the main body 210, and the opening in the depth direction of the receiving groove 211 (e.g.) Figure 2 The depth-direction opening A1 shown is provided with a blocking portion 220 to form a narrowing, and the receiving groove 211 has an opening in the length direction (e.g., Figure 2 As shown in the longitudinal opening A2), the hybrid chip 40 to be cleaned is placed in the receiving groove 211 through the longitudinal opening. The chip 410 of the hybrid chip 40 protrudes from the constriction, meaning that the surface of the chip 410 can extend from the depth opening A1 of the receiving groove 211 to facilitate cleaning of the chip 410. The readout circuit 420 of the hybrid chip 40 is at least partially blocked by the shielding part 220.

[0044] In some embodiments of the present invention, the surface of the main body 210 is provided with a plurality of receiving grooves 211. For example... Figure 2 and Figure 3 As shown, the surface of the main body 210 may be provided with two receiving grooves 211. Of course, the surface of the main body 210 may also be provided with three or more receiving grooves 211 to increase the number of hybrid chips 40 to be cleaned at one time, thereby realizing batch cleaning of the hybrid chips 40 to be cleaned.

[0045] According to some embodiments of the present invention, receiving grooves 211 are provided on both opposite surfaces of the main body 210. This further increases the amount of hybrid chip 40 that can be cleaned in a single cleaning cycle, thereby improving the cleaning efficiency of the hybrid chip 40.

[0046] In some embodiments of the present invention, such as Figure 2 As shown, the cleaning device 100 also includes a fixing strip 50, which at least partially abuts between the shielding part 220 and the readout circuit 420 to fix the hybrid chip 40 to be cleaned in the receiving groove 211.

[0047] It should be noted that the fixing strip 50 can be elastic. The fixing strip 50 can be provided at both ends of the upper surface of the hybrid chip 40 to be cleaned, so that the fixing strip 50 is clamped between the shielding part 220 and the upper surface of the read circuit 420, so as to reliably and undamagedly fix the hybrid chip 40 to be cleaned in the preset position of the receiving groove 211.

[0048] like Figure 5 As shown, according to some embodiments of the present invention, the cleaning brush 30 rolls on the surface of the carrier plate 20. The cleaning brush 30 includes a cylinder 310 and bristles 320, with the bristles 320 evenly distributed on the outer peripheral wall of the cylinder 310.

[0049] Combination Figure 1 As shown, in some embodiments of the present invention, there are two cleaning brushes 30, which roll in opposite directions on two opposite surfaces of the carrier plate 20. This improves both the smoothness of the carrier plate 20's movement and the cleaning effect of the cleaning brushes 30 on the hybrid chip 40 to be cleaned.

[0050] According to some embodiments of the present invention, the hybrid chip 40 to be cleaned is a hybrid infrared chip. It should be noted that the cleaning device 100 can be used for cleaning various hybrid devices such as MEMS, infrared detectors, and ultraviolet detectors, to improve cleaning efficiency and reduce labor costs.

[0051] According to the cleaning method of the hybrid chip 40 of the present invention, the cleaning method uses the cleaning device of the hybrid chip 40 as described above to clean the hybrid chip 40.

[0052] According to some embodiments of the present invention, the cleaning method includes:

[0053] S100, the hybrid chip 40 to be cleaned is initially fixed in the receiving groove 211 with tweezers, and then fixed a second time with the fixing strip 50.

[0054] S200, turn on the sprayer 10 to make the cleaning solution evenly cover the carrier plate 20;

[0055] S300, causing the carrier plate 20 to move parallel at a preset speed, while the two cleaning brushes 30 move in parallel with opposite directions;

[0056] S400, until the cleaning process standard of the hybrid chip 40 to be cleaned is met, and the cleaning of the hybrid chip 40 to be cleaned is completed.

[0057] Compared with existing technologies, the present invention has the following technical advantages:

[0058] 1) Enables batch cleaning of hybrid chips 40, significantly improving work efficiency; 2) Effectively reduces the number of chip handling operations, lowers the probability of damage, and increases the yield; 3) The equipment and technology used are inexpensive and easy to operate; 4) The design concept of the chip carrier board 20 is superior to commonly used industrial vacuum chucks, which can effectively prevent cleaning fluid from being sucked into the vacuum chuck, reducing the resulting labor and time costs.

[0059] The cleaning apparatus 100 and cleaning method for the hybrid chip 40 according to the present invention will now be described in detail with reference to the accompanying drawings and a specific embodiment. It is to be understood that the following description is merely exemplary and should not be construed as a specific limitation of the present invention.

[0060] like Figure 1 As shown, the cleaning device 100 mainly includes three parts: a sprayer 10 that holds cleaning fluid, a chip carrier board 20 (the number can be adjusted according to the actual use) and two cleaning brushes 30.

[0061] Among them, such as Figures 2-4 As shown, the chip carrier 20 includes a main body 210, on which two or more receiving grooves 211 are provided, and the receiving grooves 211 have a shielding part 220 at the opening A1 in the depth direction. The hybrid chip 40 to be cleaned is fixed in the receiving groove 211 by a fixing adhesive strip 50.

[0062] The number and size of the receiving slot 211 and the fixing strip 50 can be adjusted according to the actual use. The chip carrier board 20 device uses the receiving slot 211 and the shielding part 220 to initially fix the chip and the readout circuit 420 respectively, and the fixing strip 50 to fix the chip a second time. The length of the receiving slot 211 determines the number of hybrid chips 40 to be cleaned.

[0063] Figure 3 In the figure, L represents the length of the chip carrier board 20, which can be adjusted according to the actual usage. Figure 4 In the diagram, N represents the length of the hybrid chip 40, and M represents the length of the readout circuit 420. N and M can be adjusted according to actual usage. This device can perform the cleaning process of multiple chips at once without repeated handling and transport.

[0064] Among them, cleaning brush 30 is a polyvinyl alcohol (PVA) brush, and the structure of the PVA brush is as follows: Figure 5 As shown.

[0065] This cleaning device is inexpensive, easy to operate, and has a controllable process. It can be widely used in the fabrication of many hybrid devices such as MEMS, infrared detection, and ultraviolet detection, which can greatly improve process efficiency and save manpower and time costs.

[0066] In the cleaning process of hybrid chip 40, the cleaning device 100 is used as follows:

[0067] S100, the hybrid chip 40 to be cleaned is clamped into the receiving groove 211 of the chip carrier 20 with tweezers for initial fixation, and fixing strips 50 are used on both sides of each hybrid chip 40 to be cleaned to ensure that there are fixing strips 50 on both the left and right ends of each hybrid chip 40 to be cleaned.

[0068] S200, open the spray head to evenly spray the cleaning solution onto the chip carrier 20. The composition of the cleaning solution can be adjusted according to the actual usage.

[0069] S300 causes the chip carrier 20 to move parallel at a certain speed, while the two PVA brushes move in parallel with opposite directions. During this process, there is pressure between the PVA brushes and the chip carrier 20, and the pressure is adjusted according to the actual use.

[0070] S400, repeat step S300 until the cleaning process standard is met.

[0071] Through the description of specific embodiments, a more in-depth and specific understanding should be gained of the technical means and effects adopted by the present invention to achieve the intended purpose. However, the accompanying drawings are only provided for reference and illustration and are not intended to limit the present invention.

Claims

1. A cleaning apparatus for hybrid chips, characterized in that, include: Sprayer, used to spray cleaning solution; A carrier plate is movably disposed in the cleaning liquid spraying area of ​​the sprayer. The carrier plate is provided with multiple receiving slots for holding hybrid infrared chips to be cleaned. The hybrid infrared chip includes an infrared chip and a readout circuit interconnected by indium pillars. The cleaning brush, which is a polyvinyl alcohol (PVA) brush, abuts against and moves relative to the carrier plate to clean the hybrid infrared chip to be cleaned. The carrier plate includes a main body, and the receiving groove is disposed on the surface of the main body. The opening in the depth direction of the receiving groove is provided with a shielding part to form a narrow opening, and the receiving groove has an opening in the length direction. The hybrid infrared chip to be cleaned is placed in the receiving groove through the opening in the length direction of the receiving groove. The infrared chip is exposed from the narrow opening. The readout circuit is completely shielded by the shielding part, and the cleaning brush only contacts the exposed infrared chip and does not contact the readout circuit.

2. The cleaning apparatus for hybrid chips according to claim 1, characterized in that, The surface of the main body is provided with multiple receiving grooves.

3. The cleaning apparatus for hybrid chips according to claim 1, characterized in that, The receiving groove is provided on both opposite surfaces of the main body.

4. The cleaning apparatus for hybrid chips according to claim 1, characterized in that, The cleaning device further includes a fixing strip, which at least partially abuts against the shielding part and the readout circuit to fix the hybrid infrared chip to be cleaned in the receiving groove.

5. The cleaning apparatus for hybrid chips according to claim 1, characterized in that, The cleaning brush rolls on the surface of the carrier plate, and the cleaning brush includes: cylindrical body; Brush bristles are evenly distributed on the outer peripheral wall of the cylinder.

6. The cleaning apparatus for hybrid chips according to claim 5, characterized in that, There are two cleaning brushes, which roll in opposite directions on two opposite surfaces of the carrier plate.

7. A cleaning method for hybrid chips, characterized in that, The cleaning method uses the cleaning apparatus for hybrid chips as described in any one of claims 1-6 to clean the hybrid infrared chips.

8. The cleaning method for hybrid chips according to claim 7, characterized in that, The cleaning method includes: S100, the hybrid infrared chip to be cleaned is initially fixed by tweezers into the receiving groove, and then a flexible fixing strip is used to stop between the shielding part and the readout circuit for secondary fixation, so that the infrared chip is exposed from the constriction and the readout circuit is completely blocked by the shielding part. S200, turn on the sprayer so that the cleaning liquid can be evenly covered on the carrier plate and the exposed infrared chip surface on the carrier plate. S300 causes the carrier plate to move parallel at a preset speed, while two polyvinyl alcohol (PVA) brushes move in parallel with opposite directions, and the PVA brushes only contact the exposed infrared chip surface for brushing. S400, until the cleaning process standard of the hybrid chip to be cleaned is met, and the cleaning of the hybrid chip to be cleaned is completed.

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