Method for manufacturing a heat exchanger plate and hot forming die

Abstract

The invention relates to a method for producing a heat exchanger plate and a hot forming tool. The hot forming tool has a lower tool and an upper tool. The lower tool and the upper tool have spacing elements which are yieldably arranged therein. A plate stack is placed into the hot forming tool, positioned on the spacing elements in the lower tool. On closing the hot forming tool, the spacing elements of the upper tool come into contact with the plate stack. On continuing the closing movement, the spacing elements are displaced and the plate stack is clamped between the lower tool and the upper tool. The plate stack is heated and the intermediate spaces between the plate elements are loaded with internal pressure by introducing a process medium. Thereby, the forming of the channels takes place by means of internal pressure technology. In the channel forming, the channel cavities of the hot forming tool are vented. The plate elements are joined by brazing technology. On opening the hot forming tool, the spacing elements are removed from the lower tool and the upper tool and the plate stack is held and cooled. The plate stack can be removed after complete opening of the hot forming tool.

Description

Technical Field

[0001] This invention relates to a method for manufacturing heat transfer plate and a thermoforming die. Background Technology

[0002] The heat transfer plates of the type described above are, in particular, cooling plates used for battery cooling.

[0003] In electric vehicles, rechargeable batteries are used, whether the vehicle is a pure electric vehicle, a hybrid vehicle, or a plug-in hybrid vehicle. These batteries have a plurality of electrical storage units connected in series and / or parallel. Here, the electrical storage units can be combined to form battery modules, and the battery modules constitute the battery.

[0004] Batteries are sensitive to different temperature distributions, which can lead to overheating and premature aging. Cooling devices are used to maintain the battery within an optimized temperature range. These cooling devices should ensure that unwanted residual heat generated during battery operation is dissipated from the battery and that the battery temperature is adjusted to a uniform level.

[0005] Heat transfer plates are used to cool batteries or battery modules, and these plates are in direct or indirect contact with the batteries. Cooling fluid flows through the heat transfer plates. A heat transfer plate typically comprises two plate elements that are assembled and joined to define one or more channels between them. Typically, heat transfer plates are made of lightweight metal sheets, particularly aluminum sheets. Depending on the structural type or power rating, the heat transfer plates are also arranged above and below the batteries for cooling purposes.

[0006] Cooling devices for vehicle batteries, including heat exchanger plates or cooling plates, are considered prior art under EP 2 828 922 B1.

[0007] A cooling plate is known from DE 10 2015 216 719 A1. A cooling channel and an inlet and outlet communicating with it are provided in the cooling plate. Connecting pipes are respectively provided in the inlet and outlet regions, the connecting pipes being clamped between the upper and lower parts of the cooling plate.

[0008] Cooling plates for battery cooling, including structural plates and cover plates, are described in DE 10 2014 217 728 A1.

[0009] EP 3 771 878 A2 discloses a method for manufacturing heat transfer plate or plate heat exchanger. For this purpose, a plate stack is provided, the plate stack being formed from at least two plate elements of metallic material together with brazing material disposed between the plate elements. The plate stack is then heated to a first temperature and subsequently placed in a mold having cavities for setting channel structures. The channel structures are formed by forming at least one plate element using a localized internal pressure technique. Subsequently, the plate stack is heated to a second temperature and the plate elements of the plate stack are brazed together on their abutting surfaces. Summary of the Invention

[0010] Based on existing technology, the objective of this invention is to improve and more efficiently construct a method for manufacturing heat transfer plates and to demonstrate a thermoforming die for manufacturing heat transfer plates that is technologically improved.

[0011] The solution to the task according to the method lies in the method described in this invention.

[0012] The method for manufacturing heat transfer plate (especially cooling plate) includes the following steps:

[0013] - Provides a plate stack, the stack being formed of at least two plate elements made of metallic material together with brazing material disposed between the plate elements;

[0014] - The plate stack is transported into a heated thermoforming die, the thermoforming die including a lower die and an upper die and a contact surface having at least one channel cavity;

[0015] - Place the plate stack into a thermoforming mold, wherein the plate stack is positioned on a spacer element, the spacer element being receptively disposed in a lower mold and extending relative to the contact surface of the lower mold;

[0016] - Close the thermoforming mold, wherein the lower mold and the upper mold are displaced relative to each other;

[0017] - Continue the closing motion and clamp the plate stack between the lower mold and the upper mold, wherein the spacer element in the lower mold is displaced into the lower mold and the plate stack reaches surface contact between the lower mold and the upper mold;

[0018] -Heat the stacked plates, and

[0019] - A channel is formed by introducing an internal pressure medium to load the intermediate space between the plate elements of a plate stack and by forming at least one plate element region into a channel cavity using an internal pressure technique, wherein air is vented from the channel cavity, and

[0020] - The brazing material between the board components will be melted and the board components will be brazed together to the mating surfaces of the board components;

[0021] - Open the thermoforming mold, wherein the lower mold and the upper mold are displaced relative to each other, wherein the spacer element in the lower mold is moved out of the lower mold, thereby holding the plate stack on the spacer element of the lower mold with a gap;

[0022] - Keep and cool the plate stacks;

[0023] - Open the thermoforming mold until it is in the removal position and remove the heat transfer plate from the thermoforming mold.

[0024] The method according to the present invention is technically improved and enables the high-quality manufacturing of heat transfer plates in a highly efficient manner. The manufacturing of the heat transfer plates is optimized both in terms of production technology and for their operational use.

[0025] The thermoforming die has a heatable lower die and a heatable upper die. To manufacture the heat transfer plate, the thermoforming die is heated to the die temperature.

[0026] A plate stack is formed from at least two plate elements made of metallic materials. A brazing material is placed or applied between the plate elements.

[0027] During or after the formation of the plate stack, the plate stack may be provided with a fluid connector in the form of a connecting pipe. The connecting pipe may be inserted, for example, through a connection opening in one of the plate elements.

[0028] The plate stack is then placed into the forming mold. Here, the plate stack is positioned on the spacer element. The plate stack therefore does not come into contact with the heated and temperature-controlled lower mold upon placement. The spacer element protrudes relative to the contact surface of the lower mold. This measure is an advantageous aspect of the method according to the invention and significantly contributes to the efficient manufacturing of heat transfer plates.

[0029] After the plate stack is set and positioned on the spacer element, the thermoforming die closes. The lower and upper dies are thus displaced relative to each other. Specifically, the upper die descends onto the lower die. During the closing motion, the plate stack is received and clamped between the lower and upper dies. As the closing motion continues, the spacer element in the lower die moves into the lower die, where the plate stack reaches surface contact between the lower and upper dies.

[0030] The stacked plates are heated in a thermoforming mold.

[0031] Pressure is applied within the intermediate space between the plate elements of the plate stack. The intermediate space is the area between the plate elements that are placed close to each other, wherein a gap is not necessarily required between the plate elements in the area of ​​the intermediate space. The application of internal pressure to the intermediate space is carried out by introducing an action medium into the intermediate space. Here, the channel is formed by forming an internal pressure technique in a channel cavity in one or more contact surfaces of the thermoforming die through at least one plate element area. During the forming and formation of the channel by the internal pressure technique, the channel cavity is vented. The venting causes pressure compensation. This measure is also an important and advantageous aspect of the method according to the invention.

[0032] Due to the mold temperature of the forming mold, the brazing material melts between the board components and the board components are brazed together to the mating surfaces of the board components.

[0033] The thermoforming die then opens, wherein the lower die and the upper die move relative to each other and spaced apart. During the opening movement, the spacer element in the lower die moves out of the lower die, thereby holding the plate stack at a distance from the lower die on the spacer element. The plate stack is lifted by the spacer element in the lower die.

[0034] The joined, hot plate stacks are held and cooled on the spacer element. The thermoforming die is then opened further in parallel until it reaches the removal position. The heat transfer plate can then be removed from the thermoforming die.

[0035] Following the forming process, the retention of the plate stack on the spacer element is also an advantageous aspect of the method according to the invention. The plate stack is placed on the spacer element after the thermoforming die is opened. The plate stack is spaced from the lower die, which is at temperature, by the spacer element. The spacer element moves automatically or sequentially from the lower die when the thermoforming die is opened. The plate stack is lifted smoothly and meteredly from the lower die.

[0036] The molten brazing material between the sheet components can be further cooled. This prevents uncontrolled movement of the sheet stacks when the thermoforming die is opened and eliminates the risk of sheet components moving, for example, due to adhesion.

[0037] Particularly advantageously, the upper die also has a spacer element, which is receptively disposed within the upper die. The spacer element of the upper die extends relative to the contact surface of the upper die. When the plate stack is placed into the thermoforming die, the plate stack is positioned on the spacer element in the lower die. The plate stack is positioned with a distance between itself and the spacer element in the lower die. When the thermoforming die is closed, the spacer element of the upper die, extending relative to the contact surface of the upper die, comes into contact with the plate stack.

[0038] The spacer element in the upper mold is moved into the upper mold when the thermoforming mold is closed.

[0039] When the thermoforming die is opened, the spacer element in the upper die moves out of the upper die. Here, the spacer element contacts the plate stack. The spacer element in the upper die contacts the plate stack and holds the heated plate stack in place.

[0040] Not only the spacer elements in the lower mold but also those in the upper mold are designed to move automatically from their receiving portions in the lower or upper mold. For this purpose, the spacer elements are equipped with actuators or are movable via drive elements. For example, the spacer elements can work in conjunction with spring elements. The actuation device, including actuators, can have operating bars that extend longitudinally or laterally through the lower and / or upper molds, which interact with the spacer elements arranged in a sequence. The operating bars themselves are operated by linear drive devices, particularly piston-cylinder units.

[0041] The thermoforming die is heated to a die temperature at which not only the forming process but also the brazing process is carried out. Specifically, the die temperature is between 540°C and 670°C. Particularly advantageously, the die temperature is between 550°C and 640°C.

[0042] In another aspect of the invention, the plate element is provided with a fluid connector before forming the plate stack, during forming the plate stack, or for the formed plate stack.

[0043] The working medium used for channel shaping is especially introduced through fluid joints.

[0044] The plate stack is clamped between a lower and upper die during the manufacture of the heat transfer plate. In the forming and configuration of the channel using internal pressure technology, the plate stack is sealed circumferentially along the adjacent edge regions and / or adjacent to the channel cavity by means of one or more pressure elements. The pressure elements can be configured by corresponding contours in the profiles of the lower and / or upper die, for example by sealing ribs. The sealing elements can be arranged circumferentially along the adjacent edge regions of the upper and / or lower die. Furthermore, the sealing elements can be arranged adjacent to the channel cavity. The sealing elements ensure a particularly advantageous forming process, especially since the forming process occurs in the region of the channel cavity. In this way, high dimensional stability and forming accuracy are guaranteed.

[0045] The board element is made of metal. In particular, the board element is made of light alloy material, and here especially of aluminum alloy.

[0046] In the scope of the method according to the invention, it is preferred and effective to use a board element provided with a soldering material, wherein the soldering material is applied to the board element in the form of a coating solder layer.

[0047] Furthermore, in the method according to the invention, the oxide layer present on the surface of the plate element can be broken while the plate stack is clamped and held between the lower and upper molds. This can be done, in particular, by a mechanical mechanism for breaking the oxide layer.

[0048] Another advantage is that the brazing technique can be performed without flux, that is, without flux.

[0049] As already mentioned, the spacer element can be shifted automatically or actuated.

[0050] The manufacturing of heat transfer plates according to the invention can be further improved when a separation medium is applied between the contact surface of the thermoforming die and the outer surface of the plate element or plate stack.

[0051] The spacer element disposed in the lower mold has a lower limiting portion. The spacer element disposed in the upper mold has an upper limiting portion. The lower limiting portion and the upper limiting portion limit the corresponding displacement stroke of the spacer element from the lower mold or the upper mold, and thus define the final position of the spacer element and the position of the plate stack, whereby the plate stack is positioned on the lower spacer element between the lower spacer element and the upper spacer element.

[0052] The lower and upper limiting portions can be adjustable. In this way, it is possible to adapt to stacked plates of different thicknesses. Attached Figure Description

[0053] The invention will then be explained in detail with reference to the accompanying drawings. In the drawings:

[0054] Figure 1 A perspective view of the plate elements used to form the plate stack is shown;

[0055] Figure 2 The heat transfer plate is also shown in perspective.

[0056] Figure 3 A thermoforming die is shown;

[0057] Figure 4 A thermoforming die is shown, which includes a plate stack received between a lower die and an upper die;

[0058] Figure 5 Showing the corresponding Figure 3 A side view of the thermoforming mold shown in the diagram;

[0059] Figure 6 A side view of a thermoforming die including the inserted stack of plates with the upper die open;

[0060] Figure 7The thermoforming die is also shown in a side view with the upper die further closed;

[0061] Figure 8 Showing the corresponding Figure 7 A perspective view of the thermoforming mold shown in the diagram;

[0062] Figure 9 The thermoforming mold is shown in a side view and in its closed state;

[0063] Figure 10 The thermoforming die is shown in the first open position after the forming process;

[0064] Figure 11 The thermoforming die is shown in the second open position after the forming process;

[0065] Figure 12 A perspective view of the thermoforming die after the forming process is shown; and

[0066] Figure 13 A partially enlarged view of the thermoforming die is shown. Detailed Implementation

[0067] Figure 1 A pre-produced plate element 1 made of a light metal is shown. In particular, the plate element 1 is made of a light alloy material, preferably aluminum or an aluminum alloy.

[0068] Two such board elements 1 are positioned facetively overlapping each other to form a board stack 2. The surfaces of the board elements 1 that abut each other are fully or partially covered with solder material. In particular, the solder material is applied to the board elements 1 in the form of a solder overlay layer.

[0069] Figure 2 A heat transfer plate 3 is shown, which is manufactured from a plate stack 2. The plate stack 2 is formed from a first plate element 1 and a second plate element 2. The heat transfer plate 3 and its plate stack 2 have a channel structure 4 including at least one channel 5. Channel segments 6 of the channel 5 extend annularly into each other and communicate between fluid connectors 7 and 8. The fluid connector 7, including a connecting pipe 9, is designated for conveying cooling fluid, and the fluid connector 8, including a connecting pipe 10, is designated for discharging cooling fluid. Figure 6 , 7 The connecting pipes 9 and 10 can be seen in the diagrams of 10 and 11.

[0070] The thermoforming die 11 used for manufacturing heat transfer plate 3 Figures 3 to 12 As shown in the image. Figure 13 A portion of the thermoforming die 11 is shown. The illustration of the thermoforming die 11 is technically schematic. For illustrative purposes, the areas of the outer wall, insulation, and housing are not shown.

[0071] The thermoforming mold 11 has a heatable lower mold 12 and a heatable upper mold 13. The lower mold 12 and the upper mold 13 are segmented and each is composed of mold segments 14 or 15. The lower mold 12 and the upper mold 13 have contact surfaces 16 and 17. A channel cavity 18 is provided in at least one contact surface 17. This... Figure 8 As can be seen, the channel cavity 18 is provided in the contact surface 17 of the upper mold 13. The contact surface 16 in the lower mold 12 is flat or smooth and does not have a channel cavity.

[0072] The lower mold 12 has a spacer element 19, which is receptively and repositionably disposed within the lower mold 12. The upper mold 13 also has a spacer element 20. The spacer element 20 of the upper mold 13 is receptively and repositionably disposed within the upper mold 13. The spacer element 19 in the lower mold 12 and the spacer element 20 on the upper mold 13 are repositionable relative to the contact surfaces 16, 17.

[0073] Spacer elements 19 or 20 are implemented in a pin-like manner and guided within receiving portions 21 in the lower mold 12 or upper mold 13, respectively. Spacer elements 19 and 20 interact with actuators 22, which cause them to move out of the receiving portions 21. Actuators 22 can be spring elements or linear drive devices. When the thermoforming mold 11 or the lower mold 12 and upper mold 13 are closed, spacer elements 19 and 20 can displace against the force of actuators 22. The insertion or removal stroke of spacer elements 19 and 20 into the receiving portions 21 is limited by upper limiting portions 23 and lower limiting portions 24.

[0074] When the thermoforming mold 11, in which the lower mold 12 and the upper mold 13 are separated from each other, is opened, the spacer element 19 of the lower mold 12 extends relative to the contact surface 16 of the lower mold 12 and the spacer element 20 of the upper mold 13 extends relative to the contact surface 17 of the upper mold 13.

[0075] For example Figure 5 and 6 Or 13 shows the interval position A, in which the spacer element 19 of the lower mold 12 and the spacer element 20 of the upper mold 13 are displaced from the lower mold 12 or the upper mold 13 and extend relative to the contact surfaces 16, 17.

[0076] Figure 9 The diagram shows the closed position S when the lower mold 12 and the upper mold 13 are closed, in which the spacer element 19 of the lower mold 12 is received in the lower mold 12 and the spacer element 20 of the upper mold 13 is received in the upper mold 13.

[0077] To manufacture the heat transfer plate 3, a plate stack 2 formed by two plate elements 1 is placed into a thermoforming mold 11. A spacer element 19 in the lower mold 12 extends relative to the contact surface 16 of the lower mold 12. The plate stack 2 is positioned on the spacer element 19 in the lower mold 12.

[0078] The thermoforming mold 11, its lower mold 12, and its upper mold 13 are heated to a mold temperature TW between 540°C and 670°C. Specifically, the mold temperature TW is between 550°C and 640°C. The thermoforming mold 11 is equipped with heating devices for heating the lower mold 12 and the upper mold 13. A heating channel 25 is provided in the lower mold 12, and a heating channel 26 is provided in the upper mold 13. The lower mold 12 has a corresponding slot 27 into which a connecting pipe 9 or 10 can be received when the thermoforming mold 11 is closed.

[0079] Soldering material is applied between the surfaces of the board elements 1 of the board stack 2 that are placed against each other. For this purpose, in particular, one board element 1 has a solder layer covering one side.

[0080] Before the plate stack 2 is placed into the thermoforming mold 11, the contact surfaces 16 and / or 17 of the lower mold 12 or the upper mold 13 and / or the upper and / or lower sides of the plate stack 2 may be provided with a separation medium.

[0081] The plate stack 2, formed by two plate elements 1, is placed into the thermoforming mold 11. Figure 6 The diagram shows a spaced-out position A, in which the plate stack 2 is placed on the spacer element 19 at a distance x from the lower mold 12. After the plate stack 2 is placed into the thermoforming mold 11 and positioned on the lower spacer element 19 of the lower mold 12, the thermoforming mold 11 closes. The upper spacer element 20 in the upper mold 13 extends relative to the contact surface 17 of the upper mold 13. When the thermoforming mold 11 closes, the lower mold 12 and the upper mold 13 are displaced relative to each other and move toward each other. Here, the extended spacer element 20 of the upper mold 13 contacts the plate stack 2 on its upper side. The plate stack 2 is thus held between the spacer elements 19 and 20 at a distance x from the lower mold 12 and a distance x1 from the upper mold 13. In this way, it is ensured that the plate stack 2 does not directly contact the lower mold 12 when it is placed into the thermoforming mold 11.

[0082] As the closing motion continues, the upper mold 13 moves further toward the lower mold 12. During the closing motion, the spacer element 19 of the lower mold 12 moves into the lower mold 12 and the spacer element 20 of the upper mold 13 moves into the upper mold 13. For this purpose, the spacer elements 19 and 20 move into the receiving portion 21 in the lower mold 12 or the upper mold 13, respectively.

[0083] The plate stack 2 is clamped between the lower mold 12 and the upper mold 13. Here, the plate stack 2 is in surface contact with the lower mold 12 with its lower side and with the upper mold 13 with its upper side. When the plate stack 2 is clamped and held between the lower mold 12 and the upper mold 13, the oxide layer present on the surface of the plate element 1 can be broken. For this purpose, a mechanical breaking element can be configured.

[0084] In a closed thermoforming mold 11, the plate stack 2, clamped between the lower mold 12 and the upper mold 13, is heated. Pressure is applied within the intermediate space between the plate elements 1. This is done by introducing an action medium into the intermediate space between the plate elements 1. Thus, the channel 5 is formed by forming using an internal pressure technique. In the channel forming, the plate element region of the upper plate element 1 is formed into the channel cavity 18 of the upper mold 13. In the channel forming, air is vented outward from the channel cavity 18 of the thermoforming mold 11. For this purpose, an vent 28 is provided. The vent 28 has an vent hole 29 that communicates with the channel cavity 18. Air exhaust and thus pressure compensation can also be achieved through the gap between the mold sections 15 of the upper mold 13. The vent 28 ensures that air can escape from the channel cavity 18 in the upper mold 13 during the forming of the channel 5 in the plate element 1. The exhaust section 28 enables the material in the plate element region of the upper plate element 1 to be formed into the channel cavity 18 without back pressure, and the channel 5 can be formed.

[0085] The plate stack 2 can be sealed circumferentially along the adjacent edge regions 30 and / or adjacent to the channel cavity 18 by means of one or more pressure elements during the forming process using internal pressure technology. For this purpose, the thermoforming die 11, or its lower die 12 and / or upper die 13, is equipped with pressure elements configured and determined to seal the plate stack 2 circumferentially along the outer edge regions 30 and / or adjacent to the channel cavity 18. Such pressure elements can be implemented, for example, in the form of a rib-like body.

[0086] The brazing material applied between the plate elements 1 melts, or melts when the plate elements 1 are heated.

[0087] After the channel structure 4, including channel 5, is formed, the thermoforming mold 11 is opened. When the thermoforming mold 11 is opened, the lower mold 12 and the upper mold 13 are displaced relative to each other. The upper mold 13 moves away from the lower mold 12, while simultaneously the spacer element 19 of the lower mold 12 and the spacer element 20 of the upper mold 13 move out of the lower mold 12. The joined plate stack 2 is held at a distance x from the lower mold 12 on the lower spacer element 19. The spacer element 20 of the upper mold 13 moves out of the upper mold 13 and contacts the plate stack 2 on its upper side. The plate stack 2, provided with the channel structure 4, is held between the spacer elements 19 and 20 and can be cooled. Molten brazing material solidifies, and the plate elements 1 of the plate stack 2 are joined by brazing.

[0088] When the thermoforming mold 11 is opened, the upper mold 13 moves away from the lower mold 12 and the plate stack 2. Simultaneously, the spacer element 20 of the upper mold 13 moves out of the upper mold and remains in contact with the upper side of the plate stack 2. During the opening movement of the thermoforming mold 11, the upper spacer element 20 holds and fixes the plate stack 2, while the plate stack 2, or the formed heat transfer plate 3, is lifted by the lower mold 12 through the lower spacer element 19.

[0089] The thermoforming die 11 opens further. Here, the upper die 13 moves further away from the lower die 12. The thermoforming die 11 opens until it reaches the removal position E (see...). Figure 11 Furthermore, the heat transfer plate 3 can be removed from the thermoforming mold 11.

[0090] Actuator 22 is defined and designed to displace spacer element 19 or 20 within a guide device in lower mold 12 or upper mold 13. Actuator 22 of the actuating device of lower mold 12 interacts with spacer element 19 and lifts heat transfer plate 3 during the thermoforming process and after the opening of thermoforming mold 11. Spacer element 20 of upper mold 13, acting from above on heat transfer plate 3, holds heat transfer plate 3 in place during opening of thermoforming mold 11 and cooling. Actuator 22 has a corresponding actuating bar 31 extending longitudinally through lower mold 12, which interacts with spacer element 19 of lower mold 12. Actuating bar 31 is operated by a linear drive device 32 acting externally at its free end.

[0091] The operation of the spacer elements 19 and 20 is performed automatically or in a controlled manner, depending on the movement of the lower mold 12 and the upper mold 13, i.e., by manipulation and / or control of the lower mold 12 and the upper mold 13.

[0092] List of reference numerals

[0093] 1 board component

[0094] 2-plate stacked components

[0095] 3 heat transfer plates

[0096] 4-channel structure

[0097] 5 channels

[0098] 6-channel section

[0099] 7 fluid connectors

[0100] 8 fluid connectors

[0101] 9 connecting pipes

[0102] 10 connecting pipe

[0103] 11 Thermoforming Dies

[0104] 12-piece mold

[0105] 13 upper mold

[0106] 14 Mold Sections

[0107] 15 Mold Sections

[0108] 1612 contact surface

[0109] 1713 contact surface

[0110] 18-channel cavity

[0111] 1912 spacer element

[0112] 2013 spacer element

[0113] 21 Reception Department

[0114] 22 actuators

[0115] 23 Upper Limit Part

[0116] 24 Lower Limit

[0117] 2512 heating channel

[0118] Heating channel of 2613

[0119] 27 slots

[0120] 28 exhaust section

[0121] 29 exhaust holes

[0122] 30 edge areas

[0123] 31 control bar

[0124] 32 Linear Drive Unit

[0125] A interval position

[0126] E is located at the extraction position.

[0127] S closed position

[0128] TW mold temperature

[0129] x-spacing

[0130] x1 Spacing

Claims

1. A method for manufacturing a heat transfer plate (3), the method comprising the following steps: • Provide a plate stack (2) formed by at least two plate elements (1) made of metallic material together with brazing material disposed between the plate elements (1); • The plate stack (2) is transported to a heated thermoforming die (11) having a lower die (12) and an upper die (13), the thermoforming die including contact surfaces (16, 17) having at least one channel cavity (18). • placing the stack of plates (2) into the thermoforming mould (11), wherein, The plate stack (2) is positioned on a spacer element (19), which is receptively disposed in the lower mold (12) and extends relative to the contact surface (16) of the lower mold (12); • The thermoforming mold (11) is closed, wherein the lower mold (12) and the upper mold (13) are displaced relative to each other; • Continue the closing motion and clamp the plate stack (2) between the lower mold (12) and the upper mold (13), wherein the spacer element (19) in the lower mold (12) is moved into the lower mold (12) and the plate stack (2) reaches surface contact between the lower mold (12) and the upper mold (13); • Heat the stack of plates (2), and • A channel (5) is formed by introducing an internal pressure medium to load the intermediate space between the plate elements (1) of the plate stack (2) and by forming the channel cavity (18) with internal pressure through at least one plate element region, wherein the channel cavity (18) is vented, and • Melt the brazing material between the plate elements (1) and braze the plate elements (1) to the mating surfaces of the plate elements (1) in contact; • The thermoforming mold (11) is opened, wherein the lower mold (12) and the upper mold (13) are displaced relative to each other, wherein the spacer element (19) in the lower mold (12) moves out of the lower mold (12), thereby holding the plate stack (2) with a gap on the spacer element (19) of the lower mold (12); • Hold and cool the plate stack (2); • Open the thermoforming mold (11) until it is in the removal position and remove the heat transfer plate (3) from the thermoforming mold (11).

2. The method of claim 1, wherein, When the thermoforming mold (11) is closed, the spacer element (20) disposed in the upper mold (13) comes into contact with the plate stack (2), the spacer element being receptively disposed in the upper mold (13) and extending relative to the contact surface (17) of the upper mold (13).

3. The method of claim 2, wherein, When the thermoforming mold (11) is closed, the spacer element (20) in the upper mold (13) is moved into the upper mold (13).

4. The method according to claim 2 or 3, characterized in that, When the thermoforming mold (11) is opened, the spacer element (20) in the upper mold (13) moves out of the upper mold (13).

5. The method according to one of claims 1 to 3, characterized in that The thermoforming mold (11) is heated to a mold temperature between 540°C and 670°C.

6. The method according to one of claims 1 to 3, characterized in that The thermoforming mold (11) is heated to a mold temperature between 550°C and 640°C.

7. The method according to any one of claims 1 to 3, characterized in that, Provide fluid connectors (7, 8) to the plate element (1) before forming the plate stack (2), or to the plate element (1) during forming the plate stack (2), or to the plate stack (2).

8. The method of claim 7, wherein, The working medium is introduced through the fluid connectors (7, 8).

9. The method according to one of claims 1 to 3, characterized in that In the forming process of the internal pressure technology, the plate stack (2) is sealed around each other along the edge regions (30) and / or adjacent to the channel cavity (18) by means of one or more pressure elements.

10. The method according to any one of claims 1 to 3, characterized in that, Plate elements made of aluminum alloy (1) are used.

11. The method according to one of claims 1 to 3, characterized in that Board components (1) using brazing material in the form of a coating solder layer.

12. The method according to one of claims 1 to 3, characterized in that When the plate stack (2) is clamped and held between the lower mold (12) and the upper mold (13), at least one oxide layer present on the surface of the plate element (1) is broken.

13. The method according to one of claims 1 to 3, characterized in that The brazing technique is performed without flux.

14. The method according to one of claims 1 to 3, characterized in that The spacer elements (19, 20) are automatically or automatically shifted.

15. The method according to any one of claims 1 to 3, characterized in that, A separation medium is introduced between the contact surfaces (16, 17) of the thermoforming mold (11) and the outer surface of the plate element (1) or the plate stack (2).

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