Wafer thinning grinding film pasting device

Abstract

The application discloses a wafer thinning grinding film pasting device, which comprises a support, a carrier table arranged on the top of the support, an opening formed in the carrier table, a lifting frame slidably connected to the opening, a telescopic assembly installed on the top of the support below the carrier table, a platform arranged above the carrier table, a groove formed in the platform, a first hole formed in the platform at the groove, the first hole having the same diameter as the carrier table, a cutting piece installed on the platform, the cutting piece being annular and having the same inner diameter as the wafer, a film laid between the groove and the cutting piece, and a film pressing device arranged above the film. The carrier table can move and lift the wafer. When the wafer is moved to the bottom of the platform, lifted and coated with the film, and continuously lifted, the excess film on the edge of the wafer will touch the annular cutter head, so that the cutter head can cut off the excess film at one time.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing and processing technology, and specifically to a wafer thinning and polishing coating device. Background Technology

[0002] In integrated circuit packaging, wafer chips need to be picked up from the wafer for wafer mounting. Generally, incoming wafers undergo pre-processing, such as film application, thinning, and dicing, before being sent to the wafer mounting process. When a wafer leaves the factory, one side usually has a protective film. Film application involves applying a film to the other side, serving two purposes: protecting the wafer and ensuring that the chips remain attached after the protective film is removed, facilitating thinning and subsequent dicing. Currently, during film application, the side of the wafer with the protective film is in contact with the substrate to facilitate film application to the other side.

[0003] In the current wafer coating process, the wafer is first covered with a film, then rolled with rollers, and finally a dicing tool is used to remove the excess film along the edge of the wafer by circling around it. This dicing method is time-consuming and has low efficiency in removing the film. Summary of the Invention

[0004] The purpose of this invention is to solve the problem that the dicing tool removes excess film along the edge of the wafer by circling the wafer, which is time-consuming and has low efficiency. Therefore, this invention proposes a film-applying device for wafer thinning and polishing.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A wafer thinning and polishing film application device includes:

[0007] support;

[0008] A platform is provided on the top of the bracket, and an opening is provided on the platform. A lifting frame is also slidably connected to the opening.

[0009] A telescopic assembly is installed on the top of the bracket, located below the platform.

[0010] A platform is disposed above the loading platform. A groove is formed in the platform, and a first hole is formed in the platform at the groove. The diameter of the first hole is the same as the diameter of the loading platform.

[0011] A cutting element is mounted on the platform. The cutting element is annular, and its inner diameter is the same as the outer diameter of the wafer.

[0012] A membrane is laid between the groove and the cut piece;

[0013] A film pressing device is positioned above the film.

[0014] As a further aspect of the present invention: the telescopic assembly includes two telescopic members;

[0015] One of the telescopic components is fixed at its bottom to the bracket and at its top to the platform;

[0016] The bottom of the other telescopic component is fixed to the bracket, and the top is fixed to the lifting frame.

[0017] As a further aspect of the present invention: both sides of the platform are provided with strip-shaped openings, the two strip-shaped openings are connected to the groove, and the membrane passes through the strip-shaped openings.

[0018] As a further aspect of the present invention, a limit ring is fixed on the platform.

[0019] As a further aspect of the present invention: the pressing device includes a rotating device and a roller, the roller being fixed on the output end of the rotating device.

[0020] As a further aspect of the present invention: a second slider is fixed on the platform, a first slide rail is fixed on the bracket, and the second slider is slidably connected to the first slide rail.

[0021] As a further aspect of the present invention: a first slider is installed on the first slide rail, and a second slide rail is installed at the bottom of the platform, wherein the first slider is slidably connected to the second slide rail.

[0022] The beneficial effects of the present invention are: the stage can move and lift the wafer. When the wafer is moved to the bottom of the platform and lifted and coated, when it continues to be lifted, the excess film on the edge of the wafer will come into contact with the annular cutting head, so that the cutting head can remove the excess film in one go. Attached Figure Description

[0023] The invention will now be further described with reference to the accompanying drawings.

[0024] Figure 1 This is a schematic diagram of the structure of the present invention;

[0025] Figure 2 This is a partial structural schematic diagram of the present invention;

[0026] Figure 3 yes Figure 2 A schematic diagram of the cross-sectional structure;

[0027] Figure 4 This is a cross-sectional structural diagram of the platform of the present invention;

[0028] Figure 5 yes Figure 4Enlarged view of point A in the middle.

[0029] In the diagram: 1. Support; 2. Platform; 201. Groove; 202. Strip opening; 203. First hole; 3. Platform; 301. Limiting ring; 302. Opening; 401. Lifting frame; 4011. Second hole; 402. First telescopic component; 403. Second telescopic component; 5. Cutting component; 501. Blade; 6. First slide rail; 7. First slider; 8. Second slide rail; 9. Rotating device; 10. Roller; 11. Membrane. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1, please refer to Figure 3-5 As shown, the present invention is a wafer thinning and polishing film application device, comprising:

[0032] Bracket 1;

[0033] The stage 3 is set on top of the support 1. The operator or robot can place the wafer on the stage 3 in advance. When placing the wafer, the wafer needs to be aligned with the edge of the stage 3. It should be noted that the shape of the stage 3 is the same as the shape of the wafer. The stage 3 has an opening 302, which can be circular, rhomboid, rectangular, etc. A lifting frame 401 is slidably connected to the opening 302. The lifting frame 401 can lift the wafer after it has been coated and cut, so that the wafer will not be attached to the stage 3. This makes it easier for the operator or robot to pick up the wafer later. The shape of the top of the lifting frame 401 needs to be the same as the shape of the opening 302. This can prevent the lifting frame 401 from having too large a gap at the connection point during the lifting and lowering process of the opening 302.

[0034] The telescopic assembly is installed on the top of the bracket 1, below the platform 3. The main function of the telescopic assembly is to drive the platform 3 and the lifting frame 401 to rise and fall respectively.

[0035] Platform 2 is positioned above stage 3. A groove 201 is formed in platform 2. The shape of groove 201 can be circular or rectangular, etc. A first hole 203 is formed in the groove 201 in platform 2. The diameter of the first hole 203 is the same as the diameter of stage 3. When the diameter of the first hole 203 is the same as that of stage 3, stage 3 will support the wafer to pass through the first hole 203 when it rises, exposing the wafer on platform 2, which is convenient for later wafer film application.

[0036] The cutting component 5 is installed on the platform 2. Specifically, the cutting component 5 is fixedly installed at the center of the platform 2. The cutting component 5 is ring-shaped, and the center of the ring-shaped cutting component 5 is the same as the center of the first hole 203. The inner diameter of the cutting component 5 is the same as the outer diameter of the wafer. The cutting component 5 has the cutting head 501 set at the lower end. So when the wafer is lifted upward, the wafer will eventually touch the cutting component 5, and the excess film 11 will be automatically cut off.

[0037] The film 11 is laid between the groove 201 and the cutting part 5. The film pressing device is set above the film 11. When the wafer is lifted upward and touches the cutting part 5, it will first touch the film 11. Finally, the film pressing device will apply the film 11 to the wafer without air bubbles through rolling and other film-applying methods. Only then will the wafer touch the cutting part 5.

[0038] Example 2, please refer to Figure 2-5 As shown, the present invention is a wafer thinning and polishing film application device, comprising:

[0039] Bracket 1;

[0040] The stage 3 is set on top of the support 1. The operator or robot can place the wafer on the stage 3 in advance. When placing the wafer, the wafer needs to be aligned with the edge of the stage 3. It should be noted that the shape of the stage 3 is the same as the shape of the wafer. The stage 3 has an opening 302, which can be circular, rhomboid, rectangular, etc. A lifting frame 401 is slidably connected to the opening 302. The lifting frame 401 can lift the wafer after it has been coated and cut, so that the wafer will not be attached to the stage 3. This makes it easier for the operator or robot to pick up the wafer later. The shape of the top of the lifting frame 401 needs to be the same as the shape of the opening 302. This can prevent the lifting frame 401 from having too large a gap at the connection point during the lifting and lowering process of the opening 302.

[0041] A second hole 4011 is provided on the lifting frame 401;

[0042] The telescopic assembly is installed on the top of the bracket 1, below the platform 3. The main function of the telescopic assembly is to drive the platform 3 and the lifting frame 401 to rise and fall respectively.

[0043] The telescopic assembly includes two telescopic components; one of the telescopic components is the first telescopic component 402, whose bottom is fixed to the bracket 1 and whose top is fixed to the platform 3; the other telescopic component is the second telescopic component 403, whose bottom is fixed to the bracket 1 and whose top is fixed to the lifting frame 401. Both telescopic components can be telescopic devices such as cylinders or electric push rods, and the two telescopic components are controlled independently.

[0044] Platform 2 is positioned above stage 3. A groove 201 is formed inside platform 2, which can be circular or rectangular in shape. A first hole 203 is formed in the groove 201 inside platform 2. The diameter of the first hole 203 is the same as the diameter of stage 3. When the diameter of the first hole 203 is the same as that of stage 3, stage 3 will support the wafer as it rises, allowing it to pass through the first hole 203 and be exposed on platform 2, which is convenient for later wafer lamination. A limiting ring 301 is fixed on stage 3. When stage 3 passes through the first hole 203, the limiting ring 301 will contact the bottom of platform 2 to limit the stage 3.

[0045] The cutting component 5 is installed on the platform 2. Specifically, the cutting component 5 is fixedly installed at the center of the platform 2. The cutting component 5 is ring-shaped, and the center of the ring-shaped cutting component 5 is the same as the center of the first hole 203. The inner diameter of the cutting component 5 is the same as the outer diameter of the wafer. The cutting component 5 has the cutting head 501 set at the lower end. So when the wafer is lifted upward, the wafer will eventually touch the cutting component 5, and the excess film 11 will be automatically cut off.

[0046] The film 11 is laid between the groove 201 and the cutting part 5. The film pressing device is set above the film 11. The platform 2 has strip openings 202 on both sides. The two strip openings 202 are connected to the groove 201. The film 11 passes through the strip openings 202. When the wafer is lifted upward and touches the cutting part 5, it will first touch the film 11. Finally, the film pressing device will apply the film 11 to the wafer without air bubbles through rolling and other film-applying methods. Only then will the wafer touch the cutting part 5.

[0047] The film-pressing device includes a rotating device 9 and a roller 10. The roller 10 is fixed on the output end of the rotating device 9. The rotating device 9 drives the roller 10 to press and roll on the wafer to be coated, thus completing the coating process.

[0048] Example 3, please refer to Figure 1As shown, based on Embodiment 1 or Embodiment 2, a second slider is fixed on the stage 3, and a first slide rail 6 is fixed on the bracket 1. The second slider is slidably connected to the first slide rail 6. Specifically, the stage 3 adds a second slider and a first slide rail 6 during the lifting process, thereby improving the stability of the stage 3's lifting. A first slider 7 is installed on the first slide rail 6, and a second slide rail 8 is installed at the bottom of the platform 2. The first slider 7 is slidably connected to the second slide rail 8. With the cooperation of the first slider 7 and the second slide rail 8, multiple stages 3 can be added to form an assembly line mode. When the stage 3 moves to the bottom of the platform 2, a wafer lamination operation can be performed.

[0049] The foregoing has described one embodiment of the present invention in detail, but this content is merely a preferred embodiment and should not be considered as limiting the scope of the present invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the scope of the claims of this invention.

Claims

1. A wafer thinning and polishing device, characterized in that, include: Frame (1); A platform (3) is provided on the top of the bracket (1). An opening (302) is provided on the platform (3). A lifting frame (401) is also slidably connected to the opening (302). The lifting frame (401) can lift the wafer upwards after the wafer is coated and cut, making it easier for operators or robots to pick up the wafer later. The shape of the frame head at the top of the lifting frame (401) is the same as the shape of the opening (302) to avoid excessive gaps at the connection. A telescopic assembly is installed on the top of the bracket (1) below the platform (3); Platform (2) is disposed above the stage (3). A groove (201) is provided in the platform (2). A first hole (203) is provided in the platform (2) at the groove (201). The diameter of the first hole (203) is the same as the diameter of the stage (3). When the stage (3) rises, it supports the wafer through the first hole (203) and exposes the wafer on the platform, which facilitates the subsequent film application operation. A cutting element (5) is installed on the platform (2). The cutting element (5) is annular, and the inner diameter of the cutting element (5) is the same as the outer diameter of the wafer. The cutting element (5) is fixedly installed at the center of the platform (2). The center of the cutting element (5) is the same as the center of the first hole (203). The cutting element (5) has its cutting head set at the lower end. When the wafer is lifted upward, the wafer will eventually touch the cutting element (5), and the excess film (11) will be automatically cut off. A membrane (11) is laid between the groove (201) and the cutter (5); The film pressing device is set above the film (11). When the wafer is lifted upward and touches the dicing piece (5), it will first touch the film (11). Finally, the film (11) is applied to the wafer without air bubbles by the rolling method of the film pressing device, and then the wafer will touch the dicing piece (5). The telescopic assembly includes two telescopic components; One of the telescopic components is fixed at the bottom to the bracket (1) and at the top to the platform (3); The bottom of the other telescopic component is fixed to the bracket (1), and the top is fixed to the lifting frame (401).

2. The wafer thinning and polishing device according to claim 1, characterized in that, The platform (2) has slots (202) on both sides, and the two slots (202) are connected to the groove (201). The membrane (11) passes through the slots (202).

3. The wafer thinning and polishing device according to claim 1, characterized in that, A limit ring (301) is fixed on the stage (3).

4. The wafer thinning and polishing device according to claim 1, characterized in that, The pressing device includes a rotating device (9) and a roller (10), and the roller (10) is fixed on the output end of the rotating device (9).

5. A wafer thinning and polishing device according to any one of claims 1 to 4, characterized in that, A second slider is fixed on the platform (3), and a first slide rail (6) is fixed on the bracket (1). The second slider is slidably connected to the first slide rail (6).

6. The wafer thinning and polishing device according to claim 5, characterized in that, A first slider (7) is installed on the first slide rail (6), and a second slide rail (8) is installed at the bottom of the platform (2). The first slider (7) and the second slide rail (8) are slidably connected.

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