Display module and electronic device
By bonding a multi-layer ribbon circuit board to the back of the display panel's encapsulation section and combining it with a waterproof design, the problem of limited battery space in the process of making electronic devices thinner and lighter has been solved, achieving higher battery capacity and space utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2021-12-31
- Publication Date
- 2026-07-21
AI Technical Summary
The trend towards thinner and lighter electronic devices has led to limited battery space. Existing ribbon circuit boards take up a lot of space, which affects battery capacity.
The ribbon cable circuit board is bonded to the encapsulation part that is bent to the back of the light-emitting surface of the display panel, and the ribbon cable circuit board is located between the two ends of the encapsulation part. A multi-layer circuit board structure is adopted, combined with flexible bonding circuit board and waterproof adhesive protection, to optimize the wiring and waterproof design.
It reduces the size occupied by the ribbon cable circuit board, increases battery capacity, increases wiring area, improves space utilization, and provides a variety of layout methods and waterproof solutions to enhance the reliability of electronic devices.
Smart Images

Figure CN116416857B_ABST