Display module and electronic device

Abstract

This application provides a display module and an electronic device. The display module includes a display panel, a ribbon circuit board, and a flexible bonding circuit board. The display panel includes a display section, a bending section, and a packaging section. The packaging section is bent to the back side of the light-emitting surface of the display section via the bending section. The packaging section includes a first end and a second end. The first end is the end of the packaging section away from the bending section, and the second end is the end of the packaging section connected to the bending section. The ribbon circuit board is a multilayer printed circuit board or a multilayer flexible circuit board. The flexible bonding circuit board extends from one of the wiring layers of the ribbon circuit board. Both the ribbon circuit board and the flexible bonding circuit board are disposed on the side of the packaging section facing away from the display section and located between the first end and the second end. A first bonding area is provided on the packaging section, located at the first end, and the flexible bonding circuit board is bonded within the first bonding area. This application provides a display module and an electronic device that can improve battery capacity.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module and electronic device. Background Technology

[0002] As electronic devices become increasingly popular, they are evolving towards ultra-thin and lightweight designs. Simultaneously, users are demanding higher battery capacities from these devices. This trend towards thinner and lighter designs limits internal space, inevitably reducing battery capacity. Consequently, components such as display modules in electronic devices need to be more compact to allow sufficient room for the battery.

[0003] In related technologies, display modules can use flexible screens. Among the packaging methods of flexible screens, the COP (Chip On Pi, chip bonded to the polyimide film of the display panel) packaging process can reduce the bezel space occupied by the packaging part of the electronic device by bending the packaging part to the back side of the display part.

[0004] However, in related technologies, the ribbon circuit board that is bonded to the packaging section is relatively large, which will occupy a large portion of the length and width of the electronic device, affecting the battery layout space and resulting in battery capacity loss. Summary of the Invention

[0005] This application provides a display module and electronic device that can improve battery capacity.

[0006] One embodiment of this application provides a display module, including: a display panel, a ribbon cable circuit board, and a flexible bonding circuit board; the display panel includes a display part, a bending part, and an encapsulation part, the encapsulation part is bent to the back side of the light-emitting surface of the display part through the bending part, the encapsulation part includes a first end and a second end, the first end is the end of the encapsulation part away from the bending part, and the second end is the end of the encapsulation part connected to the bending part; the ribbon cable circuit board is a multilayer printed circuit board or a multilayer flexible circuit board, the number of wiring layers of the ribbon cable circuit board is greater than or equal to 2, the flexible bonding circuit board emerges from one of the wiring layers of the ribbon cable circuit board, the ribbon cable circuit board and the flexible bonding circuit board are both disposed on the side of the encapsulation part away from the display part, the ribbon cable circuit board and the flexible bonding circuit board are located between the first end and the second end, a first bonding area is provided on the encapsulation part, the first bonding area is located at the first end, and the flexible bonding circuit board is bonded in the first bonding area.

[0007] This application provides a display module that, by binding a ribbon cable circuit board to a package portion bent to the back of the light-emitting surface of the display panel, and positioning the ribbon cable circuit board between the two ends of the package portion, reduces the size occupied by the ribbon cable circuit board compared to related technologies where the ribbon cable circuit board extends beyond the first end of the package portion. This provides more space for the battery and increases the battery capacity of the electronic device. Using a flexible bonding circuit board improves the flexibility of the bonding method and the reliability of the bonding effect.

[0008] The ribbon cable circuit board is designed as a multi-layer circuit board, which can utilize the space in the package section, that is, make full use of the space in the thickness direction of the electronic device. Moreover, when the area of ​​the package section is small, the space utilization advantage can be fully utilized by increasing the number of wiring layers on the ribbon cable circuit board. The flexible bonding circuit board is a single-layer flexible circuit board, which is beneficial to improving the flexibility of the bonding method and the reliability of the bonding effect.

[0009] In one possible implementation, the ribbon circuit board and the package are bonded together by adhesive.

[0010] The ribbon cable circuit board is attached to the package with adhesive to ensure the reliability of the bonding and adhesion between the ribbon cable circuit board and the package.

[0011] In one possible implementation, the display module further includes a driver chip disposed on the side of the package portion facing away from the display portion. The package portion has a second bonding area located between the bending portion and the first bonding area, and the driver chip is bonded within the second bonding area.

[0012] In one possible implementation, the position of the flexible bonding circuit board at the exit point of the ribbon circuit board relative to the height of the package is greater than or equal to the height of the driver chip relative to the package, and the driver chip is located between the ribbon circuit board and the package.

[0013] The flexible bonding circuit board can have wires extending from the top of the ribbon cable circuit board, so that the flexible bonding circuit board can cover the top of the driver chip. This implementation is suitable for scenarios where the driver chip is relatively low in height.

[0014] In one possible implementation, the flexible bonding circuit board includes an extension section, a transition section, and a bonding section connected in sequence. The extension section is connected to the ribbon cable circuit board, the bonding section is bonded within a first bonding area, and the driver chip is located between the extension section and the package portion.

[0015] The transition section can utilize the flexibility of the flexible bonding circuit board to make the extension section and the bonding section transition smoothly, so as to ensure that the extension section remains horizontal to avoid the risk of failure caused by discontinuity, and to ensure reliable soldering at the bonding section.

[0016] In one possible implementation, a through-hole is provided on the ribbon cable circuit board, a driver chip is disposed in the through-hole, and there is a gap between the driver chip and the sidewall of the through-hole.

[0017] By placing the driver chip using through-holes on the ribbon cable circuit board, a more compact layout is achieved compared to placing the ribbon cable circuit board and driver chip side by side, which helps reduce the area of ​​the package. Furthermore, there are no restrictions on the height relationship between the driver chip and the ribbon cable circuit board, making it more widely applicable.

[0018] In one possible implementation, a blind via is provided on the ribbon cable circuit board, and the driver chip is disposed in the blind via. The sum of the depth of the blind via and the thickness of the adhesive is greater than or equal to the height of the driver chip relative to the package portion.

[0019] Using blind vias to house driver chips is more suitable for solutions where the thickness of the driver chip is less than the thickness of the ribbon circuit board. Furthermore, since trace layers can still be placed in the area above the blind via on the ribbon circuit board, the trace area can be increased. Additionally, proper height settings can prevent interference between the driver chip and the bottom wall of the blind via.

[0020] In one possible implementation, the flexible bonding circuit board exits from the bottom trace layer of the ribbon cable circuit board, which is the layer closest to the package in the multi-layer trace layer of the ribbon cable circuit board.

[0021] Flexible bonding circuit boards can have wires exiting from the bottom of the ribbon circuit board to prevent excessive breaks from causing poor soldering.

[0022] In one possible implementation, the display module further includes a flexible lead-out circuit board connected to the wide side of the ribbon cable circuit board. The flexible lead-out circuit board is used to connect to the motherboard, wherein the wide side of the ribbon cable circuit board extends in the same direction as the direction from the first end to the second end.

[0023] The flexible cable exit circuit board extends along the wide side of the ribbon cable circuit board. Compared to related technologies where the cable exits from the center of the ribbon cable circuit board, this eliminates the need to create anti-crack grooves on the ribbon cable circuit board, saving space for component placement and wiring, thus improving battery capacity. Furthermore, the wide-side cable exit avoids creating holes in the mid-frame design, preserving the overall strength of the device and enhancing its reliability.

[0024] In one possible implementation, the display module further includes waterproof adhesive that extends along the edge of the flexible bonding circuit board to fill the gap between the flexible bonding circuit board and the package; the three sides of the flexible bonding circuit board, excluding the side facing the ribbon cable circuit board, are covered with waterproof adhesive.

[0025] Waterproof adhesive can be filled in the gap (Z-axis space) between the flexible bonding circuit board and the package, preventing liquid from entering under the flexible bonding circuit board and preventing liquid from damaging the first bonding area and the driver chip.

[0026] In one possible implementation, the display module further includes a waterproof adhesive backing, which is applied to the surface of the ribbon cable circuit board facing away from the encapsulation portion. The waterproof adhesive backing is located at one end of the ribbon cable circuit board near the bend and extends along the length of the ribbon cable circuit board, covering the entire length of the ribbon cable circuit board.

[0027] Waterproof adhesive can be filled in the Z-axis space between the package and the middle frame to prevent external liquids from entering the package and damaging the ribbon cable circuit board.

[0028] Another aspect of this application provides an electronic device, including a mid-frame, a back cover, and the aforementioned display module. The display module and the back cover are respectively connected to both sides of the mid-frame. The display module, the back cover, and the mid-frame enclose a receiving space. A motherboard and a battery are disposed within the receiving space. A ribbon cable circuit board is connected to the motherboard through an outgoing circuit board.

[0029] This application provides a display module and an electronic device. By binding a ribbon cable circuit board to the encapsulation portion of the display panel that is bent to the back of the light-emitting surface, and positioning the ribbon cable circuit board between the two ends of the encapsulation portion, compared to related technologies where the ribbon cable circuit board extends beyond the first end of the encapsulation portion, the size occupied by the ribbon cable circuit board can be reduced, thereby providing more space for the battery and increasing the battery capacity of the electronic device. The ribbon cable circuit board can be bound using a single-layer flexible bonding circuit board, and the flexible bonding circuit board can extend from any layer of the ribbon cable circuit board, providing multiple binding methods applicable to different height relationships between the ribbon cable circuit board and the driver chip. In addition to effectively increasing battery capacity, it also provides multiple arrangement methods and binding structures for the ribbon cable circuit board and the driver chip, and adaptively provides a waterproof solution, making the display module more flexible and adaptable in overall space design. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0031] Figure 2 This is a schematic diagram of the assembled display module, mid-frame, motherboard, and battery according to an embodiment of this application.

[0032] Figure 3 An exploded view of the display module, mid-frame, motherboard, and battery provided in an embodiment of this application;

[0033] Figure 4This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application;

[0034] Figure 5 A simplified structural diagram of a display module provided for related technologies;

[0035] Figure 6 This is a simplified structural diagram of a display module provided in one embodiment of this application;

[0036] Figure 7 A schematic diagram of the bonding wire output structure of a ribbon circuit board provided in an embodiment of this application;

[0037] Figure 8 A top view of the packaging section provided in an embodiment of this application;

[0038] Figure 9 A schematic diagram of the wiring on a flexible bonding circuit board and a ribbon cable circuit board provided in an embodiment of this application;

[0039] Figure 10 A top view of the waterproof structure of a display module provided for related technologies;

[0040] Figure 11 A side view schematic diagram of the waterproof structure of a display module provided for related technologies;

[0041] Figure 12 This is a schematic diagram of the waterproof structure of a display module provided in one embodiment of this application;

[0042] Figure 13 A schematic diagram showing the location of the flexible outgoing circuit board provided for related technologies;

[0043] Figure 14 This is a schematic diagram showing the position of a flexible outgoing circuit board provided in one embodiment of this application;

[0044] Figure 15 for Figure 3 Enlarged view of the structure within the dashed box;

[0045] Figure 16 for Figure 2 Enlarged view of the structure within the dashed box;

[0046] Figure 17 A schematic diagram of a waterproofing solution for a flexible outgoing circuit board provided for related technologies;

[0047] Figure 18 A schematic diagram of a waterproofing solution corresponding to a flexible outgoing circuit board provided in an embodiment of this application;

[0048] Figure 19 A schematic diagram of the unfolded structure of the packaging section provided for related technologies;

[0049] Figure 20 This is a schematic diagram of the unfolded structure of the packaging section provided in an embodiment of this application;

[0050] Figure 21a This is a schematic diagram of the structure of a display module provided in one embodiment of this application;

[0051] Figure 21b This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application;

[0052] Figure 21c This is a simplified structural diagram of a display module provided in one embodiment of this application;

[0053] Figure 22a This is a schematic diagram of the structure of a display module provided in one embodiment of this application;

[0054] Figure 22b This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application;

[0055] Figure 23 This is a simplified structural diagram of a display module provided in one embodiment of this application;

[0056] Figure 24 A schematic diagram of the bonding wire output structure of a ribbon circuit board provided in an embodiment of this application;

[0057] Figure 25 A top view of the packaging section provided in an embodiment of this application;

[0058] Figure 26 A schematic diagram of the wiring on a flexible bonding circuit board and a ribbon cable circuit board provided in an embodiment of this application;

[0059] Figure 27 This is a schematic diagram of the waterproof structure of a display module provided in one embodiment of this application;

[0060] Figure 28a This is a schematic diagram of the structure of a display module provided in one embodiment of this application;

[0061] Figure 28b This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application;

[0062] Figure 28c This is a simplified structural diagram of a display module provided in one embodiment of this application;

[0063] Figure 29a This is a schematic diagram of the structure of a display module provided in one embodiment of this application;

[0064] Figure 29b This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application;

[0065] Figure 30 This is a simplified structural diagram of a display module provided in one embodiment of this application;

[0066] Figure 31 A top view of the packaging section provided in an embodiment of this application;

[0067] Figure 32a A schematic diagram of the wiring on a flexible bonding circuit board and a ribbon cable circuit board provided in an embodiment of this application;

[0068] Figure 32b This is a schematic diagram of another wiring diagram on a ribbon circuit board provided in an embodiment of this application;

[0069] Figure 33 This is a schematic diagram of the waterproof structure of a display module provided in one embodiment of this application;

[0070] Figure 34a A top view of a display module with its display panel in an unfolded state, provided for related technologies;

[0071] Figure 34b A side cross-sectional view of a display module with its display panel in a bent state, provided for related technologies;

[0072] Figure 35a A top view of a display module with its display panel in an unfolded state, according to an embodiment of this application;

[0073] Figure 35b A side cross-sectional view of a display module with its display panel in a bent state, according to an embodiment of this application;

[0074] Figure 36a A top view of a display module with its display panel in an unfolded state, according to an embodiment of this application;

[0075] Figure 36b A side cross-sectional view of a display module with its display panel in a bent state, according to an embodiment of this application;

[0076] Figure 37a A top view of a display module with its display panel in an unfolded state, according to an embodiment of this application;

[0077] Figure 37b This is a side cross-sectional view of a display module with its display panel in a bent state, according to an embodiment of this application.

[0078] Explanation of reference numerals in the attached figures:

[0079] 100 - Display module; 11 - Display panel; 111 - Display section; 112 - Bending section; 113 - Encapsulation section; 1131 - First bonding area; 1132 - Second bonding area;

[0080] 12-Driver chip; 13-Ribbon circuit board; 13a-First partition; 13b-Second partition; 1301-Trace layer; 1302-Insulating layer; 1303-Extension area; 131-Electronic components; 1321-Through hole; 1322-Blind hole;

[0081] 14-Flexible bonding circuit board; 140-Bonding pin; 141-Extension section; 142-Transition section; 143-Bonding section; 144-Support component; 15-Flexible outgoing circuit board; 151-Connecting section; 152-Main body section; 16-Metal plate; 17-Cover plate;

[0082] 181-Waterproof adhesive; 182-Waterproof adhesive backing; 191-Grounding point; 192-Conductive connector; 193-Conductive wire;

[0083] 200-Mid-frame; 21-Allow-avoidance hole; 300-Back cover; 400-Battery; 500-Main board; 50-Board to board connector; 51-Allow-avoidance hole. Detailed Implementation

[0084] "Mobile office," also known as "3A office" or mobile OA (Office Automation), means that office workers can handle anything related to business anytime, anywhere. This new office model frees office workers from the constraints of time and space, allowing for seamless information exchange and flow within the organization anytime, anywhere. Work becomes easier and more efficient, and overall operations become more coordinated. Furthermore, by utilizing mobile information software on smartphones and other electronic devices, interconnected enterprise software application systems can be established between mobile phones and computers, breaking free from time and location limitations and enabling on-the-go company management and communication, thus driving growth in government and corporate efficiency.

[0085] Whether it's a candybar phone, a foldable phone, or a tablet, these electronic devices should be made as thin and light as possible to fully leverage the advantages of mobile work. Limited by current battery technology, overall battery life will be a key bottleneck in achieving this. Therefore, maximizing battery capacity within limited space to deliver the best mobile work experience is a crucial aspect of the overall competitiveness of electronic devices.

[0086] In related technologies, display modules of electronic devices often employ COP (Chip On Pi) packaging technology, using a flexible substrate to fold the packaging portion on the display panel used for bonding cables and chips to the back of the display. In these technologies, the flexible circuit board area bonded by COP is relatively large, significantly occupying the length and width dimensions of the electronic device. This creates considerable wasted space for the battery within the device, becoming the primary factor contributing to battery capacity loss.

[0087] To address this issue, this application provides a display module and an electronic device in which both the ribbon circuit board and the driver chip are bound to the encapsulation portion of the display panel that is bent to the back of the light-emitting surface. This reduces the length and width dimensions occupied by the ribbon circuit board, thereby providing more space for the battery and increasing the battery capacity of the electronic device.

[0088] The following embodiments of this application provide an electronic device, including but not limited to mobile phones, foldable screen phones, tablet computers, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, wireless USB flash drives, Bluetooth speakers, Bluetooth headsets, or in-vehicle devices, and other electronic devices with displays.

[0089] In this embodiment of the application, a mobile phone is used as an example of the above-mentioned electronic device to specifically illustrate the structure of the electronic device.

[0090] It should be noted that in the figures of the embodiments of this application, the X-axis can be defined as the length direction of the electronic device, the Y-axis as the width direction of the electronic device, and the Z-axis as the thickness direction of the electronic device. More specifically, the light-emitting surface of the display screen of the electronic device can be defined as the positive direction of the Z-axis.

[0091] Figure 1 This is a schematic diagram of the structure of an electronic device provided according to an embodiment of this application. (Reference) Figure 1 As shown, the electronic device may include a mid-frame 200, and a display module 100 and a back cover 300 respectively connected to both sides of the mid-frame 200. The display module 100, the mid-frame 200, and the back cover 300 together form an accommodating space, in which a motherboard, a battery, a camera module, and other electronic devices may be installed.

[0092] Among them, the display module 100 may include a liquid crystal display (LCD), an organic light emitting diode (OLED) display panel, or other display panels. The middle frame 200 mainly plays a role in supporting the whole machine and can be made of materials such as metal, ceramic, glass, plastic, etc. The rear cover 300 can be made of materials such as metal, ceramic, glass, plastic, etc. The middle frame 200 and the rear cover 300 can be formed separately and fixed by means of welding, snap connection, bonding, etc.

[0093] Figure 2 FIG. is a schematic structural diagram of a display module, a middle frame, a main board, and a battery assembled according to an embodiment of the present application. Figure 3 FIG. is an exploded structural diagram of a display module, a middle frame, a main board, and a battery according to an embodiment of the present application. Refer to Figure 2 and Figure 3 As shown in FIGS. and, the display module 100 can be connected to one side of the middle frame 200, for example, the lower side in the figure, and the display module 100 can be fixed to the middle frame 200 by means of bonding. The main board 5**0 and the battery 400 can be arranged on the side of the middle frame 200 facing away from the display module 100, that is, arranged between the middle frame 200 and the rear cover 300.

[0094] The main board 500 can be fixedly connected to the middle frame 200 by means of bonding, screwing, etc., respectively. The battery 400 can be fixedly connected to the middle frame 200 by means of bonding, etc. The display module 100 and the battery 400 can be electrically connected to the main board 500 by means of flexible circuit boards, cables, conductive parts, etc., respectively. In the embodiment of the present application, the shape of the main board 500 and the positional relationship between the main board 500 and the battery 400 are not specifically limited. Exemplarily, the main board 500 can be set to a "C" shape and arranged around the battery 400.

[0095] Figure 4 FIG. is a partial cross-sectional schematic diagram of a display module according to an embodiment of the present application. Refer to Figure 3 and Figure 4 As shown in FIGS. and, the display module 100 may include a display panel 11, a driver chip 12, a flexible circuit board 13, a flexible bonding circuit board 14, and a flexible outgoing circuit board 15.

[0096] The driver chip 12 can be attached to the display panel 11 to drive the display panel 11 and realize the display function. The ribbon circuit board 13 can be attached to the display panel 11 through the flexible bonding circuit board 14. Various electronic devices 131, such as fingerprint module chips, can be arranged on the ribbon circuit board 13. One end of the flexible output circuit board 15 can extend from the side wall of the ribbon circuit board 13, and the other end can be connected to the motherboard 500. For example, it can be fastened to the motherboard 500 through a board-to-board (BTB) connector, thereby realizing the electrical connection between the display module 100 and the motherboard 500. The driver chip 12, ribbon circuit board 13, flexible bonding circuit board 14 and flexible output circuit board 15 can all be set on the back side of the light-emitting surface of the display panel 11, and the electronic devices 131 are located on the side of the ribbon circuit board 13 facing away from the display panel 11.

[0097] It should be understood that bonding, also known as wire bonding, refers to a wire bonding method in the manufacturing and packaging process of microelectronic devices. For example, it can use metal wires (such as gold wires) and utilize heat pressing or ultrasonic energy to complete the connection of internal interconnections of solid-state circuits in microelectronic devices. The process can include pressure welding, wire bonding, bonding, ball bonding, flat soldering, etc. For example, the driver chip 12 is bonded to the display panel 11, that is, the driver chip 12 is physically fixed and electrically connected to the display panel through welding or other methods.

[0098] A clearance hole 21 can be provided on the middle frame 200, and a clearance hole 51 can be provided on the main board 500. The clearance holes 21 and 51 correspond to the positions of the electronic device 131 and the flexible cable circuit board 15, so as to avoid the electronic device 131 and the flexible cable circuit board 15, so that the electronic device 131 has a larger layout space in the Z direction, and the flexible cable circuit board 15 can extend from the cable circuit board 13 and connect to the main board 500.

[0099] The display panel 11 may include a display section 111, a bending section 112, and an encapsulation section 113. The encapsulation section 113 can be bent to the back side of the light-emitting surface of the display section 111 via the bending section 112. The display section 111 is used to provide a display screen for the electronic device, while the encapsulation section 113 is used to bond the driver chip 12 and the ribbon circuit board 13. The display panel 11 may be a flexible part made of materials such as polyimide film. The encapsulation section 113 can be bent to the back side of the light-emitting surface of the display section 111 to reduce the length and width dimensions occupied by the electronic device.

[0100] The encapsulation portion 113 may include a first end and a second end. The first end is the end of the encapsulation portion 113 away from the bending portion 112, and the second end is the end of the encapsulation portion 113 connected to the bending portion 112. It should be understood that the direction from the first end of the encapsulation portion 113 to the second end can be defined as the wide side direction of the encapsulation portion 113, i.e., the X direction in the figure.

[0101] It should be noted that "first end" and "second end" refer to two mutually distant ends of a structure in a predetermined direction; that is, "first end" and "second end" are concepts of opposite ends, not "end faces" (i.e., sidewalls) of a structure. For example, the first end and second end of the encapsulation portion 113 are respectively the end away from the bending portion 112 and the end connected to the bending portion 112, and do not refer to the end face (i.e., sidewall) of the encapsulation portion 113. Furthermore, it should be understood that "first end" and "second end" refer to a length of region located at both ends of the structure, and are not limited to their distance from the end face. For example, the first end of the encapsulation portion 113 may refer to a range where the distance from the end face of the encapsulation portion 113 away from the bending portion 112 is within a first threshold value, such as 0-10 mm.

[0102] For ease of description, the extension direction of the wide side of the package portion 113 can be defined as the direction from the first end of the package portion 113 to the second end, i.e., the X direction in the figure. The side of the package portion 113 opposite to the bent portion 112 is its long side, i.e., the length direction of the ribbon cable circuit board 13 is the Y direction in the figure. At the same time, the length and width directions of the flexible bonding circuit board 14 of the ribbon cable circuit board 13 are consistent with the length and width directions of the package portion 113, with the length direction also being the Y direction in the figure and the width direction being the X direction in the figure.

[0103] The ribbon circuit board 13 can be disposed on the side of the encapsulation portion 113 that is opposite to the display portion 111. The ribbon circuit board 13 can be disposed between the first end and the second end of the encapsulation portion 113, that is, the entire width of the ribbon circuit board 13 is located on the encapsulation portion 113.

[0104] The ribbon circuit board 13 can be glued to the encapsulation part 113 with adhesive. At the same time, the ribbon circuit board 13 can be bound to the encapsulation part 113. A first binding area 1131 can be provided on the surface of the back display part 111 of the encapsulation part 113. The first binding area 1131 can be provided at the first end of the encapsulation part 113.

[0105] In one embodiment, the ribbon cable circuit board 13 can be bonded to the first bonding area 1131 by a flexible bonding circuit board 14. One end of the flexible bonding circuit board 14 can be connected to the ribbon cable circuit board 13, and the other end can be bonded to the first bonding area 1131. A second bonding area 1132 can also be provided on the surface of the package portion 113 facing away from the display portion 111. The driver chip 12 can be bonded to the second bonding area 1132. The second bonding area 1132 can be disposed between the first bonding area 1131 and the bending portion 112. There can be a gap between the second bonding area 1132 and the first bonding area 1131 to avoid mutual interference.

[0106] In one possible implementation, the first bonding area 1131 can be elongated, and its length can be made as large as possible while being smaller than the length of the package portion 113, so as to achieve the same bonding area with a smaller width. The position of the second bonding area 1132 is not specifically limited, for example, it can be set between the first bonding area 1131 and the bending portion 112. The number of second bonding areas 1132 can depend on the number of driver chips 12, for example, there can be two.

[0107] The ribbon circuit board 13 can be a multilayer printed circuit board (PCB) or a multilayer flexible printed circuit (FPC). The ribbon circuit board 13 can have multiple wiring layers, and the number of wiring layers can be greater than or equal to 2 layers, such as 4 or 6 layers. Increasing the number of wiring layers is beneficial to make full use of the space in the thickness direction of the electronic device and reduce the occupancy of the length and width dimensions of the electronic device.

[0108] The flexible bonding circuit board 14 can be a single-layer flexible circuit board to connect the ribbon circuit board 13 and the first bonding area 1131. The flexible bonding circuit board 14 can exit from one of the wiring layers of the ribbon circuit board 13. The flexible bonding circuit board 14 can exit from any wiring layer on the side wall of the ribbon circuit board 13, and the specific exit position is not limited.

[0109] In one scenario, the height of the driver chip 12 relative to the package 113 (including the thickness of the driver chip 12 itself and the thickness of the bonding solder) is less than the height of the ribbon cable circuit board 13 relative to the package 113 (including the thickness of the ribbon cable circuit board 13 itself and the thickness of the adhesive).

[0110] At this time, the flexible bonding circuit board 14 extends from the upper part of the ribbon circuit board 13, so that the flexible bonding circuit board 14 can cover the driver chip 12. The position of the flexible bonding circuit board 14 on the ribbon circuit board 13 relative to the height of the package portion 113 is greater than or equal to the height of the driver chip 12 relative to the package portion 113. The driver chip 12 can be located between the flexible bonding circuit board 14 and the first bonding area 1131, and the driver chip 12 is located between the ribbon circuit board 13 and the package portion 113.

[0111] In one possible implementation, the flexible bonding circuit board 14 may include an extension section 141, a transition section 142, and a bonding section 143 connected in sequence. The extension section 141 is connected to one of the wiring layers of the ribbon cable circuit board 13, and the driver chip 12 is located below the extension section 141. The bonding section 143 is bonded within a first bonding area 1131. The transition section 142 is bent to allow for a smooth transition between the extension section 141 and the bonding section 143, ensuring the reliability of the bonding section 143 soldering.

[0112] In this embodiment, a support member 144 may also be provided. The support member 144 may be made of materials such as foam. The height of the support member 144 is greater than the height of the driver chip 12. The support member 144 is located between the driver chip 12 and the first bonding area 1131. The support member 144 is used to support the extension segment 141 to prevent the extension segment 141 from interfering with the driver chip 12. Furthermore, the height of the connection between the extension segment 141 and the ribbon circuit board 13 is the same as the height of the support member 144. The support member 144 can ensure that the extension segment 141 remains horizontal.

[0113] Continue to refer to Figure 4 As shown, the display module 100 may also include a metal plate 16 and a cover plate 17. The metal plate 16 may be attached to the back side of the light-emitting surface of the display unit 111 to support the display module 100, increase the structural strength of the display module 100, and serve as the grounding terminal of the display module 100. The cover plate 17 is attached to the light-emitting surface side of the display unit 111 to protect the display unit 111.

[0114] Figure 5 A simplified structural diagram of a display module provided for related technologies, for reference. Figure 5 As shown, in the related technology, the packaging section 113 can be bent to the back side of the display section 111 via the bending section 112. The driver chip 12 is bound to the side of the packaging section 113 facing away from the display section 111. The ribbon circuit board 13 is located beside the packaging section 113 and is bound to the packaging section 113 via a flexible circuit board. The ribbon circuit board 13 is located on the side of the packaging section 113 facing away from the bending section 112, extends in the positive direction of the X-axis, and can be fastened to the main board 500 via a board-to-board connector 50. At this time, the X-axis dimension occupied by the ribbon circuit board 13 is D1, and the presence of D1 significantly affects the space of the battery 400.

[0115] In one related technology, D1 is reduced by integrating the electronic components 131 on the ribbon cable circuit board 13, thereby reducing the board area. However, this solution requires custom development of components, which is costly and cannot utilize currently available mature components, necessitating extensive verification of reliability issues. In another related technology, D1 can be reduced by setting the ribbon cable circuit board 13 as a rigid-flex board; however, this solution not only increases cost but also presents significant manufacturing challenges. Overall, the solutions provided by these related technologies can only continuously reduce D1 at a high cost, with a design value of 6mm in extreme cases, making it impossible to reduce it to 0.

[0116] Figure 6 This is a simplified structural diagram of a display module provided in one embodiment of this application. (See reference...) Figure 6 As shown in this embodiment, the ribbon cable circuit board 13 is configured as a multilayer circuit board and is bonded to the first bonding area 1131 on the package portion 113 by a single-layer flexible bonding circuit board 14. By both the ribbon cable circuit board 13 and the flexible bonding circuit board 14 are disposed on the package portion 113, and both the ribbon cable circuit board 13 and the flexible bonding circuit board 14 are located between the first end and the second end of the package portion 113, it is equivalent to... Figure 5 In the related technology, the ribbon circuit board 13 is reverse-laid onto the package section 113 in the X direction, which can maximize the use of the space on the package section 113, compared to Figure 5 As can be seen, D1 is reduced to 0 in this embodiment of the application. Therefore, the solution provided by this embodiment of the application can significantly increase the layout space of the battery 400.

[0117] It should also be noted that the X-axis dimension occupied by the packaging section 113 is D2. With the size of the packaging section 113 remaining constant, the area that the ribbon cable circuit board 13 can occupy is limited. In this embodiment, the ribbon cable circuit board 13 is configured as a multi-layer board to increase the ribbon cable area; for example, this multi-layer board can be a four-layer board. In one possible implementation, the X-axis dimension occupied by the packaging section 113 can be further reduced to provide more space for the battery 400. In this case, the ribbon cable circuit board 13 can adaptively increase the number of layers, for example, by configuring it as a six-layer board, to ensure the ribbon cable area. It should be understood that the solution provided in this embodiment shows a more significant advantage in space utilization when the area of ​​the packaging section 113 is smaller.

[0118] Figure 7 This is a schematic diagram of the bonding wire output structure of a ribbon circuit board according to an embodiment of this application. (Reference) Figure 7As shown, the overall width of the package 113 can be D2, the width of the ribbon circuit board 13 can be D3, and the width of the flexible bonding circuit board 14 can be D4. The ribbon circuit board 13 is a multilayer circuit board, including multiple wiring layers 1301 and an insulating layer 1302 disposed between two adjacent wiring layers 1301. The flexible bonding circuit board 14 can be formed by routing out one of the wiring layers 1301 in the ribbon circuit board 13. This wiring layer 1301 can be any wiring layer 1301 in the ribbon circuit board 13 that is higher than the driver chip 12, so as to ensure that the routing height is greater than the height of the driver chip 12 and prevent the flexible bonding circuit board 14 from interfering with the driver chip 12.

[0119] In addition, it should be understood that the lead-out height of the flexible bonding circuit board 14 is related to the height of each wiring layer 1301 of the ribbon circuit board 13. When the lead-out height of the flexible bonding circuit board 14 is slightly lower than the height of the driver chip 12, the height of the ribbon circuit board 13 can be increased by increasing the thickness of the adhesive between the ribbon circuit board 13 and the package 113 to avoid the flexible bonding circuit board 14 interfering with the driver chip 12.

[0120] Furthermore, the routing layer 1301, which serves as the outgoing trace, can be the layer closest in height to the driver chip 12 to reduce the gap between the extension section 141 and the bonding section 143, preventing excessive gaps from causing poor soldering. This solution is beneficial for effectively placing the driver chip 12 using the Z-axis space of the ribbon circuit board 13, resulting in a reasonable spatial layout.

[0121] The bonding scheme for the ribbon circuit board 13 provided in the above-described embodiments of this application can be applied to situations where the thickness of the ribbon circuit board 13 is greater than the height of the driver chip 12. In one specific embodiment, the ribbon circuit board 13 can be a six-layer board with a thickness of approximately 0.35 mm, and the driver chip 12 has a thickness of approximately 0.25 mm.

[0122] Figure 8 This is a top view of the packaging section provided in an embodiment of this application. Figure 9 This is a schematic diagram of the wiring on a flexible bonding circuit board and a ribbon cable circuit board provided in an embodiment of this application. Figure 9 for Figure 8 A magnified diagram of the internal wiring within the area enclosed by the dashed line. (Reference) Figure 8 and Figure 9 As shown, the bonding section 143 of the flexible bonding circuit board 14 is provided with bonding pins 140 for bonding with the first bonding area 1131. The remaining areas of the flexible bonding circuit board 14 are provided with traces connected to the bonding pins 140. The extension direction of the traces is consistent with the width direction of the flexible bonding circuit board 14. The traces can communicate with the vias and ribbon cables in the ribbon circuit board 13. Traces can be routed on the multiple layers of the ribbon circuit board 13.

[0123] Figure 10 A top view schematic diagram of the waterproof structure of a display module provided for related technologies. Figure 11 A side view of the waterproof structure of a display module provided for related technologies. (Reference) Figure 10 and Figure 11 As shown, in related technologies, waterproof protection of the ribbon cable circuit board 13 is achieved by providing positive adhesive 1801 and back adhesive 1802 on the front (light-emitting surface side) and back (light-emitting surface back side) of the first bonding area 1131, respectively.

[0124] Figure 12 This is a schematic diagram of the waterproof structure of a display module provided in one embodiment of this application. (Reference) Figure 12 As shown in this embodiment, waterproof adhesive 181 can be provided on the edges of three sides (excluding the side facing the bending portion 112) of the flexible bonding circuit board 14. The waterproof adhesive 181 can fill the gap (Z-direction space) between the flexible bonding circuit board 14 and the encapsulation portion 113, which can prevent liquid from entering below the flexible bonding circuit board 14 and prevent liquid from damaging the flexible bonding circuit board 14 and the driver chip 12.

[0125] Meanwhile, a waterproof adhesive 182 can be provided on one edge of the encapsulation part 113 near the bending part 112. The length of the waterproof adhesive 182 is the same as the length of the encapsulation part 113. The waterproof adhesive 182 can fill the Z-direction space between the encapsulation part 113 and the middle frame 200, which can prevent external liquid from entering the encapsulation part 113 and prevent liquid from damaging the ribbon circuit board 13.

[0126] The waterproof adhesive 182 can be applied to one end of the ribbon cable circuit board 13 near the bend 112 and extend along the length of the ribbon cable circuit board 13, covering the entire length of the ribbon cable circuit board 13. The projections of the waterproof adhesive 181 and the waterproof adhesive 182 on the encapsulation part 113 can form a closed shape, that is, the two can together form a complete sealed space, providing waterproof protection for the entire encapsulation part 113 of the display module 100.

[0127] It should be noted that the waterproof adhesive 182 in this embodiment is arranged in a straight line, which is due to the design of the flexible lead-out circuit board 15. The structure of the flexible lead-out circuit board 15 will be described below with reference to the accompanying drawings and specific embodiments.

[0128] Figure 13 A schematic diagram showing the location of the flexible outgoing circuit board provided for related technologies. (Reference) Figure 13 As shown, in the related technology, the flexible output circuit board 15 is located in the middle of the long side of the ribbon circuit board 13, and the long side of the ribbon circuit board 13 refers to the side opposite to the bent portion 112.

[0129] This design presents several problems: First, the cable exiting from the center of the ribbon circuit board 13 requires a break in the board and the addition of anti-crack grooves. This wastes space in the XY direction for component placement and wiring within the limited architectural space, resulting in a reduction in battery capacity. Second, when the flexible cable exiting circuit board 15 is located in the center of the ribbon circuit board 13, the board-to-board connector that it is attached to is also located in the middle of the entire device. This location necessitates a partial opening in the middle frame 200 to allow the flexible cable exiting circuit board 15 to engage with the board-to-board connector. Given the maximum wall thickness of the middle frame 200, the central opening significantly impacts the three-bar bending strength of the middle frame and the overall three-bar bending strength, weakening the overall strength and increasing reliability risks.

[0130] Figure 14 This is a schematic diagram showing the location of a flexible outgoing circuit board provided in one embodiment of this application. Figure 14 This illustrates the process by which the flexible lead-out circuit board 15 switches from an unfolded state to a bent state. Figure 15 for Figure 3 Enlarged view of the structure within the dashed box. (Reference) Figure 14 and Figure 15 As shown in the embodiment of this application, the flexible output circuit board 15 can be connected to the wide side of the ribbon circuit board 13. It should be understood that the long side of the ribbon circuit board 13 refers to the side opposite to the bend 112, and the wide side refers to the side connected between the two long sides. The extension direction of the wide side of the ribbon circuit board 13 refers to the direction from the side of the ribbon circuit board 13 near the bend 112 to the side away from the bend 112.

[0131] Various electronic devices 131, such as fingerprint module chips, can be arranged on the ribbon circuit board 13. One end of the flexible lead-out circuit board 15 can be connected to the ribbon circuit board 13, and the other end can be connected to the motherboard 500, thereby realizing the electrical connection between the display module 100 and the motherboard 500. The driver chip 12, ribbon circuit board 13, flexible bonding circuit board 14, and flexible lead-out circuit board 15 are all located on the back side of the light-emitting surface of the display panel 11, and the electronic devices 131 are located on the side of the ribbon circuit board 13 facing away from the packaging part 113.

[0132] In this embodiment, the flexible outgoing circuit board 15 can be configured as a single-layer flexible circuit board or a multi-layer flexible circuit board. The flexible outgoing circuit board 15 can output wires from any one or any multiple wiring layers (1301) of the cabling circuit board 13. For example, the flexible outgoing circuit board 15 can be a two-layer flexible circuit board. By configuring the flexible outgoing circuit board 15 as a multi-layer board, the outgoing area can be increased.

[0133] Figure 16 for Figure 2Enlarged view of the structure within the dashed box. (Reference) Figure 15 and Figure 16 As shown, one end of the flexible output circuit board 15 can extend from the wide side of the ribbon circuit board 13, and the other end can be fastened to the motherboard 500 via BTB. The electronic device 131 may include a touch chip, auxiliary capacitors and other devices. The electronic device 131 contains solder and can be spot-welded to the upper surface of the ribbon circuit board 13 (the surface of the back package portion 113 of the ribbon circuit board 13).

[0134] The flexible lead-out circuit board 15 can lead out from any one or more wiring layers of the ribbon circuit board 13, for example, it can lead out from the third layer of the ribbon circuit board 13. The flexible lead-out circuit board 15 may include a connecting section 151 and a main body section 152. The main body section 152 is bent to the side of the ribbon circuit board 13 opposite to the package portion 113 through the connecting section 151. The connecting section 151 is in a bent state, and the main body section 152 is in a state parallel to the ribbon circuit board 13.

[0135] The height of the main body section 152 relative to the ribbon circuit board 13 can be greater than the height of the electronic device 131, so that the flexible outgoing circuit board 15 does not interfere with the electronic device 131 below it.

[0136] Additionally, the lower surface of the flexible outgoing circuit board 15 ( Figure 15 and Figure 16 The maximum design value of the distance (Z-axis height dimension) between the surface of the flexible output circuit board 15 (facing the top surface of the ribbon circuit board 13) and the upper surface of the ribbon circuit board 13, i.e., the maximum design value of the spacing between the flexible output circuit board 15 and the ribbon circuit board 13, is the sum of the maximum design values ​​of the design gap, the thickness of the middle frame 200, the thickness of the main board 500, and the height of the BTB. The maximum design value of the design gap can be 0 or 0.2 mm. The maximum design value of the wall thickness of the middle frame 200 is 0. The maximum design value of the thickness of the main board 500 is 0.5 mm. The standard maximum working height of the BTB is 0.66 mm. Therefore, this maximum distance value is greater than or equal to 1.36 mm. This dimension determines the bending radius of the flexible output circuit board 15 (i.e., the dimension of the connecting section 151), and this dimension must not be less than the height of each electronic component 131.

[0137] In scenarios with extremely limited design space (overall thickness less than 5.5mm), the area on the motherboard 500 corresponding to the electronic device 131 requires a design that breaks the board, i.e., designing avoidance holes to prevent interference with the electronic device 131. In this embodiment, multiple electronic devices 131 can be designed in a clustered manner. For example, such as... Figure 14The left and right ends of the ribbon circuit board 13 can be used to place some electronic components, while the rest are placed in the middle. The integrated design of the components allows the motherboard 500 to have the smallest breakage area and has the least impact on the wiring and component space on the motherboard 500.

[0138] Figure 17 A schematic diagram of a waterproofing solution for the flexible outgoing circuit board provided for related technologies. (Reference) Figure 17 As shown in the related technology, when the flexible cable exit circuit board 15 exits from the middle of the long side of the cable routing circuit board 13, the waterproof path of the entire device needs to be avoided at the middle cable exit position, as shown by the waterproof adhesive 182 in the figure. Since the waterproof adhesive 182 needs to avoid the cable exit position, the waterproof path needs to be curved instead of straight. According to the principle that the shortest distance between two points is a straight line, this results in wasted waterproof space, increased difficulty in applying adhesive, and increased cost. Therefore, the middle cable exit solution greatly affects the product's competitiveness.

[0139] Figure 18 This is a schematic diagram of a waterproofing solution for a flexible outgoing circuit board provided in one embodiment of this application. (Reference) Figure 18 As shown in the embodiment of this application, since the flexible lead-out circuit board 15 is set on the wide side of the ribbon cable circuit board 13, the flexible lead-out circuit board 15 will not affect the setting of the waterproof backing adhesive 182. The waterproof backing adhesive 182 can be set as a straight line, thereby solving the defects caused by the center lead-out of the related technology.

[0140] In addition, the central cabling solution provided by the related technology is not conducive to the assembly of the display module 100. Figure 19 A schematic diagram of the unfolded structure of the packaging section provided for related technologies. (Reference) Figure 19 As shown, it should be understood that the assembly process of the display module 100 generally involves first bonding the driver chip 12 and the ribbon circuit board 13 to the encapsulation portion 113 of the display panel 11, and then attaching components such as optical adhesive and cover plate 17. After the ribbon circuit board 13 is bonded, the flexible lead-out circuit board 15 will enter the display portion 111, which will cause interference problems in subsequent processes and prevent them from being implemented, affecting the subsequent bonding process and the testing process of the display module 100.

[0141] Figure 20 This is a schematic diagram of the unfolded structure of the packaging section provided in one embodiment of this application. (See reference...) Figure 20 As shown in this embodiment, since the flexible lead-out circuit board 15 is disposed on the wide side of the ribbon circuit board 13, the flexible lead-out circuit board 15 will not enter the display section 111 during the assembly process of the display module 100, and therefore will not affect the assembly process of the display module 100.

[0142] Overall, the assembly process of the display module provided in this application embodiment may include the following steps: First, the driver chip 12 is bound in the second binding area 1132 within the package 113; then, the ribbon cable circuit board 13 is bonded to the package 113 with waterproof adhesive, and the flexible binding circuit board 14 is bound to the first binding area 1131; next, the cover plate 17 is attached to the light-emitting surface side of the display 111.

[0143] It should be understood that the encapsulation part 113 is bent to the back side of the light-emitting surface of the display part 111 via the bending part 112, and this process can be performed during the assembly of the display module 100 onto the mid-frame 200. The process of attaching the end of the flexible lead circuit board 15 to the main board 500 via BTB can be performed after the display module 100, mid-frame 200, and main board 500 are assembled.

[0144] The above Figures 2-9 In the provided embodiment, the multilayer ribbon circuit board 13 is bound to the first binding area 1131 by a single-layer flexible bonding circuit board 14. The driver chip 12 is located between the first binding area 1131 and the ribbon circuit board 13. The flexible bonding circuit board 14 extends from the upper part of the ribbon circuit board 13 and is raised above the driver chip 12 under the support of the support member 144.

[0145] In another embodiment, the multilayer ribbon circuit board 13 can also be bonded to the first bonding area 1131 by a single-layer flexible bonding circuit board 14. Through-holes or blind holes for accommodating the driver chip 12 can be provided on the ribbon circuit board 13 to make fuller use of the area of ​​the package portion 113 and increase the area of ​​the ribbon circuit board 13. Hereinafter, the solutions provided by the embodiments of this application will be described with reference to the specific accompanying drawings.

[0146] Figure 21a This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 21b This is a partial cross-sectional schematic diagram of a display module provided in one embodiment of this application. (See reference...) Figure 21a and Figure 21b As shown, the display module 100 may include a display panel 11, a driver chip 12, a ribbon cable circuit board 13, a flexible bonding circuit board 14, and a flexible outgoing circuit board 15. The specific structures of the display panel 11 and the flexible outgoing circuit board 15 can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0147] In this embodiment, the ribbon cable circuit board 13 can be a multilayer printed circuit board or a multilayer flexible circuit board, and the flexible bonding circuit board 14 can be a single-layer flexible circuit board. One end of the flexible bonding circuit board 14 can be connected to the ribbon cable circuit board 13, and the other end is bonded to the first bonding area 1131 on the package portion 113. A through hole 1321 can be formed on the ribbon cable circuit board 13, and a second bonding area 1132 is provided on the package portion 113 in the area corresponding to the through hole 1321. The driver chip 12 can be disposed in the through hole 1321 and bonded to the second bonding area 1132.

[0148] The first bonding area 1131 can be located at the end of the package portion 113 away from the bending portion 112, and the first bonding area 1131 can be elongated. There can be two second bonding areas 1132. The area of ​​the through-hole 1321 can be slightly larger than the area of ​​the driver chip 12 to avoid interference between the driver chip 12 and the ribbon circuit board 13. By providing through-holes 1321 on the ribbon circuit board 13 to arrange the driver chip 12, it is advantageous to increase the area of ​​the ribbon circuit board 13 or reduce the area of ​​the package portion 113.

[0149] Figure 21c This is a simplified structural diagram of a display module provided in one embodiment of this application. (See reference...) Figure 21c As shown, in this embodiment of the application, the ribbon cable circuit board 13 is configured as a multilayer circuit board and is bonded to the first bonding area 1131 on the package portion 113 by a single-layer flexible bonding circuit board 14. By both the ribbon cable circuit board 13 and the flexible bonding circuit board 14 are disposed between the first end and the second end of the package portion 113, the space on the package portion 113 can be utilized to the maximum extent, compared to Figure 5 As can be seen, D1 is reduced to 0 in this embodiment of the application. Therefore, the solution provided by this embodiment of the application can significantly increase the layout space of the battery 400.

[0150] Figures 21a-21c The embodiments shown are applicable to a wide range of scenarios, and the relationship between the height of the driver chip 12 relative to the package portion 113 (including the thickness of the driver chip 12 itself and the thickness of the bonding solder) and the height of the ribbon cable circuit board 13 relative to the package portion 113 (including the thickness of the ribbon cable circuit board 13 itself and the thickness of the adhesive) is not limited.

[0151] Figure 22a This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 22b This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application. Figure 23 This is a simplified structural diagram of a display module provided in one embodiment of this application. (See reference...) Figures 22a-23As shown, in another embodiment of the scheme of using a flexible bonding circuit board 14 to bond and making holes in the ribbon cable circuit board 13, a blind hole 1322 can be made in the ribbon cable circuit board 13, the driver chip 12 is located in the blind hole 1322, and the opening of the blind hole 1322 faces the ribbon cable circuit board 13.

[0152] refer to Figure 23 It can be seen that the sum of the depth of the blind via 1322 and the thickness of the adhesive (the black filled area in the figure) is greater than or equal to the height of the driver chip 12 relative to the package portion 113, in order to avoid interference between the bottom wall of the blind via 1322 and the driver chip 12. It should be understood that the depth of the blind via 1322 is related to the height of each wiring layer 1301 of the ribbon circuit board 13. When the depth of the blind via 1322 is slightly lower than the height of the driver chip 12, the height of the ribbon circuit board 13 can be increased by increasing the thickness of the adhesive between the ribbon circuit board 13 and the package portion 113, thereby preventing the flexible bonding circuit board 14 from interfering with the driver chip 12.

[0153] It should be understood that the use of blind via 1322 to house the driver chip 12 is more suitable for solutions where the thickness of the driver chip 12 is less than the thickness of the ribbon circuit board 13. By using blind via 1322 to house the driver chip 12, a trace layer can still be arranged in the area above the blind via 1322, thereby increasing the trace area.

[0154] Figures 22a-30 The illustrated embodiment is applicable to scenarios where the height of the driver chip 12 relative to the package portion 113 (including the thickness of the driver chip 12 itself and the thickness of the bonding solder) is less than the height of the ribbon cable circuit board 13 relative to the package portion 113 (including the thickness of the ribbon cable circuit board 13 itself and the thickness of the adhesive).

[0155] Figure 24 This is a schematic diagram of the bonding wire output structure of a ribbon circuit board according to an embodiment of this application. (Reference) Figure 24 As shown, the overall width of the package 113 can be D2, the width of the ribbon circuit board 13 can be D3, and the width of the flexible bonding circuit board 14 can be D4. The ribbon circuit board 13 is a multilayer circuit board, including multiple wiring layers 1301 and insulating layers 1302. The flexible bonding circuit board 14 can be formed by routing wires from one of the wiring layers 1301 in the ribbon circuit board 13. This wiring layer 1301 can be the bottom wiring layer of the ribbon circuit board 13 (the wiring layer 1301 closest to the package 113) to prevent the problem of poor soldering caused by excessive discontinuity.

[0156] This solution effectively utilizes the Z-axis space of the ribbon circuit board 13 to place the driver chip 12, resulting in a reasonable spatial layout. The through-hole solution for the ribbon circuit board 13 provided in this application embodiment is suitable when the thickness of the ribbon circuit board 13 is less than or equal to the height of the driver chip 12. The blind via solution for the ribbon circuit board 13 provided in this application embodiment is suitable when the thickness of the ribbon circuit board 13 is greater than the height of the driver chip 12. Simultaneously, the ribbon circuit board 13 has a relatively wide width, which is beneficial for wiring and components. In one specific embodiment, the ribbon circuit board 13 can be a four-layer board with a thickness of approximately 0.35 mm, and the driver chip 12 has a thickness of approximately 0.25 mm.

[0157] Figure 25 This is a top view of the packaging section provided in an embodiment of this application. Figure 26 This is a schematic diagram of the wiring on a flexible bonding circuit board and a ribbon cable circuit board provided in an embodiment of this application. Figure 26 for Figure 25 A magnified diagram of the internal wiring within the area enclosed by the dashed line. (Reference) Figure 25 and Figure 26 As shown, the flexible bonding circuit board 14 may be provided with bonding pins 140 for bonding with the first bonding area 1131. The remaining areas of the flexible bonding circuit board 14 are provided with traces connected to the bonding pins 140. The extension direction of the traces is consistent with the width direction of the flexible bonding circuit board 140. The traces can communicate with the vias and ribbon cables in the ribbon circuit board 13. Traces can be routed on the multiple layers of the ribbon circuit board 13.

[0158] Figure 27 This is a schematic diagram of the waterproof structure of a display module provided in one embodiment of this application. (Reference) Figure 27 As shown in this embodiment, waterproof adhesive 181 can be provided on the edges of three sides (excluding the side facing the bending portion 112) of the flexible bonding circuit board 14. The waterproof adhesive 181 can fill the Z-direction space between the flexible bonding circuit board 14 and the encapsulation portion 113, which can prevent liquid from entering under the flexible bonding circuit board 14 and prevent liquid from damaging the flexible bonding circuit board 14.

[0159] Meanwhile, a waterproof adhesive 182 can be provided on one edge of the encapsulation part 113 near the bending part 112. The length of the waterproof adhesive 182 is the same as the length of the encapsulation part 113. The waterproof adhesive 182 can fill the Z-direction space between the encapsulation part 113 and the middle frame 200, which can prevent external liquids from entering the encapsulation part 113 and prevent liquids from damaging the ribbon circuit board 13 and the driver chip 12. The waterproof adhesive 181 and the waterproof adhesive 182 can together form a complete sealed space, which provides waterproof protection for the entire encapsulation part 113 of the display module 100.

[0160] It should be noted that the waterproof adhesive 182 in this embodiment is arranged in a straight line, which is due to the design of the flexible lead-out circuit board 15. The structure of the flexible lead-out circuit board 15 can be referred to the previous description, and will not be repeated here.

[0161] Figure 21 above Figure 27 In the provided embodiment, the multilayer ribbon circuit board 13 is bound to the first binding area 1131 by a single-layer flexible bonding circuit board 14. The flexible bonding circuit board 14 extends from the lower part of the ribbon circuit board 13, and the driving chip 12 is located in the through hole 1321 in the ribbon circuit board 13.

[0162] In another embodiment, the multilayer ribbon circuit board 13 can be bonded to the first bonding area 1131 by a wiring layer covering a portion of its own area. The solution provided by the embodiments of this application will now be described with reference to the specific accompanying drawings.

[0163] Figure 28a This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 28b This is a partial cross-sectional schematic diagram of a display module provided in one embodiment of this application. (See reference...) Figure 28a and Figure 28b As shown in the embodiments of this application, the display module 100 may include a display panel 11, a driver chip 12, a ribbon cable circuit board 13, and a flexible cable output circuit board 15. The specific structures of the display panel 11 and the flexible cable output circuit board 15 can be referred to the description of the foregoing embodiments, and will not be repeated here.

[0164] In this embodiment, a first bonding area 1131 may be provided on the surface of the back display portion 111 of the encapsulation portion 113. The first bonding area 1131 may be located at the first end of the encapsulation portion 113, and the ribbon circuit board 13 may be located between the first end and the second end of the encapsulation portion 113. A portion of the ribbon circuit board 13 itself may be bonded to the encapsulation portion 113 through the first bonding area 1131. Except for the area bonded to the first bonding area 1131, the ribbon circuit board 13 may be adhered to the encapsulation portion 113 by adhesive. The ribbon circuit board 13 may be a multilayer printed circuit board or a multilayer flexible circuit board to fully utilize the space in the thickness direction of the electronic device and reduce the occupancy of the length and width dimensions of the electronic device.

[0165] A second bonding area 1132 may also be provided on the surface of the packaging portion 113 facing away from the display portion 111, and the driver chip 12 may be bonded within the second bonding area 1132. In one possible embodiment, the first bonding area 1131 may be provided at the end of the packaging portion 113 away from the bend portion 112, and the first bonding area 1131 may be elongated. A through hole 1321 may be provided on the ribbon circuit board 13, and the second bonding area 1132 is provided in the area corresponding to the through hole 1321, and the driver chip 12 may be disposed within the through hole 1321.

[0166] The area of ​​the through-hole 1321 is slightly larger than the area of ​​the driver chip 12 to avoid interference between the driver chip 12 and the ribbon circuit board 13. By setting the through-hole 1321 on the ribbon circuit board 13 to arrange the driver chip 12, the layout is more compact than other layout methods such as setting the ribbon circuit board 13 and the driver chip 12 side by side, which helps to reduce the area of ​​the package portion 113.

[0167] Figure 28c This is a simplified structural diagram of a display module provided in an embodiment of this application. In this embodiment, the entire width of the ribbon circuit board 13 is correspondingly disposed on the encapsulation portion 113, and a portion of the end of the ribbon circuit board 13 is used to bind it within the first binding area 1131 on the encapsulation portion 113. By utilizing a portion of the ribbon circuit board 13 for binding, the space on the encapsulation portion 113 can be utilized to the maximum extent, compared to Figure 5 As can be seen, D1 is reduced to 0 in this embodiment of the application. Therefore, the solution provided by this embodiment of the application can significantly increase the layout space of the battery 400.

[0168] It should also be noted that the X-axis dimension occupied by the packaging section 113 is D2. With the size of the packaging section 113 remaining constant, the area that the ribbon cable circuit board 13 can occupy is limited. In this embodiment, the ribbon cable circuit board 13 is configured as a multilayer board to increase the ribbon cable area. This multilayer board can be, for example, a four-layer board or a six-layer board. In one possible implementation, the X-axis dimension occupied by the packaging section 113 can be further reduced to provide more space for the battery 400. In this case, the ribbon cable circuit board 13 can adaptively increase the number of layers to ensure the ribbon cable area. Therefore, the solution provided in this embodiment shows a more significant advantage in space utilization when the area of ​​the packaging section 113 is smaller.

[0169] In this embodiment, the ribbon circuit board 13 is configured as a multi-layer circuit board, and the ribbon circuit board 13 itself is used for bonding. Compared with the solution of setting an additional single-layer circuit board for bonding, the wiring area of ​​the ribbon circuit board 13 can be further increased, and the space utilization rate can be improved.

[0170] Figure 29a This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 29b This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application. Figure 30 This is a simplified structural diagram of a display module provided in one embodiment of this application. (See reference...) Figures 29a-30 As shown, in another embodiment of the solution that uses a portion of the ribbon circuit board 13 itself for bonding, a blind hole 1322 can be formed on the ribbon circuit board 13, and the driver chip 12 is located in the blind hole 1322.

[0171] refer to Figure 30 It can be seen that the sum of the depth of the blind via 1322 and the thickness of the adhesive (the black filled area in the figure) is greater than or equal to the height of the driver chip 12 relative to the package portion 113, in order to avoid interference between the bottom wall of the blind via 1322 and the driver chip 12. It should be understood that the depth of the blind via 1322 is related to the height of each wiring layer 1301 of the ribbon circuit board 13. When the depth of the blind via 1322 is slightly lower than the height of the driver chip 12, the height of the ribbon circuit board 13 can be increased by increasing the thickness of the adhesive between the ribbon circuit board 13 and the package portion 113, thereby preventing the flexible bonding circuit board 14 from interfering with the driver chip 12.

[0172] It should be understood that the use of blind via 1322 to house the driver chip 12 is more suitable for solutions where the thickness of the driver chip 12 is less than the thickness of the ribbon circuit board 13. By using blind via 1322 to house the driver chip 12, a trace layer can still be arranged in the area above the blind via 1322, thereby increasing the trace area.

[0173] Figure 31 This is a top view of the packaging section provided in an embodiment of this application. Figure 32a This is a schematic diagram of the wiring on a flexible bonding circuit board and a ribbon cable circuit board provided in an embodiment of this application. Figure 32a for Figure 31 A magnified diagram of the internal wiring within the area enclosed by the dashed line. (Reference) Figure 31 and Figure 32a As shown, the ribbon cable circuit board 13 can be divided into a first partition 13a and a second partition 13b. The first partition 13a corresponds to the first bonding area 1131. A bonding pin 140 can be provided in the first partition 13a for bonding with the first bonding area 1131. The bonding pin 140 is located on the wiring layer of the ribbon cable circuit board 13 closest to the package portion 113, that is, on the bottom wiring layer of the ribbon cable circuit board 13. The second partition 13b can be attached to the package portion 113 with adhesive.

[0174] In one possible implementation, only bonding pins 140 are provided in the first partition 13a of the ribbon circuit board 13 corresponding to the first bonding area 1131, without any other traces or vias. Traces and vias can be provided in the second partition 13b of the ribbon circuit board 13, excluding the area corresponding to the first bonding area 1131, and the trace paths must avoid the driver chip 12. In this case, the bonding pins 140 can be connected to traces on the bottom layer of the second partition 13b.

[0175] Figure 32b This is another schematic diagram of the wiring on a ribbon cable circuit board provided in one embodiment of this application. Figure 32b for Figure 31 A magnified diagram of the internal wiring within the area enclosed by the dashed line. (Reference) Figure 32b As shown, in another possible implementation, the ribbon circuit board 13 can be divided into a first partition 13a and a second partition 13b. The first partition 13a corresponds to the first bonding area 1131. A bonding pin 140 is provided on the first partition 13a to bond with the first bonding area 1131. The bonding pin 140 is located on the wiring layer of the ribbon circuit board 13 that is closest to the package portion 113, that is, on the bottom wiring layer of the ribbon circuit board 13.

[0176] Meanwhile, traces and vias can be set on the other trace layers in the first partition 13a, except for the bottom trace layer. In this case, the bonding pin 140 can be connected to traces on non-bottom trace layers in the first partition 13a via vias or other means. This fully utilizes the area of ​​the trace layers on the ribbon circuit board 13, increasing wiring space. Similarly, traces and vias on the second partition 13b should avoid the driver chip 12.

[0177] Figure 33 This is a schematic diagram of the waterproof structure of a display module provided in one embodiment of this application. (Reference) Figure 33 As shown in this embodiment, waterproof adhesive 181 can be provided on the edges of three sides (excluding the side facing the bend 112) of the first bonding area 1131. The waterproof adhesive 181 can fill the Z-direction space between the ribbon circuit board 13 and the encapsulation part 113, preventing liquid from entering the first bonding area 1131 and preventing liquid from damaging the first bonding area 1131. It should be understood that the waterproof adhesive 181 can also cover the other three edges of the ribbon circuit board 13, excluding the side facing the bend 112.

[0178] Meanwhile, a waterproof adhesive 182 can be provided on one edge of the encapsulation part 113 near the bending part 112. The length of the waterproof adhesive 182 is the same as the length of the encapsulation part 113. The waterproof adhesive 182 can fill the Z-direction space between the encapsulation part 113 and the middle frame 200, which can prevent external liquids from entering the encapsulation part 113 and prevent liquids from damaging the ribbon circuit board 13 and the driver chip 12. The waterproof adhesive 181 and the waterproof adhesive 182 can together form a complete sealed space, which provides waterproof protection for the entire encapsulation part 113 of the display module 100.

[0179] It should be noted that the waterproof adhesive 182 in this embodiment is arranged in a straight line, which is due to the design of the flexible lead-out circuit board 15. The structure of the flexible lead-out circuit board 15 can be referred to the previous description, and will not be repeated here.

[0180] Based on the above embodiments of this application, this application also provides several implementation methods for the grounding structure of the display module 100. Hereinafter, the grounding structure of the display module 100 provided in the embodiments of this application will be described with reference to the accompanying drawings.

[0181] Figure 34a A top view of a display module with its display panel in an unfolded state, provided for related technologies. Figure 34b A side cross-sectional view of a display module with its display panel in a bent state, provided for related technologies. (Reference) Figure 34a and Figure 34b As shown, in the related technology, a grounding point 191 can be provided on the side of the ribbon circuit board 13 facing the light-emitting surface of the display section (based on the bent state). The grounding point 191 can be formed by making a copper leakage design on the surface of the ribbon circuit board 13. After the display panel 11 is bent, the grounding point 191 can contact and conduct with the metal plate 16, thereby achieving grounding.

[0182] It is easy to understand that, in this embodiment, after the display panel 11 is bent, the ribbon cable circuit board 13 and the metal plate 16 are separated by the encapsulation portion 113. Therefore, if a grounding point 191 is directly provided on the side of the ribbon cable circuit board 13 facing the light-emitting surface of the display section, the grounding point 191 cannot be directly connected to the metal plate 16. Therefore, the grounding structure of the display module 100 provided by related technologies is not applicable to this application.

[0183] Figure 35a This is a top view of a display module with its display panel in an unfolded state, according to an embodiment of this application. Figure 35b This is a side cross-sectional view of a display module with its display panel in a bent state, according to an embodiment of this application. (See reference...) Figure 35a and Figure 35bAs shown, in one possible implementation, the ribbon cable circuit board 13 can extend beyond the wide side of the encapsulation portion 113, with the extended length forming an extension area 1303. A grounding point 191 can be disposed on the extension area 1303. That is, the length L2 of the ribbon cable circuit board 13 can be greater than the length of the encapsulation portion 113, while the length L2 of the ribbon cable circuit board 13 is less than the length L3 of the display portion 111 (excluding the flexible lead-out circuit board 15). In this case, the grounding point 191 can be disposed on the side of the ribbon cable circuit board 13 facing the light-emitting surface of the display portion, and located in the area of ​​the ribbon cable circuit board 13 extending beyond the encapsulation portion 113. The grounding point 191 can be formed by performing a copper-exposed design on the surface of the ribbon cable circuit board 13. After the display panel 11 is bent, the grounding point 191 can contact and conduct with the metal plate 16, thereby achieving grounding.

[0184] Figure 36a This is a top view of a display module with its display panel in an unfolded state, according to an embodiment of this application. Figure 36b This is a side cross-sectional view of a display module with its display panel in a bent state, according to an embodiment of this application. (See reference...) Figure 36a and Figure 36b As shown, in another possible implementation, the grounding point 191 can be set on the side of the ribbon circuit board 13 facing away from the display part 11. In this case, a conductive connector 192 can also be set, which can be connected between the grounding point 191 and the middle frame 200 to achieve grounding.

[0185] Figure 37a This is a top view of a display module with its display panel in an unfolded state, according to an embodiment of this application. Figure 37b This is a side cross-sectional view of a display module with its display panel in a bent state, according to an embodiment of this application. (See reference...) Figure 37a and Figure 37b As shown, in another possible implementation, the grounding point 191 can be set on the side of the ribbon circuit board 13 facing away from the display part 11. In this case, a conductive line 193 can also be provided. The conductive line 193 can be, for example, copper foil, cable, flexible circuit board, etc. The conductive line 193 can be connected between the grounding point 191 and the metal plate 16 to achieve grounding.

[0186] It should be understood that the ribbon circuit board 13 can be connected to the middle frame 200 or the metal plate 16 to achieve grounding. In addition to the above three grounding structures, there are many other ways to achieve this, and this application embodiment does not impose specific limitations on them.

[0187] In summary, the embodiments of this application provide a display module and an electronic device. By binding both the ribbon cable circuit board and the driver chip to the encapsulation part that is bent to the back side of the light-emitting surface of the display panel, the length and width dimensions occupied by the ribbon cable circuit board can be reduced, thereby providing more space for the battery and increasing the battery capacity of the electronic device.

[0188] Combination Figure 5 As shown, in related technologies, the maximum design size of the X-axis dimension D1 occupied by the ribbon cable circuit board 13 is 6mm, referring to... Figure 6 , Figure 23 , Figure 30 All three embodiments provided in this application can reduce D1 to 0, thus increasing the length or width of the battery 400 by 6 mm. In one specific embodiment, while keeping the battery thickness and length unchanged, increasing the width by 6 mm can increase the battery capacity by 311.92 mAh compared to related technologies. Specific data can be found in Table 1 below:

[0189] Table 1

[0190]

[0191] The display module and electronic device provided in this application embodiment can effectively increase battery capacity, and also provide multiple arrangement methods and bonding structures for the ribbon circuit board 13 and the driver chip 12, and adaptively provide waterproof and grounding solutions, making the display module more flexible and mobile in overall space design.

[0192] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display module, characterized in that, include: Display panel (11), ribbon cable circuit board (13) and flexible bonding circuit board (14); The display panel (11) includes a display part (111), a bending part (112), and an encapsulation part (113). The encapsulation part (113) is bent to the back side of the light-emitting surface of the display part (111) through the bending part (112). The encapsulation part (113) includes a first end and a second end. The first end is the end of the encapsulation part (113) away from the bending part (112), and the second end is the end of the encapsulation part (113) connected to the bending part (112). The ribbon circuit board (13) is a multilayer printed circuit board or a multilayer flexible circuit board. The number of wiring layers (1301) of the ribbon circuit board (13) is greater than or equal to 2. The flexible bonding circuit board (14) extends from one of the wiring layers (1301) of the ribbon circuit board (13). The ribbon circuit board (13) and the flexible bonding circuit board (14) are both disposed on the side of the encapsulation part (113) facing away from the display part (111). The ribbon circuit board (13) and the flexible bonding circuit board (14) are located between the first end and the second end. The encapsulation part (113) is provided with a first bonding area (1131), the first bonding area (1131) is located at the first end, and the flexible bonding circuit board (14) is bonded in the first bonding area (1131); The display module further includes a driver chip (12), which is disposed on the side of the encapsulation portion (113) facing away from the display portion (111). The encapsulation portion (113) is provided with a second bonding area (1132), which is located between the bending portion (112) and the first bonding area (1131). The driver chip (12) is bonded within the second bonding area (1132). The ribbon circuit board (13) has a through hole (1321), and the driving chip (12) is disposed in the through hole (1321). There is a gap between the driving chip (12) and the side wall of the through hole (1321); or, the ribbon circuit board (13) has a blind hole (1322), and the driving chip (12) is disposed in the blind hole (1322). There is a gap between the driving chip (12) and the side wall and bottom wall of the blind hole (1322).

2. The display module according to claim 1, characterized in that, The ribbon circuit board (13) and the encapsulation part (113) are bonded together by adhesive.

3. The display module according to claim 2, characterized in that, The sum of the depth of the blind hole (1322) and the thickness of the adhesive is greater than or equal to the height of the driver chip (12) relative to the package portion (113).

4. The display module according to any one of claims 1-3, characterized in that, The flexible bonding circuit board (14) extends from the bottom trace layer of the ribbon circuit board (13), which is the layer closest to the package (113) among the multi-layer trace layers (1301) of the ribbon circuit board (13).

5. The display module according to any one of claims 1-3, characterized in that, The display module also includes a flexible cable exit circuit board (15), which is connected to the wide side of the ribbon cable circuit board (13) and is used to connect to the motherboard (500). The wide side of the ribbon circuit board (13) extends in the same direction as the first end pointing to the second end.

6. The display module according to claim 4, characterized in that, The display module also includes a flexible cable exit circuit board (15), which is connected to the wide side of the ribbon cable circuit board (13) and is used to connect to the motherboard (500). The wide side of the ribbon circuit board (13) extends in the same direction as the first end pointing to the second end.

7. The display module according to any one of claims 1-3 and 6, characterized in that, The display module also includes waterproof adhesive (181), which extends along the edge of the flexible bonding circuit board (14) to fill the gap between the flexible bonding circuit board (14) and the encapsulation portion (113); The three sides of the flexible bonding circuit board (14), except for the side facing the ribbon circuit board (13), are covered with the waterproof adhesive (181).

8. The display module according to claim 4, characterized in that, The display module also includes waterproof adhesive (181), which extends along the edge of the flexible bonding circuit board (14) to fill the gap between the flexible bonding circuit board (14) and the encapsulation portion (113); The three sides of the flexible bonding circuit board (14), except for the side facing the ribbon circuit board (13), are covered with the waterproof adhesive (181).

9. The display module according to claim 5, characterized in that, The display module also includes waterproof adhesive (181), which extends along the edge of the flexible bonding circuit board (14) to fill the gap between the flexible bonding circuit board (14) and the encapsulation portion (113); The three sides of the flexible bonding circuit board (14), except for the side facing the ribbon circuit board (13), are covered with the waterproof adhesive (181).

10. The display module according to claim 7, characterized in that, The display module (100) also includes a waterproof adhesive (182), which is attached to the surface of the ribbon circuit board (13) facing away from the encapsulation portion (113). The waterproof adhesive (182) is located at one end of the ribbon circuit board (13) near the bend portion (112) and extends along the length of the ribbon circuit board (13). The waterproof adhesive (182) covers the entire length of the ribbon circuit board (13).

11. The display module according to claim 8 or 9, characterized in that, The display module (100) also includes a waterproof adhesive (182), which is attached to the surface of the ribbon circuit board (13) facing away from the encapsulation portion (113). The waterproof adhesive (182) is located at one end of the ribbon circuit board (13) near the bend portion (112) and extends along the length of the ribbon circuit board (13). The waterproof adhesive (182) covers the entire length of the ribbon circuit board (13).

12. An electronic device, characterized in that, The device includes a middle frame (200), a back cover (300), and a display module (100) as described in any one of claims 1-11. The display module (100) and the back cover (300) are respectively connected to both sides of the middle frame (200). The display module (100), the back cover (300), and the middle frame (200) form an accommodating space. A motherboard (500) and a battery (400) are disposed in the accommodating space. The ribbon circuit board (13) is connected to the motherboard (500) through a flexible outgoing circuit board (15).

Images