A focus ring temperature control assembly, pedestal, and plasma processing apparatus
By installing a flange and a thick-film circuit heater between the insulating ring and the base, the shortcomings of the focusing ring temperature control in capacitively coupled plasma processing equipment are solved, achieving safety and flexible maintenance, and meeting high process requirements.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ADVANCED MICRO FAB EQUIP INC CHINA
- Filing Date
- 2021-12-30
- Publication Date
- 2026-07-14
AI Technical Summary
In existing capacitively coupled plasma processing equipment, there is a lack of effective means to control the temperature of the focusing ring, resulting in poor sealing, safety hazards, and high maintenance costs.
By setting a flange between the insulating ring and the base, with a power supply channel inside the flange, and the temperature control cable electrically connected to the heating component, the focusing ring is temperature controlled by a thick film circuit heater, and a seal is achieved through sealing components and multiple flange sections, ensuring safety and flexible maintenance.
It achieves precise temperature control of the focusing ring, improves equipment safety performance, reduces maintenance costs, and meets the temperature requirements of different processes.
Smart Images
Figure CN116417320B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a focusing ring temperature control component, a base, and a plasma processing device. Background Technology
[0002] Capacitively coupled plasma (CCP) equipment uses radio frequency coupled discharge to generate plasma, and then uses the plasma to perform processing techniques such as deposition and etching.
[0003] However, in the etching chamber of capacitively coupled plasma processing equipment, different process steps place different temperature requirements on the focusing ring. For example... Figure 1 As shown, the capacitively coupled plasma processing device includes a reaction chamber with a base 10 at its bottom. An electrostatic chuck is mounted on the base, and a focusing ring 50, an edge ring 40, an insulating ring 20, and a grounding ring 30 are arranged around the base 10. The focusing ring 50 and the edge ring 40 are located above the insulating ring 20 and the grounding ring 30. An electrostatic electrode is disposed inside the electrostatic chuck to generate electrostatic attraction, thereby supporting and fixing the substrate to be processed during the process. A heating device is disposed below the electrostatic chuck to control the substrate temperature during the process. The focusing ring 50 and the edge ring 40 are used to adjust the electric field or temperature distribution around the substrate, improving the uniformity of substrate processing.
[0004] A thin-film coating heater 60 is placed under the edge ring (ceramic isolation ring) 40 below the focusing ring 50 to heat the edge ring 40. A first thermally conductive adhesive 70 is placed between the edge ring 40 and the electrostatic chuck 10 for cooling. A second thermally conductive adhesive 71 is placed between the edge ring 40 and the focusing ring 50, and the heat on the edge ring 40 is transferred to the focusing ring 50 through the second thermally conductive adhesive 71 to regulate the temperature of the focusing ring 50.
[0005] However, existing technologies only consider how to improve the heat transfer performance of the focusing ring 50 or maintain its constant temperature, but lack effective means to further adjust and control the temperature of the focusing ring 50. Please continue to refer to... Figure 1 As shown, in the prior art, one approach is to directly add a ring of heaters at the step of the base 10, but this makes it impossible to maintain the heating equipment for the focusing ring independently. Another approach is to enlarge the edge ring 40 and create a power supply channel 61 on the grounding ring 30, but due to the limited width of the grounding ring 30, it is difficult to achieve a very good seal between it and the edge ring. Furthermore, due to the design of the power supply channel 61, if poor sealing allows plasma from the reaction chamber to leak into the power supply channel 61, exposing it to the plasma environment, the plasma encountering a strong current can easily cause an explosion. Summary of the Invention
[0006] The purpose of this invention is to provide a focusing ring temperature control component, a base, and a plasma processing device to achieve more accurate and precise temperature control of the focusing ring, making it adjustable in processes such as etching, thereby meeting higher process requirements.
[0007] To achieve the above objectives, the present invention is implemented through the following technical solution:
[0008] A focusing ring temperature control assembly is applied in a plasma processing device. The plasma processing device includes: a base; an insulating ring and a focusing ring surrounding the base, with the focusing ring positioned above the insulating ring; the focusing ring temperature control assembly includes: an edge ring surrounding the base and positioned between the focusing ring and the insulating ring; a heating assembly disposed on the edge ring; a flange positioned between the insulating ring and the base, below the heating assembly, with a power supply channel inside the flange; and a temperature control cable electrically connected to the heating assembly via the power supply channel to control the temperature of the focusing ring through the heating assembly.
[0009] Optionally, the heating component is a thick-film circuit heater, which is disposed between the edge ring and the flange and electrically connected to the temperature control cable. The thick-film circuit heater is used to heat the edge ring, and the cooling channel of the base is used to cool the edge ring for temperature control. Heat conduction occurs between the edge ring and the focusing ring.
[0010] Optionally, the thick-film circuit heater is sealed to the flange.
[0011] Optionally, the contact surface between the thick film circuit heater and the flange is a sealing surface with a surface roughness Ra < 0.4.
[0012] Optionally, it also includes a first sealing component disposed between the thick film circuit heater and the flange.
[0013] Optionally, the flange is provided with a first sealing groove at one end near the thick film circuit heater, and the first sealing component is located inside the first sealing groove.
[0014] Optionally, the edge ring includes a first edge ring piece and a second edge ring piece disposed opposite each other.
[0015] The heating component is a thick-film circuit heater, which is disposed between the first edge ring and the second edge ring and connected to the temperature control cable. The thick-film circuit heater is used to heat the edge ring, and the cooling channel of the base is used to cool the edge ring to control its temperature. Heat is conducted between the edge ring and the focusing ring through contact.
[0016] Optionally, the joint gap between the first edge ring and the second edge ring is sealed with a sealing material.
[0017] Optionally, a sealing arrangement is provided between the second edge ring and the flange.
[0018] Optionally, the contact surface between the second edge ring and the flange is a sealing surface with a surface roughness Ra < 0.4.
[0019] Optionally, a second sealing component is also included, which is disposed between the second edge ring and the flange.
[0020] Optionally, the flange has a second sealing groove at one end near the second edge ring, and the second sealing component is located inside the second sealing groove.
[0021] Optionally, the flange is divided into several flange sections that are sealed to each other.
[0022] Optionally, there are two flange sections, referred to as the first flange section and the second flange section, with the first flange section located closer to the heating assembly and the second flange section located further away from the heating assembly.
[0023] The first flange section has a first channel, and the second flange section has a second channel, with the first channel and the second channel communicating with each other.
[0024] The second channel is curved toward the base and communicates with the outlet at the center of the bottom of the base;
[0025] One end of the temperature control cable passes through the second channel and the first channel and is electrically connected to the heating component, while the other end is connected to the external temperature control system through the outlet at the center of the bottom of the base.
[0026] Optionally, it also includes a third sealing component disposed between the first flange section and the second flange section.
[0027] Optionally, the contact surface between the first flange segment and the second flange segment is provided with a third sealing groove, and the third sealing component is disposed inside the third sealing groove.
[0028] Optionally, it also includes a fourth sealing component disposed between the second flange section and the base sidewall.
[0029] Optionally, the second flange section has a fourth sealing groove surrounding the second channel on its side wall, and the fourth sealing component is disposed within the fourth sealing groove.
[0030] Optionally, the flange is a non-metallic flange.
[0031] Optionally, the number of flanges is multiple, and they are spaced apart circumferentially along the base.
[0032] Optionally, the insulating ring is provided with a plurality of mounting grooves at circumferential intervals, each mounting groove being located between the insulating ring and the sidewall of the base, and the flanges being disposed in the mounting grooves in a corresponding manner, with each flange sidewall contacting the sidewall of the base.
[0033] Optionally, it further includes: a plurality of temperature sensors, each of which is disposed at the heating assembly via a corresponding power supply channel, for detecting the temperature of the focusing ring.
[0034] Optionally, the base has a step on its edge, a portion of the edge ring rests on the step and another portion rests on the flange, and a first thermal pad is provided on the upper surface of the step;
[0035] A second thermal pad is provided between the focusing ring and the edge ring.
[0036] On the other hand, the present invention also provides a base, including: a focusing ring temperature control component as described above.
[0037] In another aspect, the present invention also provides a plasma processing device, comprising: a reaction chamber, wherein a gas spray head and a base disposed opposite to the gas spray head are disposed within the reaction chamber, the base being the base described above.
[0038] This invention has at least one of the following advantages:
[0039] The focusing ring temperature control assembly provided by this invention uses a flange disposed between an insulating ring and a base, with a power supply channel inside the flange. A temperature control cable is electrically connected to the heating assembly through this power supply channel, enabling the heating assembly to control the temperature of the focusing ring. Therefore, the flange provides ample space for the power supply channel, solving the safety hazard problem caused by the limited space in existing grounding rings, which makes it difficult to achieve a very good seal. This prevents the power supply channel from being exposed to the plasma environment, where the plasma encountering a strong current could easily cause an explosion.
[0040] The heating component provided by the present invention is a thick film circuit heater. The thick film circuit heater can be pre-sintered at the position corresponding to the lower surface of the edge ring through a sintering process, so as to achieve the purpose of heating the focusing ring by heating the edge ring. In addition, since the process is mature, the manufacturing cost can be reduced.
[0041] The thick film circuit heater is sealed to the flange, and its surface roughness Ra < 0.4, thereby further ensuring that the power supply channel is isolated from the vacuum environment and improving the safety performance of the equipment.
[0042] The present invention achieves the purpose of isolating the power supply channel from the vacuum environment by setting a first sealing component between the thick film circuit heater and the flange, thereby further improving the safety performance of the equipment.
[0043] The design of the first sealing groove ensures the stability of the first sealing component, thereby further improving the safety performance of the equipment.
[0044] By placing the thick-film circuit heater between the first edge ring and the second edge ring, the thick-film circuit heater is close to the focusing ring, thereby enabling more effective temperature control of the focusing ring.
[0045] This invention divides the flange into several mutually sealed flange sections, thereby facilitating maintenance and reducing manufacturing costs.
[0046] Due to the flange configuration, and the fact that the flange is a non-metallic flange, a second channel with an arbitrary bending angle can be set inside the flange. This enables the temperature control cable to extend from the outlet at the center of the base and connect to the external temperature control system, solving the problem in the prior art where it is difficult to arrange a power supply channel with a near 90-degree bend inside the grounding ring due to space limitations.
[0047] This invention, by setting multiple flanges, allows for multiple thick-film circuit heaters, spaced circumferentially along the base, thereby achieving better temperature control of the focusing ring. Since the thick-film circuit heater is located on the edge ring, the focusing ring temperature control system can be replaced by replacing the edge ring and the flanges, saving costs. This solves the problem that existing focusing rings, which are directly integrated on the base and controlled by a temperature control system on the base, can only be maintained as a whole, requiring the replacement of the entire base and focusing ring during maintenance.
[0048] This invention achieves more accurate temperature control of the focusing ring by setting a temperature sensor, so that the temperature of the focusing ring can meet the requirements of different processes. Attached Figure Description
[0049] Figure 1 This is a schematic diagram of the focusing ring temperature control assembly in the prior art;
[0050] Figure 2 This is a schematic diagram of the focusing ring temperature control assembly provided in an embodiment of the present invention;
[0051] Figure 3 This is a schematic diagram of the focusing ring temperature control assembly provided in another embodiment of the present invention;
[0052] Figure 4 This is a top view of the flange distribution in a focusing ring temperature control assembly according to another embodiment of the present invention;
[0053] Figure 5 This is a schematic diagram of the main structure of a plasma processing device provided in an embodiment of the present invention. Detailed Implementation
[0054] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a further detailed explanation of the focusing ring temperature control component, base, and plasma processing equipment proposed in this invention. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, used only to facilitate and clearly illustrate the embodiments of this invention. Please refer to the drawings to make the objectives, features, and advantages of this invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this invention, should still fall within the scope of the technical content disclosed in this invention.
[0055] Example 1
[0056] like Figure 2 As shown, this embodiment provides a focusing ring temperature control assembly applied in a plasma processing device. The plasma processing device includes: a base 100, an insulating ring 200, a grounding ring 300, and a focusing ring 500 arranged around the base 100. The grounding ring 300 surrounds the outer circumference of the insulating ring 200, and the focusing ring 500 is located above the insulating ring 200. The focusing ring temperature control assembly includes: an edge ring 400 arranged around the base 100 and located between the focusing ring 500 and the insulating ring 200; a heating assembly disposed on the edge ring 400; a flange disposed between the insulating ring 200 and the base 100, located below the heating assembly, and the flange having a power supply channel inside; and a temperature control cable 810 electrically connected to the heating assembly through the power supply channel to control the temperature of the focusing ring 500 through the heating assembly.
[0057] Therefore, the focusing ring temperature control component provided in this embodiment, through the flange set between the insulating ring 200 and the base, provides ample space for the power supply channel. This solves the safety hazard problem caused by the limited space of the grounding ring in the prior art, which makes it difficult to achieve a very good seal. If this leads to the power supply channel being exposed to the plasma environment, the plasma may easily explode when it encounters a strong current. Furthermore, because the flange is set between the insulating ring 200 and the base 100, the heating component and the temperature control channel are closer to the base, and the corresponding upper edge ring 400 does not need to be extended outward, thus saving space.
[0058] Please continue to refer to this. Figure 2 As shown, the heating component is a first thick-film circuit heater 600, which is disposed between the edge ring 400 and the flange and electrically connected to the temperature control cable 810. The first thick-film circuit heater 600 is used to heat the edge ring 400, and a cooling channel is provided in the base 100 to cool the edge ring 400, thereby controlling the temperature of the edge ring 400. The edge ring 400 and the focusing ring 500 are in contact for heat conduction. It can be understood that the first thick-film circuit heater can be pre-sintered at the corresponding position on the lower surface of the edge ring 400 through a sintering process, so as to achieve the purpose of heat conduction to the focusing ring 500 by heating the edge ring 400 and the contact between the edge ring 400 and the focusing ring 500. In addition, since this sintering process is mature, the manufacturing cost of the focusing ring temperature control system can be reduced.
[0059] Please continue to refer to this. Figure 2 As shown, in this embodiment, a sealing arrangement is provided between the first thick-film circuit heater 600 and the flange. Specifically, to achieve the above-mentioned sealing, this embodiment can, on the one hand, provide a first sealing component 802, which is disposed between the first thick-film circuit heater 600 and the flange. A first sealing groove is provided at the end of the flange near the first thick-film circuit heater 600, and the first sealing component 802 is located inside the first sealing groove. The first sealing component 802 can be an O-ring, and the first sealing groove can be annularly arranged around the outlet and / or inlet of the power channel, but the present invention is not limited thereto. Because the flange width provided here is sufficient, the first sealing component can be placed on it. The arrangement of the first sealing groove isolates the power channel from the vacuum environment, preventing plasma leakage into the power channel and improving the safety performance of the equipment.
[0060] On the other hand, the contact surface between the first thick-film circuit heater 600 and the flange is a sealing surface with a surface roughness Ra < 0.4. The surface roughness Ra < 0.4 of the sealing surface further improves the sealing performance at the sealing surface and further improves the safety performance of the equipment.
[0061] In some other embodiments, for ease of installation and fabrication, the flange may be divided into several mutually sealing flange sections.
[0062] Please continue to refer to this. Figure 2 As shown, in this embodiment, there are two flange sections, referred to as the first flange section 800 and the second flange section 801. The first flange section 800 is located close to the heating assembly, and the second flange section 801 is located away from the heating assembly.
[0063] The first flange section 800 has a first channel, and the second flange section 801 has a second channel, which are interconnected. The second channel bends towards the base 100 and communicates with an outlet at the center of the bottom of the base 100. One end of the temperature control cable 810 passes through the second channel and the first channel and is electrically connected to the heating component, while the other end communicates with an external temperature control system via the outlet at the center of the bottom of the base 100. In some embodiments, the base 100 includes a mounting plate located at the bottom of the base, and the outlet at the center of the bottom of the base is disposed on the mounting plate.
[0064] It is understandable that, since the temperature control cable 810 passes through the first channel and the second channel, the positions of the first channel and the second channel can also be referenced. Figure 2 The location of the temperature control cable 810 mentioned above.
[0065] Please continue to refer to this. Figure 2 As shown, in this embodiment, a third sealing component 803 is further included, which is disposed between the first flange section 800 and the second flange section 801. Specifically, a third sealing groove is provided on the contact surface between the first flange section 800 and the second flange section 801, and the third sealing component 803 is disposed inside the third sealing groove.
[0066] In this embodiment, a fourth sealing component 804 is further included, which is disposed between the second flange section 801 and the side wall of the base 100. The side wall of the second flange section 801 is provided with a fourth sealing groove surrounding the second channel, and the fourth sealing component 804 is disposed within the fourth sealing groove.
[0067] Therefore, the third sealing component 803 and the fourth sealing component 804 further ensure that the temperature control cable 810 is isolated from the atmospheric environment and / or vacuum environment, so that the temperature control cable 810 does not come into contact with the plasma, thereby further improving the safety performance of the equipment.
[0068] like Figure 4 As shown, the flange described in this embodiment is a non-metallic flange. For example, it can be made of hard plastic material, but the present invention is not limited thereto.
[0069] The number of flanges is multiple, that is, there can be multiple first flange segments 800, which are spaced apart circumferentially along the base 100. The insulating ring 200 is provided with a plurality of mounting grooves spaced apart circumferentially. Each mounting groove is located between the insulating ring 200 and the side wall of the base 100. The flanges (first flange segment 800 and second flange segment 801) are correspondingly arranged inside the mounting grooves, and the side wall of each flange is in contact with the side wall of the base 100.
[0070] Due to the non-metallic flange, a second channel with an arbitrary bending angle can be provided inside the flange, thereby enabling the temperature control cable 810 to extend from the outlet at the bottom center of the base 100 and connect to the external temperature control system. This solves the problem in the prior art where, due to the space limitation of the grounding ring, if the internal power supply channel is also bent towards the bottom center of the base, it is difficult to arrange a power supply channel with a near 90-degree bend inside.
[0071] This embodiment, by setting multiple flanges, allows for multiple first thick-film circuit heaters 600, spaced circumferentially along the base 100. This enables better temperature control of the focusing ring 500. Since the first thick-film circuit heater 600 is located on the edge ring 400, the focusing ring temperature control system can be replaced by replacing the edge ring 400 and the flanges, saving costs. This solves the problem that existing focusing rings, which are directly integrated on the base and controlled by a temperature control system on the base, require maintenance as a whole, necessitating the replacement of the entire base and focusing ring during maintenance.
[0072] Please continue to refer to this. Figure 2 As shown, the base 100 has a step on its edge, and part of the edge ring 400 rests on the step, while another part rests on the flange. Figure 1On the first flange section 800, a first thermally conductive pad 700 is provided on the upper surface of the step; that is, the lower surface of the edge ring 400 contacts both the step and the flange. A second thermally conductive pad 710 is provided between the focusing ring 500 and the edge ring 400. The first thermally conductive pad 700 and the second thermally conductive pad 710 improve the heat transfer efficiency between different components.
[0073] Therefore, in this embodiment, the first thick film circuit heater 600 is used to heat the edge ring 400, and the heat of the edge ring 400 is transferred to the focusing ring 500 through the second thermal pad 710; and heat is transferred through the contact surface between the focusing ring 500 and the edge ring 400.
[0074] In this embodiment, since the lower surface of the edge ring 400 is in contact with the step, the cooling channel in the base 100 can be used to cool the edge ring 400, thereby achieving temperature control of the edge ring 400. The arrangement of the first thermal pad 700 ensures good heat conduction between the edge ring 400 and the base 100, ultimately achieving temperature control of the focusing ring 500. Through more accurate and precise temperature control of the focusing ring 500, it becomes adjustable during processes such as etching, thus meeting higher process requirements.
[0075] In this embodiment, the system further includes a plurality of temperature sensors, each of which is disposed at the heating assembly via a corresponding power supply channel, for detecting the temperature of the focusing ring 500. It is understood that each temperature sensor may be a fiber optic temperature sensor or other types of temperature sensing components.
[0076] Example 2
[0077] like Figure 3 As shown, the difference between this embodiment and Embodiment 1 is that the edge ring includes a first edge ring piece 401 and a second edge ring piece 402 arranged opposite each other.
[0078] The heating component is a second thick-film circuit heater 610, which is disposed between the first edge ring plate 401 and the second edge ring plate 402 and connected to the temperature control cable 810. The second thick-film circuit heater 610 is used to heat the edge ring (first edge ring plate 401 and second edge ring plate 402), and the cooling channel of the base 100 is used to cool the edge ring ((first edge ring plate 401 and second edge ring plate 402)) to control the temperature of the edge ring. The edge ring and the focusing ring 500 are in contact for heat conduction.
[0079] In this embodiment, there are splicing gaps between the first edge ring and the second edge ring at the inner or outer circumference of the second thick film circuit heater 610, and all splicing gaps are sealed with sealing material.
[0080] In this embodiment, the second thick-film circuit heater 610 can be disposed inside the edge ring. The second thick-film circuit heater 610 is pre-sintered onto the first edge ring piece 401 or the second edge ring piece 402. After the two edge ring pieces are overlapped, the resulting splicing gap can be bonded with non-metallic materials, or the two ceramic rings can be welded together by melting a filler metal material to achieve vacuum sealing of the second thick-film circuit heater 610.
[0081] Please continue to refer to this. Figure 3 As shown, the second edge ring 402 is sealed to the flange (specifically, the first flange segment 800). The contact surface between the second edge ring 402 and the flange is a sealing surface with a surface roughness Ra < 0.4.
[0082] This embodiment also includes a second sealing component 805, which is disposed between the second edge ring 402 and the flange (specifically, the first flange segment 800). The flange (specifically, the first flange segment 800) has a second sealing groove at one end near the second edge ring 402, and the second sealing component 805 is located inside the second sealing groove.
[0083] On the other hand, this embodiment also provides a base, including: a focusing ring temperature control component as described in the above embodiment.
[0084] On the other hand, such as Figure 5As shown, this embodiment also provides a plasma processing device, including: a reaction chamber 900, a gas spray head 901 disposed above the reaction chamber 900, and a base disposed opposite to the gas spray head. The base is as described above, including an electrostatic chuck 910 for supporting a substrate, a focusing ring 911 for controlling the plasma distribution at the edge of the substrate, a covering ring 913 for protecting the outer edge of the focusing ring 911, an edge ring 912 located below the focusing ring 911, and a heating component disposed therein, and an insulating ring 914 disposed below the edge ring 912, and a flange with a power supply channel disposed therein, through which a DC power supply is electrically connected to the heating component, for using the edge ring 912 to control the temperature change of the focusing ring 911 to achieve etching uniformity of the substrate. Because the power channel is indirectly located in the insulating ring 914, which is closer to the base, the insulating ring 914 has a larger ring width. This facilitates the installation of seals on the upper and lower edges of the insulating ring to prevent plasma from entering the power channel and causing the risk of arc discharge. In addition, due to the space requirements of the semiconductor processing equipment, the power cord needs to be arranged from below the base to the reaction chamber before connecting to the power supply. Therefore, the insulating ring, which is closer to the base, can reduce the degree of bending of the wires and does not need to be bent at right angles, which helps the power cord maintain its strength.
[0085] In summary, the focusing ring temperature control assembly provided by this invention utilizes a flange positioned between the insulating ring and the base, with a power supply channel inside the flange. A temperature control cable is electrically connected to the heating assembly via this power supply channel, enabling the heating assembly to control the temperature of the focusing ring. Therefore, the flange provides ample space for the power supply channel, solving the safety hazard problem inherent in existing technologies where limited space in the grounding ring makes it difficult to achieve a very good seal. This addresses the issue that if the power supply channel is exposed to the plasma environment, the plasma encountering a strong current could easily cause an explosion.
[0086] In this embodiment, the membrane circuit heater heats the edge ring, and heat is transferred through contact between the edge ring and the focusing ring. The cooling channels in the base cool the edge ring, achieving temperature control of the edge ring and ultimately, temperature control of the focusing ring. This embodiment, through more accurate and precise independent temperature control of the focusing ring, makes it adjustable during etching and other processes, thereby meeting higher process requirements.
[0087] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0088] In the description of this invention, it should be understood that the terms "center," "height," "thickness," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.
[0089] In the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0090] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0091] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.
Claims
1. A focusing ring temperature control component, used in a plasma processing device, the plasma processing device comprising: A base, an insulating ring and a focusing ring arranged around the base, the focusing ring being located above the insulating ring; characterized in that the focusing ring temperature control assembly includes: an edge ring arranged around the base and located between the focusing ring and the insulating ring; and a heating assembly disposed on the edge ring; A flange is disposed between the insulating ring and the base, located below the heating assembly, and a power supply channel is provided inside the flange; A temperature control cable is electrically connected to the heating component through the power channel to control the temperature of the focusing ring through the heating component.
2. The focusing ring temperature control assembly as described in claim 1, characterized in that, The heating component is A thick-film circuit heater is disposed between the edge ring and the flange and is electrically connected to the temperature control cable; The thick film circuit heater is used to heat the edge ring, and the cooling channel of the base is used to cool the edge ring to control the temperature of the edge ring. The edge ring and the focusing ring are in contact for heat conduction.
3. The focusing ring temperature control assembly as described in claim 2, characterized in that, The thick film circuit heater is sealed to the flange.
4. The focusing ring temperature control assembly as described in claim 3, characterized in that, The contact surface between the thick film circuit heater and the flange is a sealing surface with a surface roughness Ra < 0.
4.
5. The focusing ring temperature control assembly as described in claim 4, characterized in that, It also includes a first sealing component disposed between the thick film circuit heater and the flange.
6. The focusing ring temperature control assembly as described in claim 5, characterized in that, The flange is provided with a first sealing groove at one end near the thick film circuit heater, and the first sealing component is located inside the first sealing groove.
7. The focusing ring temperature control assembly as described in claim 1, characterized in that, The edge ring includes a first edge ring piece and a second edge ring piece arranged vertically opposite to each other; The heating component is a thick-film circuit heater, which is disposed between the first edge ring and the second edge ring and is connected to the temperature control cable; The thick film circuit heater is used to heat the edge ring, and the cooling channel of the base is used to cool the edge ring to control the temperature of the edge ring. The edge ring and the focusing ring are in contact for heat conduction.
8. The focusing ring temperature control assembly as described in claim 7, characterized in that, The joint between the first edge ring and the second edge ring is sealed with a sealing material.
9. The focusing ring temperature control assembly as described in claim 8, characterized in that, The second edge ring is sealed to the flange.
10. The focusing ring temperature control assembly as described in claim 9, characterized in that, The contact surface between the second edge ring and the flange is a sealing surface, and its surface roughness Ra < 0.
4.
11. The focusing ring temperature control assembly as described in claim 10, characterized in that, It also includes a second sealing component disposed between the second edge ring and the flange.
12. The focusing ring temperature control assembly as described in claim 11, characterized in that, The flange has a second sealing groove at one end near the second edge ring, and the second sealing component is located inside the second sealing groove.
13. The focusing ring temperature control assembly as described in claim 1, characterized in that, The flange is divided into several flange sections that are sealed and connected to each other.
14. The focusing ring temperature control assembly as described in claim 13, characterized in that, There are two flange sections, referred to as the first flange section and the second flange section. The first flange section is located closer to the heating assembly, and the second flange section is located further away from the heating assembly. The first flange section is provided with a first channel, and the second flange section is provided with a second channel, with the first channel and the second channel communicating with each other; The second channel is curved toward the base and communicates with the outlet at the center of the bottom of the base; One end of the temperature control cable passes through the second channel and the first channel and is electrically connected to the heating component, while the other end is connected to the external temperature control system through the outlet at the center of the bottom of the base.
15. The focusing ring temperature control assembly as described in claim 14, characterized in that, Also includes: The third sealing component is disposed between the first flange section and the second flange section.
16. The focusing ring temperature control assembly as described in claim 15, characterized in that, The contact surface between the first flange segment and the second flange segment is provided with a third sealing groove, and the third sealing component is disposed inside the third sealing groove.
17. The focusing ring temperature control assembly as described in claim 16, characterized in that, Also includes: A fourth sealing component is disposed between the second flange section and the base sidewall.
18. The focusing ring temperature control assembly as described in claim 17, characterized in that, The second flange section has a fourth sealing groove surrounding the second channel on its side wall, and the fourth sealing component is disposed in the fourth sealing groove.
19. The focusing ring temperature control assembly as described in claim 18, characterized in that, The flange is a non-metallic flange.
20. The focusing ring temperature control assembly as described in claim 1, characterized in that, The flanges are multiple and are spaced apart circumferentially along the base.
21. The focusing ring temperature control assembly as described in claim 20, characterized in that, The insulating ring is provided with a plurality of mounting grooves at circumferential intervals. Each mounting groove is located between the insulating ring and the side wall of the base. The flanges are respectively arranged inside the mounting grooves, and the side wall of each flange is in contact with the side wall of the base.
22. The focusing ring temperature control assembly as described in claim 21, characterized in that, Also includes: A plurality of temperature sensors are provided, each of which is located at the heating assembly via a corresponding power supply channel, for detecting the temperature of the focusing ring.
23. The focusing ring temperature control assembly as described in claim 1, characterized in that, The base has a step on its edge, and part of the edge ring rests on the step and another part rests on the flange. A first thermal pad is provided on the upper surface of the step. A second thermal pad is provided between the focusing ring and the edge ring.
24. A base, characterized in that, include: The focusing ring temperature control assembly as described in any one of claims 1 to 23.
25. A plasma processing device, characterized in that, include: A reaction chamber, wherein a gas spray head and a base disposed opposite to the gas spray head are provided in the reaction chamber, wherein the base is the base as described in claim 24.