A handling press-in device for semiconductor devices and a method of operation thereof

CN116417388BActive Publication Date: 2026-09-15FREEWON CHINA CO LTD
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Patent Information

Application Number
CN202310365455.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-07
Publication Date
2026-09-15
Estimated Expiration
2043-04-07

AI Technical Summary

Technical Problem

[0003]随着电子产品大量普及及飞速发展的今天,对于电子产品内部的电子连接器的需求也越来越大,然而,传统的自动插针机在经过送料、进料和插针等一系列流程后,会直接进行包装,不会进行二次压入和检测,从而使得产品的质量得不到保证,且不合格的产品会直接掉落至废料盒,从而浪费了资源,为此,现提出一种用于半导体器件的搬运压入装置及其工作方法以改善现有存在的问题

Benefits of technology

[0024] 1. By cooperating with the support columns, support plates, uprights and triangular plates, the height of the handling components and pressing components can be adjusted so that the handling components and pressing components are at the same height as the previous station, thereby facilitating the handling and pressing of the handling components and pressing components.

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Abstract

The application is suitable for the technical field of semiconductor device carrying and pressing-in, and provides a carrying and pressing-in device for semiconductor devices and a working method thereof. The supporting assembly comprises a supporting column, supporting plates symmetrically arranged at both ends of the supporting column, a vertical plate arranged at one end of the supporting plate, and a triangular plate arranged on the side wall of the vertical plate away from the supporting plate. The carrying assembly comprises a motor, a horizontal plate arranged on the side wall of the motor, vertical columns symmetrically arranged at both ends of the horizontal plate, and a carrying piece arranged on the side of the horizontal plate away from the motor. The pressing-in assembly comprises an electric cylinder, a PIN needle push rod arranged at one end of the electric cylinder, a carrier arranged at the end of the PIN needle push rod away from the electric cylinder, and an upper pressing cylinder arranged on the side of the carrier away from the PIN needle push rod. The PCS product is carried by the carrying assembly and pressed in by the pressing-in assembly, so that the problem of unqualified products caused by insufficient insertion depth is avoided, and the quality of the PCS product is improved.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor device handling and pressing technology, and more specifically, to a handling and pressing device for semiconductor devices and its operating method. Background Technology

[0002] Semiconductor devices are electronic devices whose conductivity lies between that of a good conductor and an insulator. They utilize the special electrical properties of semiconductor materials to perform specific functions. They can be used to generate, control, receive, transform, and amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium, or gallium arsenide, and they can be used as rectifiers, oscillators, light emitters, amplifiers, photometers, and other equipment.

[0003] With the widespread use and rapid development of electronic products, the demand for electronic connectors inside these products is increasing. However, traditional automatic pin insertion machines directly package the products after a series of processes, including feeding, inserting, and insertion, without secondary pressing and testing. This results in compromised product quality, and defective products are often discarded into waste bins, wasting resources. To address these issues, a handling and pressing device for semiconductor devices and its operating method are proposed. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a handling and pressing device for semiconductor devices and its working method.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a handling and pressing device for semiconductor devices, comprising a support assembly, a handling assembly, and a pressing assembly, wherein the support assembly includes a support column, a support plate symmetrically arranged at both ends of the support column, a vertical plate disposed at one end of the support plate, and a triangular plate disposed on the side wall of the vertical plate away from the support plate; the handling assembly is disposed on the triangular plate and includes a motor, a horizontal plate disposed on the side wall of the motor, a vertical column symmetrically arranged at both ends of the horizontal plate, and a handling component disposed on the side of the horizontal plate away from the motor; the pressing assembly is disposed on the top of the support plate and the triangular plate and includes an electric cylinder, a PIN push rod disposed at one end of the electric cylinder, a carrier disposed at the end of the PIN push rod away from the electric cylinder, and an upper pressure cylinder disposed on the side of the carrier away from the PIN push rod.

[0006] The invention is further configured such that: through holes are symmetrically provided on the side wall of the horizontal plate along the length direction, and the conveying component can be connected to the output end of the motor through the through holes.

[0007] The present invention is further configured such that: the transport component includes a transport plate, a fixture disposed on the side wall of the transport plate, and a suction nozzle that is inserted into the fixture; wherein, mounting holes are symmetrically provided on the side wall of the transport plate along the length direction, and a rotating plate is symmetrically provided between the transport plate and the horizontal plate, one end of the rotating plate is connected to the output end of the motor, and the other end is connected to the transport plate through the mounting holes.

[0008] The invention is further configured such that: the retainers are distributed along the length of the transport plate and multiple sets are provided; wherein, the retainers have slits on the side wall away from the transport plate, and fixing holes are provided at the top and bottom of the slits, and the suction nozzle can be inserted into the fixing holes.

[0009] The invention is further configured such that: the electric cylinders are symmetrically distributed radially on the top of the support plate; a slide rail is sleeved on the output shaft of the electric cylinder; a slide table is provided on the slide rail; and the slide rail and the slide table are slidably connected; wherein, the slide table is H-shaped; a telescopic plate is provided on the side of the slide table away from the slide rail; and the end of the PIN needle push rod away from the carrier is connected to one end of the telescopic plate.

[0010] The present invention is further configured such that: the carrier is symmetrically distributed at the top end along the length direction of the upright plate, and a docking groove is provided in the radial direction at the top of the carrier, and limiting bosses are symmetrically arranged in the axial direction within the docking groove; wherein, the end of the PIN push rod away from the telescopic plate can be inserted into the docking groove, and multiple sets of limiting bosses are provided.

[0011] The invention is further configured such that: the upper pressure cylinders are symmetrically distributed radially on the top of the triangular plate; one end of each upper pressure cylinder is provided with a first guide rail; a first guide platform is provided on the first guide rail; a movable plate is provided on the top of the first guide platform; the first guide rail and the first guide platform are slidably connected; and the output end of the upper pressure cylinder is connected to one end of the movable plate. The top of the movable plate is provided with a second guide rail; a second guide platform is provided on the second guide rail; a movable plate is provided on the second guide platform; the second guide rail and the second guide platform are slidably connected; one end of the second guide rail is provided with a spring plate; the spring plate is L-shaped; a spring is provided on one side of the spring plate along its length; and the end of the spring away from the spring plate is connected to the side wall of the movable plate.

[0012] The invention is further configured such that: ear plates are symmetrically arranged radially on the top of the movable plate, a pressure strip is arranged in the middle of the ear plates, and a pressure head is arranged at one end of the pressure strip; wherein, the pressure strip is radially distributed on the top of the movable plate, the pressure strip is bolted to the ear plates, an arc-shaped surface is formed at the end of the pressure strip away from the pressure head, an arc-shaped groove is formed on the side wall of the spring plate near the pressure strip, the arc-shaped surface can slide within the arc-shaped groove, the pressure head is distributed at the end of the mating groove away from the PIN pin push rod, and the suction nozzle is distributed between the PIN pin push rod and the pressure head.

[0013] The invention is further configured such that: a detection module is provided on one side of the support plate; the detection module includes a camera, a detection frame disposed on one side of the camera, a drive motor disposed within the detection frame, a turntable station disposed on the top of the detection frame, and a detection carrier disposed on the turntable station; wherein, the turntable station is cross-shaped, the detection carriers are distributed on the cross-shaped station of the turntable station near the camera, and a suction station is disposed on the cross-shaped station away from the camera, and a storage box is disposed between the suction station and the detection carrier.

[0014] A method for handling and pressing semiconductor devices, using the injection molding equipment described above, comprises the following steps:

[0015] S1. The motor starts, and the output end of the motor drives the conveyor plate to move forward to the next station. The suction nozzles on the conveyor plate that are close to the previous process will pick up the PCS products that have been pre-processed in front and put them into the ready-to-move state.

[0016] S2. Next, the output end of the motor drives the conveyor plate to start a semi-circular motion. The suction nozzle close to the previous process places the initially processed PCS product on the carrier close to the previous process, waiting for the first deep pressing.

[0017] S3. At the same time, the upper pressure cylinder is activated and pushes the moving plate forward. The spring plate on the moving plate pushes the movable plate forward by squeezing the spring. Then the pressure bar on the movable plate also moves towards the PIN of the PCS product. When the spring is squeezed to a certain depth, the arc surface on the pressure bar begins to fit with the arc groove on the spring plate. Then the arc groove squeezes the arc surface, causing the arc surface to move upward, thereby causing the pressure bar to tilt, so that the pressure head presses down on the PIN of the PCS product.

[0018] S4. Subsequently, the electric cylinder is started, and the output end of the electric cylinder drives the telescopic plate on the slide to move, thereby driving the PIN push rod on the telescopic plate to push the PIN into the PCS product and press the PIN into place.

[0019] S5. After the first deep pressing is completed, the transport plate moves in a circular motion again. The nozzle closer to the previous process places the pre-processed PCS product on the carrier closer to the previous process again, waiting for the first deep pressing. Meanwhile, the nozzle in the middle closer to the previous process places the PCS product that has completed the first deep pressing on the carrier away from the previous process, waiting for the second deep pressing.

[0020] S6. Simultaneously, the upper pressure cylinder is activated, pushing the moving plate forward. The spring plate on the moving plate, by compressing the spring, pushes the movable plate forward, causing the pressure bar on the movable plate to move towards the PIN of the PCS product. When the spring is compressed to a certain depth, the arc-shaped surface on the pressure bar begins to fit with the arc-shaped groove on the spring plate. Then, the arc-shaped groove compresses the arc-shaped surface, causing the arc-shaped surface to move upward, thereby causing the pressure bar to tilt, so that the pressure head presses down on the PIN of the PCS product. Subsequently, the electric cylinder is activated, and the output end of the electric cylinder drives the telescopic plate on the slide to move, thereby driving the PIN push rod on the telescopic plate to advance towards the PCS product, pressing the PIN into place.

[0021] S7. After the second deep pressing is completed, the transport plate moves in a circular motion again. The suction nozzle near the previous process places the pre-processed PCS product on the carrier near the previous process again, waiting for the first deep pressing. The suction nozzle in the middle near the previous process places the PCS product that has completed the first deep pressing on the carrier away from the previous process, waiting for the second deep pressing. The suction nozzle in the middle near the suction station places the PCS product that has completed the second deep pressing on the suction station, waiting for the suction nozzle on the transport plate near the subsequent process to be sucked up.

[0022] S8. At the same time, the drive motor starts, the turntable station rotates, and the camera inspects the PCS products passing through the camera port. When the inspected product is qualified, the suction nozzle on the transport plate near the subsequent process will pick up the qualified product at the suction station and transfer it to the subsequent station. When the camera detects that the product is unqualified, the suction nozzle on the transport plate near the subsequent process will grab the unqualified product and release it when it is transported to the top of the storage box, thereby collecting the defective product.

[0023] The advantages of this invention are:

[0024] 1. By cooperating with the support columns, support plates, uprights and triangular plates, the height of the handling components and pressing components can be adjusted so that the handling components and pressing components are at the same height as the previous station, thereby facilitating the handling and pressing of the handling components and pressing components.

[0025] 2. The upper pressure cylinder is activated to hold the PCS product in place, thus preventing the PCS product from tilting upwards. The electric cylinder then moves to push the PIN pusher into the carrier, so that the PIN pusher presses the PCS product into place, avoiding the problem of product defects caused by insufficient PIN insertion depth. Moreover, through the cooperation of the upper pressure cylinder, electric cylinder, carrier, and PIN pusher, the PCS product is pressed in a second depth, thereby improving the production quality of PCS products and saving costs.

[0026] 3. The symmetrically arranged electric cylinders allow each product to be used independently, thus ensuring the stability of the pressing force and depth, avoiding the problem of product defects caused by insufficient insertion depth, thereby improving the quality of PCS products and saving costs.

[0027] 4. The pressure head is made of soft material, which prevents scratches on the surface of the PCS product. The design of the arc surface on the pressure bar and the arc groove on the spring plate makes the arc surface be squeezed upward by the arc groove when the spring plate presses the spring forward. This achieves the purpose of pressing the PCS product with the pressure head on the pressure bar, thereby improving the accuracy of the PIN push rod on the electric cylinder, and further improving the quality and efficiency of production. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the overall structure of the support component and the pressing component of the present invention;

[0030] Figure 3 This is a schematic diagram of the overall structure of the transport assembly of the present invention;

[0031] Figure 4 This is a schematic diagram of the overall structure of the internal components of the conveying assembly of the present invention;

[0032] Figure 5 This is an isometric side view of the press-in assembly of the present invention;

[0033] Figure 6 This is a side view of the press-in component of the present invention;

[0034] Figure 7 This is a schematic diagram of the overall structure of the internal components of the press-in assembly of the present invention;

[0035] Figure 8 This is a side view of the internal components of the press-in assembly of the present invention;

[0036] Figure 9 This is a schematic diagram of the overall structure of the detection module of the present invention;

[0037] In the diagram: 100, Support assembly; 101, Support column; 102, Support plate; 103, Vertical plate; 104, Triangular plate; 200, Handling assembly; 201, Motor; 202, Horizontal plate; 202a, Through hole; 203, Vertical column; 204, Handling component; 204a, Handling plate; 204a-1, Mounting hole; 204b, Fixing device; 204b-1, Cutout; 204b-2, Fixing hole; 204c, Suction nozzle; 204d, Rotating plate; 300, Press-in assembly; 301, Electric cylinder; 301a, Slide rail; 301b, Slide table; 301c, Telescopic plate; 302, PIN push rod; 303, Carrier; 30 3a. Docking groove; 303b. Limiting boss; 304. Pressing cylinder; 304a. First guide rail; 304b. First guide platform; 304c. Moving plate; 304d. Second guide rail; 304e. Second guide platform; 304f. Movable plate; 304f-1. Ear plate; 304g. Spring plate; 304g-1. Arc groove; 304h. Spring; 304i. Pressure strip; 304i-1. Arc surface; 304j. Pressure head; 400. Detection module; 401. Camera; 402. Detection frame; 403. Drive motor; 404. Turntable station; 405. Detection carrier; 406. Pickup station; 407. Storage box. Detailed Implementation

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0039] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0040] In this invention, unless otherwise stated, the directional terms such as "up" and "down" generally refer to the directions shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" generally refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention.

[0041] Example 1

[0042] Please see Figure 1-9 The present invention provides the following technical solutions:

[0043] A handling and pressing device for semiconductor devices includes a support assembly 100, a handling assembly 200, and a pressing assembly 300. The support assembly 100 places the handling assembly 200 and the pressing assembly 300 at the same height, thereby facilitating the handling assembly 200 to handle PCS products and the pressing assembly 300 to press them in. The pressing assembly 300 performs a secondary deep pressing of the pre-processed PCS products, thereby avoiding the problem of product defects due to insufficient insertion depth, thus improving the quality of PCS products and saving costs.

[0044] Specifically, the support assembly 100 includes a support column 101, support plates 102 symmetrically arranged at both ends of the support column 101, a vertical plate 103 arranged at one end of the support plate 102, and a triangular plate 104 arranged on the side wall of the vertical plate 103 away from the support plate 102. The support column 101, support plate 102, vertical plate 103 and triangular plate 104 cooperate with each other to adjust the height of the transport assembly 200 and the pressing assembly 300, so that the transport assembly 200 and the pressing assembly 300 maintain the same height as the previous station, thereby facilitating the transport and pressing of the transport assembly 200 and the pressing assembly 300.

[0045] Specifically, the conveying assembly 200 is mounted on the triangular plate 104 and includes a motor 201, a horizontal plate 202 mounted on the side wall of the motor 201, uprights 203 symmetrically mounted at both ends of the horizontal plate 202, and a conveying component 204 mounted on the side of the horizontal plate 202 away from the motor 201.

[0046] Specifically, the pressing component 300 is disposed on the top of the support plate 102 and the triangular plate 104, including an electric cylinder 301, a PIN push rod 302 disposed at one end of the electric cylinder 301, a carrier 303 disposed at the end of the PIN push rod 302 away from the electric cylinder 301, and an upper pressing cylinder 304 disposed on the side of the carrier 303 away from the PIN push rod 302.

[0047] The upper cylinder 304 is activated to press the PCS product in place, thereby preventing the PCS product from tilting upwards. The electric cylinder 301 then moves to push the PIN push rod 302 onto the carrier 303, so that the PIN push rod 302 presses the PCS product into place, avoiding the problem of product defects caused by insufficient PIN insertion depth. Moreover, through the cooperation of the upper cylinder 304, electric cylinder 301, carrier 303 and PIN push rod 302, the PCS product is pressed in a second depth, thereby improving the production quality of the PCS product and saving costs.

[0048] Furthermore, the horizontal plate 202 has symmetrical through holes 202a on its side wall along the length direction. The transport component 204 can be connected to the output end of the motor 201 through the through holes 202a. The transport component 204 and the motor 201 are connected through the through holes 202a, so that the motor 201 provides a power source for the transport component 204, thereby achieving the purpose of transporting the transport component 204.

[0049] Furthermore, the transport component 204 includes a transport plate 204a, a fixture 204b disposed on the side wall of the transport plate 204a, and a suction nozzle 204c that is inserted into and cooperates with the fixture 204b; wherein, the transport plate 204a has symmetrically provided mounting holes 204a-1 on the side wall along the length direction, and a rotating plate 204d is symmetrically provided between the transport plate 204a and the horizontal plate 202, one end of the rotating plate 204d is connected to the output end of the motor 201, and the other end is connected to the transport plate 204a through the mounting hole 204a-1.

[0050] The motor 201 rotates the rotating plate 204d, thereby driving the suction nozzle 204c on the conveying plate 204a to transport and pick up the products. This avoids the probability of damage to the PCS products caused by manual contact, improves the production quality of the PCS products, and the suction nozzle 204c is made of PEEK material, which achieves the purpose of preventing scratches on the PCS products.

[0051] Specifically, the retainers 204b are distributed along the length of the transport plate 204a, and multiple sets are provided. Among them, the retainers 204b have a cutout 204b-1 on the side wall away from the transport plate 204a. The top and bottom of the cutout 204b-1 are provided with fixing holes 204b-2. The suction nozzle 204c can be inserted into the fixing hole 204b-2. By setting multiple sets of retainers 204b and suction nozzles 204c, 4 pieces of products can be picked up at one time, and the products can be transported, picked up and pressed in at the same time, thereby improving work efficiency and saving time.

[0052] Furthermore, the electric cylinders 301 are symmetrically distributed in the radial N direction on the top of the support plate 102. The output shaft of the electric cylinders 301 is fitted with a slide rail 301a, and a slide table 301b is provided on the slide rail 301a. The slide rail 301a and the slide table 301b are slidably connected. The slide table 301b is H-shaped. A telescopic plate 301c is provided on the side of the slide table 301b away from the slide rail 301a. The end of the PIN needle push rod 302 away from the carrier 303 is connected to one end of the telescopic plate 301c.

[0053] The symmetrically arranged electric cylinders 301 allow each product to be used independently, thus ensuring the stability of the pressing force and depth, avoiding the problem of product defects caused by insufficient insertion depth, thereby improving the quality of PCS products and saving costs; while the arrangement of slide rails 301a and slide tables 301b ensures that the PIN push rod 302 has sufficient length to push the PCS products in.

[0054] Furthermore, the carrier 303 is symmetrically distributed at the top end along the length of the upright plate 103. The top of the carrier 303 is provided with a docking groove 303a in the radial N direction, and the docking groove 303a is provided with limiting bosses 303b symmetrically arranged in the axial M direction. The end of the PIN push rod 302 away from the telescopic plate 301c can be inserted into the docking groove 303a, and multiple sets of limiting bosses 303b are provided.

[0055] The size of the docking groove 303a can fit the PCS product, thereby improving the stability of the PCS product placement. In addition, multiple sets of limiting bosses 303b are set to place each PIN pin in the PCS product separately, avoiding wear and bending of the PIN pin, thereby improving the production quality of the product, increasing work efficiency, and saving costs.

[0056] Furthermore, the pressing cylinders 304 are symmetrically distributed in the radial N direction on the top of the triangular plate 104. One end of the pressing cylinder 304 is provided with a first guide rail 304a, a first guide platform 304b is provided on the first guide rail 304a, and a movable plate 304c is provided on the top of the first guide platform 304b. The first guide rail 304a and the first guide platform 304b are slidably connected, and the output end of the pressing cylinder 304 is connected to one end of the movable plate 304c. The symmetrical arrangement of the pressing cylinders 304 allows each product to be used independently, thereby ensuring the stability of the pressing force on the PCS product, achieving the purpose of preventing the PCS product from tilting upwards, thus improving the quality of the PCS product and saving costs.

[0057] Specifically, a second guide rail 304d is provided on the top of the movable plate 304c, a second guide platform 304e is provided on the second guide rail 304d, and a movable plate 304f is provided on the second guide platform 304e. The second guide rail 304d and the second guide platform 304e are slidably connected. A spring plate 304g is provided at one end of the second guide rail 304d. The spring plate 304g is L-shaped. A spring 304h is provided on one side of the spring plate 304g along its length. The end of the spring 304h away from the spring plate 304g is connected to the side wall of the movable plate 304f.

[0058] The upper pressure cylinder 304 pushes the moving plate 304c, which in turn drives the spring plate 304g to push the movable plate 304f through the spring 304h, thereby bringing the movable plate 304f closer to the carrier 303 and achieving the purpose of displacement.

[0059] Furthermore, the top of the movable plate 304f is symmetrically provided with ear plates 304f-1 in the radial N direction, and a pressure strip 304i is provided in the middle of the ear plate 304f-1. A pressure head 304j is provided at one end of the pressure strip 304i. The pressure strip 304i is distributed in the radial N direction on the top of the movable plate 304f. The pressure strip 304i is bolted to the ear plate 304f-1. An arc-shaped surface 304i-1 is provided at the end of the pressure strip 304i away from the pressure head 304j. An arc-shaped groove 304g-1 is provided on the side wall of the spring plate 304g near the pressure strip 304i. The arc-shaped surface 304i-1 can slide in the arc-shaped groove 304g-1. The pressure head 304j is distributed at the end of the mating groove 303a away from the PIN needle push rod 302. The suction nozzle 204c is distributed between the PIN needle push rod 302 and the pressure head 304j.

[0060] The pressure head 304j is made of soft material to prevent scratches on the surface of the PCS product. The design of the arc surface 304i-1 on the pressure bar 304i and the arc groove 304g-1 on the spring plate 304g ensures that when the spring plate 304g presses the spring 304h forward, the arc surface 304i-1 is squeezed upward by the arc groove 304g-1. This achieves the purpose of pressing the pressure head 304j on the pressure bar 304i to hold the PCS product in place, thereby improving the accuracy of the PIN push rod 302 on the electric cylinder 301 and further improving the quality and efficiency of production.

[0061] Furthermore, a detection module 400 is also provided on one side of the support plate 102; the detection module 400 includes a camera 401, a detection frame 402 disposed on one side of the camera 401, a drive motor 403 disposed in the detection frame 402, a turntable station 404 disposed on the top of the detection frame 402, and a detection carrier 405 disposed on the turntable station 404; wherein, the turntable station 404 is cross-shaped, the detection carrier 405 is distributed on the cross-shaped station of the turntable station 404 near the camera 401, and a suction station 406 is disposed on the cross-shaped station away from the camera 401, and a storage box 407 is disposed between the suction station 406 and the detection carrier 405.

[0062] The camera 401 detects the insertion depth and the spacing of the pins. The camera 401 is 1200W and backlit. After the PCS products are picked up and placed on the testing carrier 405, the turntable station 404 rotates to the position of the camera 401 to start the testing. When the product is qualified, the suction nozzle 204c on the transfer plate 204a, which is close to the subsequent process, will pick up the qualified product on the picking station 406 and transfer it to the subsequent station. When the camera 401 detects a product as unqualified, the suction nozzle 204c on the transfer plate 204a, which is close to the subsequent process, will pick up the unqualified product and release it when it is transported to the top of the storage box 407, thereby collecting the defective products.

[0063] Example 2

[0064] Please see Figure 1-9 The operation of the above-mentioned device is explained as follows:

[0065] Step 1: Motor 201 starts, and the output end of motor 201 drives the conveyor plate 204a to move forward to the next station. The suction nozzle 204c on the conveyor plate 204a, which is close to the previous process, will pick up the PCS products that have been initially processed and put them into the ready-to-move state.

[0066] Step 2: Next, the output end of motor 201 drives the conveyor plate 204a to start a semi-circular motion. The suction nozzle 204c, which is close to the previous process, places the initially processed PCS product on the carrier close to the previous process, waiting for the first deep pressing.

[0067] Step 3: Simultaneously, the upper pressure cylinder is activated and pushes the moving plate 304c forward. The spring plate 304g on the moving plate 304c pushes the movable plate 304f forward by squeezing the spring. Consequently, the pressure bar 304i on the movable plate 304f also moves toward the PIN of the PCS product. When the spring is squeezed to a certain depth, the arc surface 304i-1 on the pressure bar 304i begins to fit with the arc groove 304g-1 on the spring plate 304g. Then, the arc groove 304g-1 squeezes the arc surface 304i-1, causing the arc surface 304i-1 to move upward, thereby causing the pressure bar 304i to tilt, so that the pressure head 304j presses down on the PIN of the PCS product.

[0068] Step 4: Subsequently, the electric cylinder 301 is started. The output end of the electric cylinder 301 drives the telescopic plate 301c on the slide 301b to move, thereby driving the PIN push rod 302 on the telescopic plate 301c to push the PIN into place.

[0069] Step 5: After the first deep pressing is completed, the transport plate 204a makes a circular motion again. The suction nozzle 204c close to the previous process places the pre-processed PCS product on the carrier close to the previous process again, waiting for the first deep pressing. Meanwhile, the suction nozzle 204c in the middle close to the previous process places the PCS product that has completed the first deep pressing on the carrier away from the previous process, waiting for the second deep pressing.

[0070] Step 6: Simultaneously, the upper pressure cylinder is activated, pushing the moving plate 304c forward. The spring plate 304g on the moving plate 304c, by compressing the spring, pushes the movable plate 304f forward. Consequently, the pressure bar 304i on the movable plate 304f also moves towards the PIN of the PCS product. When the spring is compressed to a certain depth, the arc-shaped surface 304i-1 on the pressure bar 304i begins to fit with the arc-shaped groove 304g-1 on the spring plate 304g. Then, the arc-shaped groove 304g-1 compresses the arc-shaped surface 304i-1, causing the arc-shaped surface 304i-1 to move upward, thereby causing the pressure bar 304i to tilt, so that the pressure head 304j presses down on the PIN of the PCS product. Subsequently, the electric cylinder 301 is activated, and the output end of the electric cylinder 301 drives the telescopic plate 301c on the slide table 301b to move, thereby driving the PIN push rod 302 on the telescopic plate 301c to advance towards the PCS product, pressing the PIN into place.

[0071] Step 7: After the second deep pressing is completed, the transport plate 204a moves in a circular motion again. The suction nozzle 204c near the previous process places the pre-processed PCS product on the carrier near the previous process again, waiting for the first deep pressing. The suction nozzle 204c in the middle near the previous process places the PCS product that has completed the first deep pressing on the carrier away from the previous process, waiting for the second deep pressing. Meanwhile, the suction nozzle 204c in the middle near the suction station 406 places the PCS product that has completed the second deep pressing on the suction station 406, waiting for the suction nozzle 204c on the transport plate 204a near the subsequent process to pick it up.

[0072] Step 8: Simultaneously, drive motor 403 starts, turntable station 404 rotates, and camera 401 inspects the PCS products passing through the camera port of camera 401. When the inspected product is qualified, the suction nozzle 204c on the transport plate 204a, which is close to the subsequent process, will pick up the qualified product on the suction station 406 and transfer it to the subsequent station. When the camera 401 detects a product as unqualified, the suction nozzle 204c on the transport plate 204a, which is close to the subsequent process, will grab the unqualified product and release it when it is transported to the top of the storage box 407, thereby collecting the defective product.

[0073] Obviously, the embodiments described above are merely some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention.

[0074] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0075] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0076] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A conveying and pressing device for semiconductor devices, characterized in that: include, The support assembly (100) includes a support column (101), a support plate (102) symmetrically arranged at both ends of the support column (101), a vertical plate (103) arranged at one end of the support plate (102), and a triangular plate (104) arranged on the side wall of the vertical plate (103) away from the support plate (102). A conveying assembly (200), disposed on the triangular plate (104), includes a motor (201), a horizontal plate (202) disposed on the side wall of the motor (201), uprights (203) symmetrically disposed at both ends of the horizontal plate (202), and a conveying component (204) disposed on the side of the horizontal plate (202) away from the motor (201). The conveying component (204) includes a conveying plate (204a), a fixture (204b) disposed on the side wall of the conveying plate (204a), and a suction nozzle (204c) that is inserted into and mates with the fixture (204b). The pressing assembly (300) is disposed on the top of the support plate (102) and the triangular plate (104), including an electric cylinder (301), a PIN needle push rod (302) disposed at one end of the electric cylinder (301), a carrier (303) disposed at the end of the PIN needle push rod (302) away from the electric cylinder (301), and an upper pressure cylinder (304) disposed on the side of the carrier (303) away from the PIN needle push rod (302). The carrier (303) is symmetrically distributed along the top end of the vertical plate (103) in the length direction, and the top of the carrier (303) is provided with a docking groove (303a) in the radial (N) direction. The upper pressure cylinder (304) is symmetrically distributed in the radial (N) direction on the top of the triangular plate (104). One end of the upper pressure cylinder (304) is provided with a first guide rail (304a), a first guide platform (304b) is provided on the first guide rail (304a), and a movable plate (304c) is provided on the top of the first guide platform (304b). The first guide rail (304a) and the first guide platform (304b) are slidably connected. The output end of the upper pressure cylinder (304) is connected to one end of the movable plate (304c). The movable plate (304c) is provided with a second guide rail (304d) on its top, a second guide platform (304e) is provided on the second guide rail (304d), and a movable plate (304f) is provided on the second guide platform (304e). The second guide rail (304d) and the second guide platform (304e) are slidably connected. A spring plate (304g) is provided at one end of the second guide rail (304d). The spring plate (304g) is L-shaped. A spring (304h) is provided on one side of the spring plate (304g) along its length. The end of the spring (304h) away from the spring plate (304g) is connected to the side wall of the movable plate (304f). The top of the movable plate (304f) is symmetrically provided with ear plates (304f-1) in the radial (N) direction, and a pressure strip (304i) is provided in the middle of the ear plate (304f-1). A pressure head (304j) is provided at one end of the pressure strip (304i). The pressure strip (304i) is radially (N) distributed on the top of the movable plate (304f). The pressure strip (304i) is bolted to the ear plate (304f-1). An arc-shaped surface (304i-1) is provided at the end of the pressure strip (304i) away from the pressure head (304j). An arc-shaped groove (304g-1) is provided on the side wall of the spring plate (304g) near the pressure strip (304i). The arc-shaped surface (304i-1) can slide in the arc-shaped groove (304g-1). The pressure head (304j) is distributed at the end of the docking groove (303a) away from the PIN needle push rod (302). The suction nozzle (204c) is distributed between the PIN needle push rod (302) and the pressure head (304j).

2. The conveying and pressing device for semiconductor devices according to claim 1, characterized in that: The horizontal plate (202) has symmetrical through holes (202a) on its side wall along the length direction, and the conveying component (204) can be connected to the output end of the motor (201) through the through holes (202a).

3. The conveying and pressing device for semiconductor devices according to claim 1, characterized in that: The conveying plate (204a) has symmetrical mounting holes (204a-1) on its side wall along the length direction. A rotating plate (204d) is symmetrically arranged between the conveying plate (204a) and the horizontal plate (202). One end of the rotating plate (204d) is connected to the output end of the motor (201), and the other end is connected to the conveying plate (204a) through the mounting hole (204a-1).

4. The conveying and pressing device for semiconductor devices according to claim 3, characterized in that: The fixtures (204b) are distributed along the length of the transport plate (204a), and multiple sets are provided; The fixture (204b) has a cut (204b-1) on its side wall away from the transport plate (204a). The top and bottom of the cut (204b-1) are provided with fixing holes (204b-2), and the suction nozzle (204c) can be inserted into the fixing hole (204b-2).

5. The conveying and pressing device for semiconductor devices according to claim 3, characterized in that: The electric cylinders (301) are symmetrically distributed in the radial (N) direction on the top of the support plate (102). A slide rail (301a) is sleeved on the output shaft of the electric cylinder (301), and a slide table (301b) is provided on the slide rail (301a). The slide rail (301a) and the slide table (301b) are slidably connected. The slide (301b) is H-shaped, and a telescopic plate (301c) is provided on the side of the slide (301b) away from the slide rail (301a). The end of the PIN push rod (302) away from the carrier (303) is connected to one end of the telescopic plate (301c).

6. A conveying and pressing device for semiconductor devices according to claim 1 or 5, characterized in that: Limiting bosses (303b) are symmetrically provided in the axial (M) direction inside the docking groove (303a); The end of the PIN push rod (302) away from the telescopic plate (301c) can be inserted into the docking groove (303a), and the limiting boss (303b) is provided in multiple sets.

7. The conveying and pressing device for semiconductor devices according to claim 5, characterized in that: A detection module (400) is also provided on one side of the support plate (102). The detection module (400) includes a camera (401), a detection frame (402) disposed on one side of the camera (401), a drive motor (403) disposed in the detection frame (402), a turntable station (404) disposed on the top of the detection frame (402), and a detection carrier (405) disposed on the turntable station (404). The turntable station (404) is cross-shaped, and the detection carrier (405) is distributed on the cross-shaped station of the turntable station (404) near the camera (401). The cross-shaped station away from the camera (401) is provided with a suction station (406), and a storage box (407) is provided between the suction station (406) and the detection carrier (405).

8. A method for conveying and pressing semiconductor devices, characterized in that: Using the semiconductor device conveying and pressing apparatus of claim 7, the following steps are performed: S1. The motor (201) starts, and the output end of the motor (201) drives the conveyor plate (204a) to move forward to the next station. The suction nozzle (204c) on the conveyor plate (204a) close to the previous process will pick up the PCS products that have been pre-processed in front and enter the ready-to-move state. S2. Next, the output end of the motor (201) drives the conveyor plate (204a) to start a semi-circular motion. The suction nozzle (204c) close to the previous process places the pre-processed PCS product on the carrier (303) close to the previous process, waiting for the first deep pressing. S3. At the same time, the upper pressure cylinder is activated and pushes the moving plate (304c) forward. The spring plate (304g) on ​​the moving plate (304c) pushes the movable plate (304f) forward by squeezing the spring. Then, the pressure bar (304i) on the movable plate (304f) also moves towards the PIN of the PCS product. When the spring is squeezed to a certain depth, the arc surface (304i-1) on the pressure bar (304i) and the arc groove (304g-1) on the spring plate (304g) begin to fit together. Then, the arc groove (304g-1) squeezes the arc surface (304i-1), causing the arc surface (304i-1) to move upward, thereby causing the pressure bar (304i) to start to tilt, so that the pressure head (304j) presses down on the PIN of the PCS product. S4. Subsequently, the electric cylinder (301) is started. The output end of the electric cylinder (301) drives the telescopic plate (301c) on the slide (301b) to move, thereby driving the PIN push rod (302) on the telescopic plate (301c) to push towards the PCS product and press the PIN into place. S5. After the first deep pressing is completed, the transport plate (204a) makes a circular motion again. The suction nozzle (204c) close to the previous process places the pre-processed PCS product on the carrier (303) close to the previous process again, waiting for the first deep pressing. Meanwhile, the suction nozzle (204c) in the middle close to the previous process places the PCS product that has completed the first deep pressing on the carrier (303) far away from the previous process, waiting for the second deep pressing. S6. At the same time, the upper pressure cylinder is activated and pushes the moving plate (304c) forward. The spring plate (304g) on ​​the moving plate (304c) pushes the movable plate (304f) forward by squeezing the spring. Then, the pressure bar (304i) on the movable plate (304f) also moves towards the PIN of the PCS product. When the spring is squeezed to a certain depth, the arc surface (304i-1) on the pressure bar (304i) and the arc groove (304g-1) on the spring plate (304g) begin to fit together. Then, the arc groove (304g-1) squeezes the arc surface (304i-1), causing the arc surface (304i-1) to move upward, thereby causing the pressure bar (304i) to start to tilt, so that the pressure head (304j) presses down on the PIN of the PCS product. Subsequently, the electric cylinder (301) is started, and the output end of the electric cylinder (301) drives the telescopic plate (301c) on the slide (301b) to move, thereby driving the PIN push rod (302) on the telescopic plate (301c) to push towards the PCS product and press the PIN into place; S7. After the second deep pressing is completed, the transport plate (204a) makes a circular motion again. The suction nozzle (204c) close to the previous process places the pre-processed PCS product on the carrier (303) close to the previous process again, waiting for the first deep pressing. The suction nozzle (204c) close to the previous process places the PCS product that has completed the first deep pressing on the carrier (303) away from the previous process, waiting for the second deep pressing. The suction nozzle (204c) close to the suction station (406) places the PCS product that has completed the second deep pressing on the suction station (406), waiting for the suction nozzle (204c) close to the subsequent process on the transport plate (204a) to pick it up. S8. At the same time, the drive motor (403) starts, the turntable station (404) rotates, and the camera (401) inspects the PCS products passing through the camera port (401). When the inspected product is qualified, the suction nozzle (204c) on the transfer plate (204a) near the subsequent process will pick up the qualified product on the suction station (406) and transfer it to the subsequent station. When the camera (401) detects that the product is unqualified, the suction nozzle (204c) on the transfer plate (204a) near the subsequent process will pick up the unqualified product and release it when it is transported to the top of the storage box (407), thereby collecting the defective product.

Citation Information

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