一种冷却液分流板及芯片冷却结构
By introducing a coolant distribution plate structure into the chiplet integrated chip, and using the notch formed by the serpentine plate and baffle to guide the coolant, the problem of uneven heat dissipation caused by the rise in coolant temperature is solved, and the uniformity of cooling effect of each part of the chip and the overall cooling effect are improved.
CN116417423BActive Publication Date: 2026-07-17ZHEJIANG LAB +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG LAB
- Filing Date
- 2023-01-19
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Traditional on-chip cooling methods result in high local heat flux density and uneven heat distribution in chiplets. The gradually increasing coolant temperature leads to uneven heat dissipation, affecting the normal operation of the chip.
Method used
The coolant distribution plate structure includes a plate and a guide plate. The guide plate separates the inlet and outlet channels in the flow channel, and the serpentine plate and baffle form a notch to guide the coolant, ensuring that the coolant is evenly distributed on the chip surface.
Benefits of technology
This achieves uniform cooling across all parts of the chiplet integrated chip, improving the overall cooling performance and heat dissipation uniformity of the chip.
✦ Generated by Eureka AI based on patent content.
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Figure CN116417423B_ABST
Abstract
本发明涉及一种冷却液分流板及芯片冷却结构，包括板体和导流板；所述板体正面中间内凹形成流动槽，所述板体边缘开设有总进液口和总出液口，所述流动槽的底壁上开设有冷却口；所述导流板设置在所述流动槽的底壁上并阻隔在所述总进液口和所述总出液口之间，以在所述流动槽中分隔出进液通道和出液通道，所述进液通道连通至所述总进液口，所述出液通道连通至所述总出液口；所述导流板包括若干蛇形板，所述蛇形板盖合在所述冷却口上，所述蛇形板的一侧凹口为第一进液凹口，所述蛇形板的另一侧凹口为第一出液凹口，所述第一进液凹口连通至所述进液通道，所述第一出液凹口连通至所述出液通道。本发明整个芯粒的散热相对均匀。
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