Wiring board device

Abstract

A wiring board device includes a stack structure, a main ground area, and a circuit module. The stack structure includes a plurality of board bodies. The main ground area is disposed in the stack structure. The circuit module includes a differential signal circuit and a surrounding circuit group. The differential signal circuit is located in the stack structure and includes a positive signal pad and a negative signal pad. The positive signal pad is located on a disposition surface of one of the board bodies. The negative signal pad is located on the disposition surface and is separated from the positive signal pad. The surrounding circuit group is located on the disposition surface, is electrically connected to the main ground area, encloses around the positive signal pad and the negative signal pad, and is physically separated from the differential signal circuit. Through the above structure, the input loss and the loop loss of the signal of the wiring board device can be maintained or improved, so as to enhance the signal performance of the signal channel.

Description

Technical Field

[0001] This invention relates to a wiring board device, and more particularly to a wiring board device having a differential signal circuit. Background Technology

[0002] Generally, the substrate structure of a traditional semiconductor device consists of multiple stacked plates, and these plates have patterned circuits and vias. The individual patterned circuits of these plates are interconnected through the vias and communicate with other electronic units on the same plate through the contacts of the vias.

[0003] However, increasing the size of semiconductor components may cause substrate warping, and increasing the thickness of the substrate structure may cause the signal resonance point during operation to shift to a lower resonance frequency, making it more prone to input loss and loop failure, thereby affecting the signal performance of the signal channel.

[0004] It is evident that the aforementioned technologies still have inconveniences and shortcomings, which are problems that the industry urgently needs to solve. Summary of the Invention

[0005] One object of the present invention is to provide a wiring board device to solve the difficulties mentioned in the prior art.

[0006] An embodiment of the present invention provides a patch panel device. The patch panel device includes a stacked structure, a main contact area, and a circuit module. The stacked structure includes multiple boards stacked on top of each other. The main contact area is disposed within the stacked structure. The circuit module includes a differential signal circuit and a surrounding circuit group. The differential signal circuit is located within the stacked structure and includes a positive signal section and a negative signal section. The positive signal section has a positive signal pad. The positive signal pad is located on the surface of one of the boards. The negative signal section has a negative signal pad, which is located on the surface and is separate from the positive signal pad. The surrounding circuit group is located on the surface, electrically connected to the main contact area, enclosing the positive and negative signal pads, and is physically separate from the differential signal circuit.

[0007] According to one or more embodiments of the present invention, in the above-described wiring harness, the surrounding circuit group includes a metal surrounding portion that continuously surrounds a closed profile on the configuration surface. The metal surrounding portion is electrically connected to the main contact area and together surrounds the positive signal pad and the negative signal pad.

[0008] According to one or more embodiments of the present invention, in the above-described wiring harness, the surrounding circuit group further includes a connecting wire. The connecting wire is located within the metal surrounding portion, between the positive signal pad and the negative signal pad, and is physically separate from the positive signal pad and the negative signal pad.

[0009] According to one or more embodiments of the present invention, in the above-described wiring harness, the surrounding circuit group further includes at least one grounding via. The grounding via is located on the metal surrounding portion and these plates, and is electrically connected to the main grounding area.

[0010] According to one or more embodiments of the present invention, in the above-described wiring harness, the surrounding circuit group further includes a first metal surrounding portion and a second metal surrounding portion. The first metal surrounding portion encloses and surrounds the positive signal pad, is physically separate from the positive signal pad, and is electrically connected to the main connection area. The second metal surrounding portion encloses and surrounds the negative signal pad, is physically separate from the negative signal pad, and is electrically connected to the main connection area. The first metal surrounding portion and the second metal surrounding portion are connected to or separated from each other.

[0011] According to one or more embodiments of the present invention, in the above-described wiring harness, the surrounding circuit group further includes a connecting wire. The connecting wire is located outside the first metal surrounding portion and the second metal surrounding portion, and directly connects the first metal surrounding portion and the second metal surrounding portion.

[0012] According to one or more embodiments of the present invention, in the above-described wiring harness, the surrounding circuit group further includes at least one first grounding via and at least one second grounding via. The first grounding via is located on the first metal surrounding portion and these plates, and is electrically connected to the first metal surrounding portion and the main grounding area. The second grounding via is located on the second metal surrounding portion and these plates, and is electrically connected to the second metal surrounding portion and the main grounding area.

[0013] According to one or more embodiments of the present invention, in the above-described wiring board device, the circuit module further includes a grounding layer and at least one peripheral grounding via. The grounding layer is located on the mounting surface of the board and surrounds the circuit group, positive signal pad, and negative signal pad. The grounding layer has a closed opening exposing the mounting surface. The peripheral grounding via penetrates the grounding layer and these board bodies, and electrically connects the grounding layer and the main grounding area. The circuit group, positive signal pad, and negative signal pad are located within the closed opening and are separated from the grounding layer body.

[0014] According to one or more embodiments of the present invention, in the above-described wiring board device, the surrounding circuit group further includes a connecting wire, one end of which is connected to the surrounding circuit group, and the other end of which is connected to one of the peripheral grounding hole and the grounding layer.

[0015] According to one or more embodiments of the present invention, in the above-described wiring harness, the surrounding circuit group further includes a grounding layer and a separating conductor. The grounding layer is located on the mounting surface of the board and encloses the positive signal pad and the negative signal pad. The grounding layer has a closed opening that exposes the mounting surface. The positive signal pad and the negative signal pad are both located within the outline of the closed opening. The separating conductor is located on the mounting surface within the closed opening, connecting two opposite inner sides of the closed opening, and is located between the positive signal pad and the negative signal pad. The separating conductor divides the closed opening into two closed regions, which respectively accommodate the positive signal pad and the negative signal pad, and the separating conductor physically separates the positive signal pad and the negative signal pad.

[0016] Thus, through the above architecture, even if the board thickness of the wiring board device in this case is increased, the input loss and loop loss of the signal can still be maintained or improved, thereby enhancing the signal performance of the signal channel.

[0017] The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings. Attached Figure Description

[0018] To make the above and other objects, features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described below:

[0019] Figure 1 This is a side view of a wiring board device according to an embodiment of the present invention;

[0020] Figure 2 for Figure 1 The top view of region M;

[0021] Figure 3A and Figure 3B These are schematic diagrams of the circuit modules of a patch panel device according to an embodiment of the present invention, and they are in the same position. Figure 1 Region M;

[0022] Figure 4A and Figure 4B These are schematic diagrams of the circuit modules of a patch panel device according to an embodiment of the present invention, and they are in the same position. Figure 1 Region M;

[0023] Figures 5A to 5B These are schematic diagrams of the circuit modules of a patch panel device according to an embodiment of the present invention, and they are in the same position. Figure 1 Region M;

[0024] Figures 6A to 6B These are schematic diagrams of the circuit modules of a patch panel device according to an embodiment of the present invention, and they are in the same position. Figure 1 Region M;

[0025] Figure 7A and Figure 7B These are schematic diagrams of the circuit modules of a patch panel device according to an embodiment of the present invention, and they are in the same position. Figure 1 Region M;

[0026] Figures 8A to 8B These are schematic diagrams of the circuit modules of a patch panel device according to an embodiment of the present invention, and they are in the same position. Figure 1 Region M; and

[0027] Figure 9 This is a schematic diagram of the circuit module of a patch panel device according to an embodiment of the present invention, with the same position. Figure 1 Region M.

[0028] [Symbol Explanation]

[0029] 10-17: Wiring board assembly

[0030] 100: Layered structure

[0031] 110:Plate body

[0032] 111: Surface Configuration

[0033] 200: Main receiving area

[0034] 300, 301, 302, 303, 304, 305, 306, 307, 308, 309, 310, 311, 312, 313: Line modules

[0035] 400: Differential signal circuit

[0036] 410: Positive Signal Section

[0037] 411: Positive Channel

[0038] 412: Positive signal pad

[0039] 420: Negative Signal Section

[0040] 421: Negative Channel

[0041] 422: Negative signal pad

[0042] 500, 501, 502, 503, 504, 505, 506, 507: Circular track group

[0043] 510: Metal Surrounding Part

[0044] 511: Long ring

[0045] 512, 513: Long side

[0046] 514: Inner Ring Space

[0047] 515: Pipeline

[0048] 520: First connecting line

[0049] 521: First route

[0050] 522: Second route

[0051] 530: Second connecting line

[0052] 540, 541: Grounding conductor section

[0053] 551: First grounding guide hole

[0054] 552: Second grounding guide hole section

[0055] 560: First metal surrounding part

[0056] 570: Second metal surround

[0057] 580: Circular Space

[0058] 590: Third connecting line

[0059] 600, 601: Grounding layer

[0060] 610: Closed opening

[0061] 611, 612: Inner side

[0062] 613: Separating wire

[0063] 614, 615: Enclosed areas

[0064] 620: External grounding via

[0065] V: Vertical

[0066] H: Horizontal

[0067] M: Region Detailed Implementation

[0068] Several embodiments of the present invention will be disclosed below with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, in one embodiment of the invention, these practical details are not essential. Furthermore, for the sake of simplicity, some known and conventional structures and elements will be illustrated in the drawings in a simple schematic manner.

[0069] Figure 1 This is a side view of a wiring board device 10 according to an embodiment of the present invention. Figure 2 for Figure 1 The top view of region M. For example... Figure 1 and Figure 2 As shown, in this embodiment, the patch panel device 10 includes a stacked structure 100, a main grounding area 200, and a wiring module 300. The stacked structure 100 includes a plurality of boards 110. These boards 110 are stacked on top of each other along a longitudinal direction V. The surface 111 of any board 110 is made of an insulating material on which printed circuit patterns are distributed. The main grounding area 200 is disposed within the stacked structure 100. For example, the main grounding area 200 is a copper foil ground located within these boards 110 and extending along a transverse direction H.

[0070] The circuit module 300 includes a differential signal circuit 400 and a surround circuit group 500. The differential signal circuit 400 is located within the stacked structure 100 and includes a positive (e.g., P-pole) signal section 410 and a negative (e.g., N-pole) signal section 420. The positive signal section 410 has a positive channel 411 and a positive signal pad 412. The positive channel 411 extends through the stacked structure 100 and is electrically connected to the positive signal pad 412 to conduct the positive signal signal connection in the longitudinal direction V. The positive signal pad 412 is directly disposed on the mounting surface 111 of one of the plates 110 and is penetrated by a portion of the positive channel 411. The negative signal section 420 has a negative channel 421 and a negative signal pad 422. The negative channel 421 is disposed within the stacked structure 100 and electrically connected to the negative signal pad 422, used to conduct the negative signal signal in the longitudinal direction V. The negative signal pad 422 is directly disposed on the aforementioned surface 111 and is partially penetrated by the negative channel 421. The negative signal pad 422 and the positive signal pad 412 are side by side and physically separate. The surrounding circuit group 500 is directly disposed on the aforementioned surface 111, electrically connected to the main terminal area 200, enclosing and surrounding the positive signal pad 412 and the negative signal pad 422, and is physically separate from the differential signal circuit 400, that is, maintaining a distance from both the positive signal pad 412 and the negative signal pad 422.

[0071] Thus, through the above architecture, even if the board thickness of the wiring board device in this embodiment is increased, the input loss and loop loss of the signal can still be maintained or improved, thereby enhancing the signal performance of the signal channel.

[0072] In this embodiment, more specifically, the surrounding circuit assembly 500 includes a single metal surrounding portion 510. The metal surrounding portion 510 is formed on the configuration surface 111 and continuously surrounds a closed profile. The closed profile is, for example, an annular or elongated ring; however, the invention is not limited to its shape. The metal surrounding portion 510 only encloses and surrounds the positive signal pad 412 and the negative signal pad 422, not covering them. For example, the metal surrounding portion 510 is a printed metal layer or printed metal circuit with a thickness only on the micrometer scale, not a three-dimensional cover. The metal surrounding portion 510 continuously surrounds an elongated ring 511, which has an inner space 514. The metal surrounding portion 510 is electrically connected via a conduit 515 to the main contact area 200 located on the lower (or upper) layer. Figure 1 And together they surround the positive signal pad 412 and negative signal pad 422 on the configuration surface 111. In other words, the positive signal pad 412 and negative signal pad 422 are arranged together within the closed contour of the metal surrounding portion 510, and the positive signal pad 412 and negative signal pad 422 are completely separated from the metal surrounding portion 510 and have no direct or indirect contact. That is, the contours of the positive signal pad 412 and the negative signal pad 422 do not contact the elongated ring 511 of the metal surrounding portion 510 within the ring space 514.

[0073] In addition, the circuit module 300 also includes a ground layer 600 and a plurality of peripheral grounding vias 620. The ground layer 600 covers the mounting surface 111 of the board 110 and completely surrounds the metal surround 510, the positive signal pad 412, and the negative signal pad 422. These peripheral grounding vias 620 are spaced apart on the ground layer 600 and penetrate the ground layer 600 and these boards 110 ( Figure 1 Within the grounding area 600, the grounding layer 600, the metal surround 510, and the main grounding area 200 are electrically connected to each other as the same conductor. More specifically, the grounding layer 600 has a closed opening 610 that exposes the configuration surface 111. The metal surround 510, the positive signal pad 412, and the negative signal pad 422 are all located on the configuration surface 111 within the closed opening 610 and are physically separated from the grounding layer 600.

[0074] It should be understood that the differential signal circuit 400 and the surround circuit group 500 are both located on the same board 110 configuration surface 111 and between these boards 110; however, the present invention is not limited thereto.

[0075] Furthermore, during the design phase, the signal performance of the aforementioned signal channel can be altered by finely adjusting the coverage area, thickness, and spacing of the metal surround 510 and the electrode (positive / negative) signal pads.

[0076] Figure 3A and Figure 3B These are schematic diagrams of the circuit modules 301 and 302 of the wiring board device 11 according to an embodiment of the present invention, respectively, and they are in the same position. Figure 1 Region M. For example... Figure 1 and Figure 3A As shown, the line module 301 in this embodiment and Figure 2 The circuit module 300 is largely the same, except that the surrounding circuit group 501 also includes a plurality of first connecting lines 520. These first connecting lines 520 are located on a configuration surface 111 within the closed opening 610 and are arranged (e.g., in a straight line or in a bent arrangement) on the configuration surface 111. Each first connecting line 520 physically connects the metal surrounding portion 510 to one of the peripheral grounding vias 620. However, the invention is not limited thereto; in other embodiments, the first connecting lines may be replaced by physically connecting the metal surrounding portion to the ground layer.

[0077] More specifically, the metal surrounding portion 510 is, for example, an elongated ring 511 containing an inner ring space 514. These first connecting lines 520 are located outside the inner ring space 514; a portion of these first connecting lines 520 are connected to one long side 512 of the elongated ring 511, and another portion of these first connecting lines 520 are connected to the other long side 513 of the elongated ring 511. These first connecting lines 520 are, for example, printed metal layers or printed metal lines, with a thickness only on the micrometer scale, and are not a three-dimensional cover; however, the invention is not limited thereto.

[0078] like Figure 1 and Figure 3B As shown, the line module 302 in this embodiment and Figure 3A The circuit module 301 is largely the same, except that the surrounding circuit group 501 also includes a second connecting line 530. The second connecting line 530 is connected to the metal surrounding part 510 inside the metal surrounding part 510 and is located between the positive signal pad 412 and the negative signal pad 422, so that the positive signal pad 412 and the negative signal pad 422 are physically separated.

[0079] More specifically, the second connecting lines 530 are located within the annular space 514 of the metal surrounding portion 510 and are arranged in a straight line on the configuration surface 111 within the annular space 514. The two opposite ends of the second connecting lines 530 are respectively connected to the two opposite long sides 512 and 513 of the metal surrounding portion 510, thereby dividing the annular space 514 in two and completely sealing the positive signal pad 412 and the negative signal pad 422. These second connecting lines 530 are, for example, printed metal layers or printed metal lines, with a thickness of only micrometers and are not three-dimensional covers; however, the present invention is not limited thereto.

[0080] Figure 4A and Figure 4BThese are schematic diagrams of circuit modules 303 and 304 of a wiring board device 12 according to an embodiment of the present invention, respectively, and they are in the same position. Figure 1 Region M. For example... Figure 1 and Figure 4A As shown, the line module 303 in this embodiment and Figure 2 The circuit module 300 is largely the same, except that the surrounding circuit assembly 502 also includes multiple grounding vias 540. These grounding vias 540 are formed on the metal surrounding portion 510 and are connected to the metal surrounding portion 510. Each grounding via 540 extends through this plate 110. Figure 1 Above, and through a conduit (not shown in the diagram), electrically connected to the main connection area 200 located on the lower (or upper) layer. Figure 1 ).

[0081] More specifically, the metal surrounding portion 510 is, for example, an elongated ring 511 containing an inner ring space 514, and these grounding vias 540 are symmetrically located on the metal surrounding portion 510. In other words, a portion of these grounding vias 540 are formed on one long side 512 of the elongated ring 511, and another portion of these grounding vias 540 are formed on the other long side 513 of the elongated ring 511. The outlines of the positive signal pad 412 and the negative signal pad 422 do not contact the grounding vias 540 at all within the inner ring space 514. However, the invention is not limited thereto.

[0082] like Figure 1 and Figure 4B As shown, the line module 304 in this embodiment and Figure 4A The circuit module 303 is largely the same, except that the surrounding circuit group 502 also includes a second connecting line 530. The second connecting line 530 connects to the metal surrounding portion 510 within the metal surrounding portion 510 and is located between the positive signal pad 412 and the negative signal pad 422 and between these grounding via portions 540, so that the positive signal pad 412 and the negative signal pad 422 are physically separated.

[0083] More specifically, the second connecting line 530 is located within the annular space 514 of the metal surrounding portion 510, and is arranged (e.g., in a straight line or in a bent arrangement) on the configuration surface 111 within the annular space 514. The two opposite ends of the second connecting line 530 are respectively connected to the two opposite long sides 512 and 513 of the metal surrounding portion 510, thereby dividing the annular space 514 in two and completely sealing the positive signal pad 412 and the negative signal pad 422. However, the present invention is not limited thereto.

[0084] Figure 5A and Figure 5B These are schematic diagrams of circuit modules 305 and 306 of a wiring board device 13 according to an embodiment of the present invention, respectively, and they are in the same position. Figure 1 Region M. For example... Figure 1 and Figure 5A As shown, the line module 305 in this embodiment and Figure 4A The circuit module 303 is largely the same, except that the surrounding circuit group 503 also includes a plurality of first connecting lines 520. These first connecting lines 520 are located on a configuration surface 111 within the closed opening 610 and are arranged (e.g., in a straight line or with bends) on the configuration surface 111. Each first connecting line 520 physically connects one of the grounding vias 540 to one of the peripheral grounding vias 620. However, the invention is not limited thereto; in other embodiments, the first connecting lines may be physically connected to the metal surrounding portion and the ground layer. More specifically, these first connecting lines 520 are symmetrically located within the closed opening 610; however, the invention is not limited thereto.

[0085] like Figure 1 and Figure 5B As shown, the line module 306 in this embodiment and Figure 5A The circuit module 305 is largely the same, except that the surrounding circuit group 503 also includes a second connecting line 530. The second connecting line 530 connects to the metal surrounding portion 510 within the metal surrounding portion 510 and is located between the positive signal pad 412 and the negative signal pad 422 and between these grounding via portions 540, so that the positive signal pad 412 and the negative signal pad 422 are completely sealed. However, the present invention is not limited thereto.

[0086] Figures 6A to 6B These are schematic diagrams of circuit modules 307 and 308 of a wiring board device 14 according to an embodiment of the present invention, respectively, and they are in the same position. Figure 1 Region M. For example... Figure 1 and Figure 6A As shown, the line module 307 in this embodiment and Figure 2 The circuit module 300 is largely the same, except that, compared to a single metal surround, the circuit group 504 also includes two metal surrounds (hereinafter referred to as the first metal surround 560 and the second metal surround 570). The first metal surround 560 encloses and surrounds the positive signal pad 412, is physically separate from the positive signal pad 412, and is electrically connected to the main connection area 200. Figure 1 The second metal surround 570 encloses and surrounds the negative signal pad 422, is physically separated from the negative signal pad 422, and is electrically connected to the main contact area 200. Figure 1 The first metal surrounding portion 560 and the second metal surrounding portion 570 are separated from each other.

[0087] More specifically, a first metal surround 560 is formed on the configuration surface 111 within the closed opening 610, and continuously surrounds a closed contour. The closed contour is, for example, annular; however, the invention is not limited to its shape. The first metal surround 560 is, for example, a printed metal layer or printed metal line, with a thickness of only micrometers, and is not a three-dimensional cover. The first metal surround 560 continuously surrounds a circular ring, which completely surrounds a circular space 580. The first metal surround 560 is electrically connected to the main contact area 200 located on the lower (or upper) layer through a conduit (not shown), and together surrounds the positive signal pad 412 on the configuration surface 111. In other words, the positive signal pad 412 is located within the circular space 580, and is completely separated from the metal surround 560, with no direct or indirect contact. That is, the contour of the positive signal pad 412 does not contact the circular ring of the metal surround 560 within the circular space 580. The second metal surround 570 is the same as the first metal surround 560 described above. It is also electrically connected to the main contact area 200 located on the lower (or upper) layer through another conduit (not shown in the figure), and together they surround the negative signal pad 422 on the configuration surface 111. Therefore, the details of the second metal surround 570 will not be described again. In this way, the positive signal pad 412 and the negative signal pad 422 are completely sealed.

[0088] like Figure 1 and Figure 6B As shown, the line module 308 in this embodiment and Figure 6A The circuit module 307 is largely the same, except that the surrounding circuit group 504 also includes a third connecting line 590. The third connecting line 590 is located within the closed opening 610, outside the first metal surrounding portion 560 and the second metal surrounding portion 570, between the first metal surrounding portion 560 and the second metal surrounding portion 570, and directly connects the first metal surrounding portion 560 and the second metal surrounding portion 570. The third connecting line 590 may be, for example, a printed metal layer or printed metal circuit, with a thickness only on the micrometer scale, and is not a three-dimensional cover; however, the invention is not limited to this.

[0089] Figures 7A to 7B These are schematic diagrams of circuit modules 309 and 310 of a wiring board device 15 according to an embodiment of the present invention, respectively, and they are in the same position. Figure 1 Region M. For example... Figure 1 and Figure 7A As shown, the line module 309 in this embodiment and Figure 6AThe circuit module 307 is largely the same, except that the surrounding circuit group 505 further includes at least one first grounding via 551 and at least one second grounding via 552. The first grounding via 551 is located on the first metal surrounding portion 560 and is conductive to the first metal surrounding portion 560. The first grounding via 551 also extends through this plate 110 and is electrically connected to the main grounding area 200. Figure 1 The second grounding guide hole 552 is located on the second metal surround 570 and is connected to the second metal surround 570. The second grounding guide hole 552 also penetrates this plate 110. Figure 1 ) and the electrical connection is to the main connection area 200.

[0090] like Figure 1 and Figure 7B As shown, the line module 310 in this embodiment and Figure 7A The circuit module 309 is largely the same, except that the surrounding circuit group 505 further includes a third connecting line 590. The third connecting line 590 is located outside the first metal surrounding portion 560 and the second metal surrounding portion 570, and directly connects the first metal surrounding portion 560 and the second metal surrounding portion 570. However, the invention is not limited to this; other embodiments may allow the first metal surrounding portion 560 and the second metal surrounding portion 570 to be in direct contact with each other. The third connecting line 590 may be, for example, a printed metal layer or printed metal circuit, with a thickness only on the micrometer scale, and is not a three-dimensional cover; however, the invention is not limited to this.

[0091] Figures 8A to 8B These are schematic diagrams of the circuit modules 311 and 312 of the patch panel device 16 according to an embodiment of the present invention, respectively, and they are in the same position. Figure 1 Region M. For example... Figure 1 and Figure 8A As shown, the line module 311 in this embodiment and Figure 7A The circuit module 309 is largely the same, except that the surrounding circuit group 506 further includes a first trace 521 and a second trace 522. The first trace 521 is arranged (e.g., in a straight line or with bends) on the configuration surface 111 within the closed opening 610 and physically connects the first grounding via 551 to one of the peripheral grounding vias 620. The second trace 522 is arranged (e.g., in a straight line or with bends) on the configuration surface 111 within the closed opening 610 and physically connects the second grounding via 552 to one of the peripheral grounding vias 620. However, the invention is not limited to this; in other embodiments, the first trace may be physically connected to the first grounding via and the ground layer, and the second trace may be physically connected to the second grounding via and the ground layer.

[0092] like Figure 1 and Figure 8B As shown, the line module 312 in this embodiment and Figure 8A The circuit module 311 is largely the same, except that the surrounding circuit group 506 further includes a third connecting line 590. The third connecting line 590 is located outside the first metal surrounding portion 560 and the second metal surrounding portion 570, and directly connects the first metal surrounding portion 560 and the second metal surrounding portion 570. The third connecting line 590 is, for example, a printed metal layer or printed metal circuit, with a thickness only on the micrometer scale, and is not a three-dimensional cover; however, the invention is not limited thereto. Other embodiments may also have the first metal surrounding portion 560 and the second metal surrounding portion 570 in direct contact with each other.

[0093] Figure 9 This is a schematic diagram of the circuit module of the patch panel device 17 according to an embodiment of the present invention, with the same position. Figure 1 Region M. For example... Figure 1 and Figure 9 As shown, the line module 313 in this embodiment and Figure 2 The circuit module 300 is largely the same, except that the surrounding circuit group 507 in this embodiment also includes a ground layer 601 and a separating wire 613. The ground layer 601 and the separating wire 613 are configured to respectively enclose the positive signal pad 412 and the negative signal pad 422, instead of using a long ring ( Figure 2 ) or double ring ( Figure 6A ).

[0094] More specifically, the positive signal pad 412 and the negative signal pad 422 are both located within the outline of the closed opening 610. The separating wire 613 is located on the configuration surface 111 within the closed opening 610, between the positive signal pad 412 and the negative signal pad 422, and connects the two opposite inner sides 611 and 612 of the closed opening 610. The separating wire 613 divides the closed opening 610 into two closed regions 614 and 615. These closed regions 614 and 615 respectively accommodate the positive signal pad 412 and the negative signal pad 422, and the separating wire 613 physically separates the positive signal pad 412 and the negative signal pad 422, without directly contacting them. It should be understood that the ground layer 601 and the separating wire 613 are, for example, printed metal layers with a thickness of only micrometers, and are not three-dimensional covers. In addition, this embodiment also has a plurality of grounding holes 541 on the configuration surface 111 within the closed opening 610.

[0095] However, the present invention is not limited thereto. In other embodiments, a trace (not shown) may be configured on the surface 111 inside the closed opening 610 to physically connect the grounding hole portion 541 inside the closed opening 610 with the grounding layer 601.

[0096] Finally, the embodiments disclosed above are not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit and scope of the present invention are protected under this invention. Therefore, the scope of protection of this invention shall be determined by the scope defined in the appended claims.

Claims

1. A wiring board device, characterized in that, Include: A single-layer structure, consisting of multiple plates stacked on top of each other; A primary junction area, configured within the stacked structure; and A line module, comprising: A differential signal circuit is located within the stacked structure and includes a positive signal section and a negative signal section. The positive signal section has a positive signal pad located on a configuration surface of one of the plurality of plates. The negative signal section has a negative signal pad located on the configuration surface and is separate from the positive signal pad. A surround circuit group is located on the surface of the configuration, electrically connected to the main terminal area, enclosing the positive signal pad and the negative signal pad, and is separated from the differential signal circuit entity; A grounding layer covers the surface of the configuration of one of the plates and surrounds the surrounding circuitry, the positive signal pad, and the negative signal pad. The grounding layer has a closed opening that exposes the surface of the configuration. At least one peripheral grounding via is disposed through the grounding layer and the plurality of plates, and is electrically connected to the grounding layer and the main grounding area. The surrounding circuit group, the positive signal pad, and the negative signal pad are located within the closed opening and are separated from the grounding layer entity.

2. The wiring board device according to claim 1, characterized in that, The surround circuit assembly includes a metal surround portion that continuously surrounds a closed profile on the configuration surface. The metal surround portion is electrically connected to the main contact area and together surrounds the positive signal pad and the negative signal pad.

3. The wiring board device according to claim 2, characterized in that, The surround circuit assembly also includes a connecting wire located within the metal surround portion, between the positive signal pad and the negative signal pad, and physically separate from the positive signal pad and the negative signal pad.

4. The wiring board device according to claim 2 or 3, characterized in that, The surround circuit assembly also includes at least one grounding via, which is located on the metal surround and the plurality of plates and is electrically connected to the main grounding area.

5. The wiring board device according to claim 1, characterized in that, The loop circuit also includes: A first metal surround portion encloses and surrounds the positive signal pad, is physically separated from the positive signal pad, and is electrically connected to the main contact area; and A second metal surround encloses and surrounds the negative signal pad, is separate from the physical negative signal pad, and is electrically connected to the main contact area. The first metal surrounding portion and the second metal surrounding portion are connected to or separated from each other.

6. The wiring board device according to claim 5, characterized in that, The surround circuit assembly also includes a connecting wire located outside the first metal surround and the second metal surround, and directly connecting the first metal surround and the second metal surround.

7. The wiring board device according to claim 5 or 6, characterized in that, The loop circuit also includes: At least one first grounding via is located on the first metal surround and the plurality of plates, and electrically connects the first metal surround to the main grounding area; and At least one second grounding hole is located on the second metal surrounding portion and the plurality of plates, and is electrically connected to the second metal surrounding portion and the main grounding area.

8. The wiring board device according to claim 1, characterized in that, The surround circuit assembly also includes a connecting wire, one end of which is connected to the surround circuit assembly, and the other end of which is connected to either the peripheral grounding via or the grounding layer.

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