Electronic device

Abstract

An electronic device includes a substrate, a first light emitting unit, a first color filter, a first wavelength conversion layer, and a second color filter. The first light emitting unit is disposed on the substrate and configured to generate first light. The first color filter is disposed on the first light emitting unit, the first wavelength conversion layer is disposed on the first color filter, and the second color filter is disposed on the first wavelength conversion layer. The first light passes through the first color filter, the first wavelength conversion layer converts the first light into second light, and the second light passes through the second color filter.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device that reduces the reflection of ambient light. Background Technology

[0002] As electronic devices become increasingly convenient, they have become indispensable tools in people's lives. When used outdoors, ambient light reduces the clarity of the displayed images, making it difficult for users to see them clearly. Although some existing electronic devices incorporate anti-reflective films or structures, these designs still suffer from poor light emission efficiency and inadequate anti-reflective effects, which remain to be addressed. Summary of the Invention

[0003] According to some embodiments, the present invention discloses an electronic device including a substrate, a first light-emitting unit, a first color filter, a first wavelength conversion layer, and a second color filter. The first light-emitting unit is disposed on the substrate and is used to generate first light. The first color filter is disposed on the first light-emitting unit, the first wavelength conversion layer is disposed on the first color filter, and the second color filter is disposed on the first wavelength conversion layer. The first light passes through the first color filter, the first wavelength conversion layer converts the first light into second light, and the second light passes through the second color filter. Attached Figure Description

[0004] Figure 1 The diagram shown is a cross-sectional view of an electronic device according to a first embodiment of the present invention.

[0005] Figure 2 The diagram shown is a cross-sectional view of an electronic device according to a second embodiment of the present invention.

[0006] Figure 3 The diagram shown is a cross-sectional view of an electronic device according to a third embodiment of the present invention.

[0007] Figure 4 The diagram shown is a partial top view of the electronic device according to the fourth embodiment of the present invention.

[0008] Figure 5 The diagram shown is a partial top view of the electronic device according to the fifth embodiment of the present invention.

[0009] Figure 6 The diagram shown is a partial cross-sectional view of an electronic device according to a sixth embodiment of the present invention.

[0010] Figure 7 The diagram shown is a cross-sectional view of an electronic device according to the seventh embodiment of the present invention.

[0011] Figure 8The diagram shown is a cross-sectional view of an electronic device according to a variation of the seventh embodiment of the present invention.

[0012] Figure 9 The diagram shown is a cross-sectional view of an electronic device according to the eighth embodiment of the present invention.

[0013] Figure 10 The diagram shown is a cross-sectional view of an electronic device according to the ninth embodiment of the present invention.

[0014] Figure 11 The diagram shown is a cross-sectional view of an electronic device according to the tenth embodiment of the present invention.

[0015] Explanation of reference numerals in the attached figures: 1, 2, 3, 4, 5, 7a, 7b, 8, 9, 10 - Electronic devices; 102, 118 - Substrate; 104, 104a, 104b, 104c - Light-emitting units; 106, 110 - Color filters; 108, 108a, 108b, 108c - Wavelength conversion layers; 112, 114, 136, 138, 170 - Light-shielding layers; 120, 116, 128, 130, 132, 134, 146, 180 - Insulating layers; 122 - Circuit layer; 124 - Main... 124a-Driving element; 124b-Switching element; 125-Capacitor; 126-Semiconductor layer; 138a-Block; 140-Conductive layer; 142-Insulating block; 144, 174-Encapsulation layer; 148-Buffer layer; 150-Light shielding strip; 150a, 150b-Color filter block; 152-Organic light-emitting layer; 154-Electrode layer; 156-Protective layer; 156a-Inorganic material layer; 156b-Organic material layer; 158-Auxiliary electrode; 160-First semiconductor layer; 162-Light emitting layer; Light layer; 164-Second semiconductor layer; 166-First pad; 168-Second pad; 172, 178-Functional layers; 176-Planarization layer; 182-Adhesive layer; 184-Cap layer; 1S-Emitting surface; CH-Channel; E1, E2, E3, E4, E6, E13, E14-Electrodes; E11-Dummy electrode; E5, E7, E8-Connecting electrode; E9, E10-Tracking; G-Gate; HD1, HD2-Horizontal direction; L1, L2, L3, L4, L5, L6, L7, L8-Light Lines; M1, M2, M3, M4 - Metal layers; OP1, OP2, OP3, OP4, OP5, OP6, OP7, OP8, OP9 - Openings; P1 - Upper part; P2, P5 - Lower part; P3 - Upper left part; P4 - Upper right part; P6 - Left side part; P7 - Right side part; SD1 - Source (drain) area; SD2 - Drain (source) area; T1, T2 - Thickness; TD - Top view direction; W1, W2, W3, W4, W5, W6, W7, W8, W9, W10 - Width. Detailed Implementation

[0016] The present invention will be described in detail below with reference to specific embodiments and accompanying drawings. To make the invention clearer and easier to understand, the accompanying drawings are simplified schematic diagrams, and the elements therein may not be drawn to scale. Furthermore, the number and dimensions of the elements in the drawings are merely illustrative and are not intended to limit the scope of the invention.

[0017] Throughout this specification and claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same elements, and this document is not intended to distinguish between elements that have the same function but different names. In the following specification and claims, words such as "containing" and "comprising" are open-ended terms and should therefore be interpreted as "containing but not limited to...".

[0018] The use of ordinal numbers, such as "first," "second," etc., in the specification and claims to modify elements of a claim does not in itself imply or represent any prior ordinal number of the claimed element, nor does it represent the order of one claimed element with another, or the order of manufacturing processes. The use of these ordinal numbers is solely to clearly distinguish one claimed element with a given name from another claimed element with the same name. Therefore, a first element mentioned in the specification may be referred to as a second element in the claims.

[0019] The directional terms used in the following embodiments, such as up, down, left, right, front, or back, are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the invention. It should be understood that elements specifically described or illustrated may exist in various forms well known to those skilled in the art. In this document, when an element is referred to as "overlapping" with another element, it should be understood that the element partially or completely overlaps the other element.

[0020] Furthermore, when an element or membrane is referred to as being on or above another element or membrane, it should be understood that the element or membrane is directly located on the other element or membrane, or that there may be other elements or membranes (not directly) between them. Conversely, when an element or membrane is referred to as being "directly" on another element or membrane, it should be understood that there are no inserted elements or membranes between them.

[0021] When the text refers to a component as "electrically connected" or "coupled" to another component, it may include situations where "there may be other components between the component and the other component that electrically connect them," or situations where "there are no other components between the component and the other component that directly electrically connect them." If the text refers to a component as "directly electrically connected" or "directly coupled" to another component, it refers to situations where "there are no other components between the component and the other component that directly electrically connect them."

[0022] In this text, the terms "approximately," "substantially," "roughly," and "same" typically indicate a range within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value. The given quantity is an approximate quantity, meaning that even without specific mention of "approximately," "substantially," or "roughly," the meaning of "approximately," "substantially," "roughly," or "same" can still be implied.

[0023] It should be understood that the features described below can be replaced, recombined, or mixed in several different embodiments to complete other embodiments without departing from the spirit of the invention. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0024] In this invention, the length, width, thickness, height, or area, or the distance or spacing between elements, can be measured using an optical microscopy (OM), a scanning electron microscope (SEM), an alpha-step thickness gauge, an ellipsometry, or other suitable methods. Specifically, according to some embodiments, a scanning electron microscope can be used to obtain a cross-sectional image of the element to be measured, and the width, thickness, height, or area of ​​each element, or the distance or spacing between elements, can be measured, but this is not a limitation. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error.

[0025] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It is understood that these terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this invention.

[0026] In this invention, the electronic device may have a display function and may selectively include light sensing, image sensing, touch control, antenna, other suitable functions, or combinations thereof, but is not limited thereto. The electronic device may be bendable, flexible, or stretchable. In some embodiments, the electronic device may include a splicing device, but is not limited thereto. The electronic device may include liquid crystal molecules (LC molecule), light-emitting diodes (LEDs), or quantum dot (QD) materials, fluorescent materials, phosphorescent materials, other suitable materials, or combinations of any two of the above, but is not limited thereto. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), micro-LEDs, sub-millimeter light-emitting diodes (mini-LEDs), or quantum dot light-emitting diodes (QLEDs or QDLEDs), but are not limited thereto. Furthermore, the electronic device may be, for example, a color display device, a monochrome display device, or a grayscale display device. The shape of an electronic device can be, for example, rectangular, circular, polygonal, with curved edges, curved, or other suitable shapes. Electronic devices may optionally include peripheral systems such as drive systems, control systems, light source systems, and shelving systems. The following description uses a display device as an example, but is not limited to this.

[0027] Please refer to Figure 1 , Figure 1 The diagram shown is a cross-sectional view of an electronic device according to a first embodiment of the present invention. To clearly illustrate the main features of the present invention, some cross-sectional views of the electronic device are shown in the accompanying drawings, but this is not intended to limit the scope of the invention. Figure 1 As shown, the electronic device 1 may include a substrate 102, at least one light-emitting unit 104, a color filter 106, at least one wavelength conversion layer 108, and at least one color filter 110. The substrate 102 may, for example, be a flexible substrate or a non-flexible substrate. The material of the substrate 102 may include, for example, glass, ceramic, quartz, sapphire, acrylic, polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), other suitable materials, or combinations thereof, but is not limited thereto. The number of light-emitting units 104, wavelength conversion layers 108, and color filters 110 mentioned below is exemplified by multiple examples, but is not limited thereto.

[0028] The light-emitting unit 104 may be disposed on the substrate 102 and used to generate a first light ray (e.g., light ray L1, light ray L3, or light ray L5). The light-emitting unit 104 may, for example, include an inorganic light-emitting diode, an organic light-emitting diode, a sub-millimeter light-emitting diode, a micro light-emitting diode, a quantum dot light-emitting diode, a nanowire light-emitting diode, a bar-type light-emitting diode, a nanorod light-emitting diode, or other suitable light-emitting elements. Figure 1 In some embodiments, the light-emitting unit 104 may include a rod-shaped light-emitting diode, and the rod-shaped light-emitting diode may include a P-type semiconductor layer, a light-emitting layer, and an N-type semiconductor layer, arranged along a horizontal direction HD1 perpendicular to the top view direction TD, but is not limited thereto. The top view direction TD of the electronic device 1 may, for example, be a direction perpendicular to the upper surface of the substrate 102, but is not limited thereto. Furthermore, in Figure 1 In some embodiments, the light-emitting unit 104 may include, for example, a light-emitting diode or a light-emitting element, but is not limited thereto. In some embodiments, the light-emitting unit 104 may also include multiple light-emitting diodes or light-emitting elements. In some embodiments, the light-emitting unit 104 may also include fluorescent materials, phosphorescent materials, quantum dot particles or other suitable materials or combinations thereof, but is not limited thereto.

[0029] exist Figure 1 In some embodiments, the light-emitting unit 104 may include light-emitting units 104a, 104b, and 104c as examples, but is not limited thereto. Light-emitting units 104a, 104b, and 104c can respectively generate light rays L1, L3, and L5. For example, light-emitting units 104a, 104b, and 104c may be identical to each other, and light rays L1, L3, and L5 may have the same color, such as blue light, light rays with wavelengths shorter than blue light, white light, or other suitable colors, but are not limited thereto. In some embodiments, at least two of light-emitting units 104a, 104b, and 104c may be identical, and at least two of light rays L1, L3, and L5 may have the same color. In some embodiments, light-emitting units 104a, 104b, and 104c may be different from each other, and light rays L1, L3, and L5 may have different colors, but are not limited thereto.

[0030] A color filter 106 may be disposed on the light-emitting unit 104 to allow light of a specific wavelength to pass through, such as light rays L1, L3, and L5. The color of the color filter 106 may be the same as or close to the color of light rays L1, L3, and L5, to allow light rays L1, L3, and L5 to pass through, and to block (e.g., absorb or reflect) at least a portion of light rays of a different color than light rays L1, L3, and L5. The color filter 106 may be, for example, a blue filter, a filter that allows light with wavelengths less than blue to pass through, or other suitable filters.

[0031] A wavelength conversion layer 108 may be disposed on a color filter 106 and can convert a first light ray into a second light ray (e.g., light ray L2, light ray L4, or light ray L6). In other words, the wavelength conversion layer 108 can generate a second light ray by absorbing the first light ray. In some embodiments, the wavelength corresponding to the maximum peak intensity of the first light ray may be smaller than the wavelength corresponding to the maximum peak intensity of the second light ray; for example, the wavelength corresponding to the maximum peak intensity of the first light ray is approximately 450 nanometers (nm), and the wavelength corresponding to the maximum peak intensity of the second light ray is approximately 630 nm. Figure 1 In the embodiments described, the wavelength conversion layer 108 may include wavelength conversion layer 108a, wavelength conversion layer 108b, and wavelength conversion layer 108c as examples, but is not limited thereto. Wavelength conversion layer 108a may be disposed on the light-emitting unit 104a, and a color filter 106 may be disposed between the wavelength conversion layer 108a and the light-emitting unit 104a, such that the wavelength conversion layer 108a can convert light L1 passing through the color filter 106 into light L2. Wavelength conversion layer 108b may be disposed on the light-emitting unit 104b, and a color filter 106 may be disposed between the wavelength conversion layer 108b and the light-emitting unit 104b, such that the wavelength conversion layer 108b can convert light L3 passing through the color filter 106 into light L4. A wavelength conversion layer 108c can be disposed on the light-emitting unit 104c, and a color filter 106 is disposed between the wavelength conversion layer 108c and the light-emitting unit 104c, so that the wavelength conversion layer 108c can convert light L5 passing through the color filter 106 into light L6. In some embodiments, the wavelengths corresponding to the maximum peak light intensity of light rays L1, L3, and L5 can be smaller than the wavelengths corresponding to the maximum peak light intensity of light rays L2, L4, and L6, respectively. Figure 1In some embodiments, light rays L2, L4, and L6 may have different colors, for example, they may be mixed to produce white light. Light rays L2, L4, and L6 may be, for example, red, green, and blue light, respectively, but are not limited thereto. In some embodiments, wavelength conversion layers 108a, 108b, and 108c may include, for example, fluorescent materials, phosphorescent materials, quantum dot particles, or other light conversion materials capable of converting the color of light.

[0032] A color filter 110 may be disposed on the wavelength conversion layer 108, and a second ray (e.g., ray L2, ray L4, or ray L6) may pass through the color filter 110 and then be emitted from the light-emitting surface 1S of the electronic device 1. Figure 1In the embodiments described, the color filter 110 is illustrated by including color filter 110a, color filter 110b, and color filter 110c, but is not limited thereto. Color filter 110a may be disposed on the wavelength conversion layer 108a, and the color of color filter 110a may be, for example, the same as or close to the color of light L2, to allow light L2 to pass through, and to block (absorb or reflect) at least a portion of light of a different color than light L2. Color filter 110b may be disposed on the wavelength conversion layer 108b, and the color of color filter 110b may be, for example, the same as or close to the color of light L4, to allow light L4 to pass through, and to block (absorb or reflect) at least a portion of light of a different color than light L4. A color filter 110c can be disposed on the wavelength conversion layer 108c, and the color of the color filter 110c can be, for example, the same as or close to the color of light L6, to allow light L6 to pass through, and to block (absorb or reflect) at least a portion of light of a different color than light L6. After passing through color filters 110a, 110b, and 110c, light rays L2, L4, and L6 can be emitted from the light-emitting surface 1S of the electronic device 1, respectively, as light rays generated by different sub-pixels of the same pixel of the electronic device 1 (or light rays generated by different pixels). Through color filters 110a, 110b, and 110c, the colors of light rays L2, L4, and L6 emitted from the light-emitting surface 1S can be purified to meet the usage requirements. For example, color filters 110a, 110b, and 110c can be red, green, and blue filters, respectively, but are not limited to this. In some embodiments, the colors of color filters 110a, 110b, and 110c can be adjusted according to the colors of light rays L2, L4, and L6, respectively, but are not limited to this. In some embodiments, color filter 110c can have the same color as color filter 106, for example, but is not limited to this. In some embodiments, when light rays L5 and L6 have the same color, electronic device 1 may not include wavelength conversion layer 108c and color filter 110c, or electronic device 1 may include color filter 110c but not wavelength conversion layer 108c, but is not limited to this.

[0033] It should be noted that in this article, "light passing through" a color filter can refer to the light passing through it. The transmittance of a color filter can range from 60% to 99%, or from 70% to 95%, but is not limited to these ranges. For example, to meet the requirement of high color saturation, color filter 110a can have a transmittance of 92% for light L2 with a wavelength of approximately 630nm, color filter 110b can have a transmittance of 77% for light L4 with a wavelength of approximately 540nm, and color filter 110c can have a transmittance of 72% for light L6 with a wavelength of approximately 450nm. Alternatively, to meet the requirement of high transmittance, color filter 110a may have 97% transmittance for light L2 with a wavelength of approximately 630 nm, color filter 110b may have 87% transmittance for light L4 with a wavelength of approximately 540 nm, and color filter 110c may have 77% transmittance for light L6 with a wavelength of approximately 450 nm, but is not limited to these. Furthermore, in this invention, color filters 106 and 110 cannot convert incoming light into different colors (or generate different colors by absorbing incoming light), meaning their function differs from that of the wavelength conversion layer 108. For example, the materials of color filters 106 and / or color filters 110 may include photoresist materials, ink materials, pigments, dyes, distributed Bragg reflectors (DBR), other suitable filter materials, or combinations of any two of the above. In some embodiments, the color filter 110 may be formed, for example, by a coating and patterning process, an inkjet process, a drop-in process, or other suitable process, depending on the material. In this invention, the materials of the color filter 106 and / or the color filter 110 may absorb light of a different color, but are not limited thereto.

[0034] It is worth mentioning that, since the color of color filter 110a (or color filter 110b) can be different from the color of color filter 106, color filter 110a (or color filter 110b) and color filter 106 can absorb different colors of light respectively, thus having complementary light absorption characteristics, which can reduce the interference of ambient light on the displayed image of electronic device 1. Figure 1As shown, when ambient light (e.g., light L7) enters the electronic device 1 from the light-emitting surface 1S, it is first absorbed by the color filter 110a (or color filter 110b) and becomes light L8 with the same color as the color filter 110a (or color filter 110b). This light then travels to the wavelength conversion layer 108, and most of the light L8 passes through the wavelength conversion layer 108 and travels to the color filter 106. Since the color of the color filter 106 is different from the color of the color filter 110a (or color filter 110b), most of the light L8 that passes through the wavelength conversion layer 108 is absorbed by the color filter 106. This significantly reduces the intensity of the light L8 reflected from the circuit layer (as described below) and emitted towards the light-emitting surface 1S, thereby reducing interference from ambient light on the electronic device 1 and improving image clarity. Furthermore, since the wavelength conversion layer 108 can be disposed between the color filter 106 and the color filter 110, the first light that can pass through the color filter 106 is converted into a second light that can pass through the color filter 110, so that the light-emitting surface 1S of the electronic device 1 can emit second light of different colors.

[0035] In some embodiments, the thickness T1 of the color filter 106 may be less than the thickness T2 of at least one of the color filters 110a, 110b, and 110c, which can increase the intensity of light rays L1, L3, and L5 passing through the color filter 106, and can increase the light rays L2, L4, and L6 emitted from the light-emitting surface 1S of the electronic device 1 while reducing the reflection of ambient light (e.g., light ray L7). For example, the thickness T1 of the color filter 106 may be as small as about one-third of the thickness T2 of at least one of the color filters 110a, 110b, and 110c (thickness T2 < thickness T1 ≤ 1 / 3 × thickness T2). The thickness T1 of the color filter 106 can also be as small as approximately half the thickness T2 of at least one of the color filters 110a, 110b, and 110c (thickness T2 < thickness T1 ≤ 1 / 2 × thickness T2). In some embodiments, the thickness T1 of the color filter 106 can be, for example, 0.2 micrometers to 1.5 micrometers, and the thickness T2 of at least one of the color filters 110a, 110b, and 110c can be, for example, 1 micrometer to 3 micrometers, but is not limited thereto. In this invention, the thickness of the color filters 110a, 110b, and 110c can be, for example, the maximum thickness in the top view direction TD. In some embodiments, the thickness T2 of any two of the color filters 110a, 110b, and 110c may be the same or different from each other, so as to adjust the intensity of light L2, light L4, and light L6 to meet the requirements of displaying the image.

[0036] like Figure 1 As shown, the electronic device 1 may further include a light-shielding layer 112 disposed on the color filter 106, and the light-shielding layer 112 may have openings OP1, OP2, and OP3, wherein color filter 110a may be disposed in opening OP1, color filter 110b may be disposed in opening OP2, and color filter 110c may be disposed in opening OP3. In other words, the light-shielding layer 112 may be disposed between any two adjacent color filters 110, which can reduce or prevent light mixing, such as light L2 passing through color filter 110a, light L4 passing through color filter 110b, and light L6 passing through color filter 110c.

[0037] In the top-view direction TD of the electronic device 1, the area of ​​opening OP1 may be the same as or different from the area of ​​opening OP2. Therefore, in the top-view direction TD, the area of ​​color filter 110a may be the same as or different from the area of ​​color filter 110b. In some embodiments, the intensity of light L2 passing through color filter 110a and the intensity of light L4 passing through color filter 110b can be adjusted by changing the areas of opening OP1 and opening OP2, but are not limited thereto. In some embodiments, the area of ​​opening OP3 may be the same as or different from the area of ​​opening OP1 and / or the area of ​​opening OP2. In this invention, "the area of ​​the opening" may refer to the area of ​​the region surrounded by the inner edge of the opening when viewed from the top-view direction TD.

[0038] like Figure 1 As shown, in some embodiments, the electronic device 1 may further include a substrate 118 and an insulating layer 120, wherein a light-shielding layer 112, color filters 110a, 110b, and 110c may be disposed between the substrate 118 and the insulating layer 120, and the insulating layer 120 may be disposed between the light-shielding layer 112 and the light-shielding layer 114. The substrate 118 may, for example, include a flexible substrate or a non-flexible substrate. The material of the substrate 118 may include, for example, glass, ceramic, quartz, sapphire, acrylic, polyimide, polyethylene terephthalate, polycarbonate, other suitable materials, or combinations thereof, but is not limited thereto. Figure 1In some embodiments, the light-shielding layer 112 and the color filter 110 may be formed on the substrate 118, for example, and then an insulating layer 120 may be formed on the light-shielding layer 112 and the color filter 110. In this case, the insulating layer 120 may serve as an encapsulation layer to protect the light-shielding layer 112 and the color filter 110. The material of the insulating layer 120 may include, for example, resin, perfluoroalkoxyalkane (PFA), epoxy resin, polyimide, or other suitable insulating materials, but is not limited thereto. In some embodiments, when the electronic device 1 does not include, for example, the color filter 110c, the insulating layer 120 may be disposed in the opening OP3. The manner in which the light-shielding layer 112 and the color filter 110 are formed is not limited thereto. In some embodiments, the light-shielding layer 112 and the color filter 110 may also be formed on the wavelength conversion layer 108, but is not limited thereto. In some embodiments, the electronic device 1 may also selectively omit the insulating layer 120.

[0039] like Figure 1 As shown, the electronic device 1 may include a light-shielding layer 114 disposed between the light-shielding layer 112 and the color filter 106. The light-shielding layer 114 may have openings OP4, OP5, and OP6, which overlap with openings OP1, OP2, and OP3 respectively in the top view direction TD, wherein wavelength conversion layers 108a, 108b, and 108c may be disposed in openings OP4, OP5, and OP6 respectively. In some embodiments, the electronic device 1 may optionally include an insulating layer 116 disposed on the light-shielding layer 114 and the wavelength conversion layer 108. In this case, the insulating layer 116 may be, for example, an encapsulation layer, used to protect the light-shielding layer 114 and the wavelength conversion layer 108, but is not limited thereto. In some embodiments, the electronic device 1 may optionally include an adhesive layer (not shown) disposed between the insulating layer 120 and the insulating layer 116 for bonding the insulating layer 120 and the insulating layer 116, but is not limited thereto. In some embodiments, when the light-shielding layer 112 and the color filter 110 are formed on the wavelength conversion layer 108, the electronic device 1 may selectively exclude the insulating layer 120 or the insulating layer 116. In some embodiments, the insulating layer 120 or the insulating layer 116 may have a flat upper surface, which may facilitate the formation of the light-shielding layer 112 and the color filter 110. In some embodiments, when the electronic device 1 does not include the wavelength conversion layer 108c, the insulating layer 116 may be disposed in the opening OP6. In some embodiments, the insulating layer 120 or the insulating layer 116 may include a functional layer (e.g., Figure 11 The functional layer 172 shown can help improve the color purity of light rays L2, L4, and L6, and / or improve the light utilization of light rays L1, L3, and L5. A detailed description of functional layer 172 can be found in [reference needed]. Figure 11 Examples of implementations.

[0040] In some embodiments, when viewed from the top direction TD, the width of the opening OP1 in the horizontal direction HD1 (e.g., as shown in the figure) Figure 2 The width W1 shown may, for example, be greater than the width of the opening OP4 in the horizontal direction HD1 (e.g., as shown). Figure 2 The width W4 shown), the width of the opening OP2 in the horizontal direction HD1 (e.g., as shown) Figure 2 The width W2 shown may, for example, be greater than the width of the opening OP5 in the horizontal direction HD1 (e.g., as shown). Figure 2 The width W5 shown, and / or the width of the opening OP1 in the horizontal direction HD1 (e.g., as shown). Figure 2 The width W3 shown may, for example, be greater than the width of the opening OP6 (e.g., as shown in the figure). Figure 2 The width W6 shown can increase the light emission brightness of the electronic device 1, and / or increase the amount of ambient light (e.g., light L7) absorbed by the light-shielding layer 114, and can also reduce ambient light, such as reflected light from the circuit layer, but the present invention is not limited thereto. In the present invention, the “width” of the opening in one direction can be the minimum width of the opening in that direction.

[0041] like Figure 1 As shown, the electronic device 1 may further include a circuit layer 122 disposed between the light-emitting unit 104 and the substrate 102. The circuit layer 122 can be used to control the switching of the light-emitting units 104a, 104b, and / or 104c, as well as the brightness of light rays L1, L3, and L5, enabling the electronic device 1 to display images. The circuit layer 122 may include multiple active elements 124 for driving the corresponding light-emitting units 104. Figure 1 In some embodiments, circuit layer 122 may include pixel circuits of the type 2T1C (i.e., including two thin-film transistors and a capacitor), but is not limited thereto. In some embodiments, active element 124 may include driving element 124a and switching element 124b. Driving element 124a may be electrically connected between one end of the corresponding light-emitting unit 104 and the driving power supply, so that driving current can be provided to the light-emitting unit through driving element 124a, and switching element 124b may be electrically connected to the corresponding driving element 124a to control the switching of driving element 124a. Figure 1 In this embodiment, a driving element 124a and a switching element 124b may correspond to one light-emitting unit 104, but are not limited thereto. In some embodiments, the electronic device 1 may also include a capacitor 125, and one end of the capacitor 125 is electrically connected to the other end of the corresponding light-emitting unit 104.

[0042] In some embodiments, the structure of circuit layer 122 is not limited to, for example Figure 1As shown, the circuit layer 122 may also include multiple signal lines, such as data lines, scan lines, and power lines. In some embodiments, the circuit layer 122 may also include lines for controlling the electronic device 1, such as scan drive circuitry and data drive circuitry, but is not limited thereto. In some embodiments, the circuit layer 122 may include a 7T2C type pixel circuit (i.e., including seven thin-film transistors and two capacitors), a 7T3C type pixel circuit (i.e., seven thin-film transistors and three capacitors), a 3T1C type pixel circuit (i.e., three thin-film transistors and one capacitor), a 3T2C type pixel circuit (i.e., three thin-film transistors and two capacitors), or other suitable types of pixel circuit architectures.

[0043] like Figure 1 As shown, the active element 124 may be, for example, a thin-film transistor, but is not limited thereto. Figure 1The active element 124 shown is exemplified by a top-gate thin-film transistor. Circuit layer 122 may include a semiconductor layer 126, an insulating layer 128, a metal layer M1, an insulating layer 130, a metal layer M2, an insulating layer 132, a metal layer M3, an insulating layer 134, and a metal layer M4. Semiconductor layer 126 may be disposed on substrate 102 and includes the channel CH of active element 124, source (drain) regions SD1 and SD2, and one electrode E1 of capacitor 125. Source (drain) regions SD1 and SD2 may be disposed on both sides of channel CH and may include, for example, P-type doped or N-type doped semiconductors, but are not limited thereto. Insulating layer 128 may be disposed on semiconductor layer 126 and serve as the gate insulating layer of active element 124. Metal layer M1 is disposed on insulating layer 128 and may, for example, form the gate G of active element 124, a scan line, and the other electrode E2 of capacitor 125. Channel CH may, for example, overlap with the corresponding gate G in the top view direction TD. Insulating layer 130 may be disposed on insulating layer 128 and metal layer M1, and metal layer M2 may be disposed on insulating layer 130, and may include electrode E3, electrode E4, data line, and connecting electrode E5. Insulating layer 130 may have through holes, allowing electrode E3 and electrode E4 to be electrically connected to source (drain) region SD1 and drain (source) region SD2 respectively through corresponding through holes, and connecting electrode E5 to electrode E2 of capacitor 125 through corresponding through holes. Insulating layer 132 may be disposed on metal layer M2 and insulating layer 130, and metal layer M3 may be disposed on insulating layer 132, and includes electrode E6. Insulating layers 132 and 130 may have through holes, allowing electrode E6 to be electrically connected to electrode E2 of capacitor 125 through corresponding through holes. An insulating layer 134 may be disposed on the metal layer M3 and the insulating layer 132, and the metal layer M4 may be disposed on the insulating layer 134, including a connecting electrode E7 and a connecting electrode E8. The insulating layers 134 and 132 may have through holes, allowing the connecting electrode E7 to be electrically connected to electrode E5 through corresponding through holes, and the connecting electrode E8 to be electrically connected to electrode E4 of the driving element 124a through corresponding through holes. Figure 1 In some embodiments, the light-emitting unit 104 may be disposed on the upper surface of the insulating layer 134, but is not limited thereto. The insulating layer 134 may, for example, have a flat upper surface, which may improve the formation quality of the elements disposed on the insulating layer 134 (e.g., the light-emitting unit 104, the light-shielding layer 136, and / or the light-shielding layer 138). In some embodiments, at least one of the insulating layers 130, 132, and 134 may include a single-layer structure or a multi-layer structure. The insulating layers 130, 132, and 134 may, for example, include organic insulating materials and / or inorganic insulating materials.

[0044] In some embodiments, the transistor structure of the active element 124 is not limited to this, and may be, for example, a bottom-gate type transistor, or may be changed to a dual-gate transistor or other suitable transistor as needed. Alternatively, the semiconductor layer 126 may also include, for example, amorphous silicon, low-temperature polysilicon (LTPS), low-temperature polycrystalline oxide (LTPO), or metal-oxide semiconductor, and is not limited thereto. The number of insulating layers in the electronic device 1 may vary depending on the type of thin-film transistor. In some embodiments, different active elements 124 may contain channels CH of different materials, but are not limited thereto.

[0045] exist Figure 1 In this embodiment, the electronic device 1 may further include a light-shielding layer 136, a light-shielding layer 138, and a conductive layer 140, wherein the light-shielding layers 136 and 138 may be disposed between the circuit layer 122 and the color filter 106. The light-shielding layer 136 may have multiple openings OP7, and the light-shielding layer 138 may include multiple blocks 138a, each disposed in a corresponding opening OP7. Each block 138a may have an opening OP8, and each light-emitting unit 104 may be disposed in a corresponding opening OP8, and each block 138a of the light-shielding layer 138 and the light-emitting unit 104 may be disposed in a corresponding opening OP8. The sidewall of the block 138a may, for example, have the effect of concentrating the first light emitted by the light-emitting unit 104, so as to emit it toward the light-emitting surface 1S of the electronic device 1. Figure 1 In the embodiment, viewed from the top direction TD, the width of the opening OP8 in the horizontal direction HD1 (e.g., as shown in the figure) Figure 2 The width W7 shown may be, for example, smaller than the width of opening OP4, opening OP5, or opening OP6 in the horizontal direction HD1 (e.g., as shown). Figure 2 The widths W4, W5, or W6 shown are used to improve the light utilization rate of the first light ray, but are not limited thereto. In some embodiments, the height of the upper surface of the light-shielding layer 136 may, for example, be greater than the height of the upper surface of the block 138a, such as... Figure 2 The thickness T4 of the light-shielding layer 136 shown may be greater than the thickness T3 of the block 138a, but is not limited thereto. The comparison of “height” in this document may be relative to the same horizontal plane parallel to the horizontal direction HD1, such as relative to the upper surface of the insulating layer 134, but is not limited thereto.

[0046] The light-shielding layer 136 can serve, for example, as a pixel definition layer, such that, in the top-view direction TD, the area of ​​the opening OP7 can be used to define a pixel or subpixel of the electronic device 1, but is not limited thereto. Figure 1 In this embodiment, the color filter 106 may overlap with three openings OP7 (i.e., three pixels or three sub-pixels) in the top-view direction TD, but is not limited thereto. In some embodiments, when viewed from the top-view direction TD, the color filter 106 may overlap with the openings OP7 of the corresponding light-emitting units 104a and 104b.

[0047] The light-shielding layer 136 and / or the light-shielding layer 138 may include, for example, a light-shielding material, the same material as the color filter 106, or other suitable materials. In some embodiments, the light-shielding layer 136 and the light-shielding layer 138 may be formed by patterning the same layer of light-shielding material using a gray-tone mask or a half-tone mask, or by forming them using different processes, but are not limited thereto. In some embodiments, the area of ​​the opening OP8 may be slightly larger than the size of the light-emitting unit 104 when viewed from the top direction TD. In some embodiments, a reflective layer may be provided on the block 138a to improve the light utilization rate of the light-emitting unit 104. In some embodiments, when the light-emitting unit 104 is fluidly disposed in the opening OP8, the block 138a may confine the corresponding light-emitting unit 104 in the opening OP8, thereby achieving the purpose of disposing the light-emitting unit 104, but the method of disposing the light-emitting unit 104 in this invention is not limited thereto. In some embodiments, when the light-emitting unit 104 is disposed in a different manner, the electronic device 1 may not include the light-shielding layer 136, but is not limited thereto.

[0048] like Figure 1 As shown, the conductive layer 140 can be disposed on the circuit layer 122 and includes multiple traces E9 and multiple traces E10, wherein traces E9 and E10 are separated from each other and electrically insulated. Trace E9 can electrically connect one end of the light-emitting unit 104 to the connecting electrode E7, so that the light-emitting unit 104 can be electrically connected to the electrode E2 of the capacitor 125, and trace E10 can electrically connect the other end of the light-emitting unit 104 to the connecting electrode E8, and thus to the drain (source) region SD2 of the driving element 124a. Figure 1 In one embodiment, traces E9 and E10 may extend from opening OP8 through the upper surface of block 138a to the outside of block 138a, but are not limited thereto.

[0049] In some embodiments, such as Figure 1As shown, the conductive layer 140 may optionally include a plurality of dummy electrodes E11, and the electronic device 1 may also include a plurality of insulating blocks 142, wherein each insulating block 142 may be disposed between the corresponding dummy electrode E11 and the corresponding light-emitting unit 104, but is not limited thereto. In this case, the sidewall and lower surface of the insulating block 142 may have an angle greater than 90 degrees. For example, the insulating block 142 may have an inverted trapezoidal cross-sectional shape. Therefore, when forming the conductive layer 140, the conductive layer 140 is not easily formed on the sidewall of the insulating block 142. In this way, viewed from the top direction TD, the dummy electrode E11 located between the trace E9 and the trace E10 can be separated from the trace E9 and the trace E10 respectively, thereby achieving electrical insulation between the trace E9 and the trace E10. With the inverted trapezoidal insulating block 142, the patterning process on the light-emitting unit 104 can be reduced, thereby saving process costs or reducing process complexity.

[0050] exist Figure 1 In some embodiments, the electronic device 1 may optionally include an encapsulation layer 144 disposed between the light-emitting unit 104 and the color filter 106. The encapsulation layer 144 may, for example, be disposed in openings OP7 and OP8, such that the encapsulation layer 144 can be disposed on the light-emitting unit 104 and the conductive layer 140 to protect the light-emitting unit 104 and the conductive layer 140. In some embodiments, the encapsulation layer 144 may be disposed on the upper surface of the light-shielding layer 138, or the upper surface of the encapsulation layer 144 may be lower than the upper surface of the light-shielding layer 138, but is not limited thereto. In some embodiments, such as Figure 1 As shown, the upper surface of the light-shielding layer 136 may be higher than the upper surface of the encapsulation layer 144, so that the light-shielding layer 136 can divide the encapsulation layer 144 into multiple blocks, but is not limited thereto. In some embodiments, the color filter 106 may be disposed in the opening OP7, but is not limited thereto.

[0051] exist Figure 1 In some embodiments, the electronic device 1 may optionally include an insulating layer 146 disposed on the color filter 106. The insulating layer 146 may, for example, have a flat upper surface to facilitate the formation of a high-quality light-shielding layer 114 and wavelength conversion layer 108. The insulating layer 146 may, for example, include a filler material, such as a transparent resin or other suitable material. In some embodiments, the insulating layer 146 may include a functional layer (e.g., Figure 11 Functional layer 178 (shown) is used to enhance the output brightness of rays L2, L4, and L6. For a detailed description of functional layer 178, please refer to [reference needed]. Figure 11 Examples of implementations.

[0052] In some embodiments, such as Figure 1As shown, the electronic device 1 may optionally include a buffer layer 148 disposed between the substrate 102 and the circuit layer 122. The buffer layer 148 may, for example, be used to block moisture, oxygen, or ions from entering the electronic device 1. The buffer layer 148 may be a single layer or multiple layers, and the material of the buffer layer 148 may include, for example, silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, resin, other suitable materials, or combinations thereof, but is not limited thereto.

[0053] The electronic device is not limited to the above embodiments and may have different embodiments or variations. For the sake of simplicity, the same reference numerals will be used to label the same elements as in the first embodiment for different embodiments and variations. To facilitate comparison between the first embodiment and the different embodiments and variations, the differences between the different embodiments and variations will be highlighted below, and repeated parts will not be described again.

[0054] Figure 2 The diagram shown is a cross-sectional view of an electronic device according to a second embodiment of the present invention. Figure 2 As shown, the electronic device 2 in this embodiment and Figure 1 One difference in the electronic device 1 shown is that the color filter 106 can serve as an encapsulation layer, disposed in the openings OP7 and OP8, and on the light-emitting unit 104 and the conductive layer 140, thereby protecting the light-emitting unit 104 and the conductive layer 140. Therefore, the electronic device 2 may not include... Figure 1 The encapsulation layer 144 is shown. In some embodiments, the light-emitting units 104 may emit light of the same color, for example, light-emitting units 104a, 104b, and 104c may be blue light sources, but are not limited thereto. In some embodiments, light-emitting units 104a, 104b, and 104c may be blue light sources, and the color filter 106 may be a blue color filter, but is not limited thereto. In some embodiments, the height of the upper surface of the color filter 106 may selectively be greater than the height of the upper surface of the light-shielding layer 136, so that the color filter 106 may be disposed on the upper surface of the light-shielding layer 136, but is not limited thereto. In some embodiments, the height of the upper surface of the color filter 106 may also be less than the height of the upper surface of the light-shielding layer 136, and may fill at least a portion of the space between the blocks of the light-shielding layer 136. In some embodiments, the light-emitting unit 104 corresponding to the color filter 110c may not be provided with a color filter 106, so as to improve the light output brightness of the sub-pixel of the corresponding color filter 110c.

[0055] exist Figure 2In some embodiments, electronic device 2 may selectively exclude wavelength conversion layer 108c and color filter 110c, but is not limited thereto. In this case, since openings OP6 and OP3 may overlap with light-emitting unit 104c, light L5 can pass through openings OP6 and OP3 after passing through color filter 106, as light generated by a sub-pixel (or a pixel) of electronic device 1. Insulating layer 120 may be disposed in opening OP3, for example, and insulating layer 116 may be disposed in opening OP6, for example, but is not limited thereto. In some embodiments, viewed from the top direction TD, the area of ​​opening OP3 of electronic device 2 may be smaller than the area of ​​opening OP1 and the area of ​​opening OP2, in order to reduce the ambient light intensity entering opening OP3. In some embodiments, electronic device 2 may include Figure 1 Color filter 110c or simultaneously includes Figure 1 The wavelength conversion layer 108c and the color filter 110c are included, but are not limited to these. Figure 2 Other parts of the electronic device 2 shown may be, for example, identical to Figure 1 The electronic device 1 shown will not be described in detail.

[0056] Figure 3 The diagram shown is a cross-sectional view of an electronic device according to a third embodiment of the present invention. Figure 3 As shown, the color filter 106 of the electronic device 3 in this embodiment can also serve as an encapsulation layer, disposed in openings OP7 and OP8, and on the light-emitting unit 104 and the conductive layer 140. The color filter 106 can be formed by a drop-in method, such that the electronic device 3 may include multiple color filters 106, each disposed in a corresponding opening OP7. The drop-in method may include, for example, inkjet printing or other suitable methods. In this case, the light-shielding layer 136 may serve as a barrier for the color filter 106, but is not limited thereto. The insulating layer 146 may serve as a filler layer, for example, and has a flat upper surface, which can help form the light-shielding layer 114 and the wavelength conversion layer (e.g., wavelength conversion layer 108a and wavelength conversion layer 108b).

[0057] exist Figure 3 In some embodiments, the electronic device 3 may include a color filter 110c, and the light-emitting unit 104 corresponding to the color filter 110c may not be provided with a color filter 106, which can improve the light emission brightness of the sub-pixels of the corresponding color filter 110c (e.g., the brightness of light such as light L5), but is not limited thereto. For example, when the area of ​​the opening OP3 of the corresponding color filter 110c is smaller than the area of ​​the opening OP1 and the area of ​​the opening OP2 (e.g., as... Figure 4 The opening OP3 shown, or the opening OP3 is provided with a light-shielding strip (e.g., as shown). Figure 5When the light-shielding strip shown is not provided, the brightness of the emitted light L5 can be increased while reducing interference from ambient light by not providing the color filter 106. In this case, the insulating layer 146 can be provided in the opening OP7 of the corresponding light-emitting unit 104c. In some embodiments, when the electronic device 3 does not include Figure 1 When the wavelength conversion layer 108c is included, the electronic device 3 may not include the color filter 110c. In some embodiments, the electronic device 3 may also include a color filter 106 disposed in the opening OP7 of the corresponding light-emitting unit 104c, which can reduce the brightness of reflected light at this location. In some embodiments, the electronic device 3 may selectively include or exclude the wavelength conversion layer 108c. Figure 3 Other parts of the electronic device 3 shown may be, for example, identical to Figure 1 The electronic device 1 shown or Figure 2 The electronic device 2 shown will not be described in detail.

[0058] Figure 4 The diagram shown is a partial top view of an electronic device according to a fourth embodiment of the present invention. Figure 4 As shown in the upper portion P1 and the lower portion P2, viewed from the top direction TD, the area of ​​the opening OP3 of the electronic device 4 can be smaller than the areas of the opening OP1 and the opening OP2, in order to reduce the intensity of ambient light (e.g., light L7) entering the color filter 110c. It should be noted that, due to the color of the color filter 110c and... Figure 1 The color filters 106 shown are similar or identical in color. Therefore, compared to the case where ambient light passes through color filters 110a and 106 or color filters 110b and 106, the effect of color filter 110c combined with color filter 106 in reducing ambient light intensity may be less effective. In this embodiment, the intensity of ambient light can be reduced by decreasing the area of ​​the opening OP3 corresponding to color filter 110c. In some embodiments, the pixel or sub-pixel corresponding to the opening OP3 can be designed, for example, the light-emitting unit 104c can be a blue light source, wherein the color filter 106 can be a blue color filter and no wavelength conversion layer 108c is provided, and the color filter 110c can be combined with a blue color filter, but is not limited to this.

[0059] exist Figure 4 In the upper portion P1, the width W3 of opening OP3 may be smaller than the width W1 of opening OP1 and / or the width W2 of opening OP2. The width W10 of opening OP3 in the horizontal direction HD2 may, for example, be the same as or smaller than the width W8 of opening OP1 in the horizontal direction HD2 and / or the width W9 of opening OP2 in the horizontal direction HD2. The horizontal direction HD2 may be a direction perpendicular to the top-view direction TD and different from the horizontal direction HD1, for example, a direction perpendicular to the horizontal direction HD1. Figure 4As shown in the lower portion P2, the width W3 of opening OP3 may be the same as the width W1 of opening OP1 and / or the width W2 of opening OP2, and the width W10 of opening OP3 may, for example, be smaller than the width W8 of opening OP1 and / or the width W9 of opening OP2, but is not limited thereto. In some embodiments, such as Figure 4 As shown, in the top-view direction TD, the area of ​​opening OP1 may be different from the area of ​​opening OP2, but is not limited to this. Figure 4 Other parts of the electronic device 4 shown may, for example, employ Figure 1 The part corresponding to the electronic device 1 shown will not be described in detail. Figure 4 The openings OP1, OP2, and OP3 shown on the upper portion P1 and / or the openings OP1, OP2, and OP3 shown on the lower portion P2 can be applied to any of the above or below embodiments.

[0060] Figure 5 The diagram shown is a partial top view of an electronic device according to a fifth embodiment of the present invention. To clearly show the light-shielding strip, Figure 4 The portions of the electronic devices corresponding to color filters 110a and 110b are not shown, but this is not a limitation. For example... Figure 5 As shown in the upper left portion P3, upper right portion P4, and lower portion P5, the electronic device 5 may also include a light-shielding strip 150, disposed in the opening OP3 in the top view TD, to reduce the brightness of ambient light (e.g., light L7) entering the color filter 110c. The light-shielding strip 150 may, for example, include a light-shielding material, at least two filter materials capable of blocking light from passing through, or a combination thereof. Figure 5 In some embodiments, the areas of openings OP1, OP2, and OP3 may be the same in the top view direction TD, but are not limited thereto. In some embodiments, at least two of openings OP1, OP2, and OP3 may have different areas.

[0061] exist Figure 5 In the upper left portion P3, the light-shielding strip 150 may extend, for example, along the arrangement direction (e.g., the horizontal direction HD1) of the color filters 110a, 110b, and 110c, but is not limited thereto. Figure 5In the upper right portion P4, the extension direction of the light-shielding strip 150 may be different from, for example, the arrangement direction (e.g., horizontal direction HD1) of the color filters 110a, 110b, and 110c. The extension direction of the light-shielding strip 150 may be, for example, horizontal direction HD2, but is not limited thereto. In some embodiments, the pixels or sub-pixels corresponding to the light-shielding strip 150 may be designed such that, for example, the light-emitting unit 104c is a blue light source, wherein the color filter 106 is a blue color filter and does not have a wavelength conversion layer 108c, and the color filter 110c may be paired with a blue color filter, but is not limited thereto. In some embodiments, the pixels or sub-pixels corresponding to the light-shielding strip 150 may be designed such that, for example, the light-emitting unit 104c is a blue light source, wherein the color filter 106 is a blue color filter and may have a blue light wavelength conversion layer 108c, and the color filter 110c may be paired with a blue color filter, but is not limited thereto. Figure 5 In the lower portion P5, the opening OP3 may not contain a color filter 110c. When the area of ​​the opening OP3 is the same as that of the opening OP1, providing a light-shielding strip 150 in the opening OP3 can help reduce interference from ambient light (e.g., light L7). In some embodiments, the electronic device 5 may not include the wavelength conversion layer 108c or may not include both the color filter 110c and the wavelength conversion layer 108c. Figure 5 Other parts of the electronic device 5 shown may, for example, employ Figure 1 The part corresponding to the electronic device 1 shown and / or Figure 4 The openings OP1, OP2, and OP3 shown are not described in detail here. Figure 5 The light-shielding strip 150 may be applied to any of the above or below embodiments.

[0062] Figure 6 The diagram shown is a partial cross-sectional view of an electronic device according to a sixth embodiment of the present invention. Figure 6 As shown in the left portion P6 and the right portion P7, the light-shielding strip 150 of the electronic device 6 can be disposed on the color filter 106. Figure 6 In the left portion P6, a light-shielding strip 150 can be disposed in the opening OP6. The light-shielding strip 150 and the light-shielding layer 114 can, for example, comprise the same light-shielding material or can be formed using grayscale shielding or halftone shielding through the same process or from the same film layer. Figure 6 In the right-side portion P7, a light-shielding strip 150 may be disposed in the opening OP3. For example, the light-shielding strip 150 and the light-shielding layer 112 may comprise the same light-shielding material or may be formed using grayscale shielding or halftone shielding through the same process or from the same film layer. In some embodiments, Figure 6The electronic device 6 in the left portion P6 and the right portion P7 may not include the wavelength conversion layer 108c or the color filter 110c and the wavelength conversion layer 108c. Figure 6 Other parts of the electronic device 6 shown may, for example, be parts corresponding to the electronic devices of any of the above or below embodiments, and therefore will not be described in detail. Figure 6 The light-shielding strip 150 may be applied to any of the above or below embodiments.

[0063] Figure 7 The diagram shown is a cross-sectional view of an electronic device according to a seventh embodiment of the present invention. To clearly illustrate the light-shielding strip 150 and the color filter 110, Figure 7 Components below the insulating layer 120 are omitted, but this is not a limitation. For example... Figure 7 As shown, the light-shielding strip 150 of the electronic device 7a may include a stack of color filter materials of different colors. Specifically, the light-shielding strip 150 may include a color filter block 150a, a color filter block 150b, and a portion of a color filter 110c that overlaps with the color filter block 150a in the top view direction TD, stacked under the substrate 118 along the top view direction TD. Figure 7 In some embodiments, color filter block 150a and color filter 110b may have the same color, and color filter block 150b may have the same color as color filter 110a, but are not limited thereto. Color filter block 150b and color filter 110b may, for example, be formed from the same color filter layer, and color filter block 150a and color filter 110a may, for example, be formed from the same color filter layer, but are not limited thereto. In some embodiments, color filter 110c may be blue, color filter 110b may be green, and color filter 110a may be red. In some embodiments, color filter block 150a may be green and color filter block 150b may be red, but are not limited thereto. In some embodiments, color filter block 150a may be red and color filter 150b may be green, but are not limited thereto. In some embodiments, color filter blocks 150a and 150b may be green and blue, or a combination of blue and green, but are not limited thereto. In some embodiments, color filter blocks 150a and 150b may be red and blue, or a combination of blue and red, but are not limited thereto. Figure 7In some embodiments, color filters 110c, 110b, and 110a can be formed sequentially, so color filters 110c, color filter blocks 150b, and color filter blocks 150a can be stacked sequentially under the substrate 118, but are not limited thereto. In some embodiments, the stacking order of color filter blocks 150a, 150b, and 110c can be adjusted, for example, according to the formation order of color filters 110a, 110b, and 110c, but is not limited thereto. Figure 7 The light-shielding strip 150 may not include one of the color filter blocks 150a and 150b. In some embodiments, the color filter block 150a and the color filter 110b may have different colors, and / or the color filter block 150b and the color filter 110a may have different colors. Figure 7 Other parts of the electronic device 7 shown may, for example, be parts corresponding to the electronic devices of any of the above or below embodiments, and therefore will not be described in detail. Figure 7 The light-shielding strip 150 may be applied to any of the embodiments described above or below. In some embodiments, the light-shielding strip 150 may include a stack of three different colors (e.g., red, green, blue, etc.) of colored filter material (not shown), but is not limited thereto.

[0064] Figure 8 The diagram shown is a cross-sectional view of an electronic device according to a variation of the seventh embodiment of the present invention. To clearly illustrate the light-shielding strip 150 and the color filter 110, Figure 8 Components below the insulating layer 120 are omitted, but this is not a limitation. For example... Figure 8 As shown, the electronic device 7b of this variant embodiment and Figure 7 One difference in electronic device 7a is that electronic device 7b may not have a color filter 110c in the opening OP3. In this case, the light-shielding strip 150 may include color filter blocks 150a and 150b, stacked under substrate 118. In some embodiments, color filter 110b may be green and color filter 110a may be red. In some embodiments, color filter block 150a may be green and color filter block 150b may be red, but is not limited thereto. In some embodiments, color filter block 150a may be red and color filter block 150b may be green, but is not limited thereto. In some embodiments, the stacking order of color filter blocks 150a and 150b may be adjusted, for example, according to the formation order of color filters 110a and 110b, but is not limited thereto. Figure 8 Other parts of the electronic device 7b shown may, for example, be parts corresponding to the electronic devices of any of the above or below embodiments, and therefore will not be described in detail. Figure 8 The light-shielding strip 150 may be applied to any of the embodiments described above or below. In some embodiments, the light-shielding strip 150 may include a stack of three different colors (e.g., red, green, blue, etc.) of colored filter material (not shown), but is not limited thereto.

[0065] Figure 9 The diagram shown is a cross-sectional view of an electronic device according to the eighth embodiment of the present invention. Figure 9 As shown, the light-emitting unit 104 of the electronic device 8 in this embodiment can be, for example, an organic light-emitting diode (OLED). Specifically, the electronic device 8 may include an organic light-emitting layer 152 and an electrode layer 154, which are sequentially disposed on a light-shielding layer 136 and a circuit layer 122, and the organic light-emitting layer 152 and the electrode layer 154 may be disposed in the opening OP7 of the light-shielding layer 136. The metal layer M3 of the circuit layer 122 may include a plurality of electrodes E13, which correspond to the opening OP7 of the light-shielding layer 136 in the top view TD, such that the portion of each electrode E13 and the organic light-emitting layer 152 and the electrode layer 154 thereon can form an organic light-emitting diode, which serves as the light-emitting unit 104 in this embodiment, but the present invention is not limited thereto. In some embodiments, the organic light-emitting layer 152 may comprise a single layer or multiple layers, and is not limited thereto. In some embodiments, the light-emitting unit 104 may further include a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), an electron injection layer (EIL), and a charge generation layer (CGL), disposed on the electrode E13, but is not limited thereto. In some embodiments, the light-emitting unit 104 may be adjusted according to requirements, for example, including multiple organic light-emitting diodes or having different structures. Figure 9 In one embodiment, electrode E13 may be electrically connected to drive element 124a through the through hole corresponding to insulating layer 132 and the corresponding electrode E4, but is not limited thereto.

[0066] exist Figure 9 In some embodiments, the electronic device 8 may include a protective layer 156 disposed on the electrode layer 154, and the protective layer 156 may replace... Figure 1 The encapsulation layer 144. The protective layer 156 may include, for example, a stack of inorganic material layer 156a, organic material layer 156b, and inorganic material layer 156a and organic material layer 156b, to reduce the penetration of water vapor or oxygen. The stacked structure of the protective layer 156 is not limited to, for example, Figure 9As shown, the protective layer 156 may include at least an inorganic material layer 156a, an organic material layer 156b, and a stack of inorganic material layers 156a. For example, the inorganic material layer 156a may include silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, or other suitable protective materials, or any combination of the aforementioned inorganic materials, but is not limited thereto. The organic material layer 156b may include, but is not limited thereto, a resin. In some embodiments, the protective layer 156 may also be a single inorganic material layer 156a or a stack of multiple inorganic material layers 156a. In some embodiments, a color filter 106 may, for example, replace one of the organic material layers 156b of the protective layer 156 and be included within the protective layer 156.

[0067] In some embodiments, such as Figure 9 As shown, the electronic device 8 may also optionally include an auxiliary electrode 158, which can be used to reduce the resistance difference between the electrode layer 154 of the light-emitting unit 104 and an external voltage source or peripheral circuitry. For example, the auxiliary electrode 158 may be disposed between the electrode layer 154 and the protective layer 156, and overlap with the light-shielding layer 136. The material of the auxiliary electrode 158 may include a magnesium silver layer, nano-silver paste, aluminum, copper, or other suitable conductive materials. In some embodiments, the auxiliary electrode 158 may include the same material as the electrode layer 154, but is not limited thereto. Figure 9 Other parts of the electronic device 8 shown may, for example, be parts corresponding to the electronic devices of any of the above or below embodiments, and therefore will not be described in detail. Figure 9 The organic light-emitting diode, protective layer 156, and / or auxiliary electrode 158 may be used in any of the above or below embodiments.

[0068] Figure 10 The diagram shown is a cross-sectional view of an electronic device according to a ninth embodiment of the present invention. Figure 10As shown, the light-emitting unit 104 of the electronic device 9 can be, for example, an inorganic light-emitting diode, such as a micro light-emitting diode. Specifically, the light-emitting unit 104 may include a semiconductor layer 160, a light-emitting layer 162, and a semiconductor layer 164, stacked sequentially along the top view direction TD, and each light-emitting unit 104 may be disposed in the opening OP7 of the light-shielding layer 136. In some embodiments, the semiconductor layer 160 and the semiconductor layer 164 may be N-type and P-type, respectively, or vice versa. The light-emitting unit 104 may also include a pad 166 disposed under the semiconductor layer 160 and a pad 168 disposed under the semiconductor layer 164. Furthermore, the metal layer M3 of the circuit layer 122 may include multiple electrodes E13 and multiple electrodes E14, and each opening OP7 of the light-shielding layer 136 may expose one electrode E13 and one electrode E14, so that the pads 166 and 168 of the light-emitting unit 104 can be electrically connected to the corresponding electrodes E14 and E13 respectively, thereby being electrically connected to the capacitor 125 and the driving element 124a respectively. The connection method between the light-emitting unit 104 and the capacitor 125 and the driving element 124a of the present invention is not limited to this. Additionally, in Figure 9 In this case, the encapsulation layer 144 may be disposed on the light-emitting unit 104 and the light-shielding layer 136, but is not limited thereto.

[0069] In some embodiments, such as Figure 10 As shown, the electronic device 9 may optionally include a light-shielding layer 170 disposed between the encapsulation layer 144 and the color filter 106, which can be used to reduce the light generated by a single light-emitting unit 104 from entering non-corresponding openings, thereby reducing or preventing light leakage. The light-shielding layer 170 may have multiple openings OP9, which correspond to the openings OP7 of the light-shielding layer 136 in the top view TD. Figure 10 Other parts of the electronic device 9 shown may, for example, be parts corresponding to the electronic devices of any of the above or below embodiments, and therefore will not be described in detail. Figure 10 The inorganic light-emitting diode, encapsulation layer 144, and / or light-shielding layer 170 may be used in any of the above or below embodiments.

[0070] Figure 11 The diagram shown is a cross-sectional view of an electronic device according to the tenth embodiment of the present invention. Figure 11 As shown, the wavelength conversion layer 108 and the light-shielding layer 114 of the electronic device 10 can be formed under the color filter 110 and the light-shielding layer 112. Figure 11In some embodiments, the insulating layer 146 of the electronic device 10 may include an adhesive layer 182 disposed between the light-shielding layer 114 and the color filter 106, which can be used to bond the substrate 118 to the substrate 102. In some embodiments, the adhesive layer 182 may also be disposed between the wavelength conversion layer 108 and the color filter 110. In some embodiments, the electronic device 10 may not include the wavelength conversion layer 108c or may not include the color filter 110c and the wavelength conversion layer 108c.

[0071] In some embodiments, the electronic device 10 may optionally include a functional layer 172 disposed between the wavelength conversion layer 108 and the color filter 110. When the wavelength conversion layer 108 and the light-shielding layer 114 are formed under the color filter 110 and the light-shielding layer 112, the functional layer 172 may, for example, replace... Figure 1 The insulating layers 116 and 120 are included. Functional layer 172 may, for example, allow light generated by wavelength conversion layers 108a, 108b, and 108c to pass through and reflect light generated by the light-emitting unit 104, thereby improving the purity of the light emitted from the corresponding wavelength conversion layers 108a, 108b, and 108c. In some embodiments, when the color of the light generated by wavelength conversion layer 108c is the same as the color of the light generated by light-emitting unit 104, functional layer 172 may not cover opening OP6 in the top view TD. In some embodiments, the functional layer may also be disposed between wavelength conversion layer 108 and color filter 106.

[0072] exist Figure 11In some embodiments, the insulating layer 146 of the electronic device 10 may further include an encapsulation layer 174, a planarization layer 176, and a functional layer 178, sequentially disposed beneath the light-shielding layer 114 and the wavelength conversion layer 108. The material of the encapsulation layer 174 may be, for example, the same as or similar to the insulating layer 120, but is not limited thereto. The planarization layer 176 may have a flat lower surface to facilitate the formation of the functional layer 178. The functional layer 178 may, for example, allow light generated by the light-emitting unit 104 to pass through and reflect light generated by the wavelength conversion layers 108a, 108b, and 108c. In some embodiments, when the color of the light generated by the wavelength conversion layer 108c is the same as the color of the light generated by the light-emitting unit 104, the functional layer 178 may not cover the opening OP6 in the top view TD. The structures of the functional layers 172 and 178 may be, for example, multiple Bragg multilayer films composed of different refractive indices, but are not limited thereto. In some embodiments, the material of functional layer 172 and / or functional layer 178 may include, for example, fluorides, polymers, or nanocoatings to facilitate the formation of a wavelength conversion layer on functional layer 172 or functional layer 178, but is not limited thereto. In some embodiments, the insulating layer 146 of electronic device 10 may include a capping layer 184 (or a refractive index matching layer) disposed between color filter 106 and adhesive layer 182, but is not limited thereto. In some embodiments, when functional layer 178, light-shielding layer 114, and wavelength conversion layer 108 are formed on color filter 106, electronic device 10 may not include capping layer 184.

[0073] In some embodiments, the functional layer 178, the light-shielding layer 114, and the wavelength conversion layer 108 may also be formed on the color filter 106, and the adhesive layer 182 is disposed between the light-shielding layer 114 and the light-shielding layer 112. In this case, the encapsulation layer 174 may be disposed between the light-shielding layer 114 and the adhesive layer 182, but is not limited thereto. In some embodiments, the electronic device 10 may include one of the functional layers 172 and 178, but not the other layer.

[0074] exist Figure 11 In some embodiments, the electronic device 10 may optionally include an insulating layer 180 disposed between the encapsulation layer 144 and the color filter 106, which may improve the adhesion between the color filter 106 and the encapsulation layer 144. The insulating layer 180 may, for example, include an inorganic insulating material.

[0075] exist Figure 11 In some embodiments, the light-emitting unit 104 may include, for example, an inorganic light-emitting diode. In some embodiments, the light-emitting unit 104 may include an organic light-emitting diode, and in some embodiments, the encapsulation layer 144 may be replaced with... Figure 9 The protective layer 156 shown is not limited to this. Figure 11Other parts of the electronic device 10 shown may, for example, be parts corresponding to the electronic devices of any of the above or below embodiments, and therefore will not be described in detail. Figure 11 The formation of functional layer 172, functional layer 178, insulating layer 180, insulating layer 146 and / or light-shielding layer 114 and wavelength conversion layer may be adapted to any of the above or below embodiments.

[0076] In summary, in the electronic device of the present invention, since the color of the color filter disposed on the wavelength conversion layer can be different from the color of the color filter disposed between the wavelength conversion layer and the light-emitting unit, it can absorb light of different colors respectively and has complementary light absorption characteristics, which can reduce the interference of ambient light on the displayed image of the electronic device and / or improve the image clarity.

[0077] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Those skilled in the art will recognize that the present invention can have various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that, include: One substrate; A first light-emitting unit is disposed on the substrate and used to generate a first light ray; A first color filter is disposed on the first light-emitting unit; A first wavelength conversion layer is disposed on the first color filter; A second color filter is disposed on the first wavelength conversion layer; A second light-emitting unit is disposed on the substrate; A first light-shielding layer is disposed on the first color filter, wherein the first light-shielding layer has a first opening and a second opening, the second color filter is disposed in the first opening, and the second opening overlaps the second light-emitting unit; A second light-shielding layer is located between the first color filter and the first light-shielding layer, wherein the second light-shielding layer has a third opening that overlaps with the first opening; as well as A third light-shielding layer is located between the substrate and the first color filter, wherein the third light-shielding layer has a fourth opening that overlaps the first light-emitting unit and the third opening; In this process, the first light ray passes through the first color filter, the first wavelength conversion layer converts the first light ray into a second light ray, and the second light ray passes through the second color filter.

2. The electronic device as claimed in claim 1, characterized in that, The thickness of the first color filter is less than the thickness of the second color filter.

3. The electronic device as claimed in claim 1, characterized in that, It also includes a second wavelength conversion layer and a third color filter, wherein the second wavelength conversion layer is disposed on the second light-emitting unit, and the third color filter is disposed on the second wavelength conversion layer, wherein the first color filter is further disposed between the second wavelength conversion layer and the second light-emitting unit.

4. The electronic device as claimed in claim 3, characterized in that, The second light-emitting unit is used to generate a third ray, and the second wavelength conversion layer converts the third ray into a fourth ray. The fourth ray passes through the third color filter, and the color of the fourth ray is different from the color of the second ray.

5. The electronic device as claimed in claim 4, characterized in that, The third color filter is disposed in the second opening, and the area of ​​the first opening is different from the area of ​​the second opening in the top view of the electronic device.

6. The electronic device as claimed in claim 1, characterized in that, It also includes a third light-emitting unit disposed on the substrate, wherein the light-shielding layer has a fifth opening and the fifth opening overlaps with the third light-emitting unit, wherein the third light-emitting unit is used to generate a fifth ray, the fifth ray passing through the first color filter and the fifth opening, and in the top view of the electronic device, the area of ​​the first opening is different from the area of ​​the fifth opening.

7. The electronic device as claimed in claim 1, characterized in that, The first color filter is a blue filter.

8. The electronic device as claimed in claim 1, characterized in that, The first light-emitting unit is an organic light-emitting diode.

9. The electronic device as claimed in claim 1, characterized in that, The first light-emitting unit is an inorganic light-emitting diode.

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