Transmitting device and electronic device comprising the same

Abstract

Various embodiments of the present disclosure relate to an apparatus for transmitting a wireless signal through a heterogeneous network in an electronic device. To this end, the electronic device can include a switch for performing switching by using at least two bias voltages input from a plurality of power suppliers as its input and using one of the at least two bias voltages as its output, and a first power amplifier included in a plurality of transmission chains capable of selectively supporting at least one first transmission chain of a heterogeneous network and amplifying a radio frequency signal for transmission through a bias voltage provided from the switch. In addition, various embodiments can be possible.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to an apparatus for transmitting wireless signals and an electronic device including the apparatus. Background Technology

[0002] An electronic device includes a battery as a power supply. The battery provides a voltage suitable for the operation of various components included in the electronic device. The electronic device may include, for example, a smartphone, a wearable device, or a tablet PC that supports wireless communication.

[0003] Electronic devices supporting wireless communication can transmit or receive radio frequency signals (hereinafter referred to as "RF signals") via one or more antennas. Electronic devices supporting wireless communication may include at least one component for transmitting and / or receiving RF signals. The component transmitting RF signals may include, for example, a phase-locked loop (PLL) or a power amplifier (PA). The PLL provides a reference signal for converting a baseband signal (hereinafter referred to as "BB signal") into a high-frequency band signal (i.e., the RF signal). The PA amplifies and outputs the RF signal before transmitting it through one or more antennas. Summary of the Invention

[0004] Technical issues

[0005] Because power consumption in electronic devices that support wireless communication can directly affect battery life or performance, efforts to reduce power consumption have been ongoing. In electronic devices that support wireless communication, for example, the power consumed by the power amplifier (PA) may account for a relatively high portion of the total power consumption. For example, in electronic devices where the PA is directly coupled to the battery, when the PA operates in a low-power region, the high supply voltage (e.g., "bias voltage") may provide power as heat dissipation.

[0006] According to various embodiments of the present disclosure, a transmitting device supporting wireless communication and an electronic device including the transmitting device can be provided for stably supplying a bias voltage for a power amplifier.

[0007] According to various embodiments of the present disclosure, an apparatus and method may be provided for preventing internal circuitry from being burned out due to software errors in electronic devices that share a single power amplifier to support dual transmission.

[0008] The technical tasks to be achieved in this document are not limited to those described above, and other technical tasks can be predicted to the extent that those skilled in the art can clearly understand them. The various embodiments described below fall within this scope.

[0009] Solution to the problem

[0010] The electronic device of embodiments of this disclosure may include: a wireless communication circuit; a switch that performs switching by using at least two bias voltages input from a plurality of power supplies as its input and using one of the at least two bias voltages as its output; and a first power amplifier electrically connected to the wireless communication circuit and included in at least one first transmission chain of a plurality of transmission chains, and amplifying a radio frequency signal for transmission by means of a bias voltage supplied from the switch.

[0011] The electronic device of embodiments of this disclosure may include at least one processor, a radio frequency integrated circuit (RFIC) for upconverting a baseband signal provided by the at least one processor into a radio frequency signal, and a front-end module for transmitting the upconverted radio frequency signal by the RFIC through a plurality of antennas. The front-end module may include: a first power supply supplying a first bias voltage and a second bias voltage based on a first envelope detection signal provided by the at least one processor; a second power supply supplying a third bias voltage and a fourth bias voltage based on the second envelope detection signal provided by the at least one processor; a switch using the second bias voltage and the third bias voltage as its inputs and outputting one of the second bias voltage and the third bias voltage as a fifth bias voltage; a first transmitting module for amplifying the upconverted radio frequency signal by the RFIC using the first bias voltage output from the first power supply; a second transmitting module for amplifying the upconverted radio frequency signal by the RFIC using the fifth bias voltage output from the switch; and a third transmitting module for amplifying the upconverted radio frequency signal by the RFIC using the fourth bias voltage output from the second power supply.

[0012] The electronic device of embodiments of this disclosure may include: a wireless communication circuit; a first power supply supplying a first bias voltage; a second power supply supplying a second bias voltage; a switch that uses the first bias voltage supplied from the first power supply and the second bias voltage supplied from the second power supply as its inputs and supplies one of the first bias voltage and the second bias voltage as a third bias voltage; a first power amplifier included in at least one of a plurality of transmission chains and amplifying a radio frequency signal by means of the third bias voltage supplied from the switch; and an antenna that outputs the radio frequency signal amplified by the power amplifier.

[0013] Advantages of the invention

[0014] According to various embodiments of this disclosure, by stably supplying a bias voltage to a power amplifier in an electronic device, not only can the internal circuitry be prevented from burning out, but also higher power efficiency can be achieved.

[0015] The effects that can be obtained in this disclosure are not limited to those described above, and other effects can be predicted within the scope that can be clearly understood by those skilled in the art, and the various embodiments set forth in the following description are within that scope. Attached Figure Description

[0016] Figure 1 This is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0017] Figure 2 This is a diagram illustrating examples of components included in an electronic device to transmit wireless signals according to various embodiments of the present disclosure.

[0018] Figure 3 This is a diagram illustrating the construction of the front-end module and power supply in an electronic device 101 according to an embodiment of the present disclosure.

[0019] Figure 4 This is a diagram illustrating an example of a switching circuit for selectively outputting a bias voltage in the front-end module of an electronic device according to an embodiment of the present disclosure.

[0020] Figure 5 This is a diagram illustrating another example of a switching circuit for selectively outputting a bias voltage in the front-end module of an electronic device according to an embodiment of the present disclosure.

[0021] Figure 6 This is a diagram illustrating the construction of a bias circuit for a power amplifier module included in an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0022] In the following, various embodiments set forth in this disclosure will be described in detail with reference to the accompanying drawings. However, for ease of description, the dimensions of components may be enlarged or reduced in the drawings. For example, for ease of description, the dimensions and thickness of each component shown in the drawings are arbitrarily illustrated, and it should be noted that the various embodiments set forth in this disclosure are not necessarily limited to those shown.

[0023] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0024] Reference Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input device 150, sound output device 155, display device 160, audio module 170, sensor module 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of these components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 160 (e.g., a display).

[0025] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) and an auxiliary processor 123 (e.g., graphics processing unit (GPU), image signal processor (ISP), sensor hub processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. Additionally or alternatively, auxiliary processor 123 may be adapted to consume less power than main processor 121, or adapted for a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or it can be implemented as part of the main processor 121.

[0026] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display device 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display device 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) can be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123.

[0027] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0028] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0029] Input device 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input device 150 may include, for example, a microphone, mouse, keyboard, or digital pen (e.g., stylus).

[0030] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0031] Display device 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display device 160 may include touch circuitry adapted to detect touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of the force caused by touch.

[0032] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0033] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0034] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0035] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0037] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0038] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0039] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0040] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0041] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, antenna module 197 may include multiple antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0042] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0043] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 and electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, either with further processing or without further processing. For this purpose, technologies such as cloud computing, distributed computing, or client-server computing may be used.

[0044] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0045] Figure 2 This illustrates various embodiments of electronic devices (e.g., according to the present disclosure) based on the present disclosure. Figure 1 Figure 200 shows an example of a component included in an electronic device 101 for transmitting wireless signals.

[0046] Reference Figure 2 The electronic device 101 in the embodiment may include at least one processor 210 (e.g., Figure 1 The electronic device 101 may include a processor 120, an RFIC 220, a front-end module (FEM) 230, and / or multiple antennas 240-1, 240-2…240-k. The electronic device 101 may also include… Figure 1At least one of the components shown. In an embodiment, at least one processor 210, RFIC 220, and / or FEM 230 may be included in the wireless communication module (e.g., Figure 1 In the wireless communication module 192).

[0047] According to an embodiment, electronic device 101 may support communication in multiple frequency bands. Electronic device 101 may employ dual connectivity technologies supporting communication in multiple frequency bands, such as non-standalone (NSA) and carrier aggregation (CA). For example, electronic device 101 may support communication in at least one of a first frequency band (e.g., low frequency band (LB)), a second frequency band (e.g., mid / high frequency band (M / HB)), and a third frequency band (e.g., ultra-high frequency band (UHB)). Electronic device 101 can provide dual connectivity by combining various frequency bands.

[0048] According to an embodiment, at least one processor 210 can perform operations for transmitting and / or receiving operations in the overall control electronics 101. At least one processor 210 can determine a network in a heterogeneous network to transmit a signal and configure at least one transmission chain to transmit an RF signal to the determined network. At least one processor 210 can control the path used to provide bias voltage (or bias current, collectively referred to below as bias voltage) to one or more PAs included in the at least one transmission chain for transmitting the signal. For example, when three transmission chains exist, at least one processor 210 can determine one or two transmission chains among the three transmission chains to process the signal and perform control to complete the path for applying bias voltage to the PAs provided for each of the determined one or two transmission chains.

[0049] According to an embodiment, at least one processor 210 may include at least one of a communication processor (CP) 211 or at least one application processor (AP) 213.

[0050] According to an embodiment, CP 211 can support the establishment of communication channels for supporting dual connectivity, and communication through the established communication channels. CP 211 can support the establishment of communication channels for, for example, a first frequency band (e.g., LB) to be used for wireless communication with a first network (e.g., a cellular network), a second frequency band (e.g., M / HB) to be used for wireless communication with a second network (e.g., a cellular network), and / or a third frequency band (e.g., UHB) to be used for wireless communication with a third network (e.g., a 5G network), and communication through the established communication channels. The second network can be, for example, a legacy network, such as a second-generation (2G), 3G, 4G, or Long Term Evolution (LTE) network. The third network can be, for example, a 5G network. The third frequency band (e.g., UHB) can be, for example, from about 6 GHz to about 60 GHz. CP 211 can also support the establishment of a communication channel corresponding to another specified frequency band (e.g., about 6 GHz or less) in the frequency band to be used for wireless communication with the third network, and 5G network communication through the established communication channels.

[0051] According to an embodiment, CP 211 can provide a baseband (BB) signal for transmission and output the provided BB signal. CP 211 can, for example, provide a BB signal that will be transmitted via a dual connection.

[0052] According to an embodiment, RFIC 220 can upconvert a BB signal provided by at least one processor 210 into an RF signal in the required RF band (e.g., first band, second band, and / or third band) for a first network, a second network, and / or a third network. RFIC 220 can, for example, provide RF signals (RF_in#1, RF_in#2...RF_in#m) upconverted for multiple networks to FEM 230.

[0053] According to an embodiment, RFIC 220 can track the envelope of each or more RF signals during transmission and provide the envelope detection signals (ET_DAC#1, ET_DAC#2...ET_DAC#n) as a result of the tracking to a power supply (e.g., an envelope tracking (ET) modulator). RFIC 220 can, for example, acquire digital values ​​by tracking the envelope of RF signals, convert the acquired digital values ​​into linear analog signals, and output them as envelope detection signals.

[0054] According to an embodiment, RFIC 220 can down-convert an RF signal received from a first network, a second network, and / or a third network via at least one of a plurality of antennas 240-1, 240-2...240-k and preprocessed by FEM 230 into a BB signal during reception. RFIC 220 can forward the down-converted BB signal to at least one processor 210.

[0055] According to one embodiment, FEM 230 can perform preprocessing operations for transmitting RF signals (RF_in#1, RF_in#2, ..., RF_in#m) provided from RFIC 220 through multiple antennas 240-1, 240-2...240-k. FEM 230 can control the power of the RF signals (RF_in#1, RF_in#2, ..., RF_in#m) through the preprocessing operations. FEM 230 can amplify the RF signals (RF_in#1, RF_in#2, ..., RF_in#m) by, for example, a bias voltage (or drive voltage) provided according to a predetermined power supply method, and output them. As a power supply method, at least one of Average Power Tracking (APT) and / or Envelope Tracking (ET) methods can be used.

[0056] The APT (Adaptive Power Transmission) method uses a DC-DC converter to change the bias voltage supplied to the PA (Power Amplifier). Compared to conventional methods where the PA's bias voltage is directly supplied from the battery, the APT method achieves relatively high efficiency. However, in the APT method, by supplying the PA's bias voltage according to the peak level of the RF signal, power dissipation due to heat may occur in the PA. The ET (Electronic Power Transmission) method uses a linear envelope signal obtained by tracking the envelope of the RF signal to change the bias voltage supplied to the PA. Compared to other power supply methods (such as conventional methods and APT methods), the ET method achieves relatively high power efficiency.

[0057] According to an embodiment, the FEM 230 may include multiple transmitting modules to provide dual connectivity or uplink CA. The FEM 230 may form multiple transmitting chains through the multiple transmitting modules. The multiple transmitting chains may include, for example, at least one transmitting chain capable of selectively supporting multiple frequency bands for serving heterogeneous networks. The multiple transmitting modules may include PAs that amplify RF signals using a bias voltage controlled by a predetermined power supply method.

[0058] According to an embodiment, electronic device 101 may include an “n” number of power supply devices or FEM 230. FEM 230 may include, for example, an “m” number of transmitting modules. The “n” number of power supply devices may provide operating voltages to FEM 230 based on envelope detection signals (ET_DAC#1, ET_DAC#2…ET_DAC#n) provided from RFIC 220. The “n” number of power supply devices may include, for example, at least one switch, either individually or externally, for providing operating voltages to FEM 230 based on envelope detection signals (ET_DAC#1, ET_DAC#2…ET_DAC#n). The “m” number of transmitting modules may amplify one or more RF signals from the “m” number of RF signals using one or more bias voltages output from the “n” number of power supply devices, and then transmit the one or more RF signals through multiple antennas 240-1, 240-2…240-k.

[0059] According to an embodiment, the ET technique for providing an envelope detection signal via envelope tracking can be applied to an "n" number of power supply devices. The ET technique can be, for example, a technique for reducing the power consumption of the PA in electronic device 101. The ET technique is a technique for tracking the envelope of an RF signal and providing a bias voltage to the PA based on the envelope of the RF signal. The ET technique enables electronic device 101 to achieve high efficiency in a high-power region.

[0060] Figure 3 This illustrates an electronic device (e.g., according to embodiments of the present disclosure) Figure 1 The front-end module (e.g., in the electronic device 101) Figure 3 Figure 300 shows the construction of the FEM 230 and the power supply.

[0061] Reference Figure 3 The electronic device of the embodiment may include a FEM 230 or at least two power supplies 340 and 350. The FEM 230 of the embodiment may include at least one of a plurality of transmitting modules 310, 320, and 330 or a switching circuit 360. The plurality of transmitting modules 310, 320, and 330 may include, for example, a first transmitting module 310, a second transmitting module 320, and / or a third transmitting module 330. The at least two power supplies 340 and 350 may include, for example, a first power supply 340 and / or a second power supply 350.

[0062] According to an embodiment, the first power supply 340 may be based on an RFIC (e.g., Figure 2 The first envelope detection signal (ET_DAC#1) 341 provided by the RFIC 220 is used to supply the first bias voltage (OUT). 11 )343 and second bias voltage (OUT)12 345. First bias voltage (OUT) 11 )343 can be directly supplied as the bias voltage for driving the first transmitting module 310. The second bias voltage (OUT) 12 )345 can be supplied as an input voltage to the switching circuit 360.

[0063] According to an embodiment, the second power supply 350 may be based on an RFIC (e.g., Figure 2 The second envelope detection signal (ET_DAC#2) 351 provided by the RFIC 220 is used to supply the third bias voltage (OUT). 21 )353 and the fourth bias voltage (OUT) 22 355. Third bias voltage (OUT) 21 )353 can be supplied as another input to the switching circuit 360. Fourth bias voltage (OUT) 22 )355 can be directly supplied as the bias voltage for driving the third transmitting module 330.

[0064] According to an embodiment, since the outputs of the first power supply 340 and the second power supply 350 are divided into two, the first power supply 340 and the second power supply 350 can linearly amplify broadband signals when multiple transmitting modules (or PAs) are arranged in parallel. For example, the power amplifier module (PAM) included in the transmitting module can have an inherent capacitance ranging from tens of picofarads (pF) to hundreds of pF, and when the PAM is made to have no capacitance by using the switching circuit 360, the capacitance applied to the first power supply 340 or the second power supply 350, or the capacitance applied to the voltage supply path, can be reduced.

[0065] According to an embodiment, the switching circuit 360 can convert the second bias voltage (OUT) input from the first power supply 340. 12 )345 and the third bias voltage (OUT) input from the second power supply 350 21 One of the switches 353 is switched to the output and supplied as a fifth bias voltage to drive the second transmitting module 320. The switching circuit 360 may include, for example, two single-pole single-throw (SPST) switches or one single-pole double-throw (SPDT) switch.

[0066] According to an embodiment, when the first power supply 340 is directly connected to the first transmitting module 310 supporting the second frequency band (e.g., M / HB), and the second power supply 350 is directly connected to the third transmitting module 330 supporting the third frequency band (e.g., UHB), the switching circuit 360 can be turned off. When the switching circuit 360 is turned off, the internal capacitance can be reduced. For example, since the ET power supply, which is considered a power supply that provides a high-speed variable power supply based on the envelope signal, is considered a power supply, a delay can occur when a large capacitance is applied to the power supply path. Therefore, the capacitance on the power supply path can be reduced by physically disconnecting it from unused components (e.g., amplifiers) within the electronic device 101.

[0067] According to embodiments, the first transmitting module 310, the second transmitting module 320, or the third transmitting module 330 may have a parallel structure, and each transmitting module may form a unique transmitting chain. One or more of the first transmitting module 310, the second transmitting module 320, or the third transmitting module 330 may be activated according to the transmitting mode considering the frequency band of the transmitted RF signal. The first transmitting module 310 may, for example, be a processor (e.g., Figure 2 The control signal of CP 211 or AP 213 is activated, and the first bias voltage (OUT) input from the first power supply 340 is used to activate it. 11 )343 performs operations for transmitting a first RF signal (RF_in#1) 311 in a first frequency band (e.g., LB). The second transmitting module 320 may be, for example, a processor (e.g., Figure 2 The control signal of CP211 or AP 213 is activated, and the operation of transmitting the second RF signal (RF_in#2) 321 in the second frequency band (e.g., M / HB) is performed by the fifth bias voltage 361 input from the switching circuit 360. The fifth bias voltage 361 can be the second bias voltage (OUT) provided by the first power supply 340 provided by the switching circuit 360. 12 )345 or a third bias voltage (OUT) provided by the second power supply 350 21 The bias voltage selected in 353. The third transmitting module 330 may be, for example, by a processor (e.g., Figure 2 Activated by the control signal of CP 211 or AP 213, and by the fourth bias voltage (OUT) input from the second power supply 350. 22 )355 performs the operation of transmitting a third RF signal (RF_in#3)331 in the third frequency band (e.g., UHB).

[0068] According to embodiments, the second transmitting module 320 can support various combinations of dual connectivity to support NSA. For example, the second transmitting module 320 may amplify RF signals in a second frequency band (e.g., M / HB) or amplify RF signals in a third frequency band (e.g., UHB) by sharing the output of the first power supply 340 and / or the output of the second power supply 350. That is, the second transmitting module 320 can be shared for dual transmission to heterogeneous networks.

[0069] According to an embodiment, the RF signal 313 processed by the first transmitting module 310 can be transmitted via the first antenna (Ant_1). The RF signal 323 processed by the second transmitting module 320 can be transmitted via the second antenna (Ant_2). The RF signal 333 processed by the third transmitting module 330 can be transmitted via the third antenna (Ant_3).

[0070] According to an embodiment, the first transmitting module 310 may include a first bias voltage (OUT) 11 The first PA is driven by a fifth bias voltage 343. The second transmitting module 320 may include a second PA driven by a fifth bias voltage 361. The third transmitting module 330 may include a second PA driven by a fourth bias voltage (OUT). 22 The third PA driven by 355.

[0071] According to an embodiment, a first RF signal (RF_in#1) 311 can be transmitted via a first transmission chain including a first transmission module 310. A second RF signal (RF_in#2) 321 can be transmitted via a second transmission chain including a second transmission module 320. A third RF signal (RF_in#3) 331 can be transmitted via a third transmission chain including a third transmission module 330.

[0072] Figure 4 This illustrates an embodiment of the present disclosure in an electronic device 101 for selectively selecting from FEMs (e.g., Figure 2 The switch that provides the output bias voltage of the FEM 230 (e.g., Figure 3 Figure 400 shows an example of a switching circuit (360).

[0073] Reference Figure 4 The switching circuit 360 in the embodiment can receive power from a first power supply (e.g., Figure 3 The second bias voltage (OUT) supplied by the first power supply 340) 12 )345 and powered by a second power supply (e.g., Figure 3 The third bias voltage (OUT) supplied by the second power supply 350) 21 )353. The switching circuit 360 can perform a switching operation, wherein the second bias voltage (OUT) 12)345 and the third bias voltage (OUT) 21 One of the components in 353 is output as the fifth bias voltage 361. Switching circuit 360 can be, for example, a double-pole single-throw (DPST) type. In an embodiment, switching circuit 360 may include components capable of outputting the second bias voltage (OUT). 12 The first switch (SW1) 410, which outputs the fifth bias voltage 361, and the third bias voltage (OUT) is also present. 21 The output of 353 is the second switch (SW2) 420, which is the fifth bias voltage 361. For example, the first switch (SW1) 410 or the second switch (SW2) 420 can be of the single-pole single-throw (SPST) type.

[0074] Figure 5 This illustrates an embodiment of the present disclosure in an electronic device 101 for selectively selecting from FEMs (e.g., Figure 2 The switch that provides the output bias voltage of the FEM 230 (e.g., Figure 3 Figure 500 shows another example of a switching circuit (360).

[0075] Reference Figure 5 The switching circuit 360 in the embodiment can receive power from a first power supply (e.g., Figure 3 The second bias voltage (OUT) supplied by the first power supply 340) 12 )345 and powered by a second power supply (e.g., Figure 3 The third bias voltage (OUT) supplied by the second power supply 350) 21 )353. The switching circuit 360 can perform a switching operation, wherein the second bias voltage (OUT) 12 )345 and the third bias voltage (OUT) 21 One of the components in 353 is output as the fifth bias voltage 361. The switching circuit 360 can be, for example, a double-pole single-throw (DPST) type. In this case, the switching circuit 360 may include outputting the second bias voltage (OUT). 12 )345 and the third bias voltage (OUT) 21 A switch (SW) 510 in 353 switches to a fifth bias voltage 361. In an embodiment, switch (SW) 510 may include a first terminal (a), a second terminal (b), or a third terminal (c). The first terminal (a) may be electrically connected to a first power supply and may receive a second bias voltage (OUT) from the first power supply. 12 345. The second terminal (b) can be electrically connected to a second power supply and can receive a third bias voltage (OUT) from the second power supply. 21 353. The third terminal (c) can be electrically connected to the transmitting module (e.g., Figure 3The second transmitting module 320) can supply a fifth bias voltage 361 to the transmitting module by selectively connecting the first terminal (a) or the second terminal (b) to the transmitting module.

[0076] like Figure 5 As shown, when the switching circuit 360 is of type DPST, it can prevent power supply from the first power supply (e.g., Figure 3 The second bias voltage (OUT) supplied by the first power supply 340) 12 )345 and powered by a second power supply (e.g., Figure 3 The third bias voltage (OUT) supplied by the second power supply 350) 21 The case where 353 is output simultaneously. In this case, it can prevent the internal circuit from being burned out due to a short circuit caused by the simultaneous output of two bias voltages.

[0077] Figure 6 This illustrates an electronic device (e.g., according to embodiments of the present disclosure) Figure 1 The electronic device 101 includes a power amplifier module (PAM) (e.g., Figure 3 Figure 600 shows the construction of the bias circuit of the second transmitting module 320.

[0078] Reference Figure 6 The PAM 610 of the embodiment (e.g., Figure 3 The second transmitting module 320 may include at least one of three bias pins (P1, P2, and P3), an input pin (Pin), and / or an output pin (Pout). For example, the PAM610 may also include a controller 611, a first AMP 613, a second AMP 615, and / or a switch 617 (e.g., Figure 3 (Switching circuit 360). For example, the first AMP 613 can be a driver amplifier, and the second AMP 615 can be a main amplifier.

[0079] According to an embodiment, the three bias pins (P1, P2, and P3) may include an input for controlling the bias current (V). batt The first bias pin (P1), the second bias pin (P2) for inputting the second bias voltage (Vcc1) of the first AMP613 corresponding to the drive amplifier, and / or the third bias pin (P3) for inputting the third bias voltage (Vcc2) of the second AMP615 corresponding to the main amplifier.

[0080] According to an embodiment, the first bias voltage (V) input to the first bias pin (P1) is... battThe second bias voltage (Vcc1) input to the second bias pin (P2) can be provided to the controller 611, the second bias voltage (Vcc1) input to the second bias pin (P2) can be provided to the first terminal (a) of the switch 617, and the third bias voltage (Vcc2) input to the third bias pin (P3) can be provided to the second terminal (b) of the switch 617.

[0081] According to an embodiment, switch 617 can supply one of a second bias voltage (Vcc1) input to the first terminal (a) and a third bias voltage (Vcc2) input to the second terminal (b) as a bias voltage for driving the first AMP 613 and the second AMP 615. For example, switch 617 can be implemented such that, without changing the pins included in the module for receiving the bias voltage (Vcc) of the first AMP 613 and the second AMP 615, the pins are connected as one within the module, and then the voltage from the two power supplies (e.g., Vcc1, Vcc2, Vcc2) is supplied via the third terminal (c). Figure 3 The bias voltage of one of the power supplies (first power supply 340 and second power supply 350) is supplied to the first AMP 613 and the second AMP 615.

[0082] According to various embodiments, electronic devices (e.g., Figure 1 The electronic device 101 may include a wireless communication circuit (e.g., Figure 2 RFIC 220), switches (e.g., Figure 3 The switch 360), and the first power amplifier (e.g., Figure 3 The transmitting module 320), wherein the switch is made by using multiple power supplies (e.g., Figure 3 The first power supply 340 and the second power supply 350) input at least two bias voltages (e.g., the second bias voltage (OUT) 12 )345 and the third bias voltage (OUT) 21 )353) as its input and one of the two bias voltages (e.g., Figure 3 The fifth bias voltage 361) is used as its output to perform switching; the first power amplifier is electrically connected to the wireless communication circuit and is included in at least one first transmission chain in a plurality of transmission chains, and is switched by a bias voltage (e.g., from the switch) supplied from the switch. Figure 3 The fifth bias voltage 361) amplifies the radio frequency signal used for transmission (e.g., Figure 3 The second RF signal (RF_in#2) 321).

[0083] According to various embodiments, the switch may be located on an integrated circuit including a first power amplifier (e.g., Figure 6 In PAM 610).

[0084] According to various embodiments, the electronic device may also include: a first power supply (e.g., Figure 3 First power supply 340) and second power supply (e.g., Figure 3 The first power supply 350), wherein the first power supply is based on a first envelope detection signal obtained by envelope tracking of a radio frequency signal (e.g., Figure 3 The first envelope detection signal (ET_DAC#1) 341) is used to supply a first bias voltage (e.g., a second bias voltage (OUT)) as one of at least two bias voltages. 12 )345); The second power supply is based on a second envelope detection signal obtained by envelope tracking of the radio frequency signal (e.g., Figure 3 The second envelope detection signal (ET_DAC#2) 351) is used to supply the second bias voltage (the fourth bias voltage (OUT) as another of at least two bias voltages) 22 )355).

[0085] According to various embodiments, the electronic device may include: a second power amplifier (e.g., Figure 3 The first transmitting module 310) and the third power amplifier (e.g., Figure 3 The third transmitting module 330), wherein the second power amplifier is included in a second transmitting chain as one of a plurality of transmitting chains, and is transmitted via a bias voltage supplied from the first power supply (e.g., the first bias voltage (OUT)). 11 )343) Amplify the radio frequency signal used for transmission (e.g., Figure 3 The first RF signal (RF_in#1) 311); the third power amplifier is included in the third transmission chain as one of multiple transmission chains, and is supplied with a bias voltage (e.g., a fourth bias voltage (OUT)) from the second power supply. 22 )355) Amplify the radio frequency signal used for transmission (e.g., the third RF signal (RF_in#3)331).

[0086] According to various embodiments, the switch, the first power supply, the second power supply, and the first to third power amplifiers may be located on a single printed circuit board (e.g., Figure 3 (See attached figure 300).

[0087] According to various embodiments, one of the first power supply and the second power supply may be an envelope tracking modulator, and the other of the first power supply and the second power supply may be an envelope tracking modulator or an average power tracker.

[0088] According to various embodiments, the first power amplifier can be shared for dual transmission to a heterogeneous network.

[0089] According to various embodiments, the first power amplifier may be a series-coupled drive amplifier (e.g., Figure 6 The first AMP 613) and the main amplifier (e.g., Figure 6 The second AMP (615) is composed of bias voltage supplied from the switch, which can be supplied to the drive amplifier and the main amplifier.

[0090] According to various embodiments, electronic devices (e.g., Figure 1 The electronic device 101 may include at least one processor (e.g., Figure 2 At least one processor 210), and a radio frequency integrated circuit (RFIC) for upconverting a baseband signal provided by at least one processor into a radio frequency signal (e.g., Figure 2 RFIC 220), and a front-end module (e.g., for transmitting up-converted radio frequency signals from the RFIC via multiple antennas (e.g., multiple antennas 240-1, 240-2...240-k). Figure 2 The FEM 230). The front-end module may include: a first power supply (e.g., Figure 3 The first power supply 340) is based on a first envelope detection signal provided by at least one processor (e.g., Figure 3 The first envelope detection signal (ET_DAC#1) 341) is used to supply the first bias voltage and the second bias voltage (e.g., Figure 3 First bias voltage and second bias voltage (OUT) 11 and OUT 12 )343 and 345); second power supply (e.g., Figure 3 The second power supply 350), based on a second envelope detection signal provided by at least one processor (e.g., Figure 3 The second envelope detection signal (ET_DAC#2) 351) is used to supply the third bias voltage and the fourth bias voltage (e.g., Figure 3 The third bias voltage and the fourth bias voltage (OUT) 21 and OUT 22 )353 and 355); switches (e.g., Figure 3 The switching circuit 360) uses a second bias voltage (e.g., Figure 3 The second bias voltage (OUT) 12 )345) and the third bias voltage (e.g., Figure 3 The third bias voltage (OUT) 21 )353) as its input, and one of the second and third bias voltages as the output as the fifth bias voltage (e.g., Figure 3 The fifth bias voltage 361); the first transmitting module (e.g., Figure 3The first transmitting module 310 is used to transmit a first bias voltage (e.g., from a first power supply) by using a first bias voltage output from a first power supply. Figure 3 First bias voltage (OUT) 11 )343) to amplify the radio frequency signal upconverted by the RFIC (e.g., the first RF signal (RF_in#1) 311); the second transmitting module (e.g., Figure 3 The second transmitting module 320 is used to amplify the radio frequency signal (e.g., the second RF signal (RF_in#2) 321) up-converted by the RFIC by using a fifth bias voltage output from the switch; and the third transmitting module (e.g., Figure 3 The third transmitting module 330 is used to transmit a fourth bias voltage (e.g., output from the second power supply) by using the fourth bias voltage (e.g., Figure 3 The fourth bias voltage (OUT) 22 (355) to amplify the radio frequency signal upconverted by the RFIC (e.g., the third RF signal (RF_in#3) 331).

[0091] According to various embodiments, the switch may be located on an integrated circuit including a second transmitting module (e.g., Figure 6 In PAM610).

[0092] According to various embodiments, the first to third transmitting modules may include a power amplifier driven by a bias voltage output from a first power supply, a second power supply, or a switch.

[0093] According to various embodiments, the power amplifier consists of a series-coupled drive amplifier (e.g., Figure 6 The first AMP613) and the main amplifier (e.g., Figure 6 The second AMP (615) is composed of bias voltages output from the first power supply, the second power supply, or the switch, which can be supplied to the drive amplifier and the main amplifier.

[0094] According to various embodiments, one of the first power supply and the second power supply may be an envelope tracking modulator, and the other of the first power supply and the second power supply may be either an envelope tracking modulator or an average power tracker.

[0095] According to various embodiments, electronic devices (e.g., Figure 1 The electronic device 101 may include: a wireless communication circuit (e.g., Figure 2 RFIC 220); First power supply (e.g., Figure 3 The first power supply 340 supplies a first bias voltage (e.g., a second bias voltage (OUT)). 12 )345); Second power supply (e.g., Figure 3The second power supply 350 supplies a second bias voltage (e.g., a third bias voltage (OUT)). 21 )353); switch (e.g., Figure 3 The switching circuit 360 uses a first bias voltage supplied from a first power supply and a second bias voltage supplied from a second power supply as its inputs, and supplies one of the first bias voltage and the second bias voltage as a third bias voltage (e.g., Figure 3 The fifth bias voltage 361); the first power amplifier (e.g., Figure 3 The second transmitting module 320 is included in at least one first transmitting chain of a plurality of transmitting chains, and amplifies the radio frequency signal (e.g., by means of a third bias voltage supplied from a switch). Figure 3 The second radio frequency signal (RF_in#2); and the antenna (e.g., Figure 3 Ant_2), outputs a radio frequency signal amplified by a power amplifier (e.g., Figure 3 RF signal 323).

[0096] According to various embodiments, the switch may be located in an integrated circuit including a power amplifier (e.g., Figure 6 In PAM610).

[0097] According to various embodiments, the electronic device may include: a second power amplifier (e.g., Figure 3 The first transmitting module 310 is included in a second transmitting chain as one of a plurality of transmitting chains, and is transmitted via a fourth bias voltage (e.g., the first bias voltage (OUT)) supplied from the first power supply. 11 )343) Amplify radio frequency signals (e.g., Figure 3 The first RF signal (RF_in#1) 311); and the third power amplifier (e.g., Figure 3 The third transmitting module 330 is included in a third transmitting chain as one of a plurality of transmitting chains, and is transmitted via a fifth bias voltage (e.g., a fourth bias voltage (OUT)) supplied from the second power supply. 22 )355) Amplify radio frequency signals (e.g., Figure 3 The third RF signal (RF_in#3) 331).

[0098] According to various embodiments, the switch, the first power supply, the second power supply, and the first to third power amplifiers may be located on a single printed circuit board. Figure 3 (See attached figure 300).

[0099] According to various embodiments, one of the first power supply and the second power supply may be an envelope tracking modulator, and the other of the first power supply and the second power supply may be either an envelope tracking modulator or an average power tracker.

[0100] According to various embodiments, the first power amplifier can be shared for dual transmission to a heterogeneous network.

[0101] According to various embodiments, the first power amplifier may be a series-coupled drive amplifier (e.g., Figure 6 The first AMP 613) and the main amplifier (e.g., Figure 6 The second AMP (615) is composed of a third bias voltage supplied from the switch, which can be supplied to the drive amplifier and the main amplifier.

[0102] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0103] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and is used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0104] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0105] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0106] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device comprising: Wireless communication circuits; The first power supply is configured to supply a first bias voltage and a second bias voltage; The second power supply is configured to supply the third bias voltage; A switch is configured to select one of at least two bias voltages and output the selected bias voltage to a common output of the switch, the at least two bias voltages including a second bias voltage and a third bias voltage that are input as inputs to the switch. A first power amplifier is electrically connected to the wireless communication circuit and a first power supply, and is included in a first RF transmission chain among a plurality of RF transmission chains, and the first power amplifier is configured to amplify a first RF signal for transmission based on a first bias voltage supplied from the first power supply. A second power amplifier is electrically connected to the wireless communication circuit and is included in a second RF transmission chain of the plurality of RF transmission chains, and the second power amplifier is configured to amplify a second radio frequency signal for transmission based on a selected bias voltage of the at least two bias voltages supplied through the common output of the switch.

2. The electronic device according to claim 1, wherein, The switch is incorporated in an integrated circuit that includes a second power amplifier.

3. The electronic device according to claim 1, comprising: A third power amplifier is electrically connected to the wireless communication circuit and the second power supply, and is included in the third RF transmission chain of the plurality of RF transmission chains, and the third power amplifier is configured to amplify the third radio frequency signal for transmission based on a third bias voltage supplied from the second power supply.

4. The electronic device according to claim 3, wherein, The second frequency of the second radio frequency signal is higher than the first frequency of the first radio frequency signal.

5. The electronic device according to claim 4, wherein, The second frequency of the second radio frequency signal is lower than the third frequency of the third radio frequency signal.

6. The electronic device according to claim 5, wherein, The first radio frequency signal includes a low-frequency band (LB) signal, the second radio frequency signal includes a mid-to-high frequency band (MHB) signal, and the third radio frequency signal includes an ultra-high frequency band (UHB) signal.

7. The electronic device according to claim 1, wherein, A first bias voltage is supplied to a first power amplifier and a selected bias voltage of the at least two bias voltages is supplied to a second power amplifier through the switch, such that the first power amplifier amplifies a first radio frequency signal and the second power amplifier amplifies a second radio frequency signal for carrier aggregation.

8. The electronic device according to claim 7, wherein, The first radio frequency signal amplified by the first power amplifier and the second radio frequency signal amplified by the second power amplifier are transmitted together.

9. The electronic device according to claim 3, wherein, One of the second and third bias voltages is supplied to the second power amplifier via the switch and the third bias voltage is supplied to the third power amplifier, such that the second power amplifier amplifies the second radio frequency signal and the third power amplifier amplifies the third radio frequency signal for carrier aggregation.

10. The electronic device according to claim 9, wherein, The second radio frequency signal, amplified by the second power amplifier, is transmitted together with the third radio frequency signal, amplified by the third power amplifier.

11. The electronic device according to claim 3, wherein, The electronic device also includes: The first antenna is electrically connected to the first power amplifier; The second antenna is electrically connected to the second power amplifier; and The third antenna is electrically connected to the third power amplifier.

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