Method of reducing equipment vibration and semiconductor manufacturing equipment
By attaching weights or mass blocks to semiconductor manufacturing equipment, the problem of decreased production yield caused by low-frequency vibration has been solved, resulting in reduced equipment vibration and production defects, thereby improving the stability and efficiency of semiconductor manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
- Filing Date
- 2023-03-10
- Publication Date
- 2026-07-31
AI Technical Summary
In semiconductor manufacturing, low-frequency vibrations can affect production tools and lead to a decrease in production yield. This is especially true in three-dimensional designs such as multi-gate field-effect transistors and gate full-ring field-effect transistors, where thin film particles can easily fall from the crystal boat and the sidewalls of the cavity onto the wafer, causing defects.
Vibration is reduced by attaching weights or mass blocks to semiconductor manufacturing equipment to increase the weight of the equipment. Metal blocks, metal plates or other materials are used as weights and fixed to the side or floor of the equipment with fasteners. Damping materials are combined to limit the transmission of vibration.
It effectively reduces equipment vibration, lowers the defect rate during thin film deposition, improves production yield, and achieves flexible vibration control through balanced weight distribution and detachable design.
Smart Images
Figure CN116428306B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a semiconductor manufacturing method and apparatus, and more particularly to a semiconductor manufacturing method and apparatus for reducing vibration. Background Technology
[0002] As semiconductor chips evolve towards smaller nanometer dimensions, there is a greater need to isolate unwanted vibration frequencies in manufacturing facility design and operation. Low-frequency vibrations can affect production tools, thereby reducing production yields in semiconductor manufacturing. Challenges arising from manufacturing and design issues have led to the development of three-dimensional designs, such as multi-gate field-effect transistors (FETs), including FinFETs and gate-all-around (GAA) FETs. Summary of the Invention
[0003] According to one aspect of this disclosure, a method for reducing vibration includes: measuring the vibration level in a semiconductor manufacturing apparatus; determining one or more blocks in the semiconductor manufacturing apparatus that vibrate at a level greater than a preset vibration level; and reducing the vibration level of one or more blocks to within or at the preset vibration level by coupling one or more weights to an outer surface of the semiconductor manufacturing apparatus in one or more blocks.
[0004] According to another aspect of this disclosure, a method for reducing vibration includes: attaching a first weight to a first outer surface of a semiconductor manufacturing apparatus; attaching a second weight to a second outer surface of the semiconductor manufacturing apparatus, the second outer surface being opposite to the first outer surface; measuring the vibration level in the portion of the semiconductor manufacturing apparatus having the first weight and the second weight; and increasing the first weight and the second weight when the vibration level is greater than a preset level.
[0005] According to another aspect of this disclosure, a semiconductor manufacturing apparatus includes: a first sidewall, a second sidewall opposite to the first sidewall, and one or more weights. The weights are attached to the first and second sidewalls, wherein the weights are attached at multiple locations on the semiconductor manufacturing apparatus to minimize vibration of the semiconductor manufacturing apparatus at said locations. Attached Figure Description
[0006] The complete disclosure is based on the following detailed description and the accompanying drawings. It should be emphasized that, in accordance with the general practice of the industry, the illustrations are not necessarily drawn to scale and are for illustrative purposes only. In fact, the dimensions of components may be arbitrarily enlarged or reduced for clarity.
[0007] Figure 1A semiconductor manufacturing apparatus according to some embodiments of the present disclosure is shown, including a plurality of weights (or mass blocks) attached to the semiconductor manufacturing apparatus.
[0008] Figure 2 Some embodiments according to this disclosure are shown. Figure 1 The main view of the middle block.
[0009] Figure 3A Some embodiments according to this disclosure are shown. Figure 1 An example arrangement of multiple heavy blocks on a semiconductor manufacturing equipment.
[0010] Figure 3B Show Figure 1 The dimensions of the medium-weight block.
[0011] Figure 4 Show Figure 1 The semiconductor manufacturing equipment is placed on a vibration damping platform.
[0012] Figure 5 To illustrate some embodiments of this disclosure, a graph of vibration reduction in a semiconductor processing facility having several weights of different values attached thereto is shown.
[0013] Figure 6 This is a flowchart illustrating a method for reducing vibration in a semiconductor manufacturing apparatus according to some embodiments of the present disclosure.
[0014] Figure 7 This is a flowchart illustrating a method for reducing vibration in a semiconductor manufacturing apparatus according to some embodiments of the present disclosure.
[0015] The attached figures are labeled as follows:
[0016] 100: Semiconductor manufacturing equipment
[0017] 101-1: Lateral wall
[0018] 101-2: Lateral wall
[0019] 101-3: Lateral wall
[0020] 101-4: Lateral wall
[0021] 102: Heavy Block
[0022] 102-1: Heavy Block
[0023] 102-2: Heavy Block
[0024] 102-3: Heavy Block
[0025] 102-4: Heavy Block
[0026] 105: Graphical User Interface
[0027] 107: Attachment
[0028] 111: Horizontal section
[0029] 113: Vertical section
[0030] 115: Interconnection Section
[0031] 151: Extension
[0032] 181: Vibration Suppression Platform
[0033] 185: Ground
[0034] 187: Upper surface
[0035] 600: Method
[0036] 700: Method
[0037] H: Distance (Height)
[0038] L: Length
[0039] L1: Length
[0040] L2: Length
[0041] L3: Length
[0042] S610: Operation
[0043] S620: Operation
[0044] S630: Operation
[0045] S710: Operation
[0046] S720: Operation
[0047] S730: Operation
[0048] S740: Operation
[0049] W: Width
[0050] W1: Width
[0051] W2: Width (Distance)
[0052] W3: Width Detailed Implementation
[0053] The following disclosure provides many different embodiments or examples to implement various features of the invention. The following disclosure describes specific examples of the various components and their arrangements for simplification. Of course, these specific examples are not intended to be limiting. For example, the dimensions of the components are not limited to the disclosed range or values, but may be determined depending on the process conditions and / or the required nature of the apparatus. Furthermore, if this disclosure describes a first feature formed on or above a second feature, it indicates that it may include embodiments where the first and second features are in direct contact, or embodiments where additional features are formed between the first and second features, so that the first and second features may not be in direct contact. For simplification and clarity, various features may be drawn arbitrarily at different scales.
[0054] Furthermore, spatially related terms, such as “below,” “below,” “lower,” “above,” “higher,” and similar terms, are used to facilitate the description of the relationship between one element or feature and another element(s) in the figures. In addition to the orientations shown in the figures, these spatially related terms are intended to encompass different orientations of the device in use or operation. The device may be rotated to different orientations (rotated 90 degrees or other orientations), and the spatially related terms used herein may be interpreted in the same way. Furthermore, the phrase “made of” may mean “comprising” or “consisting of.” Unless otherwise stated, in this disclosure, the phrase “one of A, B, and C” means “A, B, and / or C” (A, B, C, A and B, A and C, B and C, or A and B and C), and does not mean an element of A, an element of B, and an element of C.
[0055] As the semiconductor industry has advanced to nanometer technology process nodes in pursuit of higher device density, higher performance, and lower costs, vibration control to mitigate the impact of vibrations on semiconductor manufacturing equipment has become crucial. Low-frequency vibrations can affect production tools, such as lithography tools, thin-film deposition tools, and furnace equipment, thereby reducing production yields in semiconductor manufacturing. Low-frequency vibrations propagate through the floor structures of buildings and cleanrooms due to personnel moving through or operating equipment, oscillating pumps, compressors, coolers, and air handling units (AHUs), or natural phenomena such as earthquakes, tornadoes, or hurricanes. Vibration can affect the quality of the semiconductor devices being manufactured. For example, in thin-film deposition processes, thin-film particles are deposited not only on the semiconductor substrate but also on the wafer boats that carry the wafers and the sidewalls of the chambers. When equipment vibrates / shakes, thin-film particles deposited on the wafer boats and chamber sidewalls may fall onto the wafer, resulting in defects such as pits, bumps, and line defects.
[0056] Embodiments of this disclosure relate to semiconductor manufacturing equipment and similar high-precision processing equipment, and more specifically to systems and methods for reducing vibration in semiconductor manufacturing equipment, etc. According to embodiments of this disclosure, vibration reduction can be achieved by attaching (or coupling) weights (or masses) to the semiconductor manufacturing equipment to increase its weight (or mass), such as a furnace for thin film deposition or other types of semiconductor manufacturing equipment. Increasing the weight (or mass) of the equipment makes it less susceptible to vibration and reduces defects in the semiconductor device being manufactured. The attached weights (or masses) can be or include blocks of metal (e.g., iron), metal plates, metal rods, etc. In some embodiments, the weights are attached to the semiconductor manufacturing equipment using fasteners (screws, bolts, studs, pins, nails, anchors, rivets, hooks, magnets, etc.). In some embodiments, the weights or masses are anchors used to secure the equipment to the floor or gratings of a cleanroom. The weights are attached to the semiconductor manufacturing equipment at any desired location, such as on the side of the equipment. In some embodiments, a damping material (e.g., a rubber pad, neoprene pad, etc.) is disposed between the weight and the semiconductor manufacturing equipment. The damping material preferably secures the weight to the semiconductor manufacturing equipment and limits the transmission of vibrations from the semiconductor manufacturing equipment to the weight, thereby limiting the vibration (rattling) of the weight.
[0057] For the purposes of this discussion, "vibrations" refers to unintended, unproductive vibrations in semiconductor manufacturing equipment that can lead to errors in the manufacturing process.
[0058] In some embodiments, the weights are attached in a removable manner, allowing them to be easily removed (detached or detached) from the semiconductor manufacturing equipment. For example, the weights are attached using screws, hooks, or other easily removable fasteners, enabling easy and relatively quick removal. The weights can be completely removed or replaced with heavier or lighter weights as needed. It should be understood that the weights (or mass blocks) added (attached) to the semiconductor manufacturing equipment are not limited to metal weights or weights of any particular shape. Weights (or mass blocks) of any material and shape can be used, as long as the weight reduces vibration to the desired level. It should also be noted that a weight is considered removably attached when it can be removed from the equipment without damaging the fasteners holding it or without causing damage to the weight and / or the equipment. Therefore, weights that are screwed on and unscrewed or attached using magnets are considered removably attached compared to weights attached using rivets, as cutting (breaking) the rivets is required to remove the weight.
[0059] In some embodiments, the shape and size (or other configuration) of the weights (mass blocks) eliminate the need to remove counterweights already attached to the semiconductor manufacturing equipment to increase its weight. For example, the attached weights may include attachment parts (hooks, rods, etc.) for attaching additional counterweights. In other cases, the weights are shaped like plates (or similar shapes) or otherwise have surfaces on which additional weights can be placed (or stacked) to increase the overall weight of the semiconductor manufacturing equipment. Similarly, the added weight can be removed to reduce the overall weight of the semiconductor manufacturing equipment. This addition and removal of weight also facilitates relatively easy adjustment of the weight distribution on the semiconductor manufacturing equipment.
[0060] In some embodiments, an additional weight (or mass block) is attached to the semiconductor manufacturing apparatus such that the additional weight does not contact the floor on which the semiconductor manufacturing apparatus is placed. As a result, the entire weight of the additional weight is added to the semiconductor manufacturing apparatus. Conversely, when the additional weight contacts (rests) the floor, the weight on the semiconductor manufacturing apparatus is reduced. In some embodiments, the semiconductor manufacturing apparatus is placed on a vibration damping platform located on the floor of the facility where the semiconductor manufacturing apparatus is located. It should be noted that, for ease of explanation, the embodiments of this disclosure are described using a semiconductor manufacturing apparatus as an example. However, the embodiments are not limited to semiconductor manufacturing apparatus, and without departing from the spirit and scope of this disclosure, the embodiments of this disclosure can be applied to reduce vibration in any device, tool, or machine.
[0061] Figure 1 A semiconductor manufacturing apparatus 100 according to some embodiments of the present disclosure is shown, including a plurality of weights (or mass blocks) attached to the semiconductor manufacturing apparatus 100. As an example, Figure 1A furnace for manufacturing semiconductor devices is shown. As shown, a plurality of weights 102-1, 102-2, 102-3, and 102-4 (collectively referred to as weights 102) are attached to opposing side walls of a semiconductor manufacturing apparatus 100. For example, weights 102-1 and 102-2 are attached to the outer surfaces of opposing side walls 101-1 and 101-2, facing away from each other. Weights 102-3 and 102-4 are attached to the outer surfaces of opposing side walls 101-3 and 101-4, facing each other. Alternatively, in some embodiments, weights 102-3 and 102-4 are attached to side walls 101-1 and 101-2 instead of side walls 101-3 and 101-4, facing opposite directions. In other embodiments, in addition to weights 102-3 and 102-4 being attached to opposing side walls 101-3 and 101-4, additional weights are also attached to opposing side walls 101-1 and 101-2. It should be noted that these additional weights are spaced apart from weights 102-1 and 102-2. It should also be noted that the number of weights 102 is not limited in any way. The number of weights 102 can be increased or decreased depending on the application and design, as long as the weights used reduce vibration in the semiconductor manufacturing equipment 100 to the required level.
[0062] The weight 102 is attached to the surface of the ground 185 at a specific vertical distance H (space or gap), and the semiconductor manufacturing equipment 100 is positioned on the surface of the ground 185. In some embodiments, the distance H is determined based on the position of the semiconductor substrate in the semiconductor manufacturing equipment 100. For example, the distance H is set such that the weight 102 is close to the path of the semiconductor substrate conveyed through different stages of the semiconductor manufacturing equipment 100 and / or the position of the semiconductor substrate in the semiconductor manufacturing equipment 100 before or after processing.
[0063] In some embodiments, the weight 102 is attached to the semiconductor manufacturing equipment 100 using fasteners (screws, bolts, studs, pins, nails, anchors, rivets, hooks, magnets, etc.). In some embodiments, the weight 102 is a shock-absorbing fastener designed to limit self-loosening caused by vibration. The shock-absorbing fastener includes hexagonal nuts with nylon inserts, locking nuts, lock nuts, slotted hexagonal nuts, toothed lock washers, locking washers, and spring washers.
[0064] The attached weights 102 balance the weight distribution on the semiconductor manufacturing equipment 100. One way to balance the weight distribution is to position the weights 102 at the same location on opposite side walls. In some embodiments, the weights on opposite side walls are attached exactly opposite each other, or offset from each other within a required margin (e.g., + / - 1 to 10 cm). For example, opposite weights 102-1 and 102-2 are attached to corresponding opposite side walls 101-1 and 101-2 at the same height from the ground surface and at the same distance from the edges (ends) of side walls 101-1 and 101-2. Similarly, opposite weights 102-3 and 102-4 are attached to corresponding opposite side walls 101-3 and 101-4 at the same height from the ground surface and at the same distance from the edges (ends) of side walls 101-1 and 101-4. The attached weight 102 also has the same weight, resulting in a balanced weight distribution. For example, weights 102-1 and 102-2 each weigh between 10 kg and 100 kg.
[0065] In some embodiments, the opposing weights 102-1 and 102-2 are attached such that the interval between weights 102-1 and 102-2 is minimized, and weights 102-1 and 102-2 are symmetrically attached to improve the balance of weight distribution. Therefore, as an example, refer to... Figure 1 To minimize the gap between weights 102-1 and 102-2, weights 102-1 and 102-2 are spaced apart in the width W direction, rather than longitudinally (in the length L direction). However, in other embodiments, the length L of the semiconductor manufacturing apparatus 100 may be shorter than the width W. In this case, to minimize the gap between weights 102-1 and 102-2, weights 102-1 and 102-2 are spaced apart in the length L direction. For similar reasons, opposing weights 102-3 and 102-4 are spaced apart in the width W direction.
[0066] Compared to other steps in the semiconductor manufacturing process, certain steps or sub-processes are more sensitive (or susceptible) to vibrations in semiconductor manufacturing equipment. In other words, it is desirable to mitigate vibrations during certain steps or sub-processes of the semiconductor manufacturing process compared to other steps. For example, in thin film deposition processes (e.g., physical vapor deposition (PVD), chemical vapor deposition (CVD), solution deposition, and atomic layer deposition (ALD)), vibrations during the loading / unloading of the wafer boat into or from the chamber can cause thin film particles to fall from the wafer boat and chamber sidewalls onto the semiconductor substrate. In this case, the heavy particles will be attached to or near (e.g., within 1 cm to 10 cm) the area of the thin film deposition equipment where the wafer boat loading / unloading occurs. Therefore, refer to... Figure 1 Weights 102-1 and 102-2 are attached to the blocks of the semiconductor manufacturing equipment 100 where more vibration-sensitive steps or sub-processes occur.
[0067] Heavy blocks are also attached to or near the areas where users interact with semiconductor manufacturing equipment. For example, see... Figure 1 The semiconductor manufacturing equipment 100 includes a graphical user interface (GUI) 105 located on side walls 101-4 for controlling the operation of the semiconductor manufacturing equipment 100. The area around the GUI 105 experiences high foot traffic due to increased operator movement. Weights 102-4 are used to mitigate vibrations caused by the high foot traffic.
[0068] In some embodiments, the weight on a semiconductor manufacturing apparatus can be increased by increasing the number (value) of weights attached to the semiconductor manufacturing apparatus. In this embodiment, the size and shape (or other configuration) of the weights attached to the semiconductor manufacturing apparatus allow additional weights to be stacked on top of them.
[0069] Reference Figure 2 And continue to refer to Figure 1 The diagram shows a front view of weight 102-1, including a vertical portion 113 attached to a side wall 101-1 and a horizontal portion 111 extending outward from the vertical portion 113. The vertical portion 113 and the horizontal portion 111 are connected to each other via a plurality of interconnecting portions 115. Weight 102-1 also includes a plurality of attachment portions 107 for attaching additional weights to weight 102-1. Figure 2In this configuration, the attachment portion 107 includes an X-shaped through-hole. An additional weight to be placed on the weight block 102-1 has an X-shaped protrusion, which is received in the attachment portion 107 to securely position the additional weight on the weight block 102-1. To increase the weight on the semiconductor manufacturing apparatus 100, the additional weight can be placed on the horizontal portion 111. The weight block 102-1 also includes interconnections 115 between multiple adjacent attachment portions 107 to provide lateral support for the additional weight. In one example, the additional weight is plate-shaped and can be stacked on the horizontal portion 111. In another example, the additional weight is a spherical object placed on the horizontal portion 111.
[0070] One or more of the other weights 102-2, 102-3, and 102-4 may also be similar in shape to weight 102-1. It should be understood that the shape and size of weight 102 are merely exemplary, and weight 102 may have any desired shape and size, as long as weight 102 can support additional weights used to increase the total weight of the semiconductor manufacturing equipment (acting as a platform for the additional weights).
[0071] Therefore, increasing the weight of the semiconductor manufacturing equipment 100 by adding additional weights to the existing weight block 102 is relatively easy, without having to dismantle the existing weight block and add a new, heavier one. Similarly, the additional weights can also be removed relatively easily.
[0072] Reference Figure 3A And continue to refer to Figure 1 and Figure 2 The diagram illustrates an exemplary arrangement of a plurality of weights 102 on a semiconductor manufacturing apparatus 100 according to some embodiments of the present disclosure. The semiconductor manufacturing apparatus 100 has a length L of approximately 460 cm and a width W of approximately 110 cm. Weights 102-1 have a length L2 of approximately 50 cm to 100 cm and are spaced apart from the longitudinal ends of the semiconductor manufacturing apparatus 100. Weights 102-1 are spaced apart from a proximal end by a length L1 of approximately 180 cm to 230 cm and from a distal end by a length L3 of approximately 180 cm to 230 cm. (Refer to...) Figure 3B The vertical portion 113 of the weight 102-1 has a height H of about 10 cm to 50 cm, and the horizontal portion 111 has a width W of about 10 cm to 30 cm.
[0073] As shown in the figure, because the relatively vibration-sensitive semiconductor device process step (sub-process) occurs in the generally central portion of the semiconductor manufacturing equipment 100, weight 102-1 is attached to the generally central portion of the semiconductor manufacturing equipment 100. If the vibration-sensitive process step occurs in other parts of the semiconductor manufacturing equipment 100, weight 102-1 may be located at or near these parts. Similarly, it should be understood that if the vibration-sensitive process occurs in more than one part of the semiconductor manufacturing equipment 100, multiple weights may be attached to some of the owners or owners of these parts. However, it should be noted that the position of the weight is not limited to any particular location, and the weight can be placed anywhere on the semiconductor manufacturing equipment as desired to achieve the desired vibration reduction. One or more of the other weights 102-2, 102-3, and 102-4 are also similar in shape to weight 102-1. It should be understood that the shape and size of weight 102 are merely exemplary, and weight 102 can have any shape and size required for any application and design to reduce vibration to the desired level.
[0074] In one embodiment, the weight 102 has a weight value of approximately 30 kg to 80 kg. However, the weight value is not limited to this. In some other embodiments, the weight value is approximately 20 kg to 90 kg, or 10 kg to 100 kg. The lower limit of the weight value is determined based on the vibration reduction obtained when using the weight. A low weight value may not provide sufficient vibration reduction required for relatively heavy semiconductor manufacturing equipment. Therefore, the weight may have a minimum lower limit of weight. The lower limit of the weight value is also determined based on the weight value of any additional weight that can be placed on top of the attached weight. A weight with a lower weight value may have a lower load-bearing capacity and may be damaged by a heavier additional weight placed on top of the attached weight.
[0075] The upper limit of the weight value is determined based on how securely the weight can be attached to the semiconductor manufacturing equipment and the load-bearing capacity of the ground on which the semiconductor manufacturing equipment is placed. Attaching heavy weights to semiconductor manufacturing equipment can be difficult, or there is a risk that the weights may detach from the semiconductor manufacturing equipment and cause damage to the equipment and the ground.
[0076] Semiconductor manufacturing equipment 100 includes a plurality of extensions 151 extending longitudinally from the body of semiconductor manufacturing equipment 100. In the illustrated embodiment, as described above, one of the extensions 151 (see...) Figure 1The device includes a graphical user interface 105; however, both extensions may include a graphical user interface. Weights 102-3 and 102-4 are respectively attached to side walls 101-3 and 101-4 to reduce vibration caused by operator actions using the graphical user interface 105. In one example, as shown, the widths W1 and W3 of the extension 151 are approximately 20 cm, and the distance W2 between side walls 101-3 and 101-4 is approximately 70 cm. In one embodiment, weights 102-3 and 102-4 have a height H of approximately 10 cm to 50 cm, a width W of approximately 10 cm to 20 cm, and a length of approximately 100 cm to 120 cm. The shape and size of weights 102-3 and 102-4 are chosen so that the operator can occupy the gap between the extensions 151. In one embodiment, weights 102-3 and 102-4 have a weight value of approximately 30 kg to 80 kg. However, the weight value is not limited to this. In some other embodiments, the weight value is approximately 20 kg to 90 kg, or 10 kg to 100 kg. The lower limit of the weight value is determined based on the vibration reduction obtained when using the weights. A low weight value may not provide sufficient vibration reduction required for relatively heavy semiconductor manufacturing equipment. Therefore, the weights may have a minimum lower limit of weight. The lower limit of the weight value is also determined based on the weight value of any additional weights that can be placed on top of the attached weights. Weights with lower weight values may have lower load-bearing capacity and may be damaged by heavier additional weights placed on top of the attached weights.
[0077] The upper limit of the weight value is determined based on how securely the weight can be attached to the semiconductor manufacturing equipment and the load-bearing capacity of the ground on which the semiconductor manufacturing equipment is placed. Attaching heavy weights to semiconductor manufacturing equipment can be difficult, or there is a risk that the weights may detach from the semiconductor manufacturing equipment and cause damage to the equipment and the ground.
[0078] The shapes of weights 102-3 and 102-4 are similar to Figure 3B The illustrated weight 102-1 is similar in length, width, and height. In some embodiments, for example, when the extension 151 is absent, weights 102-3 and 102-4 are omitted. In other embodiments, even if the extension 151 is present, weights 102-3 and 102-4 are omitted. In other embodiments, the semiconductor manufacturing apparatus 100 includes only one extension 151 having weight 102-3 (or weight 102-4).
[0079] In some embodiments, the semiconductor manufacturing equipment 100 is placed on an anti-vibration platform. The anti-vibration platform is used to mitigate large vibrations, such as those caused by an earthquake, but can increase small vibrations of the equipment during operation (e.g., handling wafers). A weight 102 can mitigate vibrations caused by an earthquake and also reduce small vibrations caused by the operation of the semiconductor manufacturing equipment 100. In some embodiments, the weight 102 is attached to the semiconductor manufacturing equipment 100 between the base of the semiconductor manufacturing equipment 100 and the upper surface of the anti-vibration platform. In one embodiment, the weight 102 is spaced apart from the upper surface of the anti-vibration platform and the ground. Figure 4 The semiconductor manufacturing equipment 100 is shown to be fixed to the vibration damping platform 181, and the weight 102 is spaced apart from the upper surface 187 of the vibration damping platform 181 and the ground 185 (the upper surface of the ground 185 of the clean room where the semiconductor manufacturing equipment 100 is located).
[0080] Figure 5 To illustrate some embodiments of this disclosure, graphs are shown showing the changes in vibration in a semiconductor processing facility when weights of varying values are attached to it. For discussion purposes, the semiconductor processing facility is conceived as a thin-film deposition apparatus or a furnace, and the vibrations are measured during the loading and / or unloading of a crystal boat. Vibrations at or near the loading / unloading point of the crystal boat are measured both when weights are absent and when weights of varying weights are present. At point A, no weight is attached to the thin-film deposition apparatus, and as shown, the vibration is greatest during loading (or unloading) of the crystal boat, approximately 0.25 mm / min. At points B, C, and D, increasingly heavier weights (30 kg, 60 kg, and 80 kg, respectively) are attached to the semiconductor processing facility. As shown, the vibrations significantly decrease to approximately 0.12 mm / min, 0.1 mm / min, and 0.08 mm / min, respectively, during loading and / or unloading of the crystal boat. At point E, the crystal boat is loaded into the thin-film deposition apparatus, and an 80 kg weight is attached to the thin-film deposition apparatus. As shown, the vibration is minimal, approximately 0.052 mm per minute. Therefore, it is observed that increasing the weight substantially reduces the vibration in the thin film deposition equipment from approximately 0.25 mm per minute to approximately 0.052 mm per minute. For example, an auto vibration system (AVS) or other types of vibration meters can be used to measure (test) the vibration.
[0081] In one method of reducing vibration in a semiconductor manufacturing apparatus using a weight 102, initially, the vibration is measured when the weight is absent and the desired operation is performed using the semiconductor manufacturing apparatus. In some embodiments, vibration is measured at multiple locations within the semiconductor manufacturing apparatus during operation. In other embodiments, vibration is measured at locations within the semiconductor manufacturing apparatus where processes more susceptible to vibration occur. For example, in a thin-film deposition apparatus, vibration is measured at or near a loading / unloading location of a wafer carrier, and during loading / unloading of the wafer carrier. After measuring the vibration, a weight is attached to the desired location within the semiconductor manufacturing apparatus, and the vibration is measured again. If the vibration exceeds an acceptable level, a weight is added. As described in other paragraphs herein, the previously attached weight is removed and replaced with a heavier weight, or the additional weight is placed on top of an existing weight. The vibration is measured again to ensure it is at or below an acceptable level. If the vibration exceeds an acceptable level, a further weight is added. When the vibration level is at or below an acceptable level, the operation is performed using the semiconductor manufacturing apparatus.
[0082] The embodiments of this disclosure advantageously reduce equipment vibration, and the equipment can become more stable due to the reduced vibration. Reduced vibration also reduces defects and / or other manufacturing errors. It should be understood that not all advantages need to be discussed herein, all embodiments or examples are not required to have specific advantages, and other embodiments or examples may provide different advantages.
[0083] One embodiment of this disclosure is a method 600 for reducing vibration in a semiconductor manufacturing apparatus, according to... Figure 6 The flowchart is shown. It should be understood that additional operations can be provided in... Figure 6 Before, during, or after the processes discussed, and for additional embodiments of this method, some of the operations described below may be replaced or removed. The order of operations / processes may be interchangeable, and at least some operations / processes may be performed in different sequences. At least two or more operations / processes may be performed concurrently or nearly simultaneously.
[0084] The method includes an operation S610, measuring the vibration level in a semiconductor manufacturing apparatus. In operation S620, determining one or more blocks in the semiconductor manufacturing apparatus that are vibrating at a level greater than a preset vibration level. In operation S630, reducing the vibration level of one or more blocks to within a preset vibration level by coupling one or more weights to an outer surface of one or more blocks of the semiconductor manufacturing apparatus.
[0085] One embodiment of this disclosure is a method 700 for reducing vibration in a semiconductor manufacturing apparatus, according to... Figure 7 The flowchart is shown. It should be understood that additional operations can be provided in... Figure 7Before, during, or after the processes discussed, and for additional embodiments of this method, some of the operations described below may be replaced or removed. The order of operations / processes may be interchangeable, and at least some operations / processes may be performed in different sequences. At least two or more operations / processes may be performed concurrently or nearly simultaneously.
[0086] The method includes an operation S710, in which a first weight is attached to a first outer surface of a semiconductor manufacturing apparatus. In operation S720, a second weight is attached to a second outer surface of the semiconductor manufacturing apparatus, the second outer surface being opposite to the first outer surface. In operation S730, the vibration level in the portion of the semiconductor manufacturing apparatus having the first and second weights is measured. In operation S740, when the vibration level exceeds a preset level, the first and second weights are added.
[0087] According to one aspect of this disclosure, a method for reducing vibration includes: measuring the vibration level in a semiconductor manufacturing apparatus; determining one or more blocks in the semiconductor manufacturing apparatus that vibrate at a level greater than a preset vibration level; and reducing the vibration level of the one or more blocks to at or below the preset vibration level by coupling one or more weights to an outer surface of the semiconductor manufacturing apparatus in the one or more blocks. In some embodiments, the one or more weights are spaced apart from a ground surface, and the semiconductor manufacturing apparatus is positioned on the ground surface. In some embodiments, the multiple weights are coupled to the semiconductor manufacturing apparatus, the multiple weights are coupled to multiple opposing side walls of the semiconductor manufacturing apparatus, and each weight is coupled opposite to another weight. In some embodiments, the weights coupled to the opposing side walls face each other. In some embodiments, the weights coupled to the opposing side walls face away from each other. In some embodiments, the method further includes: increasing the total amount of weights attached to the semiconductor manufacturing apparatus by coupling additional multiple weights to the weights already coupled to the semiconductor manufacturing apparatus. In some embodiments, the multiple weights are coupled to the semiconductor manufacturing apparatus, and each weight has the same weight value. In some embodiments, the semiconductor manufacturing equipment is placed on a vibration damping platform, which is placed on a ground surface, and the method includes coupling one or more weights between a base of the semiconductor manufacturing equipment and an upper surface of the vibration damping platform. In some embodiments, the weights are spaced apart from the upper surface of the vibration damping platform and the ground surface.
[0088] According to another aspect of this disclosure, a method for reducing vibration includes: attaching a first weight to a first outer surface of a semiconductor manufacturing apparatus; attaching a second weight to a second outer surface of the semiconductor manufacturing apparatus, the second outer surface being opposite to the first outer surface; measuring the vibration level in the portion of the semiconductor manufacturing apparatus having the first and second weights; and increasing the first and second weights when the vibration level is greater than a preset level. In some embodiments, the first weight is attached precisely opposite to the second weight. In some embodiments, the method further includes: attaching a third weight to the first outer surface and a fourth weight to the second outer surface to reduce the vibration level to less than or equal to a preset level. In some embodiments, a plurality of weights are attached to the first and second outer surfaces, the plurality of weights including the first and second weights; and the number of weights attached to the first and second outer surfaces is the same. In some embodiments, each weight on the first outer surface has a corresponding weight on the second outer surface, and they are attached precisely opposite to each other. In some embodiments, the first and second weights are attached to a ground surface spaced apart, and the semiconductor manufacturing apparatus is positioned on the ground surface. In some embodiments, adding a first weight and a second weight includes coupling an additional plurality of weights to each of the first weight and the second weight. In some embodiments, the first weight and the second weight have the same weight value.
[0089] According to another aspect of this disclosure, a semiconductor manufacturing apparatus includes: a first side wall, a second side wall opposite to the first side wall, and one or more weights. The one or more weights are attached to the first side wall and the second side wall, wherein the weights are attached at multiple locations on the semiconductor manufacturing apparatus to minimize vibration of the apparatus. In some embodiments, each weight is spaced apart from a ground surface on which the semiconductor manufacturing apparatus is positioned. In some embodiments, the semiconductor manufacturing apparatus further includes one or more additional weights coupled to the first or more weights to increase the total weight of the semiconductor manufacturing apparatus.
[0090] The foregoing outlines features of numerous embodiments to enable those skilled in the art to better understand this disclosure from various perspectives. Those skilled in the art will understand that other processes and structures can be readily designed or modified based on this disclosure to achieve the same purpose and / or the same advantages as the embodiments described herein. Those skilled in the art will also understand that these equivalent structures do not depart from the inventive spirit and scope of this disclosure. Various changes, substitutions, or modifications can be made to this disclosure without departing from its inventive spirit and scope.
Claims
1. A method for reducing equipment vibration, comprising: Measuring vibration levels in semiconductor manufacturing equipment; Determine one or more blocks in the semiconductor manufacturing equipment that vibrate at a level greater than a preset vibration level; as well as By coupling multiple weights to multiple outer surfaces of the semiconductor manufacturing equipment in one or more blocks, the vibration level of the one or more blocks is reduced to within a preset vibration level, wherein the multiple weights are coupled to multiple opposing side walls of the semiconductor manufacturing equipment.
2. The method for reducing equipment vibration as claimed in claim 1, wherein the plurality of weights are coupled to a ground surface at intervals, and the semiconductor manufacturing equipment is positioned on the ground surface.
3. The method for reducing equipment vibration as claimed in claim 1, wherein each of the plurality of weights is coupled relative to another of the plurality of weights.
4. The method for reducing equipment vibration as claimed in claim 3, wherein the plurality of side walls comprise the plurality of outer surfaces of the semiconductor manufacturing equipment, and the plurality of weights coupled to the opposing plurality of side walls face each other.
5. The method for reducing equipment vibration as claimed in claim 3, wherein the plurality of weights coupled to the plurality of opposing side walls are facing away from each other.
6. The method for reducing equipment vibration as described in claim 1, further comprising: The total number of weights attached to the semiconductor manufacturing equipment is increased by coupling additional weights to the existing weights already coupled to the semiconductor manufacturing equipment.
7. The method for reducing equipment vibration as claimed in claim 1, wherein each of the plurality of weights has the same weight value.
8. The method for reducing equipment vibration as claimed in claim 1, wherein the semiconductor manufacturing equipment is placed on a vibration damping platform, the vibration damping platform being placed on a ground surface, and the method comprising: The plurality of said weights are coupled between a base of the semiconductor manufacturing equipment and an upper surface of the vibration damping platform.
9. The method for reducing equipment vibration as claimed in claim 8, wherein the plurality of said weights are spaced apart from the upper surface of the vibration damping platform and the ground surface.
10. A method for reducing equipment vibration, comprising: A first weight is attached to a first outer surface of a semiconductor manufacturing equipment; A second weight is attached to a second outer surface of the semiconductor manufacturing equipment, the second outer surface being opposite to the first outer surface, and the first outer surface and the second outer surface being portions of opposing side walls of the semiconductor manufacturing equipment, respectively. The vibration level in the portion of the semiconductor manufacturing equipment having the first weight and the second weight was measured. as well as When multiple vibration levels exceed a preset level, the first weight and the second weight are added.
11. The method for reducing equipment vibration as claimed in claim 10, wherein the first weight is attached directly opposite to the second weight.
12. The method for reducing equipment vibration as described in claim 10, further comprising: A third weight is attached to the first outer surface and a fourth weight is attached to the second outer surface to reduce the plurality of vibration levels to less than or equal to the preset level.
13. The method for reducing equipment vibration as claimed in claim 10, wherein a plurality of weights are attached to the first outer surface and the second outer surface, the plurality of weights including the first weight and the second weight; and The number of weights attached to the first outer surface and the second outer surface is the same.
14. The method for reducing equipment vibration as claimed in claim 13, wherein each weight on the first outer surface has a corresponding weight on the second outer surface and are attached to each other exactly opposite to each other.
15. The method for reducing equipment vibration as claimed in claim 10, wherein the first weight and the second weight are attached to a ground surface at a distance, and the semiconductor manufacturing equipment is positioned on the ground surface.
16. The method for reducing equipment vibration as described in claim 10, wherein adding the first weight and the second weight comprises: The additional multiple weights are coupled to each of the first weight and the second weight.
17. The method for reducing equipment vibration as claimed in claim 10, wherein the first weight and the second weight have the same weight value.
18. A semiconductor manufacturing apparatus, comprising: First lateral wall; A second lateral wall is opposite to the first lateral wall, and the first lateral wall and the second lateral wall form a plurality of outer surfaces on the semiconductor manufacturing equipment; as well as Multiple weights are attached to multiple outer surfaces formed by the first side wall and the second side wall, respectively, wherein the multiple weights are attached to multiple locations on the semiconductor manufacturing equipment to reduce the vibration level at the multiple locations to within a preset vibration level.
19. The semiconductor manufacturing apparatus of claim 18, wherein each of the weights is attached to a ground surface at a distance, the semiconductor manufacturing apparatus being positioned on the ground surface.
20. The semiconductor manufacturing apparatus of claim 18, further comprising: One or more additional weights are coupled to at least one of the plurality of weights to increase the total weight of the semiconductor manufacturing equipment, wherein each of the plurality of weights includes a vertical portion attached to the first side wall or the second side wall and a horizontal portion extending outward from the vertical portion for placing one or more of the additional weights.