Thermal performance testing device and thermal performance testing method based on thermal performance testing device

Abstract

This invention provides a thermal performance testing device and a thermal performance testing method based on the thermal performance testing device, relating to the field of testing technology. The device includes: a motherboard, N clamping frames, and a fan system connected to the N clamping frames via N pre-set independent air ducts. The motherboard includes a processing module and N connectors corresponding to the N clamping frames. The processing module is connected to the N connectors and the fan system, where N is an integer greater than 1. The thermal performance testing device provided by this invention allows operators to simply clamp the module under test using the clamping mechanism. Subsequent loading tests and determination of whether the thermal performance of the module under test is qualified can be achieved through the interaction between the modules in the device, improving testing efficiency and simplifying operation with low professional requirements for operators.

Description

Technical Field

[0001] This invention relates to the field of testing technology, and in particular to a thermal performance testing device and a thermal performance testing method based on the thermal performance testing device. Background Technology

[0002] Before a board or module leaves the factory, its thermal performance is usually tested, such as heat dissipation testing.

[0003] Currently, heat dissipation tests on circuit boards or modules are typically conducted by professional laboratory personnel on specialized platforms.

[0004] However, thermal testing of circuit boards or modules by laboratory personnel is inefficient and requires highly specialized skills, making it unsuitable for production lines where circuit boards or modules are mass-produced and tested. Summary of the Invention

[0005] This invention provides a thermal performance testing device and a thermal performance testing method based on the thermal performance testing device, in order to solve the problems of low testing efficiency and high professional requirements for operators in the prior art of heat dissipation testing.

[0006] The present invention provides a thermal performance testing device, comprising: a motherboard, N clamping frames, and a fan system connected to the N clamping frames respectively through N pre-set independent air ducts. The motherboard includes a processing module and N connectors corresponding to the N clamping frames. The processing module is connected to the N connectors and the fan system respectively, where N is an integer greater than 1.

[0007] According to a thermal performance testing device provided by the present invention, the clamping frame is used to: clamp the module to be tested, so that the module to be tested is connected to the connector corresponding to the clamping frame, and a sealed space is formed between the module and the independent air duct corresponding to the clamping frame.

[0008] According to a thermal performance testing device provided by the present invention, the device further includes at least one scanning module corresponding to the N clamping frames, and the processing module is also connected to the at least one scanning module; wherein, the scanning module is used to: scan and identify the unique identification code of the module under test when the module under test is clamped by the clamping frame, determine the correspondence between the clamping frame and the unique identification code, and send the unique identification code and the correspondence to the processing module.

[0009] According to a thermal performance testing device provided by the present invention, the processing module is used for:

[0010] Based on the unique identifier and the corresponding relationship, a first control signal is sent to the connector corresponding to the target clamping frame, and a second control signal is sent to the fan system. The target clamping frame is the clamping frame corresponding to the unique identifier. The first control signal is used to control the module under test to be loaded to a preset test power consumption. The second control signal is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame.

[0011] While continuously controlling the module under test to reach the test power consumption and running the fan for a period of time reaching a first threshold, the highest junction temperature and actual power consumption of the module under test are obtained through the connector corresponding to the target clamping frame. Based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature value, the actual thermal resistance of the module under test is calculated. If the actual thermal resistance is less than or equal to the pre-set thermal resistance standard value, the thermal performance of the module under test is determined to be qualified.

[0012] According to the thermal performance testing device provided by the present invention, the processing module is further configured to: determine that the thermal performance of the module under test is unqualified when the actual thermal resistance is greater than the standard value of thermal resistance for M consecutive times, where M is an integer greater than 1.

[0013] According to a thermal performance testing device provided by the present invention, the device further includes N indicator light modules corresponding to the N clamping frames, and the processing module is also connected to the N indicator light modules;

[0014] The processing module is further configured to: send a third control signal to the indicator light module corresponding to the clamping frame when the thermal performance of the module under test corresponding to the clamping frame is qualified; and send a fourth control signal to the indicator light module corresponding to the clamping frame when the thermal performance of the module under test corresponding to the clamping frame is unqualified.

[0015] The indicator light module is used to: control the green light in the indicator light module to stay on when the third control signal is received; and control the red light in the indicator light module to stay on when the fourth control signal is received.

[0016] According to the present invention, a thermal performance testing device is provided, the device further comprising N preheating modules corresponding to the N clamping frames;

[0017] The processing module is further configured to: determine the preheating module corresponding to the target clamping frame based on the unique identifier and the correspondence, and send a fifth control signal to the preheating module corresponding to the target clamping frame;

[0018] The preheating module is used to preheat the module under test corresponding to the target clamping frame when the fifth control signal is received.

[0019] According to a thermal performance testing device provided by the present invention, the processing module is specifically used for: based on the highest junction temperature T j The actual power consumption Pb and the ambient temperature value are used to calculate the actual thermal resistance Rb-i of the module under test using formula (1):

[0020] Rb-i=(T j -T la-i ) / Pb (1)

[0021] Among them, T la-i The value representing the ambient temperature corresponding to the i-th independent air duct, where i is an integer greater than 0 and less than or equal to N.

[0022] The present invention also provides a thermal performance testing method based on a thermal performance testing device, wherein the thermal performance testing device is the thermal performance testing device described in any of the above embodiments, and the method includes:

[0023] When the module under test is held by the clamping frame, the unique identification code of the module under test is scanned and identified to determine the correspondence between the clamping frame and the unique identification code;

[0024] Based on the unique identifier and the corresponding relationship, a first control signal is sent to the connector corresponding to the target clamping frame, and a second control signal is sent to the fan system; wherein, the target clamping frame is the clamping frame corresponding to the unique identifier, the first control signal is used to control the module under test to be loaded to a preset test power consumption, and the second control signal is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame;

[0025] While continuously controlling the module under test to be loaded to the test power consumption, and the time for running the fan reaches a first threshold, the highest junction temperature and actual power consumption of the module under test are obtained through the connector corresponding to the target clamping frame;

[0026] Based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature, the actual thermal resistance of the module under test is calculated.

[0027] If the actual thermal resistance is less than or equal to the preset standard value of thermal resistance, the thermal performance of the module under test is determined to be qualified.

[0028] According to the thermal performance testing method based on a thermal performance testing device provided by the present invention, after calculating the actual thermal resistance of the module under test based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature value, the method further includes:

[0029] If the actual thermal resistance is greater than the standard thermal resistance value for M consecutive times, the thermal performance of the module under test is determined to be unqualified, where M is an integer greater than 1.

[0030] A thermal performance testing method based on a thermal performance testing device provided by the present invention further includes:

[0031] If the thermal performance of the module under test corresponding to the clamping frame is determined to be qualified, a third control signal is sent to the indicator light module corresponding to the clamping frame; wherein, the third control signal is used to control the green light in the indicator light module to stay on.

[0032] If the thermal performance of the module under test corresponding to the clamping frame is determined to be unqualified, a fourth control signal is sent to the indicator light module corresponding to the clamping frame; wherein, the fourth control signal is used to control the red light in the indicator light module to stay on.

[0033] According to the present invention, a thermal performance testing method based on a thermal performance testing device includes sending a first control signal to the connector corresponding to the target clamping frame and sending a second control signal to the fan system based on the unique identifier and the corresponding relationship, comprising:

[0034] Based on the unique identifier and the corresponding relationship, the type of the module under test corresponding to the target clamping frame is determined;

[0035] Based on the type, the test power consumption and control information for the fan system are determined; wherein, the control information includes the fan speed information in the fan system;

[0036] Based on the test power consumption and the control information, the first control signal and the second control signal are determined. The first control signal is sent to the connector corresponding to the target clamping frame, and the second control signal is sent to the fan system. Specifically, the second control information is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame according to the speed information.

[0037] According to the present invention, a thermal performance testing method based on a thermal performance testing device, before sending a first control signal to the connector corresponding to the target clamping frame and a second control signal to the fan system based on the unique identifier and the correspondence, the method further includes:

[0038] Based on the unique identifier and the corresponding relationship, the preheating module corresponding to the target clamping frame is determined, and a fifth control signal is sent to the preheating module corresponding to the target clamping frame; wherein, the fifth control signal is used to control the preheating module to preheat the module under test corresponding to the target clamping frame.

[0039] According to the present invention, a thermal performance testing method based on a thermal performance testing device is provided, wherein the actual thermal resistance of the module under test is calculated based on the highest junction temperature, the actual power consumption, and a pre-measured ambient temperature value, comprising:

[0040] Based on the highest junction temperature T j The actual power consumption Pb and the ambient temperature value are used to calculate the actual thermal resistance Rb-i of the module under test using formula (1):

[0041] Rb-i=(T j -T la-i ) / Pb (1)

[0042] Among them, T la-i The value representing the ambient temperature corresponding to the i-th independent air duct, where i is an integer greater than 0 and less than or equal to N.

[0043] According to a thermal performance testing method based on a thermal performance testing device provided by the present invention, after determining that the thermal performance of the module under test is qualified when the actual thermal resistance is less than or equal to a preset thermal resistance standard value, the method further includes:

[0044] Based on the unique identifier, the highest junction temperature, the actual power consumption, the ambient temperature value, and the first information, a first thermal test report is generated for the module under test corresponding to the target clamping frame; wherein, the first information is used to characterize the thermal performance of the module under test as qualified.

[0045] According to a thermal performance testing method based on a thermal performance testing device provided by the present invention, after determining that the thermal performance of the module under test is unqualified when the actual thermal resistance exceeds the standard value for M consecutive times, the method further includes:

[0046] Based on the unique identifier, the highest junction temperature, the actual power consumption, the ambient temperature value, and the second information, a second thermal test report is generated for the module under test corresponding to the target clamping frame; wherein, the second information is used to characterize the thermal performance of the module under test as unqualified.

[0047] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the thermal performance testing method based on the thermal performance testing device as described above.

[0048] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the thermal performance testing method based on the thermal performance testing device as described above.

[0049] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements a thermal performance testing method based on any of the above-described thermal performance testing devices.

[0050] The thermal performance testing device and method based on the present invention address the issues of low testing efficiency and high operator skill requirements associated with related technologies that require personnel to perform heat dissipation tests on circuit boards or modules on specialized experimental platforms, making them unsuitable for mass production and testing scenarios. In contrast, the thermal performance testing device provided by this invention only requires the operator to clamp the module under test using a clamping mechanism. Subsequent loading tests and determination of the module's thermal performance are achieved through interaction between the various modules within the device, improving testing efficiency and simplifying operation with low operator skill requirements. Furthermore, the device features multiple clamping mechanisms and corresponding testing structures, allowing simultaneous testing of multiple modules, further enhancing efficiency and making it suitable for production line applications. Additionally, each clamping mechanism has an independent air duct and fan to ensure consistent airflow conditions for each module under test, improving the accuracy of thermal performance testing. Attached Figure Description

[0051] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0052] Figure 1 This is one of the structural schematic diagrams of the thermal performance testing device provided by the present invention;

[0053] Figure 2 This is one of the flowcharts illustrating the thermal performance testing method based on a thermal performance testing device provided by the present invention;

[0054] Figure 3 This is the second schematic diagram of the thermal performance testing device provided by the present invention;

[0055] Figure 4 This is the second schematic diagram of the thermal performance testing method based on the thermal performance testing device provided by the present invention;

[0056] Figure 5 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0057] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0058] The thermal performance testing device and the thermal performance testing method based on the thermal performance testing device of the present invention are described below with reference to the accompanying drawings.

[0059] Figure 1 This is one of the structural schematic diagrams of the thermal performance testing device provided by the present invention, such as... Figure 1 As shown, the thermal performance testing device 100 includes:

[0060] The system comprises a motherboard 101, N clamping frames 102, and a fan system 105 connected to the N clamping frames 102 respectively via N pre-set independent air ducts 104. The motherboard 101 includes a processing module 1011 and N connectors 1012 corresponding to the N clamping frames 102. The processing module 1011 is connected to the N connectors 1012 and the fan system 105 respectively, where N is an integer greater than 1.

[0061] Optionally, such as Figure 1 As shown, the thermal performance testing device 100 may further include: at least one scanning module 103 corresponding to the N clamping frames 102, and the processing module 1011 is also connected to the at least one scanning module 103.

[0062] It should be noted that, Figure 1 The diagram illustrates an example with N scanning modules 103 corresponding to N clamping frames 102. The specific locations of the scanning modules 103 and the N connectors 1012 are merely examples; operators can adjust the settings according to actual conditions. Furthermore, for clarity, the connectors 1012 are not included in the motherboard 101 in the diagram; however, the connectors 1012 are actually included in the motherboard 101.

[0063] Optionally, the clamping frame 102 is used to: clamp the module under test to be tested, so that the module under test is connected to the connector corresponding to the clamping frame 102, and to form a closed space between the module under test and the independent air duct corresponding to the clamping frame 102.

[0064] Optionally, the scanning module 103 is used to: scan and identify the unique identifier of the module under test when the module under test is clamped by the clamping frame 102, determine the correspondence between the clamping frame 102 and the unique identifier, and send the unique identifier and the correspondence to the processing module 1011.

[0065] Optionally, the processing module 1011 is used for:

[0066] Based on the unique identifier and the corresponding relationship, a first control signal is sent to the connector corresponding to the target clamping frame, and a second control signal is sent to the fan system 105. The target clamping frame is the clamping frame corresponding to the unique identifier. The first control signal is used to control the module under test to be loaded to a preset test power consumption. The second control signal is used to control the fan system 105 to run the fan corresponding to the independent air duct of the target clamping frame.

[0067] While continuously controlling the module under test to reach the test power consumption and running the fan for a period of time reaching a first threshold, the highest junction temperature and actual power consumption of the module under test are obtained through the connector corresponding to the target clamping frame. Based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature value, the actual thermal resistance of the module under test is calculated. If the actual thermal resistance is less than or equal to the pre-set thermal resistance standard value, the thermal performance of the module under test is determined to be qualified.

[0068] In related technologies, thermal testing of circuit boards or modules is typically conducted by professional personnel on specialized platforms such as laboratories. However, thermal testing by personnel is inefficient and requires a high level of expertise, making it unsuitable for production lines where circuit boards or modules are mass-produced and tested.

[0069] To address the aforementioned problems, embodiments of the present invention provide a thermal performance testing device.

[0070] Specifically, the operator can clamp the module under test (DUT) using the clamping frame. While fixing the DUT, the operator connects the DUT to the corresponding connector on the clamping frame so that the DUT can upload relevant information to the processing module on the motherboard through the connector. For example, the DUT can upload its junction temperature, which specifically refers to the actual operating temperature of the semiconductor in the electronic device. In addition, clamping the DUT also requires forming a sealed space between the DUT and the independent air duct corresponding to the clamping frame so that the fan in the fan system can draw air into the DUT through the independent air duct.

[0071] Optionally, the module under test can be a board or a module. Boards include, for example, graphics processing unit (GPU) cards, general-purpose computing on GPU (GPGPU) cards, and peripheral component interconnect express (PCIe) cards; modules include, for example, OAM (Open Compute Project Accelerator Module) modules.

[0072] Alternatively, the connector may include a PCIe connector or a module connector.

[0073] When the module under test is held by the clamping frame, the scanning module can scan the module under test to identify the unique identification code corresponding to the module under test and determine the correspondence between the clamping frame and the unique identification code. This way, when testing multiple modules under test, each clamping frame can be matched with each module under test one by one to avoid confusion. Then, the unique identification code and the correspondence are sent to the processing module.

[0074] Optionally, the operator can scan the QR code of each module under test using the scanner provided with the device to match the module under test with the clamping frame, or match the module under test with the corresponding PCIe connector (e.g., PCIe interface) of the clamping frame.

[0075] Optionally, the unique identifier may be, for example, the product serial number (SN) of the module under test.

[0076] After receiving the unique identifier and its corresponding relationship, the processing module can send a first control signal to the connector corresponding to the target clamping frame based on the unique identifier and its corresponding relationship, so as to control the module under test to be loaded to a preset test power consumption, such as setting the test power consumption to full power (100% power consumption); and send a second control signal to the fan system to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame, so that the fan can supply air to the module under test held by the target clamping frame through the independent channel, and start the loading test.

[0077] In one embodiment, after receiving the unique identifier and the corresponding relationship, the processing module can first determine the type of the module under test corresponding to the target clamping frame based on the unique identifier and the corresponding relationship. The type is, for example, the model number. Then, based on the type of the module under test, it can determine the aforementioned test power consumption and control information for the fan system. The control information may include the fan speed information in the fan system, for example, to indicate the fan's operating speed. Then, based on the test power consumption and the control information, it determines a first control signal and a second control signal, sends the first control signal to the connector corresponding to the target clamping frame, and sends the second control signal to the fan system. Specifically, the second control information is used to control the fan system to operate the fan corresponding to the independent air duct of the target clamping frame according to the speed information.

[0078] When the processing module continuously controls the module under test to load to the test power consumption and the fan running time reaches the first threshold, for example, after running continuously for 10 minutes, it can obtain the highest junction temperature and actual power consumption of the module under test through the connector corresponding to the target clamping frame. Based on the highest junction temperature, actual power consumption and the pre-measured ambient temperature value, the actual thermal resistance of the module under test is calculated. If the actual thermal resistance is less than or equal to the pre-set thermal resistance standard value, the thermal performance of the module under test is determined to be qualified.

[0079] Optionally, the first threshold can be set by the operator based on the actual situation, for example, set to 10 minutes or 15 minutes.

[0080] Optionally, after the device is powered on, the temperature value read by the temperature sensor (Tsensor) installed at the air inlet of each object under test can be used as the ambient temperature value T. la .

[0081] It should be noted that thermal resistance is the ratio between the temperature difference between the two ends of the object under test and the power (power consumption) of the heat source; power consumption refers to the total power consumption of the object under test (such as a circuit board).

[0082] Optionally, embodiments of the present invention also provide a specific implementation method for calculating the actual thermal resistance of the module under test.

[0083] The processing module is specifically used for: based on the highest junction temperature T j The actual power consumption Pb and the ambient temperature value are used to calculate the actual thermal resistance Rb-i of the module under test using formula (1):

[0084] Rb-i=(T j -T la- ) / Pb (1)

[0085] Among them, T la-iThe value representing the ambient temperature corresponding to the i-th independent air duct, where i is an integer greater than 0 and less than or equal to N.

[0086] Optionally, the operator can be prompted to input the standard thermal resistance value Rb0 through a display interface or other means, and the calculated Rb-i can be compared with Rb0. If Rb-i ≤ Rb0, the thermal performance of the module under test is determined to be qualified.

[0087] Optionally, after determining that the thermal performance of the module under test is qualified, a first thermal test report of the module under test corresponding to the target clamping frame can be generated based on data such as the unique identifier, the highest junction temperature, the actual power consumption, the ambient temperature value, and the first information; wherein, the first information is used to characterize the qualified thermal performance of the module under test.

[0088] In one embodiment, after determining that the thermal performance of the module under test is qualified, the pressure (power consumption) log, temperature log, and test pass conclusion can be automatically captured to generate a thermal test report for the corresponding serial number board.

[0089] In the thermal performance testing device provided in this embodiment of the invention, compared with related technologies that require experimental personnel to perform heat dissipation tests on boards or modules on a dedicated experimental platform, resulting in low testing efficiency and high professional requirements for operators, making it unsuitable for production line use scenarios involving mass production and testing, the thermal performance testing device provided in this embodiment of the invention only requires the operator to clamp the module under test using a clamping mechanism. The subsequent loading test and the process of determining whether the thermal performance of the module under test is qualified can all be achieved through the interaction between the modules in the device, improving testing efficiency and simplifying operation with low professional requirements for operators. Furthermore, the device is equipped with multiple clamping mechanisms and their corresponding test structures, which can test multiple modules under test simultaneously, further improving testing efficiency and making it suitable for production line use scenarios. In addition, the device has independent air ducts and fans for each clamping mechanism to ensure that the air intake conditions of each module under test are consistent, improving the accuracy of thermal performance testing.

[0090] Optionally, the processing module 1011 is further configured to: determine that the thermal performance of the module under test is unqualified if the actual thermal resistance is greater than the standard value of thermal resistance for M consecutive times, where M is an integer greater than 1.

[0091] Specifically, if the actual thermal resistance exceeds the standard value for M consecutive times, the thermal performance of the module under test is determined to be unqualified. This can effectively avoid erroneous test results due to factors such as miscalculation of thermal resistance or temperature instability, and improve the accuracy of thermal performance testing.

[0092] Taking M=2 as an example, when it is first determined that Rb-i>Rb0, the processing module can re-send the first control signal to the connector corresponding to the target clamping frame and the second control signal to the fan system based on the unique identifier and the corresponding relationship. Under the condition that the module under test is continuously loaded to the test power consumption and the fan running time reaches the first threshold, the actual thermal resistance Rb-i′ of the module under test is calculated again based on the highest junction temperature, actual power consumption and ambient temperature. If Rb-i′≤Rb0, the thermal performance of the module under test is determined to be qualified; if Rb-i′>Rb0 this time, the thermal performance of the module under test is determined to be unqualified.

[0093] Optionally, after determining that the thermal performance of the module under test is unqualified, a second thermal test report for the module under test corresponding to the target clamping frame can be generated based on data such as the unique identifier, maximum junction temperature, actual power consumption, ambient temperature value, and second information; wherein, the second information is used to characterize the unqualified thermal performance of the module under test.

[0094] In one embodiment, after determining that the thermal performance of the module under test is unqualified, the power consumption log, temperature log, and the conclusion of test failure can be automatically captured to generate a thermal test report for the corresponding serial number board.

[0095] Optionally, the thermal performance testing device 100 may further include N indicator light modules corresponding to the N clamping frames, and the processing module 1011 is also connected to the N indicator light modules;

[0096] The processing module 1011 is further configured to: send a third control signal to the indicator light module corresponding to the clamping frame 102 when the thermal performance of the module under test corresponding to the clamping frame 102 is qualified; and send a fourth control signal to the indicator light module corresponding to the clamping frame 102 when the thermal performance of the module under test corresponding to the clamping frame 102 is unqualified.

[0097] The indicator light module is used to: control the green light in the indicator light module to stay on when the third control signal is received; and control the red light in the indicator light module to stay on when the fourth control signal is received.

[0098] Specifically, the device also includes an indicator light module, which is used to indicate whether the thermal performance of the module under test in the corresponding clamping frame is qualified. Specifically, a solid green light indicates that it is qualified, and a solid red light indicates that it is unqualified. It is simple to use and allows operators to quickly determine whether the thermal performance of the module under test is qualified.

[0099] Optionally, the thermal performance testing device 100 further includes N preheating modules corresponding to the N clamping frames 102;

[0100] The processing module 1011 is further configured to: determine the preheating module corresponding to the target clamping frame based on the unique identifier and the correspondence, and send a fifth control signal to the preheating module corresponding to the target clamping frame;

[0101] The preheating module is used to preheat the module under test corresponding to the target clamping frame when the fifth control signal is received.

[0102] Specifically, the device also includes a preheating module to preheat the module under test before thermal performance testing, which helps the module under test to quickly reach the test power consumption and then perform thermal performance testing.

[0103] For example, before the processing module sends the first control signal to the connector corresponding to the target clamping frame and the second control signal to the fan system, the preheating module can preheat each module under test (e.g., board) for 10 to 15 minutes, and the preheating temperature can exceed 85°C.

[0104] In one embodiment, while the preheating module preheats each module under test, other non-heating tests can also be performed on the module under test to improve the testing efficiency of the module under test.

[0105] The thermal performance testing method based on the thermal performance testing device provided by the present invention is described below. The content of the thermal performance testing method based on the thermal performance testing device described below can be referred to in correspondence with the thermal performance testing device described above.

[0106] Figure 2 This is one of the flowcharts illustrating the thermal performance testing method based on a thermal performance testing device provided by the present invention, such as... Figure 2 As shown, the method is based on the thermal performance testing device provided in any of the above embodiments, and the method includes steps 201 to 205; wherein:

[0107] Step 201: When the module under test is held by the clamping frame, scan and identify the unique identification code of the module under test, and determine the correspondence between the clamping frame and the unique identification code.

[0108] Step 202: Based on the unique identifier and the corresponding relationship, send a first control signal to the connector corresponding to the target clamping frame and a second control signal to the fan system;

[0109] The target clamping frame is the clamping frame corresponding to the unique identifier. The first control signal is used to control the module under test to be loaded to a preset test power consumption. The second control signal is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame.

[0110] Step 203: While continuously controlling the module under test to be loaded to the test power consumption, and the time for running the fan reaches the first threshold, obtain the highest junction temperature and actual power consumption of the module under test through the connector corresponding to the target clamping frame;

[0111] Step 204: Calculate the actual thermal resistance of the module under test based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature value;

[0112] Step 205: If the actual thermal resistance is less than or equal to the preset thermal resistance standard value, the thermal performance of the module under test is determined to be qualified.

[0113] Specifically, when the module under test is held by the clamping frame, the unique identification code of the module under test, such as the SN code, can be scanned and identified, and the one-to-one correspondence between the clamping frame and the unique identification code can be determined.

[0114] Based on the unique identifier and the corresponding relationship, a first control signal is sent to the connector corresponding to the target clamping frame corresponding to the unique identifier, so as to control the module under test to load to the preset test power consumption through the first control signal; and a second control signal is sent to the fan system, so as to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame through the second control signal.

[0115] By continuously controlling the module under test to reach the test power consumption and running the fan for a period of time up to the first threshold, the highest junction temperature and actual power consumption of the module under test can be obtained through the connector corresponding to the target clamping frame. Based on the highest junction temperature, actual power consumption and pre-measured ambient temperature, the actual thermal resistance of the module under test can be calculated. If the actual thermal resistance is less than or equal to the pre-set thermal resistance standard value, the thermal performance of the module under test can be determined to be qualified.

[0116] In the thermal performance testing method based on a thermal performance testing device provided in this embodiment of the invention, compared with the related technologies that require experimental personnel to perform heat dissipation testing on boards or modules on a dedicated experimental platform, resulting in low testing efficiency and high professional requirements for operators, making it unsuitable for production line use scenarios involving mass production and testing, the operator in this embodiment of the invention only needs to hold the module under test using a clamping mechanism. The subsequent loading test and the process of determining whether the thermal performance of the module under test is qualified can all be achieved by the thermal performance testing method based on a thermal performance testing device provided in this embodiment of the invention, which improves testing efficiency, is simple to operate, and has low professional requirements for operators. Furthermore, the above-mentioned thermal performance testing device is equipped with multiple clamping mechanisms and their corresponding test structures, and the method determines the one-to-one correspondence between the clamping frame and the unique identification code of the module under test, which can test multiple modules under test simultaneously without mutual confusion, further improving testing efficiency and making it suitable for production line use scenarios. In addition, the above-mentioned thermal performance testing device has independent air ducts and fans for each clamping mechanism to ensure that the air intake conditions of each module under test are consistent, improving the accuracy of thermal performance testing.

[0117] Optionally, after calculating the actual thermal resistance of the module under test based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature, the thermal performance of the module under test can be determined to be unqualified if the actual thermal resistance is greater than the standard value of thermal resistance for M consecutive times, where M is an integer greater than 1.

[0118] Optionally, embodiments of the present invention can use different displays of the indicator light module to characterize whether the thermal performance of the module under test is qualified.

[0119] If the thermal performance of the module under test corresponding to the clamping frame is determined to be qualified, a third control signal is sent to the indicator light module corresponding to the clamping frame; wherein, the third control signal is used to control the green light in the indicator light module to stay on.

[0120] If the thermal performance of the module under test corresponding to the clamping frame is determined to be unqualified, a fourth control signal is sent to the indicator light module corresponding to the clamping frame; wherein, the fourth control signal is used to control the red light in the indicator light module to stay on.

[0121] Optionally, the implementation of sending a first control signal to the connector corresponding to the target clamping frame and a second control signal to the fan system based on the unique identifier and the correspondence may include:

[0122] Based on the unique identifier and the corresponding relationship, the type of the module under test corresponding to the target clamping frame is determined;

[0123] Based on the type, the test power consumption and control information for the fan system are determined; wherein, the control information includes the fan speed information in the fan system;

[0124] Based on the test power consumption and the control information, the first control signal and the second control signal are determined. The first control signal is sent to the connector corresponding to the target clamping frame, and the second control signal is sent to the fan system. Specifically, the second control information is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame according to the speed information.

[0125] Optionally, before sending the first control signal to the connector corresponding to the target clamping frame and the second control signal to the fan system based on the unique identifier and the correspondence, the preheating module corresponding to the target clamping frame can be determined based on the unique identifier and the correspondence, and a fifth control signal can be sent to the preheating module corresponding to the target clamping frame; wherein, the fifth control signal is used to control the preheating module to preheat the module under test corresponding to the target clamping frame.

[0126] Optionally, the method for calculating the actual thermal resistance of the module under test based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature value may include:

[0127] Based on the highest junction temperature T j The actual power consumption Pb and the ambient temperature value are used to calculate the actual thermal resistance Rb-i of the module under test using formula (1):

[0128] Rb-i=(T j -T la-i ) / Pb (1)

[0129] Among them, T la-i The value representing the ambient temperature corresponding to the i-th independent air duct, where i is an integer greater than 0 and less than or equal to N.

[0130] Optionally, if the actual thermal resistance is less than or equal to a preset thermal resistance standard value, after determining that the thermal performance of the module under test is qualified, a first thermal test report of the module under test corresponding to the target clamping frame can be generated based on the unique identifier, the highest junction temperature, the actual power consumption, the ambient temperature value, and the first information; wherein, the first information is used to characterize that the thermal performance of the module under test is qualified.

[0131] Optionally, after determining that the thermal performance of the module under test is unqualified when the actual thermal resistance exceeds the standard value for M consecutive times, a second thermal test report for the module under test corresponding to the target clamping frame can be generated based on the unique identifier, the highest junction temperature, the actual power consumption, the ambient temperature value, and the second information; wherein, the second information is used to characterize the unqualified thermal performance of the module under test.

[0132] The following examples illustrate the thermal performance testing device and the thermal performance testing method based on the thermal performance testing device provided in the embodiments of the present invention.

[0133] I. Hardware System

[0134] Figure 3 This is a second schematic diagram of the thermal performance testing device provided by the present invention, as shown below. Figure 3 As shown, taking N=4 as an example, the thermal performance testing device includes:

[0135] ① Mainboard; ② Board clamping frame; ③ Test indicator light (indicator light module); ④ Fan and fan frame; ⑤ Air duct; ⑥ Base; ⑦ Module under test (e.g., board or OAM module).

[0136] Among them, the motherboard ① has a central processing unit (CPU), memory modules, hard drive, multiple (preferably four or more) connectors (such as PCIe connectors or module connectors) and other essential electronic components of the motherboard, which will not be described in detail here;

[0137] The motherboard ① is fixed on the base ⑥, which also has the power interface and power switch of the motherboard ①; the fan and fan frame ④ are fixed on the base ⑥, and the power cable and control cable of the fan are connected to the motherboard ①.

[0138] To ensure consistent airflow, each board under test (or OAM module) has a corresponding fan and independent airflow duct; the test indicator light ③ is fixed on the fan frame and has two colors, red and green. If the board passes the thermal test (qualified), the green light corresponding to the serial number will be constantly lit; otherwise (unqualified), the red light corresponding to the serial number will be constantly lit; the board under test (or OAM module) ⑦ is inserted into the PCIe connector (or module connector) of the motherboard ①; the board clamping frame ② fixes the board under test (or OAM module) ⑦ in the corresponding test position and forms a sealed airflow duct between the fan and the corresponding board; boards (or OAM modules) of different standard sizes and shapes can be equipped with clamping frames ② of different sizes and shapes;

[0139] II. Software System

[0140] The software system includes: a data entry module, an automatic data acquisition module, a fully automatic board stress testing module, and a result output module.

[0141] 1. The functions of the data entry module include: 1) Automatically collecting the air inlet temperature T of the board. la ;2) Use a barcode scanner to match the serial number of the board with the corresponding PCIe interface;3) Remind the user to enter the standard value of the board's thermal resistance Rb0.

[0142] 2. The functions of the automatic data acquisition module include: 1) automatically recording the data entered into the data entry system; 2) during the stress test, recording the power consumption and junction temperature data of each board (or OAM module) at regular intervals.

[0143] 3. The functions of the fully automatic board pressure testing module include: 1) automatically identifying the model of the board (or OAM module) and automatically selecting the pressure script and fan speed of the board model; 2) after the start test signal is issued, automatically adjusting the fan to a specific speed and running the pressure script at the same time; 3) after the pressure test has been performed for a period of time, the module will automatically end; 4) automatically calculating the actual thermal resistance Rb-i of each board and comparing it with the standard value of the board's thermal resistance Rb0. If it is less than or equal to the standard value of the thermal resistance, it is qualified; otherwise, it is unqualified.

[0144] 4. The functions of the result output module include: 1) After the test is completed, automatically integrate and output the data corresponding to the board generated by the above three modules to the Log file; 2) Output test result signals, that is: the green light of the corresponding serial number of the board (or OAM module) passes the thermal test is always on, and the red light of the corresponding serial number is always on if the test fails. If necessary, the test pass or fail result can also be output to a pre-set screen or other display device; 3) The Log file includes the test pass or fail result.

[0145] III. Thermal Performance Testing Methods Based on Thermal Performance Testing Devices

[0146] Figure 4 This is the second schematic diagram of the thermal performance testing method based on the thermal performance testing device provided by the present invention, as shown below. Figure 4 As shown, the method includes:

[0147] S1. Locate the corresponding slot (clamping frame) for each board or module, and scan the SN code of the board or module with a barcode scanner to ensure that the SN code corresponds to the slot.

[0148] S2. After powering on, read the values ​​of the T sensor at the air inlet of each board or module, and use them as the T sensor values. la-i ;

[0149] S3. After the test software starts, it prompts the user to enter Rb0 for each board or module.

[0150] S4. Preheat each board or module for 10-15 minutes;

[0151] Specifically, it is recommended that the preheating temperature of each board or module exceed 85°C, during which other non-thermal tests can be performed.

[0152] S5. The system automatically identifies the type of each board or module, and automatically loads the test power consumption and corresponding fan speed of each board or module, and runs continuously for 10 minutes.

[0153] Specifically, the power consumption being tested is, for example, full power consumption;

[0154] S6. Record the highest junction temperature T of each board or module. j and actual power consumption Pb;

[0155] S7. Calculate the actual thermal resistance Rb-i = (T) of each board or module. j -T la-i ) / Pb;

[0156] S8. Determine if Rb-i is less than or equal to Rb0. If yes, proceed to S9. If no, return to S5 if Rb-i > Rb0 is determined for the first time. Otherwise, proceed to S10.

[0157] S9. Obtain the test result of Thermal Pass, control the indicator light to stay on green, and automatically capture the pressure log, temperature log and test pass conclusion to generate a thermal test report for the corresponding serial number board.

[0158] S10. If the thermal test fails, the indicator light will remain on red. The system will automatically capture the pressure log, temperature log, and the conclusion of the test failure, and generate a thermal test report for the corresponding serial number board.

[0159] The following example illustrates the testing of four circuit boards.

[0160] Step 1: Insert the 4 cards into the 4 PCIe interfaces respectively, and scan the serial number (SN) of the 4 cards with a barcode scanner. The software system will automatically match the 4 SN codes with the PCIe interfaces (0, 1, 2, 3).

[0161] The barcode scanner is connected to another desktop operating system. After the thermal function test device is powered on, the correspondence between the SN code and the PCIe interface will be automatically transmitted to the thermal function test device.

[0162] Step 2: After the thermal function testing device is powered on, the data entry module collects the air inlet temperature data of the four boards respectively, and records them as T. la-i (i = 0, 1, 2, 3); then enter the display interface of the thermal function test device, prompting the user to enter the standard value of thermal resistance for this model of board, denoted as Rb0.

[0163] Step 3: After the system starts, the fully automatic board stress test module will automatically identify the board model and automatically adjust the fan speed to a specific speed, and then automatically run the board's preheating stress script (the recommended board temperature is above 85℃). Preheat for 10-15 minutes, during which other non-thermal stress tests can be performed.

[0164] Step 4: After preheating, the system automatically loads the pressure (100% power consumption recommended) script corresponding to this model, sets the fan speed to the specific thermal resistance test speed, and maintains it for 10 minutes. The temperature (junction temperature) T of the i-th board is recorded. j-i And the power consumption of the board, Pb-i (i = 0, 1, 2, 3).

[0165] Step 5: The system records the actual thermal resistance of each board:

[0166] Rb-i=(T j-i -T la-i ) / Pb-i, i = 0, 1, 2, 3.

[0167] Step 6: The system automatically determines: Rb-i≤Rb0?

[0168] Step 7: If step 6 is successful, the system will automatically control the corresponding green indicator light to light up, output the conclusion of Thermal Pass, and automatically capture the power consumption, temperature, thermal test pass conclusion, etc. as the content of Log, and automatically output the thermal test report.

[0169] Step 8: If the first run of Step 6 fails, the system will automatically return to Step 4 and re-execute the test program for the corresponding board. If Step 6 succeeds thereafter, Step 7 will be executed. If it still fails, the system will automatically control the corresponding red indicator light to light up and output the conclusion of Thermal Fail. It will also automatically capture the power consumption, temperature, thermal test pass conclusion, etc. as the content of Log and automatically output the thermal test report.

[0170] Step 9: Test complete.

[0171] In this embodiment of the invention, during the entire thermal testing process, the operator only needs to install the board in the PCIe slot, scan the QR code of the board with a barcode scanner, and match it with the PCIe slot. After powering on, the other steps are automatically completed by the testing system, which is simple and efficient.

[0172] It should be noted that the embodiments of the present invention have at least the following beneficial effects:

[0173] 1. Compared to single-card testing, batch testing efficiency can be increased by 4 times (testing 4 cards at a time) or more, while ensuring that all cards meet factory quality standards. It is especially suitable for small-batch production of R&D products when product quality is not yet stable; 2. Automatically determines whether thermal resistance meets standards and provides indicator light reminders; 3. Automatically archives data; 4. Through a barcode scanner, the serial number, PCIe slot, and test results can be automatically matched one-to-one, preventing confusion; 5. Customizable and highly expandable, for example: 1) parameters such as acquisition time and data can be actively adjusted; 2) It can be compatible with various sizes of boards or modules according to requirements; 6. Automatically matches stress programs; 7. Simple to use (indicator lights indicate whether it is qualified); 8. It can ensure that the thermal performance of each card or module meets almost 100% of the standards at the time of manufacture.

[0174] Figure 5 This is a schematic diagram of the structure of the electronic device provided by the present invention, such as... Figure 5 As shown, the electronic device 500 may include: a processor 510, a communication interface 520, a memory 530, and a communication bus 540, wherein the processor 510, the communication interface 520, and the memory 530 communicate with each other through the communication bus 540. The processor 510 can call logical instructions in the memory 530 to execute a thermal performance testing method based on a thermal performance testing device, wherein the thermal performance testing device is the thermal performance testing device described in any of the above embodiments, and the method includes:

[0175] When the module under test is held by the clamping frame, the unique identification code of the module under test is scanned and identified to determine the correspondence between the clamping frame and the unique identification code;

[0176] Based on the unique identifier and the corresponding relationship, a first control signal is sent to the connector corresponding to the target clamping frame, and a second control signal is sent to the fan system; wherein, the target clamping frame is the clamping frame corresponding to the unique identifier, the first control signal is used to control the module under test to be loaded to a preset test power consumption, and the second control signal is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame;

[0177] While continuously controlling the module under test to be loaded to the test power consumption, and the time for running the fan reaches a first threshold, the highest junction temperature and actual power consumption of the module under test are obtained through the connector corresponding to the target clamping frame;

[0178] Based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature, the actual thermal resistance of the module under test is calculated.

[0179] If the actual thermal resistance is less than or equal to the preset standard value of thermal resistance, the thermal performance of the module under test is determined to be qualified.

[0180] Furthermore, the logical instructions in the aforementioned memory 530 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0181] On the other hand, the present invention also provides a computer program product, the computer program product comprising a computer program, the computer program being able to be stored on a non-transitory computer-readable storage medium, and when the computer program is executed by a processor, the computer being able to execute the thermal performance testing method based on the thermal performance testing device provided by the above methods, wherein the thermal performance testing device is the thermal performance testing device described in any of the above embodiments, and the method comprising:

[0182] When the module under test is held by the clamping frame, the unique identification code of the module under test is scanned and identified to determine the correspondence between the clamping frame and the unique identification code;

[0183] Based on the unique identifier and the corresponding relationship, a first control signal is sent to the connector corresponding to the target clamping frame, and a second control signal is sent to the fan system; wherein, the target clamping frame is the clamping frame corresponding to the unique identifier, the first control signal is used to control the module under test to be loaded to a preset test power consumption, and the second control signal is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame;

[0184] While continuously controlling the module under test to be loaded to the test power consumption, and the time for running the fan reaches a first threshold, the highest junction temperature and actual power consumption of the module under test are obtained through the connector corresponding to the target clamping frame;

[0185] Based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature, the actual thermal resistance of the module under test is calculated.

[0186] If the actual thermal resistance is less than or equal to the preset standard value of thermal resistance, the thermal performance of the module under test is determined to be qualified.

[0187] In another aspect, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon. When executed by a processor, the computer program implements a thermal performance testing method based on a thermal performance testing device provided by the above methods, wherein the thermal performance testing device is the thermal performance testing device described in any of the above embodiments, and the method includes:

[0188] When the module under test is held by the clamping frame, the unique identification code of the module under test is scanned and identified to determine the correspondence between the clamping frame and the unique identification code;

[0189] Based on the unique identifier and the corresponding relationship, a first control signal is sent to the connector corresponding to the target clamping frame, and a second control signal is sent to the fan system; wherein, the target clamping frame is the clamping frame corresponding to the unique identifier, the first control signal is used to control the module under test to be loaded to a preset test power consumption, and the second control signal is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame;

[0190] While continuously controlling the module under test to be loaded to the test power consumption, and the time for running the fan reaches a first threshold, the highest junction temperature and actual power consumption of the module under test are obtained through the connector corresponding to the target clamping frame;

[0191] Based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature, the actual thermal resistance of the module under test is calculated.

[0192] If the actual thermal resistance is less than or equal to the preset standard value of thermal resistance, the thermal performance of the module under test is determined to be qualified.

[0193] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0194] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0195] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A thermal performance testing device, characterized in that, include: The system comprises a motherboard, N clamping frames, and a fan system that is connected to the N clamping frames via N pre-set independent air ducts. The motherboard includes a processing module and N connectors corresponding to the N clamping frames. The processing module is connected to the N connectors and the fan system, where N is an integer greater than 1. The clamping frame is used to: clamp the module under test to be tested, so that the module under test is connected to the connector corresponding to the clamping frame, and to form a closed space between the module under test and the independent air duct corresponding to the clamping frame; The device further includes at least one scanning module corresponding to the N clamping frames, and the processing module is also connected to the at least one scanning module; wherein, the scanning module is used to: scan and identify the unique identification code of the module under test when the module under test is clamped by the clamping frame, determine the correspondence between the clamping frame and the unique identification code, and send the unique identification code and the correspondence to the processing module; The processing module is used for: Based on the unique identifier and the corresponding relationship, a first control signal is sent to the connector corresponding to the target clamping frame, and a second control signal is sent to the fan system. The target clamping frame is the clamping frame corresponding to the unique identifier. The first control signal is used to control the module under test to be loaded to a preset test power consumption. The second control signal is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame. While continuously controlling the module under test to be loaded to the test power consumption, and the fan running time reaches a first threshold, the highest junction temperature and actual power consumption of the module under test are obtained through the connector corresponding to the target clamping frame. Based on the highest junction temperature, the actual power consumption and the pre-measured ambient temperature value, the actual thermal resistance of the module under test is calculated.

2. The thermal performance testing device according to claim 1, characterized in that, The processing module is used for: If the actual thermal resistance is less than or equal to the preset standard value of thermal resistance, the thermal performance of the module under test is determined to be qualified.

3. The thermal performance testing device according to claim 2, characterized in that, The processing module is further configured to: determine that the thermal performance of the module under test is unqualified if the actual thermal resistance is greater than the standard value of thermal resistance for M consecutive times, where M is an integer greater than 1.

4. The thermal performance testing device according to claim 3, characterized in that, The device also includes N indicator light modules corresponding to the N clamping frames, and the processing module is also connected to the N indicator light modules; The processing module is further configured to: send a third control signal to the indicator light module corresponding to the clamping frame when the thermal performance of the module under test corresponding to the clamping frame is qualified; and send a fourth control signal to the indicator light module corresponding to the clamping frame when the thermal performance of the module under test corresponding to the clamping frame is unqualified. The indicator light module is used to: control the green light in the indicator light module to stay on when the third control signal is received; and control the red light in the indicator light module to stay on when the fourth control signal is received.

5. The thermal performance testing apparatus according to any one of claims 1 to 4, characterized in that, The device also includes N preheating modules corresponding to the N clamping frames; The processing module is further configured to: determine the preheating module corresponding to the target clamping frame based on the unique identifier and the correspondence, and send a fifth control signal to the preheating module corresponding to the target clamping frame; The preheating module is used to preheat the module under test corresponding to the target clamping frame when the fifth control signal is received.

6. The thermal performance testing apparatus according to claim 1 or 3, characterized in that, The processing module is specifically used for: based on the highest junction temperature The actual power consumption The actual thermal resistance of the module under test is calculated using formula (1) based on the ambient temperature value. -i: -i （1） in, The value representing the ambient temperature corresponding to the i-th independent air duct, where i is an integer greater than 0 and less than or equal to N.

7. A thermal performance testing method based on a thermal performance testing device, characterized in that, The thermal performance testing device is the thermal performance testing device as described in any one of claims 1 to 6, and the method includes: When the module under test is held by the clamping frame, the unique identification code of the module under test is scanned and identified to determine the correspondence between the clamping frame and the unique identification code; Based on the unique identifier and the corresponding relationship, a first control signal is sent to the connector corresponding to the target clamping frame, and a second control signal is sent to the fan system; wherein, the target clamping frame is the clamping frame corresponding to the unique identifier, the first control signal is used to control the module under test to be loaded to a preset test power consumption, and the second control signal is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame; While continuously controlling the module under test to be loaded to the test power consumption, and the time for running the fan reaches a first threshold, the highest junction temperature and actual power consumption of the module under test are obtained through the connector corresponding to the target clamping frame; Based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature, the actual thermal resistance of the module under test is calculated. If the actual thermal resistance is less than or equal to the preset standard value of thermal resistance, the thermal performance of the module under test is determined to be qualified.

8. The thermal performance testing method based on the thermal performance testing device according to claim 7, characterized in that, After calculating the actual thermal resistance of the module under test based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature, the method further includes: If the actual thermal resistance is greater than the standard thermal resistance value for M consecutive times, the thermal performance of the module under test is determined to be unqualified, where M is an integer greater than 1.

9. The thermal performance testing method based on the thermal performance testing device according to claim 8, characterized in that, The method further includes: If the thermal performance of the module under test corresponding to the clamping frame is determined to be qualified, a third control signal is sent to the indicator light module corresponding to the clamping frame; wherein, the third control signal is used to control the green light in the indicator light module to stay on. If the thermal performance of the module under test corresponding to the clamping frame is determined to be unqualified, a fourth control signal is sent to the indicator light module corresponding to the clamping frame; wherein, the fourth control signal is used to control the red light in the indicator light module to stay on.

10. The thermal performance testing method based on the thermal performance testing device according to claim 7, characterized in that, The step of sending a first control signal to the connector corresponding to the target clamping frame and a second control signal to the fan system based on the unique identifier and the correspondence includes: Based on the unique identifier and the corresponding relationship, the type of the module to be tested corresponding to the target clamping frame is determined; Based on the type, the test power consumption and control information for the fan system are determined; wherein, the control information includes the fan speed information in the fan system; Based on the test power consumption and the control information, the first control signal and the second control signal are determined. The first control signal is sent to the connector corresponding to the target clamping frame, and the second control signal is sent to the fan system. Specifically, the second control signal is used to control the fan system to run the fan corresponding to the independent air duct of the target clamping frame according to the speed information.

11. The thermal performance testing method based on the thermal performance testing device according to claim 7, characterized in that, Before sending a first control signal to the connector corresponding to the target clamping frame and a second control signal to the fan system based on the unique identifier and the correspondence, the method further includes: Based on the unique identifier and the corresponding relationship, the preheating module corresponding to the target clamping frame is determined, and a fifth control signal is sent to the preheating module corresponding to the target clamping frame; wherein, the fifth control signal is used to control the preheating module to preheat the module under test corresponding to the target clamping frame.

12. The thermal performance testing method based on the thermal performance testing device according to claim 7, characterized in that, The calculation of the actual thermal resistance of the module under test based on the highest junction temperature, the actual power consumption, and the pre-measured ambient temperature includes: Based on the highest junction temperature The actual power consumption The actual thermal resistance of the module under test is calculated using formula (1) based on the ambient temperature value. -i: -i （1） in, The value representing the ambient temperature corresponding to the i-th independent air duct, where i is an integer greater than 0 and less than or equal to N.

13. The thermal performance testing method based on the thermal performance testing device according to claim 7, characterized in that, After determining that the thermal performance of the module under test is qualified when the actual thermal resistance is less than or equal to a preset standard value, the method further includes: Based on the unique identifier, the highest junction temperature, the actual power consumption, the ambient temperature value, and the first information, a first thermal test report is generated for the module under test corresponding to the target clamping frame; wherein, the first information is used to characterize the thermal performance of the module under test as qualified.

14. The thermal performance testing method based on the thermal performance testing device according to claim 8, characterized in that, After determining that the thermal performance of the module under test is unqualified when the actual thermal resistance exceeds the standard value for M consecutive occurrences, the method further includes: Based on the unique identifier, the highest junction temperature, the actual power consumption, the ambient temperature value, and the second information, a second thermal test report is generated for the module under test corresponding to the target clamping frame; wherein, the second information is used to characterize the thermal performance of the module under test as unqualified.

15. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the thermal performance testing method based on the thermal performance testing device as described in any one of claims 7 to 14.

16. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the thermal performance testing method based on the thermal performance testing device as described in any one of claims 7 to 14.

17. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the thermal performance testing method based on the thermal performance testing device as described in any one of claims 7 to 14.

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