芯片形貌预测方法、装置、设备及存储介质
By establishing a topography prediction model and using the test layout parameters and topography parameters of the chip to be predicted, a polynomial calculation of the mapping relationship is configured, which solves the problem of chip unevenness after CMP processing, realizes fast and accurate topography prediction and design adjustment, and improves chip circuit performance and yield.
CN116432596BActive Publication Date: 2026-07-17INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
- Filing Date
- 2023-04-19
- Publication Date
- 2026-07-17
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Figure CN116432596B_ABST
Abstract
本申请公开了一种芯片形貌预测方法、装置、设备及存储介质，首先利用预先配置的形貌预测模型，对待预测芯片的版图参数进行处理，得到所述待预测芯片的形貌参数，而后根据所述待预测芯片的形貌参数，确定所述待预测芯片的形貌信息。由于在相同的CMP工艺参数下，所述测试版图的化学机械抛光效果和所述待预测芯片的化学机械抛光效果一致，因此，利用所述测试版图的版图参数和所述测试版图的形貌参数，可以配置出能够表征所述待预测芯片的版图参数和对应的形貌参数之间映射关系的形貌预测模型，利用所述形貌预测模型可以确定出所述待预测芯片的化学机械抛光处理之后的形貌参数，从而实现预测化学机械抛光处理之后的芯片形貌的任务。
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