Substrate processing apparatus, switching method, semiconductor device manufacturing method, and recording medium

Abstract

Provided is a substrate processing apparatus, a switching method, a semiconductor device manufacturing method, and a recording medium that can flexibly and appropriately cope with an increase or decrease in the number of substrate storage containers. The apparatus includes: a load port that can load a substrate storage container that stores a substrate; a control section that can control a switching section and a malfunction prevention function section, wherein the switching section can switch between a first function of using the load port for carrying in or carrying out the substrate storage container and a second function of loading the substrate storage container on the load port, the malfunction prevention function section performs a malfunction prevention action for the substrate storage container disposed on the load port in accordance with a use mode of the functions; and a processing chamber that processes the substrate.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus, a switching method, a method for manufacturing a semiconductor device, and a recording medium. Background Technology

[0002] As a substrate processing apparatus used in one step of the semiconductor device manufacturing process, there exists an apparatus configured to house multiple substrate storage containers called FOUP (Front Opening Unified Pod) on a storage rack (mount) provided in the apparatus (for example, see Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2000-216212 Summary of the Invention

[0006] This invention provides a technology that can flexibly and appropriately address the increase or decrease in the number of substrate storage containers.

[0007] According to a solution, the following technology is provided, which has:

[0008] Loading port, which is capable of holding a substrate storage container for storing substrates;

[0009] The control unit controls the switching unit and the misoperation suppression function unit. The switching unit can switch between a first function of using the loading port for loading or unloading the substrate storage container and a second function of placing the substrate storage container on the loading port. The misoperation suppression function unit performs misoperation suppression operations on the substrate storage container disposed on the loading port according to the application mode accompanying the function.

[0010] The processing chamber processes the aforementioned substrate.

[0011] Invention Effects

[0012] According to the present invention, the number of substrate storage containers that can be accommodated can be flexibly and appropriately adjusted to accommodate increases or decreases. Attached Figure Description

[0013] Figure 1 This is a perspective view showing a structural example of a substrate processing apparatus according to one embodiment of the present invention.

[0014] Figure 2 This is a side perspective view showing a structural example of a substrate processing apparatus according to one embodiment of the present invention.

[0015] Figure 3These are explanatory diagrams illustrating a structural example of a box clamping mechanism provided on the loading port of a substrate processing apparatus according to an embodiment of the present invention. (a) is a perspective view of the structural example, (b) is a top view of the structural example, and (c) is a front view of the structural example.

[0016] Figure 4 This is a longitudinal sectional view showing an example of the structure of the processing container included in a substrate processing apparatus according to one embodiment of the present invention.

[0017] Figure 5 This is a functional block diagram illustrating a structural example of the controller included in a substrate processing apparatus according to one embodiment of the present invention.

[0018] Figure 6 This is a flowchart illustrating a summary of a substrate processing step according to one embodiment of the present invention.

[0019] Figure 7 This is a schematic diagram illustrating an example of the structure of an operation screen for setting device commands for a substrate processing apparatus, according to one embodiment of the present invention.

[0020] Figure 8 These are explanatory diagrams illustrating the sequence of operation mode switching of the loading port of a substrate processing apparatus according to one embodiment of the present invention. (a) to (d) are diagrams schematically showing examples of operation screen displays.

[0021] Explanation of reference numerals in the attached figures

[0022] 100: Substrate processing apparatus; 105: Wafer cassette holder (substrate storage container carrier); 110: Wafer cassette (substrate storage container); 114: Lower loading port; 160: Upper loading port; 118: Wafer cassette conveying device (substrate storage container conveying device); 200: Wafer (substrate); 280: Controller; 281: Input / output device (operation unit); 283: External connection unit; 284: Main computer (upper-level device); 300: Cassette clamping mechanism (misoperation suppression function unit). Detailed Implementation

[0023] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0024] The substrate processing apparatus listed in the following description is used in the manufacturing process of semiconductor devices and is configured to perform a prescribed process on the substrate to be processed.

[0025] The substrate that is processed is, for example, a silicon wafer (hereinafter simply referred to as "substrate") that serves as a semiconductor substrate and is used to manufacture a semiconductor device (semiconductor apparatus). Furthermore, when the term "substrate" is used in this specification, it can refer to "the substrate itself" or to "a laminate (assembly) of the substrate and a specified layer or film formed on its surface" (i.e., the specified layer or film formed on the surface is included in the term "substrate"). Additionally, when the term "surface of the substrate" is used in this specification, it can refer to "the surface of the substrate itself (exposed surface)" or to "the surface of the specified layer or film formed on the substrate, i.e., the outermost surface of the substrate as a laminate." The use of the term "wafer" in this specification is also synonymous with the use of the term "substrate."

[0026] As a prescribed process for the substrate (hereinafter, there may be cases where it is simply referred to as "process"), there are, for example, oxidation processing, diffusion processing, annealing processing, etching processing, pre-cleaning processing, chamber cleaning processing, film formation processing, etc. In this embodiment, the case of film formation processing is specifically listed as an example.

[0027] (1) Overall structure of the substrate processing device

[0028] Reference Figure 1 and Figure 2 The overall structure of a substrate processing apparatus according to one embodiment of the present invention will be described. Figure 1 This is a perspective view showing a structural example of the substrate processing apparatus of this embodiment. Figure 2 This is a side perspective view showing a structural example of the substrate processing apparatus of this embodiment.

[0029] like Figure 1 and Figure 2 As shown, in the substrate processing apparatus 100 described here as an example, when transferring the wafer 200, which serves as a substrate, to or from the apparatus, a wafer cassette 110, which houses multiple wafers 200, is used as a wafer transfer device (substrate storage container). The wafer cassette 110 is, for example, a FOUP.

[0030] Since wafer cassette 110 is used, the substrate processing apparatus 100 has a lower loading port 114 and an upper loading port 160 on the side of the front wall 111a of the apparatus housing 111. These multiple loading ports 114 and 160 function as substrate storage container transfer stations for loading or unloading wafer cassette 110, which holds wafers 200, and are configured to hold wafer cassette 110 transported by in-process transport equipment (not shown) or manually.

[0031] Each loading port 114, 160 is configured to hold multiple (e.g., two) wafer cassettes 110.

[0032] In addition, each loading port 114, 160 is provided with a cassette clamping mechanism (not shown) to hold the mounted wafer cassette 110. The structure of the cassette clamping mechanism will be described later.

[0033] Within the device housing 111 on the rear side of each loading port 114, 160, a substrate storage container transport chamber 150 is formed, which serves as the transport space for the wafer cassette 110. A wafer cassette transport device (substrate storage container transport device) 118 and a rotating wafer cassette holder (substrate storage container holder) 105 are provided in the substrate storage container transport chamber 150.

[0034] The wafer cassette transport device 118 is configured to include a wafer cassette lift (substrate storage container lifting mechanism) 118a capable of lifting and lowering while holding the wafer cassette 110, and a wafer cassette transport mechanism (substrate storage container transport mechanism) 118b as a transport mechanism. The wafer cassette transport device 118 is configured to transport the wafer cassette 110 between the loading port 114, the wafer cassette holder 105, and the wafer cassette opener 121 (described later) through the continuous operation of the wafer cassette lift 118a and the wafer cassette transport mechanism 118b.

[0035] The wafer cassette holder 105 is configured to have multiple shelf plates (substrate storage container platforms) 117 and vertically erected support columns 116 that can rotate intermittently in the horizontal plane. The wafer cassette holder 105 is configured to function as a container platform, and can store multiple wafer cassettes 110 into the device housing 111 by intermittently rotating the support columns 116 and placing the wafer cassettes 110 onto the shelf plates 117.

[0036] At the lower part of the device housing 111, a sub-housing 119 is disposed from approximately the center of the device housing 111 in the front-rear direction to the rear end. On the front wall 119a of the sub-housing 119, a pair of wafer loading and unloading outlets (substrate loading and unloading outlets) 120 are arranged vertically in two layers to transport the wafer 200 in and out of the sub-housing 119. A wafer cassette opener (substrate storage container opening and closing part) 121 is provided in the upper and lower wafer loading and unloading outlets 120 respectively.

[0037] Each wafer cassette opener 121 includes a pair of mounting stages 122 for placing wafer cassettes 110 and a cover mounting / removing mechanism (cover mounting / removing mechanism) 123 for mounting and dismounting the cover (cover body) of the wafer cassette 110. The wafer cassette opener 121 is configured to open and close the wafer pick-and-place port of the wafer cassette 110 by mounting and dismounting the cover of the wafer cassette 110 placed on the mounting stage 122 using the cover mounting / removing mechanism 123.

[0038] Within the sub-housing 119, a transfer chamber 124, serving as a substrate transfer chamber, is fluidly isolated from the space containing the wafer cassette transport device 118 and the wafer cassette holder 105. A wafer transfer mechanism (substrate transfer mechanism) 125 is provided in the front region of the transfer chamber 124. The wafer transfer mechanism 125 comprises a wafer transfer device (substrate transfer device) 125a capable of rotating or linearly moving the wafer 200 in the horizontal direction and a wafer transfer device elevator (substrate transfer device lifting mechanism) 125b for lifting the wafer transfer device 125a (see reference). Figure 1 The wafer transport device elevator 125b is located between the right end of the front region of the transport chamber 124 of the sub-house 119 and the right end of the house 111 (see reference). Figure 1 The wafer transport device 125a includes a clamp-like member (substrate holder) 125c that serves as a mounting portion for the wafer 200. It is configured to load (fill) and unload (discharge) the wafer 200 relative to the boat (substrate holder) 217 ​​through the continuous operation of the wafer transport device elevator 125b and the wafer transport device 125a.

[0039] In the rear region of the transfer chamber 124, a standby section 126 is configured to house the wafer 217 and keep it in standby mode. Above the standby section 126, a processing container 202 for processing the wafer 200 is provided. The lower end of the processing container 202 is configured to be opened and closed using a furnace gate (furnace opening and closing mechanism) 147. Furthermore, the structure of the processing container 202 will be described later.

[0040] Between the right end of the standby section 126 of the sub-housing 119 and the right end of the housing 111, a boat lifting mechanism (substrate holding device lifting mechanism) 115 for raising and lowering the boat 217 is provided (see reference). Figure 1 An arm 128, serving as a connecting element, is connected to the lifting platform of the vessel elevator 115. A sealing cover 219, serving as a furnace opening cover, is horizontally mounted on the arm 128. The sealing cover 219 is configured to vertically support the vessel 217 and is capable of sealing the lower end of the processing container 202.

[0041] The vessel 217 is configured to horizontally hold multiple wafers 200 (e.g., about 50 to 125 wafers) in a state where they are aligned at their centers and arranged in a vertical direction.

[0042] like Figure 1As shown, a cleaning unit 134, consisting of a supply fan and a dust filter, is provided at the left end of the transfer chamber 124, opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side, to supply cleaned ambient gas or cleaning gas as an inactive gas. The cleaning gas 133 blown out from the cleaning unit 134 flows around the notch alignment device, the wafer transfer device 125a, and the boat 217 in the standby section 126, and is then drawn into the housing 111 by a pipe and discharged to the outside of the housing 111, or circulates to the primary side (supply side) of the cleaning unit 134 as the suction side and is blown out again into the transfer chamber 124 by the cleaning unit 134.

[0043] (2) Structure of the box clamping mechanism

[0044] Next, use Figure 3 The structure of the box clamping mechanism located at each loading port 114 and 160 is described. Figure 3 This is an explanatory diagram showing a structural example of the box clamping mechanism provided on the loading port of the substrate processing apparatus of this embodiment.

[0045] like Figure 3 As shown, each loading port 114, 160 is provided with a cassette clamping mechanism 300 for holding the wafer cassette 110 in a designated location. The cassette clamping mechanism 300 is configured to have a clamping claw 301 that engages with a base 110a at the lower part of the wafer cassette 110, a cylinder 302 that serves as a mechanism for moving the clamping claw 301 up and down, and a rotation mechanism for the clamping claw 301 using a motor or the like (figures omitted).

[0046] If a wafer cassette 110 is placed on the loading ports 114 and 160 of the cassette clamping mechanism 300 configured in this way, the locking claws 301 located near both ends of the loading ports 114 and 160 are raised by the drive of the cylinder 302, and then rotated 90 degrees by the drive of the rotating mechanism. As a result, the locking claws 301 are engaged with the base 110a at the lower part of the wafer cassette 110, and the wafer cassette 110 is held by the cassette clamping mechanism 300, preventing the wafer cassette 110 from falling off or being removed from the loading ports 114 and 160.

[0047] With this configuration, the wafer cassette clamping mechanism 300, since the locking claw 301 is located on the outside of the wafer cassette 110, can hold the wafer cassette 110 on the loading ports 114 and 160 without interfering with the transport device that transports the wafer cassette 110 or hindering the operation of the transport device. In this embodiment, the wafer cassette clamping mechanism 300 uses a single-axis cylinder for holding, resulting in a simple structure and low cost. Since the locking claw 301 is located on the outside of the wafer cassette 110, it is easy to verify the operation and holding of the locking claw 301.

[0048] Furthermore, the height and width of the base 110a vary depending on the manufacturer and type of the wafer cassette 110. In this embodiment, by having adjustment portions for each direction, it is possible to accommodate different situations such as varying height and width of the base 110a. For example, the height of the locking claw 301 is adjusted in the height direction, and the installation position of the locking claw 301 and the cylinder 302 is adjusted in the width direction.

[0049] (3) Structure of the processing container

[0050] Next, use Figure 4 The structure of the processing container 202 in the substrate processing apparatus 100 is explained. Figure 4 This is a longitudinal sectional view showing an example of the structure of the processing container included in the substrate processing apparatus of this embodiment.

[0051] like Figure 4 As shown, the processing container 202 includes a reaction tube 203. The reaction tube 203 is made of a heat-resistant material such as quartz (SiO2) or silicon carbide (SiC) and is formed into a cylindrical shape with openings at the top and bottom. A processing chamber 201 for processing the wafer 200, which serves as a substrate, is formed in the hollow portion of the reaction tube 203. The processing chamber 201 is configured as a boat 217 capable of housing and holding the wafer 200.

[0052] The boat 217, serving as a substrate holder, is configured to hold multiple wafers 200 in a horizontal orientation and with their centers aligned, forming a multi-layered holding structure. The boat 217 is made of a heat-resistant material, such as quartz or silicon carbide, or a combination of both. A heat insulation body 216, also made of a heat-resistant material, such as quartz or silicon carbide, is provided at the bottom of the boat 217, preventing heat from the heater 207 (described later) from being transferred to the sealing cap 219.

[0053] A sealing cover 219, serving as a furnace opening cover, is provided below the reaction tube 203 to airtightly seal the lower opening of the reaction tube 203. The sealing cover 219 abuts against the lower end of the reaction tube 203 from a vertical downward position. The sealing cover 219 is made of a metal such as stainless steel and is formed in a circular plate shape. An O-ring, serving as a sealing member, is provided on the upper surface of the sealing cover 219, abutting against the lower end of the reaction tube 203. As described above, the sealing cover 219 is configured to be raised and lowered vertically by a boat lift 115, which is vertically installed outside the reaction tube 203. This configuration allows the boat 217 to be moved inside and outside the processing chamber 201 by raising and lowering the sealing cover 219.

[0054] Near the center of the sealing cap 219 and on the opposite side of the processing chamber 201, a rotation mechanism 254 is provided to rotate the boat 217. The rotation axis of the rotation mechanism 254 passes through the sealing cap 219 and supports the boat 217 from below. The rotation mechanism 254 is configured to rotate the wafer 200 by rotating the boat 217.

[0055] The transport control unit 275 is electrically connected to the rotating mechanism 254 and the boat lift 115. The transport control unit 275 is configured to control the rotating mechanism 254 and the boat lift 115, causing them to perform desired actions at desired timings. Furthermore, the transport control unit 275 is also electrically connected to the aforementioned wafer cassette lift 118a, wafer cassette transport mechanism 118b, wafer cassette opener 121, wafer transport device 125a, and wafer transport device lift 125b, controlling these components to perform desired actions at desired timings. The transport system of this embodiment mainly consists of the boat lift 115, the rotating mechanism 253, the wafer cassette lift 118a, the wafer cassette transport mechanism 118b, the wafer cassette opener 121, the wafer transport device 125a, and the wafer transport device lift 125b.

[0056] Outside the reaction tube 203, a heater 207, which serves as a heating element, is provided to heat the wafer 200 inside the reaction tube 203, surrounding the side wall of the reaction tube 203. The heater 207 is cylindrical and is vertically mounted by a heater base that serves as a holding plate.

[0057] Inside the reaction tube 203, a temperature sensor 225, such as a thermocouple, is installed as a temperature detector. A temperature control unit 274 is electrically connected to the heater 207 and the temperature sensor 225. The temperature control unit 274 is configured to adjust the power supply to the heater 207 based on the temperature information detected by the temperature sensor 225, so that the temperature inside the processing chamber 201 reaches the desired temperature distribution at a desired timing.

[0058] A processing gas supply nozzle 220 is provided between the reaction tube 203 and the heater 207. The processing gas supply nozzle 220 is arranged along the side of the outer wall of the reaction tube 203. The upper end (downstream end) of the processing gas supply nozzle 220 is hermetically located at the top of the reaction tube 203 (formed at the opening at the upper end of the reaction tube 203). A plurality of processing gas supply holes are provided on the processing gas supply nozzle 220 located at the upper end opening of the reaction tube 203.

[0059] The downstream end of a process gas supply pipe 221 for supplying process gas is connected to the upstream end of the process gas supply nozzle 220. On the process gas supply pipe 221, a process gas supply source 222, a mass flow controller (MFC) 223 (which serves as a flow controller), and a valve 224 (which serves as an on / off valve) are connected in sequence from the upstream side.

[0060] A gas flow control unit 276 is electrically connected to the MFC223. The gas flow control unit 276 is configured to control the MFC223 so that the flow rate of the gas supplied to the processing chamber 201 is the desired flow rate at a desired timing.

[0061] The process gas supply system mainly consists of process gas supply pipe 221, MFC 223, and valve 224. Alternatively, process gas supply nozzle 220 and / or process gas supply source 222 may also be included in the process gas supply system.

[0062] The upstream end of an exhaust pipe 231 is connected to the reaction tube 203 to discharge ambient gas from the reaction tube 203 (processing chamber 201). On the exhaust pipe 231, starting from the upstream side, are arranged in sequence a pressure sensor 232 (pressure detector, pressure detection unit) to detect the pressure inside the processing chamber 201, an APC (Auto Pressure Controller) valve 233 (pressure adjustment device), and a vacuum pump 234 (vacuum exhaust device). Furthermore, the APC valve 233 is an on / off valve, capable of opening and closing to allow or stop vacuum exhaust in the reaction tube 203, and also allowing adjustment of the valve opening to regulate the pressure inside the reaction tube 203.

[0063] A pressure control unit 277 is electrically connected to the APC valve 233 and the pressure sensor 232. The pressure control unit 277 is configured to control the APC valve 233 based on the pressure value detected by the pressure sensor 232, so that the pressure in the processing chamber 201 becomes the desired pressure at a desired time.

[0064] The process gas exhaust section mainly consists of an exhaust pipe 231, a pressure sensor 232, and an APC valve 233. Alternatively, a vacuum pump 234 can also be included in the process gas exhaust section.

[0065] (4) Controller Structure

[0066] Next, use Figure 5 The structure of the controller 280 that controls the processing operation in the substrate processing apparatus 100 configured as described above will be explained. Figure 5 This is a functional block diagram illustrating a structural example of the controller included in the substrate processing apparatus of this embodiment.

[0067] like Figure 5As shown, the controller 280, which serves as the control unit (control mechanism), is configured as a computer equipped with a CPU (Central Processing Unit) 280a, RAM (Random Access Memory) 280b, a storage device 280c, and an I / O port 280d. The RAM 280b, storage device 280c, and I / O port 280d are configured to exchange data with the CPU 280a via an internal bus 280e. Furthermore, the CPU 280a includes a switching unit 280f and a misoperation suppression function unit 280g.

[0068] The storage device 280c is composed of, for example, flash memory, HDD (Hard Disk Drive), CD-ROM, etc. Within the storage device 280c, control programs that control the operation of the substrate processing apparatus 100 and process recipes that describe the steps and conditions of substrate processing are stored in a readable manner. Furthermore, the process recipe is a combination that enables the controller 280 to execute each step of the substrate processing process described later and obtain a predetermined result, and functions as a program. Hereinafter, the process recipe and control program will be collectively referred to as a program. Furthermore, when the term "program" is used in this specification, it may include only the process recipe, only the control program, or both. Additionally, RAM 280b is configured as a storage area (working area) for temporarily storing programs and data read by CPU 280a.

[0069] I / O port 280d is connected to the aforementioned mass flow controllers 210 and 223, valves 211 and 224, gates 213 and 214, APC valve 233, heater 207, temperature sensor 225, boat rotation mechanism 254, vacuum pump 234, wafer cassette opener 121, loading port 114, wafer cassette transport device 118, wafer transport mechanism 125, cleaning gas unit 134, cassette clamping mechanism 300, etc.

[0070] CPU 280a is configured to read and execute control programs from storage device 280c, and to read process recipes from storage device 280c based on input operation instructions from input / output device 281. Furthermore, CPU 280a is configured to, in accordance with the read process recipe, control the temperature adjustment of heater 207 based on temperature sensor 207 via signal line A, control the rotation speed adjustment of boat rotation mechanism 254 via signal line B, control the flow rate adjustment of various gases based on mass flow controllers 210 and 223 via signal line C, and control the opening and closing of valves 211 and 224, the shut-off of gates 213 and 214, the opening adjustment of APC valve 233, and the starting and stopping of vacuum pump 234 via signal line D.

[0071] When the switching unit 280f receives an instruction from the host computer 284 via the input / output device 281 or the external connection unit 283 to switch the operation mode of the loading ports 114 and 160, it instructs the loading ports 114 and 160 to switch operation mode in accordance with the content of the operation mode switching instruction.

[0072] The error suppression function unit 280g and the switching unit 280f notify the loading ports 114 and 160 whether the error suppression function is active or inactive, according to the instructions of the error suppression function unit 280g and the switching unit 280f.

[0073] An input / output device 281 is connected to the controller 280. The input / output device 281 functions as an operation unit for operation by the operator of the board processing apparatus 100, and may be composed of, for example, a touch panel, mouse, keyboard, or operation terminal. The input / output device 281 may also be composed of a display unit such as a monitor.

[0074] Additionally, an external connection unit 283 is connected to the controller 280. The external connection unit 283 is used to ensure connection with an external device, and is configured, for example, by a communication module that enables wireless or wired communication with the external device. As an external device connected to the controller 28 via the external connection unit 283, there is, for example, a host computer 284 that functions as a higher-level device of the board processing device 100.

[0075] Furthermore, the controller 280 is not limited to being configured as a dedicated computer, but can also be configured as a general-purpose computer. For example, an external storage device (e.g., magnetic disks such as magnetic tape, floppy disks, or hard disks, optical discs such as CDs or DVDs, optical disks such as MO, USB (Universal Serial Bus) memory, or memory cards, etc.) 282 storing the aforementioned program can be prepared, and the program can be installed into a general-purpose computer using the external storage device 282. Thus, the controller 280 of this embodiment can be configured. Furthermore, the means for providing the program to the computer are not limited to providing it via the external storage device 282. For example, the program can be provided without using the external storage device 282 using communication means such as the Internet or a dedicated line. Furthermore, the storage device 280c and the external storage device 282 constitute a computer-readable recording medium. Hereinafter, they will be referred to collectively but only as recording media. Furthermore, when the term recording media is used in this specification, there may be cases that only include the storage device 280c, cases that only include the external storage device 282, or cases that include both.

[0076] (5) Sequence of substrate processing steps

[0077] Next, as a step in the semiconductor manufacturing process, utilizing Figure 6 This describes a substrate processing step in which the substrate processing apparatus 100 configured as described above processes the wafer 200. Figure 6 This is a flowchart illustrating an outline of the substrate processing steps in this embodiment.

[0078] As an example, the film formation process of forming a thin film on wafer 200 using CVD (Chemical Vapor Deposition) will be described below. Furthermore, in the following description, the operation of each part constituting the substrate processing apparatus 100 is controlled by controller 280.

[0079] (Substrate handling process (S10))

[0080] First, multiple wafers 200 are loaded into a boat 217 (wafer filling). The boat 217, holding multiple wafers 200, is then lifted by a boat lift 115 and moved into the reaction tube 203 (processing chamber 201) (boat loading). In this state, the furnace opening at the lower end of the reaction tube 203 is sealed by a sealing cap 219.

[0081] (Pressure and temperature adjustment process (S20))

[0082] Vacuum pump 234 is used to exhaust vacuum, bringing the processing chamber 201 to the desired pressure (vacuum level). At this time, pressure sensor 232 measures the pressure in reaction tube 203, and based on this measured pressure value, feedback control (pressure adjustment) is applied to the opening of APC valve 233. Additionally, heater 207 heats the processing chamber 201 to a desired temperature (e.g., 500°C to 1200°C, preferably 1000°C). At this time, based on the temperature value detected by temperature sensor 225, feedback control is applied to the power supply to heater 207 (temperature adjustment).

[0083] Meanwhile, while heating the processing chamber 201, the boat rotation mechanism 254 is activated to begin the rotation of the boat 217, i.e., the rotation of the wafer 200. At this time, the rotation speed of the boat 217 is controlled by the controller 280. Furthermore, the rotation of the boat 217 based on the boat rotation mechanism 254 continues at least until the film deposition process (S30) described later is completed.

[0084] (Film forming process (S30))

[0085] After the desired pressure and temperature are reached in the processing chamber 201, processing gas is supplied to the reaction tube 203 from the processing gas supply pipe 221. Specifically, valve 224 is opened, and while the flow is controlled using MFC 223, processing gas is supplied to the reaction tube 203 from the processing gas supply source 222. As the processing gas passes through the processing chamber 201, it contacts the surface of the wafer 200, and a thin film is deposited on the surface of the wafer 200 through a thermal CVD reaction. Processing gas is supplied to the reaction tube 203 while the opening of APC valve 233 is adjusted, and exhaust gas is pumped out from vacuum pump 234. After a preset processing time, valve 224 is closed, and the supply of processing gas to the reaction tube 203 is stopped.

[0086] (Cooling process (S40))

[0087] After the film formation process (S30) is completed, the power supply to the heater 207 is stopped and the cooling process (S40) begins. In the cooling process (S40), for example, the supply of cooling medium to the cooling medium flow path and the discharge of cooling medium from the cooling medium flow path are performed. Furthermore, after the temperature of the processing container 202 reaches a temperature sufficient to remove the wafer 200 from the processing container 202 (processing chamber 201) (e.g., 600°C or below, preferably 600°C), the supply of cooling medium to the cooling medium flow path is stopped, and the cooling process (S40) ends.

[0088] (Atmospheric pressure recovery and substrate removal processes (S50, S60))

[0089] After the cooling process (S40) is completed, the opening of the APC valve 233 is adjusted to restore the pressure in the processing chamber 201 to atmospheric pressure. Then, the boat 217 is removed from the processing chamber 201 in the reverse order of the substrate loading process described above (boat unloading). Then, the processed wafer 200 is removed from the boat 217 (wafer discharge) and placed into the wafer cassette 110, thus ending the substrate processing process of this embodiment.

[0090] (6) Sequence of substrate loading and unloading operations

[0091] Next, the substrate loading and unloading operations required during the above substrate processing steps will be explained.

[0092] (Substrate loading operation)

[0093] Before performing the substrate processing step, the substrate loading operation described below is performed.

[0094] Specifically, if a wafer cassette 110 containing a wafer 200 to be processed is supplied to a lower loading port 114 or an upper loading port 160, the wafer cassette 110 on the loading port 114, 160 is moved into the device housing 111 via a wafer cassette transfer device 118. Then, the wafer cassette 110 is placed on each shelf plate 117 of the wafer cassette rack 105, whereby the wafer cassette rack 105 stores it.

[0095] Then, the wafer cassettes 110, which contain wafers 200 to be deposited, stored on the wafer cassette rack 105, are transferred from the wafer cassette rack 105 to the mounting stage 122 of the wafer cassette opener 121 using the wafer cassette transport device 118. The open end face of the wafer cassette 110 on the mounting stage 122 is pressed against the edge of the wafer loading / unloading outlet 120 in the front wall 119a of the sub-housing housing 119, and its cover is removed by the cover removal mechanism 123, opening the wafer loading / unloading port.

[0096] If the wafer cassette 110 is opened, the clamp 125c of the wafer transfer device 125a picks up the wafer 200 from the wafer cassette 110 and moves it into the standby section 126 located behind the transfer chamber 124, filling it into the boat 217. The wafer transfer device 125a, having filled the boat 217 with the wafer 200, returns to the wafer cassette 110 to fill the boat 217 with the next wafer 200.

[0097] During the loading of wafers 200 from one (upper or lower) wafer cassette opener 121 to the carrier 217 using the wafer transfer mechanism 125, another wafer cassette 110 is transferred from the wafer cassette rack 105 to the mounting stage 122 of the wafer cassette opener 121 using the wafer cassette transfer device 118. This is performed simultaneously with the wafer cassette 200 loading operation, and the wafer cassette 110 is opened based on the wafer cassette opener 121. The empty wafer cassette 110 is transferred from the wafer cassette opener 121 to the wafer cassette rack 105 and placed on the wafer cassette rack 105.

[0098] In this way, wafer loading is performed into the boat 217, thereby enabling the aforementioned substrate processing steps.

[0099] (Substrate removal action)

[0100] After the substrate processing step is performed, the substrate removal step is performed in the reverse order of the substrate loading step described above. As a result, the wafer cassette 110 containing the processed wafer 200 is moved to the lower loading port 114 or the upper loading port 160.

[0101] (Basic application forms)

[0102] Furthermore, in the substrate processing apparatus 100, a lower loading port 114 and an upper loading port 160 are provided as loading ports used in the aforementioned substrate loading operation. In this embodiment, these upper / lower loading ports 114 and 160 are used in the configuration described below.

[0103] For example, the substrate processing apparatus 100 may be used in a manner where the lower loading port 114 is specifically used when the substrate processing apparatus 100 does not need to be associated with other devices, i.e., when it is offline, so that the operator can manually supply the wafer cassette 110 to the lower loading port 114.

[0104] On the other hand, for example, the substrate processing apparatus 100 may be used specifically for connecting the substrate processing apparatus 100 to other devices, i.e., online, so that the upper loading port 160 is supplied with wafer cassette 110 by an automatic transfer device (not shown) to the upper loading port 160.

[0105] In other words, in this embodiment, offline and online operations can be selectively handled separately, and each loading port 114, 160 can be used separately depending on the selection.

[0106] (Using form switching)

[0107] When the substrate processing apparatus 100 is operated under such conditions, a shortage of the mounting plates 117 of the wafer cassette 105 may occur. For example, depending on the substrate processing steps, there may be situations where a large number of wafer cassettes 110 need to be handled within the apparatus housing 111, and in such cases, there may be a shortage of mounting plates 117 for holding the wafer cassettes 110. If the mounting plates 117 of the wafer cassette 105 are insufficient, there is a concern that unnecessary handling of the wafer cassettes 110 may reduce the production efficiency of substrate processing.

[0108] Therefore, in this embodiment, since each loading port 114, 160 has an upper / lower layer, the usage mode of the loading ports 114, 160 can be switched as needed to eliminate the shortage of wafer cassettes 105, so that at least one of the loading ports 114, 160 can be used as part of the wafer cassette 105. For example, if two wafer cassettes 110 are placed on each loading port 114, 160 (a total of four wafer cassettes 110), the usage mode of each placement location can be switched independently as needed, so that each of the four placement locations can be used as a wafer cassette 105 individually. By switching the usage mode in this way, the number of wafer cassettes 110 accommodated in the substrate processing apparatus 100 can be flexibly and appropriately adjusted.

[0109] The following examples illustrate the switching of the usage modes of loading ports 114 and 160.

[0110] The switching of the operating modes of loading ports 114 and 160 is performed under the action control of controller 280. Controller 280 switches the operating modes of loading ports 114 and 160 based on device commands used to instruct the operation of various parts in the substrate processing apparatus 100. Furthermore, the form of the device commands is not particularly limited, as long as commands commonly used in controller 280 of substrate processing apparatus 100 are used.

[0111] The device commands for switching the operating modes of loading ports 114 and 160 can be set, for example, using an input / output device 281 connected to the controller 280 as an operation unit. However, it is not limited to this. For example, the device commands can be set using a host computer 284 connected to the controller 280 via an external connection unit 283, and the operating mode can be switched based on the instructions from the host computer 284.

[0112] In all cases, device commands are set on the operation screen.

[0113] Figure 7 This is a schematic diagram illustrating an example of the structure of an operation screen used to set device commands.

[0114] like Figure 7 As shown, the screen area of ​​the operation screen 290 is divided into multiple panel partitions. As panel partitions, for example, there is a title panel 291 for displaying screen titles and timestamps, a guide panel 292 for displaying buttons for selecting work partitions, an information panel 293 for displaying different screens for each function, and an instruction panel 294 for displaying execution buttons for device instructions.

[0115] The operation mode switching operation on the operation screen is performed in the following order as described below.

[0116] Figure 8 This is an explanatory diagram showing the sequence of operations for switching the usage mode of the loading port.

[0117] When using the form switching operation, the operation screen will display... Figure 8 The command information display area is shown in (a). If the LoadPort Status icon is selected in this command information display area, the operation screen switches to... Figure 8 (b) shows the command selection request (Please select Execute Command). Here, if the Change Service icon is selected, the operation screen switches to... Figure 8 The mechanism selection request shown in (c) allows you to specify the loading port that will be the target of the application mode switching. Furthermore, regarding the specification of the loading port, if it is the lower loading port 114, it can be specified according to each part of the wafer cassette 110 (e.g., "loading port 1", "loading port 2"). Similarly, for the upper loading port 160, it can be specified according to each part of the wafer cassette 110 (e.g., "loading port 3", "loading port 4"). In other words, if there are a total of four loading parts in the wafer cassette 110, then each of "loading port 1" to "loading port 4" can be independently switched in application mode. Therefore, for example, even when loading ports 160 ("Loading Port 3" and "Loading Port 4") are used as loading ports and loading ports 114 ("Loading Port 1" and "Loading Port 2") are used as mounting racks, if the wafer tray 105 has insufficient mounting boards, it is possible to use one or both of loading ports 160 ("Loading Port 3" or "Loading Port 4") as mounting racks accordingly. Furthermore, if a specific loading port is selected, the operation screen switches to... Figure 8The command selection request shown in (d) (Please select Execute Command) allows you to specify whether the selected load port is set to In Service or Out of Service.

[0118] If, after the above-described application mode switching operation, the selected loading port is set to "In Service," then the controller 280 is sent a device instruction for that purpose. Furthermore, based on this device instruction, the controller 280 uses the selected loading port as the loading port in its original application mode, and so on.

[0119] On the other hand, if the selected loading port is set to "Out of Service" after the above-described application mode switching operation, a device instruction of the same purpose is sent to the controller 280. Furthermore, according to the device instruction, the controller 280 switches the application mode of the selected loading port so that it is used as part of the wafer tray 105 instead of as a loading port.

[0120] In other words, in this embodiment, when the service status of the selected loading port is switched to "Out of Service" on the operation screen that indicates the switching of the service status of the loading port, the controller 280 switches the application mode to use the loading port as part of the wafer cassette 105. By switching the application mode in this way, even if there is a possibility of insufficient racks 117 for example, the wafer cassette 105, a portion of the loading ports 114 and 160 can be used as part of the wafer cassette 105. Therefore, the problem of insufficient racks in the wafer cassette 105 can be solved, and the increase or decrease in the number of wafer cassettes 110 in the substrate processing apparatus 100 can be flexibly and appropriately addressed. Moreover, by switching the application mode, the number of wafer cassettes 110 in the wafer cassette 105 can be substantially increased without changing (modifying) the hardware structure of the substrate processing apparatus 100.

[0121] This switching of application mode is performed by the controller 280 based on device commands indicating device operation. In other words, the application mode of the loading port is switched by utilizing the loading port service state (InService / OutOfService) switching function of the device commands, which are existing functions in the board processing apparatus 100. Therefore, by utilizing the existing functions in the board processing apparatus 100, significant changes (modifications) to the software structure of the board processing apparatus 100 can be suppressed.

[0122] Furthermore, by switching the operating mode based on device commands, there is no need to restart the substrate processing apparatus 100 along with the switching of the operating mode. In other words, the controller 280 switches the operating mode of the loading port without restarting the device. In this way, the operating mode of the loading port can be switched without restarting the substrate processing apparatus 100, thus eliminating the time spent on device restart and the time spent on resetting related parameters.

[0123] In this embodiment, the switching of the loading port's operating mode can be performed on the operation screen of the input / output device 281, which is connected to the controller 280 and serves as an operation unit. Therefore, the loading port's operating mode can be switched solely through operation on the input / output device 281, without requiring significant changes (modifications) to the hardware structure of the board processing apparatus 100.

[0124] However, the switching of the loading port's operating mode can also be based on instructions from the host computer 284. That is, the loading port's operating mode can be switched when there is a loading port change request (Change Service Status) from the host computer 284. In this case, the loading port's operating mode can be switched without operation on the input / output device 281. Therefore, the switching of the loading port's operating mode can be remotely managed in accordance with the operation of the host computer 284, resulting in operation without impacting production.

[0125] (Action to suppress accidental operation)

[0126] As described above, in this embodiment, the usage mode of each loading port 114 and 160 can be switched. That is, each loading port 114 and 160 can be used individually as a loading port or as part of the wafer cassette 105, depending on the placement location of the wafer cassette 110.

[0127] If such a switching of application mode can be performed, there is a risk of operator misoperation, such as wanting to remove wafer cassette 110 from the loading port, regardless of whether the loading port has been used as part of wafer cassette 105.

[0128] Therefore, in this embodiment, in addition to being able to switch the operating modes of loading ports 114 and 160, the misoperation suppression function unit 280f provides operation instructions to each cassette clamping mechanism 300 provided on the loading ports 114 and 160 via the controller 280, so as to perform misoperation suppression operations in accordance with the operating mode. That is, each cassette clamping mechanism 300 performs misoperation suppression operations for the wafer cassette 110 disposed on the loading ports 114 and 160 in accordance with the operation instructions from the controller 280, thereby functioning as the misoperation suppression function unit.

[0129] Specifically, the box clamping mechanism 300 performs the following processing actions as a misoperation suppression action.

[0130] For example, when one of the loading ports 114 and 160 is used as part of the wafer cassette holder 105, the cassette clamping mechanism 300 provided on the loading port that becomes part of the wafer cassette holder 105 is set to a state in which the wafer cassette 110 placed on the loading port is held, i.e., a container holding state (clamping state). More specifically, the base 100a of the wafer cassette 110 placed on the loading port is held in a clamping state with the locking claw 301 of the cassette clamping mechanism 300. However, when no wafer cassette 110 is placed on the loading port, the locking claw 301 of the cassette clamping mechanism 300 can be rotated to set it to an unclamped state.

[0131] By performing this misoperation suppression action by the cassette clamping mechanism 300, operator errors can be prevented from occurring at the loading ports that serve as part of the wafer cassette rack 105. For example, when the loading port is not loaded with a wafer cassette 110, the cassette clamping mechanism 300 can be set to a clamping state to prevent the wafer cassette 110 from being mistakenly placed on the loading port. Furthermore, for example, when a wafer cassette 110 is already loaded on the loading port, the cassette clamping mechanism 300 can be set to a clamping state to prevent the wafer cassette 110 from being mistakenly removed from the loading port. In other words, even when switching the operating modes of the loading ports 114 and 160, by performing this misoperation suppression action of switching the clamping / unclamping state of the cassette clamping mechanism 300 according to its operating mode, operator errors caused by this switching can be prevented.

[0132] Furthermore, for example, when using loading ports 114 and 160 as loading ports, the container clamping mechanism 300 is set to a container-unheld state (unclamped state). More specifically, as a rule, the locking claw 301 of the container clamping mechanism 300 is rotated to be set to an unclamped state, allowing the wafer cassette 110 to be supplied or discharged relative to loading ports 114 and 160. Moreover, the container clamping mechanism 300 is set to a clamping state only when a wafer cassette 110 is supplied and loaded.

[0133] By implementing such error suppression measures, when loading ports 114 and 160 are used as loading ports as is, loading ports 114 and 160 can be used in the same way as in conventional substrate processing apparatuses.

[0134] (Emergency response actions in case of failure)

[0135] As described above, in this embodiment, the usage mode of each loading port 114, 160 can be switched, and one of the loading ports 114, 160 can be used as part of the wafer cassette 105. That is, by switching the usage mode of the loading ports 114, 160, one of them can be used as part of the wafer cassette 105, while the other loading ports are used as loading ports as before.

[0136] In this case, if the loading port used as the loading port becomes faulty for some reason, the transfer of wafer cassette 110 between the substrate processing apparatus 100 and the substrate processing apparatus 100 cannot be carried out, and there is a concern that the downtime of the substrate processing apparatus 100 will have an adverse impact on the productivity of the substrate processing process.

[0137] Therefore, in this embodiment, in addition to switching the application mode by using one of the loading ports 114 and 160 as part of the wafer cassette 105, the application mode is also switched in a way that allows for recovery in case of loading port failure. Specifically, as a recovery mechanism in case of loading port failure, the controller 280 identifies whether the loading ports 114 and 160 are in a fault state (in particular, the fault state of the loading port used as a loading port), and based on the identification result, switches the application mode of the loading ports 114 and 160 so that other loading ports are used as alternatives to the loading ports in a fault state.

[0138] During the operation of the substrate processing apparatus 100, the controller 280 continuously monitors the status of the loading ports 114 and 160, enabling the detection of faults in the loading ports 114 and 160. Regarding the status monitoring, for example, it can be performed using known techniques such as utilizing sensor detection results or monitoring the response time of device commands. Furthermore, based on the results of this status monitoring, the controller identifies whether a fault condition exists in the loading ports 114 and 160, particularly those used as loading ports.

[0139] As a result, if a loading port is identified as faulty, the controller 280 switches the operating mode of loading ports 114 and 160 to utilize other loading ports to replace the function of that loading port. Specifically, the use of the loading port in a faulty state is stopped, and on the other hand, for other loading ports that are already used as part of the wafer cassette holder 105, the cassette clamping mechanism 300 is set to an unclamped state, and the wafer cassette 110 is removed from the other loading port. Moreover, for the other loading port, the service state is switched to In Service, so that it can be used as a replacement for the loading port in a faulty state.

[0140] In this way, when a loading port is in a faulty state, the operating mode is switched to use another loading port as its replacement. Therefore, even if a loading port fails, it can be used as a replacement for the faulty loading port simply by changing the state of the loading port that is being used as part of the wafer cassette 105. As a result, it can help reduce the downtime of the substrate processing apparatus 100 and suppress adverse effects on the productivity of the substrate processing process.

[0141] (7) Effects of the implementation method

[0142] According to this embodiment, one or more of the following effects are achieved.

[0143] (a) According to this embodiment, the operating mode of each loading port 114, 160 can be switched so that at least one wafer cassette 110 among the multiple loading ports 114, 160 can be used as part of the wafer cassette holder 105. Therefore, even in cases where there is a possibility of insufficient wafer cassette holder 117, the insufficient wafer cassette holder 105 can be resolved by switching the operating mode of the loading ports 114, 160. Moreover, since the solution is made by switching the operating mode, the number of wafer cassettes 110 can be substantially increased without changing (modifying) the hardware structure of the substrate processing apparatus 100.

[0144] Furthermore, according to this embodiment, an operation suppression action is performed to switch the clamping state / unclamping state of the box clamping mechanism 300 in accordance with the operating mode of each loading port 114, 160. Therefore, even when dealing with the switching of the operating mode of each loading port 114, 160, operator errors caused by the switching can be prevented.

[0145] In other words, according to this embodiment, the number of wafer cells 110 in the substrate processing apparatus 100 can be increased or decreased flexibly and appropriately.

[0146] (b) According to this embodiment, the operation mode of loading ports 114 and 160 is switched based on device instructions that instruct device operation. In other words, the operation mode of the loading ports is switched using the loading port service state (In Service / Out Of Service) switching function of the device instructions, which are existing functions in the board processing apparatus 100. Therefore, even when dealing with the switching of the operation mode of loading ports 114 and 160, significant changes (modifications) to the software structure of the board processing apparatus 100 can be suppressed.

[0147] (c) According to this embodiment, the switching of the operating modes of the loading ports 114 and 160 can be performed without restarting the substrate processing apparatus 100. Therefore, even when dealing with the switching of the operating modes of the loading ports 114 and 160, the time spent on restarting the apparatus and the time spent on resetting the relevant parameters are eliminated.

[0148] (d) According to this embodiment, when one of the loading ports 114 and 160 is used as part of the wafer cassette holder 105, the cassette clamping mechanism 300 is set to a container holding state (clamping state). Therefore, misoperations such as the operator accidentally placing the wafer cassette 110 onto the loading port or removing the placed wafer cassette 110 can be prevented.

[0149] (e) According to this embodiment, when loading ports 114 and 160 are used as loading ports as is, the container clamping mechanism 300 is set to a container non-holding state (unclamped state). Therefore, in this usage mode, loading ports 114 and 160 can be used in the same way as in the case of a conventional substrate processing apparatus.

[0150] (f) According to this embodiment, the operation modes of loading ports 114 and 160 can be switched on the operation screen of the input / output device 281, which is connected to the controller 280 and serves as an operation unit. Therefore, the operation modes of loading ports 114 and 160 can be switched solely through operation on the input / output device 281, without requiring significant changes (modifications) to the hardware structure of the board processing apparatus 100.

[0151] (g) According to this embodiment, the operating modes of loading ports 114 and 160 can be switched based on instructions from a host computer 284 connected via an external connection unit 283. In this case, the operating modes of loading ports 114 and 160 can be switched without operation on the input / output device 281. Therefore, the switching of operating modes of loading ports 114 and 160 can be remotely managed in accordance with the operation of the host computer 284, resulting in operation without affecting production.

[0152] (h) According to this embodiment, the presence or absence of a fault in loading ports 114 and 160 is identified. If a loading port is in a faulty state, the operating mode is switched so that another loading port can be used as its replacement. Therefore, even if a loading port fails, it can be used as a replacement for the faulty loading port simply by changing the state of the loading port currently being used as part of the wafer cassette 105. As a result, it helps to shorten the downtime of the substrate processing apparatus 100 and can suppress adverse effects on the productivity of the substrate processing process.

[0153] (8) Variations, etc.

[0154] The embodiments of the present invention have been specifically described above, but the present invention is not limited to the above embodiments and various modifications can be made without departing from its spirit.

[0155] For example, in the above embodiments, film formation is listed as an example of substrate processing steps, but the present invention is not limited to this. That is, in the present invention, regardless of the specific content of the substrate processing steps, it is applicable not only to film formation but also to other substrate processing such as annealing, diffusion, oxidation, nitriding, and photolithography. Moreover, the present invention is also applicable to other substrate processing apparatuses, such as annealing apparatuses, etching apparatuses, oxidation apparatuses, nitriding apparatuses, exposure apparatuses, coating apparatuses, drying apparatuses, heating apparatuses, plasma processing apparatuses, and other substrate processing apparatuses. In addition, the present invention may also combine these apparatuses. Furthermore, regarding the structure of the embodiments, other structures can be added, deleted, or replaced.

[0156] (9) Preferred embodiment of the present invention

[0157] The preferred embodiments of the present invention are described below.

[0158] [Postscript 1]

[0159] According to one aspect of the present invention, a substrate processing apparatus is provided, comprising:

[0160] Loading port, which is capable of holding a substrate storage container for storing substrates;

[0161] The control unit controls the switching unit and the misoperation suppression function unit. The switching unit can switch between a first function of using the loading port for loading or unloading the substrate storage container and a second function of placing the substrate storage container on the loading port. The misoperation suppression function unit performs misoperation suppression operations on the substrate storage container disposed on the loading port in accordance with the application mode accompanying the aforementioned functions.

[0162] The processing chamber processes the aforementioned substrate.

[0163] [Postscript 2]

[0164] A substrate processing apparatus as described in Appendix 1 is provided, preferably,

[0165] The aforementioned control unit switches the aforementioned operating mode based on device commands that instruct the device to operate.

[0166] [Postscript 3]

[0167] A substrate processing apparatus as described in Appendix 2 is provided, preferably,

[0168] The aforementioned control unit can switch the aforementioned operating mode without restarting the device.

[0169] [Postscript 4]

[0170] A substrate processing apparatus as described in Appendix 1 is provided, preferably,

[0171] The aforementioned misoperation suppression function is composed of a holding mechanism that holds the substrate storage container disposed on the loading port. When the loading port is in an application mode accompanying the second function, the holding mechanism in the loading port is set to a container holding state.

[0172] [Postscript 5]

[0173] A substrate processing apparatus as described in Appendix 4 is provided, preferably,

[0174] When the loading port is used in the manner described above, the misoperation suppression function set the state of the holding mechanism in the loading port to a container non-holding state.

[0175] [Postscript 6]

[0176] A substrate processing apparatus as described in Appendix 1 is provided, preferably,

[0177] It has an operating unit that is set to respond to device commands.

[0178] The control unit switches the operation mode based on the device commands set by the operation unit.

[0179] [Postscript 7]

[0180] A substrate processing apparatus as described in Appendix 1 is provided, preferably,

[0181] It has an external connection part for connecting to a higher-level device.

[0182] The control unit switches the operation mode based on instructions from the superior device connected to the external connection unit.

[0183] [Postscript 8]

[0184] A substrate processing apparatus as described in Appendix 1 is provided, preferably,

[0185] The control unit identifies whether the multiple loading ports are in a faulty state and switches the operation mode so that other loading ports are used as alternatives to the loading ports in a faulty state.

[0186] [Postscript 9]

[0187] According to another aspect of the present invention, a method for manufacturing a semiconductor device is provided, comprising:

[0188] The process of placing the substrate storage container for storing substrates onto the loading port.

[0189] A process of switching between the first function of using the loading port for the loading of the substrate storage container and the second function of placing the substrate storage container on the loading port.

[0190] The process of performing a misoperation suppression operation on the substrate storage container disposed on the loading port is performed in accordance with the application mode of the above-mentioned functions; and

[0191] The process of processing the above-mentioned substrate.

[0192] [Postscript 10]

[0193] According to another aspect of the present invention, a program is provided that uses a computer to cause a substrate processing apparatus to perform the following steps:

[0194] The step of placing the substrate storage container for storing the substrate onto the loading port;

[0195] A step of switching between the first function of using the loading port for moving the substrate storage container in or out and the second function of placing the substrate storage container on the loading port.

[0196] The steps of performing a misoperation suppression operation on the substrate storage container disposed on the loading port are performed in accordance with the application mode of the above-described functions; and

[0197] The steps for processing the above-mentioned substrate.

Claims

1. A substrate processing apparatus, characterized in that, have: Loading port, which is capable of holding a substrate storage container for storing substrates; A substrate storage container holder is provided inside the device and is capable of holding multiple substrate storage containers. A control unit is capable of controlling a switching unit and a misoperation suppression function unit. The switching unit can switch between a first function and a second function. The first function is to transfer the substrate storage container to the substrate storage container holder after it has been placed on the loading port. The second function is to use the loading port as part of the substrate storage container holder instead of transferring it to the loading port after it has been placed on the loading port. The misoperation suppression function unit switches the state of the container clamping mechanism located on the loading port between a container holding state and a container non-holding state according to the application mode associated with the first and second functions, thereby performing a misoperation suppression operation on the substrate storage container disposed on the loading port. The processing chamber is used to process the substrate. The box clamping mechanism is configured to hold the substrate storage container placed on the loading port in a container holding state, and not hold the substrate storage container placed on the loading port in a container non-holding state.

2. The substrate processing apparatus according to claim 1, characterized in that, The control unit switches the operating mode based on device commands that instruct the device to operate.

3. The substrate processing apparatus according to claim 2, characterized in that, The control unit can switch the operating mode without restarting the device.

4. The substrate processing apparatus according to claim 1, characterized in that, The misoperation suppression function is composed of the box clamping mechanism.

5. The substrate processing apparatus according to claim 4, characterized in that, When the loading port is in the mode of operation accompanying the second function, the misoperation suppression function sets the state of the box clamping mechanism in the loading port to the container holding state.

6. The substrate processing apparatus according to claim 5, characterized in that, When the loading port is in the mode of operation accompanying the second function, the misoperation suppression function set the state of the box clamping mechanism in the loading port to the container non-holding state only when the substrate storage container is placed on the loading port.

7. The substrate processing apparatus according to claim 4, characterized in that, When the loading port is in the mode of operation accompanying the first function, the misoperation suppression function sets the state of the box clamping mechanism in the loading port to the container non-holding state.

8. The substrate processing apparatus according to claim 7, characterized in that, When the loading port is in the mode of operation accompanying the first function, the misoperation suppression function sets the state of the box clamping mechanism in the loading port to the container holding state only when the substrate storage container is placed on the loading port.

9. The substrate processing apparatus according to claim 1, characterized in that, It has an operating unit that is set to respond to device commands. The control unit switches the operation mode based on device commands set by the operation unit.

10. The substrate processing apparatus according to claim 9, characterized in that, Having multiple loading ports, the operation unit is capable of setting the switching of the application mode of at least one of the loading ports.

11. The substrate processing apparatus according to claim 1, characterized in that, It has an external connection part for connecting to a higher-level device. The control unit switches the operating mode based on instructions from the upper-level device connected to the external connection unit.

12. The substrate processing apparatus according to claim 1, characterized in that, The control unit identifies whether any of the multiple loading ports are in a faulty state and switches the operating mode so that other loading ports are used as alternatives to the loading ports in a faulty state.

13. A switching method, characterized in that, include: The process of placing the substrate storage container for storing substrates onto the loading port. A process for switching between a first function and a second function, wherein the first function is to transport the substrate storage container to a substrate storage container holder disposed within the device and capable of holding multiple substrate storage containers after placing the substrate storage container on the loading port; and the second function is to use the loading port as part of the substrate storage container holder instead of transporting the substrate storage container to the loading port after placing the substrate storage container on the loading port; and Corresponding to the application configuration associated with the first function and the second function, the state of the box clamping mechanism provided on the loading port is switched between a container holding state and a container non-holding state, thereby performing a step of suppressing misoperation of the substrate storage container disposed on the loading port. The box clamping mechanism is configured to hold the substrate storage container placed on the loading port in a container holding state, and not hold the substrate storage container placed on the loading port in a container non-holding state.

14. A method for manufacturing a semiconductor device, characterized in that, include: The process of placing the substrate storage container for storing substrates onto the loading port. The process of switching between a first function and a second function, wherein the first function is to transport the substrate storage container to a substrate storage container rack provided in the device and capable of holding multiple substrate storage containers after placing the substrate storage container on the loading port, and the second function is to use the loading port as part of the substrate storage container rack instead of transporting the substrate storage container to the substrate storage container rack after placing the substrate storage container on the loading port. Corresponding to the application configuration associated with the first function and the second function, the state of the box clamping mechanism provided on the loading port is switched between a container holding state and a container non-holding state, thereby performing a step of suppressing misoperation of the substrate storage container disposed on the loading port; and The process of processing the substrate. The box clamping mechanism is configured to hold the substrate storage container placed on the loading port in a container holding state, and not hold the substrate storage container placed on the loading port in a container non-holding state.

15. A recording medium, a computer-readable recording medium, recording a program that enables a board processing apparatus to perform the following steps using a computer: The step of placing the substrate storage container for storing the substrate onto the loading port; The steps for switching between the first function and the second function include, The first function is to transfer the substrate storage container to a substrate storage container holder provided in the device and capable of holding multiple substrate storage containers after placing the substrate storage container on the loading port. The second function is to use the loading port as part of the substrate storage container holder instead of transferring the substrate storage container to the substrate storage container holder after placing the substrate storage container on the loading port. Corresponding to the application configuration associated with the first function and the second function, the state of the box clamping mechanism provided on the loading port is switched between a container holding state and a container non-holding state, thereby performing a step of misoperation suppression action against the substrate storage container disposed on the loading port; and The step of processing the substrate. The box clamping mechanism is configured to hold the substrate storage container placed on the loading port in a container holding state, and not hold the substrate storage container placed on the loading port in a container non-holding state.

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