Lens module and electronic device

Abstract

The application provides a lens module, which comprises a first circuit board, a first motor, a second motor and a temperature sensor. The first motor is located on the first circuit board and comprises a first shell and a power device. The first shell comprises a side surface, and a groove is arranged on the side surface. The second motor is located on the same surface of the first circuit board as the first motor, and comprises a second shell and a shape memory alloy. The shape memory alloy is located between the first shell and the second shell. The temperature sensor is accommodated in the groove and is used for measuring the ambient temperature of the shape memory alloy to obtain a temperature signal. The application can accurately monitor and feedback the ambient temperature of the shape memory alloy. The application further provides an electronic device comprising the lens module.

Description

Technical Field

[0001] This application relates to the field of electronic and optical devices, and more particularly to a lens module and electronic device. Background Technology

[0002] In lens module design, temperature sensors are sometimes required to measure the ambient temperature near the shape memory alloy (SMA) within the lens module. Currently, temperature sensors are typically placed on the circuit board where the motor is mounted. However, this approach usually presents the following problems: First, the temperature sensor is susceptible to interference from other heat-generating components on the circuit board; second, because the temperature sensor is relatively far from the SMA, it cannot accurately reflect the ambient temperature of the SMA; and third, because there can be no obstructions between the temperature sensor and the SMA, and the temperature sensor cannot be covered by anything, the overall lens module becomes bulky and its design complex. Summary of the Invention

[0003] In view of this, this application provides a lens module that can solve at least one of the above problems.

[0004] Additionally, it is necessary to provide an electronic device having the lens module.

[0005] One embodiment of this application provides a lens module, including a first circuit board. The lens module further includes a first motor, a second motor, and a temperature sensor. The first motor is located on the first circuit board and includes a first housing and a power unit. The first housing includes a side surface with a groove. The second motor is located on the first circuit board and on the same surface as the first motor. The second motor includes a second housing and a shape memory alloy, which is located between the first housing and the second housing. The temperature sensor is housed in the groove and is used to measure the ambient temperature of the shape memory alloy to obtain a temperature signal.

[0006] An embodiment of this application also provides an electronic device including the lens module.

[0007] This application creates a groove on the side of the first motor and places the temperature sensor within the groove, making the temperature sensor close to the shape memory alloy. This allows the temperature sensor to accurately monitor and report the ambient temperature of the shape memory alloy. Simultaneously, because the temperature sensor is located within the groove, the first housing provides protection and isolation for the temperature sensor, reducing the influence and interference of the external environment. Furthermore, since the temperature sensor is located inside the lens module, it improves the reliability of the lens module and facilitates its miniaturization. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of a lens module provided in one embodiment of this application.

[0009] Figure 2 yes Figure 1 A top view of the lens module shown.

[0010] Figure 3 yes Figure 1 A partial cross-sectional view of the lens module shown.

[0011] Figure 4 This is a schematic diagram of the electronic device of a lens module provided in an embodiment of this application.

[0012] Explanation of main component symbols

[0013] Lens Module 100

[0014] First circuit board 10

[0015] First Motor 20

[0016] First shell 21

[0017] Side view 211

[0018] Groove 212

[0019] First Reception Port 213

[0020] Lens 30

[0021] Second motor 40

[0022] Second shell 41

[0023] Second receiving port 411

[0024] Shape memory alloy 42

[0025] Fastener 50

[0026] Activity item 51

[0027] Temperature sensor 60

[0028] First controller 70

[0029] Second circuit board 80

[0030] Resistance 90

[0031] Electronic devices 200

[0032] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0035] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0036] Please see Figures 1 to 3 One embodiment of this application provides a lens module 100, which includes a first circuit board 10, a first motor 20, a lens 30, a second motor 40, a temperature sensor 60, a first controller 70, and a second circuit board 80.

[0037] Please see Figure 1 The first circuit board 10 is a flexible board, a rigid board, or a rigid-flex board. In this embodiment, the first circuit board 10 is a rigid board.

[0038] A second controller (not shown) is mounted on one surface of the first circuit board 10. The second controller is located on and electrically connected to the first circuit board 10. In this embodiment, the second controller may be an IC chip.

[0039] Please refer to the following: Figure 2The first motor 20 is located on the first circuit board 10. In this embodiment, the first motor 20 includes a first housing 21 and a power unit (not shown). In this embodiment, the first housing 21 is generally a hollow cuboid shape. The first housing 21 includes four sides 211. One of the sides 211 has a groove 212. Specifically, one of the sides 211 is recessed inward to form the groove 212. The first housing 21 has a first receiving hole 213, and the first receiving hole 213 penetrates the first housing 21.

[0040] The lens 30 is housed in the first receiving hole 213. The power device can drive the lens 30 to move, so as to adjust the position of the lens 30 in the first receiving hole 213, that is, adjust the focal length of the lens 30.

[0041] The second motor 40 is located on the first circuit board 10 and on the same surface as the first motor 20. The second motor 40 includes a second housing 41 and a shape memory alloy 42. In this embodiment, the second housing 41 is generally a hollow cuboid. The second housing 41 has a second receiving hole 411 that extends through it. In this embodiment, the first motor 20 is housed within the second receiving hole 411. The shape memory alloy 42 is located between the second housing 41 and the first housing 21.

[0042] The shape memory alloy 42 has the following properties: when the crystal structure of the shape memory alloy 42 changes due to temperature and stress, it will return to a reference or "memorized" shape when heated or the stress is removed.

[0043] When current flows through the shape memory alloy 42, the temperature of the shape memory alloy 42 increases, causing the crystal structure of the shape memory alloy 42 to change and the length of the shape memory alloy 42 to shorten, so that the shape memory alloy 42 moves, thereby driving the first motor 20 and the lens 30 to move for image stabilization of the lens 30.

[0044] The second housing 41 is provided with a fixing member 50 and a movable member 51. The shape memory alloy 42 is also disposed on the fixing member 50 and the movable member 51. In this embodiment, there are two fixing members 50 and two movable members 51. Specifically, the two fixing members 50 are located at two opposite corners of the second housing 41, and the two movable members 51 are located at the other two opposite corners of the second housing 41. When the shape memory alloy 42 moves, the positions of the two fixing members 50 do not change, while the positions of the two movable members 51 move with the movement of the shape memory alloy 42. In this embodiment, the fixing member 50 may be a protrusion fixed to the second housing 41, and the movable member 51 may be a pulley slidably disposed on the second housing 41.

[0045] The temperature sensor 60 is housed in the groove 212. The temperature sensor 60 is used to measure the ambient temperature of the shape memory alloy 42 (i.e., the ambient temperature near the shape memory alloy 42) to obtain a temperature signal. In this embodiment, the temperature sensor 60 may be a thermistor.

[0046] Please see Figure 3 The first controller 70 is housed in the recess 212. The first controller 70, the second controller, and the temperature sensor 60 are electrically connected. The first controller 70 receives the temperature signal and controls the current flowing through the shape memory alloy 42 based on the temperature signal. In this embodiment, the first controller 70 may be an IC chip.

[0047] Please refer to the following: Figure 2 and Figure 3 The second circuit board 80 is located between the first motor 20 and the second motor 40, and a portion of the second circuit board 80 is housed in the recess 212. The temperature sensor 60 and the first controller 70 are also located on the second circuit board 80 and are electrically connected to it. In this embodiment, the second circuit board 80 is a flexible circuit board. The second circuit board 80 is electrically connected to the first circuit board 10.

[0048] The second circuit board 80 is provided with a resistor 90, which is also housed in the groove 212. The resistor 90 is electrically connected to the second circuit board 80. The resistor 90 is used in conjunction with the thermistor to improve the sensitivity of the thermistor.

[0049] It is understood that the lens module 100 also includes a photosensitive chip (not shown) and a filter (not shown). The photosensitive chip is located on the first circuit board 10, and the filter and the photosensitive chip are disposed opposite to each other.

[0050] Please see Figure 4 The lens module 100 can be applied to various electronic devices 200 with camera modules, such as mobile phones, wearable devices, computer devices, vehicles, or monitoring devices. In this embodiment, the lens module 100 is applied to a mobile phone.

[0051] This application creates a groove 212 on the side 211 of the first motor 20 and places the temperature sensor 60 within the groove 212, making the temperature sensor 60 close to the shape memory alloy 42. This allows the temperature sensor 60 to accurately monitor and report the ambient temperature of the shape memory alloy 42. Simultaneously, because the temperature sensor 60 is located within the groove 212, the first housing 21 provides protection and isolation for the temperature sensor 60, reducing the influence and interference of the external environment. Furthermore, since the temperature sensor 60 is located inside the lens module 100, it improves the reliability of the lens module 100 and facilitates its miniaturization.

[0052] The above description is merely an optimized implementation of this application, but in actual applications, it should not be limited to this implementation.

Claims

1. A lens module, comprising a first circuit board, characterized in that, The lens module also includes a first motor, a second motor, and a temperature sensor. The first motor is located on the first circuit board and includes a first housing and a power unit. The first housing includes a side surface with a groove. The second motor is located on the first circuit board and on the same surface as the first motor. The second motor includes a second housing and a shape memory alloy, which is located between the first housing and the second housing. The temperature sensor is housed in the groove and is used to measure the ambient temperature of the shape memory alloy to obtain a temperature signal. The lens module also includes a second circuit board, which is located between the first motor and the second motor, and a portion of the second circuit board is housed in the groove. The temperature sensor is also located on the second circuit board.

2. The lens module as described in claim 1, characterized in that, The lens module also includes a lens, and the first housing has a first receiving hole, in which the lens is received. The power device is used to drive the first housing to adjust the position of the lens in the first receiving hole.

3. The lens module as described in claim 1, characterized in that, The second housing has a second receiving hole, the first motor is received in the second receiving hole, the second housing has a fixing member and a moving member, and the shape memory alloy is also disposed on the fixing member and the moving member.

4. The lens module as described in claim 1, characterized in that, The lens module also includes a first controller, which is located on the second circuit board and housed in the groove. The first controller is used to receive the temperature signal and control the current passing through the shape memory alloy according to the temperature signal.

5. The lens module as described in claim 4, characterized in that, The lens module also includes a second controller, which is located on the first circuit board and is electrically connected to the first controller.

6. The lens module as described in claim 4, characterized in that, The first controller is an IC chip.

7. The lens module as described in claim 1, characterized in that, The temperature sensor is a thermistor.

8. The lens module as described in claim 1, characterized in that, The lens module also includes a resistor located on the second circuit board and housed in the groove.

9. An electronic device, characterized in that, Includes the lens module as described in any one of claims 1 to 8.

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