Camera module and molded wiring board thereof

Abstract

The application discloses a camera module and a molded wiring board thereof. The camera module includes a lens assembly and a photosensitive assembly. The photosensitive assembly includes a molded wiring board, a photosensitive chip, and a lead frame. The lead frame further includes a movable portion, a fixed portion, and a deformation portion disposed between the movable portion and the fixed portion. The fixed portion is disposed on the molded wiring board. The photosensitive chip is disposed on the movable portion and corresponds to a board material through hole. The photosensitive chip is suspended on the back of the molded wiring board by the lead frame and is allowed to translate. The lens assembly is attached to the molded wiring board.

Description

Technical Field

[0001] This invention relates to optical imaging devices, and more particularly to a camera module and its molded circuit board. Background Technology

[0002] In recent years, the functions of portable electronic devices have developed rapidly and become increasingly sophisticated. Among them, the camera module, as a crucial component of portable electronic devices, has also undergone continuous evolution in design and application. A camera module mainly consists of a circuit board, a photosensitive chip, electronic components, a lens mount, and a lens. The photosensitive chip, electronic components, and lens mount are all mounted on the circuit board, with the photosensitive chip and electronic components connected to the circuit board. The lens mount is directly or indirectly mounted on the lens mount via a driver. Thus, the circuit board provides integrated circuitry and mechanical support. The surface of the circuit board typically has exposed circuit boards, vias, and pads. These structures make the surface uneven, affecting the flatness of the photosensitive chip, electronic components, and lens mount. Even with an ink layer on the surface of the circuit board, the ink layer cannot effectively improve the flatness. Furthermore, the photosensitive chip generates a large amount of heat during operation (photoelectric conversion), and the ink layer on the circuit board hinders heat conduction and diffusion, affecting the heat dissipation performance of the camera module.

[0003] In addition, the imaging requirements of camera modules in portable electronic devices are becoming increasingly demanding. To achieve better focusing and image stabilization, the driver often needs to have a greater driving stroke, which places increasingly higher demands on the driver's driving force. Simultaneously, as the number of lens elements increases, the driving force requirements also increase. To drive heavier lenses within a greater range of stroke, the driver's size needs to increase. However, the trend towards thinner and lighter portable electronic devices places even more stringent demands on the overall size of the camera module, conversely requiring that the driver's size cannot be increased. Therefore, based on the existing design concepts of camera modules, the contradiction between miniaturization and high image quality cannot be reconciled; that is, a miniaturized camera module cannot achieve high-quality imaging, and a camera module with high-quality imaging cannot be miniaturized. Summary of the Invention

[0004] One object of the present invention is to provide a camera module and a molded circuit board thereof, wherein the camera module allows a photosensitive chip to be movably held on the back side of a molded circuit board and electrically connected to the photosensitive chip and the molded circuit board via a lead frame, thereby achieving chip-based image stabilization of the camera module.

[0005] One object of the present invention is to provide a camera module and a molded circuit board thereof, wherein the lead frame provides a deformable portion surrounding the photosensitive chip. In one embodiment, the deformable portion is used to provide a pathway connecting the photosensitive chip and the molded circuit board and a driving force for translating the photosensitive chip. In another embodiment, the deformable portion is used to provide a restoring force to allow the photosensitive chip to reset after it has been translated.

[0006] One object of the present invention is to provide a camera module and a molded circuit board thereof, wherein the lead frame provides a fixed part and a movable part, the deformable part is located between the fixed part and the movable part, wherein the deformable part provides a driving force by generating deformation to drive the movable part to move the photosensitive chip to achieve chip image stabilization of the camera module, or the deformable part provides a restoring force by generating deformation to allow the movable part to move the photosensitive chip to reset.

[0007] One object of the present invention is to provide a camera module and a molded circuit board thereof, wherein the camera module provides at least one support component for suspending the photosensitive chip on the back of the molded circuit board, wherein the support component allows point contact connection between the movable part and the molded circuit board to allow the movable part to smoothly move the photosensitive chip.

[0008] One object of the present invention is to provide a camera module and its molded circuit board, wherein the support component allows point contact connection between the movable part and a substrate of the camera module, so as to allow the movable part to smoothly translate the photosensitive chip.

[0009] One object of the present invention is to provide a camera module and a molded circuit board thereof, wherein the flatness of the molded circuit board manufactured by the molding process can be improved, which is beneficial to ensuring the flatness of the molded circuit board and the photosensitive chip, thereby improving the imaging quality of the camera module.

[0010] One object of the present invention is to provide a camera module and a molded circuit board thereof, wherein a lens assembly of the camera module can be directly mounted on the front side of the molded circuit board, and the molded circuit board can ensure that the optical axis of the lens assembly is perpendicular to the photosensitive chip, so as to ensure the imaging quality of the camera module.

[0011] One object of the present invention is to provide a camera module and a molded circuit board thereof, wherein the heat dissipation performance of the molded circuit board manufactured by the molding process can be improved, so that when the heat generated by the photosensitive chip is radiated to the molded circuit board, the molded circuit board can dissipate heat quickly, which helps to reduce the operating temperature of the camera module and thus ensure the reliability of the camera module during operation.

[0012] One object of the present invention is to provide a camera module and a molded circuit board thereof, wherein the structural strength of the molded circuit board can be increased based on the molding process, so that the molded circuit board is not easily deformed when assembling the camera module or when using the camera module, thereby ensuring the reliability of the camera module when it is used.

[0013] One object of the present invention is to provide a camera module and a molded circuit board thereof, wherein the thickness of the molded circuit board based on the molding process can be reduced, which is beneficial to reducing the height of the camera module so that the camera module is suitable for electronic devices that pursue thinness and lightness.

[0014] According to one aspect of the present invention, a camera module is provided, comprising:

[0015] A lens assembly; and

[0016] A photosensitive assembly, wherein the photosensitive assembly includes a molded circuit board, a photosensitive chip, and a lead frame, wherein the lead frame further includes a movable part, a fixed part, and a deformable part disposed between the movable part and the fixed part, the fixed part is disposed on the molded circuit board, the photosensitive chip is disposed on the movable part and a plate through hole corresponding to the molded circuit board, so as to suspend the photosensitive chip on the back of the molded circuit board by the lead frame and allow the photosensitive chip to translate, wherein a lens assembly is mounted on the molded circuit board.

[0017] According to one embodiment of the present invention, the deformable part is configured to drive the movable part to move the photosensitive chip.

[0018] According to one embodiment of the present invention, the movable part has a movable part extension arm on each of its opposite sides, the fixed part has a fixed part extension arm on each of its opposite sides, the deformable part includes a plurality of deformable units, the deformable units are disposed at intervals between the movable part and the fixed part, and each movable part extension arm of the movable part extends toward the fixed part and is connected to each deformable unit, and each fixed part extension arm of the fixed part extends toward the movable part and is connected to each deformable unit.

[0019] According to one embodiment of the present invention, each of the deformation units includes an elastomer and a molded body wrapped around the outside of the elastomer.

[0020] According to one embodiment of the present invention, the molded circuit board is disposed on the inner wall of the fixing part, and the front surface of the molded circuit board is flush with the top surface of the fixing part, so that the molded circuit board and the fixing part together provide a mounting platform for mounting the lens assembly.

[0021] According to one embodiment of the present invention, the camera module further includes a filter portion, wherein the filter portion is mounted on the molded circuit board.

[0022] According to one embodiment of the present invention, the camera module further includes a substrate, wherein the edge of the substrate is disposed on the fixing portion to close the bottom opening of the fixing portion by the substrate.

[0023] According to one embodiment of the present invention, the camera module further includes an upper support assembly and a lower support assembly, wherein the upper support assembly is disposed between the movable part and the molded circuit board, and allows point contact connection between the movable part and the molded circuit board, wherein the lower support assembly is disposed between the movable part and the substrate, and allows point contact connection between the movable part and the substrate.

[0024] According to one embodiment of the present invention, the upper support assembly has at least three upper guide rails and at least three upper grooves, and includes at least three upper balls. Each of the upper guide rails is respectively disposed on one of the back surface of the molded circuit board and the top surface of the movable part. Each of the upper grooves is respectively disposed on the other of the back surface of the molded circuit board and the top surface of the movable part. A portion of each of the upper balls is rollably held in each of the upper guide rails and each of the upper grooves, and each of the upper balls creates a gap between the molded circuit board and the movable part.

[0025] According to one embodiment of the present invention, the upper support assembly has four upper guide rails and four upper grooves, and includes four upper balls. Each upper guide rail is respectively disposed at each corner of the molded circuit board or at each corner of the movable part, and each upper groove is respectively disposed at each corner of the movable part or at each corner of the molded circuit board, such that each upper ball is respectively held between each corner of the molded circuit board and each corner of the movable part.

[0026] According to one embodiment of the present invention, the lower support assembly has at least three lower guide rails and at least three lower grooves, and includes at least three lower balls. Each of the lower guide rails is respectively disposed on at least one of the inner wall of the substrate and the back surface of the movable part, and each of the lower grooves is respectively disposed on the other of the inner wall of the substrate and the back surface of the movable part. A portion of each lower ball is rollably held in each of the lower guide rails and each of the lower grooves, and each lower ball creates a gap between the substrate and the movable part.

[0027] According to one embodiment of the present invention, the lower support assembly has four lower guide rails and four lower grooves, and includes four lower balls. Each lower guide rail is respectively disposed at each corner of the substrate or at each corner of the movable part, and each lower groove is respectively disposed at each corner of the movable part or at each corner of the substrate, such that each lower ball is respectively held at each corner of the substrate and at each corner of the movable part.

[0028] According to one embodiment of the present invention, the molded circuit board includes at least one molding layer, at least one metal layer and at least one set of conductive pillars. The metal layer is composed of a plurality of conductors and a plurality of trenches, the trenches being located between adjacent conductors. The conductive pillars contact and conduct the conductors. The molding layer is integrally bonded to the sidewalls of the conductors and the conductive pillars of the metal layer, and the molding layer fills the trenches of the metal layer.

[0029] According to another aspect of the invention, the invention further provides a molded circuit board comprising:

[0030] At least one set of conductive pillars;

[0031] At least one metal layer, wherein the metal layer comprises a plurality of conductors and a plurality of trenches, the trenches being located between adjacent conductors, and the conductive pillars contacting and conducting the conductors; and

[0032] At least one molding layer, wherein the molding layer is integrally bonded to the sidewalls of the conductor and the conductive post of the metal layer, and the molding layer fills the trench of the metal layer.

[0033] According to one embodiment of the present invention, the molded circuit board includes three sets of conductive pillars, three metal layers, and three molding layers. The three sets of conductive pillars are sequentially a first set of conductive pillars, a third set of conductive pillars, and a fourth set of conductive pillars. The three metal layers are sequentially a first metal layer, a second metal layer, and a third metal layer. The three molding layers are sequentially a first molding layer, a second molding layer, and a third molding layer. The first molding layer is integrally bonded to the conductor of the first metal layer and the sidewall of the first conductive pillar. The second molding layer is formed on the first molding layer and integrally bonded to the conductor of the second metal layer and the sidewall of the second conductive pillar. The third molding layer is formed on the second molding layer and integrally bonded to the conductor of the third metal layer and the sidewall of the third conductive pillar. Attached Figure Description

[0034] Figure 1 This is a perspective view of a camera module according to a preferred embodiment of the present invention.

[0035] Figure 2 This is an exploded view of the camera module according to the preferred embodiment of the present invention described above.

[0036] Figure 3 This is an exploded view of the camera module according to the above-described preferred embodiment of the present invention.

[0037] Figure 4 This is an exploded view of the camera module according to the preferred embodiment of the present invention from another perspective.

[0038] Figure 5 This is a cross-sectional schematic diagram showing one of the usage states of the camera module according to the above-described preferred embodiment of the present invention.

[0039] Figure 6 This is a cross-sectional schematic diagram showing a second usage state of the camera module according to the above-described preferred embodiment of the present invention.

[0040] Figures 7A to 7K This is a schematic diagram illustrating the manufacturing process of a molded circuit board for the camera module according to the above-described preferred embodiment of the present invention.

[0041] Figure 8 This is a cross-sectional schematic diagram of a modified example of the camera module according to the above-described preferred embodiment of the present invention.

[0042] Figure 9 This is a cross-sectional schematic diagram of another variation of the camera module according to the above-described preferred embodiment of the present invention.

[0043] Figure 10This is a cross-sectional schematic diagram of another variation of the camera module according to the above-described preferred embodiment of the present invention.

[0044] Figure 11 This is a cross-sectional schematic diagram of another variation of the camera module according to the above-described preferred embodiment of the present invention.

[0045] Figure 12 This is a top view schematic diagram of a lead frame of the camera module according to the above preferred embodiment of the present invention. Detailed Implementation

[0046] Before detailing any embodiment of the invention, it should be understood that the invention is not limited in its application to the details of the construction and arrangement of the components set forth in the following description or illustrated in the following figures. The invention can have other embodiments and can be practiced or carried out in various ways. Furthermore, it should be understood that the wording and terminology used herein are for descriptive purposes and should not be considered limiting. The use of “comprising,” “including,” or “having,” and variations thereof is intended to cover the items set forth below and their equivalents, as well as any additional items. Unless otherwise specified or limited, the terms “installation,” “connection,” “support,” and “linkage,” and variations thereof are used broadly and cover both direct and indirect installation, connection, support, and linking. Moreover, “connection” and “linkage” are not limited to physical or mechanical connections or links.

[0047] Furthermore, firstly, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting this invention. Secondly, the term "a" should be understood as "at least one" or "one or more," that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. The term "a" should not be construed as a limitation on the quantity.

[0048] See attached diagrams in the reference manual. Figures 1 to 7K A camera module according to a preferred embodiment of the present invention will be disclosed and described in the following description, wherein the camera module includes a photosensitive component 10 and a lens component 20 disposed on the photosensitive component 10.

[0049] Specifically, the photosensitive assembly 10 further includes a molded circuit board 11, a photosensitive chip 12, and a lead frame 13. The molded circuit board 11 has a through-hole 111 extending from its front to its back. The lead frame 13 allows the photosensitive chip 12 to be movably held on the back of the molded circuit board 11 and to be electrically connected to the molded circuit board 11. The through-hole 111 of the molded circuit board 11 corresponds to the photosensitive chip 12. Preferably, the size of the through-hole 111 of the molded circuit board 11 is equal to or smaller than the size of the photosensitive chip 12, thereby reducing vignetting to ensure the imaging quality of the camera module. The lens assembly 20 includes an optical lens 21, which is held in the light-sensitive path of the photosensitive chip 12. Incident light can pass through the optical lens 21 and the perforation 111 of the molded circuit board 11 in sequence to reach the photosensitive chip 12. Subsequently, the photosensitive chip 12 performs photoelectric conversion to allow the camera module to form an image. During the imaging process of the camera module, the lead frame 13 is configured to drive the photosensitive chip 12 to translate (move along a direction perpendicular to the optical axis) to achieve chip-based image stabilization of the camera module.

[0050] Preferably, the lens assembly 20 further includes a driver 22, on which the optical lens 21 is drivably mounted. The driver 22 is attached to the photosensitive assembly 10, such that the driver 22 maintains the photosensitive path of the optical lens 21 on the photosensitive chip 12. The driver 22 is configured to drive the optical lens 21 to move along the optical axis to achieve focusing of the camera module.

[0051] It is worth mentioning that the type of driver 22 is not limited in the camera module of the present invention, as long as it can maintain the light-sensing path of the optical lens 21 on the photosensitive chip 12 and drive the optical lens 21 to move along the optical axis of the photosensitive chip 12. For example, the driver 22 can be, but is not limited to, a VCM (Voice Coil Motor) driver.

[0052] Optionally, in other embodiments of the camera module of the present invention, the optical lens 21 of the lens assembly 20 can be directly mounted to the photosensitive assembly 10 to maintain the light-sensing path of the optical lens 21 to the photosensitive chip 12. In this specific example of the camera module, the camera module is a fixed-focus camera module.

[0053] Continue to refer to the appendix Figures 1 to 6The lead frame 13 includes a movable part 131, a fixed part 132, and a deformable part 133. The photosensitive chip 12 is disposed on the movable part 131, the fixed part 132 is disposed on the molded circuit board 11, and the fixed part 132 surrounds the outside of the movable part 131. The deformable part 133 is deformably disposed between the movable part 131 and the fixed part 132, thus allowing the photosensitive chip 12 to be held on the back of the molded circuit board 11. When the deformable part 133 of the lead frame 13 deforms, the deformable part 133, through the movable part 131, drives the photosensitive chip 12 to translate, thereby achieving chip-based image stabilization of the camera module.

[0054] It is worth mentioning that the manner in which the photosensitive chip 12 is disposed on the movable part 131 is not limited in the camera module of the present invention. For example, in the attached... Figures 1 to 6 In this specific example of the camera module of the present invention, the movable portion 131 is square-shaped and surrounds the photosensitive chip 12 to allow the photosensitive chip 12 to be embedded in the center of the movable portion 131. Optionally, in another specific example of the camera module of the present invention, the movable portion 131 is plate-shaped and provides a mounting surface on which the photosensitive chip 12 is mounted. Optionally, in another specific example of the camera module of the present invention, the movable portion 131 may be integrally formed with the photosensitive chip 12.

[0055] Preferably, the deformation part 133 can be implemented based on SMA (Shape Memory Alloy) driving technology, that is, the deformation part 133 can provide driving force. Thus, when power is supplied to the deformation part 133, the deformation part 133 can drive the movable part 131 to move the photosensitive chip 12 by deforming. In this way, not only can the overall structure of the camera module be simplified, but the miniaturization of the camera module can also be achieved.

[0056] Preferably, conductive elements can be provided in the movable part 131 and the fixed part 132 respectively by insert injection molding process. These conductive elements can be embedded inside the movable part 131 and the fixed part 132, or a part or surface of these conductive elements can be exposed on the surface of the movable part 131 and the fixed part 132. The deformable part 133 is connected to the conductive elements of the movable part 131 and the fixed part 132. The photosensitive chip 12 is connected to the conductor of the movable part 131, and the conductor of the fixed part 132 is connected to the molded circuit board 11. Thus, on the one hand, the molded circuit board 11 can supply power to the deformable part 133 through the conductor of the fixed part 132 to control the deformation mode and deformation range of the deformable part 133, thereby driving the movable part 131 to move the photosensitive chip 12. On the other hand, the molded circuit board 11 can supply power to the photosensitive chip 12 through the conductors of the fixed part 132, the deformable part 133, and the movable part 131 to drive the photosensitive chip 12 to work. At the same time, the electrical signal generated by the photosensitive chip 12 can be transmitted to the molded circuit board 11 through the conductors of the movable part 131, the deformable part 133, and the fixed part 132.

[0057] Therefore, in the camera module of the present invention, the molded circuit board 11 and the photosensitive chip 12 are not directly connected by traditional leads, but are connected by the lead frame 13. In this way, the reliability of the connection between the molded circuit board 11 and the photosensitive chip 12 can be greatly improved. At the same time, the leadless design helps to reduce the height of the camera module.

[0058] Optionally, in the appendix Figure 8In this specific example of the camera module shown, the movable part 131 and the fixed part 132 are not embedded with conductors. Instead, a movable part conductive pattern 1311 is provided on the surface of the movable part 131 and a fixed part conductive pattern 1321 is provided on the surface of the fixed part 132. The movable part conductive pattern 1311 is conductively connected to the photosensitive chip 12 and the deformable part 133, and the fixed part conductive pattern 1321 is conductively connected to the deformable part 133 and the molded circuit board 11. Thus, on the one hand, the molded circuit board 11 can transmit power through the fixed part conductive pattern 1321 to the photosensitive chip 12 and the deformable part 133. The deformable part 133 is powered to control the deformation mode and deformation range of the deformable part 133, thereby driving the movable part 131 to move the photosensitive chip 12. On the other hand, the molded circuit board 11 can power the photosensitive chip 12 through the conductive pattern 1321 of the fixed part, the deformable part 133 and the conductive pattern 1311 of the movable part to drive the photosensitive chip 12 to work. At the same time, the electrical signal generated by the photosensitive chip 12 can be transmitted to the molded circuit board 11 through the conductive pattern 1311 of the movable part, the deformable part 133 and the conductive pattern 1321 of the fixed part.

[0059] Continue to refer to the appendix Figures 1 to 6 The molded circuit board 11 is fixed to the inner wall of the fixing part 132 of the lead frame 13, and the front surface of the molded circuit board 11 is flush with the top surface of the fixing part 132. Thus, the molded circuit board 11 and the fixing part 132 together provide a mounting platform to replace the traditional lens mount for mounting the lens assembly 20. In other words, in the attached... Figures 1 to 6 In this specific example of the camera module shown, the camera module eliminates the lens mount and allows the lens assembly 20 to be directly mounted on the molded circuit board 11 and the fixing part 132, which helps to simplify the structure of the camera module and reduce the height of the camera module.

[0060] Optionally, in the appendix Figure 9 In this specific example of the camera module shown, the molded circuit board 11 is fixed to the top surface of the lead frame 13, so that the molded circuit board 11 provides a separate mounting platform to replace the conventional lens mount for mounting the lens assembly 20.

[0061] It is worth mentioning that the fixing method of the molded circuit board 11 and the fixing part 132 is not limited in the camera module of the present invention. For example, in one feasible example of the camera module, after the fixing part 132 is formed, the molded circuit board 11 and the fixing part 132 are bonded by adhesive such as glue, so that the molded circuit board 11 is disposed on the inner wall or top surface of the fixing part 132; in another feasible example of the camera module, the fixing part 132 is integrally formed on the side of the molded circuit board 11 by injection molding, so that the molded circuit board 11 is disposed on the inner wall of the fixing part 132, or the fixing part 132 is integrally formed on the back of the molded circuit board 11 by injection molding, so that the molded circuit board 11 is disposed on the top surface of the fixing part 11.

[0062] Continue to refer to the appendix Figures 1 to 6 The camera module includes a substrate 30, the edge of which is disposed on the fixing portion 132 of the lead frame 13, so that the bottom opening of the fixing portion 132 is closed by the substrate 30, thereby preventing the movable portion 131, the deformable portion 133 and the photosensitive chip 12 from being exposed, and a gap is formed between the movable portion 131 and the photosensitive chip 12 and the substrate 30. In other words, the molded circuit board 11 and the substrate 30 are respectively supported on opposite sides of the fixing portion 132.

[0063] Continue to refer to the appendix Figures 1 to 6 The camera module further includes at least one support component 40, which is used to suspend the photosensitive chip 12 on the back of the molded circuit board 11 and allow point contact connection between the movable part 131 and the molded circuit board 11, so that the deformable part 133 drives the movable part 131 to smoothly move the photosensitive chip 12, thereby improving the response sensitivity of the camera module and improving the imaging quality of the camera module.

[0064] Preferably, the camera module includes two support components 40, one of which is disposed between the molded circuit board 11 and the movable part 131 and is defined as an upper support component 41, and the other support component 40 is disposed between the movable part 131 and the substrate 30 and is defined as a lower support component 42. Thus, the upper support component 41 and the lower support component 42 cooperate with each other to suspend the photosensitive chip 12 on the back of the molded circuit board 11.

[0065] Specifically, the upper support assembly 41 has at least three upper guide rails 411, at least three upper grooves 412, and at least three upper balls 413. Each upper guide rail 411 is located on the back side of the molded circuit board 11, each upper groove 412 is located on the top surface of the movable part 131, and a portion of each upper ball 413 is rollably held in each upper guide rail 411 and each upper groove 412, with each upper ball 413 creating a gap between the molded circuit board 11 and the movable part 131. By providing the upper grooves 412 on the top surface of the movable part 131 and allowing portions of the upper balls 413 to be rollably held in the upper grooves 412, the relative positions of these upper balls 413 can be prevented from changing during chip-based image stabilization of the camera module, thereby preventing the movable part 131 and the photosensitive chip 12 from tilting.

[0066] Preferably, the upper guide rail 411 is a cross-shaped guide rail, so that the deformable part 133 can drive the movable part 131 to move the photosensitive chip 12 in two directions, thereby realizing chip image stabilization of the camera module.

[0067] Optionally, in other examples of the camera module of the present invention, each of the upper guide rails 411 of the upper support assembly 41 may be provided on the top surface of the movable part 131, and correspondingly, each of the upper grooves 412 may be provided on the back side of the molded circuit board 11, and portions of each upper ball 413 are respectively rollably held in each upper guide rail 411 and each upper groove 412, and each upper ball 413 creates a gap between the molded circuit board 11 and the movable part 131.

[0068] In the appendix Figures 1 to 6 In this specific example of the camera module shown, the upper support assembly 41 has four upper guide rails 411 and four upper grooves 412, as well as four upper balls 413. Each upper guide rail 411 is respectively located at each corner of the molded circuit board 11, and the four upper grooves 412 are respectively located at each corner of the movable part 131. Thus, the four upper balls 413 are held between the molded circuit board 11 and the movable part 131 at each corner of the molded circuit board 11 and at each corner of the movable part 131.

[0069] Accordingly, the lower support assembly 42 has at least three lower guide rails 421 and at least three lower grooves 422, as well as at least three lower balls 423. Each lower guide rail 421 is disposed on the inner wall of the substrate 30, each lower groove 422 is disposed on the back side of the movable part 131, and a portion of each lower ball 423 is rotatably held in each lower guide rail 421 and each lower groove 422, and each lower ball 423 creates a gap between the substrate 30 and the movable part 131. By providing the lower grooves 422 on the back side of the movable part 131 and allowing a portion of the lower balls 423 to be rotatably held in the lower grooves 422, the relative positions of these lower balls 423 can be prevented from changing during the chip-based image stabilization process of the camera module, thereby preventing the movable part 131 and the photosensitive chip 12 from tilting.

[0070] Preferably, the lower guide rail 421 is a cross-shaped guide rail, so that the deformable part 133 can drive the movable part 131 to move the photosensitive chip 12 in two directions, thereby realizing chip image stabilization of the camera module.

[0071] Optionally, in other examples of the camera module of the present invention, each of the lower guide rails 421 of the lower support assembly 42 may be disposed on the back side of the movable part 131, and correspondingly, each of the lower grooves 422 may be disposed on the inner wall of the substrate 30, and portions of each lower ball 423 are respectively rollably held in each of the lower guide rails 421 and each of the lower grooves 422, and each of the lower balls 423 creates a gap between the substrate 30 and the movable part 131.

[0072] In the appendix Figures 1 to 6 In this specific example of the camera module shown, the lower support assembly 42 has four lower guide rails 421 and four lower grooves 422, as well as four lower balls 423. Each lower guide rail 421 is provided at each corner of the substrate 30, and the four lower grooves 422 are provided at each corner of the movable part 131. Thus, the four lower balls 423 are held between the substrate 30 and the movable part 131 at each corner of the substrate 30 and each corner of the movable part 131, respectively.

[0073] In other words, in the appendix Figures 1 to 6In this specific example of the camera module shown, each upper ball bearing 413 of the upper support assembly 41 is rotatably held between the molded circuit board 11 and the movable part 131, and each lower ball bearing 423 of the lower support assembly 42 is rotatably held between the substrate 30 and the movable part 131. Thus, the upper support assembly 41 and the lower support assembly 42 cooperate to suspend the photosensitive chip 12 on the back of the molded circuit board 11. Furthermore, each upper ball bearing 413 of the upper support assembly 41 allows point contact connection between the movable part 131 and the molded circuit board 11, and each lower ball bearing 423 of the lower support assembly 42 allows point contact connection between the movable part 131 and the substrate 30. In this way, the deformable part 133 can drive the movable part 131 to smoothly translate the photosensitive chip 12, thereby improving the responsiveness of the camera module and enhancing its imaging quality.

[0074] Continue to refer to the appendix Figures 1 to 6 The photosensitive component 10 further includes at least one electronic component 14, which may be a resistor, capacitor, processor, etc., and is mounted on the molded circuit board 11. Preferably, the electronic component 14 is mounted on the front side of the molded circuit board 11, so that the photosensitive chip 12 and the electronic component 14 are respectively held on opposite sides of the molded circuit board 11. In this way, the internal space of the camera module can be reasonably arranged, and the electronic component 14 is prevented from affecting the translation of the photosensitive chip 12.

[0075] Continue to refer to the appendix Figures 1 to 6 The photosensitive component 10 further includes a filter section 15, which can be implemented as a filter, for example, an infrared cut-off filter. The filter section 15 is mounted on the molded circuit board 11 in a manner that blocks the perforations 111 of the board material. Thus, the filter section 15 is maintained in the photosensitive path of the photosensitive chip 12. In this way, incident light must pass through the filter section 15 before reaching the photosensitive chip 12, so that the filter section 15 filters out the corresponding light type from the incident light, thereby improving the imaging quality of the camera module. Optionally, in the attached... Figure 10 In this specific example of the camera module shown, the filter 15 is a film layer, such as an IR film, which is attached to or formed on the photosensitive surface of the photosensitive chip 12 to replace the filter. This helps to further save the internal space of the camera module and reduce the height of the camera module.

[0076] In the camera module of the present invention, the molded circuit board 11 is manufactured using a molding process to give it good flatness, enabling it to be used as a support platform. This allows the photosensitive chip 12 to be suspended on the back of the molded circuit board 11, and the filter 15 and the lens assembly 20 to be mounted on the molded circuit board 11. Furthermore, the molded circuit board 11, manufactured using a molding process, has good structural strength, making it less prone to deformation during both assembling and using the camera module. In this way, when using the molded circuit board 11 as a support platform to mount the filter 15 and the lens assembly 20 on its front side, and to suspend the photosensitive chip 12 on its back side, the molded circuit board 11 effectively ensures the stability of the camera module, thereby guaranteeing the imaging quality of the camera module.

[0077] Furthermore, the thickness of the molded circuit board 11, based on the molding process, can be reduced, which helps to lower the height of the camera module, making it suitable for thinner and lighter electronic devices. Simultaneously, the heat dissipation performance of the molded circuit board 11 can be improved, allowing it to quickly dissipate heat when the heat generated by the photosensitive chip 12 radiates to it, thus reducing the operating temperature of the camera module and ensuring its reliability during operation.

[0078] Appendix Figures 7A to 7K The manufacturing process of the molded circuit board 11 based on the molding process is shown.

[0079] Reference Appendix Figure 7A and Figure 7B A first metal layer 200 is formed on the surface of a metal substrate 100. The first metal layer 200 comprises a plurality of first conductors 201 and a plurality of first trenches 202. The first conductors 201 are used to subsequently form the circuitry of the molded circuit board 11. The first trenches 202 are formed between adjacent first conductors 201 to prevent short circuits in the molded circuit board 11. Preferably, the metal material used to form the first metal layer 200 is copper. Preferably, the first metal layer 200 is formed on the surface of the metal substrate 100 by electroplating.

[0080] Reference Appendix Figure 7CA first set of conductive pillars 300 is formed on the surface of the first metal layer 200. These first set of conductive pillars 300 contact and conduct electricity to the first conductors 201 of the first metal layer 200. Preferably, the first set of conductive pillars 300 is made of copper; that is, the first set of conductive pillars 300 is a copper pillar. Preferably, the width of the first set of conductive pillars 300 is slightly larger than the height of the first metal layer 200.

[0081] Reference Appendix Figure 7D This allows a first molding layer 400 to be integrally bonded to the sidewalls of the first metal layer 200 and the first set of conductive pillars 300, at which time the end faces of the first set of conductive pillars 300 are exposed on the surface of the first molding layer 400. For example, firstly, the assembly of the metal substrate 100, the first metal layer 200, and the first set of conductive pillars 300 is placed in a molding die. At this time, the lower mold of the molding die can be attached to the metal substrate 100, and the upper mold can be attached to the end face of the first set of conductive pillars 300. Secondly, molding material is injected into the molding die to allow the molding material to cover the portions of the first conductors 201 of the first metal layer 200 exposed in the molding space of the molding die and to cover the portions of the first set of conductive pillars 300 exposed in the molding space of the molding die. Thirdly, after curing the molding material and demolding, the first molding layer 400 is formed, thereby the first molding layer 400 is integrally bonded to the sidewalls of the first metal layer 200 and the first set of conductive pillars 300, and the end face of the first set of conductive pillars 300 is exposed on the surface of the first molding layer 400.

[0082] After the first molding layer 400 is formed, the thickness of the first molding layer 400 can be reduced by a grinding process, but not limited to. This is beneficial in reducing the thickness of the molded circuit board 11 and in fully exposing the end faces of the first set of conductive pillars 300 to ensure the reliability of subsequent electrical connections.

[0083] Reference Appendix Figure 7EA second metal layer 500 is formed on the surface of the first molding layer 400. The second metal layer 500 comprises a plurality of second conductors 501 and a plurality of second trenches 502. The second conductors 501 contact and conduct the first set of conductive pillars 300 and are subsequently used to form the circuitry of the molded circuit board 11. The second trenches 502 are formed between adjacent second conductors 501 to prevent short circuits in the molded circuit board 11. Preferably, the metal material used to form the second metal layer 500 is copper. Preferably, the second metal layer 500 is formed on the surface of the first molding layer 400 by electroplating. Preferably, the second conductors 501 of the second metal layer 500 are distributed relatively dispersedly relative to the first conductors 201 of the first metal layer 200 to facilitate connections between subsequent components.

[0084] Reference Appendix Figure 7F A second set of conductive pillars 600 is formed on the surface of the second metal layer 500. These second set of conductive pillars 600 respectively contact and conduct electricity to the second conductors 501 of the second metal layer 500. Preferably, the material of the second set of conductive pillars 600 is copper, that is, the second set of conductive pillars 600 are copper pillars. Preferably, the width of the second set of conductive pillars 600 is slightly larger than the height of the second metal layer 500.

[0085] Reference Appendix Figure 7G This allows a second molding layer 700 to be integrally bonded to the sidewalls of the first molding layer 400, the second metal layer 500, and the second set of conductive pillars 600, in which case the end faces of the second set of conductive pillars 600 are exposed on the surface of the second molding layer 700. For example, firstly, the assembly of the metal substrate 100, the first metal layer 200, the first set of conductive pillars 300, the first molding layer 400, the second metal layer 500, and the second set of conductive pillars 600 is placed in a molding die. At this time, the lower mold of the molding die can be attached to the metal substrate 100 and the upper mold can be attached to the end face of the second set of conductive pillars 600. Secondly, molding material is injected into the molding die so that the molding material covers the portions of the second conductors 501 of the second metal layer 500 exposed in the molding space of the molding die and covers the portions of the second set of conductive pillars 600 exposed in the molding space of the molding die. Thirdly, after curing the molding material and demolding, the second molding layer 700 is formed, thereby the second molding layer 700 is integrally bonded to the sidewalls of the second metal layer 500 and the second set of conductive pillars 600, and the end face of the second set of conductive pillars 600 is exposed on the surface of the second molding layer 700.

[0086] After the second molding layer 700 is formed, the thickness of the second molding layer 700 can be reduced by a grinding process, but not limited to. This is beneficial in reducing the thickness of the molded circuit board 11 and in fully exposing the end faces of the second set of conductive pillars 600 to ensure the reliability of subsequent electrical connections.

[0087] Reference Appendix Figure 7H A third metal layer 800 is formed on the surface of the second molding layer 700. The third metal layer 800 comprises a plurality of third conductors 801 and a plurality of third trenches 802. The third conductors 801 contact and conduct the second set of conductive pillars 600 and are subsequently used to form the circuitry of the molded circuit board 11. The third trenches 802 are formed between adjacent third conductors 801 to prevent short circuits in the molded circuit board 11. Preferably, the metal material used to form the third metal layer 800 is copper. Preferably, the third metal layer 800 is formed on the surface of the second molding layer 700 by electroplating. Preferably, the distribution of the third conductors 801 in the third metal layer 800 relative to the distribution of the second conductors 501 in the second metal layer 500 facilitates the connection between subsequent components.

[0088] Reference Appendix Figure 7I A third set of conductive pillars 900 is formed on the surface of the third metal layer 800. These third set of conductive pillars 900 respectively contact and conduct electricity to the third conductors 801 of the third metal layer 800. Preferably, the material of the third set of conductive pillars 900 is copper, that is, the third set of conductive pillars 900 are copper pillars. Preferably, the width of the third set of conductive pillars 900 is slightly larger than the height of the third metal layer 800.

[0089] Reference Appendix Figure 7JThis allows a third molding layer 1000 to be integrally bonded to the sidewalls of the second molding layer 700, the third metal layer 800, and the third set of conductive pillars 900, in which case the end faces of the third set of conductive pillars 900 are exposed on the surface of the third molding layer 1000. For example, firstly, the assembly of the metal substrate 100, the first metal layer 200, the first set of conductive pillars 300, the first molding layer 400, the second metal layer 500, the second set of conductive pillars 600, the second molding layer 700, the third metal layer 800, and the third set of conductive pillars 900 is placed in a molding die. At this time, the lower mold of the molding die can be fitted to the metal substrate 100, and the upper mold can be fitted to the end faces of the third set of conductive pillars 900. Secondly, molding material is injected into the molding die to... The molding material is allowed to cover the portions of the third conductors 801 of the third metal layer 800 exposed to the molding space of the molding mold and to cover the portions of the third set of conductive pillars 900 exposed to the molding space of the molding mold; again, the molding material is cured and demolded to form the third molding layer 1000, thereby the third molding layer 1000 is integrally bonded to the sidewalls of the third metal layer 800 and the third set of conductive pillars 900, and the end faces of the third set of conductive pillars 900 are exposed on the surface of the third molding layer 1000.

[0090] After the third molding layer 1000 is formed, the thickness of the third molding layer 1000 can be reduced by a grinding process, but not limited to. This is beneficial in reducing the thickness of the molded circuit board 11 and in fully exposing the end faces of the third set of conductive posts 900 to ensure the reliability of subsequent electrical connections.

[0091] Reference Appendix Figure 7K The metal substrate 100 is removed to obtain the molded circuit board 11. Preferably, after removing the metal substrate 100, the surfaces of the first conductors 201 of the first metal layer 200 exposed to the first molding layer 400 and the surfaces of the third set of conductive pillars 900 exposed to the third molding layer 1000 can be etched to allow the height of the metal portion to be lower than the height of the molding portion, thereby not only protecting the metal portion but also ensuring the flatness of the molded circuit board 11.

[0092] It is understood that the first molding layer 400 and the third molding layer 1000 can respectively form the front and back sides of the molded circuit board 11. In this way, the flatness of the front and back sides of the molded circuit board 11 can be guaranteed by means of the molding process. Thus, when the molded circuit board 11 is used as a support platform to mount the filter 15 and the lens assembly 20 on the front side of the molded circuit board 11 and to suspend the photosensitive chip 12 on the back side of the molded circuit board 11, the molded circuit board 11 can effectively ensure the stability of the camera module and ensure the imaging quality of the camera module. Meanwhile, the molded circuit board 11 is made using a multi-layer molding process, which ensures its strength. This prevents deformation during the assembly and use of the camera module, guaranteeing its reliability. Furthermore, the heat dissipation of the molded circuit board 11 is improved, allowing it to quickly dissipate heat generated by the photosensitive chip 12 and reduce the operating temperature of the camera module, thus ensuring its reliability during operation.

[0093] Furthermore, laser cutting can be used to hollow out the first molding layer 400, the second molding layer 700, and the third molding layer 1000, forming through holes 111 in the molded circuit board 11 at the hollowed-out locations. A grinding process can be used to form grooves at corresponding positions in the first molding layer 400 and the third molding layer 1000, respectively. These grooves form the upper groove 412 of the upper support assembly 41 and the lower groove 422 of the lower support assembly 42.

[0094] According to another aspect of the present invention, the molded circuit board 11 further includes at least one set of conductive posts 112, at least one metal layer 113, and at least one molding layer 114, wherein the metal layer 113 is composed of a plurality of conductors 1131 and a plurality of trenches 1132, the trenches 1132 being located between adjacent conductors 1131, the conductive posts 112 contacting and conducting the conductors 1131, and wherein the molding layer 114 is integrally bonded to the conductors 1131 and the metal layer 113. The sidewalls of the conductive pillar 112 are filled with the molding layer 114, and the grooves 1132 of the metal layer 113 are filled with the molding layer 114. In this way, by taking advantage of the molding process, the flatness, strength and heat dissipation performance of the molding circuit board 11 can be greatly improved. Thus, the molding circuit board 11 can be used as a support platform so that the photosensitive chip 12 can be suspended on the back of the molding circuit board 11 and the filter part 15 and the lens assembly 20 can be mounted on the molding circuit board 11.

[0095] Appendix Figure 11 and Figure 12 The camera module according to another preferred embodiment of the present invention is shown, along with an attached... Figures 1 to 7K Unlike the camera module shown, the attached... Figure 11 and Figure 12 In this specific example of the camera module shown, the movable part 131 of the lead frame 13 has a movable part extension arm 1311 on each side opposite to the movable part 131, and the fixed part 132 has a fixed part extension arm 1321 on each side opposite to the fixed part 132. The deformable part 133 includes a plurality of deformable units 1331, which are spaced apart from each other between the movable part 131 and the fixed part 132. Each movable part extension arm 1311 of the movable part 131 extends toward the fixed part 132 and is connected to each deformable unit 1331, and each fixed part extension arm 1321 of the fixed part 132 extends toward the movable part 131 and is connected to each deformable unit 1331.

[0096] When each deformation unit 1331 of the deformation portion 133 of the lead frame 131 is driven to deform, the movable portion 131 can drive the photosensitive chip 12 to translate and realize chip image stabilization of the camera module. At the same time, each deformation unit 1331 of the deformation portion 133 accumulates elastic potential energy due to deformation, so that in the future, each deformation unit 1331 of the deformation portion 133 can provide a restoring force to allow the movable portion 131 to drive the photosensitive chip 12 to reset.

[0097] With appendix Figures 1 to 7K Unlike the camera module shown, the attached... Figure 11 and Figure 12 In this specific example of the camera module shown, the deformable portion 133 of the lead frame 131 provides only a restoring force to allow the movable portion 131 to return to its original position after it has been translated by being driven by another mechanism.

[0098] Further, the deformation unit 1331 of the deformation portion 133 includes an elastic body 13311 and a molding body 13312, wherein the molding body 13312 is molded around the elastic body 13311. By wrapping the molding body 13312 around the elastic body 13311, the restoring force provided by the deformation unit 1331 can be precisely controlled. The material of the elastic body 13311 is not limited in the camera module of the present invention; for example, the elastic body 13311 can be a metal material. Preferably, the molding body 13312 is provided with a draft angle to facilitate drafting, and the cross-section of the deformation unit 1331 is approximately trapezoidal. Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been shown and explained in the embodiments, and any variations or modifications can be made to the embodiments of the present invention without departing from the stated principles.

Claims

1. A camera module, characterized in that, include: A lens assembly; and A photosensitive assembly includes a molded circuit board, a photosensitive chip, and a lead frame. The lead frame further includes a movable portion, a fixed portion, and a deformable portion disposed between the movable portion and the fixed portion. The fixed portion is disposed on the molded circuit board. The photosensitive chip is disposed on the movable portion and a through-hole in the molded circuit board corresponding to the molded circuit board, so that the lead frame suspends the photosensitive chip on the back of the molded circuit board and allows the photosensitive chip to translate. A lens assembly is mounted on the molded circuit board. The molded circuit board is disposed on the inner wall of the fixed portion, and the front surface of the molded circuit board is flush with the top surface of the fixed portion, so that the molded circuit board and the fixed portion together provide a mounting platform for mounting the lens assembly.

2. The camera module according to claim 1, wherein the deformable part is configured to drive the movable part to move the photosensitive chip.

3. The camera module according to claim 1, wherein the movable part has a movable part extension arm on each of its opposite sides, the fixed part has a fixed part extension arm on each of its opposite sides, the deformable part includes a plurality of deformable units, the deformable units are disposed at intervals between the movable part and the fixed part, and each movable part extension arm of the movable part extends toward the fixed part and is connected to each deformable unit, and each fixed part extension arm of the fixed part extends toward the movable part and is connected to each deformable unit.

4. The camera module according to claim 3, wherein each of the deformation units comprises an elastomer and a molded body wrapped around the outside of the elastomer.

5. The camera module according to claim 1, further comprising a filter portion, wherein the filter portion is mounted on the molded circuit board.

6. The camera module according to claim 1, further comprising a substrate, wherein the edge of the substrate is disposed on the fixing portion to close the bottom opening of the fixing portion by the substrate.

7. The camera module according to claim 6, further comprising an upper support assembly and a lower support assembly, wherein the upper support assembly is disposed between the movable part and the molded circuit board, and allows point contact connection between the movable part and the molded circuit board, wherein the lower support assembly is disposed between the movable part and the substrate, and allows point contact connection between the movable part and the substrate.

8. The camera module of claim 7, wherein the upper support assembly has at least three upper guide rails and at least three upper grooves and includes at least three upper balls, each of the upper guide rails being disposed on one of the back surface of the molded circuit board and the top surface of the movable part, each of the upper grooves being disposed on the other of the back surface of the molded circuit board and the top surface of the movable part, a portion of each of the upper balls being rollably held in each of the upper guide rails and each of the upper grooves, and each of the upper balls creating a gap between the molded circuit board and the movable part.

9. The camera module according to claim 8, wherein the upper support assembly has four upper guide rails and four upper grooves and includes four upper balls, each upper guide rail being disposed at each corner of the molded circuit board or at each corner of the movable part, each upper groove being disposed at each corner of the movable part or at each corner of the molded circuit board, such that each upper ball is held between each corner of the molded circuit board and each corner of the movable part.

10. The camera module according to any one of claims 7 to 9, wherein the lower support assembly has at least three lower guide rails and at least three lower grooves and includes at least three lower balls, each of the lower guide rails being disposed on at least one of the inner wall of the substrate and the back surface of the movable part, each of the lower grooves being disposed on the other of the inner wall of the substrate and the back surface of the movable part, a portion of each lower ball being rollably held in each of the lower guide rails and each of the lower grooves, and each of the lower balls creating a gap between the substrate and the movable part.

11. The camera module of claim 10, wherein the lower support assembly has four lower guide rails and four lower grooves and includes four lower balls, each of the lower guide rails being disposed at each corner of the substrate or at each corner of the movable part, each of the lower grooves being disposed at each corner of the movable part or at each corner of the substrate, such that each of the lower balls is held at each corner of the substrate and at each corner of the movable part.

12. The camera module according to any one of claims 1 to 9, wherein the molded circuit board comprises at least one molding layer, at least one metal layer and at least one set of conductive pillars, the metal layer comprising a plurality of conductors and a plurality of trenches located between adjacent conductors, the conductive pillars contacting and conducting the conductors, the molding layer being integrally bonded to the sidewalls of the conductors and the conductive pillars of the metal layer, and the molding layer filling the trenches of the metal layer.

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