Display panel, manufacturing method of display panel, and display device

Abstract

The application discloses a display panel, a manufacturing method of the display panel and a display device. The display panel comprises an array substrate, a light-emitting functional layer, a first electrode layer and an encapsulation layer. The array substrate comprises a light-transmitting area and a display area, and at least part of the display area surrounds the light-transmitting area. The light-emitting functional layer is located on one side of the array substrate. The first electrode layer is located on the side of the light-emitting functional layer away from the array substrate. The vertical projection of the first electrode layer on the array substrate covers the display area and does not overlap with the light-transmitting area. The encapsulation layer is located on the side of the first electrode layer away from the array substrate. The encapsulation layer comprises at least two inorganic layers and at least one organic layer. The vertical projection of the organic layer on the array substrate covers the display area and does not overlap with the light-transmitting area. The vertical projection of the inorganic layer farthest from the array substrate on the array substrate covers the display area and the light-transmitting area. The application can improve the light transmittance of the light-transmitting area, improve the light transmission effect of the light-transmitting area, and further improve the photosensitive effect of the optical sensor arranged in the light-transmitting area.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] In the field of display technology, some display panels are equipped with front-facing cameras, which has attracted widespread attention from users.

[0003] Display panels are typically divided into a display area and a light-transmitting area. The front-facing camera is positioned below the light-transmitting area of ​​the display panel. However, the light transmittance of the light-transmitting area in existing display panels is relatively poor, affecting the shooting performance of the front-facing camera. Summary of the Invention

[0004] This invention provides a display panel, a method for manufacturing the display panel, and a display device, which can improve the light transmittance of the light-transmitting area and the light transmission effect of the light-transmitting area, thereby improving the light-sensing effect of the optical sensor set in the light-transmitting area.

[0005] According to one aspect of the present invention, a display panel is provided, the display panel comprising: an array substrate, the array substrate including a light-transmitting area and a display area, wherein at least a portion of the display area surrounds the light-transmitting area;

[0006] A light-emitting functional layer is located on one side of the array substrate, wherein the vertical projection of the light-emitting functional layer on the array substrate covers the display area;

[0007] The first electrode layer is located on the side of the light-emitting functional layer away from the array substrate, wherein the vertical projection of the first electrode layer on the array substrate covers the display area and does not overlap with the light-transmitting area;

[0008] An encapsulation layer is located on the side of the first electrode layer away from the array substrate. The encapsulation layer includes at least two inorganic layers and at least one organic layer, with the inorganic layers and the organic layers stacked alternately. The side of the encapsulation layer closest to the array substrate and the side furthest from the array substrate are both inorganic layers. The vertical projection of the organic layer on the array substrate covers the display area and does not overlap with the light-transmitting area. The vertical projection of the inorganic layer furthest from the array substrate on the array substrate covers both the display area and the light-transmitting area.

[0009] Optionally, in the encapsulation layer, except for the inorganic layer furthest from the array substrate, the vertical projection of the other inorganic layers on the array substrate covers the display area and does not overlap with the light-transmitting area.

[0010] Optionally, the encapsulation layer includes two inorganic layers and one organic layer.

[0011] Optionally, the inorganic layer furthest from the array substrate includes a first sub-inorganic layer and a second sub-inorganic layer stacked together, wherein the first sub-inorganic layer is disposed on the side of the second sub-inorganic layer adjacent to the array substrate, and the thickness of the first sub-inorganic layer is less than the thickness of the second sub-inorganic layer.

[0012] Optionally, the thickness of the inorganic layer furthest from the array substrate is greater than the thickness of the other inorganic layers;

[0013] Except for the inorganic layer furthest from the array substrate, the thickness of the other inorganic layers ranges from 50 nm to 80 nm.

[0014] Optionally, the thickness of the first inorganic sublayer ranges from 50 nm to 80 nm.

[0015] Optionally, at least a portion of the film layer in the light-emitting functional layer does not overlap with the light-transmitting area in its vertical projection onto the array substrate;

[0016] Optionally, the vertical projection of the light-emitting functional layer on the array substrate does not overlap with the light-transmitting area;

[0017] Optionally, the light-emitting functional layer includes a first functional layer, a light-emitting layer, and a second functional layer stacked sequentially, wherein the first functional layer is located on the side of the light-emitting functional layer adjacent to the array substrate;

[0018] The first electrode layer is a cathode layer, the first functional layer includes at least one of a hole injection layer, a hole transport layer, and an electron blocking layer, and the second functional layer includes at least one of an electron injection layer, an electron transport layer, and a hole blocking layer; or, the first electrode layer is an anode layer, the second functional layer includes at least one of a hole injection layer, a hole transport layer, and an electron blocking layer, and the first functional layer includes at least one of an electron injection layer, an electron transport layer, and a hole blocking layer.

[0019] Optionally, the array substrate further includes a light-transmitting substrate, a pixel circuit layer, and a second electrode layer stacked sequentially, wherein the second electrode layer is located between the pixel circuit layer and the light-emitting functional layer;

[0020] The second electrode layer is located only in the display area;

[0021] The pixel circuit layer includes opaque traces, which are located only in the display area;

[0022] Optionally, the pixel circuit layer is located only in the display area;

[0023] Optionally, an optical sensor is disposed on the side of the light-transmitting substrate away from the pixel circuit layer, and the optical sensor is disposed in the light-transmitting area.

[0024] According to another aspect of the present invention, a method for manufacturing a display panel is provided, the method comprising:

[0025] An array substrate is provided, wherein the array substrate includes a light-transmitting area and a display area, the display area at least partially surrounding the light-transmitting area;

[0026] A light-emitting functional layer is formed on one side of the array substrate, wherein the vertical projection of the light-emitting functional layer on the array substrate covers the display area;

[0027] A first electrode layer is formed on the side of the light-emitting functional layer away from the array substrate, wherein the vertical projection of the first electrode layer on the array substrate covers the display area and does not overlap with the light-transmitting area;

[0028] An encapsulation layer is formed on the side of the first electrode layer away from the array substrate. The encapsulation layer includes at least two inorganic layers and at least one organic layer, with the inorganic layers and the organic layers stacked alternately. The side of the encapsulation layer closest to the array substrate and the side furthest from the array substrate are both inorganic layers. The vertical projection of the organic layer on the array substrate covers the display area and does not overlap with the light-transmitting area. The vertical projection of the inorganic layer furthest from the array substrate on the array substrate covers both the display area and the light-transmitting area.

[0029] Optionally, forming the light-emitting functional layer, the first electrode layer, and the encapsulation layer specifically includes:

[0030] A light-emitting functional material layer is formed on one side of the array substrate, wherein the light-emitting functional material layer covers the light-transmitting area and the display area;

[0031] A first electrode material layer is formed on the side of the light-emitting functional material layer away from the array substrate, wherein the vertical projection of the first electrode material layer on the array substrate covers the light-transmitting area and the display area;

[0032] At least one set of inorganic and organic material layers are formed on the side of the first electrode material layer away from the light-emitting functional material layer, wherein each set of inorganic and organic material layers includes an inorganic material layer and an organic layer, and the inorganic material layer in the same set of inorganic and organic material layers is disposed on the side of the organic layer adjacent to the array substrate.

[0033] The inorganic material layer, the first electrode material layer, and at least a portion of the light-emitting functional material layer in the light-transmitting area are sequentially removed using a plasma etching process, thereby forming the inorganic layer, the first electrode layer, and the light-emitting functional layer in sequence.

[0034] The inorganic layer, furthest from the array substrate, is formed on the side of the organic layer furthest from the array substrate;

[0035] Optionally, before forming the inorganic layer furthest from the array substrate on the side of the organic layer furthest from the array substrate, the method further includes: ultrasonically cleaning the particles remaining after etching.

[0036] Optionally, a plasma etching process is used to sequentially remove the inorganic material layer, the first electrode material layer, and at least a portion of the light-emitting functional material layer in the light-transmitting region, thereby sequentially forming the inorganic layer, the first electrode layer, and the light-emitting functional layer, respectively, including:

[0037] The entire light-emitting functional material layer in the light-transmitting area is removed by plasma etching to form the light-emitting functional layer.

[0038] Optionally, forming at least one set of inorganic and organic material layers on the side of the first electrode material layer away from the light-emitting functional material layer specifically includes:

[0039] The inorganic material layer is formed on the side of the first electrode material layer away from the light-emitting functional material layer using an atomic layer deposition process;

[0040] An organic material layer is formed on the side of the inorganic material layer away from the light-emitting functional material layer using an inkjet printing process.

[0041] The organic material layer in the light-transmitting area is removed using a photolithography process to form the organic layer.

[0042] Optionally, the inorganic layer furthest from the array substrate includes a first sub-inorganic layer and a second sub-inorganic layer stacked together; the thickness of the first sub-inorganic layer is less than the thickness of the second sub-inorganic layer.

[0043] The step of fabricating the inorganic layer furthest from the array substrate on the side of the organic layer furthest from the array substrate specifically includes:

[0044] The first sub-inorganic layer is formed on the side of the organic layer away from the array substrate using an atomic layer deposition process;

[0045] The second sub-inorganic layer is formed on the side of the first sub-inorganic layer away from the array substrate using a chemical vapor deposition process.

[0046] According to another aspect of the present invention, a display device is provided, the display device including the display panel provided in any embodiment of the present invention.

[0047] This embodiment provides a display panel comprising an array substrate, an organic functional layer, a first electrode layer, and an encapsulation layer stacked sequentially. The encapsulation layer includes stacked inorganic and organic layers, and the array substrate includes a display area and a light-transmitting area. The first electrode layer is not disposed in the light-transmitting area, thereby avoiding reflection or absorption of light by the first electrode layer and improving the light transmittance of the light-transmitting area. The organic layer is also not disposed in the light-transmitting area, thus avoiding the influence of uneven surfaces on the light propagation direction and affecting the light transmission effect. The absence of an organic layer in the light-transmitting area also improves the light transmittance of the light-transmitting area. The inorganic layer furthest from the array substrate is disposed in the light-transmitting area and the display area, protecting other inorganic layers, organic layers, the array substrate, and the light-emitting functional layer from external water and oxygen influences. In summary, the display panel provided in this embodiment can improve both the light transmittance and the light transmission effect of the light-transmitting area, thereby improving the photosensitivity of the optical sensor disposed in the light-transmitting area.

[0048] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0050] Figure 1 This is a top view structural diagram of a display panel according to an embodiment of the present invention;

[0051] Figure 2 This is a top view structural diagram of another display panel provided according to an embodiment of the present invention;

[0052] Figure 3 It is along Figure 2 A schematic diagram of the cross-sectional structure of a display panel obtained by section lines A1A2 in the diagram;

[0053] Figure 4 It is along Figure 2 A schematic diagram of the cross-sectional structure of another display panel obtained by the cross-section lines A1A2 in the diagram;

[0054] Figure 5 It is along Figure 2 A schematic diagram of the cross-sectional structure of another display panel obtained by the cross-section lines A1A2 in the diagram;

[0055] Figure 6 It is along Figure 2 A schematic diagram of the cross-sectional structure of another display panel obtained by the cross-section lines A1A2 in the diagram;

[0056] Figure 7 It is along Figure 2 A schematic diagram of the cross-sectional structure of another display panel obtained by the cross-section lines A1A2 in the diagram;

[0057] Figure 8 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;

[0058] Figures 9-12 This is a structural schematic diagram of the manufacturing process of a display panel according to an embodiment of the present invention;

[0059] Figure 13 and Figure 14 This is a structural schematic diagram of the fabrication process of an inorganic material and an organic material layer according to an embodiment of the present invention. Detailed Implementation

[0060] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0061] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0062] The display panel provided in this embodiment can improve the problem of poor light transmittance in the light-transmitting area of ​​existing display panels. Figure 1 This is a top view structural diagram of a display panel according to an embodiment of the present invention. Figure 2 This is a top view structural diagram of another display panel provided according to an embodiment of the present invention. Figure 3 It is along Figure 2A schematic diagram of the cross-sectional structure of a display panel obtained by section lines A1A2 in the diagram, for reference. Figures 1-3 The display panel provided in this embodiment includes: an array substrate 110, the array substrate 110 including a light-transmitting area 111 and a display area 112, the display area 112 at least partially surrounding the light-transmitting area 111 (see reference). Figure 1 and Figure 2 The light-emitting functional layer 120 is located on one side of the array substrate 110, wherein the vertical projection of the light-emitting functional layer 120 on the array substrate 110 covers the display area 112; the first electrode layer 130 is located on the side of the light-emitting functional layer 120 away from the array substrate 110, wherein the vertical projection of the first electrode layer 130 on the array substrate 110 covers the display area 112 and does not overlap with the light-transmitting area 111; the encapsulation layer 140 is located on the side of the first electrode layer 130 away from the array substrate 110, wherein the encapsulation layer 140... 40 includes at least two inorganic layers 141 and at least one organic layer 142, with the inorganic layers 141 and organic layers 142 stacked alternately. The side of the encapsulation layer 140 closest to the array substrate 110 and the side furthest from the array substrate 110 are both inorganic layers 141. The vertical projection of the organic layer 142 on the array substrate 110 covers the display area 112 and does not overlap with the light-transmitting area 111. The vertical projection of the inorganic layer 141 furthest from the array substrate on the array substrate 110 covers both the display area 112 and the light-transmitting area 111.

[0063] Specifically, display area 112 is used to display images. The light-emitting functional layer 120 includes an organic light-emitting layer. The array substrate 110 includes a second electrode layer and a driving circuit layer. The first electrode layer 130, the light-emitting functional layer 120, and the second electrode layer constitute a light-emitting structure. The driving circuit layer drives the light-emitting structure to emit light. Furthermore, the light-emitting functional layer 120 may also include one, two, or multiple layers of an electron injection layer, an electron transport layer, a hole blocking layer, a hole transport layer, a hole injection layer, and an electron blocking layer.

[0064] The light-transmitting area 111 is a non-display area and does not display any image. The light-transmitting area 111 is transparent; when an optical sensor is placed in the light-transmitting area 111 on the side of the array substrate 110 away from the light-emitting functional layer 120, the optical sensor can receive light passing through the light-transmitting area 111. The optical sensor has a photosensitizing function; exemplary devices include cameras and infrared sensors. At least a portion of the display area 112 surrounds the light-transmitting area 111, or the display area 112 may partially surround the light-transmitting area 111 (see reference). Figure 1 Alternatively, the display area 112 can surround the light-transmitting area 111 (see reference). Figure 2 ). refer to Figure 1 The semi-circular light-transmitting area 111 surrounding the display area 112 can be understood as having a portion of its perimeter that is not adjacent to the display area 112, and a portion that is adjacent to the display area 112. (See reference...) Figure 2 The display area 112 surrounds the light-transmitting area 111, which can be understood as the entire edge of the light-transmitting area 111 being adjacent to the display area 112.

[0065] Continue to refer to Figure 3 The vertical projection of the light-emitting functional layer 120 on the array substrate 110 can be non-overlapping with the light-transmitting area 111, that is, the light-transmitting area 111 does not have the light-emitting functional layer 120. The absence of the light-emitting functional layer 120 in the light-transmitting area 111 can improve the light transmittance of the light-transmitting area 111. Figure 4 It is along Figure 2 A cross-sectional structural diagram of another display panel obtained from section lines A1A2 in the diagram is shown in the reference diagram. Figure 4 The vertical projection of the light-emitting functional layer 120 onto the array substrate 110 can also cover the light-transmitting area 111. The thickness of the light-emitting functional layer 120 in the light-transmitting area 111 can be less than or equal to the thickness of the light-emitting functional layer 120 in the display area 112. Figure 4 The thickness of the light-emitting functional layer 120 in the light-transmitting area 111 is less than the thickness of the light-emitting functional layer 120 in the display area 112. By providing at least part of the light-emitting functional layer 120 in the light-transmitting area 111, the height difference between the display area 112 and the light-transmitting area 111 can be reduced, which can reduce the manufacturing difficulty of the inorganic layer 141 that is furthest from the array substrate 110.

[0066] The first electrode layer 130 can be a cathode, and the material of the first electrode layer 130 can include metal or ITO. The vertical projection of the first electrode layer 130 on the array substrate 110 does not overlap with the light-transmitting area 111, that is, the first electrode layer 130 is not disposed in the light-transmitting area 111. Not disposing of the first electrode layer 130 in the light-transmitting area 111 can avoid the reflection and absorption of light by the first electrode layer 130, thereby improving the light transmittance of the light-transmitting area 111.

[0067] The encapsulation layer 140 is used to block external water and oxygen, preventing them from affecting the array substrate 110 and the light-emitting functional layer 120. The organic layer 142 in the encapsulation layer 140 can be fabricated using inkjet printing. During the fabrication of the organic layer 142, fluid flows freely. If the organic layer 142 is placed in the light-transmitting area 111, the uneven surface of the fluid flowing in the light-transmitting area 111 will cause unevenness on the surface of the organic layer 142 in the light-transmitting area 111. This uneven surface of the organic layer 142 will affect the direction of light transmission, leading to problems such as ghosting and color flare in the images captured by the optical sensor, thus affecting the light transmission effect of the light-transmitting area 111. In this embodiment, by not placing the organic layer 142 in the light-transmitting area 111, both the light transmittance and the light transmission effect of the light-transmitting area 111 can be improved, thereby enhancing the photosensitivity of the optical sensor located in the light-transmitting area. Both the light-transmitting area 111 and the display area 112 are provided with an inorganic layer 141 furthest away from the array substrate 110. This inorganic layer 141 protects the organic layer 142, the array substrate 110, and the light-emitting functional layer 120 from external water and oxygen influences. The inorganic layer 141 can be made of silicon oxide. The vertical projection of other inorganic layers 141 onto the array substrate 110 may or may not cover the light-transmitting area 111. When other inorganic layers 141 are not located in the light-transmitting area 111, the light transmittance of the light-transmitting area 111 can be increased. When other inorganic layers 141 are located in the light-transmitting area 111, the encapsulation effect of the encapsulation layer 140 can be improved.

[0068] It should be noted that, Figure 1 and Figure 2 Setting the light-transmitting area 111 at the center of the display area 112 in the row direction is not a limitation of the present invention. The position of the light-transmitting area 111 relative to the display area 112 can also be set at the upper left corner of the display area 112 or at the upper right corner of the display area 112.

[0069] This embodiment provides a display panel comprising an array substrate, an organic functional layer, a first electrode layer, and an encapsulation layer stacked sequentially. The encapsulation layer includes stacked inorganic and organic layers, and the array substrate includes a display area and a light-transmitting area. The first electrode layer is not disposed in the light-transmitting area, thereby avoiding reflection or absorption of light by the first electrode layer and improving the light transmittance of the light-transmitting area. The organic layer is also not disposed in the light-transmitting area, thus avoiding the influence of uneven surfaces on the light propagation direction and affecting the light transmission effect. The absence of an organic layer in the light-transmitting area also improves the light transmittance of the light-transmitting area. The inorganic layer furthest from the array substrate is disposed in the light-transmitting area and the display area, protecting other inorganic layers, organic layers, the array substrate, and the light-emitting functional layer from external water and oxygen influences. In summary, the display panel provided in this embodiment can improve both the light transmittance and the light transmission effect of the light-transmitting area, thereby improving the photosensitivity of the optical sensor disposed in the light-transmitting area.

[0070] Optionally, in the encapsulation layer, except for the inorganic layer furthest from the array substrate, the vertical projection of the other inorganic layers on the array substrate covers the display area and does not overlap with the light-transmitting area.

[0071] Specifically, other inorganic layers refer to all inorganic layers in the encapsulation layer except for the inorganic layer furthest from the array substrate. The absence of other inorganic layers in the light-transmitting area prevents these layers from absorbing or reflecting light entering the area and affecting its transmittance. Therefore, omitting other inorganic layers in the light-transmitting area can further improve its transmittance. For example, when the encapsulation layer includes two inorganic layers and one organic layer, the vertical projection of the inorganic layer closest to the array substrate covers the display area on the array substrate without overlapping with the light-transmitting area, while the vertical projection of the inorganic layer furthest from the array substrate covers both the light-transmitting and display areas.

[0072] Optional, continue to refer to Figure 3 or Figure 4 The encapsulation layer 140 includes two inorganic layers 141 and one organic layer 142. This configuration ensures the encapsulation effect of the encapsulation layer 140 without excessively increasing the number of inorganic layers 141 and organic layers 142, thus avoiding excessively increasing the thickness of the encapsulation layer 140.

[0073] Optional, Figure 5 It is along Figure 2 A cross-sectional structural diagram of another display panel obtained from section lines A1A2 in the diagram is shown in the reference diagram. Figure 5 The inorganic layer 141 furthest from the array substrate includes a first sub-inorganic layer 1411 and a second sub-inorganic layer 1412 stacked together. The first sub-inorganic layer 1411 is disposed on the side of the second sub-inorganic layer 1412 adjacent to the array substrate 110. The thickness of the first sub-inorganic layer 1411 is less than the thickness of the second sub-inorganic layer 1412.

[0074] Specifically, the first sub-inorganic layer 1411 and the second sub-inorganic layer 1412 can be fabricated using different processes. The first sub-inorganic layer 1411 can be fabricated using atomic layer deposition (ALD). AALD-fabricated first sub-inorganic layer 1411 features uniform thickness and uniform coverage density, thus fully covering the display area 112 and the light-transmitting area 111, improving the encapsulation effect. Compared to AALD, chemical vapor deposition (CVD) has a faster fabrication rate; therefore, the second sub-inorganic layer 1412 can be fabricated using CVD, thereby improving manufacturing efficiency. Setting the thickness of the first sub-inorganic layer 1411 to be less than the thickness of the second sub-inorganic layer 1412 can further increase the fabrication rate of the first sub-inorganic layer 1411. In summary, the inorganic layer 141 furthest from the array substrate includes a first sub-inorganic layer 1411 and a second sub-inorganic layer 1412 stacked together, which can improve the packaging effect of the inorganic layer 141 furthest from the array substrate and also increase the fabrication rate of the inorganic layer 141 furthest from the array substrate.

[0075] Optionally, the inorganic layer furthest from the array substrate has a greater thickness than the other inorganic layers. This configuration ensures that the inorganic layer furthest from the array substrate has good water and oxygen barrier properties, thus guaranteeing a better encapsulation effect for the display panel.

[0076] Optionally, except for the inorganic layer furthest from the array substrate, the thickness of the other inorganic layers ranges from 50 nm to 80 nm.

[0077] Specifically, in this embodiment, the thickness of each inorganic layer in the other inorganic layers ranges from 50nm to 80nm. This thickness range is smaller than that of inorganic layers in the prior art, thereby improving the manufacturing efficiency of inorganic layers.

[0078] Optionally, the thickness of the first inorganic sublayer ranges from 50 nm to 80 nm.

[0079] Specifically, setting the thickness range of the first sub-inorganic layer to 50nm to 80nm can shorten the fabrication time of the first sub-inorganic layer and improve its fabrication efficiency.

[0080] Optionally, at least a portion of the film layer in the light-emitting functional layer does not overlap with the light-transmitting area in its vertical projection on the array substrate, that is, the light-transmitting area is provided with a portion of the light-emitting functional layer or there is no light-emitting functional layer in the light-transmitting area.

[0081] The specific steps for fabricating the light-emitting functional layer are as follows: First, light-emitting functional materials are deposited in both the light-transmitting area and the display area to form a light-emitting functional material layer. Then, a portion of the light-emitting functional material layer in the light-transmitting area is etched to form the light-emitting functional layer. Setting a portion of the light-emitting functional layer in the light-transmitting area can shorten the etching time of the light-emitting functional material layer and improve the manufacturing efficiency of the display panel.

[0082] Optionally, the vertical projection of the light-emitting functional layer on the array substrate does not overlap with the light-transmitting area, that is, there is no light-emitting functional layer in the light-transmitting area. This setting can prevent the light-emitting functional layer in the light-transmitting area from absorbing the light entering the light-transmitting area, thereby further improving the light transmittance of the light-transmitting area.

[0083] Optionally, the light-emitting functional layer includes a first functional layer, a light-emitting layer, and a second functional layer stacked sequentially, with the first functional layer located on the side of the light-emitting functional layer adjacent to the array substrate; the first electrode layer is a cathode layer, the first functional layer includes at least one of a hole injection layer, a hole transport layer, and an electron blocking layer, and the second functional layer includes at least one of an electron injection layer, an electron transport layer, and a hole blocking layer; or, the first electrode layer is an anode layer, the second functional layer includes at least one of a hole injection layer, a hole transport layer, and an electron blocking layer, and the first functional layer includes at least one of an electron injection layer, an electron transport layer, and a hole blocking layer.

[0084] Specifically, the array substrate includes a second electrode layer, and the first electrode layer and the second electrode layer have opposite polarities. When the first electrode layer is a cathode layer, the second electrode layer is an anode layer; when the first electrode layer is an anode layer, the second electrode layer is a cathode layer. The cathode layer can provide electrons, and the anode layer can provide holes. Holes in the anode layer can be transported to the light-emitting layer through a hole injection layer and a hole transport layer, and electrons in the cathode layer can be transported to the light-emitting layer through an electron injection layer and an electron transport layer. Therefore, when the first electrode layer is a cathode layer, at least one of the hole injection layer, hole transport layer, and electron blocking layer is located between the second electrode layer and the light-emitting layer, and at least one of the electron injection layer, electron transport layer, and hole blocking layer is located between the first electrode layer and the light-emitting layer. When the second electrode layer is a cathode layer, at least one of the hole injection layer, hole transport layer, and electron blocking layer is located between the first electrode layer and the light-emitting layer, and at least one of the electron injection layer, electron transport layer, and hole blocking layer is located between the second electrode layer and the light-emitting layer.

[0085] Electrons and holes transported to the light-emitting layer combine, causing the light-emitting layer to emit light. The resistive blocking layer can block the transmission of electrons to the hole transport layer, thereby preventing the loss of electrons in the light-emitting layer and improving the luminous efficiency of the light-emitting layer. Similarly, the hole blocking layer can block the transmission of holes to the electron transport layer, thereby preventing the loss of holes in the light-emitting layer and improving the luminous efficiency of the light-emitting layer.

[0086] Optional, Figure 6 It is along Figure 2 A cross-sectional structural diagram of another display panel obtained from section lines A1A2 in the diagram is shown in the reference diagram. Figure 6 The array substrate 110 also includes a light-transmitting substrate 113, a pixel circuit layer 114, and a second electrode layer 115 stacked sequentially. The second electrode layer 115 is located between the pixel circuit layer 114 and the light-emitting functional layer 120. The second electrode layer 115 is located only in the display area 112. The pixel circuit layer 114 includes opaque traces, which are located only in the display area 112.

[0087] Specifically, the light-transmitting substrate 113 can be a glass substrate or a flexible substrate. The light-transmitting substrate 113 has high light transmittance. The second electrode layer 115 is not disposed in the light-transmitting area 111, which can improve the light transmittance of the light-transmitting area 111. The pixel circuit layer 114 includes multiple pixel driving circuits. Each pixel driving circuit includes at least two transistors and at least one capacitor. The at least two transistors and one capacitor can form a 2T1C circuit or a 7T1C circuit, etc.

[0088] The opaque traces in the pixel circuit layer 114 can be metal traces. Not providing opaque traces in the light-transmitting area 111 can improve the light transmittance of the light-transmitting area. The pixel circuit layer 114 also includes an insulating layer and a planarization layer, etc. The insulating layer and planarization layer can be disposed in the light-transmitting area 111. The insulating layer and planarization layer disposed in the light-transmitting area 111 are transparent. The insulating layer and planarization layer in the light-transmitting area 111 can be integrally connected with the insulating layer and planarization layer in the display area 112.

[0089] Optionally, the pixel circuit layer may be located only in the display area.

[0090] Specifically, the pixel circuit layer is only located in the display area, that is, in the array substrate, no pixel circuit layer film is set in the light-transmitting area, which can further improve the light transmittance of the light-transmitting area.

[0091] Optional, Figure 7 It is along Figure 2 A cross-sectional structural diagram of another display panel obtained from section lines A1A2 in the diagram is shown in the reference diagram. Figure 7 An optical sensor 150 is disposed on the side of the light-transmitting substrate 113 away from the pixel circuit layer 114, and the optical sensor 150 is disposed in the light-transmitting area 111.

[0092] Specifically, the optical sensor 150 is disposed in the light-transmitting area 111, enabling the optical sensor 150 to receive light passing through the inorganic layer 141 and the light-transmitting substrate 113 of the light-transmitting area 111. The optical sensor 150 can be a camera.

[0093] Figure 8 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention. (Refer to...) Figure 8 The manufacturing method provided in this embodiment includes the following steps:

[0094] S110. An array substrate is provided, wherein the array substrate includes a light-transmitting area and a display area, and the display area at least partially surrounds the light-transmitting area.

[0095] S120. A light-emitting functional layer is formed on one side of the array substrate, wherein the vertical projection of the light-emitting functional layer on the array substrate covers the display area.

[0096] S130. A first electrode layer is formed on the side of the light-emitting functional layer away from the array substrate, wherein the vertical projection of the first electrode layer on the array substrate covers the display area and does not overlap with the light-transmitting area.

[0097] S140. An encapsulation layer is formed on the side of the first electrode layer away from the array substrate. The encapsulation layer includes at least two inorganic layers and at least one organic layer. The inorganic and organic layers are stacked alternately. The side of the encapsulation layer closest to the array substrate and the side furthest from the array substrate are both inorganic layers. The vertical projection of the organic layer on the array substrate covers the display area and does not overlap with the light-transmitting area. The vertical projection of the inorganic layer furthest from the array substrate on the array substrate covers both the display area and the light-transmitting area.

[0098] Specifically, the inorganic layer furthest from the array substrate can be fabricated using either atomic layer deposition or chemical vapor deposition.

[0099] Optional, Figures 9-12 This is a structural schematic diagram of the manufacturing process of a display panel according to an embodiment of the present invention, with reference to... Figures 9-12 The formation of the light-emitting functional layer, the first electrode layer, and the encapsulation layer specifically includes the following steps: A light-emitting functional material layer is formed on one side of the array substrate, wherein the light-emitting functional material layer covers the light-transmitting area and the display area. A first electrode material layer is formed on the side of the light-emitting functional material layer away from the array substrate, wherein the vertical projection of the first electrode material layer on the array substrate covers the light-transmitting area and the display area. At least one set of inorganic and organic material layers is formed on the side of the first electrode material layer away from the light-emitting functional material layer, wherein each set of inorganic and organic material layers includes one inorganic material layer and one organic layer, and the inorganic material layer in the same set of inorganic and organic material layers is disposed on the side of the organic layer adjacent to the array substrate. The inorganic material layer, the first electrode material layer, and at least part of the light-emitting functional material layer in the light-transmitting area are sequentially removed using a plasma etching process to sequentially form the inorganic layer, the first electrode layer, and the light-emitting functional layer; the inorganic layer furthest from the array substrate is formed on the side of the organic layer furthest from the array substrate.

[0100] For details, please refer to Figure 9 , Figure 9This is a schematic diagram of the structure forming the luminescent functional material layer 121. (Reference) Figure 10 , Figure 10 This is a schematic diagram showing the structure in which the first electrode material layer 131 is formed on the side of the light-emitting functional material layer 121 away from the array substrate 110. (Reference) Figure 11 , Figure 11 This is a schematic diagram of the structure forming the inorganic and organic material layers 143. Figure 11 An exemplary display panel is shown to include a set of inorganic materials and an organic material layer 143. In the fabrication of the inorganic and organic material layers 143, the inorganic material layer 1413 is formed first, and then the organic layer 142 is formed. The vertical projection of the inorganic material layer 1413 on the array substrate 110 covers the light-transmitting area 111 and the display area 112.

[0101] Before plasma etching, a photomask is placed on the side of the organic layer 142 away from the array substrate 110. The photomask includes through-holes. The array substrate 110 also has a driver chip and a fan-out area electrically connected to the display area 112. When the photomask is placed on the side of the organic layer 142 away from the array substrate 110, the vertical projection of the through-holes on the array substrate 110 coincides with the light-transmitting area 111. The vertical projection of the photomask on the array substrate 110 covers the display area 112, the driver chip, and the fan-out area. This avoids accidental etching of the driver chip and fan-out area circuitry during the etching process. (Reference) Figure 12 , Figure 12 This is a schematic diagram of the structure of the inorganic layer 141, the first electrode layer 130, and the light-emitting functional layer 120 formed after plasma etching. Figure 12 Based on this, the inorganic layer 141 furthest from the array substrate can be formed. Figure 3 The display panel shown. In this embodiment, the thickness of the inorganic material layer 1413 is in the range of 50nm to 80nm. Setting the thickness of the inorganic material layer 1413 in the range of 50nm to 80nm can improve the fabrication efficiency of the inorganic material layer 1413 and shorten the etching time of the plasma etching inorganic material layer 1413.

[0102] Optionally, before fabricating the inorganic layer furthest from the array substrate on the side of the organic layer furthest from the array substrate, the process may also include ultrasonically cleaning away any particles remaining after etching.

[0103] Specifically, after plasma etching, the etched particles remain inside the display panel. If not cleaned in time, they may cause problems such as short circuits inside the display panel. Using ultrasonic cleaning to remove the residual particles can improve the cleaning effect.

[0104] Optionally, a plasma etching process is used to sequentially remove the inorganic material layer, the first electrode material layer, and at least part of the light-emitting functional material layer in the light-transmitting area, thereby sequentially forming the inorganic layer, the first electrode layer, and the light-emitting functional layer, including: removing all the light-emitting functional material layers in the light-transmitting area using a plasma etching process to form the light-emitting functional layer.

[0105] For details, please refer to [link / reference]. Figure 3 , Figure 3 This is a schematic diagram of the structure in which all light-emitting functional material layers in the light-transmitting region 111 are removed using a plasma etching process.

[0106] Optionally, forming at least one set of inorganic and organic material layers on the side of the first electrode material layer away from the light-emitting functional material layer specifically includes: forming an inorganic material layer on the side of the first electrode material layer away from the light-emitting functional material layer using an atomic layer deposition process; forming an organic material layer on the side of the inorganic material layer away from the light-emitting functional material layer using an inkjet printing process; and removing the organic material layer in the light-transmitting area using a photolithography process to form an organic layer.

[0107] Specifically, Figure 13 and Figure 14 This is a structural schematic diagram of the fabrication process of an inorganic material and an organic material layer according to an embodiment of the present invention, with reference to... Figure 13 , Figure 13 This is a schematic diagram illustrating the structure for forming the inorganic material layer 1413. The inorganic material layer 1413 can also be fabricated using chemical vapor deposition. (Reference) Figure 14 , Figure 14 The schematic diagram shows the structure of the organic material layer 1421. The vertical projection of the organic material layer 1421 onto the array substrate 110 covers the display area 112 and the light-transmitting area 111. The organic material layer 1421 is fabricated using an inkjet printing process. During fabrication, a fluid is placed on the side of the inorganic material layer 1413 away from the array substrate 110, and then the fluid is solidified to form the organic material layer 1421. Next, the organic material layer 1421 in the light-transmitting area 111 is etched. In this embodiment, the organic material layer 1421 is placed in the light-transmitting area 111, eliminating the need for a dam to block the fluid flowing into the light-transmitting area 111. The area of ​​the light-transmitting area 111 without a dam is smaller than the area with a dam. Therefore, the method for fabricating the organic layer 1421 provided in this embodiment can reduce the area of ​​the light-transmitting area 111, thereby increasing the area of ​​the display area 112 and improving the screen-to-body ratio of the display panel. (Continue to refer to...) Figure 11 , Figure 11 This is a schematic diagram of the structure after the organic material layer 1421 in the light-transmitting region 111 is removed using photolithography.

[0108] Optionally, the inorganic layer furthest from the array substrate includes a first sub-inorganic layer and a second sub-inorganic layer stacked together; the thickness of the first sub-inorganic layer is less than the thickness of the second sub-inorganic layer; the fabrication of the inorganic layer furthest from the array substrate on the side of the organic layer furthest from the array substrate specifically includes: forming the first sub-inorganic layer on the side of the organic layer furthest from the array substrate using an atomic layer deposition process; and forming the second sub-inorganic layer on the side of the first sub-inorganic layer furthest from the array substrate using a chemical vapor deposition process.

[0109] The method for manufacturing the display panel provided in this embodiment has the same beneficial effects as the display panel provided in any embodiment of the present invention. For technical details not covered in this embodiment, please refer to the display panel provided in any embodiment of the present invention.

[0110] This embodiment also provides a display device, which includes the display panel provided in any embodiment of the present invention.

[0111] Specifically, the display device provided in this embodiment can be a mobile phone, tablet, computer, smartwatch, or other device with display function.

[0112] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0113] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display panel, characterized in that, include: An array substrate, the array substrate including a light-transmitting area and a display area, wherein at least a portion of the display area surrounds the light-transmitting area; A light-emitting functional layer is located on one side of the array substrate, wherein the vertical projection of the light-emitting functional layer on the array substrate covers the display area; The first electrode layer is located on the side of the light-emitting functional layer away from the array substrate, wherein the vertical projection of the first electrode layer on the array substrate covers the display area and does not overlap with the light-transmitting area; An encapsulation layer is located on the side of the first electrode layer away from the array substrate. The encapsulation layer comprises at least two inorganic layers and at least one organic layer, with the inorganic and organic layers alternately stacked. Both the side of the encapsulation layer closest to the array substrate and the side furthest from the array substrate are inorganic layers. The vertical projection of the organic layer onto the array substrate covers the display area and does not overlap with the light-transmitting area. The vertical projection of the inorganic layer furthest from the array substrate onto the array substrate covers both the display area and the light-transmitting area. Wherein, the vertical projection of the light-emitting functional layer on the array substrate covers the light-transmitting area, and the thickness of the light-emitting functional layer in the light-transmitting area is less than the thickness of the light-emitting functional layer in the display area; The inorganic layer of the encapsulation layer on the side closest to the array substrate is prepared using an atomic layer deposition process. The array substrate further includes a light-transmitting substrate, a pixel circuit layer, and a second electrode layer stacked sequentially, with the second electrode layer located between the pixel circuit layer and the light-emitting functional layer. An optical sensor is disposed on the side of the light-transmitting substrate away from the pixel circuit layer, and the optical sensor is disposed in the light-transmitting area.

2. The display panel according to claim 1, characterized in that, In the encapsulation layer, except for the inorganic layer furthest from the array substrate, the vertical projection of the other inorganic layers on the array substrate covers the display area and does not overlap with the light-transmitting area.

3. The display panel according to claim 1, characterized in that, The encapsulation layer comprises two inorganic layers and one organic layer.

4. The display panel according to claim 1, characterized in that, The inorganic layer furthest from the array substrate includes a first sub-inorganic layer and a second sub-inorganic layer stacked together. The first sub-inorganic layer is disposed on the side of the second sub-inorganic layer adjacent to the array substrate, and the thickness of the first sub-inorganic layer is less than the thickness of the second sub-inorganic layer.

5. The display panel according to claim 1, characterized in that, The thickness of the inorganic layer furthest from the array substrate is greater than the thickness of the other inorganic layers; Except for the inorganic layer furthest from the array substrate, the thickness of the other inorganic layers ranges from 50 nm to 80 nm.

6. The display panel according to claim 4, characterized in that, The thickness of the first inorganic layer ranges from 50 nm to 80 nm.

7. The display panel according to claim 1 or 2, characterized in that, At least a portion of the film layer in the light-emitting functional layer does not overlap with the light-transmitting area when projected vertically onto the array substrate.

8. The display panel according to claim 7, characterized in that, The light-emitting functional layer includes a first functional layer, a light-emitting layer, and a second functional layer stacked sequentially, wherein the first functional layer is located on the side of the light-emitting functional layer adjacent to the array substrate; The first electrode layer is a cathode layer, the first functional layer includes at least one of a hole injection layer, a hole transport layer, and an electron blocking layer, and the second functional layer includes at least one of an electron injection layer, an electron transport layer, and a hole blocking layer; or, the first electrode layer is an anode layer, the second functional layer includes at least one of a hole injection layer, a hole transport layer, and an electron blocking layer, and the first functional layer includes at least one of an electron injection layer, an electron transport layer, and a hole blocking layer.

9. The display panel according to claim 1, characterized in that, The second electrode layer is located only in the display area; The pixel circuit layer includes opaque traces, which are located only in the display area.

10. The display panel according to claim 9, characterized in that, The pixel circuit layer is located only in the display area.

11. A method for manufacturing a display panel, characterized in that, include: An array substrate is provided, wherein the array substrate includes a light-transmitting area and a display area, and at least a portion of the display area surrounds the light-transmitting area; A light-emitting functional layer is formed on one side of the array substrate, wherein the vertical projection of the light-emitting functional layer on the array substrate covers the display area; A first electrode layer is formed on the side of the light-emitting functional layer away from the array substrate, wherein the vertical projection of the first electrode layer on the array substrate covers the display area and does not overlap with the light-transmitting area; An encapsulation layer is formed on the side of the first electrode layer away from the array substrate. The encapsulation layer includes at least two inorganic layers and at least one organic layer, with the inorganic layers and the organic layers stacked alternately. The side of the encapsulation layer closest to the array substrate and the side furthest from the array substrate are both inorganic layers. The vertical projection of the organic layer on the array substrate covers the display area and does not overlap with the light-transmitting area. The vertical projection of the inorganic layer furthest from the array substrate on the array substrate covers both the display area and the light-transmitting area. Wherein, the vertical projection of the light-emitting functional layer on the array substrate covers the light-transmitting area, and the thickness of the light-emitting functional layer in the light-transmitting area is less than the thickness of the light-emitting functional layer in the display area; The inorganic layer of the encapsulation layer on the side closest to the array substrate is prepared using an atomic layer deposition process. The array substrate further includes a light-transmitting substrate, a pixel circuit layer, and a second electrode layer stacked sequentially, with the second electrode layer located between the pixel circuit layer and the light-emitting functional layer. An optical sensor is disposed on the side of the light-transmitting substrate away from the pixel circuit layer, and the optical sensor is disposed in the light-transmitting area.

12. The manufacturing method according to claim 11, characterized in that, The specific steps for forming the light-emitting functional layer, the first electrode layer, and the encapsulation layer include: A light-emitting functional material layer is formed on one side of the array substrate, wherein the light-emitting functional material layer covers the light-transmitting area and the display area; A first electrode material layer is formed on the side of the light-emitting functional material layer away from the array substrate, wherein the vertical projection of the first electrode material layer on the array substrate covers the light-transmitting area and the display area; At least one set of inorganic and organic material layers are formed on the side of the first electrode material layer away from the light-emitting functional material layer, wherein each set of inorganic and organic material layers includes an inorganic material layer and an organic layer, and the inorganic material layer in the same set of inorganic and organic material layers is disposed on the side of the organic layer adjacent to the array substrate. The inorganic material layer, the first electrode material layer, and at least a portion of the light-emitting functional material layer in the light-transmitting area are sequentially removed using a plasma etching process, thereby forming the inorganic layer, the first electrode layer, and the light-emitting functional layer in sequence. The inorganic layer, furthest from the array substrate, is formed on the side of the organic layer furthest from the array substrate.

13. The manufacturing method according to claim 12, characterized in that, Before forming the inorganic layer furthest from the array substrate on the side of the organic layer furthest from the array substrate, the process further includes: ultrasonically cleaning the particles remaining after etching.

14. The manufacturing method according to claim 12, characterized in that, The inorganic material layer, the first electrode material layer, and at least a portion of the light-emitting functional material layer in the light-transmitting region are sequentially removed using a plasma etching process to sequentially form the inorganic layer, the first electrode layer, and the light-emitting functional layer, respectively. A portion of the light-emitting functional material layer in the light-transmitting area is removed using a plasma etching process to form the light-emitting functional layer.

15. The manufacturing method according to claim 14, characterized in that, The specific steps of forming at least one set of inorganic and organic material layers on the side of the first electrode material layer away from the light-emitting functional material layer include: The inorganic material layer is formed on the side of the first electrode material layer away from the light-emitting functional material layer using an atomic layer deposition process; An organic material layer is formed on the side of the inorganic material layer away from the light-emitting functional material layer using an inkjet printing process. The organic material layer in the light-transmitting area is removed using a photolithography process to form the organic layer.

16. The manufacturing method according to claim 12, characterized in that, The inorganic layer furthest from the array substrate includes a first sub-inorganic layer and a second sub-inorganic layer stacked together; the thickness of the first sub-inorganic layer is less than the thickness of the second inorganic layer; The specific steps of fabricating the inorganic layer furthest from the array substrate on the side of the organic layer furthest from the array substrate include: The first sub-inorganic layer is formed on the side of the organic layer away from the array substrate using an atomic layer deposition process; The second sub-inorganic layer is formed on the side of the first sub-inorganic layer away from the array substrate using a chemical vapor deposition process.

17. A display device, characterized in that, Includes the display panel as described in any one of claims 1-10.

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