Bonding apparatus and bonding method

Abstract

The present application provides a bonding apparatus and a bonding method capable of shortening the processing time for calculating the variation of the offset distance. The bonding apparatus (100) includes: a bonding head (20) capable of moving, holding a top camera (24), and a bonding tool (22) disposed apart from the top camera by an offset distance; a bottom camera (28) capable of photographing the bonding head (20); a reference member (30) having a reference mark, fixed at a position apart from the bottom camera (28) by a prescribed distance; and a calculation unit (61) that, when the bonding head is moved in a manner that the reference mark is disposed within the field of view of the top camera (24), and a chip (72) held by the bonding tool (22) is disposed within the field of view of the bottom camera (28), calculates the variation of the offset distance based on the prescribed distance, the position of the reference mark detected by the top camera, and the position of the chip detected by the bottom camera.

Description

Technical Field

[0001] This invention relates to a joining device and a joining method. Background Technology

[0002] Conventional mounting methods for bonding chips to a substrate include the following steps: a first chip position calculation step, in which images of the upper surface of a reference chip and the lower surface of a correction chip are obtained using dual-view cameras, and the position of each chip is calculated; a second chip movement step, in which, based on the deviation between each chip calculated according to the position of each chip, the reference chip is moved to a position where the separation distance between each chip is a predetermined offset, and then the correction chip is placed on an adsorption stage; the second chip position calculation step, in which an image of the upper surface of the correction chip is obtained, and a second position of the correction chip is calculated; and a correction amount calculation step, in which a correction amount of the predetermined offset is calculated based on the position of the reference chip and the second position of the correction chip (see Patent Document 1). This mounting method suppresses time-dependent positional deviations of the chip mounting position by calculating the change (correction amount) over a predetermined offset distance.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2015 / 119274 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, in the method disclosed in Patent Document 1, multiple steps are required to calculate the change in offset distance, thus the processing used to calculate the change in offset distance takes time.

[0008] The present invention was made in view of this situation, and one of its objectives is to provide a joining device and joining method that can shorten the processing time for calculating the change in offset distance.

[0009] Technical means to solve the problem

[0010] A bonding apparatus according to one aspect of the present invention includes: a bonding head, movable, holding a first camera that is positioned to face one side of an optical system, and a bonding tool disposed at an offset distance from the first camera; a second camera that is positioned to face the optical system to the other side in a manner capable of capturing images of the bonding head; a reference member having a reference mark on its other side surface and fixed at a position at a predetermined distance relative to the second camera; and a calculation unit that, when the bonding head is moved such that the reference mark is positioned within the field of view of the first camera and the chip held by the bonding tool is positioned within the field of view of the second camera, calculates the change in offset distance based on the predetermined distance, the position of the reference mark detected by the first camera, and the position of the chip detected by the second camera.

[0011] According to the structure described above, when the bonding head is moved such that a reference mark is positioned within the field of view of the first camera and a chip held by the bonding tool is positioned within the field of view of the second camera, the change in offset distance is calculated based on a predetermined distance, the position of the reference mark detected by the first camera, and the position of the chip detected by the second camera. Therefore, it is possible to simultaneously detect the position of the reference mark and the position of the chip held by the bonding tool, and calculate the change in offset distance. Thus, compared to existing bonding apparatuses that sequentially perform reference mark detection and chip detection in different steps, the processing time for calculating the change in offset distance can be shortened.

[0012] In the bonding device described above, the calculation unit may detect the position of the reference mark based on the first image captured by the first camera, and the position of the chip based on the second image captured by the second camera.

[0013] In the bonding device described above, the calculation unit may determine the deviation of the reference mark relative to the first camera based on the first image, and determine the deviation of the chip relative to the second camera based on the second image.

[0014] The joining device described above may also include a movement control unit, which controls the movement of the joining head and determines the amount of movement of the joining head based on the calculated change in offset distance.

[0015] In the aforementioned joining device, the second camera and the reference component can be integrated.

[0016] In the engagement device described above, the specified distance can be set based on the offset distance.

[0017] Another aspect of the present invention relates to a bonding method for a bonding apparatus, the bonding apparatus comprising: a bonding head movable to hold a first camera positioned to face one side of an optical system; a bonding tool disposed at an offset distance from the first camera; a second camera positioned to face the optical system to the other side in a manner capable of capturing images of the bonding head; and a reference member having a reference mark on its other side surface and fixed at a position at a predetermined distance relative to the second camera. The bonding method comprises: the steps of detecting the position of the reference mark using the first camera and detecting the position of a chip held by the bonding tool using the second camera; and the step of calculating a change in the offset distance based on the predetermined distance, the detected position of the reference mark, and the detected position of the chip.

[0018] According to the structure described above, when the bonding head is moved such that a reference mark is positioned within the field of view of the first camera and a chip held by the bonding tool is positioned within the field of view of the second camera, the change in offset distance is calculated based on a predetermined distance, the position of the reference mark detected by the first camera, and the position of the chip detected by the second camera. Therefore, it is possible to simultaneously detect the position of the reference mark and the position of the chip held by the bonding tool, and calculate the change in offset distance. Thus, compared to existing bonding apparatuses that sequentially perform reference mark detection and chip detection in different steps, the processing time for calculating the change in offset distance can be shortened.

[0019] The effects of the invention

[0020] According to the present invention, the processing time for calculating the change in offset distance can be shortened. Attached Figure Description

[0021] Figure 1 This is a side view showing a schematic structure of the coupling device in one embodiment.

[0022] Figure 2 It means Figure 1 A side view showing the positional relationship between the joining tool and the top camera.

[0023] Figure 3 It means Figure 1 A side view showing an example of the positional relationship between the bottom camera and the reference component.

[0024] Figure 4 It means Figure 1 A side view showing another example of the positional relationship between the bottom camera 28 and the reference component.

[0025] Figure 5 This is a conceptual diagram showing the configuration of the engagement head, bottom camera, and reference member of the engagement device in one embodiment.

[0026] Figure 6 It means Figure 5 A schematic diagram of the first image taken by the top camera.

[0027] Figure 7 It means Figure 5 A schematic diagram of the second image taken by the bottom camera.

[0028] Figure 8 This is a flowchart used to illustrate a joining method in one embodiment.

[0029] Explanation of symbols

[0030] 12: Wafer holding section

[0031] 14: Operation Unit

[0032] 15: Stepper motor

[0033] 16: Rotation axis

[0034] 17: Arm

[0035] 18: Base

[0036] 19: Pickup Tools

[0037] 20: Joining Head

[0038] 21: Z-axis drive mechanism

[0039] 22: Joining tools

[0040] 24: Top Camera

[0041] 26: XY Platform

[0042] 28: Bottom camera

[0043] 30: Reference Component

[0044] 31: Supporting components

[0045] 32: Reference Marker

[0046] 40: Jointing platform

[0047] 60: Engagement Control Unit

[0048] 61: Calculation Department

[0049] 62: Motion Control Department

[0050] 70: Wafer

[0051] 72: Chip

[0052] 80: Substrate

[0053] 100: Connecting device

[0054] CA1: Central axis

[0055] CA2: Central Axis

[0056] g1: First image

[0057] g2: Second image

[0058] OA1: Optical axis

[0059] OA2: Optical axis

[0060] ODd: Offset distance

[0061] ODr: Offset distance

[0062] PD: Specified distance

[0063] S100: Joining process

[0064] Δbh: Deviation

[0065] Δmk: Deviation

[0066] Δod: Change Detailed Implementation

[0067] The embodiments of the present invention will be described below. In the following drawings, the same or similar parts are represented by the same or similar symbols. However, the drawings are illustrative. Therefore, specific dimensions, etc., should not be judged by referring to the following description. Furthermore, the drawings naturally include parts where the dimensional relationships or ratios differ from each other. Therefore, the technical scope of the present invention should not be interpreted as limited by the described embodiments.

[0068] First, refer to Figures 1 to 4 The structure of the coupling device according to one embodiment will be described. Figure 1 This is a side view showing a schematic structure of the coupling device 100 in one embodiment. Figure 2 It means Figure 1 Side view showing the positional relationship between the joining tool 22 and the top camera 24. Figure 3 It means Figure 1 A side view showing an example of the positional relationship between the bottom camera 28 and the reference member 30. Figure 4 It means Figure 1 A side view of another example of the positional relationship between the bottom camera 28 and the reference member 30.

[0069] like Figure 1As shown, the bonding apparatus 100 includes a wafer holding section 12, an operation unit 14, a bonding head 20, an XY platform 26, a bottom camera 28, a reference member 30, a bonding stage section 40, and a bonding control section 60. In the following description, the direction parallel to the bonding target surface is defined as the XY axis direction, and the direction perpendicular to the bonding target surface is defined as the Z axis direction.

[0070] The bonding apparatus 100 is a semiconductor manufacturing apparatus used to bond a chip 72 (also called a "bare die") of a wafer 70 to a substrate 80. The chip 72 includes a surface on which an integrated circuit pattern is formed, and a back surface opposite to said surface. The bonding apparatus 100 described below aligns the chip 72 with the mounting portion of the substrate 80, bonding the chip 72 to the substrate 80 with the back surface of the chip 72 facing the substrate 80. This bonding apparatus 100 is called a die bonding apparatus.

[0071] The wafer holding section 12 is configured to hold a wafer 70 transported by a wafer transport tool (not shown). The wafer 70 is cut into a checkerboard pattern and includes multiple chips 72 cut into small pieces. The wafer holding section 12 holds the multiple chips 72, for example, by vacuum adsorption of the wafer 70 or by attaching the wafer 70 to a film.

[0072] Each chip 72 of the wafer 70 held by the wafer holding section 12 is bonded to the substrate 80. The chip 72 is picked up from the wafer 70, for example, by the operation unit 14, and by the reversing operation of the operation unit 14, the back side attached to the substrate faces upward. The reversed chip 72 is then transferred to the bonding tool 22.

[0073] More specifically, the operating unit 14 includes a stepper motor 15, a rotary axis 16, an arm 17, a base 18, and a pickup tool 19. The stepper motor 15 is a reversing drive mechanism that rotates the rotary axis 16, causing the base 18 and the pickup tool 19 to reverse. One end of the arm 17 is mounted to the rotary axis 16 and extends obliquely downwards in the Z-axis direction from the rotary axis 16; the other end is mounted to the upper surface 18a of the base 18 in the Z-axis direction. The base 18 is a plate-like member fixed to the front end of the arm 17 by bolts or the like. The pickup tool 19 is mounted on the lower surface 18b of the base 18 in the Z-axis direction. The pickup tool 19 can be moved along the Z-axis direction via a Z-axis drive mechanism (not shown).

[0074] Figure 1The illustrated operation unit 14 shows the pickup tool 19 facing downwards, i.e., the upper surface 18a of the base 18 faces upwards in the Z-axis direction. In this state, the operation unit 14 is moved onto the wafer holding portion 12, lifting the chip 72 from below the wafer holding portion 12 across the film, and the pickup tool 19 picks up the chip 72 from the film above, thus the chip 72 is picked up by the pickup tool 19 of the operation unit 14. On the other hand, after the rotation axis 16 is rotated by the stepper motor 15 and the base 18 and pickup tool 19 are reversed, the lower surface 18b of the base 18 faces upwards in the Z-direction, and the pickup tool 19 also faces upwards. Thus, the operation unit 14 can reverse the picked-up chip 72.

[0075] The bonding head 20 is configured to pick up and flip the chip 72 from the wafer holding section 12, transport it to the bonding position of the substrate 80, and bond the chip 72 to the substrate 80.

[0076] The engagement head 20 holds the engagement tool 22 and the top camera 24. Specifically, the engagement tool 22 is mounted on the engagement head 20 via the Z-axis drive mechanism 21, and the top camera 24 is mounted in a position separate from the engagement tool 22. The engagement head 20 is movable along the X-axis and Y-axis directions via the XY platform 26, thereby moving the engagement tool 22 and the top camera 24 in at least one direction of the X-axis and Y-axis directions.

[0077] Furthermore, the bonding device 100 is not limited to including only one bonding head 20. For example, the bonding device 100 may also include multiple bonding heads 20. In this case, by providing multiple bonding heads, multiple substrates can be bonded simultaneously.

[0078] The bonding tool 22 is, for example, a suction nozzle that holds the chip 72. This nozzle is configured in a cuboid or frustum shape, and is configured to contact and hold the chip 72 from the surface side on which the integrated circuit pattern is formed. The nozzle, as the bonding tool 22, has a central axis parallel to the Z-axis direction, and can move along the Z-axis direction, X-axis direction, and Y-axis direction, respectively, via the Z-axis drive mechanism 21 and the XY platform 26.

[0079] The engagement tool 22 is mounted on the engagement head 20 via a θ-axis drive mechanism (not shown) and a tilt drive mechanism, which allow it to rotate about the Z-axis and move along the tilt direction.

[0080] The top camera 24 is configured to acquire image information from the reference member 30 fixed to the bottom camera 28. The top camera 24 is, for example, a digital camera including an optical system such as a lens, and imaging elements such as a charge-coupled device (CCD) image sensor or a complementary metal-oxide-semiconductor (CMOS) image sensor. The top camera 24 directs the optical system toward one side, i.e. Figure 1 It is configured on the negative Z-axis side and has an optical axis pointing downwards in the vertical direction.

[0081] like Figure 2 As shown, the joining tool 22 is configured in the joining head 20 at an offset distance ODd from the top camera 24. More specifically, the joining tool 22 and the top camera 24 are configured such that the central axis CA1 of the joining tool 22 in the Y-axis direction is at an offset distance ODd from the optical axis OA1 of the top camera 24.

[0082] In this type of bonding device, the distance between the bonding tool and the top camera may change due to temperature variations or changes over time. Furthermore, if the offset distance changes from the pre-defined reference offset distance ODd, an error corresponding to the amount of change will occur, resulting in a decrease in the accuracy of, for example, the bonding position on the substrate.

[0083] Therefore, some joining devices employ methods such as adding a step to calculate the change in offset distance before the joining process. However, this method requires an additional step, which may increase the time required to calculate the change in offset distance.

[0084] return Figure 1 The bottom camera 28 is configured to obtain image information from the joining tool 22. Like the top camera 24, the bottom camera 28 is, for example, a digital camera including an optical system and an image sensor. The bottom camera 28 directs the optical system towards the other side, i.e. Figure 1 The bottom camera 28 is positioned on the positive Z-axis side and has an optical axis pointing upwards in the vertical direction. In other words, the bottom camera 28 is positioned facing the joining tool 22 and the top camera 24 so as to be able to photograph the bottom surface (front end surface) of the joining tool 22. Moreover, the bottom camera 28 is positioned so as to be able to photograph the bottom surface of the joining tool 22 around the joining platform portion 40.

[0085] Reference member 30 is the member that serves as a reference when calculating the change in the offset distance ODd between the joining tool 22 and the top camera 24. The calculation of the change in offset distance ODd will be explained below.

[0086] like Figure 3 As shown, the bottom camera 28 is mounted and fixed on a fixed member or a reference member. The reference member 30 is fixed at a position spaced a predetermined distance PD relative to the bottom camera 28. More specifically, a support member 31, mounted on the fixed member or reference member, is fixed at a position separated from the bottom camera 28 along the Y-axis direction. The reference member 30 is supported by the support member 31. As a result, the bottom camera 28 and the reference member 30 are configured such that the optical axis OA2 of the bottom camera 28 and the central axis CA2 of the reference member 30 in the Y-axis direction are spaced a predetermined distance PD apart.

[0087] As described above, since the bottom camera 28 and the reference component 30 are fixed, the specified distance PD between the bottom camera 28 and the reference component 30 is different from the offset distance described above, and is not affected by temperature changes or changes over time, or these effects are so small as to be negligible. Therefore, the specified distance PD can be considered to be unchanged (unchanged).

[0088] The reference member 30 on the side of the joint head 20 ( Figure 3 The upper surface of the top camera 24 has a reference mark 32. Furthermore, the reference member 30 is positioned at a height within the depth of field range of the top camera 24, as described above.

[0089] The shape of the reference mark 32 is not particularly limited as long as it can identify the position and orientation within the field of view of the top camera 24. Thus, the reference mark 32 can be, for example, a rectangular mark including a rectangular block, or a cross-shaped mark including a cross-shaped groove (hole) formed in the rectangular block.

[0090] exist Figure 3 The image shows an example where the bottom camera 28 and the reference component 30 are different components, but this is not a limitation. Figure 4 As shown, for example, the support member 31 can also be a member that extends from the bottom camera 28 along the Y-axis and connects the bottom camera 28 to the reference member 30. In this case, the bottom camera 28 and the reference member 30 are integrally formed as one member. Thus, the reference member 30 can be easily fixed at a position separated from the bottom camera 28 by a predetermined distance PD.

[0091] Furthermore, it is preferable to set the specified distance PD between the bottom camera 28 and the reference member 30 based on the offset distance ODd described above. For example, the specified distance PD may be the same as the offset distance ODd (PD = ODd), or it may be obtained by adding a specified length (ΔL) to the offset distance ODd (PD = ODd + ΔL), or it may be obtained by subtracting the specified length (ΔL) from the offset distance ODd (PD = ODd - ΔL).

[0092] As described above, by setting a predetermined distance PD between the bottom camera 28 and the reference member 30 based on the offset distance ODd mentioned above, for example by setting the predetermined distance PD to the same value as the offset distance ODd, the change in the offset distance described below can be calculated simply and easily.

[0093] return Figure 1 The bonding stage 40 is a mounting platform for bonding the chip 72 to the substrate 80. The bonding stage 40 is equipped with a (not shown) moving mechanism for moving the substrate 80 in at least one direction (X-axis and Y-axis), and a (not shown) heater for heating the substrate 80. These are controlled by the bonding control unit 60.

[0094] The bonding control unit 60 is configured to control the bonding apparatus 100 as a whole. More specifically, the bonding control unit 60 is configured to control the processes required for bonding using the bonding apparatus 100. Specifically, the bonding control unit 60 includes controlling the bonding process performed using the bonding head 20, the replacement process of the wafer 70 held by the wafer holding section 12, and the transport process of the chip 72 and the substrate 80. The bonding control unit 60 is connected to each structure of the bonding apparatus 100 in a manner that enables it to receive and transmit signals within the range required for these processes, and controls the operation of each structure.

[0095] The bonding control unit 60 is a computer device that includes, for example, a microprocessor (not shown) such as a central processing unit (CPU) and a memory (not shown) such as read-only memory (ROM) and random access memory (RAM). A bonding program and other necessary information for the processing required for bonding are pre-stored in the memory. The bonding control unit 60 is configured to execute, for example, a program for causing a computer to perform each step, in order to perform each step related to the bonding method described below.

[0096] Furthermore, the engagement control unit 60 includes a calculation unit 61 and a movement control unit 62 as functional modules.

[0097] The calculation unit 61 is configured to calculate the change in offset distance when the bonding head is moved such that the reference mark 32 is positioned within the field of view of the top camera 24 and the chip 72 held by the bonding tool 22 is positioned within the field of view of the bottom camera 28. As will be described in detail below, the calculation unit 61 is configured to calculate the change in offset distance based on a predetermined distance PD, the position of the reference mark 32 detected by the top camera 24, and the position of the chip 72 detected by the bottom camera 28. Therefore, the position of the reference mark 32 and the position of the chip 72 held by the bonding tool 22 can be detected simultaneously, and the change in offset distance can be calculated. Therefore, compared to conventional bonding apparatuses that sequentially detect the reference mark 32 and the chip 72 in different steps, the processing time for calculating the change in offset distance can be shortened.

[0098] The movement control unit 62 is configured to control the movement of the bonding head 20. More specifically, the movement control unit 62 is configured to determine the amount of movement of the bonding head 20 based on the calculated change in offset distance. Therefore, the bonding head 20 can be moved by an amount of movement corrected for the calculated change in offset distance. This improves the accuracy of the bonding position of the chip 72 held by the bonding tool 22.

[0099] also, Figure 1 This illustration shows a portion of the functional modules required for engagement in this embodiment. Therefore, the engagement control unit 60 may include... Figure 1 Modules other than the functional modules shown.

[0100] Next, refer to Figures 5 to 7 The calculation of the variation in the offset distance of the coupling device in one embodiment will be explained. Figure 5 This is a conceptual diagram showing the configuration of the engagement head 20, bottom camera 28, and reference member 30 of the engagement device 100 in one embodiment. Figure 6 It means Figure 5 A schematic diagram of the first image g1 taken by the top camera 24. Figure 7 It means Figure 5 A schematic diagram of the second image g2 captured by the bottom camera 28.

[0101] like Figure 5As shown, with the bonding tool 22 holding the chip 72, the movement control unit 62 moves the bonding head 20 to a position where the reference mark 32 is positioned within the field of view of the top camera 24 and the chip 72 held by the bonding tool 22 is positioned within the field of view of the bottom camera 28. Specifically, when the specified distance PD and the offset distance ODd are the same (PD = ODd), the movement control unit 62 moves the bonding head 20 in the following manner: the top camera 24 is located directly above the reference member 30, that is, the optical axis OA1 of the top camera 24 is aligned with the central axis CA2 of the reference member 30 in the Y-axis direction, and the bonding tool 22 is located directly above the bottom camera 28, that is, the optical axis OA2 of the bottom camera 28 is aligned with the central axis CA1 of the bonding tool 22 in the Y-axis direction.

[0102] Since the offset distance ODd was originally the same as the specified distance PD (OD = PD), if the offset distance remains unchanged (fixed), after the joining head 20 moves, the optical axis OA1 of the top camera 24 should be aligned with the central axis CA2 of the Y-axis direction of the reference member 30, and the optical axis OA2 of the bottom camera 28 should be aligned with the central axis CA1 of the Y-axis direction of the joining tool 22. However, as mentioned above, the offset distance may change due to heat or years, and the actual offset distance ODr includes the offset distance ODd, which is a pre-specified reference distance, and the change Δod (ODr = ODd + Δod).

[0103] In the stated state, that is, in Figure 5 When the optical axis OA1 of the top camera 24 at the indicated position is not aligned with the central axis CA2 of the Y-axis direction of the reference member 30 and is deviated, and the optical axis OA2 of the bottom camera 28 is not aligned with the central axis CA1 of the Y-axis direction of the bonding tool 22 and is deviated, the bonding control unit 60 drives the top camera 24 to capture the reference member 30 in the field of view to obtain a first image g1, and drives the bottom camera 28 to capture the chip 72 held by the bonding tool 22 in the field of view to obtain a second image g2.

[0104] Here, we consider a case where a deviation Δmk occurs, for example, along the Y-axis, between the optical axis OA1 of the top camera 24 and the central axis CA2 of the reference member 30. In this case, the calculation unit 61 is based on... Figure 6 The first image g1 shown detects the position of reference marker 32. In the absence of a deviation Δmk (Δmk = 0), reference marker 32 of reference member 30 should be positioned in the first image. Figure 6The original position is shown by the dashed line. Therefore, the joining control unit 60 captures the first image without generating a deviation amount Δmk, detects the position of the reference mark 32, and stores the position of the reference mark 32 in the first image in advance. Furthermore, the calculation unit 61 analyzes the first image g1 based on the stored position of the reference mark 32, thereby determining the deviation amount Δmk of the reference mark 32 relative to the top camera 24.

[0105] Similarly, consider the case where a deviation Δbh occurs, for example, along the Y-axis, between the optical axis OA2 of the bottom camera 28 and the central axis CA1 of the joining tool 22. In this case, the calculation unit 61 is based on... Figure 7 The second image g2 shown detects the position of the chip 72 held by the bonding tool 22. In the absence of a deviation Δbh (Δbh = 0), the chip 72 held by the bonding tool 22 should be in the second image at... Figure 7 The original position is shown by the dashed line. Therefore, the bonding control unit 60 captures a second image without any deviation Δbh, detects the position of the chip 72 held by the bonding tool 22, and stores the position of the chip 72 in the second image in advance. Furthermore, the calculation unit 61 analyzes the second image g2 based on the stored position of the chip 72, thereby determining the deviation Δbh of the chip 72 relative to the bottom camera 28.

[0106] Then, the calculation unit 61 calculates the change in offset distance Δod based on the specified distance PD, the deviation Δmk of the reference member 30 relative to the top camera 24 measured based on the first image g1, and the deviation Δbh of the chip 72 relative to the bottom camera 28 measured based on the second image g2.

[0107] Specifically, the calculation unit 61 uses the following formula (1) to calculate the change in offset distance Δod.

[0108] Δod=PD-Δbh+Δmk···(1)

[0109] As described above, the position of the reference mark 32 is detected based on the first image g1 captured by the top camera 24, and the position of the chip 72 held by the bonding tool 22 is detected based on the second image g2 captured by the bottom camera 28, thereby making it easy to detect the positions of the reference mark 32 and the chip 72.

[0110] Furthermore, by measuring the deviation amount Δmk of the reference mark 32 based on the first image g1 and the deviation amount Δbh of the chip 72 based on the second image g2, the change in offset distance Δod can be easily calculated based on the measured deviation amounts Δmk and Δbh.

[0111] The movement control unit 62 determines the movement amount of the engagement head 20 based on the calculated change in offset distance Δod. More specifically, the movement control unit 62 determines the actual movement amount of the engagement head 20 such that the movement distance, including the change in offset distance Δod, is equal to the original movement amount of the engagement head 20. For example, if the change in offset distance Δod is positive, the movement control unit 62 determines the movement amount of the engagement head 20 as the original movement amount minus the change in offset distance Δod. On the other hand, if the change in offset distance Δod is negative, the movement control unit 62 determines the movement amount of the engagement head 20 as the original movement amount plus the change in offset distance Δod.

[0112] exist Figure 6 and Figure 7 The example shown illustrates the deviation amount Δmk of the reference mark 32 and the deviation amount Δbh of the chip 72 along the Y-axis direction, but it is not limited to this. For example, in addition to the Y-axis direction, the calculation unit 61 can also measure the deviation amount of the reference mark 32 and the chip 72 along the X-axis direction, and calculate the change in offset distance along the X-axis direction. Similarly, regarding the tilt (slope) relative to the Z-axis, the calculation unit 61 can measure the deviation amount (deviation angle) of the reference mark 32 and the deviation amount (deviation angle) of the chip 72, and calculate the change in tilt (change angle) relative to the Z-axis for the offset distance.

[0113] Furthermore, the first image g1 and the second image g2 are not limited to temporarily stopping the engagement head 20. Figure 5 The situation is obtained by the position shown. For example, the engagement head 20 can also be moved by the movement control unit 62 and become Figure 5 When the position is shown, the engagement control unit 60 obtains the first image g1 and the second image g2.

[0114] Next, refer to Figure 8 A joining method according to one embodiment will be described. Figure 8 This is a flowchart illustrating a joining method in one embodiment. The joining method in this embodiment can be performed using the joining device 100 described above.

[0115] When bonding chip 72 to substrate 80, bonding control unit 60 performs... Figure 8The bonding process S100 is shown. First, the movement control unit 62 moves the bonding head 20, positioning the bonding tool 22 directly above the operation unit 14 that reverses the picked-up chip 72 (S101). Then, at this position, the bonding control unit 60 drives the Z-axis drive mechanism 21 to lower the bonding tool 22, drawing and holding the chip 72 with the tip of the bonding tool 22 (S102). After drawing and holding the chip 72 in step S102, the bonding control unit 60 drives the Z-axis drive mechanism 21 to raise the bonding tool 22 to a predetermined height.

[0116] Next, the movement control unit 62 moves the bonding head 20, positioning the reference member 30 within the field of view of the top camera 24 and the chip 72 held by the bonding tool 22 within the field of view of the bottom camera 28 (S103). Then, at the aforementioned positions, the bonding control unit 60 uses the top camera 24 to capture a first image g1 of the reference mark 32 of the reference member 30 within the field of view, and uses the bottom camera 28 to capture a second image g2 of the chip 72 held by the bonding tool 22 within the field of view (S104). The first image g1 and the second image g2 obtained in step S104 are stored in a memory or the like.

[0117] Furthermore, before obtaining the second image g2 in step S104, the bonding control unit 60 may also drive the Z-axis drive mechanism 21 to lower the bonding tool 22 holding the chip 72 within the depth of field of the bottom camera 28. In this case, since the image is taken while the bonding tool 22 holding the chip 72 is lowered, the deviation measurement described below may include the deviation of the chip 72 caused by the movement of the Z-axis direction accompanying the Z-axis drive mechanism 21.

[0118] Furthermore, the bonding control unit 60 can also determine the quality of the chip 72 based on the second image g2. If the second image g2 is analyzed and a defect such as cracking is detected in the chip 72, the bonding control unit 60 stops the bonding of the chip 72.

[0119] Next, the calculation unit 61 detects the position of the reference mark 32 in the reference member 30 based on the first image g1 obtained in step S104, and detects the position of the chip 72 held by the bonding tool 22 based on the second image g2 obtained in step S104 (S105).

[0120] Next, the calculation unit 61 determines the deviation amount Δmk of the reference mark 32 relative to the top camera 24 based on the position of the reference mark 32 detected in step S105, and determines the deviation amount Δbh of the chip 72 relative to the bottom camera 28 based on the position of the chip 72 detected in step S105 (S106). The deviation amount Δmk of the reference mark 32 and the deviation amount Δbh of the chip 72 measured in step S106 are stored in a memory or the like.

[0121] Next, the calculation unit 61 calculates the change in offset distance Δod (S107) based on the specified distance PD, the deviation amount Δmk of the reference mark, and the deviation amount Δbh of the chip 72, according to the formula (1) described above.

[0122] Next, the movement control unit 62 moves the bonding head 20 and positions the bonding tool 22 directly above the mounting portion of the substrate 80 (S108). At this time, taking into account the change in offset distance Δod calculated in step S107, the movement control unit 62 determines the amount of movement of the bonding head 20 such that the bonding tool 22 is directly above the mounting portion of the substrate 80.

[0123] Then, the bonding control unit 60 lowers the bonding tool 22 to the vicinity of the substrate 80 and bonds the chip 72 to the assembly section of the substrate 80 (S109). After the bonding of one chip 72 is completed, the process returns to step S101 to bond the next chip 72.

[0124] When steps S101 to S109 of bonding one chip 72 are considered as one cycle, in a conventional bonding apparatus, using 383 chips as samples, the time for each cycle (hereinafter referred to as "cycle time") is measured, and the result is approximately 24.7 seconds. Furthermore, in a conventional bonding apparatus, using 63 chips as samples, the time spent on the process of determining the change in offset distance is measured, and the result is approximately 15.1 seconds. These times are equivalent to more than 61% of the cycle time.

[0125] In contrast, in the bonding apparatus 100 and bonding method of this embodiment, since the chip 72 and the reference mark 32 can be detected, and the change in offset distance Δod can be calculated, the processing time of approximately 15.1 seconds used in conventional bonding apparatuses to calculate the change in offset distance can be reduced to zero or approximately zero. Therefore, compared with conventional bonding apparatuses, the bonding apparatus 100 and bonding method of this embodiment can reduce the cycle time to 39% or less.

[0126] Furthermore, the embodiments described above are intended to facilitate understanding of the present invention and are not intended to limit its interpretation. The present invention can be modified / improved without departing from its spirit, and the present invention also includes its equivalents. That is, any modifications made by those skilled in the art to the embodiments and / or variations that possess the characteristics of the present invention are also included within the scope of the present invention. For example, the elements included in the embodiments and / or variations, their configurations, materials, conditions, shapes, dimensions, etc., are not limited to those illustrated and can be appropriately modified. Moreover, the embodiments and variations are illustrative; naturally, the structures shown in different embodiments and / or variations can be partially replaced or combined, and these substitutions or combinations, as long as they possess the characteristics of the present invention, are also included within the scope of the present invention.

Claims

1. A coupling device comprising: The engagement head is movable and holds a first camera that is positioned to face the optical system to one side, and an engagement tool that is configured at an offset distance from the first camera; The second camera is positioned so as to be able to capture images of the assembled head, with the optical system facing the other side; A reference member, having a reference mark on the other side, is fixed at a position spaced a predetermined distance from the second camera; as well as The calculation unit, when moving the bonding head in a manner that positions the reference mark within the field of view of the first camera and the chip held by the bonding tool within the field of view of the second camera, calculates the change in the offset distance based on the predetermined distance, the position of the reference mark detected by the first camera, and the position of the chip detected by the second camera. The calculation unit detects the position of the reference mark based on the first image captured by the first camera, and detects the position of the chip based on the second image captured by the second camera.

2. The coupling device according to claim 1, wherein The calculation unit determines the deviation of the reference mark relative to the first camera based on the first image, and determines the deviation of the chip relative to the second camera based on the second image.

3. The coupling device according to claim 1 or 2, further comprising: A movement control unit controls the movement of the engagement head and determines the amount of movement of the engagement head based on the calculated change in the offset distance.

4. The coupling device according to claim 1 or 2, wherein The second camera is integrated with the reference component.

5. The coupling device according to claim 1 or 2, wherein The specified distance is set based on the offset distance.

6. A joining method, which is a joining method of a joining device, said joining device comprising: The assembly head is movable and holds a first camera positioned to face one side of the optical system, and an assembly tool positioned at an offset distance from the first camera; a second camera is positioned to face the optical system to the other side in a manner capable of capturing images of the assembly head. And a reference component, having a reference mark on the other side surface, fixed at a position spaced a predetermined distance from the second camera. The joining method includes: The steps of detecting the position of the reference mark using the first camera and detecting the position of the chip held by the bonding tool using the second camera; and The step of calculating the change in offset distance based on the specified distance, the detected position of the reference marker, and the detected position of the chip. The calculation steps include: detecting the position of the reference marker based on a first image captured by the first camera, and detecting the position of the chip based on a second image captured by the second camera.

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