A packaging device and process for circular metal packaging shells

Abstract

The application relates to the field of manufacturing equipment of metal packaging shells of semiconductor light source parts, in particular to a packaging device and process of a circular metal packaging shell. The welding device comprises a mechanical hand support, a mechanical hand module movably arranged on the mechanical hand support, a sealing cover positioning table arranged below the mechanical hand support, a window calibration unit with a laser receiver, a rotating base, a laser welding device and a base positioning module arranged on the rotating base, and a control module. The mechanical hand module comprises a gripper base, an L-shaped light source fixing rod fixed on the gripper base, a gripper structure and a laser emitter. The position of the window can be automatically determined through the cooperation of the mechanical hand module and the window calibration unit, so that the sealing cover can be accurately buckled on the base. Finally, the sealing cover and the light element core main body are synchronously rotated under the control of the control module, and the welding of the sealing cover and the base is completed.

Description

Technical Field

[0001] This invention relates to the field of manufacturing equipment for metal packaging shells of semiconductor light source devices, and specifically to a packaging device and process for a circular metal packaging shell. Background Technology

[0002] In recent years, semiconductor optical components, which are used for emitting light, receiving light, and modulating light, have developed rapidly and have gradually become important components of information and communication systems.

[0003] Semiconductor optical components consist of semiconductor packages, LDs (Laser Diodes), PDs (Photo Diodes), and other optical elements. To withstand harsh environments and ensure stable operation of the semiconductor optical components, the semiconductor packages typically use metal enclosures.

[0004] Figure 1 A novel semiconductor optical element is demonstrated, comprising a wiring substrate, a base, an internal wiring substrate, an optical element, and a sealing cap. The base and sealing cap are made of ferrous alloys such as Fe-Ni-Co alloy or Fe-Mn alloy, or pure iron. During assembly, the wiring substrate, base, internal wiring substrate, and optical element are first assembled to form the core of the optical element. Then, the sealing cap is welded to the base to protect the optical element. The sealing cap has a through-hole, and a flat or lens-shaped window component is provided in the through-hole. The finished window component is aligned with the optical element to facilitate information exchange between the optical element and the outside world. Therefore, the accuracy of the sealing cap assembly is extremely important to ensure smooth information exchange.

[0005] During assembly, the usual procedure is to first assemble the wiring board, substrate, internal wiring board, and optical components, and finally align the window component of the sealing cover with the optical components and weld the sealing cover onto the substrate. However, due to... Figure 1 The device on display is a novel semiconductor optical element, therefore there is no dedicated production equipment, and the entire assembly process is manual. This means that during the assembly of the sealing cover, the window component needs to be manually aligned with the optical element, and the sealing cover needs to be manually welded to the substrate. The entire assembly process is time-consuming and labor-intensive; moreover, there is a possibility of misalignment between the window component and the optical element, affecting product quality. Summary of the Invention

[0006] This invention discloses a packaging device and process for a circular metal package shell, the purpose of which is to automate the alignment of the window component of the sealing cover with the optical element and the welding of the sealing cover with the substrate, so as to improve production efficiency and product quality.

[0007] To achieve the above objectives, the technical solution of the present invention is as follows:

[0008] The present invention provides a packaging device for a circular metal encapsulation shell, including a robotic arm support, a robotic arm module movably mounted on the robotic arm support, a sealing cover positioning platform mounted below the robotic arm support, a window calibration unit with a laser receiver, a rotating base, a laser welding device, a substrate positioning module mounted on the rotating base, and a control module.

[0009] The robotic arm module includes a gripper base, an L-shaped light source fixing rod fixed on the gripper base, a gripper structure rotatably sleeved on the light source fixing rod, and a laser emitter fixed at the end of the light source fixing rod.

[0010] When the robotic arm module moves directly above the window calibration unit, the laser emitter and the laser receiver are coaxial.

[0011] Furthermore, the robotic arm support includes a pair of side walls and a crossbeam disposed between the two side walls. A "T"-shaped slide rail is provided on the lower surface of the crossbeam, and a rack is provided on the surface of the slide rail.

[0012] Furthermore, the robotic arm module also includes a movable base and a lifting structure.

[0013] Furthermore, the movable base includes a housing with a slide groove that matches the slide rail, and a power servo motor, a harmonic drive reducer I, a gear set I, and a power gear that meshes with the rack, all disposed within the housing.

[0014] Furthermore, the gripper structure includes a robotic arm servo motor fixed on the gripper base, a harmonic drive reducer II mounted on the output shaft of the robotic arm servo motor, a drive wheel mounted on the output end of the harmonic drive reducer II, a fixed plate with a through hole at its center, and a pair of grippers; the fixed plate is provided with a driven gear coaxial with the through hole, a bearing is provided in the through hole, the bearing is sleeved on the light source fixing rod, and the fixed plate can rotate about the light source fixing rod as an axis; the grippers are movably mounted on the fixed plate through a tightening unit, and the grippers are symmetrically arranged.

[0015] Furthermore, the tightening unit includes a permanent magnet slider I, a buffer spring I, and an electromagnet I fixed to the gripper.

[0016] Furthermore, the rotating base includes a rotating base housing, and a rotating servo motor, a gear set II, and a harmonic drive reducer III disposed within the rotating base housing.

[0017] Furthermore, the substrate positioning module includes a substrate base and a pair of substrate fixing clips symmetrically arranged on both sides of the substrate base. The upper surface of the substrate base is provided with a downwardly recessed wiring substrate limiting groove that matches the wiring substrate. A touch switch is provided on the side wall of the wiring substrate limiting groove.

[0018] Furthermore, the base fixing clamp includes a clamping claw, a permanent magnet slider II, a buffer spring II, and an electromagnet II.

[0019] A packaging process for a circular metal enclosure includes the following steps:

[0020] S1. Positioning the sealing cap: Place the sealing cap on the sealing cap positioning platform;

[0021] S2. Substrate positioning: Place the optical element core body that has been assembled in the previous process into the wiring board limiting groove, trigger the touch switch, and the substrate fixing clamp tightens to hold the substrate.

[0022] S3. Once the position of the sealing cover window component is determined, the robotic arm module picks up the sealing cover from the sealing cover positioning platform and moves it directly above the window calibration unit. The laser emitter and laser receiver are activated simultaneously, and the gripper structure rotates at a constant speed under the drive of the robotic arm servo motor. When the light signal received by the laser receiver reaches its maximum value, the gripper structure stops rotating. At this time, the laser emitter, laser receiver, and window component are coaxial, and the control module records the position information of the sealing cover at this time.

[0023] S4. Welding preparation: The robotic arm module moves the sealing cover to directly above the core body of the optical element, making the sealing cover coaxial with the substrate; the robotic arm structure rotates, making the window component coaxial with the optical element; the lifting structure drives the gripper structure to descend, and fastens the sealing cover onto the substrate;

[0024] S5. The sealing cap is welded to the substrate. The robotic arm servo motor and the rotary servo motor rotate synchronously. At the same time, the laser welding device is started. After rotating 360 degrees, the welding of the sealing cap to the substrate is completed.

[0025] The beneficial effects achieved by this invention are as follows:

[0026] This invention, through the cooperation of a robotic arm module and a window calibration unit, can automatically determine the position of the window, thereby accurately attaching the sealing cover to the substrate. Finally, under the control of the control module, the sealing cover and the core body of the optical element are rotated synchronously to complete the welding of the sealing cover to the substrate.

[0027] Furthermore, this invention reduces the experience requirements for workers, making the entire production process no longer dependent on workers' manual skills, but supported by data, achieving standardized assembly and facilitating large-scale production.

[0028] The robotic arm module of this invention uses several servo motors as power sources and a harmonic drive reducer for transmission and deceleration, making the movement of the robotic arm more stable and precise, and improving the operational accuracy of the entire system. Attached Figure Description

[0029] Figure 1 This is an unfolded diagram of an existing semiconductor optical element; in the diagram, a represents the substrate, b represents the optical element, c represents the sealing cover, and d represents the window component.

[0030] Figure 2 This is a schematic diagram of the overall structure of the present invention.

[0031] Figure 3 This is the front view of the present invention.

[0032] Figure 4 This is a top view of the present invention.

[0033] Figure 5 This is a schematic diagram of the robotic arm module structure of the present invention.

[0034] Figure 6 This is a schematic diagram of the gripper structure.

[0035] Figure 7 This is a schematic diagram of the substrate positioning module structure of the present invention.

[0036] In the diagram: 1. Base plate; 2. Robot arm support; 21. Side wall; 22. Crossbeam; 221. Slide rail; 3. Robot arm module; 31. Moving base; 311. Power servo motor; 32. Lifting structure; 33. Grip base; 331. Light source fixing rod; 34. Grip structure; 341. Robot arm servo motor; 342. Harmonic drive reducer II; 343. Drive wheel; 344. Fixing plate; 345. Grip; 346. Laser emitter; 4. Sealing cover positioning platform; 41. Sealing cover limiting groove; 5. Window calibration module; 51. Laser receiver; 6. Rotating base; 7. Base positioning module; 71. Base base; 711. Wiring board limiting groove; 712. Touch switch; 72. Base fixing clamp; 8. Laser welding structure. Detailed Implementation

[0037] To facilitate understanding of the present invention by those skilled in the art, specific embodiments of the present invention will be described below with reference to the accompanying drawings.

[0038] This invention provides a packaging device for a circular metal encapsulation shell, mainly to achieve automatic alignment of window components and optical elements, and automatic welding of the sealing cover and the substrate, thereby improving production speed and product quality.

[0039] like Figures 2-4As shown, the welding structure specifically includes a base plate 1, a robotic arm support 2 mounted on the base plate 1, a robotic arm module 3 movably mounted on the robotic arm support 2, a sealing cover positioning platform 4 mounted on the base plate 1 below the robotic arm support 2, a window calibration unit with a laser receiver 51, a rotating base 6, a laser welding device, and a substrate positioning module 7 mounted on the rotating base 6, as well as a control module connected to the robotic arm module 3, the window calibration unit, the rotating base 6, the laser welding device, and the substrate positioning module 7 respectively.

[0040] The robotic arm support 2 includes a pair of sidewalls 21 and a crossbeam 22 disposed between the two sidewalls 21. The sidewalls 21 are parallel to each other and have an "n"-shaped planar shape. The crossbeam 22 is disposed on one side of the line connecting the midpoints of the two sidewalls 21. A "T"-shaped slide rail 221 is provided on the lower surface of the crossbeam 22, and a rack is provided on the surface of the slide rail 221. The crossbeam 22 provides support for the suspension and movement of the robotic arm module 3.

[0041] like Figure 5 As shown, the robotic arm module 3 includes a movable base 31 suspended on the slide rail 221, a lifting structure 32 fixed on the movable base 31, a gripper base 33 fixed at the end of the lifting structure 32, an L-shaped light source fixing rod 331 fixed on the gripper base 33, a gripper structure 34 rotatably sleeved on the light source fixing rod 331, and a laser emitter 346 fixed at the end of the light source fixing rod 331.

[0042] Furthermore, the movable base 31 serves as the power structure for the robotic arm module 3, which moves left and right along the slide rail 221 under the drive of the movable base 31. The movable base 31 includes a housing with a groove that matches the slide rail 221, and a power servo motor 311, a harmonic drive reducer I, a gear set I, and a power gear meshing with the rack, all housed within the housing. The output shaft of the power servo motor 311 is connected to the input end of the harmonic drive reducer I, the output end of the harmonic drive reducer I is connected to the gear set I, and the gear set I is connected to the power gear. The harmonic drive reducer I is used to make the movement of the robotic arm module 3 more precise. During operation, the power servo motor 311 provides power, which, after reduction by the harmonic drive reducer I and transmission by the gear set I, drives the power gear to rotate, thereby moving the movable base 31 along the slide rail 221.

[0043] Furthermore, the lifting structure 32 can be a cylinder, or it can be a screw jack or other structures with lifting functions. The gripper base 33 is fixed to the end of the cylinder piston rod, and the gripper base 33 can move up and down under the drive of the cylinder.

[0044] like Figure 6 As shown, the gripper structure 34 includes a robotic arm servo motor 341 fixed on the gripper base 33, a harmonic drive reducer II 342 mounted on the output shaft of the robotic arm servo motor 341, a drive wheel 343 mounted on the output end of the harmonic drive reducer II 342, a fixed plate 344 with a through hole at its center, and a pair of grippers 345. A driven gear coaxial with the through hole is mounted on the fixed plate 344, and the driven gear meshes with the drive wheel 343. A bearing is installed inside the through hole, and the bearing is sleeved on the light source fixing rod 331. The fixed plate 344 can rotate about the light source fixing rod 331 as its axis. The laser emitter 346 is located below the fixed plate 344, so that the laser emitter 346 is not obstructed when the fixed plate 344 rotates. The grippers 345 are movably mounted on the fixed plate 344 via a tightening unit, and the grippers 345 are symmetrically arranged.

[0045] The fixing plate 344 is made of non-metallic materials such as ceramic or hard plastic. The upper surface of the fixing plate 344 is provided with several gripper slides, and the gripper 345 is provided with several sliders that match the gripper slides, allowing the gripper 345 to slide along the gripper slides. A tightening unit provides power for the sliding of the gripper 345. The tightening unit is disposed within the fixing plate 344 and includes a groove on the fixing plate 344, a permanent magnet slider I fixed to the gripper 345, a buffer spring I, and an electromagnet I. The permanent magnet slider I is disposed within the groove, and the electromagnet I is fixed to one end of the groove. One end of the buffer spring I is connected to the permanent magnet slider I, and the other end is fixed to one end of the groove. The buffer spring I is disposed between the permanent magnet slider I and the electromagnet.

[0046] In the initial state, the buffer spring I is naturally extended, and the permanent magnet slider I is pressed against the end of the slide groove away from the electromagnet I. At this time, the gripper structure 34 is in an extended state. When the electromagnet I is energized, the permanent magnet slider I moves along the slide groove towards the end of the electromagnet I under the attraction of the electromagnet I. The buffer spring I is compressed, and the gripper 345 retracts, gripping the sealing cover. When the electromagnet I is de-energized, the magnetic force disappears, and the permanent magnet slider I returns to its initial position under the elastic force of the buffer spring I. The buffer spring I also serves to slow down the movement speed of the permanent magnet slider I, preventing it from moving too fast under the action of the electromagnet I, which could cause the gripper 345 to collide with the sealing cover and damage it.

[0047] In summary, the robotic arm module 3 has two degrees of freedom (left and right, up and down) and can also perform grasping actions. Simultaneously, the gripper structure 34 can rotate along with the sealing cover under the drive of the robotic arm servo motor 341. The robotic arm module 3 can reach down to grasp the sealing cover from the sealing cover positioning platform 4, pass directly above the window calibration unit, transport the sealing cover to directly above the base positioning module 7, and finally, in conjunction with the corresponding structure, complete the welding of the sealing cover to the base.

[0048] When the robotic arm module 3 moves directly above the window calibration unit, the laser emitter 346 and the laser receiver 51 are coaxial to better confirm the position of the window component.

[0049] The upper surface of the sealing cover positioning platform 4 is provided with a downwardly recessed sealing cover limiting groove 41 that matches the sealing cover, which is used to limit and fix the sealing cover.

[0050] The rotating base 6 is for driving the base positioning module 7 to rotate together. The rotating base 6 includes a rotating base housing mounted on the base plate 1, and a rotating servo motor, gear set II, and harmonic drive reducer III disposed within the rotating base housing. The input end of the harmonic drive reducer III is connected to the output shaft of the rotating servo motor, and the output end of the harmonic drive reducer III is connected to the gear set II. The output end of the gear set II is connected to the base base 71 described below, and the gear set II drives the base positioning module 7 to rotate at a uniform speed.

[0051] like Figure 7 As shown, the substrate positioning module 7 includes a substrate base 71 and a pair of substrate fixing clips 72 symmetrically arranged on both sides of the substrate base 71. The upper surface of the substrate base 71 is provided with a downwardly recessed wiring substrate limiting groove 711 that matches the wiring substrate. A touch switch 712 is provided on the side wall 21 of the wiring substrate limiting groove 711. When the touch switch 712 is triggered, the substrate fixing clips 72 on both sides move closer together, locking the substrate. The substrate base 71 is made of non-metallic materials such as ceramic or hard plastic.

[0052] Furthermore, the base fixing clamp 72 includes grippers, a permanent magnet slider II fixed on the grippers, a buffer spring II, and an electromagnet II. The base 71 has a gripper groove, the permanent magnet slider II is slidably disposed within the gripper groove, and the electromagnet II is disposed at one end of the gripper groove. One end of the buffer spring II is fixed to the permanent magnet slider II, and the other end is fixed to the end of the gripper groove, with the buffer spring II positioned between the permanent magnet slider II and the electromagnet II. In the initial state, the buffer spring II is naturally extended, and the permanent magnet slider II is pressed against the end of the gripper groove away from the electromagnet; at this time, the base fixing clamp 72 is in an extended state. The working principle of the base fixing clamp 72 is similar to that of the gripper structure 34, and will not be repeated here.

[0053] The laser welding structure 8 is a YAG laser welding machine or other laser welding equipment, and the welding head of the laser welding structure 8 is aligned with the joint between the sealing cap and the substrate.

[0054] The control module includes a PLC controller and a control system running on the PLC controller. Since the control actions in this invention are relatively conventional and can be edited by those skilled in the art based on existing technology, they will not be described in detail here.

[0055] A packaging process for a circular metal enclosure includes the following steps:

[0056] S1. Sealing cap positioning: The sealing cap is placed into the sealing cap limiting groove 41 on the sealing cap positioning table 4 by the robot or manual labor in the previous process.

[0057] S2. Substrate positioning: Place the optical element core body that has been assembled in the previous process into the wiring substrate limiting groove 711, trigger the touch switch 712, and the substrate fixing clamp 72 tightens and clamps the substrate.

[0058] S3. Once the position of the sealing cover window component is determined, the robotic arm module 3 picks up the sealing cover from the sealing cover positioning platform 4 and moves it directly above the window calibration unit. The laser emitter 346 and the laser receiver 51 are activated simultaneously, and the gripper structure 34 rotates at a constant speed under the drive of the robotic arm servo motor 341. When the light signal received by the laser receiver 51 reaches its maximum value, the gripper structure 34 stops rotating. At this time, the laser emitter 346, the laser receiver 51, and the window component are coaxial, and the control module records the position information of the sealing cover at this time.

[0059] S4. Welding preparation: The robotic arm module 3 moves the sealing cover to the top of the core body of the optical element, making the sealing cover coaxial with the base; the robotic arm structure rotates, making the window component coaxial with the optical element; the lifting structure 32 drives the gripper structure 34 to descend, and fastens the sealing cover onto the base;

[0060] S5. The sealing cover is welded to the substrate. The robotic arm servo motor 341 and the rotary servo motor rotate synchronously. At the same time, the laser welding device is started. After rotating 360 degrees, the sealing cover and the substrate are welded. The substrate fixing clamps 72 on both sides return to the initial position, the substrate is released, and the robotic arm or manual handling is required for the next process to handle the welded semiconductor optical element.

[0061] The embodiments of the present invention described above do not constitute a limitation on the scope of protection of the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A packaging device for a circular metal enclosure, characterized in that: It includes a robotic arm support, a robotic arm module movably mounted on the robotic arm support, a sealing cover positioning platform mounted below the robotic arm support, a window calibration unit with a laser receiver, a rotating base, a laser welding device, a base positioning module mounted on the rotating base, and a control module. The robotic arm module includes a gripper base, an L-shaped light source fixing rod fixed on the gripper base, a gripper structure that can be rotatably sleeved on the light source fixing rod, and a laser emitter fixed at the end of the light source fixing rod. When the robotic arm module moves directly above the window calibration unit, the laser emitter and the laser receiver are coaxial; The gripper structure includes a robotic arm servo motor fixed on the gripper base, a harmonic drive reducer II mounted on the output shaft of the robotic arm servo motor, a drive wheel mounted on the output end of the harmonic drive reducer II, a fixed plate with a through hole at its center, and a pair of grippers. The fixed plate has a driven gear coaxial with the through hole, and a bearing is installed inside the through hole. The bearing is sleeved on the light source fixing rod, and the fixed plate can rotate about the light source fixing rod as its axis. The grippers are movably mounted on the fixed plate via a tightening unit, and the grippers are symmetrically arranged.

2. The packaging device for a circular metal package according to claim 1, characterized in that: The robotic arm support includes a pair of side walls and a crossbeam disposed between the two side walls. A "T"-shaped slide rail is provided on the lower surface of the crossbeam, and a rack is provided on the surface of the slide rail.

3. The packaging device for a circular metal package according to claim 2, characterized in that: The robotic arm module also includes a movable base and a lifting structure.

4. The packaging device for a circular metal package according to claim 3, characterized in that: The movable base includes a housing with a groove that matches the slide rail, and a power servo motor, a harmonic drive reducer I, a gear set I, and a power gear that meshes with the rack, all disposed within the housing.

5. The packaging device for a circular metal package according to claim 1, characterized in that: The tightening unit includes a permanent magnet slider I, a buffer spring I, and an electromagnet I fixed to the gripper.

6. The packaging device for a circular metal package according to claim 1, characterized in that: The rotating base includes a rotating base housing, and a rotating servo motor, gear set II, and harmonic drive reducer III disposed within the rotating base housing.

7. The packaging device for a circular metal package according to claim 1, characterized in that: The substrate positioning module includes a substrate base and a pair of substrate fixing clips symmetrically arranged on both sides of the substrate base. The upper surface of the substrate base is provided with a downwardly recessed wiring substrate limiting groove that matches the wiring substrate. A touch switch is provided on the side wall of the wiring substrate limiting groove.

8. The packaging device for a circular metal package according to claim 7, characterized in that: The base fixing clamp includes a clamp, a permanent magnet slider II, a buffer spring II, and an electromagnet II.

9. A packaging process for a circular metal enclosure, applied to the packaging device according to any one of claims 1 to 8, characterized in that: Includes the following steps: S1. Positioning the sealing cap: Place the sealing cap on the sealing cap positioning platform; S2. Substrate positioning: Place the optical element core body that has been assembled in the previous process into the wiring board limiting groove, trigger the touch switch, and the substrate fixing clamp tightens to hold the substrate. S3. Once the position of the sealing cover window component is determined, the robotic arm module picks up the sealing cover from the sealing cover positioning platform and moves it directly above the window calibration unit. The laser emitter and laser receiver are activated simultaneously, and the gripper structure rotates at a constant speed under the drive of the robotic arm servo motor. When the light signal received by the laser receiver reaches its maximum value, the gripper structure stops rotating. At this time, the laser emitter, laser receiver, and window component are coaxial, and the control module records the position information of the sealing cover at this time. S4. Welding preparation: The robotic arm module moves the sealing cover to directly above the core body of the optical element, making the sealing cover coaxial with the substrate; the robotic arm structure rotates, making the window component coaxial with the optical element; the lifting structure drives the gripper structure to descend, and fastens the sealing cover onto the substrate; S5. The sealing cap is welded to the substrate. The robotic arm servo motor and the rotary servo motor rotate synchronously. At the same time, the laser welding device is started. After rotating 360 degrees, the welding of the sealing cap to the substrate is completed.

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