Cutting control method, system and microtome

Abstract

The application provides a cutting control method, a system and a slicing machine. The method is applied to the slicing machine. The slicing machine comprises at least two parallel arranged wire rollers, and a cutting wire is wound between the wire rollers. The slicing machine further comprises a tension detection device for detecting the tension of the cutting wire. The method comprises the following steps: acquiring the tension of the cutting wire detected by the tension detection device; and controlling the movement of the at least one wire roller relative to the remaining wire rollers according to the tension of the cutting wire, so as to adjust the tension of the cutting wire. The cutting control method, the system and the slicing machine provided by the application can detect the tension of the cutting wire in real time during the cutting process, and drive the wire rollers to move to adjust the tension, so that the tension is kept stable, and the cutting stability is improved.

Description

Technical Field

[0001] This application relates to cutting technology for hard and brittle materials, and more particularly to a cutting control method, system and slicer. Background Technology

[0002] A slicer is a device that cuts hard and brittle material bars into thin slices. Slicers typically use two parallel main rollers arranged horizontally, with a single diamond wire wound around the two main rollers to form at least 2,000 wire cutters. The hard and brittle material bar moves from top to bottom, passing between the two main rollers. The main rollers rotate, driving the diamond wire to move at high speed, cutting the hard and brittle material bar into thin slices.

[0003] Taking the cutting of silicon rods as an example, which are hard and brittle materials, the diamond wire is compressed by the silicon rod during the cutting process, resulting in a certain degree of elastic stretching and tension. When the tension is too high, the taut diamond wire is prone to breakage; when the tension is too low, the diamond wire is prone to detaching from the groove of the main roller. Summary of the Invention

[0004] To address one of the aforementioned technical deficiencies, this application provides a cutting control method, system, and slicer.

[0005] According to a first aspect of the embodiments of this application, a cutting control method is provided, applied to a slicing machine; the slicing machine includes at least two parallel wire rollers, with a cutting wire wound between the wire rollers; the slicing machine further includes a tension detection device for detecting the tension of the cutting wire; the method includes:

[0006] Acquire the cutting wire tension detected by the tension detection device;

[0007] The tension of the cutting wire is adjusted by controlling the movement of at least one wire roller relative to the other wire rollers according to the cutting wire tension.

[0008] According to a second aspect of the embodiments of this application, a cutting control system is provided, including: a processor, a memory, and a computer program;

[0009] The computer program is stored in the memory and configured to be executed by the processor to implement the method described above.

[0010] According to a third aspect of the embodiments of this application, a slicer is provided, comprising:

[0011] At least two parallel and side-by-side wire rollers;

[0012] Cutting lines wound around each of the wire rollers;

[0013] Tension detection device used to detect the tension of cutting wire;

[0014] A tension roller drive mechanism for driving the movement of the wire roller; and,

[0015] The cutting control system described above.

[0016] The technical solution provided in this application embodiment obtains the cutting wire tension detected by the tension detection device, and controls the movement of a certain wire roller relative to the other wire rollers according to the cutting wire tension. This allows the tension of the cutting wire to be adjusted during the cutting process so that the tension of the cutting wire can meet the needs of different stages of the cutting process, ensuring stable cutting operation, thereby obtaining silicon wafers with high cutting precision, avoiding wire breakage, ensuring production efficiency, and reducing production costs. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0018] Figure 1 This is a side sectional view of an existing slicer;

[0019] Figure 2 This is a top sectional view of an existing slicer;

[0020] Figure 3 This is a cross-sectional view of the cutting line wound around the main roller;

[0021] Figure 4 A schematic diagram of the tension on the cutting line;

[0022] Figure 5 A schematic diagram illustrating the deformation caused by the interaction between the cutting line and the silicon rod;

[0023] Figure 6 A side sectional view of the slicer provided in an embodiment of this application;

[0024] Figure 7 A top sectional view of the slicer provided in an embodiment of this application;

[0025] Figure 8 A flowchart of the cutting control method provided in the embodiments of this application;

[0026] Figure 9 A schematic diagram of the speed control tension roller movement curve in the cutting control method provided in the embodiments of this application;

[0027] Figure 10 A schematic diagram illustrating the effect of the cutting control method provided in this application embodiment on the bow wire;

[0028] Figure 11 This is a schematic diagram illustrating the effect of the cutting control method provided in the embodiments of this application on tension;

[0029] Figure 12 This is a cross-sectional view of another side of the slicer provided in an embodiment of this application;

[0030] Figure 13 Another top sectional view of the slicer provided in the embodiments of this application;

[0031] Figure 14 A flowchart of another cutting control method provided in an embodiment of this application.

[0032] Figure label:

[0033] 1-Framework;

[0034] 2-Main roller; 21-Wire groove; 22-Front axle box; 23-Rear axle box; 24-Steering wheel;

[0035] 3-Cutting line;

[0036] 4-Silicon rod;

[0037] 5-Tension roller. Detailed Implementation

[0038] To make the technical solutions and advantages of the embodiments of this application clearer, the exemplary embodiments of this application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not an exhaustive list of all embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0039] This embodiment provides a cutting control method that can be used to cut hard and brittle material rods into thin slices using a slicing machine. During the cutting process, the tension of the cutting wires is adjusted to improve the cutting quality. This embodiment uses a silicon rod as an example to specifically illustrate the technical solution.

[0040] In practical applications, this cutting control method can be implemented through a computer program, such as application software; alternatively, it can be implemented as a medium storing the relevant computer program, such as a USB flash drive or cloud storage; furthermore, it can be implemented through a physical device that integrates or installs the relevant computer program, such as a chip or a portable smart device. The method provided in this embodiment can be executed by a processor in the cutting control system.

[0041] Figure 1 This is a side sectional view of an existing slicer. Figure 2 This is a top sectional view of an existing slicer. Figure 3 This is a cross-sectional view showing the cutting line wound around the main roller. Figure 4 This is a schematic diagram of the tension on the cutting line. Figure 5This is a schematic diagram illustrating the deformation caused by the interaction between the dicing line and the silicon rod. (Example) Figures 1 to 5 As shown, a conventional slicing machine has a frame 1 in its cutting area. The frame 1 has two parallel and side-by-side main rollers 2, which are arranged horizontally. A gap is reserved between them for a silicon rod 4 to pass through. When the silicon rod 4 passes through this cutting gap, it is cut by the cutting line. The two ends of the main rollers 2 are supported by a front axle box 22 and a rear axle box 23, respectively. The main rollers 2 are connected to the corresponding axle boxes by bearings.

[0042] The main roller 2 has multiple grooves 21 on its circumferential surface, within which the cutting wire 3 can be accommodated. The cutting wire 3 can be diamond wire, with a single wire wound sequentially around two main rollers 2 to form a wire mesh. The two ends of the cutting wire are respectively wound onto the take-up mechanism and the unwinding mechanism via steering wheels 24. A drive mechanism drives the main rollers 2 to rotate, causing the cutting wire 3 to move at high speed, forming a wire saw with cutting capabilities. During the cutting process, the silicon rod 4 moves from top to bottom, and the cutting wire 3 cuts the silicon rod 4 into silicon wafers.

[0043] In the prior art, there is also a scheme that uses three main rollers 2, which are arranged in a fixed triangle, and the cutting line 3 is sequentially wound around the three main rollers 2. The silicon rod 4 passes between two of the main rollers 2 and is cut by the cutting line 3.

[0044] The cutting line 3 initially extends horizontally without external force. During the cutting process, the cutting line 3 is compressed downward by the silicon rod 4, resulting in a certain elastic stretch, forming a downward convex arc shape, creating a bow distance X compared to the initial state of the cutting line 3. At this time, the cutting line 3 has a certain tension F.

[0045] In the traditional method, the speed of the silicon rod 4 moving downwards gradually increases and then gradually decreases. When the silicon rod is about to be cut, the feed speed of the silicon rod 4 is very slow. As the speed of the silicon rod initially increases and then decreases, the changes in the wire bow distance X and tension also initially increase and then decrease. Higher tension in the cutting wire allows it to be better confined within the wire groove 21, maintaining stable high-speed movement within the groove, but this carries a higher risk of wire breakage. Lower tension in the cutting wire makes it difficult for the diamond wire to be confined within the wire groove 21, and it is prone to shifting or even detaching from the groove during high-speed movement.

[0046] To address the aforementioned technical problems, this embodiment provides a cutting control method. The applied slicing machine includes at least two parallel wire rollers, with a cutting wire wound between the rollers. The slicing machine also includes a tension detection device for detecting the tension of the cutting wire. For the aforementioned slicing machine, the cutting control method includes:

[0047] Step 1: Obtain the cutting wire tension detected by the tension detection device.

[0048] Step 2: Control at least one wire roller to move relative to the other wire rollers according to the cutting wire tension to adjust the cutting wire tension.

[0049] Tension detection devices are used to detect the tension of cutting wire and can be force sensors, displacement sensors, photoelectric sensors, etc. They can be placed in different locations depending on their different detection principles. In this embodiment, a force sensor is used as the tension detection device and is installed on the wire roller.

[0050] The force sensor is electrically connected to the processor and sends the detected data to the processor.

[0051] The processor sends a control command to the tension roller drive mechanism based on the currently acquired cutting line tension, controlling the tension roller drive mechanism to move at least one line roller. When the cutting line tension is low, the drive roller moves in the direction of stretching the cutting line 3 to increase the tension of the cutting line; when the cutting line tension is high, the drive roller moves in the direction of relaxing the cutting line 3 to decrease the tension of the cutting line.

[0052] The technical solution provided in this embodiment obtains the cutting wire tension detected by the tension detection device, and controls at least one line roller to move relative to the other line rollers according to the cutting wire tension. This allows the tension of the cutting wire to be adjusted during the cutting process so that the tension of the cutting wire can meet the needs of different stages of the cutting process, ensuring stable cutting operation, thereby obtaining silicon wafers with high cutting precision, avoiding wire breakage, ensuring production efficiency, and reducing production costs.

[0053] This embodiment uses a three-roll slicing machine as an example to explain the cutting control method in detail:

[0054] Figure 6 This is a side sectional view of the slicer provided in an embodiment of this application. Figure 7 This is a top sectional view of the slicer provided in an embodiment of this application. Figure 6 and Figure 7 As shown, the slicing machine provided in this embodiment uses three rollers: two main rollers 2 and a tension roller 5. The two main rollers 2 are parallel and side by side, arranged horizontally, with a gap between them for the silicon rod 4 to pass through. The two ends of the main rollers 2 are supported by a front axle box 22 and a rear axle box 23, respectively, and the main rollers 2 are connected to the corresponding axle boxes by bearings.

[0055] Tension roller 5 extends horizontally and is positioned below the two main rollers 2. A single cutting wire 3 is sequentially wound around the two main rollers 2 and tension roller 5 to form a wire mesh. The slicer also includes a tension roller drive mechanism to drive tension roller 5 to move relative to the main rollers 2. When the direction of movement of tension roller 5 stretches the cutting wire 3, the tension of the cutting wire 3 increases; when the direction of movement of tension roller 5 relaxes the cutting wire 3, the tension of the cutting wire 3 decreases.

[0056] The slicer is also equipped with a tension detection device to detect the tension of the cutting line 3.

[0057] Figure 8 A flowchart illustrating the cutting control method provided in an embodiment of this application. Figure 8 As shown, based on the above-mentioned slicer, this embodiment provides a cutting control method, including:

[0058] Step 101: Obtain the cutting wire tension detected by the tension detection device.

[0059] In this embodiment, a force sensor is used as a tension detection device and is installed on the tension roller 5.

[0060] Step 102: Control the movement of the tension roller relative to the two main rollers according to the tension of the cutting line.

[0061] The processor sends a control command to the tension roller drive mechanism based on the currently acquired cutting line tension, controlling the tension roller drive mechanism to move the tension roller 5. When the cutting line tension is low, the tension roller 5 is driven to move in the direction of stretching the cutting line 3 to increase the tension of the cutting line; when the cutting line tension is high, the tension roller 5 is driven to move in the direction of relaxing the cutting line 3 to decrease the tension of the cutting line.

[0062] The technical solution provided in this embodiment obtains the cutting wire tension detected by the tension detection device, and controls the movement of the tension roller relative to the two main rollers according to the cutting wire tension. This allows the tension of the cutting wire to be adjusted during the cutting process so that the tension of the cutting wire can meet the needs of different stages of the cutting process, ensuring stable cutting operation, thereby obtaining silicon wafers with high cutting precision, avoiding wire breakage, ensuring production efficiency, and reducing production costs.

[0063] One implementation method is that the movement range of the tension roller 5 is within a plane perpendicular to the axis of the tension roller.

[0064] For different models of slicing machines, the silicon rod can move up and down or left and right for cutting. Therefore, the arrangement direction of the two main rollers 2 is also adjusted accordingly. This embodiment only takes the scheme of the two main rollers 2 being arranged horizontally, the tension roller 5 being set below the two main rollers 2, and the silicon rod 2 moving up and down for cutting as an example. The tension roller moves in the vertical plane, for example: it can move left and right, up and down, or diagonally.

[0065] During implementation, preset upper and lower tension limits are stored in memory and can be retrieved by the processor. After the processor acquires the cutting line tension, it compares the tension with the upper and lower limits respectively. When the detected cutting line tension is greater than the upper limit, it means the current tension is too high, so the tension roller is moved closer to the two main rollers to relax the cutting line 3 and reduce the tension. When the detected cutting line tension is less than the lower limit, the tension roller is moved away from the two main rollers to stretch the cutting line 3 and increase the tension.

[0066] One implementation: A tension roller 5 is placed below the two main rollers 2, arranged in a triangular pattern. The tension roller 5 is located on the perpendicular bisector of the line connecting the centers of the two main rollers 2, and moves along this perpendicular bisector towards or away from the two main rollers 2. (Based on the attached...) Figure 6 and Figure 7 The slicer shown has a tension roller 5 that moves up and down. When it moves up, it relaxes the cutting wire 3 and reduces the tension of the cutting wire; when it moves down, it tightens the cutting wire 3 and increases the tension of the cutting wire.

[0067] The tension roller drive mechanism can be a single unit, driving the tension roller 5 to move up and down. Alternatively, there can be two sets of tension roller drive mechanisms, independently controlled by the processor, acting on both ends of the tension roller 5 respectively. That is, the processor can control one set of tension roller drive mechanisms to move one end of the tension roller 5 up and down; or it can control both sets of tension roller drive mechanisms to move both ends of the tension roller 5 up and down synchronously.

[0068] Accordingly, at least two sets of tension detection devices can be set, respectively at different positions on the tension roller 5, to detect the tension value of the cutting line at different positions. One implementation is to use two sets of tension detection devices, respectively set at both ends of the tension roller 5, to detect the tension of the cutting line at both ends of the tension roller 5.

[0069] The processor acquires the cutting line tension value detected by each tension detection device and compares the acquired cutting line tension value with the upper and lower tension limits. When it is determined that the cutting line tension value is greater than the upper tension limit, a control command is sent to the tension roller drive mechanism at the corresponding end to drive the corresponding end of the tension roller 5 to move upward. When it is determined that the cutting line tension value is less than the upper tension limit, a control command is sent to the tension roller drive mechanism at the corresponding end to drive the corresponding end of the tension roller 5 to move downward.

[0070] One implementation method is as follows: After acquiring the cutting line tension detected by the two sets of tension sensors, the processor first determines whether the difference between the cutting line tension detected by the two sets of tension sensors is within a preset range.

[0071] If the tension difference between the cutting lines at both ends of the tension roller is small within the preset range, then the two tension roller drive mechanisms are controlled to operate according to the two sets of tension sensors.

[0072] If the tension is outside the preset range, it indicates a large difference in the cutting line tension at both ends of the tension roller. To avoid thread breakage during the movement of the tension roller, first determine the cutting line tension that deviates more from the average tension (i.e., identify which end has a larger deviation from the average tension). Then, control the movement of the corresponding end of the tension roller based on this cutting line tension until the difference between the cutting line tensions detected by the two sets of tension sensors is within the preset range. This reduces the tension difference between the two ends of the tension roller and lowers the risk of thread breakage. The average tension is the average of the upper and lower tension limits.

[0073] Furthermore, during the process of controlling the tension roller 5 to move towards the two main rollers (i.e., moving upwards), the tension roller is first controlled to move towards the two main rollers at a first speed. During this movement, the current cutting line tension is continuously acquired. When the difference between the acquired cutting line tension and the upper limit of tension is within a first preset range, the tension roller is controlled to move towards the two main rollers at a second speed, which is less than the first speed. When the difference between the acquired cutting line tension and the upper limit of tension is within a second preset range, the tension roller is controlled to move towards the two main rollers at a third speed, which is less than the second speed.

[0074] Similarly, during the process of controlling the tension roller 5 to move away from the two main rollers (i.e., move downwards), the tension roller is first controlled to move away from the two main rollers at a first speed. During this movement, the current cutting line tension is continuously acquired. When the difference between the acquired cutting line tension and the lower tension limit is within a first preset range, the tension roller is controlled to move away from the two main rollers at a second speed, which is less than the first speed. When the difference between the acquired cutting line tension and the lower tension limit is within a second preset range, the tension roller is controlled to move away from the two main rollers at a third speed, which is less than the second speed.

[0075] This is equivalent to first rapidly moving the tension roller 5, and then gradually reducing the moving speed, following the same pattern as described above. This method allows the tension roller 5 to be quickly adjusted to the designated position, ensuring the cutting line tension meets requirements quickly, improving efficiency, and guaranteeing cutting quality.

[0076] The movement process of the tension roller 5 can be divided into three stages: first speed, second speed, and third speed. It can also be divided into two stages: first speed and second speed. Alternatively, it can be divided into four or more stages.

[0077] A simple example: Figure 9 This is a schematic diagram of the speed-controlled tension roller movement curve in the cutting control method provided in this application embodiment. (See attached diagram.) Figure 9 As shown, when the cutting wire tension is between F1 and F2, the tension roller 5 is controlled to move at a first speed V1; when the cutting wire tension is between F2 and F3, the tension roller 5 is controlled to move at a second speed V2; when the cutting wire tension is between F3 and F4, the tension roller 5 is controlled to move at a third speed V3.

[0078] One application scenario is:

[0079] At the beginning of the cutting process, the feed speed of silicon rod 4 is relatively low, the wire bow X is small, and the cutting wire tension is low. The tension of the wire mesh is monitored in real time by a detection device mounted on the tension roller 5. To ensure stable cutting tension, the tension roller 5 is driven to move downwards appropriately, stretching the cutting wire 3 and increasing its tension. Increased tension strengthens the constraint force of the groove 21 on the cutting wire 3, reducing the likelihood of wire skipping. Furthermore, the reaction force of the cutting wire 3 on the silicon rod 4 is more stable, resulting in more stable cutting of the silicon rod 4.

[0080] As the silicon rod 4 is further cut, its feed speed gradually increases, the wire bow X gradually increases, and the cutting wire tension gradually increases. The tension of the wire mesh is monitored in real time by a detection device mounted on the tension roller 5. To ensure stable cutting tension, the tension roller 5 is driven to move upwards appropriately, reducing the stretch on the cutting wire 3, lowering the tension of the cutting wire, and maintaining it in a stable state. This ensures that the constraint force of the groove 21 on the cutting wire remains stable, reducing the likelihood of wire skipping. Furthermore, the reaction force of the cutting wire 3 on the silicon rod 4 is relatively stable, making the removal of the silicon rod 4 more stable.

[0081] The silicon rod 4 continues to be cut, and its feed speed gradually decreases. At this point, the wire bow X gradually shrinks, and the tension of the wire mesh also gradually decreases. The tension of the wire mesh is monitored in real time by a detection device mounted on the tension roller 5. To ensure stable cutting tension, the tension roller 5 is driven downwards to stretch the cutting wire and appropriately increase its tension. With stable cutting wire tension, the constraint force of the main roller groove on the cutting wire remains stable, reducing the likelihood of wire skipping. Furthermore, the reaction force of the cutting wire 3 on the silicon rod 4 remains stable until the silicon rod 4 is completely cut through.

[0082] Figure 10 This diagram illustrates the effect of the cutting control method provided in this embodiment on the bow wire. Figure 10 As shown, compared with the traditional three-roll cutting scheme, this application adopts a scheme with adjustable tension roller 5, which makes the bow size of the cutting line more stable and eliminates drastic high and low points.

[0083] Figure 11This diagram illustrates the effect of the cutting control method provided in this embodiment on tension. Figure 11 As shown, compared with the traditional three-roll cutting scheme, this application adopts a scheme with adjustable tension roller 5, which makes the wire mesh tension of the cutting line more stable and without drastic fluctuations.

[0084] In this embodiment, a sensor is installed on the tension roller 5 during the silicon rod cutting process to detect the tension of the cutting wire mesh in real time. This allows for a clear understanding of how to adjust the size of the wire bow and drive the tension roller 5 to move accordingly, maintaining the cutting wire tension at a precise value. A stable tension value improves the stability of the cutting process, thereby enhancing the silicon wafer cutting accuracy.

[0085] In addition, this embodiment also provides an implementation method applicable to a slicer with two wire rollers. Specifically, Figure 12 This is a cross-sectional view of another side of the slicer provided in an embodiment of this application. Figure 13 Another top sectional view of the slicer provided in an embodiment of this application. (See attached image.) Figure 12 and Figure 13 As shown, the slicing machine provided in this embodiment uses two wire rollers, referred to as main rollers 2. The two main rollers 2 are parallel and side by side, and are arranged in a horizontal direction, with a gap reserved between them for the silicon rod 4 to pass through. The two ends of the main rollers 2 are supported by a front axle box 22 and a rear axle box 23, respectively, and the main rollers 2 are connected to the corresponding axle boxes by bearings.

[0086] A single cutting wire 3 is sequentially wound around two main rollers 2 to form a wire mesh. The slicer is also equipped with a tension roller drive mechanism, which is used to drive one or both main rollers 2 to move. When the direction of movement of the main roller 2 can stretch the cutting wire 3, the tension of the cutting wire 3 increases; when the direction of movement of the main roller 2 can relax the cutting wire 3, the tension of the cutting wire 3 decreases.

[0087] The slicer is also equipped with a tension detection device to detect the tension of the cutting line 3.

[0088] Figure 14 A flowchart illustrating another cutting control method provided in an embodiment of this application. (See attached flowchart.) Figure 14 As shown, based on the above-mentioned slicer, this embodiment provides a cutting control method, including:

[0089] Step 201: Obtain the cutting wire tension detected by the tension detection device.

[0090] In this embodiment, a force sensor is used as a tension detection device and is installed on the main roller 2.

[0091] Step 202: Control the movement of one main roller relative to the other main roller according to the tension of the cutting line.

[0092] The processor sends control commands to the tension roller drive mechanism based on the currently acquired cutting line tension, controlling the tension roller drive mechanism to move the main roller 2. When the cutting line tension is low, the main roller 2 is driven to move in the direction of stretching the cutting line 3 to increase the tension of the cutting line; when the cutting line tension is high, the main roller 2 is driven to move in the direction of relaxing the cutting line 3 to decrease the tension of the cutting line.

[0093] Specifically, when the two main rollers 2 are arranged in the horizontal direction, the main rollers 2 move in the horizontal direction, moving closer to the other main roller 2 to loosen the cutting line 3; and moving away from the other main roller 2 to tighten the cutting line 3.

[0094] During implementation, preset upper and lower tension limits are stored in memory and can be retrieved by the processor. After the processor acquires the cutting line tension, it compares the tension with the upper and lower limits respectively. When the detected cutting line tension is greater than the upper limit, it means the current cutting line tension is too high, so the two main rollers are brought closer together to relax the cutting line 3 and reduce the cutting line tension. When the detected cutting line tension is less than the lower limit, the two main rollers are moved away from each other to stretch the cutting line 3 and increase the cutting line tension.

[0095] The tension roller drive mechanism can be a single unit, driving the main roller 2 to move horizontally. Alternatively, there can be two sets of tension roller drive mechanisms, independently controlled by the processor, acting on both ends of the main roller 2 respectively. That is, the processor can control one set of tension roller drive mechanisms to move one end of the main roller 2 horizontally; or it can control both sets of tension roller drive mechanisms to move both ends of the main roller 2 horizontally synchronously.

[0096] Accordingly, at least two sets of tension detection devices can be set, respectively at different positions on the main roller 2, to detect the tension value of the cutting line at different positions. One implementation is to use two sets of tension detection devices, respectively set at both ends of the main roller 2, to detect the tension of the cutting line at both ends of the main roller 2.

[0097] The processor acquires the cutting line tension value detected by each tension detection device and compares the acquired cutting line tension value with the upper and lower tension limits. When it is determined that a cutting line tension value is greater than the upper tension limit, a control command is sent to the tension roller drive mechanism at the corresponding end to drive the corresponding end of the main roller 2 to move upward. When it is determined that a cutting line tension value is less than the upper tension limit, a control command is sent to the tension roller drive mechanism at the corresponding end to drive the corresponding end of the main roller 2 to move downward.

[0098] One implementation method is as follows: After acquiring the cutting line tension detected by the two sets of tension sensors, the processor first determines whether the difference between the cutting line tension detected by the two sets of tension sensors is within a preset range.

[0099] If it is within the preset range, it indicates that the tension difference between the cutting lines at both ends of the main roller 2 is small, and the two tension roller drive mechanisms are controlled to operate according to the two sets of tension sensors respectively.

[0100] If the tension is outside the preset range, it indicates a large difference in the cutting line tension between the two ends of the main roller 2. To avoid wire breakage during the movement of the main roller, the cutting line tension with the larger difference from the average tension can be determined first (i.e., confirming which end has a larger deviation from the average tension). Then, the corresponding end of the main roller 2 is moved according to this cutting line tension until the difference between the cutting line tensions detected by the two sets of tension sensors is within the preset range, thereby reducing the tension difference between the two ends of the main roller 2 and lowering the risk of wire breakage. The average tension is the average of the upper tension limit and the lower tension limit.

[0101] Furthermore, during the process of controlling the main roller 2 to move towards the other main roller, it is first controlled to move towards the other main roller at a first speed. During this movement, the current cutting line tension is continuously acquired. When the difference between the acquired cutting line tension and the upper limit of tension is within a first preset range, the main roller 2 is controlled to move towards the other main roller at a second speed, which is less than the first speed. When the difference between the acquired cutting line tension and the upper limit of tension is within a second preset range, the main roller 2 is controlled to move towards the other main roller at a third speed, which is less than the second speed.

[0102] Similarly, during the process of controlling the main roller 2 to move away from the other main roller, it is first controlled to move at a first speed in that direction. The current cutting line tension is continuously acquired during this movement. When the difference between the acquired cutting line tension and the lower tension limit falls within a first preset range, the main roller 2 is controlled to move at a second speed, which is less than the first speed. When the difference between the acquired cutting line tension and the lower tension limit falls within a second preset range, the main roller 2 is controlled to move at a third speed, which is less than the second speed.

[0103] This is equivalent to first rapidly moving the main roller 2, and then gradually reducing the moving speed, following the same pattern as described above. This method allows the main roller 2 to be quickly adjusted to the designated position, ensuring the cutting line tension meets requirements quickly, improving efficiency, and guaranteeing cutting quality.

[0104] The movement process of the main roller 2 described above can be divided into three stages: a first speed, a second speed, and a third speed. It can also be divided into two stages: a first speed and a second speed. Furthermore, it can be divided into four or more stages. The method for controlling the movement of the main roller 2 can also be referred to... Figure 9 And the above content.

[0105] One application scenario is:

[0106] At the beginning of the cutting process, the feed speed of silicon rod 4 is relatively low, the wire bow X is small, and the cutting wire tension is low. The tension of the wire mesh is monitored in real time by a detection device mounted on the main roller 2. To ensure stable cutting tension, the main roller 2 is driven slightly further away to stretch the cutting wire 3, increasing its tension. Increased tension strengthens the constraint force of the groove 21 on the cutting wire 3, reducing the likelihood of wire skipping. Furthermore, the reaction force of the cutting wire 3 on the silicon rod 4 is more stable, resulting in more stable cutting of the silicon rod 4.

[0107] As the silicon rod 4 is further cut, its feed speed gradually increases, the wire bow X gradually increases, and the cutting wire tension gradually increases. The tension of the wire mesh is monitored in real time by a detection device mounted on the main roller 2. To ensure stable cutting tension, the main rollers 2 are driven to move closer together, reducing the stretch on the cutting wire 3, lowering the tension of the cutting wire, and maintaining it in a stable state. This ensures that the constraint force of the groove 21 on the cutting wire remains stable, reducing the likelihood of wire skipping. Furthermore, the reaction force of the cutting wire 3 on the silicon rod 4 is relatively stable, resulting in more stable cutting of the silicon rod 4.

[0108] The silicon rod 4 continues to be cut, and its feed speed gradually decreases. At this point, the wire bow X gradually shrinks, and the tension of the wire mesh also gradually decreases. The tension of the wire mesh is monitored in real time by a detection device mounted on the main roller 2. To ensure stable cutting tension, the main roller 2 is driven downwards to stretch the cutting wire and appropriately increase its tension. With stable cutting wire tension, the constraint force of the main roller groove on the cutting wire remains stable, reducing the likelihood of wire skipping. Furthermore, the reaction force of the cutting wire 3 on the silicon rod 4 remains stable until the silicon rod 4 is completely cut through.

[0109] In this embodiment, a sensor is installed on the main roller 2 during the silicon rod cutting process to detect the tension of the cutting wire mesh in real time. This allows for a clear understanding of how to adjust the size of the wire bow and drive the main roller 2 to move accordingly, maintaining the cutting wire tension at a suitable value. Maintaining a stable tension value improves the stability of the cutting process and thus enhances the silicon wafer cutting accuracy.

[0110] This embodiment also provides a cutting control system, including a processor, a memory, and a computer program. The computer program is stored in the memory and configured to be executed by the processor to implement the cutting control method provided by any of the above-described components.

[0111] This embodiment also provides a slicer, such as Figure 6 and Figure 7As shown, the slicing machine includes: two parallel and side-by-side main rollers, a tension roller arranged in a triangle parallel to the two main rollers, a cutting wire wound on the two main rollers and the tension roller, a tension detection device for detecting the tension of the cutting wire, a tension roller drive mechanism for driving the tension roller to move; and the aforementioned cutting control system.

[0112] This embodiment also provides a slicer, such as Figure 12 and Figure 13 As shown, the slicing machine includes: two parallel and side-by-side main rollers, a cutting wire wound around the two main rollers, a tension detection device for detecting the tension of the cutting wire, a tension roller drive mechanism for driving the main rollers to move; and the aforementioned cutting control system.

[0113] The cutting control system and slicer provided in this embodiment have the same technical effects as the methods described above.

[0114] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code. The solutions in the embodiments of this application can be implemented in various computer languages, such as the object-oriented programming language Java and the interpreted scripting language JavaScript.

[0115] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0116] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1The function specified in one or more boxes.

[0117] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0118] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0119] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0120] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0121] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0122] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A cutting control method applied to a slicer; characterized in that, The slicing machine includes at least two parallel wire rollers, with a cutting wire wound between each wire roller; each wire roller includes two main rollers and a tension roller, with a cutting gap reserved between the two main rollers for a hard and brittle material rod to pass through, and the hard and brittle material rod is cut by the cutting wire when passing through the cutting gap; the slicing machine also includes a tension detection device for detecting the tension of the cutting wire; the method includes: Acquire the cutting wire tension detected by the tension detection device; The movement of at least one wire roller relative to the other wire rollers is controlled according to the cutting wire tension, specifically: the tension roller is controlled to move relative to the two main rollers according to the cutting wire tension to adjust the tension of the cutting wire; The slicer includes two sets of tension roller drive mechanisms, which act on both ends of the tension rollers respectively; The tension detection device is provided in two sets, which are used to detect the cutting line tension at both ends of the tension roller respectively; obtaining the cutting line tension detected by the tension detection device includes: obtaining the cutting line tension detected by the two sets of tension detection devices respectively; After acquiring the cutting line tension detected by the two sets of tension detection devices, the process also includes: Determine whether the difference between the cutting wire tension detected by the two sets of tension detection devices is within the preset range; If it is within the preset range, the two tension roller drive mechanisms are controlled to operate according to the cutting line tension detected by the two sets of tension detection devices. If it is not within the preset range, first determine the cutting line tension that has a larger difference from the average tension, and then control the corresponding end of the tension roller to move according to the cutting line tension until the difference between the cutting line tensions detected by the two sets of tension detection devices is within the preset range; the average tension is the average of the upper tension value and the lower tension value.

2. The method according to claim 1, characterized in that, The tension roller is moved relative to the two main rollers according to the cutting line tension, specifically as follows: The tension roller is moved relative to the two main rollers according to the tension of the cutting line, and the range of movement of the tension roller is in a plane perpendicular to the axis of the tension roller.

3. The method according to claim 2, characterized in that, Controlling the movement of the tension roller relative to the two main rollers based on the cutting line tension includes: When the tension of the cutting line is greater than the upper limit of the tension, the tension roller is controlled to move toward the two main rollers; When the tension of the cutting line is less than the lower limit of the tension, the tension roller is controlled to move away from the two main rollers.

4. The method according to claim 2, characterized in that, There is one tension roller, which is arranged in a triangle with the two main rollers; the tension roller is located on the vertical line connecting the centers of the two main rollers; the tension roller moves along the vertical line toward the two main rollers or away from the two main rollers.

5. The method according to claim 3, characterized in that, Controlling the tension roller to move toward the two main rollers includes: The tension roller is controlled to move toward the direction close to the two main rollers at a first speed; When the difference between the obtained cutting line tension and the upper limit of tension is within a first preset range, the tension roller is controlled to move towards the two main rollers at a second speed; the second speed is less than the first speed. When the difference between the obtained cutting line tension and the upper limit of tension is within the second preset range, the tension roller is controlled to move toward the two main rollers at a third speed; the third speed is less than the second speed.

6. The method according to claim 3, characterized in that, Controlling the tension roller to move away from the two main rollers includes: The tension roller is controlled to move at a first speed in a direction away from the two main rollers; When the difference between the obtained cutting line tension and the lower limit of tension is within a first preset range, the tension roller is controlled to move away from the two main rollers at a second speed; the second speed is less than the first speed. When the difference between the obtained cutting line tension and the lower limit of tension is within the second preset range, the tension roller is controlled to move away from the two main rollers at a third speed; the third speed is less than the second speed.

7. A cutting control system, characterized in that, include: Processor, memory, and computer programs; The computer program is stored in the memory and configured to be executed by the processor to implement the method as described in any one of claims 1-6.

8. A slicer, characterized in that, include: At least two parallel and side-by-side wire rollers; Cutting lines wound around each of the wire rollers; Tension detection device used to detect the tension of cutting wire; Tension roller drive mechanism for driving the movement of wire rollers; as well as, The cutting control system as described in claim 7.

9. The slicer according to claim 8, characterized in that, The roller includes two main rollers and a tension roller arranged in a triangle with the two main rollers; the tension roller drive mechanism is used to drive the tension roller to move relative to the two main rollers.

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