Optical module

Abstract

The application discloses an optical module, comprising a shell, a heat sink and a PCB plate arranged in the shell, and a plurality of lasers arranged on the heat sink, one end of the optical module having an optical interface and the other end having an electrical interface, the PCB plate being configured as a hard plate, a vertical projection of the PCB plate on the shell at least partially overlapping a vertical projection of the heat sink on the shell, and the PCB plate being fixedly connected with the heat sink, the plurality of lasers being arranged adjacent to the PCB plate and electrically connected with the PCB plate, and a vertical projection of the plurality of lasers on the heat sink not overlapping a vertical projection of the PCB plate on the heat sink. The optical module of the application adopts a whole PCB hard plate, and provides better high-speed electrical signal transmission performance.

Description

[0001] This application is a divisional application of the Chinese invention patent application filed by the applicant on July 19, 2017, entitled "Optical Module", with application number 2017105907964. Technical Field

[0002] This invention relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0003] With societal development, the volume of data is increasing exponentially. This has led to demands for faster transmission rates and lower costs for optical communication modules. Existing 3G technology can no longer meet the complex needs of users and the market, prompting the emergence of TD-LTE (Time Division-Long Term Evolution, the long-term evolution of TD-SCDMA) as a technology to bridge the gap between 3G and 4G. Due to the current scarcity of fiber optic resources, high costs of new deployments, and the long distances between base stations, the demand for small pluggable (SFP+) packaged optical modules is gradually increasing.

[0004] Typically, in an optical module structure, electrical signals enter the PCBA from the gold fingers and are then output to the optoelectronic chip. The optoelectronic chip converts the electrical signals into optical signals, which are then output to the optical port via the optical system. Both the optical port and the electrical interface (gold fingers) are fixed relative to the module housing. Generally speaking, the PCBA is rigid, the optical system is also rigid, and all components have certain dimensional tolerances.

[0005] Currently, most optical module packaging technologies use flexible printed circuit boards (FPCs) to absorb assembly tolerances. However, the solder joints between the FPCs and PCBAs introduce significant electrical signal attenuation, limiting their application to transmission rates below 10G.

[0006] Higher transmission rates and longer distances require optical module designs with lower attenuation of high-speed electrical signals. Simultaneously, assembly requirements must be met, necessitating the integration of the gold fingers, PCBA, optoelectronic chip, free-space optical path components, and optical port. Achieving optimal optoelectronic signal conversion and transmission through integrated design has become a pressing issue. Summary of the Invention

[0007] The purpose of this invention is to provide an optical module that can achieve better high-speed signal transmission.

[0008] To achieve the above-mentioned objectives, the present invention provides an optical module, comprising:

[0009] The optical module includes a housing, a heat sink and a PCB board disposed within the housing, and multiple lasers disposed on the heat sink. One end of the optical module has an optical interface, and the other end has an electrical interface.

[0010] The PCB board is constructed as a rigid board, and the vertical projection of the PCB board on the housing at least partially overlaps with the vertical projection of the heat sink on the housing, and the PCB board is fixedly connected to the heat sink.

[0011] The plurality of lasers are disposed near the PCB board and electrically connected to the PCB board, and the vertical projection of the plurality of lasers on the heat sink does not overlap with the vertical projection of the PCB board on the heat sink.

[0012] As a further improvement of one embodiment of the present invention, the drivers of the plurality of lasers are packaged on the PCB board, and the plurality of lasers are electrically connected to the PCB board via gold wires.

[0013] As a further improvement of one embodiment of the present invention, no flexible circuit board is soldered between the plurality of lasers and the PCB board.

[0014] As a further improvement of one embodiment of the present invention, the drivers of the plurality of lasers are packaged on the heat sink, and the vertical projection of the driver on the heat sink does not overlap with the vertical projection of the PCB board on the heat sink; the plurality of lasers are electrically connected to the driver via gold wires, and the driver is electrically connected to the PCB board via gold wires.

[0015] As a further improvement of one embodiment of the present invention, the driver is disposed adjacent to the PCB board.

[0016] As a further improvement of one embodiment of the present invention, along the main extension direction of the housing, the end of the PCB board away from the optical interface is configured as the electrical interface.

[0017] As a further improvement of one embodiment of the present invention, the PCB board is provided with a gold finger for external insertion at the end opposite to the optical interface.

[0018] As a further improvement of one embodiment of the present invention, the optical module further includes an optical system and an optical receiver disposed within the housing. At least a portion of the optical system is disposed on the heat sink and adjacent to the optical interface. The optical system is disposed between the plurality of lasers and the optical interface to guide the light emitted by the plurality of lasers to the optical interface and / or to guide the received light to the optical receiver.

[0019] As a further improvement of one embodiment of the present invention, the optical receiver includes any one of a PD chip, a PIN chip, or an APD chip.

[0020] As a further improvement of one embodiment of the present invention, the optical interface includes a transmitting optical interface and a receiving optical interface, wherein the transmitting optical interface is used to transmit optical signals and the receiving optical interface is used to receive optical signals.

[0021] The transmitting optical interface is optically coupled to the plurality of lasers;

[0022] The receiving optical interface transmits the received optical signal to the optical receiver via the optical system, and the optical receiver converts the optical signal into an electrical signal.

[0023] As a further improvement of one embodiment of the present invention, the optical system includes a transmitting optical path and a receiving optical path, the transmitting optical path includes a wavelength division multiplexer, and the receiving optical path includes a wavelength division multiplexer and a reflecting prism.

[0024] The optical signals emitted by the plurality of lasers are transmitted to the transmitting optical interface via the wavelength division multiplexer;

[0025] The optical signal received from the optical interface of the receiving end is transmitted to the optical receiver via the wavelength division multiplexer and the reflecting prism.

[0026] As a further improvement of one embodiment of the present invention, the emitting optical path further includes a lens assembly, which is used to process the light emitted by the plurality of lasers to adjust the propagation direction of the light emitted from the plurality of lasers.

[0027] As a further improvement of one embodiment of the present invention, the transmitting optical interface and the receiving optical interface are either separately configured or integrated.

[0028] As a further improvement of one embodiment of the present invention, the optical module further includes an assembly tolerance absorption component, which is disposed between the optical system and the optical interface, or the assembly tolerance absorption component is disposed between the plurality of lasers and the optical system;

[0029] The assembly tolerance absorption component includes an optical element, which includes any one of a lens, a flat glass plate, or a mirror.

[0030] The optical elements include transmitting optical elements and receiving optical elements.

[0031] As a further improvement of one embodiment of the present invention, the optical module further includes an assembly tolerance absorption component, which is disposed between the optical system and the optical interface;

[0032] The assembly tolerance absorption component includes an adapter and at least one optical fiber connecting the adapter and the optical interface.

[0033] As a further improvement of one embodiment of the present invention, the adapter is fixed relative to the heat sink.

[0034] As a further improvement of one embodiment of the present invention, the adapter includes a transmitting adapter corresponding to the plurality of lasers and a receiving adapter corresponding to the optical receiver;

[0035] The at least one optical fiber includes a first optical fiber and a second optical fiber, wherein the first optical fiber is connected between the transmitting adapter and the corresponding optical interface, and the second optical fiber is connected between the receiving adapter and the corresponding optical interface.

[0036] As a further improvement of one embodiment of the present invention, the heat sink includes a first heat sink and a second heat sink, the optical system is disposed on the first heat sink, and the plurality of lasers are disposed on the second heat sink.

[0037] As a further improvement of one embodiment of the present invention, the first heat sink, the second heat sink, the PCB board, and the optical interface are all fixed relative to the housing;

[0038] The optical system is fixed relative to the first heat sink;

[0039] The plurality of lasers are fixed relative to the second heat sink.

[0040] As a further improvement of one embodiment of the present invention, the optical module further includes an assembly tolerance absorption component, which is disposed between the optical system and the plurality of lasers, or the assembly tolerance absorption component is disposed between the optical system and the optical receiver;

[0041] The assembly tolerance absorption component includes at least one optical fiber.

[0042] As a further improvement of one embodiment of the present invention, the at least one optical fiber includes at least one transmitting optical fiber and / or at least one receiving optical fiber.

[0043] As a further improvement of one embodiment of the present invention, both the first heat sink and the second heat sink are provided with optical fiber fixing elements, and the two ends of each optical fiber are fixed by the optical fiber fixing elements.

[0044] As a further improvement of one embodiment of the present invention, the number of at least one optical fiber is matched with the number of the corresponding optical interfaces or the number of the corresponding plurality of lasers.

[0045] As a further improvement of one embodiment of the present invention, the heat sink and the shell are integrally formed.

[0046] This invention provides an optical module, comprising:

[0047] The optical module includes a housing, a heat sink and a PCB board disposed within the housing, and an optical interface at one end and an electrical interface at the other end.

[0048] The PCB board is constructed as a rigid board, and the vertical projection of the PCB board on the housing at least partially overlaps with the vertical projection of the heat sink on the housing, and the PCB board is fixedly connected to the heat sink.

[0049] An optical component is integrated on the PCB board or detachably disposed on the PCB board or integrated on the heat sink. The optical component is electrically connected to the PCB board and thermally connected to the heat sink.

[0050] As a further improvement of one embodiment of the present invention, the optical component includes multiple lasers, a receiver, and an optical system.

[0051] As a further improvement of one embodiment of the present invention, the optical component includes a transceiver chip that integrates optical receiving and optical transmitting.

[0052] As a further improvement of one embodiment of the present invention, the housing is provided with a receiving space, and the optical module further includes an assembly tolerance absorption component connected to the housing. The assembly tolerance absorption component is constructed as an adapter, the adapter is separately disposed from the housing, and at least a portion of the adapter is received within the receiving space.

[0053] The optical component has an optical interface that mates with the adapter.

[0054] As a further improvement of one embodiment of the present invention, the optical interface includes an optical transmitting interface and an optical receiving interface, wherein the optical transmitting interface is used to transmit optical signals and the optical receiving interface is used to receive optical signals.

[0055] As a further improvement of one embodiment of the present invention, the adapter is connected to the housing along a plugging direction parallel to the optical interface, and there is an adjustment gap between the adapter and the housing along a direction perpendicular to the plugging direction.

[0056] As a further improvement of one embodiment of the present invention, the heat sink and the shell are integrally formed.

[0057] As a further improvement of one embodiment of the present invention, along the main extension direction of the housing, the end of the PCB board away from the optical interface is configured as the electrical interface.

[0058] As a further improvement of one embodiment of the present invention, the PCB board is provided with a gold finger for external insertion at the end opposite to the optical interface.

[0059] As a further improvement of one embodiment of the present invention, the plurality of lasers are electrically connected to the PCB board via gold wires.

[0060] Compared with the prior art, the beneficial effects of the present invention are as follows: In the above embodiments, the optical module adopts a single piece of rigid PCB board, providing better high-speed electrical signal transmission performance. The single PCB board has no solder joints, the signal from the gold fingers to the driver to the laser is optimized, it is compatible with free space optical transmission, and meets the module assembly requirements. Moreover, the optical module is based on a heat sink, and most or all components are fixed together with the heat sink, resulting in small assembly tolerances and good heat dissipation. Attached Figure Description

[0061] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other implementation methods can be obtained based on these drawings without creative effort.

[0062] Figure 1 This is a perspective view of the optical module in the preferred first embodiment of the present invention;

[0063] Figure 2 yes Figure 1 Top view of the optical module;

[0064] Figure 3 yes Figure 2 Cross-sectional view of the optical module along line AA;

[0065] Figure 4 yes Figure 1 3D exploded view of the optical module;

[0066] Figure 5 This is a perspective view of the optical module in the preferred second embodiment of the present invention;

[0067] Figure 6 yes Figure 5 Top view of the optical module;

[0068] Figure 7 This is a perspective view of the optical module in the preferred third embodiment of the present invention;

[0069] Figure 8 yes Figure 7 3D exploded view of the optical module;

[0070] Figure 9This is a front view of the optical module in a preferred fourth embodiment of the present invention;

[0071] Figure 10 yes Figure 9 Top view of the optical module;

[0072] Figure 11 yes Figure 10 An enlarged view of part a of the optical module;

[0073] Figure 12 This is a three-dimensional schematic diagram of the optical module in the preferred fifth embodiment of the present invention;

[0074] Figure 13 yes Figure 12 3D exploded view of the optical module;

[0075] Figure 14 yes Figure 12 Front view of the optical module;

[0076] Figure 15 yes Figure 14 A cross-sectional view along line BB. Detailed Implementation

[0077] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings.

[0078] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0079] The present invention will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the scope of protection of the present invention.

[0080] like Figures 1 to 4As shown, in one embodiment of the present invention, the optical module 100 includes a housing 10 (only the lower housing is shown here), a heat sink 20 disposed within the housing 10, a laser 31 disposed on the heat sink 20, and a PCB board 40 partially disposed on the heat sink 20. The optical module 100 has an optical interface at one end and an electrical interface at the other end. The optical interface includes a transmitting optical interface 51 and a receiving optical interface 52. The PCB board 40 is constructed as a rigid board. One end of the PCB board 40 is fixed to the heat sink 20 and electrically connected to the laser 31. The other end of the PCB board 40 serves as the electrical interface 43 of the optical module. Here, the other end of the PCB board 40 is provided with gold fingers, which serve as the electrical interface of the optical module.

[0081] The optical module 100 also includes an optical system 60 disposed within the housing, located between the laser 31 and the optical interface. Preferably, the optical system 60 is at least partially disposed on the heat sink 20; that is, the optical system 60 can be partially or entirely disposed on the heat sink 20. The heat sink 20 and the housing can be constructed as an integral structure. The driver 35 of the laser 31 is packaged on the PCB board 40. The laser 31 can be directly packaged on the heat sink 20 or packaged on a pad of the heat sink 20. High-speed electrical signals are output from the driver 35 to the PCB board 40, and then output to the laser 31 through a very short distance via a gold wire connection. The optical system 60 guides the light emitted by the laser 31 to the optical interface. In other words, the laser 31 acts as a light emitter and is optically coupled to the emitter optical interface 51. The optical signal received by the receiver optical interface 52 is transmitted to the optical receiver via the optical system 60, and the optical receiver converts the received optical signal into an electrical signal. That is, the optical receiver is optically coupled to the receiver optical interface 52 and electrically connected to the PCB board. Throughout the high-speed link, there are no soldered flexible circuit boards, reducing signal loss caused by solder joints. The laser 31 is close enough to the PCB board 40 to ensure optimal electrical performance. Moreover, with the heat sink 20 as the reference, all components are fixed together with the heat sink 20, resulting in small assembly tolerances and heat dissipation through the heat sink 20, ensuring reliable performance and good heat dissipation.

[0082] Specifically, the optical system 60 is located on one side of the laser 31. The optical system 60 includes a lens assembly and a wavelength division multiplexer. The lens assembly includes at least one lens, which can process the light emitted by the laser 31, such as focusing or collimating, thereby adjusting the propagation direction of the emitted light from the laser 31. The wavelength division multiplexer can combine multiple separated beams into one beam, so that the light signal emitted by the laser 31 can be guided to the transmitting optical interface 51 by the lens assembly and the wavelength division multiplexer. The PCB board 40 is horizontally arranged inside the housing 10 of the optical module 100. The optical receiver can be directly encapsulated on the heat sink 20 or on the pad of the heat sink. The laser 31 includes a VCSEL (vertical cavity surface emission laser) chip, and the optical receiver includes a PD (photodiode) chip. The light from the receiving optical interface 52 passes through the wavelength division multiplexer and the reflecting prism 32 before reaching the PD chip 32. The VCSEL chip is directly soldered onto the heat sink 20 and electrically connected to the PCB board 40 via gold wires, and then electrically connected to the driver 35 packaged on the PCB board 40. The PD chip 32 is also directly soldered onto the heat sink 20. Of course, the laser 31 can also be other types of laser chips, and similarly, the optical receiver can also be a PIN chip, ADP chip, or other detector chip. In addition, the optical interface can be constructed as a single interface, and the transmitting and receiving optical interfaces can be configured as one or a combined interface. That is to say, the optical module includes transceiver optical interfaces, which can be a transmitting optical interface and / or a receiving optical interface, or an integrated transceiver optical interface.

[0083] Furthermore, in this embodiment, the optical interface is fixed relative to the housing 10, and the heat sink 20 is also fixed relative to the housing 10. To absorb the assembly tolerance between the optical interface and its corresponding laser and / or optical receiver (here, a photodetector), the optical module 100 also includes an assembly tolerance absorption component. This component ensures that the light emitted by the laser can be received by external components connected to the optical module 100, and that the light emitted by the external components connected to the optical module 100 can be effectively transmitted to the optical receiver. In other words, the assembly tolerance absorption component can guide the light emitted by the laser 31 through the optical system 60 to the center position of the optical interface or to the external connector connected to the optical module, or it can guide the light emitted by the laser 31 to the optical system 60. The center position of the optical interface is approximately near the center; it is the position where the external connector receives and emits optical signals after mating with the optical module 100. External connectors include fiber optic plugs, switch interfaces, etc.

[0084] Specifically, the assembly tolerance absorption component is located at the optical interface. This component includes optical elements positioned between the optical system 60 and the optical interface to achieve optical path docking between them. The optical elements include a transmitting optical element 71 and a receiving optical element 72. These elements can be lenses, flat glass, or mirrors—components capable of transmitting light and altering its propagation direction. By adjusting the optical path using these elements, the light entering the transmitting optical interface 51 is positioned at the center of the interface, and the light entering the optical module 100 from the receiving optical interface 52 reaches the optical receiver effectively. Alternatively, the optical elements can be positioned between the optical system 60 and the laser 31 to achieve optical path docking between them.

[0085] This embodiment also discloses an assembly method for the optical module 100, which includes the following steps: encapsulating the optical system 60, the laser 31, and the PD chip of the optical receiver on the heat sink 20; fixing one end of the PCB board 40 on the heat sink 20; fixing the heat sink 20 inside the housing 10; setting an optical element 71 between the optical system 60 and the optical interface, and adjusting the optical element 71 so that the optical path center of the optical interface corresponds to the optical path of the laser 31 and the PD chip 32 of the optical receiver.

[0086] refer to Figures 5 to 6 As shown, this is a second embodiment of the present invention. In this embodiment, the optical module 200 also includes a housing 210, a heat sink 221 / 222 disposed within the housing, a laser 231 disposed on the heat sink, and a PCB board 240 partially disposed on the heat sink. One end of the optical module 200 has an optical interface, and the other end has an electrical interface. The optical interface includes a transmitting optical interface 251 and a receiving optical interface 252. The PCB board 240 is constructed as a rigid board. One end of the PCB board 240 is fixed to the heat sink and electrically connected to the laser 231. The other end of the PCB board 240 is constructed as the electrical interface 243 of the optical module, and it is provided with gold fingers for plug-in connection with external components.

[0087] In this embodiment, the heat sink includes a first heat sink 221 and a second heat sink 222. The optical system 260 of the optical module is disposed on the first heat sink 221, and the laser 231 and the PD chip 232 of the optical receiver are packaged on the second heat sink 222. The driver 235 of the laser 231 is packaged on the PCB board 240. In this embodiment, the optical interface is fixed relative to the housing 210, and the first heat sink 221 and the second heat sink 222 are also fixed relative to the housing 210. In order to absorb the assembly tolerance between the optical interface and its corresponding laser and / or optical receiver, the assembly tolerance absorption component of the optical module 200 is disposed between the optical system 260 and the laser 231 / PD chip 232 of the optical receiver. Specifically, the assembly tolerance absorption component includes at least one transmitting optical fiber 271 and at least one receiving optical fiber 272. Both the first heat sink 221 and the second heat sink 222 are provided with optical fiber fixing elements, which fix both ends of the optical fiber. Optical paths are connected via optical fibers, guiding the light emitted by laser 231 to the optical system 260, or guiding the light received by the optical system 260 to the optical receiver. Because optical fibers are flexible and deformable, tolerances can be absorbed using them. In this embodiment, the number of optical fibers is related to the structure of the optical module and the transmission rate. For example, if the optical interface of the optical module is set to a single optical interface, then only one optical fiber is needed; when a higher transmission rate is required, the optical module can be configured with multiple lasers, and the number of optical fibers is consistent with the number of lasers. By using flexible and deformable optical fibers to absorb tolerances, the optical path center of the optical interface corresponds to the optical paths of the laser 231 at the optical transmitter and the PD chip 232 at the optical receiver.

[0088] This embodiment also discloses an assembly method for the optical module 200, which includes the following steps: encapsulating the optical system 260 on the first heat sink 221; encapsulating the laser 231 and the PD chip 232 of the optical receiver on the second heat sink 222; fixing one end of the PCB board 240 on the second heat sink 222; fixing both the first heat sink 221 and the second heat sink 222 inside the housing 210; and connecting an optical fiber between the optical system 260 and the laser 231 and / or the PD chip 232 of the optical receiver.

[0089] refer to Figures 7 to 8As shown, this is the third embodiment of the present invention. In this embodiment, the optical module 300 also includes a housing 310, a heat sink 320 disposed within the housing 310, a laser 331 disposed on the heat sink 320, and a PCB board 340 partially disposed on the heat sink. One end of the optical module 330 has an optical interface, and the other end has an electrical interface. The optical interface includes a transmitting optical interface 351 and a receiving optical interface 352. The PCB board 340 is constructed as a rigid board. One end of the PCB board 340 is fixed to the heat sink 320 and electrically connected to the laser 331. The other end of the PCB board 340 is constructed as the electrical interface 343 of the optical module.

[0090] The optical system 360 of the optical module is mounted on the heat sink 320. The driver 335 of the laser 331 is packaged on the PCB board 340, and the laser 331 is packaged on the heat sink 320. The PD chip of the optical receiver is also packaged on the heat sink 320. The optical system 360 includes a transmitting optical path and a receiving optical path. The transmitting optical path includes a wavelength division multiplexer, and the receiving optical path includes a wavelength division multiplexer and a reflector. In this embodiment, the optical interface is fixed relative to the housing 310, and the heat sink 320 is also fixed relative to the housing 310. In order to absorb the assembly tolerance between the optical interface and its corresponding transmitter and receiver, the assembly tolerance absorption component of the optical module is disposed between the optical system 360 and the optical interface. Specifically, the assembly tolerance absorption component includes an adapter 370 and at least one optical fiber connecting the adapter 370 and the optical interface. The adapter 370 is fixed on the heat sink 320, and the adapter 370 includes a transmitting adapter corresponding to the optical transmitter and a receiving adapter corresponding to the optical receiver. Therefore, two optical fibers are used: a first optical fiber 371 connecting the transmitting optical interface 351 and the transmitting adapter, and a second optical fiber 372 connecting the receiving optical interface 352 and the receiving adapter. Using optical fibers for optical path connection simplifies the structure, and if only one optical interface is used, only one optical fiber is needed, resulting in low cost.

[0091] This embodiment also discloses the assembly method of the above-mentioned optical module, which includes the following steps: encapsulating the optical system 360, the laser 331 and the PD chip of the optical receiver on the heat sink 320; fixing the adapter 370 on the heat sink 320; fixing one end of the PCB board 340 on the heat sink 320; fixing the heat sink 320 inside the housing 310; connecting the optical fiber between the adapter 370 and the optical interface, and aligning the optical path center of the optical interface with the optical paths of the transmitter and receiver through the optical fiber.

[0092] refer to Figures 9 to 11As shown, this is the fourth embodiment of the present invention. In this embodiment, the optical module 400 also includes a housing 410, a heat sink 420 disposed within the housing 410, a laser 431 disposed on the heat sink 420, and a PCB board 440 partially disposed on the heat sink. One end of the optical module has an optical interface, and the other end has an electrical interface. The optical interface includes a transmitter optical interface 451 and a receiver optical interface 452. The PCB board 440 is constructed as a rigid board. One end of the PCB board 440 is fixed to the heat sink 420 and electrically connected to the laser 431. The other end of the PCB board 440 is constructed as the electrical interface 443 of the optical module. The optical system 460 of the optical module is disposed on the heat sink 420. The laser 431 and its driver 435 are both encapsulated on the heat sink 420, and the PD chip of the optical receiver is also encapsulated on the heat sink 420. The difference between this embodiment and the first embodiment is that the driver 435 of the laser 431 is also mounted on the heat sink 420 and connected to the laser 431 via gold wire. The driver 435 is also located at the edge of the PCB board 440 and is similarly connected to the PCB board 440 via gold wire. The arrangement of other components is largely the same as in the first embodiment and will not be described further here.

[0093] refer to Figures 12 to 15 This is the fifth embodiment of the present invention. In this embodiment, the optical module 500 includes a housing 510 and a PCB board 540 disposed within the housing. The housing 510 has a receiving space, and the PCB board 540 is disposed within the receiving space. The PCB board 540 can be snapped onto the housing 510. Of course, the PCB board 540 can be fixed to the housing 510 with screws, or it can be fixed to a heat sink at one end as in the previous embodiments, and then fixed relative to the housing by the heat sink, or other connection methods can be used. The PCB board 540 can be entirely housed within the receiving space, or it can be partially housed within the receiving space. One end of the optical module is provided with an optical interface, and the other end is provided with an electrical interface. The end of the PCB board 540 away from the optical interface is configured as the electrical interface 543 of the optical module.

[0094] In addition, the optical module 500 also includes an assembly tolerance absorption component connected to the housing. In this embodiment, the assembly tolerance component is configured as an adapter 570. The adapter 570 is separately disposed from the housing 510, and the adapter 570 is at least partially housed within the housing space. The optical module also includes an optical component 560 disposed on the PCB board. The optical component 560 has optical interfaces 551 and 552 that mate with the adapter 570. The gap S between the adapter 570 and the housing 10 is adjustable. The optical component 560 can be integrally integrated onto a PCB board, detachably disposed on the PCB board, or integrally integrated onto a heat sink, i.e., the optical system, optical interfaces, and circuit board are all fixed together with the heat sink. The optical component 560 is electrically connected to the PCB board.

[0095] In this embodiment, the adapter 570 and the housing 510 are separately configured, and the gap 22 between the adapter 570 and the housing 510 is adjustable. This avoids the problem of misalignment between the optical path center of the adapter 570 and the optical component 560 due to the manufacturing tolerances of the adapter 570 and / or the housing 510. The manufacturing tolerances of the adapter 570 and / or the housing 510 are converted into the positional tolerances of the adapter 570, so that the adapter 570 can move relative to the housing 510 according to the position of the optical component 560. This makes it very easy to plug and unplug the optical component 560 and the adapter 570 of the optical module 500 and to assemble them.

[0096] When the optical component 560 is plugged into the adapter 570, the connection between the optical component 560 and the adapter 570 can be manually controlled. Alternatively, a positioning fixture can be used to position the optical component 560 and the adapter 570 together.

[0097] Furthermore, the optical component 560 is configured to include an optical receiver, an optical transmitter, and an optical system. Of course, the optical component 560 can also be configured as a transceiver chip that integrates optical receiving and optical transmitting.

[0098] In this embodiment, the optical component 560 has two optical interfaces: one interface 551 is a light transmitting interface, and the other interface 552 is a light receiving interface. Of course, both interfaces can also be configured as either light transmitting interfaces or light receiving interfaces.

[0099] The end face of the adapter 570, parallel to the insertion direction of the optical interfaces 551 and 552, has an adjustable gap S in all directions (up, down, left, and right) with the housing 510. Thus, when the adapter 570 is assembled, it can move in multiple directions (up, down, left, and right) according to the position of the optical component 560.

[0100] In this embodiment, the adapter 570 and the housing 510 are fixed together by adhesive dispensing. Of course, other methods can also be used for fixing, such as fixing the adapter 570 and the housing 510 together by thread.

[0101] This embodiment also discloses an assembly method for the aforementioned optical module, which includes the following steps: assembling the optical component 560 and the PCB board into the housing 510; mating the adapter 570 with the optical interfaces 551 and 552 of the optical component 560; and fixing the adapter 570 to the housing 510. When fixing the adapter 570 to the housing 510, it is preferable to use an adhesive dispensing method. Of course, other methods can also be used, such as threaded fixing between the adapter 570 and the housing 510. When using a threaded fixing method, a shim (not shown) of appropriate thickness can be inserted into the gap S between the adapter 570 and the housing 510 as needed.

[0102] In other embodiments, the optical component has only one interface, and correspondingly, the adapter also has only one interface with the optical component; that is, the interface is a combined optical transceiver interface. Of course, the interface can also be configured as either a single optical transmitter interface or a single optical receiver interface.

[0103] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0104] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. An optical module, characterized in that, include: The optical module includes a housing, a heat sink and a PCB board disposed within the housing, and multiple lasers disposed on the heat sink. One end of the optical module has an optical interface, and the other end has an electrical interface. The PCB board is constructed as a rigid board, and the vertical projection of the PCB board on the housing at least partially overlaps with the vertical projection of the heat sink on the housing. The PCB board and the heat sink are fixedly connected, and the heat sink is fixed to one side of the PCB board. The plurality of lasers are positioned close to the PCB board and electrically connected to the PCB board via gold wires, and the vertical projections of the plurality of lasers on the heat sink do not overlap with the vertical projections of the PCB board on the heat sink.

2. The optical module as described in claim 1, characterized in that, The drivers for the multiple lasers are packaged on the PCB board.

3. The optical module as described in claim 1, characterized in that, There is no flexible solder joint between the multiple lasers and the PCB board.

4. The optical module as described in claim 1, characterized in that, The drivers of the plurality of lasers are encapsulated on the heat sink, and the vertical projection of the drivers on the heat sink does not overlap with the vertical projection of the PCB board on the heat sink; The plurality of lasers are electrically connected to the driver via gold wires, and the driver is electrically connected to the PCB board via gold wires.

5. The optical module as described in claim 4, characterized in that, The driver is positioned adjacent to the PCB board.

6. The optical module as described in claim 1, characterized in that, Along the main extension direction of the housing, the end of the PCB board away from the optical interface is configured as the electrical interface.

7. The optical module as described in claim 6, characterized in that, The PCB board has a gold finger for external connection at the end opposite to the optical interface.

8. The optical module as described in claim 2 or 4, characterized in that, The optical module also includes an optical system and an optical receiver disposed within the housing, wherein at least a portion of the optical system is disposed on the heat sink and adjacent to the optical interface; The optical system is disposed between the plurality of lasers and the optical interface to guide the light emitted by the plurality of lasers to the optical interface and / or to guide the received light to the optical receiver.

9. The optical module as described in claim 8, characterized in that, The optical receiver includes any one of a PD chip, a PIN chip, or an APD chip.

10. The optical module as described in claim 8, characterized in that, The optical interface includes a transmitter optical interface and a receiver optical interface, wherein the transmitter optical interface is used to transmit optical signals and the receiver optical interface is used to receive optical signals. The transmitting optical interface is optically coupled to the plurality of lasers; The receiving optical interface transmits the received optical signal to the optical receiver via the optical system, and the optical receiver converts the optical signal into an electrical signal.

11. The optical module as described in claim 10, characterized in that, The optical system includes a transmitting optical path and a receiving optical path. The transmitting optical path includes a wavelength division multiplexer, and the receiving optical path includes a wavelength division multiplexer and a reflecting prism. The optical signals emitted by the plurality of lasers are transmitted to the transmitting optical interface via the wavelength division multiplexer; The optical signal received from the optical interface of the receiving end is transmitted to the optical receiver via the wavelength division multiplexer and the reflecting prism.

12. The optical module as described in claim 11, characterized in that, The light emission path also includes a lens assembly, which is used to process the light emitted by the plurality of lasers to adjust the propagation direction of the light emitted from the plurality of lasers.

13. The optical module as described in claim 10, characterized in that, The transmitting optical interface and the receiving optical interface can be set separately or as a single unit.

14. The optical module as described in claim 8, characterized in that, The optical module further includes an assembly tolerance absorption component, which is disposed between the optical system and the optical interface, or the assembly tolerance absorption component is disposed between the plurality of lasers and the optical system; The assembly tolerance absorption component includes an optical element, which includes any one of a lens, a flat glass plate, or a mirror. The optical elements include transmitting optical elements and receiving optical elements.

15. The optical module as described in claim 8, characterized in that, The optical module further includes an assembly tolerance absorption component, which is disposed between the optical system and the optical interface; The assembly tolerance absorption component includes an adapter and at least one optical fiber connecting the adapter and the optical interface.

16. The optical module as described in claim 15, characterized in that, The adapter is fixed relative to the heat sink.

17. The optical module as described in claim 16, characterized in that, The adapter includes a transmitting adapter corresponding to the plurality of lasers and a receiving adapter corresponding to the optical receiver; The at least one optical fiber includes a first optical fiber and a second optical fiber, wherein the first optical fiber is connected between the transmitting adapter and the corresponding optical interface, and the second optical fiber is connected between the receiving adapter and the corresponding optical interface.

18. The optical module as described in claim 8, characterized in that, The heat sink includes a first heat sink and a second heat sink, the optical system is disposed on the first heat sink, and the plurality of lasers are disposed on the second heat sink.

19. The optical module as described in claim 18, characterized in that, The first heat sink, the second heat sink, the PCB board, and the optical interface are all fixed relative to the housing. The optical system is fixed relative to the first heat sink; The plurality of lasers are fixed relative to the second heat sink.

20. The optical module as described in claim 19, characterized in that, The optical module further includes an assembly tolerance absorption component, which is disposed between the optical system and the plurality of lasers, or the assembly tolerance absorption component is disposed between the optical system and the optical receiver; The assembly tolerance absorption component includes at least one optical fiber.

21. The optical module as described in claim 20, characterized in that, The at least one optical fiber includes at least one transmitting optical fiber and / or at least one receiving optical fiber.

22. The optical module as described in claim 21, characterized in that, Both the first heat sink and the second heat sink are provided with optical fiber fixing elements, which fix both ends of each optical fiber.

23. The optical module as described in claim 22, characterized in that, The number of the at least one optical fiber is matched with the number of the corresponding optical interfaces or the number of the corresponding plurality of lasers.

24. The optical module as described in claim 1, characterized in that, The heat sink and the shell are integrally formed.

25. An optical module, characterized in that, include: The optical module includes a housing, a heat sink and a PCB board disposed within the housing, and an optical interface at one end and an electrical interface at the other end. The PCB board is constructed as a rigid board, and the vertical projection of the PCB board on the housing at least partially overlaps with the vertical projection of the heat sink on the housing. The PCB board and the heat sink are fixedly connected, and the heat sink is fixed to one side of the PCB board. An optical component is integrated on the PCB board, or detachably disposed on the PCB board, or integrated on the heat sink. The optical component is electrically connected to the PCB board via gold wires, and the optical component is thermally connected to the heat sink.

26. The optical module as described in claim 25, characterized in that, The optical components include multiple lasers, receivers, and optical systems.

27. The optical module as described in claim 25, characterized in that, The optical component includes a transceiver chip that integrates optical receiving and optical transmitting.

28. The optical module as described in claim 26 or 27, characterized in that, The housing has a receiving space, and the optical module also includes an assembly tolerance absorption component connected to the housing. The assembly tolerance absorption component is constructed as an adapter. The adapter is separately disposed from the housing, and at least a portion of the adapter is received within the receiving space. The optical component has an optical interface that mates with the adapter.

29. The optical module as described in claim 28, characterized in that, The optical interface includes an optical transmitting interface and an optical receiving interface, wherein the optical transmitting interface is used to transmit optical signals and the optical receiving interface is used to receive optical signals.

30. The optical module as described in claim 28, characterized in that, The adapter is connected to the housing along a plugging direction parallel to the optical interface, and there is an adjustable gap between the adapter and the housing along a direction perpendicular to the plugging direction.

31. The optical module as described in claim 25, characterized in that, The heat sink and the shell are integrally formed.

32. The optical module as described in claim 25, characterized in that, Along the main extension direction of the housing, the end of the PCB board away from the optical interface is configured as the electrical interface.

33. The optical module as described in claim 32, characterized in that, The PCB board has a gold finger for external connection at the end opposite to the optical interface.

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