Micro light emitting diodes, displays, mass transfer systems, and mass transfer methods

Abstract

The application provides a micro light emitting diode, which comprises an electrode part, a light emitting part and a suspension part. The electrode part comprises at least one electrode. The light emitting part is arranged on one side of the electrode part and used for emitting light of a color. The suspension part is arranged on the side of the light emitting part away from the electrode part. The suspension part has the same color as the color of the light, and the density of the suspension part is less than the density of the light emitting part and the electrode part. The application also provides a display, a mass transfer system and a mass transfer method.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a micro light-emitting diode and a self-emissive display using the micro light-emitting diode, as well as a mass transfer system and mass transfer method for transferring the micro light-emitting diode. Background Technology

[0002] Currently, LCD monitors dominate the market. However, with the development of display technology, the requirements for monitor resolution and contrast are becoming increasingly stringent. Micro-Light-Emitting Diode (MicroLED) display technology, as a new technology with higher brightness, better luminous efficiency, and lower power consumption, has promising development prospects. However, since MicroLED shrinks the size of LEDs from hundreds of micrometers to tens or even a few micrometers, how to assemble small-sized MicroLEDs onto display substrates with high efficiency and low cost while maintaining a low error rate is a pressing issue that needs to be addressed. Summary of the Invention

[0003] The first aspect of this application provides a miniature light-emitting diode, comprising:

[0004] An electrode portion includes at least one electrode;

[0005] A light-emitting part is disposed on one side of the electrode part and is used to emit a colored light;

[0006] A suspension portion is provided on the side of the light-emitting portion away from the electrode portion, and the density of the suspension portion is less than the density of the light-emitting portion and the electrode portion.

[0007] In one embodiment, the micro LED further includes an upper electrode, which is disposed on the side of the light-emitting portion away from the electrode portion, and the levitation portion does not cover the upper electrode.

[0008] In one embodiment, the suspended portion is the same color as the colored light.

[0009] A second aspect of this application provides a display comprising:

[0010] Array substrate; and

[0011] A plurality of micro light-emitting diodes are arranged in an array on the array substrate, and each of the micro light-emitting diodes is any one of the micro light-emitting diodes described above.

[0012] A third aspect of this application provides a mass transfer system, comprising:

[0013] A receiving cavity for holding a suspension containing multiple miniature light-emitting diodes;

[0014] A positioning plate is provided with a plurality of positioning through holes arranged in an array. Each positioning through hole is used to accommodate one of the micro light-emitting diodes. The positioning plate is used to be positioned on the surface of the suspension when the suspension is contained in the receiving cavity, such that one of the micro light-emitting diodes passes through one of the positioning through holes and is partially located on the side of the positioning plate away from the suspension.

[0015] A transfer roller is used to roll from the side of the positioning plate away from the suspension to adhere to the plurality of micro LEDs in the plurality of positioning through holes, and to transfer the plurality of micro LEDs onto an array substrate.

[0016] In one embodiment, the transfer roller is provided with an adhesive material for adhering a plurality of the micro LEDs.

[0017] In one embodiment, the mass transfer system further includes the suspension containing micro-light-emitting diodes, wherein the micro-light-emitting diodes are any of the micro-light-emitting diodes described above, and the density of each micro-light-emitting diode is less than the density of the suspension; the receiving cavity is used to hold the suspension containing the micro-light-emitting diodes.

[0018] In one embodiment, the transfer roller is provided with a plurality of suction cups, each suction cup being used to adsorb one of the micro light-emitting diodes. When the transfer roller rolls on the positioning plate, each positioning through hole corresponds to one of the suction cups.

[0019] In one embodiment, each of the micro LEDs includes a magnetic electrode, such that the micro LED is transferred from the transfer roller to the array substrate under the influence of a magnetic field.

[0020] In one embodiment, the receiving cavity further includes a communication device for controlling the communication between the inside and outside of the receiving cavity, the communication device being located on the side of the suspension away from the positioning plate.

[0021] The mass transfer system provided in this application embodiment allows the micro-LEDs to float upwards in the suspension by setting a receiving cavity containing a suspension and making the density of the micro-LEDs less than the density of the suspension. By setting a positioning plate, the micro-LEDs can float into the positioning through holes on the positioning plate. By using a transfer roller, multiple micro-LEDs on the positioning plate can be adsorbed and transferred in batches to the array substrate, thereby achieving efficient mass transfer of micro-LEDs.

[0022] A fourth aspect of this application provides a mass transfer method, comprising:

[0023] A receiving cavity is provided, wherein a suspension is disposed therein;

[0024] A plurality of miniature light-emitting diodes are provided, and the plurality of miniature light-emitting diodes are placed into the suspension, wherein the density of the plurality of miniature light-emitting diodes is less than the density of the suspension;

[0025] A positioning plate is provided, wherein the positioning plate is provided with a plurality of positioning through holes arranged in an array;

[0026] The positioning plate is placed on the surface of the suspension, such that each positioning through hole accommodates one micro light-emitting diode, and the micro light-emitting diode is located on the side of the positioning plate away from the suspension.

[0027] A transfer roller is provided, and the transfer roller is rolled on the side of the positioning plate away from the suspension to adhere the plurality of micro LEDs;

[0028] An array substrate is provided, and a transfer roller is rolled on the array substrate such that each of the micro light-emitting diodes is transferred from the transfer roller to the array substrate.

[0029] In one embodiment, providing a plurality of miniature light-emitting diodes specifically refers to:

[0030] Multiple electrode portions are formed on a substrate, a light-emitting portion is provided on the side of each electrode portion away from the substrate, and a levitation portion is provided on the side of each light-emitting portion away from the electrode portion.

[0031] The plurality of electrode portions are separated from the substrate to generate a plurality of micro light-emitting diodes, each comprising an electrode portion, a light-emitting portion, and a suspension portion. The density of the suspension portion is less than the density of the light-emitting portion and the electrode portion, such that when each micro light-emitting diode is located in a positioning through hole, the suspension portion is away from the suspension liquid, and the electrode portion is close to the suspension liquid.

[0032] In one embodiment, the material of the suspending part is a light-transmitting photoresist, and the color of the photoresist is the same as the color of the light emitted by the micro light-emitting diode.

[0033] In one embodiment, after transferring the plurality of micro-light-emitting diodes to the array substrate, the method further includes: calibrating the position of the plurality of micro-light-emitting diodes using the photoresist.

[0034] In one embodiment, the step of filling each of the positioning through holes with a micro light-emitting diode specifically involves vibrating the positioning plate to cause the plurality of micro light-emitting diodes to vibrate until each of the positioning through holes is filled with a micro light-emitting diode.

[0035] In one embodiment, an adhesive material is disposed on the transfer roller;

[0036] Rolling the transfer roller on the side of the positioning plate away from the suspension to adhere the plurality of micro LEDs specifically involves using the adhesive material to bond the plurality of micro LEDs to the transfer roller.

[0037] In one embodiment, the transfer roller is provided with a plurality of suction cups, each suction cup being used to adsorb one of the micro light-emitting diodes. When the transfer roller rolls on the positioning plate, each of the positioning through holes corresponds to one of the suction cups.

[0038] Rolling the transfer roller on the side of the positioning plate away from the suspension to adhere the plurality of micro LEDs specifically involves using the plurality of suction cups to adsorb the plurality of micro LEDs onto the transfer roller.

[0039] In one embodiment, each of the micro LEDs includes a magnetic electrode;

[0040] Specifically, the transfer of the plurality of micro LEDs from the transfer roller to the array substrate involves: providing a magnetic generator on the side of the array substrate away from the transfer roller, activating the magnetic generator, and causing the plurality of micro LEDs to detach from the transfer roller under the action of magnetic force and be fixed to the array substrate.

[0041] In one embodiment, the receiving cavity further includes a communication device for controlling the communication between the inside and outside of the receiving cavity, the communication device being located on the side of the suspension away from the positioning plate;

[0042] The specific steps of placing multiple micro LEDs into the suspension are as follows: injecting multiple micro LEDs into the suspension through the communication device, so that the multiple micro LEDs move from the suspension to the surface of the suspension under the action of buoyancy.

[0043] The mass transfer method provided in this application involves placing a suspension in a receiving cavity, suspending multiple micro-LEDs on the surface of the suspension, and using a positioning plate. Each micro-LED floats into a positioning through-hole in the positioning plate. By including a suspension portion with a density lower than that of the light-emitting part and the electrode part in each micro-LED, the transfer roller can adhere to the suspension portion of each micro-LED as it rolls on the positioning plate, thus achieving uniformity in transfer direction and enabling efficient and rapid mass transfer of micro-LEDs. Furthermore, by including a suspension portion made of light-transmitting photoresist of each micro-LED, with the photoresist's color matching the color of the light emitted by the micro-LED, the position of the corresponding color micro-LED can be determined after transfer to the array substrate, thus avoiding the need for power-on detection. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the structure of a mass transfer system according to an embodiment of this application.

[0045] Figure 2 This is a flowchart of a mass transfer method according to an embodiment of this application.

[0046] Figure 3 This is a structural diagram of a miniature light-emitting diode according to an embodiment of this application.

[0047] Figure 4 This is a structural diagram of a miniature light-emitting diode according to another embodiment of this application.

[0048] Figure 5 for Figure 2 A schematic diagram of step S2 in the mass transfer method.

[0049] Figure 6 This is a structural diagram of a positioning plate according to an embodiment of this application.

[0050] Figure 7 for Figure 2 A schematic diagram of step S4 in the mass transfer method.

[0051] Figure 8 for Figure 2 A schematic diagram of step S5 in the mass transfer method.

[0052] Figure 9 for Figure 2 A schematic diagram of step S6 in the mass transfer method.

[0053] Figure 10 This is a schematic diagram of the structure of a display according to an embodiment of this application.

[0054] Explanation of main component symbols

[0055] Mass Transfer System 100

[0056] Reception cavity 10

[0057] Suspension 11

[0058] Liquid level 110

[0059] Connecting device 13

[0060] Positioning plate 30

[0061] Positioning through hole 31

[0062] Transfer roller 50

[0063] Adhesive material 51

[0064] Suction Cup 53

[0065] Array substrate 70

[0066] 71 capture holes

[0067] Magnetic generator 73

[0068] Miniature LED 90

[0069] Electrode section 91

[0070] Light-emitting part 93

[0071] Suspension section 95

[0072] Upper electrode 97

[0073] Monitor 200

[0074] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0075] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0076] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0077] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0078] This application provides a mass transfer system that can be used to transfer a large number (tens of thousands or even hundreds of thousands) of miniature light-emitting diodes at once. Please refer to... Figure 1 The mass transfer system 100 includes a receiving cavity 10, a positioning plate 30, and a transfer roller 50. The receiving cavity 10 holds a suspension 11, which includes a plurality of micro-LEDs 90, wherein the density of each micro-LED 90 is less than the density of the suspension 11. The positioning plate 30 has a plurality of positioning through holes 31 arranged in an array, each positioning through hole 31 accommodating one micro-LED 90. The positioning plate 30 is positioned on the liquid surface 110 of the suspension 11, such that one micro-LED 90 passes through one positioning through hole 31 and is partially located on the side of the positioning plate 30 away from the liquid surface 110. The transfer roller 50 rolls from the side of the positioning plate 30 away from the suspension 11 to adhere the plurality of micro-LEDs 90 located in the plurality of positioning through holes 31, and transfers the plurality of micro-LEDs 90 onto an array substrate.

[0079] In some embodiments, the mass transfer system 100 further includes the suspension 11 containing micro-light-emitting diodes 90, and the average density of each micro-light-emitting diode 90 is less than the density of the suspension 11; the receiving cavity is used to hold the suspension containing the micro-light-emitting diodes.

[0080] This application also provides a mass transfer method. Please refer to [link to relevant documentation]. Figure 2 Mass transfer methods include:

[0081] Step S1: Provide a receiving cavity, wherein the receiving cavity contains a suspension;

[0082] Step S2: Provide a plurality of miniature light-emitting diodes and place the plurality of miniature light-emitting diodes into the suspension;

[0083] Step S3: Provide a positioning plate, wherein the positioning plate is provided with a plurality of positioning through holes arranged in an array;

[0084] Step S4: Place the positioning plate on the surface of the suspension, such that each positioning through hole accommodates one micro light-emitting diode, and the micro light-emitting diode is located on the side of the positioning plate away from the suspension;

[0085] Step S5: Provide a transfer roller and roll the transfer roller on the side of the positioning plate away from the suspension to adhere the plurality of micro LEDs;

[0086] Step S6: Provide an array substrate, and roll the transfer roller on the array substrate so that the plurality of micro light-emitting diodes are transferred from the transfer roller to the array substrate.

[0087] The mass transfer system 100 of this application will be specifically described below in conjunction with each step of the mass transfer method.

[0088] In one embodiment, please refer to the following: Figure 3 and Figure 4 In step S2, providing multiple miniature light-emitting diodes 90 includes an electrode portion 91, a light-emitting portion 93, and a floating portion 95 stacked sequentially. Specifically, the miniature light-emitting diodes 90 can be as follows: Figure 3 The flip-chip micro LED shown has an electrode portion 91 formed by the cathode and anode electrodes, a light-emitting portion 93 disposed on one side of the electrode portion 91, and a levitation portion 95 disposed on the side of the light-emitting portion 93 away from the electrode portion 91. The micro LED 90 can also be as follows: Figure 4 The vertical miniature light-emitting diode shown has an electrode portion 91 that includes either a cathode electrode or an anode electrode. An upper electrode 97 is also provided on the side of the light-emitting portion 93 away from the electrode portion 91. The upper electrode 97 is specifically another type of cathode electrode or anode electrode. A levitation portion 95 is also provided on the side of the light-emitting portion 93 away from the electrode portion 91, and the levitation portion 95 does not cover the upper electrode 97.

[0089] In one embodiment, the suspension portion 95 is made of a light-transmitting photoresist, the color of which is the same as the color of the light emitted by the micro-LED 90. In other embodiments, the suspension portion 95 may also be made of a colorless and transparent photoresist or other light-transmitting material that is the same color as the light emitted by the micro-LED 90.

[0090] In one embodiment, the density of the suspension portion 95 is less than the density of the light-emitting portion 93 and the electrode portion 91. Therefore, when the micro light-emitting diode 90 is disposed in the suspension liquid 11, it can always be in a state where the suspension portion 95 faces upward under the action of buoyancy, and when the micro light-emitting diode 90 finally floats on the liquid surface 110 of the suspension liquid 11, the suspension portion 95 is farther away from the suspension liquid 11 than the electrode portion 91.

[0091] In one embodiment, step S2, providing a plurality of micro LEDs 90, further includes fabricating a plurality of micro LEDs 90, specifically by: providing a plurality of electrode portions 91 on a substrate (not shown), providing a light-emitting portion 93 on the side of each electrode portion 91 away from the substrate, and providing a levitation portion 95 on the side of each light-emitting portion 93 away from the electrode portion 91; and separating the plurality of electrode portions 91 from the substrate to generate a plurality of micro LEDs 90, each micro LED 90 including an electrode portion 91, a light-emitting portion 93, and a levitation portion 95. In other embodiments, fabricating a plurality of micro LEDs may also involve: sequentially depositing an electrode layer, a light-emitting layer, and a levitation layer on the substrate; and cutting the substrate to obtain a plurality of micro LEDs 90.

[0092] In one embodiment, please refer to Figure 5 The receiving cavity 10 also includes a connecting device 13 for controlling the communication between the inner and outer sides of the receiving cavity 10. The connecting device 13 is located on the side of the suspension 11 away from the positioning plate 30. Specifically, the connecting device 13 is a pipe located at the bottom of the receiving cavity 10. Multiple micro LEDs 90 are transported into the receiving cavity 10 through the connecting device 13 and float from the suspension 11 towards the liquid surface 110 under the action of buoyancy. In other embodiments, the connecting device 13 can also be multiple pipes located on the side wall of the receiving cavity 10, so that multiple micro LEDs 90 are transported into the receiving cavity 10 from different positions, thereby achieving uniform distribution in the suspension 11. By setting the connecting device 13 in this application, multiple micro LEDs 90 float from the suspension 11, which can control the number of micro LEDs 90 in the suspension 11 and avoid a large number of micro LEDs 90 being located on the liquid surface 110 of the suspension 11 at the same time, causing blockage at multiple positioning through holes 31, thereby affecting the micro LEDs 90 from floating into the positioning through holes 31.

[0093] In one embodiment, please refer to Figure 6 The positioning plate 30 includes a plurality of positioning through holes 31 arranged in an array. The aperture and shape of the positioning through holes 31 match the aperture and shape of the micro light-emitting diodes 90, so that each positioning through hole 31 can accommodate one micro light-emitting diode 90. By setting the distance between adjacent positioning through holes 31, the distance between adjacent micro light-emitting diodes 90 after transfer to an array substrate can be controlled.

[0094] In one embodiment, the material of the positioning plate 30 can be metal, plastic, etc., and this application does not limit it.

[0095] In one embodiment, please refer to Figure 7 In step S4, ensuring that each positioning through-hole 31 accommodates a micro LED 90 specifically involves vibrating the positioning plate 30, thereby causing the plurality of micro LEDs 90 to vibrate until each positioning through-hole 31 is filled with a micro LED 90. Specifically, when the plurality of micro LEDs 90 float, they may accumulate or misalign near the positioning through-hole 31. Vibrating the positioning plate 30 at this time can cause the plurality of micro LEDs 90 to vibrate, thereby changing their positions. Under the action of buoyancy, when the position of the micro LED 90 matches the position of the positioning through-hole 31, it can float into the positioning through-hole 31. The vibrating positioning plate 30 may include vibration in a direction parallel to the liquid surface 110, and may also include vibration in a direction perpendicular to the liquid surface 110.

[0096] In one embodiment, when the micro LED 90 floats into the positioning through-hole 31, because the density of the micro LED 90 is less than the density of the suspension 11, a portion of the micro LED 90 will be exposed above the surface 110 of the suspension 11. By setting the position of the positioning plate 30, the micro LED 90 can pass through the positioning through-hole 31 and be partially located on the side of the positioning plate 30 away from the suspension 11. Since the density of the suspended portion 95 is less than that of the light-emitting portion 93 and the electrode portion 91, for each micro LED 90 suspended in the positioning through-hole 31, its suspended portion 95 is away from the suspension 11 relative to the electrode portion 91, that is, the suspended portion 95 is at least partially located on the side of the positioning plate 30 away from the suspension 11.

[0097] In one embodiment, please refer to Figure 8 An adhesive material 51 is provided on the transfer roller 50. Step S5 specifically involves using the adhesive material 51 to adhere multiple micro LEDs 90 to the transfer roller 50. Specifically, the transfer roller 50 with the adhesive material 51 rolls on the side of the positioning plate 30 away from the suspension liquid 11. When the transfer roller 50 passes through the positioning through hole 31 containing the micro LEDs 90, it can adhere to the suspension part 95, thereby adhering the micro LEDs 90 to the transfer roller 50 and bringing them out through the positioning through hole 31.

[0098] In another embodiment, the transfer roller 50 may also be provided with a plurality of suction cups 53, each suction cup 53 being used to adsorb a micro light-emitting diode 90, and when the transfer roller 50 rolls on the positioning plate 30, each positioning through hole 31 corresponds to a suction cup 53. Step S5 specifically involves: using the plurality of suction cups 53 to adsorb a plurality of micro light-emitting diodes 90 onto the transfer roller 50.

[0099] In one embodiment, please refer to Figure 9 Step S6 specifically involves: providing an array substrate 70, on which a plurality of trapping holes 71 are provided, each trapping hole 71 being used to accommodate a micro light-emitting diode 90. A transfer roller 50 coated with a plurality of micro light-emitting diodes 90 is rolled on the array substrate 70, thereby transferring the plurality of micro light-emitting diodes 90 onto the plurality of trapping holes 71 of the array substrate 70.

[0100] In one embodiment, each micro-LED 90 includes magnetic electrodes, meaning the electrode portion 91 of each micro-LED 90 is magnetic. A plurality of magnetic generators 73 are also provided on the side of the array substrate 70 away from the collection aperture 71, with each magnetic generator 73 corresponding to a collection aperture 71. Step S6 further includes: when the micro-LED 90 on the transfer roller 50 coincides with the corresponding collection aperture 71, the corresponding magnetic generator 73 is activated to generate a magnetic field, causing the micro-LED 90 to detach from the transfer roller 50 under the action of the magnetic force and be fixed to the corresponding collection aperture 71. In other embodiments, one magnetic generator 73 may correspond to multiple collection apertures 71; this application does not impose any limitation on this.

[0101] In one embodiment, the mass transfer system 100 may further include multiple receiving cavities 10, each containing a micro-LED 90 emitting light of a different color. The multiple micro-LEDs 90 in each receiving cavity 10 emit light of the same color. Multiple transfer rollers 50 transfer the multiple micro-LEDs 90 from the different receiving cavities 10 onto the array substrate 70, thereby arranging micro-LEDs 90 of different colors on the array substrate 70 to achieve image display. In other embodiments, the same receiving cavity 10 may be used. After transferring multiple micro-LEDs 90 emitting the same color light onto the array substrate 70, multiple micro-LEDs 90 emitting a different color light are placed into the receiving cavity 10. Steps S2-S6 are repeated multiple times until the multiple trapping holes 71 on the array substrate 70 are filled with multiple micro-LEDs 90 of different colors.

[0102] In one embodiment, after step S6, the method further includes: calibrating the positions of multiple micro-light-emitting diodes 90 using photoresist. Specifically, since the material of the levitation portion 95 of the micro-light-emitting diode 90 is photoresist of the same color as the light emitted by the micro-light-emitting diode 90, the position of the corresponding color micro-light-emitting diode can be directly determined by the photoresist, thereby avoiding the need to energize each micro-light-emitting diode 90 to calibrate its position and saving on the manufacturing process.

[0103] The mass transfer system 100 and mass transfer method provided in this application embodiment, by placing multiple micro-LEDs 90 in a receiving cavity 10 containing a suspension liquid 11, and using buoyancy to suspend the multiple micro-LEDs 90 in multiple positioning through holes 31 of a positioning plate 30, can accurately set the distance between the multiple micro-LEDs 90. The multiple micro-LEDs 90 are then transferred from the positioning plate 30 to the array substrate 70 by a transfer roller 50, achieving high efficiency and low cost for transferring multiple micro-LEDs 90. By providing a suspension part 95, the arrangement direction of the micro-LEDs 90 in the positioning through holes 31 can be controlled. By setting the material of the suspension part 95 to a light-transmitting material with the same color as the light emitted by the micro-LEDs 90, the position of the micro-LEDs 90 can be calibrated after the multiple micro-LEDs 90 are transferred to the array substrate 70, thereby optimizing the calibration process.

[0104] Please see Figure 10 This application also provides a display 200. In this embodiment, the display 200 is a self-emissive display, which includes an array substrate 70 and a plurality of micro-light-emitting diodes 90 arranged in an array on the array substrate 70. Specifically, the array substrate 70 includes a plurality of trapping holes 71, and each micro-light-emitting diode 90 is disposed in a trapping hole 71. The array substrate 70 also includes a thin-film transistor circuit (not shown) for electrically connecting to each micro-light-emitting diode 90 and for controlling the light emission of each micro-light-emitting diode 90 respectively. By controlling the light emission state of each micro-light-emitting diode 90, image display is achieved. In other embodiments of this application, the display 200 may also be a non-self-emissive display, in which case the array substrate 70 and the plurality of micro-light-emitting diodes 90 arranged in an array on the array substrate 70 may serve as the backlight of the display 200.

[0105] Those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of protection claimed in this application.

Claims

1. A mass transfer system, characterized in that, include: A receiving cavity for holding a suspension containing multiple miniature light-emitting diodes; A positioning plate is provided with a plurality of positioning through holes arranged in an array. Each positioning through hole is used to accommodate one of the micro light-emitting diodes. Each micro light-emitting diode includes an electrode part, a light-emitting part, and a suspension part. The density of the suspension part is less than the density of the light-emitting part and the electrode part. The positioning plate is used to be positioned on the surface of the suspension when the accommodating cavity contains the suspension, such that one of the micro light-emitting diodes passes through one of the positioning through holes and is partially located on the side of the positioning plate away from the suspension. A transfer roller is used to roll from the side of the positioning plate away from the suspension to adhere to the plurality of micro LEDs in the plurality of positioning through holes, and to transfer the plurality of micro LEDs onto an array substrate.

2. The mass transfer system as described in claim 1, characterized in that, The transfer roller is provided with an adhesive material for adhering multiple micro LEDs.

3. The mass transfer system as described in claim 1, characterized in that, The mass transfer system also includes a suspension containing multiple micro-light-emitting diodes, each of which has a density less than that of the suspension; the receiving cavity is used to hold the suspension containing the multiple micro-light-emitting diodes.

4. The mass transfer system as described in claim 1, characterized in that, The transfer roller is provided with a plurality of suction cups, each suction cup being used to adsorb one of the micro light-emitting diodes. When the transfer roller rolls on the positioning plate, each positioning through hole corresponds to one of the suction cups.

5. The mass transfer system as described in claim 1, characterized in that, Each of the micro LEDs includes a magnetic electrode, which allows the micro LED to be transferred from the transfer roller to the array substrate under the influence of a magnetic field.

6. The mass transfer system as described in claim 1, characterized in that, The receiving cavity also includes a communication device for controlling the communication between the inside and outside of the receiving cavity. The communication device is located on the side of the suspension away from the positioning plate.

7. A mass transfer method, characterized in that, include: A receiving cavity is provided, wherein a suspension is disposed therein; A plurality of micro light-emitting diodes are provided, and the plurality of micro light-emitting diodes are placed in the suspension. Each micro light-emitting diode includes an electrode part, a light-emitting part, and a suspension part. The density of the suspension part is less than the density of the light-emitting part and the electrode part, and the density of the plurality of micro light-emitting diodes is less than the density of the suspension. A positioning plate is provided, wherein the positioning plate is provided with a plurality of positioning through holes arranged in an array; The positioning plate is placed on the surface of the suspension, such that each positioning through hole accommodates one micro light-emitting diode, and the micro light-emitting diode is located on the side of the positioning plate away from the suspension. A transfer roller is provided, and the transfer roller is rolled on the side of the positioning plate away from the suspension to adhere the plurality of micro LEDs; An array substrate is provided, and a transfer roller is rolled on the array substrate such that each of the micro light-emitting diodes is transferred from the transfer roller to the array substrate.

8. The mass transfer method as described in claim 7, characterized in that, The provision of multiple miniature light-emitting diodes specifically refers to: Multiple electrode portions are formed on a substrate, a light-emitting portion is provided on the side of each electrode portion away from the substrate, and a levitation portion is provided on the side of each light-emitting portion away from the electrode portion. The plurality of electrode portions are separated from the substrate to generate a plurality of the micro light-emitting diodes.

9. The mass transfer method as described in claim 8, characterized in that, The material of the suspension part is a light-transmitting photoresist, and the color of the photoresist is the same as the color of the light emitted by the micro light-emitting diode.

10. The mass transfer method as described in claim 9, characterized in that, After transferring the plurality of micro-light-emitting diodes to the array substrate, the method further includes: calibrating the position of the plurality of micro-light-emitting diodes using the photoresist.

11. The mass transfer method as described in claim 7, characterized in that, The specific steps for filling each of the positioning through holes with a micro light-emitting diode are as follows: vibrate the positioning plate, thereby causing the plurality of micro light-emitting diodes to vibrate, until each of the positioning through holes is filled with a micro light-emitting diode.

12. The mass transfer method as described in claim 7, characterized in that, An adhesive material is provided on the transfer roller; Rolling the transfer roller on the side of the positioning plate away from the suspension to adhere the plurality of micro LEDs specifically involves using the adhesive material to bond the plurality of micro LEDs to the transfer roller.

13. The mass transfer method as described in claim 7, characterized in that, The transfer roller is provided with multiple suction cups, each suction cup being used to adsorb one of the micro light-emitting diodes. When the transfer roller rolls on the positioning plate, each of the positioning through holes corresponds to one of the suction cups. Rolling the transfer roller on the side of the positioning plate away from the suspension to adhere the plurality of micro LEDs specifically involves using the plurality of suction cups to adsorb the plurality of micro LEDs onto the transfer roller.

14. The mass transfer method as described in claim 7, characterized in that, Each of the aforementioned miniature light-emitting diodes includes magnetic electrodes; Specifically, the transfer of the plurality of micro LEDs from the transfer roller to the array substrate involves: providing a magnetic generator on the side of the array substrate away from the transfer roller, activating the magnetic generator, and causing the plurality of micro LEDs to detach from the transfer roller under the action of magnetic force and be fixed to the array substrate.

15. The mass transfer method as described in claim 7, characterized in that, The receiving cavity also includes a communication device for controlling the communication between the inside and outside of the receiving cavity. The communication device is located on the side of the suspension away from the positioning plate. The specific steps of placing multiple micro LEDs into the suspension are as follows: injecting multiple micro LEDs into the suspension through the communication device, so that the multiple micro LEDs move from the suspension to the surface of the suspension under the action of buoyancy.

Images