Packaging structure of a wide-angle structure three-color base LED lamp

Abstract

The application provides a wide-angle three-color LED lamp packaging structure of a wide-angle structure, and belongs to the technical field of wide-angle LED; solves the problems of poor light emitting consistency, uneven brightness and poor reliability of a full-color LED of a traditional TOP structure; and comprises an LED support metal part, a plastic body, an internal LED chip and auxiliary part, a filling packaging part and a lens part; the LED support metal part is a stepped stretching structure; the plastic body is fixed on the LED support metal part; the plastic body comprises a bowl cup and a bottom plastic; a boss is arranged at the center of the bowl cup; four functional areas arranged in a fan shape are arranged in the bowl cup with the center of the bowl cup as an axis, and are respectively an R, G, B three-color chip fixing functional area and a common electrode welding area; the internal LED chip and auxiliary part comprises R, G, B chip adhesive and a bonding lead wire of the chip; the filling packaging part comprises twice packaging glue; the lens part comprises three layers of lenses; and the application is applied to a scene requiring wide-angle viewing and using LED.

Description

Technical Field

[0001] This invention provides a packaging structure for a wide-angle tri-color LED lamp, belonging to the field of wide-angle LED packaging technology. Background Technology

[0002] Currently, traditional TOP structure full-color LEDs use an L-shaped cup-bottom structure with a lensless planar package. The bottom of the cup is flat, and the R, G, and B chips are arranged in a line to meet the consistency of the left and right viewing angles in display applications. The encapsulating adhesive is applied flush with the rim of the cup, and after curing, the surface is flat, ensuring the consistency of the LED chip's radiation angle. However, the luminous intensity of this LED is high in the middle and gradually decreases towards the edges, and the half-maximum radiation angle is relatively small, generally around 115 degrees. This results in poor luminous uniformity and slight brightness deviations at different distances, leading to poor reliability. Summary of the Invention

[0003] To address the problems of poor light emission uniformity and slight brightness deviation at different distances in existing traditional TOP structure full-color LEDs, as well as their poor reliability, this invention proposes a wide-angle structure for the packaging of tri-color LED lamps.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: a packaging structure for a wide-angle tri-color LED lamp, including an LED bracket metal part, a plastic body, an internal LED chip and auxiliary parts, a filling and encapsulation part, and a lens part. The LED bracket metal part is a stepped stretching structure. There are two external pins at the bottom of the LED bracket metal part. A step is stretched upward from the two external pins to form a bracket plane. The plastic body is fixed on the bracket plane of the LED bracket metal part. The plastic body includes a cup and a bottom plastic. A boss is provided in the center of the cup. The boss in the cup is connected to the bottom plastic as a whole. Four functional areas are arranged in a fan shape with the center of the cup as the axis. They are the R, G, and B tri-color chip fixing functional area and the common electrode welding area. The common electrode welding area passes through the central axis of the cup and extends to the opposite side to form a wire bonding welding area. The internal LED chip and auxiliary components include R, G, and B chip adhesives and chip bonding wires. The filling and encapsulation portion includes two layers of encapsulating adhesive; The lens section comprises three lenses whose diameter gradually decreases from the outside to the inside.

[0005] The rim of the bowl / cup is stepped, with the step being 0.1-0.3mm lower than the rim, and a V-groove is provided on the inner side of the step.

[0006] The protrusion inside the bowl / cup is specifically designed as a frustum-shaped light guide protrusion.

[0007] The frustum-shaped light guide protrusion forms an annular light mixing groove between itself and the cup wall.

[0008] The bottom of the bowl / cup is provided with grooved, airtight reinforcement protrusions at intervals around its perimeter.

[0009] The internal LED chip and auxiliary part R chip are bonded and fixed to the R chip metal functional area at the bottom of the cup using R chip adhesive. G chip is bonded and fixed to the G chip metal functional area at the bottom of the cup using G chip adhesive. B chip is bonded and fixed to the B chip metal functional area at the bottom of the cup using B chip adhesive. Two bonding leads connect the positive terminals of R chip and B chip to the common electrode soldering area, respectively. Another bonding lead connects the positive terminal of G chip to the wire bonding area.

[0010] The two encapsulation adhesives include a primary encapsulation adhesive and a secondary encapsulation adhesive. The height of the primary encapsulation adhesive is flush with the step on the rim of the bowl. The primary encapsulation adhesive fills the annular light mixing groove formed by the bowl and the frustum-shaped light guide protrusion at its center, so that the light emitted by the R, G, and B three-color LED chips is mixed through the primary encapsulation adhesive. After the primary encapsulating colloid has initially cured, a secondary encapsulating colloid is applied. The secondary encapsulating colloid is a transparent colloid that forms a lens, allowing the light emitted by the R, G, and B color LED chips to be dispersed and radiated through the lens.

[0011] The encapsulated colloid contains uniformly distributed fumed silica, titanium dioxide, and zinc oxide particles with diffused and uniform light distribution. The particle size is between 50 nanometers and 20 micrometers.

[0012] The lens formed by secondary encapsulation of the colloid is a three-layer lens from the outside to the inside. The outermost layer of the lens is the angle and brightness magnification layer, the middle layer of the lens is the brightness maintenance layer, and the innermost layer of the lens is the brightness attenuation layer. The innermost layer of the lens is located at the center of the cup, and the middle layer and the outermost layer of the lens extend outward from the innermost layer of the lens in sequence.

[0013] The advantages of this invention compared to existing technologies are as follows: By adding a frustum-shaped light-guiding protrusion to the bottom of the bowl-shaped LED and using a secondary encapsulation lens, the light angle and brightness emitted by the full-color LED are at a comfortable level for viewing at both long and short distances. Simultaneously, the functional areas within the bowl-shaped LED are arranged in a fan-shaped pattern, extending the common electrode soldering area to the opposite side, resulting in shorter bonding leads for the R, G, and B color LED chips, which improves LED reliability. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the structure of the metal part of the LED bracket of the present invention; Figure 2 for Figure 1 Top view; Figure 3 This is a schematic diagram of the structure of the LED bracket body of the present invention; Figure 4 for Figure 3 Top view; Figure 5 This is a schematic diagram of the overall structure of the LED packaging structure of the present invention; Figure 6 for Figure 5 Top view; Figure 7 This is a schematic diagram of the LED packaging and lens portion of the present invention; Figure 8 This is the radiation spectrum of the LED lamp of the present invention; In the diagram: 1 is the metal part of the LED bracket, 101 is the metal functional area of ​​the R chip, 102 is the metal functional area of ​​the G chip, 103 is the metal functional area of ​​the B chip, 104 is the common electrode welding area, 105 is the wire bonding welding area, 106 is the circular fixing hole, 107 is the stepped tension area, and 108 is the external lead. 2 is the plastic body, 201 is the frustum-shaped light guide boss, 202 is the groove airtightness reinforcing boss, 203 is the cup, 204 is the V-groove, 205 is the corner polarity mark, and 206 is the annular light mixing groove. 3 is the internal LED chip-level auxiliary part, 301 is the R chip adhesive, 302 is the G chip adhesive, 303 is the B chip adhesive, 304 is the R chip, 305 is the G chip, 306 is the B chip, and 307 is the bonding wire. 4 represents the filling and encapsulation part, 401 represents the primary encapsulation colloid, and 402 represents the secondary encapsulation colloid and lens body; 5 represents the lens, 501 represents the outermost layer of the lens, 502 represents the middle layer of the lens, and 503 represents the innermost layer of the lens. Detailed Implementation

[0015] like Figures 1 to 8As shown, the present invention provides a packaging structure for a wide-angle tri-color LED lamp, including an LED bracket metal part 1, a plastic body 2, an internal LED chip and auxiliary part 3, a filling and encapsulation part 4, and a lens part. The LED bracket metal part 1 is divided into a stepped stretching structure. There are two external pins 108 at the bottom of the LED bracket metal part 1. A step is stretched upward from the two external pins 108 to form a bracket plane. The plastic body 2 is fixed on the bracket plane of the LED bracket metal part 1. The plastic body 2 includes a cup 203 and a bottom plastic. A boss is provided in the center of the cup 203. The boss in the cup 203 is connected to the bottom plastic as a whole. Four functional areas are arranged in a fan shape with the center of the cup 203 as the axis. They are the R, G, and B tri-color chip fixing functional area and the common electrode welding area 104. The common electrode welding area 104 passes through the central axis of the cup 203 and extends to the opposite side to form a wire bonding area 105. The internal LED chip and auxiliary part 3 include R, G, B chip adhesive and chip bonding wires 307; The filling and encapsulation portion 4 includes two encapsulation adhesives; The lens section includes three lenses 5 whose diameter gradually decreases from the outside to the inside.

[0016] The rim of the bowl 203 is stepped, with the step being 0.1-0.3mm lower than the rim, and a V-groove 204 is provided on the inner side of the step.

[0017] The protrusion inside the bowl 203 is specifically configured as a frustum-shaped light guide protrusion 201.

[0018] The frustum-shaped light guide protrusion 201 and the cup wall of the bowl 203 form an annular light mixing groove 206.

[0019] The bottom of the bowl 203 is provided with grooved, airtight reinforcement protrusions 202 at intervals around its perimeter.

[0020] The internal LED chip and auxiliary part 3's R chip 304 is bonded and fixed to the R chip metal functional area 101 at the bottom of the cup using R chip adhesive 301. The G chip 305 is bonded and fixed to the G chip metal functional area 102 at the bottom of the cup using G chip adhesive 302. The B chip 306 is bonded and fixed to the B chip metal functional area 103 at the bottom of the cup using B chip adhesive 303. Two bonding wires 307 connect the positive terminals of the R chip 304 and B chip 306 to the common electrode soldering area 104, respectively. Another bonding wire 307 connects the positive terminal of the G chip 305 to the wire bonding area 105.

[0021] The two encapsulation adhesives include a primary encapsulation adhesive 401 and a secondary encapsulation adhesive 402. The encapsulation filling height of the primary encapsulation adhesive 401 is flush with the step on the rim of the cup 203. The primary encapsulation adhesive 401 fills the annular light mixing groove 206 formed by the cup 203 and the frustum-shaped light guide protrusion 201 at its center, so that the light emitted by the R, G, and B three-color LED chips is mixed through the primary encapsulation adhesive. After the primary encapsulating colloid 401 has initially cured, a secondary encapsulating colloid is applied. The secondary encapsulating colloid 402 is a transparent colloid and forms a lens, allowing the light emitted by the R, G, and B color LED chips to be dispersed and radiated through the lens 5.

[0022] The primary encapsulation colloid 401 contains uniformly distributed fumed silica, titanium dioxide, and zinc oxide particles with diffused and uniform light distribution. The particle size is between 50 nanometers and 20 micrometers.

[0023] The lens 5 formed by the secondary encapsulating colloid 402 is a three-layer lens from the outside to the inside. The outermost layer 501 of the lens is an angle and brightness magnification layer, the middle layer 502 of the lens is a brightness maintenance layer, and the innermost layer 503 of the lens is a brightness attenuation layer. The innermost layer 503 of the lens is located at the center of the cup 503, and the middle layer 502 and the outermost layer 501 of the lens extend outward from the innermost layer 503 of the lens in sequence.

[0024] The packaging structure of the wide-angle tri-color LED lamp proposed in this invention mainly includes: an LED bracket metal part 1, a plastic body 2, an internal LED chip and auxiliary parts 3, a filling and encapsulation part 4, and a lens part 5. The LED bracket metal part 1 is designed as a stepped stretching structure to enhance the moisture resistance of the LED; the four functional areas inside the cup 203 are arranged in a fan shape with the center of the cup as the axis, namely the R, G, and B tri-color chip mounting functional area and the common electrode soldering area 104, wherein the common electrode soldering area 104 extends through the central axis of the cup to the opposite side to form a wire bonding area 105; the plastic body 2 includes the cup 203 and a frustum-shaped light guide protrusion 201 protruding from the center of the cup, the frustum-shaped light guide protrusion 201 is integrated with the bottom plastic of the plastic body 2. The rim of the bowl 203 is stepped, with the step being 0.1~0.3mm lower than the rim. At the same time, there is a V-groove 204 on the inner side of the step. The V-groove 204 is used to reduce stray light spillage from the LED chip and enhance the bonding area and bonding force of the lens. The lens is divided into three layers to ensure that the LED meets the intensity and angle matching requirements for viewing at different distances.

[0025] The structure of the metal part of the LED bracket in this invention is as follows: Figure 1 and 2As shown, 1 consists of an R chip metal functional area 101, a G chip metal functional area 102, a B chip metal functional area 103, a common electrode soldering area 104, a wire bonding soldering area 105, a circular fixing hole 106, a stepped stretching section 107, and an external pin 108. The four functional areas are distributed in a fan-shaped pattern. The common electrode soldering area 104 extends to the opposite side through the central axis to form the wire bonding soldering area 105. When the common electrode soldering area 104 extends to the central axis, a circular fixing hole 106 is formed by stamping. The circular fixing hole 106 is used to connect the frustum-shaped light guide protrusion 201 at the bottom of the cup 203 to the bottom plastic of the cup, while ensuring the flatness and dimensional stability of the wire bonding soldering area 105.

[0026] The structure of the two plastic body parts of the present invention is as follows: Figure 3 and 4 As shown, it consists of a frustum-shaped light guide boss 201, a grooved airtightness reinforcing boss 202, a cup 203, a V-groove 204, and a notched polarity mark 205. The bottom of the cup 203 is formed by injection molding from the bottom common pole welding area 104 through the circular fixing hole 106 of the central axis to form the frustum-shaped light guide boss 201. An annular light mixing groove 206 is formed between the frustum-shaped light guide boss 201 and the cup wall. At the same time, in order to improve the airtightness inside the annular light mixing groove 206, four grooved airtightness reinforcing bosses 202 are set at intervals on the bottom of the cup 203.

[0027] The structure of the internal LED chip and auxiliary part 3 of the present invention is as follows: Figure 5 and 6 As shown, the assembly includes R, G, and B chip adhesives, chips, and bonding wires. R chip 304 is bonded to the R chip metal functional area 101 at the bottom of the cup using R chip adhesive 301. G chip 305 is bonded to the G chip metal functional area 102 at the bottom of the cup using G chip adhesive 302. B chip 306 is bonded to the B chip metal functional area 103 at the bottom of the cup using B chip adhesive 303. Bonding wire 307 connects the positive terminals of the R and B chips to the common electrode soldering area 104, and also connects the positive terminal of the G chip to the wire bonding area 105.

[0028] The filling and encapsulation portion 4 of this invention is divided into two stages of encapsulation. The first encapsulation colloid 401 has a filling height flush with the step inside the bowl / cup rim. The first encapsulation colloid 401 fills the annular mixing groove 206 formed between the bowl / cup 203 and the central frustum-shaped light-guiding protrusion 201, allowing the light emitted by the R, G, and B LED chips to be mixed through the first encapsulation colloid 401. The first encapsulation colloid 401 contains uniformly distributed particles of fumed silica, titanium dioxide, and zinc oxide, which diffuse and unify light. The particle size is between 50 nanometers and 20 micrometers; excessively large particles will affect the light extraction efficiency. The second encapsulation colloid 402 is applied after the first encapsulation colloid 401 has initially cured. The second encapsulation colloid 402 is a transparent colloid and forms a lens 5, allowing the light emitted by the R, G, and B chips to be dispersed and radiated through the lens 5.

[0029] The lens 5 structure formed by the secondary encapsulation of this invention has three layers: the outermost layer 501 is the angle and brightness magnification layer, the middle layer 502 is the brightness maintenance layer, and the innermost layer 503 is the brightness attenuation layer. The three-layer lens amplifies the light emitted by the R, G, and B chips to the required angle and adjusts the brightness according to the viewing distance, ensuring suitable brightness for both long-distance and close-range viewing.

[0030] The LED of this invention can be applied to wide-angle scenarios, such as traffic signs, high-speed rail station waiting area signs, airport runway signs, and urban road lane indicators, expanding the application range of LED indicators. With the wide-angle LED of this invention, secondary lenses are no longer needed for signal indication, significantly reducing the manufacturing cost and overall size of the signal lights.

[0031] Regarding the specific structure of this invention, it should be noted that the connection relationships between the various component modules used in this invention are definite and achievable. Except as specifically described in the embodiments, their specific connection relationships can bring about corresponding technical effects and solve the technical problems proposed by this invention without relying on the execution of corresponding software programs. The models of the components, modules, and specific components appearing in this invention, the connection methods between them, and the conventional usage methods and expected technical effects brought about by the above technical features, unless specifically described, are all publicly disclosed content in patents, journal articles, technical manuals, technical dictionaries, and textbooks that can be obtained by those skilled in the art before the application date, or belong to conventional technology, common knowledge, and other existing technologies in this field. There is no need to elaborate, which makes the technical solution provided in this case clear, complete, and achievable, and can reproduce or obtain corresponding physical products based on this technical means.

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A packaging structure for a wide-angle tri-color LED lamp, characterized in that: The device includes an LED bracket metal part, a plastic body, internal LED chips and auxiliary parts, a filling and encapsulation part, and a lens part. The LED bracket metal part has a stepped stretching structure. There are two external pins at the bottom of the LED bracket metal part. A step is stretched upward from each of the two external pins to form a bracket plane. The plastic body is fixed on the bracket plane of the LED bracket metal part. The plastic body includes a cup and a bottom plastic. A boss is provided in the center of the cup. The boss in the cup is connected to the bottom plastic as a whole. Four functional areas are arranged in a fan shape with the center of the cup as the axis. These are the R, G, and B three-color chip fixing functional area and the common electrode soldering area. The common electrode soldering area passes through the central axis of the cup and extends to the opposite side to form a wire bonding soldering area. The internal LED chip and auxiliary components include R, G, and B chip adhesives and chip bonding wires. The filling and encapsulation portion includes two layers of encapsulating adhesive; The lens section comprises three lenses whose diameter gradually decreases from the outside to the inside.

2. The packaging structure of a wide-angle tri-color LED lamp according to claim 1, characterized in that: The rim of the bowl / cup is stepped, with the step being 0.1-0.3mm lower than the rim, and a V-groove is provided on the inner side of the step.

3. The packaging structure of a wide-angle tri-color LED lamp according to claim 2, characterized in that: The protrusion inside the bowl / cup is specifically designed as a frustum-shaped light guide protrusion.

4. The packaging structure of a wide-angle tri-color LED lamp according to claim 3, characterized in that: The frustum-shaped light guide protrusion forms an annular light mixing groove between itself and the cup wall.

5. The packaging structure of a wide-angle tri-color LED lamp according to claim 4, characterized in that: The bottom of the bowl / cup is provided with grooved, airtight reinforcement protrusions at intervals around its perimeter.

6. The packaging structure of a wide-angle tri-color LED lamp according to claim 1, characterized in that: The internal LED chip and auxiliary part R chip are bonded and fixed to the R chip metal functional area at the bottom of the cup using R chip adhesive. G chip is bonded and fixed to the G chip metal functional area at the bottom of the cup using G chip adhesive. B chip is bonded and fixed to the B chip metal functional area at the bottom of the cup using B chip adhesive. Two bonding leads connect the positive terminals of R chip and B chip to the common electrode soldering area, respectively. Another bonding lead connects the positive terminal of G chip to the wire bonding area.

7. The packaging structure of a wide-angle tri-color LED lamp according to claim 1, characterized in that: The two encapsulation adhesives include a primary encapsulation adhesive and a secondary encapsulation adhesive. The height of the primary encapsulation adhesive is flush with the step on the rim of the bowl. The primary encapsulation adhesive fills the annular light mixing groove formed by the bowl and the frustum-shaped light guide protrusion at its center, so that the light emitted by the R, G, and B three-color LED chips is mixed through the primary encapsulation adhesive. After the primary encapsulating colloid has initially cured, a secondary encapsulating colloid is applied. The secondary encapsulating colloid is a transparent colloid that forms a lens, allowing the light emitted by the R, G, and B color LED chips to be dispersed and radiated through the lens.

8. The packaging structure of a wide-angle tri-color LED lamp according to claim 7, characterized in that: The encapsulated colloid contains uniformly distributed fumed silica, titanium dioxide, and zinc oxide particles with diffused and uniform light distribution. The particle size is between 50 nanometers and 20 micrometers.

9. The packaging structure of a wide-angle tri-color LED lamp according to claim 7, characterized in that: The lens formed by secondary encapsulation of the colloid is a three-layer lens from the outside to the inside. The outermost layer of the lens is the angle and brightness magnification layer, the middle layer of the lens is the brightness maintenance layer, and the innermost layer of the lens is the brightness attenuation layer. The innermost layer of the lens is located at the center of the cup, and the middle layer and the outermost layer of the lens extend outward from the innermost layer of the lens in sequence.

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