Millimeter-wave phased array antenna

Abstract

This application discloses a millimeter-wave phased array antenna, comprising: an antenna assembly; an RF chip feed line assembly; and a feed network stripline assembly. The feed network stripline assembly is disposed between the antenna assembly and the RF chip feed line assembly, and is connected to both the antenna assembly and the RF chip feed line assembly. This technical solution effectively solves the problem of numerous compression operations in millimeter-wave phased array antennas by using the feed network stripline assembly to connect the antenna assembly and the RF chip feed line assembly, while also improving the versatility of the antenna assembly.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and in particular to a millimeter-wave phased array antenna. Background Technology

[0002] Currently, millimeter-wave phased array antennas integrate the antenna carrier layer, antenna array surface, TR components, and feed network into a single design. The advantage is that they use microwave integration methods to integrate phase shifters, filters, attenuators, power amplifiers, and low-noise amplifiers into a single chip, achieving miniaturization and lightweighting of the equipment, as well as high beam pointing accuracy and a certain beam sidelobe suppression capability.

[0003] However, millimeter-wave phased array antennas are expensive, have low component versatility, and require multiple bonding cycles. Summary of the Invention

[0004] This application provides a millimeter-wave phased array antenna that can solve the problems of low versatility and numerous pressing cycles of the aforementioned millimeter-wave phased array antenna components.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a millimeter-wave phased array antenna, which includes: an antenna assembly; an RF chip feed line assembly; and a feed network stripline assembly, wherein the feed network stripline assembly is disposed between the antenna assembly and the RF chip feed line assembly, and is connected to the antenna assembly and the RF chip feed line assembly respectively.

[0006] The antenna assembly and the feed network stripline assembly, as well as the RF chip feedline assembly and the feed network stripline assembly, are connected by a contact array packaging and soldering process.

[0007] The feed network stripline assembly includes a first circuit board dielectric layer, an insulating layer, and a second circuit board dielectric layer that are sequentially bonded together. The first circuit board dielectric layer is connected to the antenna assembly, and the second circuit board dielectric layer is connected to the RF chip feedline assembly.

[0008] The first circuit board dielectric layer, the insulating layer, and the second circuit board dielectric layer are connected by a pressing process.

[0009] In this circuit, a plurality of first power supply points are provided on the dielectric layer of the first circuit board, and a plurality of second power supply points are provided on the dielectric layer of the second circuit board. The number of first power supply points and second power supply points are equal, and the first power supply points and second power supply points are connected in a one-to-one correspondence.

[0010] The insulation layer contains multiple wires for connecting the first feed point and the second feed point.

[0011] The first surface of the antenna assembly, which is away from the RF chip feed line assembly, includes multiple antenna patches. The second surface of the antenna assembly, which is adjacent to and connected to the RF chip feed line assembly, includes several antenna feed points. The antenna feed points are set in correspondence with the antenna patches, and the antenna feed points are connected to the first feed points one by one.

[0012] The antenna patches are arranged in an array on the first surface of the antenna assembly.

[0013] The antenna feed point and the first feed point, as well as the RF chip feed point and the second feed point, are connected one-to-one through a contact array packaging and soldering process.

[0014] The RF chip feeder assembly includes multiple RF chips, multiple RF chip channels, and multiple RF chip feed points, with the RF chip channels evenly arranged on both sides of the RF chips.

[0015] The beneficial effects of this application are as follows: Unlike existing technologies, this application provides a millimeter-wave phased array antenna, comprising: an antenna assembly; an RF chip feed line assembly; and a feed network stripline assembly. The feed network stripline assembly is disposed between the antenna assembly and the RF chip feed line assembly, and is connected to both the antenna assembly and the RF chip feed line assembly. This technical solution, by using the feed network stripline assembly to connect the antenna assembly and the RF chip feed line assembly, effectively solves the problem of numerous compression cycles in millimeter-wave phased array antennas, while also improving the versatility of the antenna assembly. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0017] Figure 1 This is a schematic diagram of the structure of the first surface of the antenna assembly in the first embodiment of the millimeter-wave phased array antenna provided in this application;

[0018] Figure 2 This is a schematic diagram of the structure of the second surface of the antenna assembly in the first embodiment of the millimeter-wave phased array antenna provided in this application;

[0019] Figure 3 This is a schematic diagram of the structure of the first surface of the radio frequency chip feeder assembly of the first embodiment of the millimeter-wave phased array antenna provided in this application;

[0020] Figure 4This is a schematic diagram of the structure of the second surface of the radio frequency chip feed assembly of the first embodiment of the millimeter-wave phased array antenna provided in this application;

[0021] Figure 5 This is a schematic diagram of the structure of the second embodiment of the millimeter-wave phased array antenna provided in this application;

[0022] Figure 6 This is a schematic diagram of the feed network stripline assembly in the second embodiment of the millimeter-wave phased array antenna provided in this application;

[0023] Figure 7 This is another structural schematic diagram of the feed network stripline assembly in the second embodiment of the millimeter-wave phased array antenna provided in this application. Detailed Implementation

[0024] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0025] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] Millimeter-wave phased array antennas are mainly used in millimeter-wave 5G communication and satellite communication. In the field of millimeter-wave 5G communication, in order to increase the communication capacity, dual-polarized antenna module design is required, and the azimuth and elevation scanning angles must reach ±60 degrees or wider. The spacing between antenna radiating elements is small, and the design of the RF transceiver chip feed network is complex and difficult. For the design of dual-beam, quad-beam, or more-beam phased array antenna panels used in KA and Ku bands for satellite communication, two or more RF feed network designs are required, and the design of the RF transceiver chip feed network is complex and difficult.

[0027] The antenna assembly of a millimeter-wave phased array antenna consists of several subarrays, each of which has several antenna patches. Each antenna patch is a disc-shaped directional antenna, composed of two stacked metal plates of different sizes with a sheet of dielectric material between them. The antenna patch has a wide coverage area, and the propagation range from 30 degrees to 180 degrees from the installation point.

[0028] Currently, millimeter-wave phased array antennas are mostly integrated designs, meaning that different specifications of RF chips and their corresponding RF chip channels are different, resulting in different positions of the RF chip feed points corresponding to the RF chip channels. Therefore, during the connection process between the RF chip feed points and the antenna components, winding is inevitable, and the integrated design also necessarily involves a pressing process.

[0029] Based on the analysis of the structure of millimeter-wave phased array antennas, in order to improve the versatility of components and reduce the number of compression operations in millimeter-wave phased array antennas, this application proposes a millimeter-wave phased array antenna. Utilizing the concept of decoupling, the millimeter-wave phased array antenna components are decoupled from the RF chip feed components, making the antenna components universal components in the millimeter-wave phased array antenna. By redistributing the components, it can match millimeter-wave RF chips from different manufacturers, as detailed below:

[0030] In this application, the antenna assembly acts as a converter, transforming guided waves propagating on the transmission line into electromagnetic waves propagating in an unbounded medium, or vice versa. The antenna assembly includes a circuit board, wherein the side connected to the outside world is a first surface of the circuit board, on which multiple antenna patches are disposed for receiving electromagnetic waves from the outside world or releasing electromagnetic waves to the outside world; the side connected to the components providing transmission signals in the millimeter-wave phased array antenna is a second surface of the circuit board, on which multiple antenna feed points are disposed for transmitting the transmission signals of the millimeter-wave phased array antenna to the antenna patches or acquiring electromagnetic wave signals from the antenna patches and feeding them back to the millimeter-wave phased array antenna.

[0031] To improve the space utilization of the first surface of the antenna assembly, such as Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of the first surface of the antenna assembly in the first embodiment of the millimeter-wave phased array antenna provided in this application. In this embodiment, the antenna assembly 10 includes a plurality of antenna patches 11, which are arranged in an array on the first surface of the antenna assembly 10, for example, a rectangular grid arranged on the first surface of the antenna assembly 10. Each antenna patch 11 is relatively independent and does not interfere with each other. In other embodiments, the antenna assembly 10 may be arranged in other ways as needed.

[0032] To reduce the number of wiring connections in antenna assembly 10, such as Figure 2 As shown, Figure 2This is a schematic diagram of the structure of the second surface of the antenna assembly in the first embodiment of the millimeter-wave phased array antenna provided in this application. In this embodiment, the antenna assembly 10 includes a plurality of antenna feed points 21, which are arranged in an array on the second surface of the antenna assembly 10, for example, a rectangular grid is arranged on the second surface of the antenna assembly 10. The antenna feed points 21 are connected one-to-one with the antenna patch 11, and the antenna feed points 21 are used to acquire and transmit the electrical signal energy of the antenna patch 11.

[0033] In actual production, since the specifications and dimensions of the antenna patch 11 are relatively fixed and the antenna assembly 10 has a simple structure and wide range of applications, mainly serving as a converter, in order to make the antenna assembly 10 a universal component in millimeter-wave phased array antennas, the millimeter-wave phased array antenna is decoupled, and the antenna assembly 10 is designed and manufactured separately. By setting the arrangement of the antenna patch 11 and the antenna feed point 21, it is possible to match millimeter-wave RF chips from different manufacturers and improve the versatility of the antenna assembly 10.

[0034] In addition, in order to reduce the connection lines between the antenna patch 11 and the antenna feed point 21, the antenna feed point 21 is set on the second surface of the antenna assembly 10 corresponding to the center position of the antenna patch 11. That is to say, in this embodiment, the antenna feed point 21 is arranged in an array on the second surface of the antenna assembly 10.

[0035] In other embodiments, the antenna patch 11 can also be arranged in other ways, such as in a ring, and the antenna feed point 21 can also be set in other ways as needed, such as on the second surface of the antenna assembly 10 corresponding to a corner or a special point of the antenna patch 11.

[0036] A radio frequency (RF) chip is an electronic component that converts radio signals into specific radio signal waveforms. The RF chip feeder assembly also includes an RF signal common input port, an RF signal common output port, an RF signal receiving channel, an RF signal transmitting channel, a power supply, and control circuitry. For existing global mobile communication systems (GSM) and Time Division Synchronous Code Division Multiple Access (TDMA), if a terminal adds support for a frequency band, its RF chip correspondingly adds one more receiving channel. However, whether an additional RF signal transmitting channel is needed depends on the spacing between the new and existing frequency bands. For mobile communication systems with receive diversity, the number of RF receiving channels is twice the number of RF transmitting channels. This means that the more frequency bands a terminal supports, the more significantly the number of RF signal receiving channels its RF chip will have.

[0037] The radio frequency (RF) chip provides signals to the RF chip channels, which are connected to the antenna assembly 10 to provide transmission signals to the antenna assembly 10. To increase the distribution density of the RF chips on the circuit board, the number of RF chip channels is increased, such as... Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of the first surface of the RF chip feeder assembly of the first embodiment of the millimeter-wave phased array antenna provided in this application. The first surface of the RF chip feeder assembly 30 includes a plurality of RF chips 31 and a plurality of RF chip channels 32, wherein the RF chip channels 32 are uniformly arranged on both sides of the RF chips 31. In other embodiments, more RF chips 31 may be arranged on the circuit board, and the RF chips 31 may be arranged in other ways, such as in a ring arrangement. More RF chip channels 32 may be provided around the RF chips 31, and the relative positions of the RF chip channels 32 and the RF chips 31 may be adjusted as needed.

[0038] like Figure 4 As shown, Figure 4 This is a schematic diagram of the structure of the second surface of the RF chip feeder assembly of the first embodiment of the millimeter-wave phased array antenna provided in this application. The second surface of the RF chip feeder assembly 30 includes a plurality of RF chip feed points 41, wherein the number of RF chip feed points 41 and RF chip channels 32 are equal and connected in a one-to-one correspondence. In other embodiments, more RF chip feed points 41 and RF chip channels 32 can be provided, and the corresponding positional relationship between the RF chip feed points 41 and RF chip channels 32 can be more diversified. For example, when the RF chip channels 32 are arranged in a ring around the RF chip 31, the RF chip feed points 41 are arranged in multiple rings on the second surface of the RF chip feeder assembly 30; when the RF chip channels 32 and the RF chip 31 are spaced apart, the RF chip feed points 41 are arranged in a queue on the second surface of the RF chip feeder assembly 30, that is, the arrangement of the RF chip feed points 41 can be more diversified.

[0039] Based on the above configuration of the RF chip feeder assembly 30, it is possible to manufacture the RF chip feeder assembly 30 independently and, when used in conjunction with the antenna assembly 10, to realize the function of a millimeter-wave phased array antenna.

[0040] However, in actual production, there are many specifications for the RF chip 31, resulting in RF chip feeder assemblies 30 with various specifications. In other words, there are multiple ways to arrange the RF chip feed points 41 on the second surface of the RF chip feeder assembly 30. The antenna feed points 21 on the second surface of the antenna assembly 10 are arranged in an array. Directly connecting them to the RF chip feed points 41 obviously cannot realize the function of a millimeter-wave phased array antenna. Therefore, a feed network stripline assembly is provided. The RF chip feeder assembly 30 can be connected to the antenna assembly 10 by using the corresponding feed network stripline assembly, reducing the number of pressing operations.

[0041] Specifically, such as Figure 5 As shown, Figure 5 This is a schematic diagram of the second embodiment of the millimeter-wave phased array antenna provided in this application, dividing the millimeter-wave phased array antenna into three parts. The millimeter-wave phased array antenna 50 includes an antenna assembly 51, a feed network stripline assembly 52, and an RF chip feedline assembly 53. The feed network stripline assembly 52 is disposed between the antenna assembly 51 and the RF chip feedline assembly 53, and is connected to both the antenna assembly 51 and the RF chip feedline assembly 52. ​​Specifically, the antenna assembly 51 and the feed network stripline assembly 52 are connected by a contact array packaging and soldering process, and the RF chip feedline assembly 53 and the feed network stripline assembly 52 are also connected by a contact array packaging and soldering process.

[0042] Specifically, such as Figure 6 As shown, Figure 6 This is a schematic diagram of the feed network stripline assembly in the second embodiment of the millimeter-wave phased array antenna provided in this application. The feed network stripline assembly 52 includes a first circuit board dielectric layer 61, an insulating layer 62, and a second circuit board dielectric layer 63. The first circuit board dielectric layer 61 and the second circuit board dielectric layer 63 are respectively disposed on both sides of the insulating layer 62. The first circuit board dielectric layer 61 is connected to the antenna assembly, and the second circuit board dielectric layer 63 is connected to the RF chip feedline assembly.

[0043] The materials of the insulating layer 62 specifically include epoxy resin, polyimide, BT, ABF, and ceramic matrix.

[0044] Specifically, the first circuit board dielectric layer 61, the insulating layer 62, and the second circuit board dielectric layer 63 are connected by a crimping process. In other embodiments, the first circuit board dielectric layer 61, the insulating layer 62, and the second circuit board dielectric layer 63 can also be connected in other ways, or they can be integrated into a single unit.

[0045] like Figure 7 As shown, Figure 7This is another structural schematic diagram of the feed network stripline assembly in the second embodiment of the millimeter-wave phased array antenna provided in this application. The feed network stripline assembly 52 includes first feed points 71 and second feed points 72. A plurality of first feed points 71 are disposed on the dielectric layer 61 of the first circuit board for corresponding connection to the antenna feed points, and a plurality of second feed points 72 are disposed on the dielectric layer 63 of the second circuit board for corresponding connection to the RF chip feed points. The number of first feed points 71 and second feed points 72 is equal, and the first feed points 71 and second feed points 72 are connected one-to-one through an insulating layer 62. In other embodiments, more first feed points 71 and second feed points 72 may be provided.

[0046] In this embodiment, the arrangement of the first feed point 71 is the same as the arrangement of the antenna feed points in the antenna assembly 51, and the arrangement of the second feed point 72 is the same as the arrangement of the RF chip feed points in the RF chip feed line assembly 53.

[0047] In the process of combining antenna assembly 51, feed network stripline assembly 52 and RF chip feedline assembly 53, antenna assembly 51, as a general-purpose component, can be adapted to various RF chip feedline assemblies 53. RF chip feedline assemblies 53 are divided into various models according to the number and arrangement of RF chip feed points. The appropriate feed network stripline assembly 52 is selected according to the model of the RF chip feed point, and then the corresponding antenna assembly 51 is selected according to the feed network stripline assembly 52. ​​The antenna feed points on antenna assembly 51 are connected one-to-one with the first feed point 71, and the RF chip feed points on RF chip feedline assembly 53 are connected with the second feed point 72 through a contact array packaging and soldering process, thus completing the assembly of antenna assembly 51, feed network stripline assembly 52 and RF chip feedline assembly 53.

[0048] Based on the above technical solutions, the antenna assembly 51 and the RF chip feed line assembly 53 can be manufactured separately without being limited by the model and specifications of the RF chip. Only by configuring the RF chip feed line assembly 53 with the corresponding model of the feed network stripline assembly 52 can the direct connection with the antenna assembly 51 be completed, thereby completing the assembly of the entire antenna. This improves the versatility of the antenna assembly 51 and reduces the number of pressing operations in the production process of the millimeter-wave phased array antenna.

[0049] The first and second embodiments described above are both illustrated using a channel dual-polarized RF chip. For millimeter-wave phased array antennas with multi-channel, multi-beam designs, the RF traces of the feed network stripline assembly will be more numerous and complex. However, based on the technical solution of this application, the antenna assembly is a general-purpose component, and the RF chip feedline assembly directly sets the feed point on the second surface. Combined with the corresponding feed network stripline assembly and a contact array packaging and soldering process, the assembly of the millimeter-wave phased array antenna can be achieved. This method not only improves the versatility of the antenna assembly but also reduces the number of pressing operations during the production process of the millimeter-wave phased array antenna due to the use of a contact array packaging and soldering process.

[0050] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A millimeter-wave phased array antenna, characterized in that, The millimeter-wave phased array antenna includes: Antenna assembly; RF chip feeder assembly; A feed network stripline assembly, wherein the feed network stripline assembly is disposed between the antenna assembly and the RF chip feedline assembly, and is connected to the antenna assembly and the RF chip feedline assembly respectively; the antenna assembly and the feed network stripline assembly, and the RF chip feedline assembly and the feed network stripline assembly are connected by a contact array packaging and soldering process. The feed network stripline assembly includes a first circuit board dielectric layer, an insulating layer, and a second circuit board dielectric layer that are sequentially bonded together, wherein the first circuit board dielectric layer is connected to the antenna assembly, and the second circuit board dielectric layer is connected to the RF chip feedline assembly. A plurality of first power supply points are provided on the dielectric layer of the first circuit board, and a plurality of second power supply points are provided on the dielectric layer of the second circuit board, wherein the number of first power supply points and second power supply points are equal, and the first power supply points and the second power supply points are connected in a one-to-one correspondence. The arrangement of the first feed point is the same as that of the antenna feed point of the antenna assembly, and the arrangement of the second feed point is the same as that of the RF chip feed point of the RF chip feed line assembly; multiple wires are provided in the insulating layer for correspondingly connecting the first feed point and the second feed point.

2. The millimeter-wave phased array antenna according to claim 1, characterized in that, The first circuit board dielectric layer, the insulating layer, and the second circuit board dielectric layer are connected by a pressing process.

3. The millimeter-wave phased array antenna according to claim 1 or 2, characterized in that, The first surface of the antenna assembly away from the RF chip feed line assembly includes multiple antenna patches, and the second surface of the antenna assembly adjacent to and connected to the RF chip feed line assembly includes a number of antenna feed points; the antenna feed points are arranged corresponding to the antenna patches, and the antenna feed points are connected to the first feed points one by one.

4. The millimeter-wave phased array antenna according to claim 3, characterized in that, The antenna patches are arranged in an array on the first surface of the antenna assembly.

5. The millimeter-wave phased array antenna according to any one of claims 1-3, characterized in that, The antenna feed point and the first feed point, as well as the RF chip feed point and the second feed point, are all connected one-to-one through a contact array packaging and soldering process.

6. The millimeter-wave phased array antenna according to claim 1, characterized in that, The RF chip feeder assembly includes multiple RF chips, multiple RF chip channels, and multiple RF chip power supply points, with the RF chip channels evenly arranged on both sides of the RF chips.

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