A method for active thermal management of an integrated power supply of a WBG inverter and a Si inverter in parallel

Abstract

The application provides a kind of WBG inverter and Si inverter parallel integrated power active thermal management method, utilizes aging parameter measurement circuit, real-time online monitoring obtains target temperature-sensitive electrical parameter, obtains real-time junction temperature information, and realizes dynamic safety protection using over-temperature protection circuit;Gradually calculate the average temperature-sensitive electrical parameter and average junction temperature of each inverter in power topology and the entire parallel structure;Get the current aging degree of power topology and the heat dissipation performance of device;Combined with real-time information feedback, control refrigeration system dynamic adjustment liquid pump driven cooling liquid medium to realize effective forced circulation heat dissipation, realize active circulation thermal management;The application realizes reliable circulation heat dissipation, carries out cooling treatment to cooling liquid medium, improves technical level, saves cost.

Description

Technical Field

[0001] This invention relates to the field of power supply thermal management, specifically to an integrated active thermal management method for power supplies where a WBG inverter and a Si inverter are connected in parallel. Background Technology

[0002] In recent years, the unique climate environment and increasingly complex operating conditions of the ocean have placed more stringent demands on the comprehensive performance of power electronic devices, including power density, power capacity, efficiency, cost, and reliability. Developing new integrated power supply equipment and technologies with high reliability, high efficiency, and low cost is of vital importance to the development of my country's independent innovation equipment technology and industry.

[0003] Wide-bandgap (WBG) semiconductor devices and silicon-based devices are mature technologies that dominate the market. Current power supply devices based on a hybrid of wide-bandgap semiconductor devices (such as SiC MOSFETs and GaN HEMTs) and silicon-based devices combine the high switching frequency and low switching loss of wide-bandgap semiconductor devices with the large current carrying capacity of Si IGBTs. This makes it easier to achieve high-performance power supply devices while maintaining higher current capacity at a lower cost. It can make up for the disadvantages of insufficient performance of traditional single devices and is of great significance in meeting the urgent needs of high-performance power supply devices with high reliability, large current capacity and low cost.

[0004] However, while the development of this type of new integrated power supply brings a series of advantages, it also faces enormous challenges. The inverter parallel power supply topology based on a hybrid of wide-bandgap semiconductor devices and silicon-based devices is compact, bulky, and complex in construction. Furthermore, special power supply equipment in marine engineering contexts faces harsh natural environments, complex operating conditions, dense equipment, and interference from marine organisms, making low heat dissipation efficiency a critical problem that urgently needs to be solved. If the heat dissipation performance of the power devices within the device is insufficient, the temperature of the active region of the chip and the junction temperature will rise, leading to an increase in the overall device temperature. The continuously generated heat within the device will gradually jeopardize the overall reliability and lifespan of the integrated power supply. Therefore, thermal management of the integrated power supply is an essential and crucial aspect of the converter structure design in marine engineering special power supplies. Excellent active thermal management strategies and methods are necessary conditions for maintaining the stable, reliable, and efficient operation of the integrated power supply.

[0005] Currently, research on heat dissipation technology for power devices is still in its developmental stage both domestically and internationally. Heat dissipation technologies can be broadly categorized into passive and active cooling methods. Commonly used heat dissipation technologies for power devices include natural air cooling, air cooling, water cooling, and heat pipe cooling. This invention focuses on an integrated power supply using parallel SiC MOSFETs and Si IGBT inverters in marine engineering. It designs a thermal management strategy and method based on online monitoring of junction temperature and aging failure in the integrated power supply, utilizing a special liquid medium for cooling. This thermal management strategy and method can effectively reduce thermal failure caused by overheating or junction temperature fluctuations in the integrated power supply, thereby improving the overall operational reliability of the integrated power supply. Summary of the Invention

[0006] The purpose of this invention is to provide an integrated active thermal management method for a WBG inverter and a Si inverter connected in parallel in special power supply equipment for marine engineering. This method aims to solve problems such as severe losses in core power devices and insufficient overall reliability of special power supply equipment on islands due to environmental factors, thereby improving the stability of the power supply topology, reducing overall equipment losses, and extending lifespan. The integrated active thermal management method for a WBG inverter and a Si inverter connected in parallel according to this invention includes the following steps: An integrated active thermal management method for WBG inverters and Si inverters in parallel is proposed. The method utilizes an aging parameter measurement circuit to monitor and acquire the target temperature-sensitive electrical parameters of power devices in the inverter parallel power supply topology in real time. Based on the relationship between the target temperature-sensitive electrical parameters and the junction temperature of the power devices, the real-time junction temperature information of the power devices is obtained. An over-temperature protection circuit based on the power devices is used to achieve dynamic safety protection. The average temperature-sensitive electrical parameters and average junction temperature of each inverter and the entire parallel structure in the power supply topology are calculated step by step. By combining topology aging standards and device heat dissipation requirements, the current aging level of the power topology connected in parallel with the inverter and the device heat dissipation performance are obtained. By combining real-time information feedback, the refrigeration system dynamically adjusts the liquid pump to drive a special coolant medium to achieve effective forced circulation heat dissipation, thus realizing active circulation thermal management. The specific steps are as follows: S1. Using an external aging parameter measurement circuit, the target temperature-sensitive electrical parameters of the power devices in the power topology of the inverter in a special marine environment are extracted online and monitored in real time. Based on the relationship between the target temperature-sensitive electrical parameters and the junction temperature of the power devices, the real-time junction temperature information of the power devices is obtained. S2. Design an over-temperature protection circuit based on power devices. Based on the aging information of power devices obtained from real-time monitoring and feedback, set up protection mechanisms for the corresponding power devices. S3. The aging information of the power devices obtained from monitoring is transmitted to the computer system in a wireless communication mode. The computer receives and processes the information. The average temperature-sensitive electrical parameters and average junction temperature of each inverter composed of power devices in the power supply topology are obtained through analysis and calculation. Based on the aging information of each inverter, the average temperature-sensitive electrical parameters and average junction temperature of the entire parallel structure are finally obtained through analysis and calculation. Based on the power topology aging standards and the heat dissipation requirements of the device, the current aging degree and heat dissipation performance of the power topology of the inverter in parallel are analyzed. S4. Based on the current aging level and junction temperature information of the power supply topology, control the refrigeration system to dynamically adjust the low-temperature special coolant medium in the storage tank to flow into the liquid pump through the heat dissipation pipe, and under the drive of the liquid pump, deliver it to the heat exchanger. Adjust the heat exchange column on the heat exchanger according to the shape and size of the power device, so that the shape and size of the power device are adapted to the power device, and finally the heat generated by the power device is conducted to the heat exchanger and absorbed by the low-temperature special coolant medium flowing in through each heat dissipation pipe. S5. To prevent the temperature inside the coolant tank from continuously rising due to the continuous circulation and heat absorption of the coolant medium, a temporary storage container is set up for the coolant medium flowing back to the storage tank, and air cooling is used to cool down this part of the coolant medium.

[0007] Furthermore, the aging parameter measurement circuit in step S1 can realize the online extraction and real-time monitoring of the target temperature-sensitive electrical parameters of the power devices in the power topology of the inverter in parallel, and analyze and predict the real-time junction temperature information of the power devices based on the relationship between the target temperature-sensitive electrical parameters and the junction temperature of the power devices. The method for extracting the junction temperature of the power device is the temperature-sensitive electrical parameter method, which selects the optimal temperature-sensitive parameter as the parameter for monitoring the junction temperature and aging status of the power device. Temperature-sensitive parameters of power devices are divided into static temperature-sensitive parameters and dynamic temperature-sensitive parameters. The static temperature-sensitive parameters include threshold voltage. V gs(th) On-state pressure drop V CE On-resistance R ds(on) saturation drain-source current I dss Reverse current I gss The dynamic temperature-sensitive electrical parameters mentioned are mainly related to the time delay. T d(off) Peak gate current I gp Reverse recovery time Trr Rate of increase of starting current d i / d t .

[0008] Furthermore, step S2 involves designing an over-temperature protection circuit and corresponding protection mechanism based on power devices, including the following steps: S21. The real-time junction temperature information of the power device obtained by monitoring is transmitted to the controller using a wireless communication transmission mode, and the memory is used to store and remember the information. S22. The controller analyzes the data based on the real-time junction temperature information feedback to determine the temperature change curve of the power device under the current operating condition. S23. Analyze the temperature values ​​at two adjacent time points on the detection curve, calculate the slope of the curve, and obtain the relevant temperature change curve equation; S24. Based on the real-time junction temperature information and temperature change curve equation of the power devices, calculate the temperature of the two types of power devices after a certain period of time under the current operating conditions, and determine whether it exceeds the set threshold. S25. If the temperature exceeds the set threshold, the controller will activate the over-temperature protection circuit in advance to provide real-time safety protection for the two types of power devices.

[0009] Furthermore, in step S3, wireless communication methods such as Bluetooth, WiFi, NB-IoT, and LoRa can be used to achieve data transmission.

[0010] Furthermore, in step S3, the computer system receives and processes the aging information of the power devices. The processing mainly includes data analysis and calculation, and the specific process includes: The differences in the numerical values ​​of the target temperature-sensitive electrical parameters and junction temperature of each power device in the aging information are analyzed, and the average values ​​are calculated to obtain the average temperature-sensitive electrical parameters and average junction temperature of the corresponding inverter for the power device. Based on the aging information of each inverter obtained from the analysis, the differences in average temperature-sensitive electrical parameters and average junction temperature between each inverter are analyzed, and the average value is calculated to finally obtain the average temperature-sensitive electrical parameters and average junction temperature of the entire parallel structure. Based on the aging information of the parallel structure obtained at the end, the current aging degree and heat dissipation performance of the power supply topology connected in parallel with the inverter are analyzed.

[0011] Furthermore, in step S4, the low-temperature special coolant medium in the refrigeration system storage tank is selected as electronic fluorinated liquid.

[0012] Furthermore, in step S4, the refrigeration system's liquid storage tank is connected to the heat dissipation pipe, and a one-way valve is used to control the outflow of the low-temperature special coolant medium to prevent coolant backflow; the heat exchanger consists of at least one heat exchange column, and an adjustable heat exchange column is selected to adapt to the power device; at the same time, silicone grease is used as a thermal conductive agent during the device heat conduction process. Since there are gaps in the device that are invisible to the naked eye, the silicone grease can fill these gaps. Therefore, by utilizing the adhesiveness of the silicone grease, the heat generated by the power device can be conducted to the heat exchange column without affecting the thermal conductivity.

[0013] Furthermore, in step S5, thermally conductive baffles are respectively set on the surface of the corresponding temporary storage container of coolant to accelerate the heat conduction rate. Through the continuous suction of the liquid pump, the heat flow formed by the low temperature special coolant medium that has fully absorbed heat is extracted into the corresponding coolant storage container at the fastest rate. Cooling fans of the same power are set on the upper side of each container. The cooling fans are used to quickly diffuse the heat in the heat flow to the external environment. This process is continuously circulated to achieve active heat dissipation.

[0014] The integrated active thermal management method for WBG inverters and Si inverters connected in parallel, provided by this invention, achieves the following technical advantages compared to traditional heat dissipation methods: (1) As a thermal management method for an integrated power supply connected in parallel with an inverter, the target temperature-sensitive electrical parameters are obtained through real-time monitoring of power devices. T sep And obtain the real-time junction temperature of the device ( T j The average temperature-sensitive electrical parameters and average junction temperature of each inverter and the entire parallel structure in the power supply topology are analyzed and calculated step by step. Combining topology aging standards and device heat dissipation requirements, the aging degree and heat dissipation performance of the power supply topology with inverters in parallel are analyzed. Based on the analysis results, the relevant modules in the cooling system are dynamically controlled to operate in an orderly and reliable manner to achieve cyclic heat dissipation. During cyclic heat dissipation, the valve switches of the heat dissipation pipes corresponding to the power devices are opened to control the unidirectional flow of the low-temperature special coolant into the liquid pump. Combined with real-time information feedback, the liquid pump of the cooling system is dynamically adjusted to drive the special coolant to achieve effective cyclic heat dissipation. During the process of controlling the coolant to flow back to the storage tank, temporary storage containers are set up for the coolant flowing through the power devices to cool this portion of the coolant, thereby achieving the purpose of recycling, improving the technical level, and saving costs.

[0015] (2) The method proposed in this invention emphasizes the word "active" by targeting the temperature-sensitive electrical parameters of the power devices in the power supply topology of the inverter in parallel ( T sep Real-time online monitoring and analysis predicts the real-time junction temperature of power devices. T jThis reflects the aging status of power devices, and designs an over-temperature protection circuit based on the power devices, setting corresponding protection mechanisms; based on the acquired power device aging information, the over-temperature protection circuit is controlled in advance to provide dynamic safety protection for the power devices; based on the target temperature-sensitive electrical parameters of the power devices obtained through real-time monitoring (… T sep ) and junction temperature ( T j Then, the average temperature-sensitive electrical parameters and average junction temperature of each inverter and the entire parallel structure within the power supply topology are gradually obtained through analysis and calculation. The average temperature-sensitive electrical parameters and average junction temperature of the parallel structure are used as the standard for analyzing and judging the aging degree and heat dissipation performance of the power supply topology.

[0016] (3) The strategy proposed in this invention is applied to the field of special power equipment in the context of marine engineering. This thermal management strategy fully considers that the power topology based on the parallel connection of power device inverters may have different aging levels and heat dissipation performance due to different power devices. It sets up heat dissipation pipes and liquid pump valve switches for each power device. Based on real-time monitoring information and target heat dissipation requirements, it dynamically and differentially adjusts each liquid pump of the refrigeration system to drive a special coolant medium to achieve circulating heat dissipation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the active thermal management method of the present invention; Figure 2 This is a flowchart of the active thermal management method of the present invention; Figure 3 This is a flowchart illustrating the over-temperature protection of power devices according to the present invention; Figure 4 This is a power supply topology diagram based on parallel connection of SiC MOSFETs and Si IGBT inverters; Figure 5 This is a schematic diagram of the refrigeration system structure of the present invention; Figure 6 This is a control block diagram for controlling the circulation and heat dissipation of the coolant medium in the refrigeration system according to the present invention; In the diagram: 1. Computer system; 2. Over-temperature protection circuit; 3. Power topology based on parallel connection of WBG and Si power devices (SiC MOSFET and SiIGBT) inverter; 4. Aging parameter measurement circuit; 5. Liquid storage tank; 6. SiC MOSFET circulating liquid pump; 7. SiC MOSFET heat exchanger; 8. SiC MOSFET heat dissipation pipe; 9. SiC MOSFET coolant container; 10. Si IGBT circulating liquid pump; 11. Si IGBT heat exchanger; 12. Si IGBT heat dissipation pipe; 13. Si IGBT coolant container; 14. Cooling fan; 15. First liquid storage tank outlet valve; 16. Second liquid storage tank outlet valve; 17. SiC MOSFET coolant container outlet valve; 18. Si IGBT coolant container outlet valve. Detailed Implementation

[0018] First, it should be noted that WBG stands for Wide Bandgap Semiconductor Device, and Si stands for Silicon-based Device, referred to as a power device in this invention. The invention will now be further described in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0019] Example 1 This embodiment takes SiC MOSFET in WBG and Si IGBT in Si as examples. The overall structural diagram and overall flowchart of the active thermal management method of this invention are as follows: Figure 1 and Figure 2 First, using an external aging parameter measurement circuit, the target temperature-sensitive electrical parameters of each power device (taking SiC MOSFET and Si IGBT as examples) in a power supply topology structure based on WBG and Si power devices (SiC MOSFET and Si IGBT) inverters connected in parallel are measured for a certain period of time under special marine environment and complex working conditions. T sep Online extraction and real-time monitoring are performed based on the target's temperature-sensitive electrical parameters. T sep ) and the junction temperature of power devices ( T j The relationship between the two is analyzed to predict the real-time junction temperature information of the power devices. The power supply topology based on parallel SiC MOSFETs and Si IGBT inverters is shown below. Figure 4 As shown, it includes an input terminal, an inverter circuit, a filter circuit, a common load terminal, and an output terminal connected in sequence.

[0020] Secondly, an over-temperature protection circuit 2 based on SiC MOSFET and Si IGBT power devices is designed. Corresponding protection mechanisms are set according to the aging information of the power devices obtained through real-time monitoring and feedback. The specific over-temperature protection process for the power devices is as follows: Figure 3 As shown, the controller receives real-time junction temperature information of the power devices, the memory realizes the function of saving and recording, analyzes and obtains the temperature change curves corresponding to each power device, analyzes and calculates the temperature change curve equations of each power device, uses the temperature change curve equations to calculate the temperature of the power devices after a certain period of time under the operating condition, and determines whether the temperature exceeds the set threshold. If so, the over-temperature protection circuit 2 is controlled to perform over-temperature protection of the power devices in advance; otherwise, the next step is executed.

[0021] Next, the aging information of the monitored power devices is transmitted to computer system 1 via wireless communication. The computer receives and processes the information, and through analysis and calculation, firstly obtains the average temperature-sensitive electrical parameters and average junction temperature of each inverter composed of power devices in the power topology; then, based on the aging information results of each inverter, it analyzes and calculates to finally obtain the average temperature-sensitive electrical parameters and average junction temperature of the entire parallel structure; combining the power topology aging standard and the device heat dissipation requirements, it analyzes the current aging degree and heat dissipation performance of the power topology based on SiCMOSFET and Si IGBT inverters in parallel; finally, based on the current aging degree and junction temperature information of the power topology, and combined with the target heat dissipation requirements, it controls the cooling system to dynamically adjust the inflow of low-temperature special coolant medium in the liquid storage tank 5, and under the drive of the liquid pump, absorbs the heat generated by the power devices, ultimately achieving the purpose of heat dissipation.

[0022] The structure of the refrigeration system and the cooling fluid circulation process in the active thermal management strategy are as follows: Figure 5 and Figure 6 As shown, the refrigeration system mainly includes a liquid storage tank 5, a SiC MOSFET circulating liquid pump 6, a Si IGBT circulating liquid pump 10, a SiC MOSFET heat exchanger 7, a Si IGBT heat exchanger 11, a SiC MOSFET coolant container 9, a Si IGBT coolant container 13, two cooling fans 14 of the same power, a SiC MOSFET heat dissipation pipe 8, a Si IGBT heat dissipation pipe 12, and corresponding valve switches.

[0023] To prevent the temperature inside the cooling system's liquid storage tank 5 from continuously rising due to the heat absorption caused by the continuous circulation of the coolant medium, a temporary storage container corresponding to the coolant flowing through the SiC MOSFET and Si IGBT is set up during the return flow of the coolant medium to the liquid storage tank 5, and air cooling is used to cool down this part of the coolant medium.

[0024] The computer controller dynamically adjusts the flow of the low-temperature special coolant medium from the outlet valve 15 of the first storage tank and the outlet valve 16 of the second storage tank. The medium flows through the heat dissipation pipes of each power device to the inlet of its respective circulating pump. Driven by the high-speed operation of the circulating pump, it is delivered to its corresponding heat exchanger. The length of the heat exchange column on the heat exchanger is adjusted according to the shape, size, and length of the SiC MOSFET and Si IGBT to ensure compatibility with the power devices. Ultimately, the heat generated by the power devices is conducted to the heat exchanger and fully absorbed by the low-temperature special coolant medium flowing into each heat dissipation pipe. The coolant medium, having absorbed heat, flows out through the pump outlet valve using the suction action of the circulating pump. To prevent the temperature inside the refrigeration system's storage tank from continuously rising due to heat absorption during continuous circulation, a corresponding flow path is set along the coolant medium's return flow to storage tank 5, passing through the SiC MOSFET and Si IGBT. The temporary storage container for IGBT coolant. After the coolant medium flows into the corresponding container, the cooling fan 14 is used to cool the medium. After the cooling process is completed, the outlet valves of the respective coolant containers (SiC MOSFET coolant container outlet valve 17, Si IGBT coolant container outlet valve 18) are opened to allow the coolant medium to flow back to the storage tank 5 through the heat dissipation pipe.

[0025] Example 2 An integrated active thermal management method for parallel WBG inverters and Si inverters is disclosed. This method utilizes an aging parameter measurement circuit to monitor and acquire target temperature-sensitive electrical parameters of power devices in the parallel power topology in real time. Based on the relationship between these target temperature-sensitive electrical parameters and the junction temperatures of the power devices, real-time junction temperature information of the power devices is obtained. An over-temperature protection circuit based on the power devices is then used to achieve dynamic safety protection. The average temperature-sensitive electrical parameters and average junction temperatures of each inverter and the entire parallel structure in the power topology are calculated progressively. Combining topology aging standards and device heat dissipation requirements, the current aging level and heat dissipation performance of the parallel power topology are obtained. Based on real-time information feedback, the cooling system is controlled to dynamically adjust the liquid pump to drive a special coolant medium to achieve effective forced circulation heat dissipation, thus realizing active circulation thermal management.

[0026] The specific steps are as follows: S1. Using an external aging parameter measurement circuit, the target temperature-sensitive electrical parameters of the power devices in the parallel power supply topology of inverters operating in a special marine environment are extracted online and monitored in real time. Based on the relationship between the target temperature-sensitive electrical parameters and the junction temperature of the power devices, the real-time junction temperature information of the power devices is obtained. S2. An over-temperature protection circuit based on the power devices is designed. Based on the aging information of the power devices obtained through real-time monitoring and feedback, protection mechanisms are set for the corresponding power devices. S3. The monitored aging information of the power devices is transmitted to the computer system via wireless communication. The computer receives and processes the information. The average temperature-sensitive electrical parameters and average junction temperature of each inverter composed of power devices in the power supply topology are obtained through analysis and calculation. Based on the aging information results of each inverter, the average temperature-sensitive electrical parameters and average junction temperature of the entire parallel structure are finally obtained through analysis and calculation. Combining the power supply topology aging standards and the device's heat dissipation requirements, the current aging degree and heat dissipation performance of the parallel power supply topology of inverters are analyzed. S4. Based on the current aging level and junction temperature information of the power supply topology, the refrigeration system dynamically adjusts the flow of the low-temperature special coolant medium from the storage tank into the liquid pump via the heat dissipation pipes. Driven by the liquid pump, the coolant is then transported to the heat exchanger. The heat exchange columns on the heat exchanger are adjusted according to the shape and size of the power devices to ensure compatibility. Ultimately, the heat generated by the power devices is conducted to the heat exchanger and absorbed by the low-temperature special coolant medium flowing through the heat dissipation pipes. S5. To prevent the temperature inside the storage tank from continuously rising due to heat absorption during continuous circulation, a temporary storage container is set up along the coolant medium's return flow path to the storage tank. This portion of the coolant medium is cooled using air cooling.

[0027] In step S1, the aging parameter measurement circuit enables online extraction and real-time monitoring of target temperature-sensitive electrical parameters of power devices in a power topology connected in parallel with the inverter. Based on the relationship between these target temperature-sensitive electrical parameters and the junction temperature of the power devices, it analyzes and predicts the real-time junction temperature information of the power devices. The method for extracting the junction temperature of the power devices is the temperature-sensitive electrical parameter method, which selects the optimal temperature-sensitive parameter as the parameter for monitoring the junction temperature and aging status of the power devices. The temperature-sensitive parameters of the power devices are divided into static temperature-sensitive electrical parameters and dynamic temperature-sensitive electrical parameters. The static temperature-sensitive electrical parameters include the threshold voltage. V gs(th) On-state pressure drop V CE On-resistance R ds(on) saturation drain-source current I dss Reverse current I gss The dynamic temperature-sensitive electrical parameters mentioned are mainly related to the time delay. Td(off) Peak gate current I gp Reverse recovery time T rr Rate of increase of starting current d i / d t .

[0028] Step S2 involves designing an over-temperature protection circuit and corresponding protection mechanism based on power devices, including the following steps: S21. The real-time junction temperature information of the monitored power devices is transmitted to the controller via wireless communication, and the memory stores the information. S22. The controller analyzes the data based on the real-time junction temperature feedback to determine the temperature change curve corresponding to the power devices under the current operating conditions. S23. The controller analyzes the temperature values ​​at two adjacent time points on the detection curve, calculates the slope of the curve, and obtains the relevant temperature change curve equation. S24. Based on the real-time junction temperature information and the temperature change curve equation, the controller calculates the temperature of the two types of power devices after a certain period of time under the current operating conditions and determines whether it exceeds a set threshold. S25. If the temperature exceeds the set threshold, the controller proactively activates the over-temperature protection circuit to provide real-time safety protection for the two types of power devices.

[0029] In step S3, wireless communication methods such as Bluetooth, WiFi, NB-IoT, and LoRa can be used to achieve data transmission.

[0030] In step S3, the computer system receives and processes the aging information of the power devices. The processing mainly includes data analysis and calculation, and the specific process includes: The differences in target temperature-sensitive electrical parameters and junction temperatures for each power device in the aging information are analyzed, and the average values ​​are calculated to obtain the average temperature-sensitive electrical parameters and average junction temperatures of the corresponding inverters. Based on the aging information results of each inverter, the differences in average temperature-sensitive electrical parameters and average junction temperatures between inverters are analyzed, and the average values ​​are calculated to obtain the average temperature-sensitive electrical parameters and average junction temperatures of the entire parallel structure. Based on the aging information of the parallel structure, the current aging degree and heat dissipation performance of the power topology with inverters connected in parallel are analyzed.

[0031] In step S4, the low-temperature special coolant medium in the refrigeration system's storage tank is selected as electronic fluorinated liquid.

[0032] In step S4, the refrigeration system's liquid storage tank is connected to the heat dissipation pipe, and a one-way valve is used to control the outflow of the low-temperature special coolant medium to prevent coolant backflow. The heat exchanger consists of at least one heat exchange column, and an adjustable heat exchange column is selected to adapt to the power devices. At the same time, silicone grease is used as a thermal conductive agent during the device heat conduction process. Since there are gaps in the device that are invisible to the naked eye, the silicone grease can fill these gaps. Therefore, by utilizing the adhesive properties of the silicone grease, the heat generated by the power devices can be conducted to the heat exchange column without affecting the thermal conductivity.

[0033] In step S5, thermally conductive baffles are installed on the surface of the corresponding temporary coolant storage containers to accelerate the heat conduction rate. Through continuous pumping, the heat flow formed by the low-temperature special coolant medium that has fully absorbed heat is extracted into the corresponding coolant storage containers at the fastest rate. Cooling fans of the same power are installed on the upper side of each container. The cooling fans are used to quickly diffuse the heat in the heat flow to the external environment. This process is continuously circulated to achieve active heat dissipation.

[0034] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated active thermal management method for a power supply with a WBG inverter and a Si inverter connected in parallel, characterized in that, Using an aging parameter measurement circuit, the target temperature-sensitive electrical parameters of power devices in the inverter parallel power supply topology are monitored and obtained in real time. Based on the relationship between the target temperature-sensitive electrical parameters and the junction temperature of the power devices, the real-time junction temperature information of the power devices is obtained, and an over-temperature protection circuit based on the power devices is used to achieve dynamic safety protection. The average temperature-sensitive electrical parameters and average junction temperature of each inverter and the entire parallel structure in the power supply topology are calculated step by step. By combining topology aging standards and device heat dissipation requirements, the current aging level of the power topology connected in parallel with the inverter and the device heat dissipation performance are obtained. By combining real-time information feedback, the refrigeration system can be dynamically adjusted to drive the liquid pump to drive the coolant medium to achieve effective forced circulation and heat dissipation, thus realizing active circulation thermal management. The specific steps are as follows: S1. Using an external aging parameter measurement circuit, the target temperature-sensitive electrical parameters of the power devices in the power topology of the inverter in a special marine environment are extracted online and monitored in real time. Based on the relationship between the target temperature-sensitive electrical parameters and the junction temperature of the power devices, the real-time junction temperature information of the power devices is obtained. S2. Design an over-temperature protection circuit based on power devices. Based on the aging information of power devices obtained from real-time monitoring and feedback, set up protection mechanisms for the corresponding power devices. S3. The aging information of the power devices obtained from monitoring is transmitted to the computer system in a wireless communication mode. The computer receives and processes the information. The average temperature-sensitive electrical parameters and average junction temperature of each inverter composed of power devices in the power supply topology are obtained through analysis and calculation. Based on the aging information of each inverter, the average temperature-sensitive electrical parameters and average junction temperature of the entire parallel structure are finally obtained through analysis and calculation. Based on the power topology aging standards and the heat dissipation requirements of the device, the current aging degree and heat dissipation performance of the power topology of the inverter in parallel are analyzed. S4. Based on the current aging level and junction temperature information of the power supply topology, control the refrigeration system to dynamically adjust the low-temperature special coolant medium in the storage tank to flow into the liquid pump through the heat dissipation pipe, and under the drive of the liquid pump, deliver it to the heat exchanger. Adjust the heat exchange column on the heat exchanger according to the shape and size of the power device, so that the shape and size of the power device are adapted to the power device, and finally the heat generated by the power device is conducted to the heat exchanger and absorbed by the low-temperature special coolant medium flowing in through each heat dissipation pipe. S5. To prevent the temperature inside the coolant tank from continuously rising due to the continuous circulation and heat absorption of the coolant medium, a temporary storage container is set up for the coolant medium flowing back to the storage tank, and air cooling is used to cool down this part of the coolant medium.

2. The integrated active thermal management method for a WBG inverter and a Si inverter connected in parallel, as described in claim 1, is characterized in that... The aging parameter measurement circuit in step S1 can realize the online extraction and real-time monitoring of the target temperature-sensitive electrical parameters of the power devices in the power topology of the inverter in parallel, and analyze and predict the real-time junction temperature information of the power devices based on the relationship between the target temperature-sensitive electrical parameters and the junction temperature of the power devices. The method for extracting the junction temperature of the power device is the temperature-sensitive electrical parameter method, which selects the optimal temperature-sensitive parameter as the parameter for monitoring the junction temperature and aging status of the power device. Temperature-sensitive parameters of power devices are divided into static temperature-sensitive parameters and dynamic temperature-sensitive parameters. The static temperature-sensitive parameters include threshold voltage. V gs(th) On-state pressure drop V CE On-resistance R ds(on) saturation drain-source current I dss Reverse current I gss The dynamic temperature-sensitive electrical parameters mentioned are mainly related to the time delay. T d(off) Peak gate current I gp Reverse recovery time T rr Rate of increase of starting current d i / d t .

3. The integrated active thermal management method for a WBG inverter and a Si inverter connected in parallel according to claim 1, characterized in that, Step S2 involves designing an over-temperature protection circuit and corresponding protection mechanism based on power devices, including the following steps: S21. The real-time junction temperature information of the power device obtained by monitoring is transmitted to the controller using a wireless communication transmission mode, and the memory is used to store and remember the information. S22. The controller analyzes the data based on the real-time junction temperature information feedback to determine the temperature change curve of the power device under the current operating condition. S23. Analyze the temperature values ​​at two adjacent time points on the detection curve, calculate the slope of the curve, and obtain the relevant temperature change curve equation; S24. Based on the real-time junction temperature information and temperature change curve equation of the power devices, calculate the temperature of the two types of power devices after a certain period of time under the current operating conditions, and determine whether it exceeds the set threshold. S25. If the temperature exceeds the set threshold, the controller will activate the over-temperature protection circuit in advance to provide real-time safety protection for the two types of power devices.

4. The integrated active thermal management method for a WBG inverter and a Si inverter connected in parallel, as described in claim 1, is characterized in that... In step S3, wireless communication methods such as Bluetooth, WiFi, NB-IoT, and LoRa can be used to achieve data transmission.

5. The integrated active thermal management method for a WBG inverter and a Si inverter connected in parallel according to claim 1, characterized in that, In step S3, the computer system receives and processes the aging information of the power devices. The processing mainly includes data analysis and calculation, and the specific process includes: The differences in the numerical values ​​of the target temperature-sensitive electrical parameters and junction temperature of each power device in the aging information are analyzed, and the average values ​​are calculated to obtain the average temperature-sensitive electrical parameters and average junction temperature of the corresponding inverter for the power device. Based on the aging information of each inverter obtained from the analysis, the differences in average temperature-sensitive electrical parameters and average junction temperature between each inverter are analyzed, and the average value is calculated to finally obtain the average temperature-sensitive electrical parameters and average junction temperature of the entire parallel structure. Based on the aging information of the parallel structure obtained at the end, the current aging degree and heat dissipation performance of the power supply topology connected in parallel with the inverter are analyzed.

6. The integrated active thermal management method for a WBG inverter and a Si inverter connected in parallel according to claim 1, characterized in that, In step S4, the low-temperature special coolant medium in the refrigeration system's storage tank is selected as electronic fluorinated liquid.

7. The integrated active thermal management method for a WBG inverter and a Si inverter connected in parallel according to claim 1, characterized in that, In step S4, the refrigeration system's liquid storage tank is connected to the heat dissipation pipe, and a one-way valve is used to control the outflow of the low-temperature special coolant medium to prevent coolant backflow. The heat exchanger consists of at least one heat exchange column, and an adjustable heat exchange column is selected to accommodate the power devices. Meanwhile, silicone grease is used as a thermal conductive agent during the heat conduction process of the devices. Since there are gaps in the devices that are invisible to the naked eye, the silicone grease can fill these gaps. Therefore, by utilizing the adhesive properties of the silicone grease, the heat generated by the power devices can be conducted to the heat exchange column without affecting the thermal conductivity.

8. The integrated active thermal management method for a WBG inverter and a Si inverter connected in parallel according to claim 1, characterized in that, In step S5, thermally conductive baffles are installed on the surface of the corresponding temporary coolant storage containers to accelerate the heat conduction rate. Through continuous pumping, the heat flow formed by the low-temperature special coolant medium that has fully absorbed heat is extracted into the corresponding coolant storage containers at the fastest rate. Cooling fans of the same power are installed on the upper side of each container. The cooling fans are used to quickly diffuse the heat in the heat flow to the external environment. This process is continuously circulated to achieve active heat dissipation.

Images