Internet of things host with high heat dissipation function

Abstract

The application relates to the technical field of Internet of Things devices, and discloses an Internet of Things host with high-efficiency heat dissipation function, wherein a heat dissipation fan module is arranged in the shell and close to a cover plate, and the air supply direction of the heat dissipation fan module is from bottom to top; a plurality of cooling modules are arranged on the upper plate surface of the bottom plate in sequence, and the cooling modules are vertically plate-shaped; the Internet of Things host can realize active heat dissipation of the host through the heat dissipation fan module, so as to improve the heat dissipation efficiency. The heat exchange liquid filled in the closed inner cavity can have a physical cooling function after being frozen. During the operation of the heat dissipation fan module, external air enters from the air inlet at the lower part of the side wall of the shell and passes through the air ducts between the cooling modules, so that the cooling modules cool the airflow, the low-temperature airflow is discharged upwards from the air outlet interval and passes through the operating mainboard, the low-temperature airflow not only quickly takes away the heat generated by the mainboard, but also cools the mainboard, so that the heat dissipation effect is better.

Description

Technical Field

[0001] This invention relates to the field of Internet of Things (IoT) device technology, and more particularly to an IoT host with efficient heat dissipation function. Background Technology

[0002] Originating in the media industry, the Internet of Things (IoT) represents the third revolution in the information technology industry. The IoT connects any object to a network via information sensing devices and agreed-upon protocols. Objects exchange and communicate information through communication media to achieve intelligent identification, location, tracking, and monitoring functions.

[0003] The Industrial Internet of Things (IIoT) integrates machines, cloud computing, analytics, and people to improve the performance and productivity of industrial processes. With IIoT, industrial companies can digitize processes, transform business models, improve performance and productivity, and reduce waste. Asset-intensive companies across multiple industries, including manufacturing, energy, agriculture, transportation, and utilities, are working on IoT projects that can connect billions of devices and deliver value in various use cases, including predictive quality and maintenance analytics, asset condition monitoring, and process optimization. IoT host devices, acting as hubs in the IIoT, maintain its normal operation; a similar IoT host is disclosed in utility model patent CN217116119U.

[0004] During operation, the aforementioned IoT host generates a significant amount of heat through its internal motherboard. To ensure stable operation, heat sink fins are installed on the casing for passive cooling. However, due to the slow airflow around the heat sink fins, the cooling effect is inadequate. If the host operates under high load for extended periods, the heat sink fins may fail to meet the device's cooling requirements. Excessive operating temperature can lead to frequency throttling or even system crashes, thus requiring further improvement. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides an IoT host with efficient heat dissipation capabilities. By utilizing a cooling fan module and a cooling module, the host can achieve active heat dissipation and physical cooling, thereby improving the device's heat dissipation performance and making the device operate more stably.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] An IoT host with efficient heat dissipation includes a housing and a motherboard disposed within the housing. The housing is a vertical rectangular tube, with a cover plate at the top and a bottom plate at the bottom. Air vents are distributed on the surface of the cover plate. A cooling fan module is disposed within the housing near the cover plate, with the fan blowing air from bottom to top. Multiple cooling modules are arranged sequentially on the upper surface of the bottom plate. Each cooling module is a vertical plate and detachably connected to the bottom plate. Each cooling module has a sealed inner cavity filled with a heat exchange liquid. The surfaces of adjacent cooling modules are arranged opposite each other and are aligned. The cooling modules are parallel to each other, with their plates abutting against the two opposite side walls inside the housing. An air duct is formed between the adjacent cooling modules. An air inlet is passed through the side wall of the housing and connected to one of the ports of the air duct. The area where the upper side of all cooling modules is located is covered by a baffle plate. One edge of the baffle plate extends to the air inlet, and the other edge of the baffle plate maintains an air outlet gap with the inner side wall of the housing relative to the air inlet. The main board is located between the cooling fan module and the cooling module. The plate of the main board is parallel to the inner side wall of the housing corresponding to the air outlet gap and is located above the air outlet gap.

[0008] Using the above solution, the cooling fan module enables active cooling of the IoT host, thereby improving heat dissipation efficiency. The heat exchange liquid filled in the sealed cavity, after freezing, enables the cooling module to have a physical cooling function. During operation, external air enters through the air inlet at the bottom of the casing side wall and passes through the air ducts between the cooling modules. The airflow is cooled by the cooling modules, and the low-temperature airflow is discharged upward through the air outlet and passes over the running motherboard. This not only quickly removes the heat generated by the motherboard but also cools the motherboard further, resulting in better heat dissipation. The airflow over the motherboard is finally discharged through the air outlet on the cover, achieving air exchange between the host and the outside. The baffle plate effectively restricts the flow direction of the outside air after passing through the air inlet, forcing the airflow to pass through the air ducts between the cooling modules and then be discharged upward through the air outlet, thus ensuring sufficient cooling of the airflow and improving the host's heat dissipation effect.

[0009] Preferably, the cooling fan module includes a motor with its output shaft facing upward and fan blades mounted on the output shaft, with a bracket fixed to the inner wall of the housing on the motor.

[0010] Using the above solution, the output shaft of the motor drives the fan blades to rotate at high speed, which can quickly remove the hot air inside the main unit casing and introduce the low-temperature air from the outside into the casing, thereby realizing the active heat dissipation of the cooling fan module.

[0011] Preferably, the upper surface of the base plate has multiple mounting protrusions that correspond one-to-one with multiple cooling modules. The mounting protrusions are arranged along the plate surface direction of the cooling modules, and the upper surface of the mounting protrusions has a slot along its length for the side of the corresponding cooling module to engage.

[0012] The above solution features a simple and convenient snap-fit ​​mechanism between the side of the cooling module and the slot, enabling quick assembly and disassembly of the cooling module on the base plate while ensuring the stability of the cooling module after installation.

[0013] Preferably, the upper side of the air inlet extends into a slot for inserting a baffle plate horizontally into the housing and for sliding the baffle plate surface onto the cooling module.

[0014] The above solution allows for quick assembly and disassembly of the baffle plate via a plug-in connection with the slot. Removing the baffle plate further facilitates the assembly and disassembly of the cooling module, thus improving operational efficiency.

[0015] Preferably, the lower surface of the baffle plate extends vertically with a dustproof plate for covering the air inlet, and the surface of the dustproof plate has air inlet holes.

[0016] By adopting the above solution, the dustproof plate can reduce the amount of dust entering the air inlet and isolate larger foreign objects from the outside, making the main unit operate more stably. At the same time, the baffle plate and the dustproof plate can be disassembled and assembled simultaneously, further improving the efficiency and convenience of disassembly and assembly of the cooling module.

[0017] Preferably, the wind deflector extends upward along the edge away from the air outlet interval and has a limiting plate for abutting against the outer wall of the housing to prevent the wind deflector from being over-inserted into the slot. A gripping plate extends along the lower side of the limiting plate in the direction of its plate surface.

[0018] Using the above solution, the limiting plate not only restricts the insertion stroke of the baffle into the slot, making the installation and removal of the baffle more precise and convenient, but also seals the gap between the slot and the baffle, making the air inlet the only channel for outside air to enter the housing, thus ensuring the heat dissipation and cooling effects of the cooling fan module and the cooling module. The grip plate makes the removal and disassembly of the baffle even more convenient.

[0019] Preferably, guide strips are provided on the inner sidewalls of the housing corresponding to both ends of the slot. The guide strips are horizontally arranged and maintain a sliding interval between them and the upper side of the cooling module to allow the side of the baffle plate to slide.

[0020] With the above solution, after the baffle plate enters the housing along the slot, the guide strip can ensure that the baffle plate always slides against the upper side of the cooling module, thereby improving the installation accuracy and convenience of the baffle plate.

[0021] Preferably, the wind deflector has guide rods extending along the surface of the wind deflector at both ends of the edge near the air outlet interval for insertion into slots, and the side wall of the housing relative to the air inlet has a insertion groove for the two guide rods to be inserted one-to-one.

[0022] Preferably, the two guide rods have opposing positioning holes on their opposite surfaces at a position away from the wind deflector. When the wind deflector is inserted into the slot and the limiting plate abuts against the outer wall of the housing, the two guide rods can be inserted into the corresponding insertion slots and the positioning holes can slide to the outside of the housing. When the positioning holes are located on the outside of the housing, a locking rod is inserted into the two positioning holes to prevent the ends of the guide rods from disengaging from the positioning holes. The two ends of the locking rods extend beyond the opposing ports of the two positioning holes, and the two extended portions are respectively provided with a gripping part and a positioning through hole. A positioning screw is inserted into the positioning through hole.

[0023] Using the above solution, when the wind deflector is inserted into the slot and installed in place, the two guide rods can be simultaneously inserted into their corresponding insertion slots, causing the positioning holes to shift to the outer wall of the housing. At this point, inserting the locking rod into the two positioning holes prevents the ends of the guide rods from disengaging from the insertion slots, thus limiting the horizontal position of the wind deflector within the slot. The grip facilitates the installation and removal of the locking rod, and by inserting the positioning screw into the positioning through hole, the locking rod is prevented from disengaging from the positioning hole, making the locking state of the wind deflector more stable.

[0024] Preferably, the outer wall of the housing is provided with a start / stop unit and a through-beam infrared sensor. The start / stop unit is coupled to a control module for controlling the start / stop of the motherboard. The through-beam infrared sensor includes a transmitting unit and a receiving unit arranged longitudinally opposite each other. The transmitting unit is used to emit infrared rays, and the receiving unit is coupled to the control module to receive the infrared rays and send a corresponding detection signal to the control module according to whether the infrared rays are received.

[0025] When the start / stop unit responds to an external trigger, the control module first uses a through-beam infrared sensor to determine the infrared blocking status. If the locking rod is simultaneously inserted into the two positioning holes so that the rod body passes through the gap between the transmitting unit and the receiving unit to block the infrared light emitted by the transmitting unit, the control module controls the main board to start.

[0026] Conversely, if the infrared rays emitted by the transmitting unit are not blocked so that the receiving unit can receive them, the control module will not control the motherboard to start.

[0027] Using the above scheme, the mainboard inside the host can only be started to enable normal operation after the locking rod is simultaneously inserted into both positioning holes to lock the installation position of the guide rod and the baffle. Conversely, if the baffle is not locked, in order to prevent the baffle from shifting position during host operation, the control module will not control the mainboard to start, thus keeping the host in a stopped state and avoiding misoperation.

[0028] This invention, employing the above technical solutions, achieves significant technical effects: The cooling fan module enables active heat dissipation of the IoT host, improving heat dissipation efficiency. The heat exchange liquid filled in the sealed cavity, after freezing, provides the cooling module with physical cooling functionality. During operation, external air enters through the air inlet below the side wall of the casing and passes through the air ducts between the cooling modules. The airflow is cooled by the cooling modules, and the low-temperature airflow is discharged upwards through the air outlet and passes over the running motherboard. This not only quickly removes the heat generated by the motherboard but also cools the motherboard further, resulting in better heat dissipation. The airflow over the motherboard is finally discharged through the air outlet on the cover, facilitating air exchange between the host and the outside environment. The baffle plate effectively restricts the flow of outside air after passing through the air inlet, forcing the airflow to pass through the air ducts between the cooling modules and then be discharged upwards through the air outlet, thus ensuring sufficient cooling and improving the host's heat dissipation effect. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of this embodiment. Figure 1 ;

[0030] Figure 2 This is a schematic diagram of the structure of this embodiment. Figure 2 ;

[0031] Figure 3 This is a schematic diagram of the cooling fan module in this embodiment;

[0032] Figure 4 For the explosion in this embodiment Figure 1 ;

[0033] Figure 5 For the explosion in this embodiment Figure 2 ;

[0034] Figure 6 This is a schematic diagram of the cooling module in this embodiment;

[0035] Figure 7 for Figure 4 An enlarged schematic diagram of part A shown;

[0036] Figure 8 for Figure 4 An enlarged schematic diagram of part B is shown below;

[0037] Figure 9 for Figure 5 An enlarged schematic diagram of section C is shown below;

[0038] Figure 10 This is a schematic diagram of the structure of this embodiment. Figure 3 ;

[0039] Figure 11 For the explosion in this embodiment Figure 3 ;

[0040] Figure 12 for Figure 10 An enlarged schematic diagram of part D is shown below;

[0041] Figure 13 This is a system architecture diagram for this embodiment.

[0042] The parts referred to by the numbers in the attached diagrams are as follows: 1. Housing; 2. Mainboard; 3. Cover plate; 4. Base plate; 5. Air outlet; 6. Cooling fan module; 7. Cooling module; 8. Sealed inner cavity; 9. Air duct; 10. Air inlet; 11. Baffle plate; 12. Air outlet spacing; 13. Output shaft; 14. Motor; 15. Fan blade; 16. Bracket; 17. Mounting protrusion; 18. Slot; 19. Slot; 20. Dustproof plate; 21. Air inlet; 22. Limiting plate; 23. Grip plate; 24. Guide strip; 25. Sliding interval; 26. Guide rod; 27. Insertion slot; 28. Positioning hole; 29. ​​Locking rod; 30. Grip; 31. Positioning through hole; 32. Positioning screw; 33. Start / stop unit; 34. Through-beam infrared sensor; 35. Control module; 36. Transmitting unit; 37. Receiving unit; 38. Mounting plate; 39. Ventilation interval; 40. Mounting post; 41. Interface module; 42. Clearance hole; 43. Groove. Detailed Implementation

[0043] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0044] like Figure 1 , Figure 2 and Figure 3 As shown, this embodiment discloses an IoT host with efficient heat dissipation function, including a housing 1 and a motherboard 2 disposed within the housing 1. The housing 1 is a vertical rectangular tube, with a cover plate 3 and a bottom plate 4 respectively disposed at the upper and lower ports. The surface of the cover plate 3 is distributed with multiple air outlet holes 5. A cooling fan module 6 is disposed inside the housing 1 near the cover plate 3. The airflow direction of the cooling fan module 6 is from bottom to top. Specifically, the cooling fan module 6 includes a motor 14 with its output shaft 13 facing upward and fan blades 15 disposed on the output shaft 13. A bracket 16 fixed to the inner side wall of the housing 1 is disposed on the motor 14, thereby realizing active heat dissipation of the cooling fan module 6.

[0045] like Figure 4 , Figure 5 and Figure 6 As shown, to further reduce the operating temperature of the host, multiple cooling modules 7 are arranged sequentially on the upper surface of the base plate 4. Each cooling module 7 is a vertical plate and detachably connected to the base plate 4. Specifically, multiple mounting protrusions 17, corresponding to the cooling modules 7, are arranged sequentially on the upper surface of the base plate 4. The mounting protrusions 17 are positioned along the plate direction of the cooling modules 7, and the upper surface of each mounting protrusion 17 has a slot 18 along its length for engaging the side of the corresponding cooling module 7. Each cooling module 7 has a sealed inner cavity 8 filled with a heat exchange liquid, preferably purified water. By placing the cooling module 7 in a refrigerator to freeze, the heat exchange liquid in the sealed inner cavity 8 can condense into ice, thus enabling the cooling module 7 to perform physical cooling and allowing for recycling, making it more environmentally friendly. The plates of adjacent cooling modules 7 are arranged opposite each other and are parallel to each other. The plates of the two outermost cooling modules 7 abut against the two opposite side walls inside the housing 1 to reduce the temperature of the side walls of the housing 1. An air duct 9 is formed between adjacent cooling modules 7. An air inlet 10 is passed through the side wall of the housing 1 and connected to one of the ports of the air duct 9. The area where the upper side of all cooling modules 7 is located is covered by a baffle plate 11. One edge of the baffle plate 11 extends to the air inlet 10, and the other edge of the baffle plate 11 maintains an air outlet gap 12 between it and the inner side wall of the housing 1 relative to the air inlet 10. The main board 2 is located between the cooling fan module 6 and the cooling modules 7. The plate of the main board 2 is parallel to the inner side wall of the housing 1 corresponding to the air outlet gap 12 and is located above the air outlet gap 12. Specifically, a mounting plate 38 is provided inside the housing 1 near the cover plate 3. The surface of the mounting plate 38 is parallel to the inner wall of the housing 1 corresponding to the air outlet interval 12 and maintains a ventilation interval 39 with the inner wall. Multiple mounting posts 40 are distributed on the surface of the mounting plate 38 away from the ventilation interval 39. The main board 2 is fixed to the multiple mounting posts 40 by screws (not shown). An interface module 41 is integrated on the main board 2. The interface module 41 includes a power interface, a communication interface, etc., to realize electrical connection and data interaction between the host and the outside world. The side wall of the housing 1 has clearance holes 42 for the installation of the interface module 41 to facilitate the docking of external connectors with the interface module 41.

[0046] like Figure 7 As shown, in order to enable quick disassembly and assembly of the baffle plate 11 to facilitate the replacement of the cooling module 7, the upper side of the air inlet 10 extends a slot 19 for the baffle plate 11 to be horizontally inserted into the housing 1 and for the baffle plate 11 to slide onto the cooling module 7.

[0047] like Figure 4As shown, in order to reduce the amount of dust entering the air inlet 10 and prevent large foreign objects from entering the housing 1, the lower surface of the baffle plate 11 has a dustproof plate 20 extending vertically to cover the air inlet 10, and the surface of the dustproof plate 20 has a plurality of air inlet holes 21.

[0048] like Figure 4 and Figure 8 As shown, in order to improve the installation accuracy of the baffle plate 11 and seal the gap between the baffle plate 11 and the slot 19, a limiting plate 22 extends upward along the edge of the baffle plate 11 away from the air outlet gap 12 to abut against the outer wall of the housing 1 to prevent the baffle plate 11 from being over-inserted into the slot 19. The limiting plate 22 is set along the length direction of the current edge. A gripping plate 23 extends along the surface direction of the lower side of the limiting plate 22. A groove 43 for hand engagement is maintained between the surface of the gripping plate 23 and the surface of the dustproof plate 20 to facilitate the user to pull the baffle plate 11 out of the slot 19.

[0049] like Figure 7 As shown, in order to improve the stability of the wind deflector 11 during disassembly and assembly, guide strips 24 are provided on the inner sidewalls of the housing 1 corresponding to both ends of the slot 19. The guide strips 24 are horizontally arranged and maintain a sliding interval 25 between them and the upper side of the cooling module 7 to allow the side of the wind deflector 11 to slide.

[0050] like Figure 4 , Figure 5 and Figure 9 As shown, in order to enable the wind deflector 11 to be inserted into the slot 19 more efficiently and accurately, the wind deflector 11 has guide rods 26 extending along the plate surface direction of the two ends of the edge near the air outlet interval 12 for insertion into the slot 19. The housing 1 has insertion slots 27 that pass through the side wall relative to the air inlet 10 for the two guide rods 26 to be inserted one-to-one.

[0051] like Figure 10 , Figure 11 and Figure 12 As shown, to improve the stability of the wind deflector 11 after installation, the opposing surfaces of the two guide rods 26 are provided with opposing positioning holes 28 at positions away from the wind deflector 11. When the wind deflector 11 is inserted into the slot 19 and the limiting plate 22 abuts against the outer wall of the housing 1, the two guide rods 26 can be inserted into the corresponding insertion slots 27 and the positioning holes 28 can slide to the outside of the housing 1. When the positioning holes 28 are located on the outside of the housing 1, a locking rod 29 is inserted into the two positioning holes 28 to prevent the ends of the guide rods 26 from disengaging from the positioning holes 28. The two ends of the locking rod 29 extend beyond the opposing ports of the two positioning holes 28, and the two extended portions are respectively provided with a gripping member 30 and a positioning through hole 31. A positioning screw 32 is inserted into the positioning through hole 31 to prevent the locking rod 29 from disengaging from the positioning hole 28 on its own.

[0052] like Figure 11 and Figure 13 As shown, to reduce the risk of accidental startup of the host, a start / stop unit 33 and a through-beam infrared sensor 34 are provided on the outer wall of the housing 1. The start / stop unit 33 is preferably a push-button switch. A control module 35 for controlling the start / stop of the motherboard 2 is coupled to the start / stop unit 33. The control module 35 is preferably a microcontroller or a PLC. The through-beam infrared sensor 34 includes a transmitting unit 36 ​​and a receiving unit 37 arranged longitudinally opposite each other. The transmitting unit 36 ​​is used to emit infrared light, and the receiving unit 37 is coupled to the control module 35 to receive the infrared light and send a corresponding detection signal to the control module 35 according to whether infrared light is received.

[0053] When the start / stop unit 33 responds to an external trigger, the control module 35 first uses the through-beam infrared sensor 34 to determine the infrared light blocking status. If the locking rod 29 is simultaneously inserted into the two positioning holes 28 so that the rod body of the locking rod 29 passes through the gap between the transmitting unit 36 ​​and the receiving unit 37 to block the infrared light emitted by the transmitting unit 36, the control module 35 controls the main board 2 to start.

[0054] Conversely, if the infrared rays emitted by the transmitting unit 36 ​​are not blocked so that the receiving unit 37 can receive them, the control module 35 will not control the motherboard 2 to start.

[0055] The specific usage process is as follows:

[0056] Before the IoT host (hereinafter referred to as "host") is put into operation, the locking rod 29 needs to be removed from the positioning holes 28 of the two guide rods 26 to release the lock between the guide rods 26 and the insertion slot 27. Then, the baffle plate 11 is removed from the slot 19 with the help of the holding plate 23, and the dustproof plate 20 is removed from the air inlet 10 until the baffle plate 11 is completely removed from the slot 19. At this time, the multiple cooling modules 7 after freezing are sequentially snapped into the slots 18 of the multiple mounting protrusions 17 to create an air duct 9 between adjacent cooling modules 7. After all cooling modules 7 are installed, the baffle plate 11 is inserted into the slot 19 with the help of the guide rods 26. Under the guidance of the guide pressure strip 24, the baffle plate 11 can be horizontally covered above the cooling module 7, and under the limiting action of the limiting plate 22, an air outlet gap 12 is formed between the edge of the baffle plate 11 and the inner side wall of the housing 1. Simultaneously, the two guide rods 26 can be precisely inserted into the corresponding insertion slots 27, and the positioning holes 28 on the guide rods 26 are transferred to the outside of the housing 1 through the insertion slots 27. In this state, the locking rod 29 is simultaneously inserted into the two positioning holes 28 to lock the guide rods 26 in the insertion slots 27. At the same time, the positioning screws 32 are inserted from top to bottom into the positioning through holes 31 to prevent the locking rod 29 from disengaging from the positioning holes 28, thereby improving the stability of the locking rod 29. At this time, the rod of the locking rod 29 passes through the gap between the transmitting unit 36 ​​and the receiving unit 37 to block the infrared rays emitted by the transmitting unit 36. To start the main unit, simply press the start / stop unit 33 to send a trigger signal to the control module 35. After receiving the trigger signal, the control module 35 detects through the through-beam infrared sensor 34 that the infrared rays emitted by the transmitting unit 36 ​​have been blocked. Therefore, the control module 35 controls the main board 2 inside the housing 1 to start, so that the main unit can run.

[0057] After the host is running, the control module 35 controls the motor 14 inside the cooling fan module 6 to drive the fan blades 15 to rotate at high speed, thereby achieving active cooling of the host and improving heat dissipation efficiency. The heat exchange liquid filled in the sealed inner cavity 8, after being frozen, enables the cooling module 7 to have a physical cooling function. During the operation of the cooling fan module 6, external air enters through the air inlet 10 below the side wall of the casing 1 and passes through the air duct 9 between the cooling modules 7 to cool the airflow. The low-temperature airflow is discharged upward through the air outlet 12 and passes through the running motherboard 2, which not only quickly removes the heat generated by the motherboard 2, but also cools the motherboard 2 with the low-temperature airflow, making the heat dissipation effect better. The airflow passing through the motherboard 2 is finally discharged through the air outlet 5 on the cover plate 3 to realize the air exchange between the host and the outside. The baffle 11 can effectively restrict the flow of outside air after passing through the air inlet 10, so that the airflow must pass through the air duct 9 between the cooling modules 7 and then be discharged upward through the air outlet 12, thereby allowing the airflow to be fully cooled and improving the heat dissipation effect of the host.

[0058] Once the heat exchange liquid inside the cooling module 7 heats up, the cooling module 7 needs to be replaced. To do this, first press and hold the start / stop button to stop the control module 35 from controlling the mainboard 2, thereby shutting down the entire host machine. In this state, repeat the above steps to replace the cooling module 7.

[0059] The above-mentioned processes can be implemented with the help of the control program built into the control module 35, which is common knowledge in the field and will not be described in detail here.

Claims

1. An IoT host with efficient heat dissipation function, comprising a housing (1) and a motherboard (2) disposed within the housing (1), characterized in that: The shell (1) is a vertical rectangular tube. The upper and lower ends of the shell (1) are respectively provided with a cover plate (3) and a bottom plate (4). The surface of the cover plate (3) is provided with air outlet holes (5). A cooling fan module (6) is provided in the shell (1) near the cover plate (3). The air supply direction of the cooling fan module (6) is from bottom to top. Multiple cooling modules (7) are arranged in sequence on the upper surface of the bottom plate (4). The cooling modules (7) are vertical plates and are detachably connected to the bottom plate (4). A sealed inner cavity (8) is provided on the cooling module (7). The sealed inner cavity (8) is filled with heat exchange liquid. The plates of adjacent cooling modules (7) are arranged opposite each other and are parallel to each other. The plates of the two outermost cooling modules (7) respectively abut against the shell. Two opposing sidewalls inside the body (1) form an air duct (9) between adjacent cooling modules (7). An air inlet (10) is connected to one of the ports of the air duct (9) through the sidewall of the housing (1). The area where the upper side of all cooling modules (7) is located is covered by a baffle plate (11). One side edge of the baffle plate (11) extends to the air inlet (10). The other side edge of the baffle plate (11) and the inner sidewall of the housing (1) relative to the air inlet (10) maintain an air outlet gap (12). The main board (2) is located between the cooling fan module (6) and the cooling module (7). The surface of the main board (2) is parallel to the inner sidewall of the housing (1) corresponding to the air outlet gap (12) and is located above the air outlet gap (12). The upper side of the air inlet (10) extends into a slot (19) for the baffle plate (11) to be horizontally inserted into the housing (1) and for the baffle plate (11) to slide onto the cooling module (7); the lower surface of the baffle plate (11) extends vertically into a dustproof plate (20) for covering the air inlet (10), and the surface of the dustproof plate (20) is provided with air inlet holes (21).

2. The IoT host with high-efficiency heat dissipation function according to claim 1, characterized in that: The cooling fan module (6) includes a motor (14) with the output shaft (13) facing upward and a fan blade (15) on the output shaft (13). The motor (14) is provided with a bracket (16) fixed to the inner wall of the housing (1).

3. The IoT host with high-efficiency heat dissipation function according to claim 1, characterized in that: The upper surface of the base plate (4) has a series of mounting protrusions (17) that correspond to multiple cooling modules (7). The mounting protrusions (17) are arranged along the plate surface direction of the cooling module (7). The upper surface of the mounting protrusions (17) is provided with a slot (18) for the side of the corresponding cooling module (7) to be engaged.

4. The IoT host with high-efficiency heat dissipation function according to claim 1, characterized in that: The wind deflector (11) extends upward along the edge away from the air outlet interval (12) and has a limiting plate (22) for abutting against the outer side wall of the housing (1) to prevent the wind deflector (11) from being over-inserted into the slot (19). A gripping plate (23) extends along the lower side of the limiting plate (22) in the direction of its plate surface.

5. The IoT host with high-efficiency heat dissipation function according to claim 1, characterized in that: Inside the housing (1), guide strips (24) are provided on the inner sidewalls corresponding to both ends of the slot (19). The guide strips (24) are horizontally arranged and maintain a sliding interval (25) between them and the upper side of the cooling module (7) for the side of the baffle plate (11) to slide.

6. The IoT host with high-efficiency heat dissipation function according to claim 4, characterized in that: The wind deflector (11) has guide rods (26) extending along the plate surface direction of the wind deflector (11) at both ends of the edge near the air outlet (12), for inserting into the slot (19). The housing (1) has a insertion groove (27) through the side wall relative to the air inlet (10) for the two guide rods (26) to be inserted one-to-one.

7. The IoT host with high-efficiency heat dissipation function according to claim 6, characterized in that: The two guide rods (26) have opposing positioning holes (28) on their opposite sides at a position away from the wind deflector (11). When the wind deflector (11) is inserted into the slot (19) and the limiting plate (22) abuts against the outer wall of the housing (1), the two guide rods (26) can be inserted into the corresponding insertion slots (27) and the positioning holes (28) slide to the outside of the housing (1). When the positioning holes (28) are located outside the housing (1), a locking rod (29) is inserted into the two positioning holes (28) to prevent the ends of the guide rods (26) from disengaging from the positioning holes (28). The two ends of the locking rod (29) extend beyond the opposing ports of the two positioning holes (28), and the two extended parts are respectively provided with a grip (30) and a positioning through hole (31). A positioning screw (32) is inserted into the positioning through hole (31).

8. The IoT host with high-efficiency heat dissipation function according to claim 7, characterized in that: The outer wall of the housing (1) is provided with a start-stop unit (33) and a through-beam infrared sensor (34). The start-stop unit (33) is coupled to a control module (35) for controlling the start-stop of the main board (2). The through-beam infrared sensor (34) includes a transmitting unit (36) and a receiving unit (37) arranged longitudinally opposite to each other. The transmitting unit (36) is used to emit infrared rays. The receiving unit (37) is coupled to the control module (35) to receive the infrared rays and send a corresponding detection signal to the control module (35) according to whether the infrared rays are received. When the start / stop unit (33) responds to an external trigger, the control module (35) first uses the through-beam infrared sensor (34) to determine the infrared blocking status. If the locking rod (29) is inserted into the two positioning holes (28) at the same time so that the rod body of the locking rod (29) passes through the gap between the transmitting unit (36) and the receiving unit (37) to block the infrared light emitted by the transmitting unit (36), the control module (35) controls the main board (2) to start. Conversely, if the infrared rays emitted by the transmitting unit (36) are not blocked so that the receiving unit (37) can receive them, the control module (35) will not control the motherboard (2) to start.

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