Heat dissipation structure with heat pipe and main machine for intelligent cockpit

Abstract

This invention discloses a heat dissipation structure with a heat pipe, including a heat sink, a heat pipe, and a heat dissipation shell. The heat pipe has an "I"-shaped cross-section, which can be divided into an upper and lower half of the "I". A first T-shaped groove is formed on the first surface of the heat sink, which mates with the lower half. The second surface of the heat sink contacts the component to be cooled. A second T-shaped groove is formed on the first surface of the heat dissipation shell, which mates with the upper half. The upper half of the heat pipe is embedded in and engaged with the second T-shaped groove, and the lower half of the heat pipe is embedded in and engaged with the first T-shaped groove, so that the first surface of the heat sink and the first surface of the heat dissipation shell are in relative contact. The heat pipe is sandwiched between the heat sink and the heat dissipation shell and accommodated in a locking groove formed by the first T-shaped groove of the heat sink and the second T-shaped groove of the heat dissipation shell. This invention has high heat dissipation efficiency and good heat dissipation stability. This invention also discloses a host for a smart cockpit.

Description

Technical Field

[0001] This invention relates to heat dissipation for electronic devices, and more particularly to a heat dissipation structure with heat pipes and a host for a smart cockpit. Background Technology

[0002] The automotive infotainment industry is rapidly evolving towards multi-functionality, demanding higher requirements for the main unit's heat dissipation performance, electrical shielding performance, and smaller size and weight. Therefore, existing main unit casings generally use die-cast aluminum alloy designs, with a fan added to the top for auxiliary heat dissipation, and air duct designs that function as air outlets to optimize heat dissipation. However, these structures still fall short of meeting the heat dissipation requirements of the main units in current smart cockpits.

[0003] Chinese Patent 204131898 U discloses a heat dissipation device, including a heat pipe, a metal heat sink, and a circuit board. One end of the heat pipe is connected to the metal heat sink using a metal pad, and the other end is connected to an integrated circuit board, which is used to transfer the heat of the integrated circuit board to the metal heat sink. However, the metal heat sink and the integrated circuit board are spaced apart and do not exchange heat directly, resulting in low heat dissipation efficiency and large volume. Furthermore, both ends of the heat pipe need to be connected to the metal heat sink and the integrated circuit board respectively through metal pads and metal connectors, resulting in poor connection stability.

[0004] To address this, engineers designed a heat dissipation device with a T-shaped heat pipe in Chinese patent CN115003122A. The device has a T-shaped heat pipe embedded on the lower surface of the heat dissipation housing. The lower side of the heat pipe contacts the high-power IC on the circuit board, thereby quickly transferring heat away through the heat pipe. The heat pipe and the heat dissipation housing are not vertically connected. However, heat pipes are generally composed of a shell, a wick, and end caps. The shell has a certain degree of flexibility. If the adhesive or solder used to fix the heat pipe to the heat sink melts at excessively high temperatures, it may cause slight deformation of the heat pipe, creating a gap between the heat pipe and the heat sink, affecting heat dissipation efficiency. Furthermore, because the cross-sectional area of ​​the heat pipe is relatively small, it can generally only contact one or two high-power ICs. Even if multiple heat pipes are placed in the high-power area, it is difficult to ensure that the heat pipes fully contact all the high-power ICs in the high-power area. A large part of the heat in the high-power area is still transferred through the contact between the heat sink and the high-power IC. After embedding the heat pipe into the heat sink, it is difficult to keep the heat pipe and the lower surface of the heat sink completely flush, making it difficult for the heat from the high-power IC to be transferred to the heat pipe and the heat sink simultaneously and efficiently, thus limiting the heat dissipation efficiency.

[0005] Therefore, there is an urgent need for a new heat dissipation structure that can solve the above problems. Summary of the Invention

[0006] The purpose of this invention is to provide a heat dissipation structure with heat pipes and a host for a smart cockpit. The heat pipes are arranged in an "I" shape and clamped between the heat sink and the heat sink housing, resulting in high heat dissipation efficiency, good heat dissipation stability, and long service life.

[0007] To achieve the above objectives, the present invention discloses a heat dissipation structure with a heat pipe, comprising a heat sink, a heat pipe, and a heat dissipation shell. The heat pipe has an "I"-shaped cross-section and can be divided into an upper half and a lower half of the "I". The heat sink has a first surface and a second surface facing away from each other. The first surface of the heat sink has a first T-shaped groove that mates with the lower half of the heat sink. The second surface of the heat sink contacts the component to be cooled. The first surface of the heat dissipation shell has a second T-shaped groove that mates with the upper half of the heat sink. The upper half of the heat pipe is embedded in and engaged in the second T-shaped groove, and the lower half of the heat pipe is embedded in and engaged in the first T-shaped groove, such that the first surface of the heat sink and the first surface of the heat dissipation shell are in relative contact. The heat pipe is sandwiched between the heat sink and the heat dissipation shell and accommodated in a locking groove formed by the first T-shaped groove of the heat sink and the second T-shaped groove of the heat dissipation shell.

[0008] Preferably, the heat pipe is snapped between the heat sink and the heat sink housing along its longitudinal direction in the middle, and the two ends of the heat pipe extend out of the heat sink and are snapped into the second T-shaped slot of the heat sink housing. The heat pipe includes a heat absorption part in the middle and heat dissipation parts at both ends, which can transfer the heat of the area to be cooled to the heat dissipation part through the heat absorption part, and then from the heat dissipation part to the part of the heat sink housing away from the area to be cooled, thereby quickly transferring it away.

[0009] Preferably, the heat pipe extends into the first T-shaped slot and the second T-shaped slot from the top opening of the first T-shaped slot and the second T-shaped slot by deformation.

[0010] Preferably, the component to be cooled is a high-power region of the circuit board. The second surface of the heat sink makes thermally conductive contact with the high-power region of the circuit board and has a groove corresponding to a high-power IC in the high-power region, so that the high-power IC in the high-power region extends into the groove on the second surface of the heat sink and makes thermally conductive contact with the groove. This solution further increases the contact area and contact stability between the high-power IC in the high-power region and the heat sink, further improving heat dissipation efficiency and ensuring heat dissipation stability.

[0011] Preferably, a plurality of heat dissipation fins are protruding on the second surface of the heat dissipation housing opposite to the first surface.

[0012] Specifically, the heat dissipation fins include a plurality of heat dissipation pillars formed in the middle region of the second surface of the heat dissipation housing and a plurality of heat dissipation fins formed in the periphery region of the second surface of the heat dissipation housing and surrounding the heat dissipation pillars.

[0013] More specifically, several of the heat sinks are radially distributed around the central region.

[0014] More specifically, the top of the heat dissipation column gradually narrows to form an air guide wall, and a cross-shaped heat dissipation groove is opened at the top of the heat dissipation column and extends through the two opposite sides of the heat dissipation column to divide the upper part of the heat dissipation column into four heat dissipation sections.

[0015] More specifically, the component to be cooled is a high-power area of ​​the circuit board and corresponds to the middle area of ​​the second surface of the heat sink housing. The second surface of the heat sink housing is also provided with a cooling fan and a heat sink cover plate covering the cooling fan and the cooling fins. The heat sink cover plate has an air inlet hole opposite to the cooling fan and a heat dissipation hole offset from the cooling fan. The heat dissipation hole is provided with a dust-proof part covering the heat dissipation hole, and there is a gap between one side of the dust-proof part and the heat sink cover plate.

[0016] Preferably, the heat sink has an outwardly protruding protrusion on its outer side, and the first surface of the heat sink housing has a recessed receiving groove that accommodates the heat sink and engages with the protrusion. This design allows the heat sink and the heat sink housing to be tightly connected together, forming a non-removable whole, resulting in high structural stability of the entire heat dissipation structure and eliminating the need for screw fixation.

[0017] The present invention also discloses a host for a smart cockpit, including a host housing and a circuit board installed in the host housing. The host housing includes a heat dissipation structure as described above and a bottom shell that cooperates with the heat dissipation shell in the heat dissipation structure to form a receiving cavity. The circuit board is installed in the receiving cavity.

[0018] Preferably, the bottom shell has several ventilation holes, and an air guide shield is connected to the ventilation holes of the bottom shell. The air guide shield protrudes from the bottom shell, and there is a gap between the front side of the air guide shield and the bottom shell to form an air guide channel connecting the ventilation holes. Ventilation structures are formed on the front and rear side walls of the main unit housing, and there is a gap between the circuit board and the bottom shell to form an air duct connecting the ventilation structure and the air guide channel.

[0019] Specifically, there are two circuit boards installed opposite each other in the receiving cavity at a certain distance. One circuit board is in contact with the heat dissipation structure and dissipates heat through the heat dissipation structure, while the other circuit board is adjacent to the bottom shell and dissipates heat through the ventilation holes and air ducts on the bottom shell.

[0020] More specifically, a shielding bracket is also installed between the two circuit boards. The shielding bracket shields the control part and input / output part of the circuit board. The shielding bracket is set perpendicularly to the circuit board, and a plurality of adapter pins are protruding on the first side of the shielding bracket. The circuit board is provided with a locking hole that mates with the adapter pins. The shielding bracket is installed on one of the circuit boards through the mating of the adapter pins and the locking hole. A plurality of grounding contacts are protruding on the second side of the shielding bracket opposite to the first side, and the shielding bracket is electrically connected to the grounding area of ​​the other circuit board through the grounding contacts.

[0021] Preferably, the circuit board has a high-power area, and a high-power IC is mounted on the front side of the high-power area. A reinforcing plate is fixed on the back side of the high-power area. One or more strip holes are opened on the reinforcing plate along a first direction. The reinforcing plate is arranged along the first direction and its two ends along the first direction are respectively positioned and fixed to the high-power area.

[0022] Compared with existing technologies, this invention sets the heat pipe's cross-section in an "I" shape and clamps it between the heat sink and the heat sink housing. This not only ensures structural stability but also guarantees contact between the heat pipe and the heat sink and housing. Furthermore, the upper part of the heat pipe engages with the second T-shaped slot in the heat sink housing, effectively ensuring contact stability between the heat pipe and the housing, preventing deformation and detachment, resulting in a longer service life and better heat dissipation efficiency. Moreover, the entire area to be cooled in this invention contacts the second surface of the heat sink, ensuring comprehensive contact and high heat dissipation efficiency. Attached Figure Description

[0023] Figure 1 This is a perspective view of the host unit of the present invention used in a smart cockpit.

[0024] Figure 2 This is a perspective view of the host unit of the present invention used in a smart cockpit from another angle.

[0025] Figure 3 This is an exploded view of the host computer used in the intelligent cockpit of this invention.

[0026] Figure 4 This is a top view of the host unit of the present invention used in a smart cockpit.

[0027] Figure 5 It is along Figure 4 A cross-sectional view taken along line AA.

[0028] Figure 6 This is the present invention. Figure 5 Enlarged view of part a.

[0029] Figure 7 This is a back view of a circuit board in the host unit of the present invention used in a smart cockpit.

[0030] Figure 8 This is a structural diagram of the heat sink of the present invention.

[0031] Figure 9 This is a structural diagram of the heat dissipation housing of the present invention.

[0032] Figure 10 This is a cross-sectional view of the host computer used in the intelligent cockpit according to the second embodiment of the present invention. Detailed Implementation

[0033] To illustrate the technical content, structural features, objectives, and effects of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0034] refer to Figures 1 to 3 This invention discloses a host 100 for a smart cockpit, including a host housing and circuit boards 41 and 42 installed in the host housing. The host housing includes a heat dissipation shell 1111 and a bottom shell 12, which cooperate to form a receiving cavity, in which the circuit boards 41 and 42 are installed. To facilitate heat dissipation, a heat dissipation structure is also formed on the host housing.

[0035] refer to Figures 3 to 6The heat dissipation structure includes a heat sink 30, a heat pipe 20, and a heat dissipation shell 11. The heat pipe 20 has an "I"-shaped cross section and can be divided into an upper half 21 and a lower half 22. The upper half 21 and the lower half 22 have a T-shaped cross section with their necks facing each other. The lengths of their heads can be equal or unequal. The heat sink 30 has a first surface and a second surface facing away from each other. The first surface of the heat sink 30 has a first T-shaped groove 31 that mates with the lower half 22. The second surface of the heat sink 30 contacts the component to be cooled. The first surface of the heat sink housing 11 has a second T-shaped groove 111 that mates with the upper half 21. The upper half 21 of the heat pipe 20 is embedded in and engaged with the second T-shaped groove 111, and the lower half 22 of the heat pipe 20 is embedded in and engaged with the first T-shaped groove 31, so that the first surface of the heat sink 30 and the first surface of the heat sink housing 11 are in relative contact. The heat pipe 20 is sandwiched between the heat sink 30 and the heat sink housing 11 and is accommodated in the engagement groove formed by the first T-shaped groove 31 of the heat sink 30 and the second T-shaped groove 111 of the heat sink housing 11. The heat pipe 20 includes a shell, a capillary structure disposed within the shell, and a heat-conducting medium. The engagement between the first T-shaped slot 31, the second T-shaped slot 111, the upper half 21, and the lower half 22 allows the first surface of the heat sink 30 to make thermal contact with the first surface of the heat sink housing, and they are connected as one unit.

[0036] The heat pipe 20 extends into the first and second T-shaped slots 31 and 111 through the top openings of these slots. Alternatively, the second portion 22 of the heat pipe 20 can be inserted into the first T-shaped slot 31, in which case the first T-shaped slot 31 is a transversely penetrating groove. The first T-shaped slot 31 can also be a closed groove, in which case the heat pipe 20 extends into it, or the heat sink 30 can be die-cast together with the first T-shaped slot 31. The first portion 21 of the heat pipe 20 can also be die-cast together with the heat sink housing 11.

[0037] The heat dissipation housing 11 is made of aluminum, but it can also be made of other materials with fast heat dissipation, and is not limited to aluminum.

[0038] The heat sink 30 is a copper heat sink. Of course, the heat sink can also be made of other materials with fast heat dissipation. In this embodiment, the heat dissipation speed of the heat sink 30 material is greater than that of the heat sink housing 11 material.

[0039] refer to Figure 6 , Figure 8 and Figure 9The outer wall of the heat sink 30, near the heat sink housing 11, has a protrusion 32 protruding outward. The first surface of the heat sink housing 11 has a recessed receiving groove 112 that accommodates the heat sink 30 and engages with the protrusion 32. The receiving groove 112 has a T-shaped cross-section and a snap-fit ​​wall that engages with the protrusion 32. The heat sink 30 and the heat sink housing 11 are snapped together using a die-casting process. Alternatively, the heat sink 30 and the heat sink housing 11 can be fixed together with screws or rotatable snap-fit ​​pieces, or they can be detachably snapped together or non-detachably connected (e.g., welded) using other methods. The protrusion 32 can also protrude from the middle of the outer wall of the heat sink 30, as long as there is a gap between it and the outer wall of the heat sink 30 away from the heat sink housing 11.

[0040] refer to Figure 6 The heat pipe 20 is snapped between the heat sink 30 and the heat sink housing 11 along its longitudinal direction. The two ends of the heat pipe 20 extend out of the heat sink 30 and are snapped into the second T-shaped slot 111 of the heat sink housing 11. The heat pipe 20 includes a heat absorption part 201 located in the middle and heat dissipation parts 202 located at both ends. It can transfer the heat of the area to be cooled through the heat absorption part 201 to the heat dissipation part 202, and then from the heat dissipation part 202 to the part of the heat sink housing 11 away from the area to be cooled, thereby quickly transferring it away.

[0041] refer to Figure 3 The component to be cooled is the high-power region 401 of the circuit board 41 (the region corresponding to the position of the heat sink 30). The second surface of the heat sink 30 is in thermally conductive contact with the high-power region 401 of the circuit board 41, and has a groove 33 corresponding to the high-power IC 411 of the high-power region 401, so that the high-power IC 411 of the high-power region 401 extends into the groove 33 of the second surface of the heat sink 30 and is in thermally conductive contact with the groove 33. The high-power IC is in thermally conductive contact with the bottom of the groove 33 through thermally conductive adhesive. refer to Figure 3 The heat dissipation housing 11 has a plurality of heat dissipation fins protruding from its second surface opposite to the first surface. Each heat dissipation fin includes a plurality of heat dissipation pillars 134 formed in the middle region of the second surface of the heat dissipation housing 11 and a plurality of heat dissipation fins 133 formed in the periphery of the second surface of the heat dissipation housing 11 and surrounding the heat dissipation pillars 134. The heat dissipation fins 133 are radially distributed around the middle region.

[0042] refer to Figure 3The top of the heat dissipation column 134 gradually tapers to form an air guide wall. A cross-shaped heat dissipation groove 1341 is formed at the top of the heat dissipation column 134, penetrating both opposite sides of the column, dividing the upper half 21 of the column into four heat dissipation sections 1342. Of course, the structure of the heat dissipation column 134 is not limited to this; it can also be a cylindrical column or other structures.

[0043] The high power consumption region 401 corresponds to the middle region of the second surface of the heat sink 11. The second surface of the heat sink 11 is also provided with a cooling fan 14 and a heat sink cover plate 13 covering the cooling fan 14 and the heat sink fins.

[0044] refer to Figure 1 The heat dissipation cover plate 13 has an air inlet 135 opposite to the position of the heat dissipation fan 14 and a heat dissipation hole 131 offset from the heat dissipation fan 14. The heat dissipation hole 131 is provided with a dust-proof part 132 covering the heat dissipation hole 131. There is a gap between one side of the dust-proof part 132 and the heat dissipation cover plate 13 to form a ventilation channel.

[0045] refer to Figure 2 and Figure 3 The bottom shell 12 has several ventilation holes 121. Air guide shields 122 are connected to the ventilation holes 121 of the bottom shell 12. The air guide shields 122 protrude from the bottom shell 12, and there is a gap between the front side of the air guide shields 122 and the bottom shell 12 to form an air guide channel communicating with the ventilation holes 121. Ventilation structures are formed on the front and rear side walls of the main unit housing. (Reference) Figure 3 and Figure 5 The main unit housing contains two circuit boards, namely circuit board 41 and circuit board 42. A gap exists between circuit board 42 and the bottom shell 12 to form an air duct 123 connecting the ventilation structure and the air guide channel (e.g., Figure 5 (As shown).

[0046] refer to Figure 5 Circuit boards 41 and 42 are mounted opposite each other in the receiving cavity at a certain distance. One circuit board 41 is in contact with the heat dissipation structure and dissipates heat through the heat dissipation structure, while the other circuit board 42 is adjacent to the bottom shell and dissipates heat through the ventilation holes 121 and air ducts 123 on the bottom shell.

[0047] refer to Figure 3 and Figure 5A shielding bracket 43 is also installed between the two circuit boards 41 and 42. The shielding bracket 43 shields the control part and input / output part (input / output interface) of the circuit boards 41 and 42. The shielding bracket 43 is vertically arranged relative to the circuit boards 41 and 42, and a plurality of adapter pins 431 are protruding on the first side of the shielding bracket 43. The circuit board 42 is provided with a locking hole 423 that cooperates with the adapter pins 431. The shielding bracket 43 is installed on one of the circuit boards 42 through the cooperation of the adapter pins 431 and the locking hole 423. A plurality of grounding contacts 432 are protruding on the second side of the shielding bracket 43 opposite to the first side, which contacts the grounding area of ​​the other circuit board 41. The shielding bracket 43 is electrically connected to the grounding area of ​​the other circuit board 41 through the grounding contacts 432.

[0048] refer to Figure 3 The control section of the circuit board 42 is also covered by a shielding cover 421, which has several heat dissipation holes 422.

[0049] refer to Figure 7 The circuit board has a high power consumption area 401, and a high power IC 411 is mounted on the front side of the high power consumption area 401. A reinforcing plate 44 is fixed on the back side of the high power consumption area 401. One or more strip holes 440 are opened on the reinforcing plate 44 along a first direction. The reinforcing plate 44 is arranged along the first direction and its two ends 441 and 442 along the first direction are respectively positioned and fixed to the high power consumption area 401.

[0050] refer to Figure 10 This is a second embodiment of the present invention, different from the first embodiment. In this embodiment, the bottom shell 12 is made of shielding material and has a plurality of inclined heat dissipation holes 121a. The bottom shell 12 has a first direction perpendicular to the plate surface of the bottom shell. The heat dissipation hole 121a includes a first opening, a second opening, and a hole body connecting the first opening and the second opening. The hole body is set at a certain inclined angle with the first direction. The first opening expands outward and is set towards the first direction. The second opening expands outward and is set towards the first direction. The minimum cross-sectional area of ​​the second opening and the first opening is offset from each other on the projection plane parallel to the shielding plate and does not have an overlapping portion.

[0051] Wherein, the side of the first opening adjacent to the second opening expands toward the second opening to form a first bent wall, the first bent wall being parallel to the first direction or located on the other side of the first direction relative to the side of the first opening away from the second opening, the side of the second opening adjacent to the first opening expands toward the first opening to form a second bent wall, the second bent wall being parallel to the first direction or located on the other side of the first direction relative to the side of the second opening away from the first opening.

[0052] Specifically, the heat dissipation hole 121a includes a first straight hole edge and a second straight hole edge that are relatively parallel. The first straight hole edge and the second straight hole edge extend from the first hole opening to the second hole opening along a first direction while being inclined along a second direction perpendicular to the first direction, so that the first straight hole edge and the second straight hole edge are inclined relative to the first direction. The second straight hole edge is close to the second hole opening at one end relative to the first straight hole edge. The first straight hole edge is bent away from the first straight hole edge along the second direction at one end of the first hole opening to form a first bent wall, and the second straight hole edge forms a first air guide wall at one end of the first hole opening. The first straight hole edge is bent away from the second straight hole edge along the second direction at one end of the second hole opening to form a second bent wall, and the first straight hole edge forms a second air guide wall at one end of the second hole opening.

[0053] The heat dissipation hole 121a is a square hole, a diamond-shaped hole, or a polygonal hole. The thickness of the bottom shell is greater than or equal to 3 mm, and the heat dissipation hole 121a is inclined at 60 ± 5 degrees relative to the first direction.

[0054] In this embodiment, the inclined heat dissipation hole 121a enables the bottom shell to dissipate heat and exhaust air while having a full shielding function. Furthermore, no shielding cover needs to be installed on the heat dissipation hole 121a, resulting in a simple structure and good concealment.

[0055] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A heat dissipation structure with a heat pipe, characterized in that: The device includes a heat sink, a heat pipe, and a heat sink housing. The heat pipe has an "I"-shaped cross-section and can be divided into an upper and lower half of the "I". The heat sink has a first surface and a second surface facing away from each other. The first surface of the heat sink has a first T-shaped groove that mates with the lower half of the heat sink. The second surface of the heat sink is in contact with the component to be cooled. The first surface of the heat sink housing has a second T-shaped groove that mates with the upper half of the heat sink. The upper half of the heat pipe is embedded in and engaged with the second T-shaped groove, and the lower half of the heat pipe is embedded in and engaged with the first T-shaped groove, so that the first surface of the heat sink and the first surface of the heat sink housing are in relative contact. The heat pipe is sandwiched between the heat sink and the heat sink housing and is accommodated in a locking groove formed by the first T-shaped groove of the heat sink and the second T-shaped groove of the heat sink housing.

2. The heat dissipation structure as described in claim 1, characterized in that: The heat pipe is snapped between the heat sink and the heat sink housing along its longitudinal direction in the middle. The two ends of the heat pipe extend out of the heat sink and are snapped into the second T-shaped slot of the heat sink housing. The heat pipe includes a heat absorption part in the middle and heat dissipation parts at both ends.

3. The heat dissipation structure as described in claim 1, characterized in that: The component to be cooled is a high-power area of ​​the circuit board. The second surface of the heat sink is in thermal contact with the high-power area of ​​the circuit board and has a groove corresponding to the high-power IC of the high-power area, so that the high-power IC of the high-power area extends into the groove of the second surface of the heat sink and is in thermal contact with the groove.

4. The heat dissipation structure as described in claim 1, characterized in that: The heat dissipation housing has a plurality of heat dissipation fins protruding from its second surface opposite to the first surface. The heat dissipation fins include a plurality of heat dissipation pillars formed in the middle region of the second surface of the heat dissipation housing and a plurality of heat dissipation fins formed in the periphery of the second surface of the heat dissipation housing and surrounding the heat dissipation pillars.

5. The heat dissipation structure as described in claim 4, characterized in that: Several of the heat sinks are radially distributed around the central region.

6. The heat dissipation structure as described in claim 4, characterized in that: The top of the heat dissipation column gradually narrows to form an air guide wall. A cross-shaped heat dissipation groove is opened at the top of the heat dissipation column and runs through the two opposite sides of the heat dissipation column to divide the upper part of the heat dissipation column into four heat dissipation sections.

7. The heat dissipation structure as described in claim 4, characterized in that: The component to be cooled is a high-power area of ​​the circuit board and corresponds to the middle area of ​​the second surface of the heat sink housing. The second surface of the heat sink housing is also provided with a cooling fan and a heat sink cover plate covering the cooling fan and the cooling fins. The heat sink cover plate has an air inlet hole opposite to the cooling fan and a heat dissipation hole offset from the cooling fan. The heat dissipation hole is provided with a dust-proof part covering the heat dissipation hole, and there is a gap between one side of the dust-proof part and the heat sink cover plate.

8. The heat dissipation structure as described in claim 1, characterized in that: The heat sink has a protrusion protruding outward on its outer side, and the first surface of the heat sink housing has a recessed receiving groove that accommodates the heat sink and engages with the protrusion.

9. A main unit for a smart cockpit, characterized in that: The device includes a main unit housing and a circuit board mounted in the main unit housing. The main unit housing includes a heat dissipation structure as described in any one of claims 1-8 and a bottom shell that cooperates with the heat dissipation shell in the heat dissipation structure to form a receiving cavity. The circuit board is mounted in the receiving cavity.

10. The host computer as described in claim 9, characterized in that: The bottom shell has several ventilation holes, and air guide shields are connected to the ventilation holes of the bottom shell. The air guide shields protrude from the bottom shell, and there is a gap between the front side of the air guide shields and the bottom shell to form an air guide channel connecting the ventilation holes. Ventilation structures are formed on the front and rear side walls of the main unit housing. There is a gap between the circuit board and the bottom shell to form an air duct connecting the ventilation structure and the air guide channel.

11. The host computer as described in claim 10, characterized in that: Two circuit boards are installed opposite each other in the receiving cavity at a certain distance. One circuit board is in contact with the heat dissipation structure and dissipates heat through the heat dissipation structure, while the other circuit board is adjacent to the bottom shell and dissipates heat through the ventilation holes and air ducts on the bottom shell.

12. The host computer as described in claim 11, characterized in that: A shielding bracket is also installed between the two circuit boards. The shielding bracket shields the control part and input / output part of the circuit board. The shielding bracket is set perpendicular to the circuit board and a plurality of adapter feet are protruding on the first side of the shielding bracket. The circuit board is provided with a locking hole that mates with the adapter feet. The shielding bracket is installed on one of the circuit boards through the mating of the adapter feet and the locking hole. A plurality of grounding contacts are protruding on the second side of the shielding bracket opposite to the first side, and the shielding bracket is electrically connected to the grounding area of ​​the other circuit board through the grounding contacts.

13. The host computer as described in claim 9, characterized in that: The circuit board has a high power consumption area, and one or more high power ICs are mounted on the front side of the high power consumption area. A reinforcing plate is fixed on the back side of the high power consumption area. One or more strip holes are opened on the reinforcing plate along a first direction. The reinforcing plate is arranged along the first direction and its two ends along the first direction are respectively positioned and fixed to the high power consumption area.

Images