Silver-based alloy powder material and its application in high-temperature oxidation-resistant, segregation-resistant materials
Patent Information
- Application Number
- CN202310338052.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-03-31
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2043-03-31
AI Technical Summary
但由于纯银材料易氧化、团聚,在大电流或外部硫化、高温环境等影响时会出现氧化、粘结、腐蚀导致导电触面的导电性、导热性受到严重影响,威胁设备和线路的安全稳定运行
[0015]本发明提供的银基合金材料中,Cu的掺入量大,Cu与Ag形成共晶强化其机械性能,能够提高材料的抗氧化性能和抗熔焊性;但Cu含量的大量加入,容易造成析晶,本发明中进一步增加Ni含量,其能够细化晶粒稳定相区,同时Ni和Cu可以无限固溶,降低银基合金内部组织的偏析;更进一步地,该合金材料中加入一定量的Si,其与Cu协同,能够显著提高合金材料的抗高温氧化性能。
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Figure CN116460288B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of powder materials technology, and relates to laser cladding or laser additive manufacturing materials, specifically a silver-based alloy powder material and its application in high-temperature oxidation-resistant and segregation-resistant materials. Background Technology
[0002] Pure silver and its derivatives, such as pure silver powder, silver paste, and silver brazing filler metal, are widely used in electronic circuits, high-voltage and high-current electrical applications, and conductive materials due to their low contact resistance, high electrical conductivity, and high thermal conductivity. These materials are used to prepare conductive contacts, electrical contacts, and conductive circuits. However, pure silver is prone to oxidation and agglomeration. Under the influence of high current or external sulfidation and high-temperature environments, oxidation, adhesion, and corrosion can occur, severely affecting the conductivity and thermal conductivity of conductive contacts and threatening the safe and stable operation of equipment and circuits.
[0003] CN 114974645 A discloses a silver-based multi-element alloy powder material, its preparation method and application. By incorporating Cu, Ni and V into the silver-based material, it can be made to have certain anti-oxidation and anti-sulfurization effects, while improving mechanical properties. However, when it is used in high-current copper busbars, the anti-oxidation performance is limited due to the large current and temperature rise carried by the busbar. After long-term use, the surface will lose its metallic luster and turn gray, and the surface will be oxidized, affecting its service life. Summary of the Invention
[0004] This invention provides a silver-based alloy powder material and its application in high-temperature oxidation-resistant and segregation-resistant materials. As a surface cladding material for high-current busbars, it exhibits good oxidation resistance when there is a temperature rise caused by current flow.
[0005] The technical solution of the present invention is a silver-based alloy powder material containing the following elements by weight percentage: Cu: 20-30%, Ni: 8-15%, Si: 0.5-2%, with the balance being Ag and unavoidable impurities.
[0006] Furthermore, the composition is Cu: 28%, Ni: 10%, and Si: 1%.
[0007] Furthermore, the particle size of the silver-based alloy powder material is 30-200 μm.
[0008] Furthermore, the Hall flow rate of the silver-based alloy powder material is ≤20s / 50g.
[0009] The present invention also relates to a method for preparing the material, specifically, the raw materials are mixed and melted and then atomized to form spherical particles.
[0010] In the preferred embodiment, the gas atomization powder production process employs ultrasonic close-coupled atomization technology.
[0011] This invention also relates to the application of the material in high-temperature oxidation-resistant and anti-segregation materials.
[0012] Furthermore, the material can be prepared into a cladding layer or deposition layer that is resistant to high-temperature oxidation and segregation through laser cladding or laser additive manufacturing processes.
[0013] Furthermore, the high-temperature oxidation resistance means that the temperature rise during high-current flow testing is within 65K, which can effectively prevent oxidation of the cladding layer or deposited layer.
[0014] The present invention has the following beneficial effects:
[0015] In the silver-based alloy material provided by this invention, the large amount of Cu incorporation strengthens its mechanical properties by forming a eutectic with Ag, thereby improving the material's oxidation resistance and weldability. However, the large amount of Cu incorporation can easily cause crystallization. In this invention, the Ni content is further increased, which can refine the grain stable phase region. At the same time, Ni and Cu can be infinitely dissolved, reducing segregation in the internal structure of the silver-based alloy. Furthermore, a certain amount of Si is added to the alloy material, which, in synergy with Cu, can significantly improve the alloy material's resistance to high-temperature oxidation.
[0016] This invention utilizes ultrasonic tight-coupled atomization technology with gas atomization powder preparation process to produce spherical silver-based multi-element alloy powder materials with excellent flowability. Furthermore, the types and contents of alloying elements can be adjusted before powder blowing to maximize the preservation of the relevant properties of Ag in the silver-based alloy. This material can be processed using laser cladding or laser additive manufacturing methods to produce cladding or deposition layers with uniform and dense microstructure and no obvious segregation, resulting in significantly improved high-temperature oxidation resistance, anti-segregation, sulfidation resistance, and mechanical properties. Attached Figure Description
[0017] Figure 1 This is a scanning electron microscope image of the alloy powder material obtained in Example 1.
[0018] Figure 2 These are photographs of Example 1, Comparative Example 1, and pure silver material after temperature rise during flow. Detailed Implementation
[0019] The embodiments of the present invention will be described in detail below with reference to examples. However, those skilled in the art will understand that the following examples are only for illustrating the present invention and should not be regarded as limiting the scope of the present invention.
[0020] Example 1:
[0021] A silver-based alloy powder material, by mass percentage, comprises Cu: 28%, Ni: 10%, Si: 1%, with the balance being Ag and unavoidable impurities. A scanning electron microscope image of this material is shown below. Figure 1 .
[0022] The above raw materials are melted under vacuum induction, and then blown into spherical particles by ultrasonic tight coupling atomization technology of gas atomization powder making process. Powder with a size of 30-200μm is sieved and its Hall flow rate detection value is 18s / 50g.
[0023] Example 2:
[0024] A silver-based alloy powder material, by mass percentage, comprises Cu: 21.5%, Ni: 8%, Si: 0.5%, with the balance being Ag and unavoidable impurities. The preparation method is the same as in Example 1.
[0025] Example 3:
[0026] A silver-based alloy powder material, by mass percentage, comprises Cu: 29%, Ni: 14%, Si: 1.5%, with the balance being Ag and unavoidable impurities. The preparation method is the same as in Example 1.
[0027] Comparative Example 1:
[0028] A silver-based alloy powder material, by mass percentage, comprises Cu: 7%, Ni: 3%, with the balance being Ag and unavoidable impurities. The preparation method is the same as in Example 1.
[0029] Comparative Example 2:
[0030] A silver-based alloy powder material, by mass percentage, comprises Cu: 15%, Ni: 8%, Si: 0.5%, with the balance being Ag and unavoidable impurities. The preparation method is the same as in Example 1.
[0031] Comparative Example 3:
[0032] A silver-based alloy powder material, by mass percentage, comprises Cu: 28%, Ni: 8%, with the balance being Ag and unavoidable impurities. The preparation method is the same as in Example 1.
[0033] Comparative Example 4:
[0034] A silver-based alloy powder material, by mass percentage, comprises Cu: 28%, Ni: 3%, Si: 0.5%, with the balance being Ag and unavoidable impurities. The preparation method is the same as in Example 1.
[0035] The silver-based alloy powder material in the above embodiments and comparative examples was used to prepare a cladding layer on a T2 copper substrate by laser cladding. After 24 hours of continuous high current operation (temperature rise within 65K), the specific results are shown in the table below.
[0036] Table 1
[0037]
[0038]
[0039] In addition, products obtained by laser cladding on Cu substrates using Example 1, Comparative Example 1, and pure silver materials were subjected to continuous high current (temperature rise within 65K) for 24 hours. Photos of the products are shown below. Figure 2 In Example 1, the surface of the product has a distinct metallic luster, while in Comparative Example 1, some areas lose their metallic luster, and the surface of the product treated with pure silver material turns gray.
Claims
1. A silver-based alloy powder material, characterized in that, This silver-based alloy powder material contains the following elements by weight percentage: Cu: 20~30%, Ni: 8~15%, Si: 0.5~2%, with the balance being Ag and unavoidable impurities.
2. The material according to claim 1, characterized in that: The composition is Cu: 28%, Ni: 10%, and Si: 1%.
3. The material according to claim 1 or 2, characterized in that: The particle size of silver-based alloy powder materials is 30-200μm.
4. The material according to claim 1, characterized in that: The Hall flow rate of the silver-based alloy powder material is ≤20s / 50g.
5. A method for preparing the material according to any one of claims 1 to 4, characterized in that: The raw materials are mixed and melted, and then atomized to produce spherical particles.
6. The preparation method according to claim 5, characterized in that: The gas atomization powder production process employs ultrasonic tight-coupled atomization technology.
7. The application of the material according to any one of claims 1 to 4 in high-temperature oxidation-resistant and anti-segregation materials.
8. The application according to claim 7, characterized in that: The material is prepared into a cladding layer or deposition layer that is resistant to high-temperature oxidation and segregation by laser cladding or laser additive manufacturing processes.
9. The application according to claim 7, characterized in that: The high-temperature oxidation resistance refers to preventing oxidation of the cladding layer or deposited layer by keeping the temperature rise within 65K during high-current flow testing.
Citation Information
Patent Citations
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