一种硅片包装方法
By inspecting the side and exterior surfaces of silicon wafer assemblies and using an automated packaging method that wraps them with dust-free paper and plastic film, the problems of missed detection, false detection, and secondary damage in the silicon wafer packaging process have been solved, achieving an efficient and stable silicon wafer packaging process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TIANJIN HUANBO SCI & TECH CO LTD
- Filing Date
- 2023-04-26
- Publication Date
- 2026-07-17
AI Technical Summary
Silicon wafer packaging is prone to missed or incorrect inspections, resulting in low yield and low production efficiency. It also causes secondary damage and contamination, affecting equipment grafting rate and production costs.
Automated inspection and packaging methods are adopted, including inspection of the side and appearance of the silicon wafer assembly, wrapping the top and bottom surfaces with dust-free paper, and forming a cross-shaped packaging film by wrapping with plastic film. A six-axis robot is used to roll the packaging film and apply labels to ensure the quality and efficiency of the silicon wafer assembly.
It improves the quality and efficiency of silicon wafer packaging, reduces the risk of secondary damage and contamination, ensures the stability of product quality and packaging quality, and enhances production efficiency.
Smart Images
Figure CN116461798B_ABST