LED device and LED packaging method

Abstract

The present application relates to the technical field of LED manufacturing, and provides an LED device and an LED packaging method, the LED device comprising: a support comprising a substrate, the substrate having opposite front and back surfaces; an LED chip fixed to the front surface of the substrate; a light-transmitting member arranged on the front surface of the substrate and covering the LED chip; and a fluorescent substance arranged on the support and / or the light-transmitting member, the fluorescent substance being used to generate visible light through a fluorescent reaction when the light emitted by the LED chip irradiates. When the LED chip works, the fluorescent substance can generate visible light, so that the working state of the LED device can be conveniently detected.

Description

Technical Field

[0001] This invention belongs to the field of LED manufacturing technology, and particularly relates to an LED device and an LED packaging method. Background Technology

[0002] Light-emitting diodes (LEDs) are semiconductor light sources. Compared to traditional incandescent lamps, LEDs have advantages such as high luminous efficiency and long lifespan. To expand the application range of LEDs, ultraviolet light-emitting diode (UV-LED) lamps have emerged. Today, UV-LED lamps are already being used in fields such as biomedicine, anti-counterfeiting, and purification. The technology of UV-LED lamps is still under continuous development.

[0003] However, because UV-LED lamps emit invisible light, it is often difficult to directly observe whether a UV-LED lamp is in operation with the naked eye. If users are unknowingly exposed to ultraviolet light for extended periods, it may cause damage to their eyes and skin, leading to inconvenience and potential safety hazards. Currently, there are two main methods to address this issue. One is to add another chip that emits visible light to the device. However, in actual manufacturing, if the visible light chip is connected in parallel with the ultraviolet chip in the UV-LED lamp, one chip may fail while the other continues to function normally, resulting in misjudgment. If the visible light chip is connected in series with the ultraviolet chip in the UV-LED lamp, both the visible light and ultraviolet chips may fail simultaneously, significantly increasing the risk of device failure. The other method is to add a monitoring circuit to detect changes in current and voltage in the device's circuitry to determine its operational status. However, adding a monitoring circuit is more difficult and costly. Summary of the Invention

[0004] The purpose of this invention is to overcome at least one of the shortcomings of the prior art and to provide an LED device and lamp that can conveniently detect the working status of the LED device.

[0005] The technical solution of the present invention is: a method for packaging a lamp, comprising: a bracket including a substrate having a front side and a back side; an LED chip fixed to the front side of the substrate; a light-transmitting element disposed on the front side of the substrate and covering the LED chip; and a fluorescent material disposed on the bracket and / or the light-transmitting element, wherein the fluorescent material is used to generate visible light by undergoing a fluorescence reaction when irradiated by light emitted from the LED chip.

[0006] As a further improvement to this technical solution, the light-transmitting element encloses the LED chip.

[0007] As a further improvement to this technical solution, the bracket also includes a package body, which is annular and has an inner sidewall, a top and a bottom. The bottom of the package body is seated on the front side of the substrate, and the package body surrounds the LED chip. The light-transmitting element, the package body and the substrate together form a receiving cavity.

[0008] As a further improvement to this technical solution, the light-transmitting element is bonded to the encapsulation body by an adhesive mixed with the fluorescent material, and / or the fluorescent material is disposed in the receiving cavity.

[0009] As a further improvement to this technical solution, at least a portion of the inner wall of the package above the LED chip is provided with a mounting groove that extends through the top of the package, and the bottom and / or side of the light-transmitting element is fixed to the mounting groove by adhesive mixed with the fluorescent material.

[0010] As a further improvement to this technical solution, the fluorescent material is a fluorescent layer, which is annular, strip-shaped, circular, or polygonal; the fluorescent material is disposed on the front side of the substrate or on the inner sidewall of the package.

[0011] As a further improvement to this technical solution, a first line is provided on the front side of the substrate, the first line having an annular groove, and the fluorescent material is disposed in the annular groove.

[0012] As a further improvement to this technical solution, the light-transmitting element covers the LED chip and the phosphor layer.

[0013] As a further improvement to this technical solution, the encapsulation body is a metal cap, the upper and lower ends of which are open, the bottom of which is seated on the front side of the substrate, the light-transmitting element is connected to the upper end of the metal cap and closes the upper opening, and the fluorescent material is disposed on the front side of the substrate inside the metal cap.

[0014] The present invention also provides an LED packaging method for packaging LED devices as described in any of the above claims, comprising the following steps: preparing a support having a substrate; placing an LED chip on the front side of the substrate; and disposing a fluorescent material on the support and / or the light-transmitting element, thereby connecting the light-transmitting element to the support.

[0015] As a further improvement to this technical solution, a first line is provided on the front side of the substrate, and a receiving groove is provided on the first line. Fluorescent material is mixed with glue and filled into the receiving groove.

[0016] This invention provides an LED device and an LED packaging method. The LED device includes a bracket, an LED chip, a light-transmitting element, and a fluorescent material. The bracket includes a substrate having a front side and a back side. The LED chip is fixed to the front side of the substrate. The light-transmitting element is disposed on the front side of the substrate and covers the LED chip. The fluorescent material is disposed on the bracket and / or the light-transmitting element, and the fluorescent material is used to generate visible light by undergoing a fluorescence reaction when irradiated by light emitted from the LED chip. When the LED chip is working, the light emitted by the LED chip illuminates the fluorescent material, causing the fluorescent material to produce visible light. Therefore, the LED device and LED packaging method provided by this invention detect the working status of the LED device by setting a fluorescent material that can react with the light emitted by the LED chip to emit visible light. It is very simple and convenient to manufacture and apply. Users can easily observe the working status of the LED device, reducing the probability of safety accidents. Furthermore, this invention avoids the use of another visible light chip or monitoring circuit in the LED device, thereby avoiding the problems of increased false alarm rate, increased device failure rate, and increased manufacturing difficulty and cost caused by adding a monitoring circuit. In practical applications, the LED device mentioned in this embodiment has greater advantages. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a cross-sectional view of the LED device provided in Embodiment 1 of the present invention;

[0019] Figure 2 This is a top view of the LED device provided in Embodiment 1 of the present invention;

[0020] Figure 3 This is a schematic diagram of an LED device provided in Embodiment 1 of the present invention, excluding the light-transmitting element;

[0021] Figure 4 This is another schematic diagram of the LED device provided in Embodiment 1 of the present invention, excluding the light-transmitting element;

[0022] Figure 5 This is a cross-sectional view of the LED device provided in Embodiment 2 of the present invention;

[0023] Figure 6 This is a top view of the LED device provided in Embodiment 2 of the present invention;

[0024] Figure 7 This is a cross-sectional view of the LED device provided in Embodiment 3 of the present invention;

[0025] Figure 8 This is a top view of the LED device provided in Embodiment 3 of the present invention;

[0026] Figure 9 This is a flowchart of the first embodiment of the LED packaging method provided by an embodiment of the present invention;

[0027] Figure 10 This is a flowchart of the step of setting fluorescent material on the bracket and / or the light-transmitting element in an LED packaging method provided by an embodiment of the present invention;

[0028] Figure 11 This is a flowchart of the step of setting fluorescent material on the bracket and / or the light-transmitting element in an LED packaging method provided by an embodiment of the present invention.

[0029] In the figure: 100, LED device; 10, bracket; 11, substrate; 111, first circuit; 112, second circuit; 113, conductive hole; 115, annular groove; 12, package; 121, mounting groove; 13, receiving cavity; 14, metal cap; 141, housing part; 142, first connecting part; 143, second connecting part; 144, solder layer; 20, LED chip; 30, light-transmitting element; 40, adhesive; 50, phosphor layer. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0031] It should be noted that the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to direct setup or connection, or indirect setup or connection through centered components or centered structures.

[0032] Furthermore, in embodiments of this invention, terms such as "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, or in a conventional placement or usage state. These terms are merely for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the structures, features, devices, or elements referred to must have a specific orientation or positional relationship, nor that they must be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0033] The various specific technical features and embodiments described in the detailed embodiments can be combined in any suitable manner without contradiction. For example, different implementation methods can be formed by combining different specific technical features / embodiments. In order to avoid unnecessary repetition, the various possible combinations of the various specific technical features / embodiments in this invention will not be described separately.

[0034] Example 1:

[0035] like Figure 1 and Figure 2As shown, Embodiment 1 of the present invention provides an LED device 100, which includes a support 10, an LED chip 20, a light-transmitting element 30, and a fluorescent material. The support 10 includes a substrate 11, which has a front side and a back side. The LED chip 20 is fixed to the front side of the substrate 11. The light-transmitting element 30 and the support 10 enclose a receiving cavity 13 for housing the LED chip 20, and the light-transmitting element 30 is disposed on the front side of the substrate 11 and covers the LED chip 20. The fluorescent material is disposed on the support 10 and / or the light-transmitting element 30, and the fluorescent material is used to generate visible light by undergoing a fluorescence reaction when irradiated by the light emitted by the LED chip 20. When the LED chip 20 is working, the light emitted by the LED chip 20 irradiates the fluorescent material, enabling the fluorescent material to generate visible light. Therefore, the LED device 100 provided by the present invention can conveniently detect the working status of the LED device 100 by setting the fluorescent material. It is very simple and convenient to manufacture and use, and users can easily observe the working status of the LED device, reducing the probability of safety accidents. Furthermore, in the existing technology, there are currently two main methods for detecting the working status of LED devices. One method is to add another chip that emits visible light to the LED device. However, in actual manufacturing, if the visible light chip is connected in parallel with the LED chip, one chip may fail while the other works normally, leading to misjudgment. If the visible light chip is connected in series with the LED chip, the visible light chip may fail while the ultraviolet chip does not, which will also cause the LED device to fail. Such a series design increases the risk of overall device failure. The other method is to add a monitoring circuit to detect changes in current and voltage in the device circuit to determine whether the device is in a working state. However, adding a monitoring circuit is difficult and costly. This invention avoids using another visible light chip or monitoring circuit in the LED device, thereby avoiding the problems of increased misjudgment rate, increased failure rate, and high manufacturing difficulty and cost caused by using another visible light chip. In practical applications, the LED device mentioned in this embodiment has greater advantages.

[0036] It is understood that the LED device 100 can be used in UV-LED lamps, infrared LED lamps, and other lamps that can emit invisible light. When a fluorescent material that can react with the invisible light is provided, the working status of UV-LED lamps, infrared LED lamps, and other lamps can be detected.

[0037] In some embodiments, the bracket 10 further includes a package 12 for mounting the light-transmitting element 30 (to avoid interference between the light-transmitting element 30 and the LED chip 20, the mounting position of the light-transmitting element 30 should be higher than the top surface of the LED chip 20) thereby improving the sealing effect of the LED device 100 and enhancing its protective performance. Preferably, the package 12 is annular and has an inner sidewall, a top, and a bottom. The bottom of the package 12 sits on the front side of the substrate 11, and the package 12 surrounds the periphery of the LED chip 20. The light-transmitting element 30, the package 12, and the substrate 11 together form the receiving cavity 13. Preferably, the substrate 11 and the package 12 can be integrally formed, which is very convenient to manufacture.

[0038] Preferably, the light-transmitting element 30 is bonded to the package 12 by an adhesive 40 mixed with the fluorescent material, and / or, the fluorescent material is disposed within the receiving cavity. When the LED chip 20 emits invisible light, the fluorescent material undergoes a fluorescent reaction and emits visible light. The visible light is emitted to the outside through the light-transmitting element 30, and the human eye can then identify the working state of the LED device 100.

[0039] Preferred, such as Figure 1 As shown, at least a portion of the inner sidewall of the package 12 above the LED chip 20 is provided with a mounting groove 121 extending through the top of the package 12. The bottom and / or side of the light-transmitting element 30 is fixed to the mounting groove 121 by the adhesive 40 mixed with the fluorescent material. By fixing the adhesive 40 mixed with the fluorescent material to the mounting groove 121, not only can the fluorescent material be fixed, but the light-transmitting element 30 can also be fixed to the mounting groove 121.

[0040] For the best option, please refer to the following: Figure 5 and Figure 6 The fluorescent material is configured as a fluorescent layer 50, which can be annular, strip-shaped, circular, or polygonal. Specifically, the fluorescent layer 50 can be prepared by mixing the fluorescent material with adhesive, or by mixing the fluorescent material with other curable liquids, or the fluorescent material can directly form the fluorescent layer 50. This invention does not limit this, as long as the fluorescent material can be placed on the support and / or the light-transmitting component, and the user can observe the visible light produced by the fluorescent material. This invention does not limit the thickness, width, or shape of the fluorescent material coating, as long as the user can observe the visible light produced after the fluorescent material undergoes a fluorescent reaction.

[0041] In some embodiments, the substrate 11 has a first line 111 on its front side for connecting to the LED chip 20. The substrate 11 also has a second line 112 on its back side. A conductive hole 113 extends through both the front and back sides of the substrate 11. The first line 111 and the second line 112 are connected through the conductive hole 113, thereby achieving the connection between the LED chip 20, the first line 111, and the second line 112.

[0042] In specific applications, the first line 111 and the second line 112 on the substrate 11 can be achieved using the DPC (Direct Plating copper) process.

[0043] In some embodiments, the LED chip 20 is any one of flip chip, upright chip, or vertical chip. A soldering material is disposed on the first line 111 on the front side of the substrate 11, and then the LED chip 20 is disposed on the soldering material to achieve the connection between the LED chip 20 and the substrate 11.

[0044] In some embodiments, please combine Figure 5 and Figure 6 The first circuit 111 has an annular groove 115, and the fluorescent material is disposed within the annular groove 115, which improves the placement of the fluorescent material and prevents the flow of the liquid to be cured from affecting the use of other components in the LED device 100 when the fluorescent layer 50 is not cured. It is understood that the fluorescent layer 50 can be coated to cover the annular groove 115 or can be coated in a block shape in the annular groove 115, as long as the user can easily observe the visible light generated after the fluorescent material undergoes a fluorescent reaction.

[0045] In some embodiments, the light-transmitting element 30 is made of quartz or sapphire. However, the present invention does not limit the specific material of the light-transmitting element 30, as long as it can achieve the function of light transmission. For example, the light-transmitting element 30 can be made of PMMA (polymethyl methacrylate). Preferably, the light-transmitting element 30 can be laid flat in a square shape in the mounting groove 121. At least one of the bottom or side surfaces of the light-transmitting element 30 is connected to the groove surface of the mounting groove 121 by adhesive 40. When one of the bottom or side surfaces of the light-transmitting element 30 is connected to the groove surface of the mounting groove 121 by adhesive 40, the other side can abut against the groove surface of the mounting groove 121.

[0046] Regarding the fluorescent material, in some embodiments, the LED chip 20 is a UV-LED chip, and the fluorescent material can be ultraviolet phosphor or other fluorescent materials that can fluoresce with ultraviolet light. In some other embodiments, the LED chip 20 is a high-energy infrared laser LED chip, and the fluorescent material can be infrared phosphor or other fluorescent materials that can fluoresce with high-energy infrared laser light. It is understood that, apart from the fluorescent materials mentioned above, the present invention does not limit the specific materials of the fluorescent material, as long as it is configured to correspond to the LED chip and can fluoresce with the invisible light emitted by the LED chip to detect the working state of the LED chip.

[0047] In practical applications, since some fluorescent materials have light-absorbing properties, in order to avoid the fluorescent materials absorbing the light emitted by the LED chip 20 and affecting the use of the LED device 100, and to ensure that the fluorescent materials are in sufficient quantity to produce visible light, the concentration of the fluorescent materials mixed in the adhesive 40 can be 5% to 10%.

[0048] It is understood that the adhesive 40 containing the fluorescent material may be in a ring shape (see [link to product description]). Figure 3 ) or block (see Figure 4 The adhesive 40 containing the fluorescent material is distributed on the front side of the substrate 11 and located inside the package 12 or disposed on the inner sidewall of the package 12. The present invention does not limit the thickness, width and shape of the adhesive 40 coating, as long as the user can easily observe the visible light generated after the fluorescent material undergoes a fluorescent reaction, and can play an adhesive role when bonding the light-transmitting element 30 to the package 12.

[0049] It should be noted that, in addition to the preferred method of placing the fluorescent material in the mounting groove 121, in some other embodiments, the fluorescent material can also be placed inside the receiving cavity, or even outside the receiving cavity. For example, the fluorescent material can be placed on the surface (outer or inner side) of the transparent part 30 or on the front side of the substrate 11. The fluorescent material can also be placed in the interlayer of the transparent part 30. The present invention does not impose specific restrictions on the placement position of the fluorescent material, as long as the fluorescent material is placed on the LED device 100 and does not affect the reaction between the fluorescent material and the light emitted by the LED chip 20 to produce visible light that can be observed by the user.

[0050] It is understood that the adhesive 40 refers to a coating with adhesive properties. When the LED chip 20 is a UV-LED chip, the adhesive 40 is a UV-resistant adhesive, typically made from materials such as silicone, epoxy resin, and fluororesin. Of course, this invention does not limit the specific materials of the adhesive 40, as long as the adhesive's lifespan meets the lifespan of the device.

[0051] It is understood that the fluorescent material can be placed in the LED device 100 in a manner not limited to mixing the fluorescent material with the adhesive 40 as described above. Alternatively, it can be placed in the bracket 10 and / or the light-transmitting element 30 by mixing the fluorescent material with a curable liquid to form a fluorescent block or layer containing the fluorescent material. The present invention does not limit the method of placing the fluorescent material, as long as the fluorescent material can be fixed in the LED device 100 and the user can observe the visible light generated by the fluorescent material.

[0052] Example 2:

[0053] like Figure 5 and Figure 6 As shown, Embodiment 2 of the present invention provides an LED device 100. Unlike Embodiment 1, the light-transmitting element 30 in Embodiment 2 is hemispherical and directly wraps the LED chip 20. The bracket 10 does not include the encapsulation body 12 in Embodiment 1. The structure is simple, the size is small, and the protection of the LED chip 20 is better, and the effect of isolating moisture is better.

[0054] Specifically, the LED device 100 includes a support 10, an LED chip 20, a light-transmitting element 30, and a fluorescent material. The support 10 includes a substrate 11, which has a front side and a back side. The LED chip 20 is fixed to the front side of the substrate 11. The light-transmitting element 30 is disposed on the front side of the substrate 11 and covers the LED chip 20. The fluorescent material is disposed on the support 10 (substrate 11) and / or the light-transmitting element 30, and is used to generate visible light by undergoing a fluorescence reaction when irradiated by light emitted from the LED chip 20. When the LED chip 20 is working, the light emitted by the LED chip 20 irradiates the fluorescent material, enabling the fluorescent material to generate visible light. Therefore, the LED device 100 provided by this invention can conveniently detect the working status of the LED device 100 by setting the fluorescent material. It is very simple and convenient to manufacture and apply, and users can easily observe the working status of the LED device, reducing the probability of safety accidents. Furthermore, there are currently two main methods for detecting the operating status of LED devices in the existing technology. One method is to add another chip that emits visible light into the device. However, in actual manufacturing, if the visible light chip is connected in parallel with the LED chip, one chip may fail while the other works normally, leading to misjudgment. If the visible light chip is connected in series with the LED chip, the visible light chip may fail while the ultraviolet chip does not, also causing device failure. Such a series design increases the risk of overall device failure. The other method is to add a monitoring circuit to detect changes in current and voltage in the device circuit to determine whether the device is in a working state. However, adding a monitoring circuit is difficult and costly. This invention avoids using another visible light chip or monitoring circuit in the LED device, thus avoiding the problems of increased misjudgment rate, increased device failure rate, and increased manufacturing difficulty and cost caused by adding a monitoring circuit. In practical applications, this device has greater advantages.

[0055] It is understood that the light-transmitting element 30 can be made of light-resistant materials such as silicone, epoxy resin, and fluororesin. The light-transmitting element 30 can be directly molded (compression molding, also known as pressing or compression molding) onto the front side of the substrate 11 using a mold.

[0056] Example 3:

[0057] like Figure 7 and Figure 8As shown, Embodiment 3 of the present invention provides an LED device 100. Unlike Embodiment 1, the package 12 in Embodiment 3 is a metal cap 14. The LED device 100 includes a support 10, an LED chip 20, a light-transmitting element 30, and a fluorescent material. The support 10 includes a substrate 11, which has a front and a back side. The LED chip 20 is fixed to the front side of the substrate 11. The light-transmitting element 30 and the support 10 enclose a receiving cavity 13 for housing the light-transmitting element 30. The fluorescent material is disposed on the support 10 and / or the light-transmitting element 30, and is used to generate visible light by undergoing a fluorescence reaction when irradiated by light emitted from the LED chip 20. When the LED chip 20 is working, the light emitted by the LED chip 20 irradiates the fluorescent material, enabling the fluorescent material to generate visible light. Therefore, the LED device 100 provided by the present invention can conveniently detect the working state of the LED device 100 by setting the fluorescent material. Its manufacturing and application are very simple and convenient, allowing users to easily observe the working state of the LED device and reducing the probability of safety accidents. Furthermore, there are currently two main methods for detecting the operating status of LED devices in the existing technology. One method is to add another chip that emits visible light into the device. However, in actual manufacturing, if the visible light chip is connected in parallel with the LED chip, one chip may fail while the other works normally, leading to misjudgment. If the visible light chip is connected in series with the LED chip, the visible light chip may fail while the ultraviolet chip does not, which greatly increases the risk of device failure. The other method is to add a monitoring circuit to detect changes in current and voltage in the device circuit to determine whether the device is in a working state. However, adding a monitoring circuit is difficult and costly. This invention avoids using another visible light chip or monitoring circuit in the LED device, thus avoiding the problems of increased misjudgment rate, increased device failure rate, and high manufacturing difficulty and cost caused by using another visible light chip. In practical applications, this device has greater advantages.

[0058] Specifically, the metal cap 14 has openings at both its upper and lower ends. The bottom of the metal cap 14 is seated on the front side of the substrate 11. The light-transmitting element 30 is connected to the upper end of the metal cap 14 and closes the upper opening. The metal cap 14 surrounds the LED chip 20. The light-transmitting element 30, the metal cap 14, and the substrate 11 together form the receiving cavity 13. The fluorescent material is disposed on the front side of the substrate 11 and inside the metal cap 14.

[0059] In some embodiments, the metal cap 14 includes a housing portion 141 and a first connecting portion 142 and a second connecting portion 143 extending from both ends of the housing portion 141 along a length direction perpendicular to the housing portion 141. The first connecting portion 142 is located at the upper end of the metal cap 14, and the second connecting portion 143 is located at the lower end of the metal cap 14. The first connecting portion 142 is used to connect with the light-transmitting element 30, and the second connecting portion 143 is used to connect with the substrate 11.

[0060] Furthermore, the housing portion 141 is annular, and the first connecting portion 142 is formed by extending the housing portion 141 inward along a length direction perpendicular to the housing portion 141. The length of the first connecting portion 142 is less than the length of the light-transmitting element 30. The second connecting portion 143 is formed by extending the housing portion 141 outward along a length direction perpendicular to the housing portion 141. The first connecting portion 142 surrounds a portion of the top surface of the light-transmitting element 30, and the housing portion 141 surrounds the side surface of the light-transmitting element 30.

[0061] It is understood that the light-transmitting element 30 and the upper end of the metal cap 14 can be connected by high-temperature sintering using glass solder as a medium, and the substrate 11 and the lower end of the metal cap 14 can be welded to form a weld layer 144.

[0062] Example 4:

[0063] like Figure 9 As shown, Embodiment 4 of the present invention provides an LED packaging method, which is used to package the above-mentioned LED device 100, in conjunction with... Figures 1 to 9 The LED packaging method includes the following steps:

[0064] S101: Prepare a support 10 with a substrate 11;

[0065] S102: The LED chip 20 is disposed on the front side of the substrate 11;

[0066] S103: Provide fluorescent material on the bracket 10 and / or the light-transmitting element 30, so that the light-transmitting element 30 is connected to the bracket 10.

[0067] In the step of fabricating the support 10 with substrate 11, when fabricating the substrate 11, a first line 111 and a second line 112 for connecting to the LED chip 20 can be respectively provided on the front and back sides of the substrate 11. The first line 111 and the second line 112 can be fabricated using DPC (Direct Plating copper) process. Furthermore, the second line 112 can be provided on the back side of the substrate 11. The substrate 11 has a conductive hole 113 penetrating the substrate 11, and the first line 111 and the second line 112 are connected through the conductive hole 113, thereby enabling the connection between the LED chip 20, the first line 111, and the second line 112, and facilitating the electrical connection of the LED chip 20 within the support 10.

[0068] In practical applications, nickel-gold plating can be applied to the first line 111 and the second line 112 to prevent metal migration and oxidation on the lines and to improve conductivity and oxidation resistance. Specifically, the nickel plating thickness is required to be >3µm and the gold plating thickness >0.05µm to ensure conductivity and oxidation resistance.

[0069] The step of placing the LED chip 20 on the front side of the substrate 11 is to fix the LED chip 20 to the substrate 11. In some embodiments, the LED chip 20 is a flip chip, and the first line 111 includes pads. Soldering material is placed on the pads, and then the LED chip 20 is placed on the soldering material to achieve the connection between the LED chip 20 and the substrate 11. Typically, the first pads are formed simultaneously when the first line 11 is fabricated. Preferably, the soldering material is placed on the first line 111 by dot application. It is understood that the soldering material can be dotted on the first line 111 manually or mechanically, for example, by using a robotic arm to evenly apply a fixed amount of soldering material, thereby further improving the soldering effect.

[0070] Understandably, to make the bonding between the LED chip 20 and the substrate 11 more robust, the ceramic substrate 11 with the chip bonded can be eutecticized using a eutectic furnace. In specific applications, when the pads can be made of a gold-tin alloy, the temperature of the eutectic furnace must have at least one temperature zone between 300°C and 340°C, and the eutectic process requires nitrogen protection.

[0071] Regarding the step of setting fluorescent material on the bracket 10 and / or the light-transmitting element 30, the fluorescent material can be set by mixing the fluorescent material with adhesive and then coating it onto the bracket 10 and / or the light-transmitting element 30, or by setting a fluorescent block containing fluorescent material made by mixing fluorescent material with a curable liquid onto the bracket 10 and / or the light-transmitting element 30, or by directly forming a fluorescent layer 50, etc., as long as the fluorescent material can be fixed in the LED device 100 and the user can observe the visible light generated by the fluorescent material.

[0072] It is understood that the adhesive refers to a coating with bonding function, and the adhesive can be made of materials such as silicone, epoxy resin, and fluororesin. This invention does not limit the specific materials of the adhesive. Furthermore, the method of curing the adhesive can include allowing it to cure naturally, baking, or UV curing. It is understood that the curing method is not limited to these methods; any method that can cure the adhesive is acceptable. For example, if the adhesive requires baking to cure, baking curing is used; if it can be cured directly by UV light irradiation, UV curing is used; and for other types of adhesives, the corresponding curing method is used.

[0073] Preferably, the fluorescent material is a fluorescent layer, which can be distributed in the support 10 and / or the light-transmitting element 30 in the form of a ring, strip, circle, polygon, or block without a specific shape. The present invention does not limit the thickness, width, and shape of the fluorescent material coating, as long as the user can easily observe the visible light generated after the fluorescent material undergoes a fluorescent reaction.

[0074] For the step of connecting the light-transmitting element 30 to the bracket 10, the connection method between the light-transmitting element 30 and the bracket 10 may be slightly different for different structural shapes. However, as long as the light-transmitting element 30 and the bracket 10 enclose and form a receiving cavity 13 for accommodating the light-transmitting element 30, or the light-transmitting element 30 is disposed on the front side of the substrate 11 and covers the LED chip 20, it is acceptable.

[0075] As one of the optional implementation methods of this embodiment, reference can be made to Embodiment 1 of the invention, combined with... Figures 1 to 4The light-transmitting element 30 and the support 10 can be encapsulated and connected using a semi-inorganic encapsulation method. Specifically, after the step of preparing the substrate 11, an encapsulation body 12 connected to the substrate 11 needs to be prepared. At least a portion of the inner sidewall of the encapsulation body 12 above the LED chip 20 is provided with a mounting groove 121 that extends through the top of the encapsulation body 12. Then, the bottom of the encapsulation body 12 is placed on the front side of the substrate 11, and the encapsulation body 12 surrounds the LED chip 20. Then, the bottom of the light-transmitting element 30 is placed in the mounting groove 121. Then, the bottom and / or the side of the light-transmitting element 30 is fixed to the mounting groove 121 with adhesive. Finally, the adhesive is cured. It is understood that the placement of the fluorescent material can be optimized and adjusted according to the different structural shapes of the light-transmitting element 30 and the support 10. In Embodiment 1, the fluorescent material can be mixed with the aforementioned adhesive to fix both the light-transmitting element 30 and the fluorescent material in the mounting groove 121. This allows for the bonding of the light-transmitting element 30 and the encapsulation body 12 while simultaneously placing the fluorescent material. Preferably, the substrate 11 and the encapsulation body 12 can be integrally formed, which is very convenient for manufacturing.

[0076] As another optional implementation of this embodiment, reference can be made to Embodiment 2 of the invention, combined with... Figure 5 and Figure 6 The light-transmitting element 30 and the support 10 can be encapsulated and connected using an organic encapsulation method. Specifically, the light-transmitting element 30 can be made of moldable materials such as silicone, epoxy resin, and fluororesin. After the step of setting fluorescent material on the support 10 and / or the light-transmitting element 30, the light-transmitting element 30 can be directly molded onto the front side of the substrate 11 using a mold to complete the connection between the light-transmitting element 30 and the support 10. It is understood that the placement position of the fluorescent material can also be adjusted according to the different structural shapes of the light-transmitting element 30 and the support 10. In the second embodiment of the invention, a fluorescent layer 50 with the fluorescent material can be provided on the front side of the substrate 11 for easy observation by the user. The fluorescent layer 50 can be made by mixing the fluorescent material with adhesive 40, or by mixing the fluorescent material with other curable liquids. The present invention does not limit this, as long as the fluorescent material can be placed on the substrate 11.

[0077] As another optional implementation of this embodiment, reference can be made to Embodiment 3 of the invention, in combination with... Figure 7 and Figure 8The light-transmitting element 30 and the support 10 can be encapsulated and connected using a fully inorganic encapsulation method. Specifically, after preparing the substrate 11, an encapsulation body 12 connected to the substrate 11 needs to be prepared. The encapsulation body 12 is a metal cap 14, with openings at both the upper and lower ends. After fluorescent material is placed on the support 10 and / or the light-transmitting element 30, the upper ends of the light-transmitting element 30 and the encapsulation body 12 are connected by high-temperature sintering using glass solder as a medium. The light-transmitting element 30 also seals the opening at the upper end of the metal cap 14 to achieve a seal for the LED device 100. Finally, the lower end of the metal cap 14 is welded to the front side of the substrate 11 to form a welding layer 144.

[0078] like Figure 10 As shown, in another optional embodiment of this invention, the step of providing fluorescent material on the support 10 and / or the light-transmitting element 30 further includes:

[0079] S1031: A first line 111 is provided on the front side of the substrate 11, and a receiving groove is provided on the first line 111. Fluorescent material is mixed with glue and filled into the receiving groove.

[0080] This embodiment, by providing a receiving groove, allows for the convenient placement of adhesive containing fluorescent material, preventing the adhesive to be cured from flowing and affecting the use of other components in the LED device 100.

[0081] like Figure 11 As shown, in one optional embodiment of this invention, the preparation steps of the fluorescent material include:

[0082] S1032: Place the fluorescent material in the glue;

[0083] S1032: Stir the fluorescent material and the adhesive;

[0084] S1034: Remove air bubbles from the adhesive containing the fluorescent substance.

[0085] Preferably, since some fluorescent materials have light-absorbing properties, to avoid the fluorescent materials absorbing the light emitted by the LED chip 20 and affecting the use of the LED device 100, and to ensure that the fluorescent materials are present in sufficient quantity to generate visible light, the concentration of the fluorescent materials mixed in the adhesive 40 can be controlled to be 5% to 10% when the fluorescent materials are placed in the adhesive. To ensure the concentration, the present invention can also be equipped with an intelligent robotic arm, which uniformly distributes a fixed amount of fluorescent materials and adhesive, thereby ensuring the illumination and detection effects of the LED device 100.

[0086] It is understood that stirring the fluorescent material and the adhesive can be achieved manually or mechanically. For example, a smart robotic arm can be used to stir the mixture evenly, thereby further improving the luminescence effect of the fluorescent material. Removing air bubbles from the adhesive containing the fluorescent material can also be achieved manually or mechanically, for example, by using a degassing machine to remove air bubbles, thereby further improving the luminescence effect of the fluorescent material.

[0087] This embodiment improves the luminescence effect of the fluorescent material by stirring the fluorescent material and the adhesive and removing air bubbles from the adhesive containing the fluorescent material, thereby making it easier for users to detect the working status of the LED device 100.

[0088] The present invention provides an LED device and an LED packaging method. The LED device 100 includes: a support 10, an LED chip 20, a light-transmitting element 30, and a fluorescent material. The support 10 includes a substrate 11, which has a front side and a back side. The LED chip 20 is fixed to the front side of the substrate 11. The light-transmitting element 30 and the support 10 enclose a receiving cavity 13 for housing the light-transmitting element 30; alternatively, the light-transmitting element 30 is disposed on the front side of the substrate 11 and covers the LED chip 20. The fluorescent material is disposed on the support 10 and / or the light-transmitting element 30, and the fluorescent material is used to generate visible light by undergoing a fluorescence reaction when irradiated by light emitted from the LED chip 20. When the LED chip is working, the light emitted by the LED chip illuminates the fluorescent material, causing the fluorescent material to produce visible light. Therefore, the LED device and LED packaging method provided by this invention detect the working status of the LED device by setting a fluorescent material that can react with the light emitted by the LED chip to emit visible light. It is very simple and convenient to manufacture and apply. Users can easily observe the working status of the LED device, reducing the probability of safety accidents. Furthermore, this invention avoids the use of another visible light chip or monitoring circuit in the LED device, thereby avoiding the problems of increased false alarm rate, increased device failure rate, and increased manufacturing difficulty and cost caused by adding a monitoring circuit. In practical applications, this device has greater advantages.

[0089] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An LED device, characterized in that, include: The support includes a substrate having opposing front and back sides; LED chip, the LED chip being fixed to the front side of the substrate; A light-transmitting element is disposed on the front side of the substrate and covers the LED chip; A fluorescent material is disposed on the support and / or the light-transmitting element, and the fluorescent material is used to generate visible light by undergoing a fluorescent reaction when irradiated by light emitted from the LED chip. The support also includes a package, which is annular and has an inner wall, a top, and a bottom. The bottom of the package sits on the front side of the substrate. The package surrounds the LED chip. The light-transmitting element, the package, and the substrate together form a receiving cavity. At least a portion of the inner wall of the package above the LED chip has a mounting groove penetrating the top of the package. The bottom and / or sides of the light-transmitting element are fixed to the mounting groove by adhesive mixed with the fluorescent material; or The front side of the substrate is provided with a first line, the first line having an annular groove, and the fluorescent material is disposed in the annular groove.

2. The LED device according to claim 1, characterized in that, The light-transmitting element encloses the LED chip.

3. The LED device according to claim 1 or 2, characterized in that, The fluorescent material is a fluorescent layer, which is ring-shaped, strip-shaped, circular, or polygonal.

4. An LED packaging method, characterized in that, A method for encapsulating an LED device as described in any one of claims 1 to 3 includes the following steps: Prepare a support with a substrate; The LED chip is disposed on the front side of the substrate; A fluorescent material is disposed on the bracket and / or the light-transmitting element, so that the light-transmitting element is connected to the bracket.

5. The LED packaging method according to claim 4, characterized in that, The step of applying fluorescent material to the bracket and / or the light-transmitting element includes: A first line is provided on the front side of the substrate, and a receiving groove is provided on the first line. Fluorescent material is mixed with glue and filled into the receiving groove.

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