Optical image stabilization device and electronic device

Abstract

The application provides an optical image stabilization device and an electronic device, wherein the optical image stabilization device adopts a moving image sensor chip to perform motion compensation, and comprises a stator, a rotor and a transmission assembly connecting the stator and the rotor, the rotor comprises a bearing plate and an image sensor chip, the transmission assembly is arranged around the image sensor chip, and the rotor moves in X and Y directions and rotates in an XY plane under the action of the transmission assembly to perform shake compensation; wherein the X and Y directions and the XY plane are parallel to a photosensitive surface of the image sensor chip; the transmission assembly comprises a shape memory alloy piece, two ends of the shape memory alloy piece are fixedly connected to the stator, and a middle part of the shape memory alloy piece is fixedly connected or movably connected to the rotor. The optical image stabilization device and the electronic device provided by the application can realize optical image stabilization with a large stroke in a limited space.

Description

Technical Field

[0001] This invention relates to the field of image imaging technology, and in particular to an optical image stabilization device and electronic device. Background Technology

[0002] When taking photos or videos with handheld portable smart devices, the physiological tremors of the human body and external vibrations inevitably interfere with the devices. The physiological tremors of the human body cannot be overcome through training, and the external vibrations change with the environment. As a result, handheld portable smart devices will inevitably be affected by the above factors when taking photos or videos, resulting in unwanted shaking, which leads to a decrease in image quality. The most obvious manifestation is that the photos or videos are blurry and unclear.

[0003] Current handheld portable smart devices use lens components within their camera modules that can move in the X and Y directions to compensate for physiological tremors and external vibrations, resulting in high-quality images. However, with technological advancements and increasing consumer demands for image quality, the camera modules of existing handheld portable smart devices have become proportionally larger and heavier due to the increased size of the image sensor. Traditional methods of lens movement compensation in the X and Y directions are increasingly insufficient to move the heavy lenses. Furthermore, the angle that can be compensated for using these methods in the X and Y directions can no longer meet customers' demands for image quality.

[0004] In existing technologies, optical image stabilization methods provided by moving the image sensor chip are structurally complex and mostly applied to SLR digital cameras, with few examples of mass production in handheld portable smart devices. Furthermore, in optical image stabilization solutions using moving image sensors, the electrical connection between the image sensor and the bottom circuit board has always been a difficult problem to solve. Ordinary ultra-high pixel image sensor chips often have hundreds of pads, and the corresponding electrical connections typically use gold wire bonding. Gold wires are short and rigid, making it very difficult, if not impossible, to move a chip connected by hundreds of gold wires. Summary of the Invention

[0005] The purpose of this invention is to provide an optical image stabilization device that uses a mobile image sensor chip for motion compensation, which is difficult to meet the compensation requirements for certain angles and is therefore insufficient to meet the requirements for high image quality.

[0006] To address the aforementioned technical problems, the present invention proposes the following technical solution: An optical image stabilization device, employing a moving image sensor chip for motion compensation, includes: A stator, a mover, and a transmission assembly connecting the stator and the mover, wherein the mover includes a carrier plate and an image sensor chip, the transmission assembly is arranged around the image sensor chip, and the mover moves in the X and Y directions and rotates in a plane under the action of the transmission assembly to perform jitter compensation; The transmission assembly includes a shape memory alloy component, with both ends of the shape memory alloy component fixedly connected to the stator, and the middle of the shape memory alloy component fixedly or movably connected to the mover.

[0007] Preferably, the transmission assembly includes a first clamping part and a second clamping part, and the stator is provided with a plurality of first clamping parts, and two adjacent first clamping parts are respectively fixedly connected to the two ends of a shape memory alloy part; The mover is provided with a plurality of second clamping parts, each of which is fixedly or movably connected to the middle of the shape memory alloy part.

[0008] Preferably, the transmission assembly is freely movable within at least one of the second clamping portions.

[0009] Preferably, at least one of the second clamping portions clamps the transmission assembly.

[0010] Preferably, the first clamping portion includes a bent portion, which clamps the end of the transmission assembly.

[0011] Preferably, the first clamping part includes a bending part, and the bending radius of the bending part of the second clamping part is greater than the diameter of the transmission assembly.

[0012] Preferably, electrodes are connected to both ends of the shape memory alloy part, or electrodes are connected to both ends and the middle of the shape memory alloy part respectively.

[0013] Preferably, the displacement of the image sensor is fed back by the change in resistance of the shape memory alloy component after it is energized.

[0014] Preferably, the stator includes a circuit board, and a groove or hollow portion is provided in the middle of the circuit board, the groove or hollow portion being adapted to accommodate the mover.

[0015] Preferably, the stator further includes a reinforcing steel sheet disposed at the bottom of the groove or the hollow portion to increase the strength of the circuit board.

[0016] Preferably, the stator includes a circuit board, and the first clamping portion is disposed on the circuit board.

[0017] Preferably, the circuit board is further provided with a connector and a control unit, which are respectively disposed on both sides of the mover.

[0018] Preferably, the mover is further provided with an infrared filter bracket, which supports the infrared filter film located on the upper surface of the image sensor chip. A distance is provided between the outer frame of the infrared filter bracket and the outer shell, and the distance is the movement range of the mover.

[0019] Preferably, a signal transmission unit is provided between the image sensor chip and the circuit board, and the signal transmission unit realizes the electrical connection between the image sensor chip and the circuit board.

[0020] Preferably, the signal transmission unit includes a metal circuit formed by etching.

[0021] Preferably, the signal transmission unit is an elastic connection component, which has a vertically upward pre-deformation, suitable for providing Z-direction pre-pressure to the image sensor chip.

[0022] Preferably, the mover includes a movable carrier plate, and the image sensor chip is disposed on the movable carrier plate; the image sensor chip is electrically connected to the signal transmission unit.

[0023] Preferably, the mover includes a movable carrier plate, the image sensor chip is electrically connected to the movable carrier plate, and the movable carrier plate is electrically connected to the signal transmission unit.

[0024] Preferably, at least three support members are provided on the reinforcing steel sheet, which are suitable for leaving a gap of a predetermined height between the image sensor and the circuit board.

[0025] Preferably, the predetermined height is greater than or equal to 10 micrometers.

[0026] Preferably, the shape memory alloy part includes a filamentous, spiral, bent, or curved shape.

[0027] The present invention also provides an electronic device, comprising: The optical image stabilization device described above; A lens, located on the optical image stabilization device, is adapted to move in the Z direction to adjust the focal length.

[0028] Compared with the prior art, the flexible connection component, optical image stabilization device and electronic device provided by the technical solution of the present invention have the following beneficial effects: The optical image stabilization device provided by this invention, comprising a stator, a mover, and a transmission assembly connecting the stator and the mover, increases the travel distance of the mover without increasing the area of ​​the mover and the stator, the distance between them, or changing other positional relationships. This is achieved by including a shape memory alloy component in the transmission assembly, with both ends of the shape memory alloy component fixedly connected to the stator and the middle of the shape memory alloy component fixedly or movably connected to the mover.

[0029] Furthermore, the optical image stabilization device provided by this invention uses an image sensor chip for motion compensation. By placing the elastic connecting component below the image sensor chip, the electrical connection of the chip is achieved, while ensuring that the image sensor chip can be flexibly driven by the actuator, thereby moving in the X and Y directions and rotating in the plane. The overall structure is simple and the manufacturing process is also simple. At the same time, it effectively reduces the thickness of the entire optical image stabilization device, enabling the device to adapt to the needs of more different situations, improving reliability and image quality.

[0030] Building upon this, the optical image stabilization device of the present invention utilizes a hollow design to achieve spatial overlap between the image sensor chip, the carrier plate, and the lower substrate. For example, a hollow portion can be provided in the carrier plate, and the image sensor can be placed within the hollow portion; similarly, a hollow portion can be provided on the lower substrate on which the carrier plate is placed, and the image sensor can be placed within the hollow portion. This spatial overlap structure further reduces the thickness of the optical image stabilization device. Attached Figure Description

[0031] Figure 1 An exploded view of the optical image stabilization device in the embodiments provided by the present invention; Figure 2 This is a top-angle view of the structure of the optical image stabilization device in the embodiments provided by the present invention; Figure 3 This is a top view of the structure of the optical image stabilization device in the embodiments provided by the present invention; Figure 4 This is a schematic diagram of the transmission component in the embodiment provided by the present invention; Figure 5 This is a schematic diagram of the stator structure of the optical image stabilization device in the embodiments provided by the present invention; Figure 6 This is a schematic diagram of the structure of the upper surface of the mover and the elastic connection assembly of the optical image stabilization device in the embodiments provided by the present invention; Figure 7 This is a schematic diagram of the bottom structure of the optical image stabilization device in the embodiments provided by the present invention; Figure 8This is a schematic diagram of the structure of the lower surface of the mover and the elastic connection assembly in one embodiment of the optical image stabilization device provided by the present invention; Figure 9 This is a schematic diagram of the structure of the lower surface of the mover and the elastic connection assembly in another embodiment of the optical image stabilization device provided in the present invention. Detailed Implementation

[0032] Numerous specific details are set forth in the following description to provide a full understanding of the invention. However, the invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0033] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, the schematic diagrams are merely examples for ease of explanation and should not limit the scope of protection of the present invention.

[0034] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the image sensor optical image stabilization method of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] The present invention provides an optical image stabilization device that uses a moving image sensor chip for motion compensation. This device enables the image sensor chip to replace the lens in X and Y direction movement and planar rotation, thereby achieving motion compensation for optical image stabilization. The following is in conjunction with... Figures 1 to 9 The embodiments provided by the technical solution of the present invention are described in detail.

[0036] Specifically, such as Figure 1 As shown, Figure 1 This is a three-dimensional structural diagram of an optical image stabilization device according to an embodiment of the present invention. Figure 1 The optical image stabilization device shown employs a moving image sensor chip for motion compensation, including: The stator 300, the mover 200, and the transmission assembly 700 connecting the stator 300 and the mover 200 are provided. The mover 200 includes a movable carrier plate 210 and an image sensor chip 100. The transmission assembly 700 is arranged around the image sensor chip 100, and the mover 200 moves in the X and Y directions and rotates in a plane under the action of the transmission assembly 700 to perform jitter compensation.

[0037] Combination Figure 2 and Figure 3 As shown, the transmission assembly 700 includes a shape memory alloy part 77, the two ends of which are fixedly connected to the stator 300, and the middle of which is fixedly or movably connected to the mover 200.

[0038] Specifically, shape memory alloys (SMAs) are materials composed of two or more metallic elements that exhibit shape memory effect (SME) through thermoelastic and martensitic phase transformations and their inverse transformations. Shape memory alloys possess both shape memory effect and deformation recovery capability. In this embodiment, the shape memory alloy component 77 in the transmission assembly 700 has the characteristic of stretching or contracting when energized and returning to its original shape when energized.

[0039] Specifically, the shape memory alloy part is filamentous, spiral, curved, bent, spring-like, or other shapes, or a combination of these shapes. This application specifically uses a filamentous shape memory alloy part as a specific embodiment to illustrate the principle of the solution. However, this application is not limited to the application of the shape memory alloy part being only filamentous.

[0040] Preferably, the transmission assembly 700 includes a first clamping part 71 and a second clamping part 72. The stator 300 is provided with a plurality of first clamping parts 71, and two adjacent first clamping parts 71 are respectively fixedly connected to both ends of a shape memory alloy component 77. The mover is provided with a plurality of second clamping parts 72, and each second clamping part 72 is fixedly or movably connected to the middle of a shape memory alloy component 77.

[0041] refer to Figure 4 The diagram illustrates one specific embodiment of the second clamping portion 72. In this embodiment, the second clamping portion 72 has a bent portion 72a through which the shape memory alloy member 77 passes. In some embodiments, the bending radius of the bent portion of the second clamping portion is larger than the diameter of the transmission assembly, allowing the shape memory alloy member 77 to move freely within the bent portion 72a. In some embodiments, the bent portion of the second clamping portion is in a compressed state, with the middle of the shape memory alloy member 77 fixed within the bent portion 72a.

[0042] Similarly, the first clamping part 71 also has a bent part, in which one end of the shape memory alloy part is clamped and fixed.

[0043] In other embodiments, the first clamping part 71 or the second clamping part 72 may also be other embodiments, that is, the two ends of the shape memory alloy part 77 may be fixed by other fixing methods, and the middle of the shape memory alloy part 77 may be clamped or penetrated through it in other ways and be movable. For example, the first clamping part 71 may also be other forms of grippers, and the second clamping part 72 may also be an end with a through hole.

[0044] Continue to refer to Figures 1 to 3 As shown, in this embodiment, the transmission assembly 700 is arranged around the mover.

[0045] Specifically, the photosensitive area of ​​the image sensor chip 100 is located in the XY plane, and the transmission component 70 is configured to allow the mover 200 to move and rotate in the XY plane for jitter compensation.

[0046] In this embodiment, an image sensor chip 100 is centrally located on the mover 200. The transmission assembly 700 is positioned such that the center of the photosensitive area of ​​the image sensor chip 100 is located at the center of the area surrounding the transmission assembly, and also at the center of the area surrounding the second clamping portion 72. Each pair of first clamping portions 71 are symmetrically located on both sides of each second clamping portion 72. The transmission assemblies 70 on each opposite side of the photosensitive area of ​​the image sensor chip 100 are also symmetrically arranged.

[0047] In some embodiments, all the second clamping portions 72 are implementations of through-holes or bends that allow the shape memory alloy member 77 to move. In other embodiments, the bends 72 of at least one side of the second clamping portion 72 or at least the opposite sides of the second clamping portions 72 are in a state of clamping and fixing the shape memory alloy member 77 passing through them.

[0048] In this embodiment, the mover 200 is square, the image sensor chip 100 is located at the center of the mover 200, and the transmission assembly 700 is arranged around the four sides of the mover 200.

[0049] The fixed ends of the first clamping portions 71 of the transmission assembly 700 are respectively fixedly disposed on the stator 300 and located near the four corners of the mover. The bent portions of the first clamping portions 71 are disposed facing the mover. A shape memory alloy part 77 is connected between the first clamping portions 71 at both ends of one side of the mover 200.

[0050] The second clamping part 72 is located at the center of the four sides of the moving part. The fixed end of the second clamping part 72 is fixed near the side of the moving part 200, and the bent part is located on the side of the moving part 200, in the middle of the first clamping part 71 facing the two ends of the same side of the moving part 200.

[0051] This configuration ensures that the shape memory alloy part 77 can smoothly stretch and deform between the stator 300 and the mover 200 without being obstructed or blocked by other parts of the first clamping part 71 or the second clamping part 72.

[0052] Furthermore, the first clamping part 71 and / or the second clamping part 72 are energized electrodes, energizing the shape memory alloy part 77. In practical applications, when the mover needs to perform optical compensation jitter in the X direction and / or Y direction, the transmission component 700 on the corresponding side of the X direction and / or Y direction, under the action of a control signal, will retract or extend accordingly to generate corresponding displacement or rotation, thereby completing the required optical compensation movement.

[0053] Furthermore, a sensing unit can be provided to sense the resistance of the shape memory alloy component 77 after it is energized. The change in resistance of each shape memory alloy component 77 after energization provides feedback on the displacement of the mover in the X and Y directions, thereby obtaining the displacement of the image sensor chip. This allows for determination of whether the image sensor chip has completed the required optical compensation movement.

[0054] Furthermore, by comparing the displacement of the obtained image sensor chip with the displacement of the target optical jitter compensation, it is determined whether to continue to power on or de-power the corresponding shape memory alloy part 77.

[0055] The shape memory alloy component 77 is fixedly connected to the stator 300 at both ends and pulled to the mover 200 in the middle, so that the mover 200 can obtain a large stroke in a limited space.

[0056] Compared to the case where one end of the shape memory alloy part 77 is fixed to the stator 300 and the other end is pulled to the mover 200, the stroke of the solution provided in this embodiment can be increased by at least 10%.

[0057] Specifically, in one prior art implementation, one end of the shape memory alloy part 77 is fixed to the stator 300, and the other end is pulled to the mover 200. In this case, the shape memory alloy part can be stretched to 100 μm.

[0058] In this embodiment, the shape memory alloy component 77 is fixedly connected to the stator 300 at both ends and pulled to the mover 200 in the middle to maintain its movement. This increases the overall extension length of the shape memory alloy component 77, allowing it to extend to 110 μm, while keeping other structural elements unchanged. This allows the mover 200 to achieve a larger stroke within a limited space.

[0059] Furthermore, the image sensor chip 100, the movable carrier 210, and the circuit board 310 in this invention can have various different combined structural forms, and specific embodiments are provided herein. It should be noted that the structural forms of the image sensor chip 100, the movable carrier 210, and the circuit board 310 in this invention are not limited to the embodiments illustrated and described below. Any embodiment that conforms to the core idea of ​​this invention and satisfies the scope defined by the claims is within the protection scope of this invention.

[0060] Continue to combine Figures 1 to 3 ,refer to Figure 5 and Figure 7 As shown, in one embodiment, the stator 300 includes a circuit board 310. In a specific embodiment, the circuit board 310 is a rigid board capable of integral electrical connection, and may be a PCB board. In this embodiment, the circuit board 310 is located below the movable carrier board 210.

[0061] In one specific embodiment, such as Figure 5 As shown, the stator 300 includes a circuit board 310 and a reinforcing plate 345. The reinforcing plate 345 is in close contact with the bottom surface of the circuit board 310 to increase the mechanical strength of the circuit board 310. A connector and a control unit are also provided on the circuit board 310, respectively located on both sides of the mover. One end of the elastic connection assembly 400 is fixedly connected to the circuit board 310.

[0062] Furthermore, such as Figure 6 As shown, the mover 200 includes a movable carrier plate 210, on which an image sensor chip 100 is fixedly disposed. The photosensitive surface of the image sensor chip 100 faces the Z direction, and the plane containing the photosensitive surface of the image sensor chip 100 is parallel to the XY plane.

[0063] like Figure 7 In the illustrated embodiment, the circuit board 310 is a rigid board, such as a PCB board, with a first cutout portion 340 in the middle for electrical connection. The movable carrier board 210 is located in the first cutout portion 340 of the circuit board 310.

[0064] Furthermore, in this implementation, when static, the first connecting end 410 and the second connecting end 420 of the elastic connecting assembly 400 are located on the same horizontal plane. The first clamping portion 71 and the second clamping portion 72 of the transmission assembly 700 are also located on the same horizontal plane.

[0065] In another embodiment, the circuit board 310 is located below the movable carrier plate 210. The first connection end 410 and the second connection end 420 of the elastic connection assembly 400 are located on the same horizontal plane. Those skilled in the art will understand that in this embodiment, the first clamping portion 71 of the transmission assembly 700 is lower than the second clamping portion 72.

[0066] Furthermore, in a specific embodiment, the movable carrier board 210 includes a logic circuit board (not shown). The logic circuit board is adapted to provide electrical connections to the image sensor chip; A capacitor is provided on the logic circuit board. The capacitor is located on the side of the image sensor chip and serves as an external capacitor for the image sensor chip to save design space.

[0067] Here are two implementation methods for the combined structure of the image sensor chip 100 and the mobile carrier 210: In one embodiment, the movable carrier plate 210 has a first hollow portion 240, and the image sensor chip 100 is fixed in the first hollow portion 240 to reduce the thickness of the optical image stabilization device. The second connection end 420 of the elastic connection component 400 is electrically connected to the bottom surface of the image sensor chip 100.

[0068] Furthermore, the image sensor chip is electrically connected to the resilient connection assembly 400 via a pad disposed below it.

[0069] Secondly, in another embodiment, such as Figure 5 As shown, the image sensor chip 100 is fixedly connected to the upper surface of the movable carrier plate 210, and the second connection end 420 of the elastic connection component 400 is electrically connected to the bottom surface of the movable carrier plate 210.

[0070] The mover is also provided with an infrared filter bracket, which supports the infrared filter film located on the upper surface of the image sensor chip. There is a distance between the outer frame of the infrared filter bracket and the outer shell, which is the movement range of the mover.

[0071] Furthermore, at least three support portions are provided on the reinforcing plate, which are adapted to leave a gap of a predetermined height between the image sensor chip and the reinforcing plate.

[0072] In a preferred embodiment, the support portion is a metal ball bearing or a ceramic ball bearing.

[0073] In a preferred embodiment, the reinforcing plate 345 is provided with an opening or a groove, which is suitable for providing the support portion.

[0074] In a preferred embodiment, the support portion is positioned corresponding to one side of the image sensor chip 100, and its rolling or sliding direction is the X and Y directions, so as to provide a Z-direction support force to the image sensor chip, keep the image sensor chip 100 horizontal, and reduce the frictional force of the image sensor chip 100 moving in the X and Y directions.

[0075] Preferably, the predetermined height is greater than or equal to 10 micrometers.

[0076] Preferably, the elastic connection component has a vertically upward pre-deformation, adapted to provide Z-direction pre-pressure to the image sensor chip.

[0077] Through the above methods, the thickness of the optical image stabilization device in this invention can be greatly reduced, effectively saving design space and adapting to a wider range of different needs. At the same time, the structure is simple, requires no additional cost, and is suitable for practical production applications.

[0078] Furthermore, the optical image stabilization device provided by the present invention also includes a first magnetic component located on the mover 200 and a second magnetic component located on the stator 300. The first magnetic component 230 and the second magnetic component attract each other, so that the bottom surface of the mover remains in contact with the top of the support portion; and the image sensor chip moves in the X and Y directions and rotates in the plane under the action of external force to perform motion compensation for optical image stabilization. In this embodiment, the first magnetic component 230 is disposed on the movable carrier plate 210, and the second magnetic component is disposed on the reinforcing plate 345 or is the reinforcing plate 345 itself.

[0079] Furthermore, the signal transmission unit is an elastic connection component 400, which is disposed between the mover 200 and the stator 300 to provide electrical connection and a certain elastic support force to the image sensor chip 100; The image sensor chip 100 moves in the X and Y directions and rotates in a plane under the action of external force to perform motion compensation for optical image stabilization.

[0080] Figures 7 to 9 The diagram shows the arrangement of the elastic connection assembly 400 between the mover 200 and the stator 300. (Reference) Figures 7 to 9 As shown, the elastic connection component 400 includes at least one metal spring wire 430, one end of which is connected to the mover 200 of the optical image stabilization device, and the other end is connected to the stator 300 of the optical image stabilization device, thereby conducting electrical signals of the image sensor chip 100.

[0081] Specifically, in one embodiment, the elastic connection components 400 are symmetrically disposed on or around the bottom surface of the image sensor chip 100. The elastic connection components 400 are evenly distributed on or around the bottom surface of the image sensor chip 100. Preferably, the connection ends of the elastic connection components 400 are connected to at least two directions on the bottom surface of the movable carrier plate 210.

[0082] Furthermore, the main body of the metal elastic wire 430 is wrapped with an insulating material.

[0083] The metal elastic wire 430 has at least one bent portion 470 in the middle of its main body.

[0084] like Figure 7 In the embodiment shown, the optical image stabilization device includes four sets of elastic connection components 400, which are centrally symmetrically arranged around the bottom surface of the mover 200 and labeled R1, R2, R3, and R4 respectively in a clockwise direction. One end of each elastic connection component 400 is connected to the stator 300, and the other end is connected to the mover 200.

[0085] Each elastic connecting component 400 includes multiple parallel-arranged metal elastic wires 430, and each metal elastic wire 430 includes a bent portion 470 with a bending angle in its middle section. The bending angle of the bent portion 470 of each metal elastic wire 430 in each elastic connecting component 400 is the same. The multiple metal elastic wires in each elastic connecting component 400 are divided into left and right parts, with the bending angle openings of the bent portions of the left and right metal elastic wires arranged opposite each other.

[0086] Continue to refer to Figure 7 As shown, each metal spring wire 430 has a connection point on the mover 200 at its first end or on the stator 300 at its second end.

[0087] Specifically, the elastic connection component 400 includes multiple metal elastic wires 430, and the connection points of the multiple metal elastic wires 430 on the mover 200 or the stator 300 are arranged in a row, that is, the connection ends of the elastic connection component 400 on the mover 200 or the stator 300 are respectively a row of connection points.

[0088] Figure 8 The diagram illustrates another implementation. The optical image stabilization device includes four sets of elastic connecting components 400, arranged symmetrically around the bottom surface of the mover 200, and labeled R1, R2, R3, and R4 in a clockwise direction. The first end 410 of each elastic connecting component 400 is connected to the bottom surface of the stator 300, and the second end 420 of each elastic connecting component 400 is connected to the bottom surface of the mover 200.

[0089] Each elastic connecting component 400 includes multiple parallel-arranged metal elastic wires 430, and each metal elastic wire 430 includes a bent portion 470 with a bending angle in its middle section. The bending angle of the bent portion 470 of each metal elastic wire 430 in each elastic connecting component 400 is the same, and the opening of the bending angle faces the same direction. The bending angle openings of the bent portions 470 of the metal elastic wires 430 in each elastic connecting component 400 are arranged sequentially in a clockwise or counterclockwise direction.

[0090] In other embodiments, the metal elastic wire 430 may also be a series of three or more insulating metal layers. Accordingly, the connection points (i.e., the first connection end 410 or the second connection end 420) of each elastic connection component on the stator 300 or the mover 200 are arranged in multiple rows of parallel straight lines or curves.

[0091] for example Figure 9 In one embodiment shown, the elastic connection assembly 400 includes a plurality of metal elastic wires 430, the bent portions 470 of which are parallel to each other.

[0092] The first end 410 of each metal spring wire 430 has at least two connection points on the mover 200 or the second end 420 has at least two connection points on the stator 300, and each connection point corresponds to a corresponding metal layer of the metal spring wire 430.

[0093] Specifically, the elastic connection component 400 includes a plurality of metal elastic wires 430, and the connection points of the plurality of metal elastic wires 430 on the mover 200 or the stator 300 are arranged in at least two rows, and the arrangement of the connection points corresponds to the corresponding metal layer of the metal elastic wires 430.

[0094] In one embodiment, different metal layers of the same metal spring 430 conduct different signals to suit impedance matching, signal shielding, or other electrical requirements.

[0095] Furthermore, Figure 9 In the illustrated embodiment, each metal spring wire 430 in each elastic connection assembly 400 includes two mutually insulated metal layers. Correspondingly, the first end 410 of the metal spring wire 430 has two connection points on the stator 300, and the second end 420 of the metal spring wire 430 has two connection points on the mover 200. Correspondingly, each elastic connection assembly 400 has two rows of connection points on the mover 200 and two rows of connection points on the stator 300. Figure 9As shown, the connection points of R1 on the stator 300 are arranged as two parallel straight lines, L1 and L2. In this embodiment, the connection points of R1 on the mover 200 are also arranged as two parallel straight lines. R2 to R4 are similarly arranged.

[0096] In other embodiments, the metal elastic wire 430 may consist of only one metal layer wrapped with an insulating layer, or it may consist of three or more layers of mutually insulating metal layers. Accordingly, the connection points of each elastic connection component on the stator 300 or the mover 200 are arranged in multiple rows of mutually parallel straight lines or curves.

[0097] In this way, signals of different natures can be transmitted simultaneously without interfering with each other.

[0098] Specifically, in one embodiment, the first end of the metal spring wire 430 is connected to the mover 200 by welding, or the second end is connected to the stator 300 by welding.

[0099] Specifically, in one embodiment, the metal layer 431 of the elastic metal wire 430 is made of any one of gold, silver, copper, aluminum, copper alloy, silver alloy, and gold alloy.

[0100] Specifically, in one embodiment, the insulating layer 432 is a combination of one or more of silicon oxide, aluminum oxide, ceramic, and polyimide.

[0101] Specifically, in one embodiment, the length of the metal elastic wire 430 is greater than 1 mm. This ensures that the overall stress distribution of the metal elastic wire 430 is uniform, resulting in good reliability and suitable stiffness.

[0102] Specifically, in one embodiment, the metal filament 430 is shaped by etching.

[0103] Specifically, in one embodiment, the metal elastic wire 430 is shaped by shaping a metal round wire.

[0104] Specifically, in one embodiment, the metal spring wire 430 is formed by stamping a metal sheet.

[0105] Furthermore, in other embodiments, the image sensor chip 100 is driven by coils and magnets to achieve movement in the X and Y directions and planar rotation. (Not shown) Furthermore, in other embodiments, the image sensor chip 100 achieves movement in the X and Y directions and planar rotation via piezoelectric ultrasonic actuation. (Not shown) The mover 200 further includes a heat sink (not shown), disposed below the image sensor chip 100. Specifically, the heat sink can be disposed on the bottom surface of the carrier board in any area that does not interfere with electrical connections. In this embodiment, the heat sink is a circular, square, polygonal, or irregular shape located at the center of the bottom surface of the carrier board, or any shape coated with a heat-dissipating coating that does not interfere with electrical connections and the operation of other components. Specifically, the heat sink fills the lower part of the image sensor chip, filling the air gap between the bottom surface of the image sensor chip and the reinforcing plate 345. Because the thermal conductivity of the heat sink is much greater than that of air, this greatly improves heat dissipation efficiency, significantly reduces the possibility of the image sensor chip failing due to overheating, and greatly improves the operational reliability of the optical image stabilization device.

[0106] Furthermore, the movable carrier plate 210 is also equipped with a dustproof device (not shown).

[0107] Specifically, the optical image stabilization device further includes: a lens; The lens is adapted to move along the optical axis to adjust the focal length.

[0108] In this embodiment, the optical axis direction is the Z direction.

[0109] The embodiments of the technical solution provided by the present invention also provide an electronic device, including the optical image stabilization device as described above.

[0110] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. An optical image stabilization device, employing a moving image sensor chip for motion compensation, characterized in that, include: The system includes a stator, a mover, and a transmission assembly connecting the stator and the mover. The mover includes a carrier plate and an image sensor chip. The transmission assembly surrounds the image sensor chip, and the mover moves in the X and Y directions and rotates in the XY plane under the action of the transmission assembly to compensate for jitter. The X and Y directions and the XY plane are parallel to the photosensitive surface of the image sensor chip. The transmission assembly includes a shape memory alloy component. Both ends of the shape memory alloy component are fixedly connected to the stator, and the middle of the shape memory alloy component is fixedly or movably connected to the mover. The transmission assembly also includes multiple first clamping portions disposed on the stator and multiple second clamping portions disposed on the mover. Two adjacent first clamping portions are respectively fixedly connected to both ends of the same shape memory alloy component, and a portion passes through the middle of the same shape memory alloy component. In the corresponding bending portion of the second clamping portion, and at least one bending portion of the second clamping portion has a bending radius greater than the diameter of the shape memory alloy part, so that the shape memory alloy part can move within the second clamping portion; the stator includes a circuit board, and a signal transmission unit is provided between the image sensor chip and the circuit board. The signal transmission unit includes four sets of elastic connection components arranged symmetrically around the bottom surface of the mover. Each set of elastic connection components includes multiple parallel metal spring wires. The first end of each metal spring wire is connected to the mover, the opposite second end is connected to the stator, and at least one bending portion is provided in the middle to conduct the electrical signal of the image sensor chip; each metal spring wire includes at least two metal layers, an insulating layer is provided between each metal layer, and each metal layer is connected to a corresponding connection point and transmits different signals.

2. The optical image stabilization device as described in claim 1, characterized in that, Each of the second clamping portions is disposed in the middle of one side of the mover, and the two first clamping portions corresponding to the second clamping portion are respectively disposed near the two ends of the side. The same shape memory alloy part extends from one of the first clamping portions to the second clamping portion, and after turning through the second clamping portion, extends to the other first clamping portion.

3. The optical image stabilization device as described in claim 2, characterized in that, The transmission components can move freely within each of the second clamping parts.

4. The optical image stabilization device as described in claim 2, characterized in that, At least one of the second clamping parts clamps the transmission assembly.

5. The optical image stabilization device as described in claim 2, characterized in that, The first clamping part includes a bent part, which clamps the end of the transmission assembly.

6. The optical image stabilization device as described in claim 2, characterized in that, The second clamping part includes a bending part, and the bending radius of the bending part of each second clamping part is greater than the diameter of the transmission assembly.

7. The optical image stabilization device as described in claim 1, characterized in that, The shape memory alloy part is connected to electrodes at both ends, or the shape memory alloy part is connected to electrodes at both ends and the middle.

8. The optical image stabilization device as described in claim 1 or 7, characterized in that, The displacement of the image sensor is fed back by the change in resistance of the shape memory alloy component after it is energized.

9. The optical image stabilization device as described in claim 1, characterized in that, The stator includes a circuit board, and a groove or hollow portion is provided in the middle of the circuit board, the groove or hollow portion being adapted to accommodate the mover.

10. The optical image stabilization device as described in claim 9, characterized in that, The stator also includes reinforcing steel sheets, which are disposed at the bottom of the groove or hollow portion to increase the strength of the circuit board.

11. The optical image stabilization device as described in claim 2, characterized in that, The stator includes a circuit board, and the first clamping portion is disposed on the circuit board.

12. The optical image stabilization device as described in claim 9 or 11, characterized in that, The circuit board is also provided with a connector and a control unit, which are respectively located on both sides of the mover.

13. The optical image stabilization device as described in claim 1, characterized in that, Each metal layer of the metal elastic wire corresponds to at least two connection points. The connection points of the multiple metal elastic wires on the mover and the stator are arranged in at least two rows, and each row of connection points corresponds to the corresponding metal layer of the metal elastic wire.

14. The optical image stabilization device as described in claim 13, characterized in that, The metal filament is formed by etching.

15. The optical image stabilization device as described in claim 13, characterized in that, The signal transmission unit is an elastic connection component, which has a vertically upward pre-deformation, suitable for providing Z-direction pre-pressure to the image sensor chip.

16. The optical image stabilization device as described in claim 13, characterized in that, The mover includes a movable carrier plate, and the image sensor chip is disposed on the movable carrier plate; the image sensor chip is electrically connected to the signal transmission unit.

17. The optical image stabilization device as described in claim 13, characterized in that, The mover includes a movable carrier plate, and the image sensor chip is electrically connected to the movable carrier plate; the movable carrier plate is electrically connected to the signal transmission unit.

18. The optical image stabilization device as described in claim 10, characterized in that, At least three support members are provided on the reinforcing steel sheet, which are adapted to leave a gap of a predetermined height between the image sensor and the circuit board.

19. The optical image stabilization device as described in claim 18, characterized in that, The predetermined height is greater than or equal to 10 micrometers.

20. The optical image stabilization device as described in claim 1, characterized in that, The shape memory alloy parts include filamentous, spiral, bent, or curved shapes.

21. An electronic device, characterized in that, include: The optical image stabilization device as described in claim 1; A lens, located on the optical image stabilization device, is adapted to move in the Z direction to adjust the focal length.

Images