Aluminum-based copper clad plate and preparation method thereof

Abstract

The application discloses an aluminum-based copper-clad plate and a preparation method thereof. The preparation method comprises the following steps: S1, hot-pressing an aluminum plate, an insulating material and a copper foil to obtain an aluminum base material; S2, cutting the aluminum base material according to etching process requirements to obtain an aluminum-based copper-clad whole plate; S3, pasting a protective film; S4, drilling positioning holes; S5, pasting a dry film; S6, sequentially performing exposure plate making, developing and removing the protective film in the etching area, and then etching through a chemical solution; S7, brushing a green oil layer; S8, drying and forming; S9, line surface treatment; S10, flying needle testing; S11, pressure testing; performing hole drilling; and S13, dividing the aluminum-based copper-clad whole plate after the hole drilling into a plurality of aluminum-based copper-clad plates. The preparation method of the aluminum-based copper-clad plate can reduce the consumption of the aluminum-based copper-clad whole plate, improve the production efficiency and reduce the cost.

Description

Technical Field

[0001] This invention relates to the field of aluminum-based copper clad laminate preparation technology, and more particularly to an aluminum-based copper clad laminate and its preparation method. Background Technology

[0002] Aluminum-based copper clad laminate, also known as aluminum substrate, is mainly made of three raw materials: aluminum plate, epoxy resin or epoxy glass cloth bonding sheet, and copper foil, which are hot-pressed together. It is one of the raw materials for aluminum substrate. Specifically, it is a plate-shaped material made by covering one or both sides with copper foil and hot-pressing it. It is called copper foil laminate aluminum substrate, or simply aluminum-based copper clad laminate. It is moderately priced and has good thermal conductivity.

[0003] like Figure 5 As shown, the general etching process for aluminum-based copper clad laminates is as follows: material preparation → applying protective film → drilling → dry film photolithography → board inspection → etching → etching inspection → solder mask → character marking → solder mask inspection → forming → circuit surface treatment (tin plating, palladium plating, nickel plating, or gold plating) → open / short circuit testing → high voltage testing → VCUT → ultrasonic cleaning → final inspection → shipment. Furthermore, due to different scenarios and application fields, the processing requirements for the substrate also vary.

[0004] Aluminum substrates are etched to create the required patterned circuit boards, which are now widely used in power modules, motor drive modules, automotive electronics, and LEDs. In some special applications, such as bonding wires on aluminum substrates to achieve electrical connections, the types of wires used for bonding include copper, aluminum, and gold wires. This makes the processing requirements for aluminum-based circuit boards quite high. To ensure that the bonding wires meet the tensile strength requirements, the circuit surface must be as flat or intact as possible, without any defects or pits, to prevent the bonding wires from falling off the circuit surface of the aluminum substrate, thereby reducing defects, improving efficiency, and reducing costs.

[0005] Some etching processes on aluminum substrates require creating functional blind vias at designated locations on the aluminum-based copper-clad laminate (CCL). Jumpers are then bonded to these blind vias to improve the module's anti-interference performance. In semiconductor packaging, to ensure the bonding wires meet pull requirements, the circuit surface (bonding surface) of the aluminum substrate must be flat. However, current etching methods, when mechanically routing blind vias, place the entire aluminum-based CCL onto a blind via routing device (such as...). Figure 6 As shown in the diagram, the work area is then used to fix the four corner edges of the entire aluminum-based copper clad laminate using the pressure strips of the blind hole drilling equipment. This fixing method can cause a bulge in the middle area of ​​the aluminum-based copper clad laminate due to its large area. This results in an uneven bottom when the aluminum-based copper clad laminate is drilled with blind holes, affecting the bonding of the bonding wires. This makes it impossible for the bonding wires to meet the required tension, and in severe cases, the bonding wires may even fall off. This leads to a large loss of aluminum-based copper clad laminate, low production efficiency, and high cost. Summary of the Invention

[0006] The purpose of this invention is to provide a method for preparing aluminum-based copper clad laminates, in order to solve the problems in existing methods where the aluminum-based copper clad laminate is fixed to the four corner process edges by pressure strips, resulting in uneven bottom surfaces when drilling blind holes, affecting the bonding of the bonding wires, making the tensile strength of the bonding wires insufficient, and in severe cases, causing the bonding wires to fall off. This leads to high losses, low production efficiency, and high costs in the aluminum-based copper clad laminate.

[0007] To address the above problems, the present invention provides a method for preparing an aluminum-based copper-clad laminate, comprising the following steps:

[0008] S1. Hot pressing aluminum plate, insulating material and copper foil to obtain aluminum substrate;

[0009] S2. Cut the aluminum substrate according to the etching process requirements to obtain an aluminum-based copper-clad laminate;

[0010] S3. A protective film is attached to the side of the aluminum plate away from the insulating material in the aluminum-based copper-clad laminate.

[0011] S4. Drill positioning holes on the aluminum-based copper-clad laminate after the protective film is applied, according to the route diagram requirements.

[0012] S5. In the aluminum-based copper-clad laminate after drilling, a dry film is attached to the side of the copper foil away from the insulating material.

[0013] S6. The aluminum-based copper-clad laminate with dry film is exposed for plate making, developed and the protective film in the etched area is removed in sequence, and then etched by chemical solution.

[0014] S7. Apply a green oil layer to the etched aluminum-based copper-clad board.

[0015] S8. The aluminum-based copper-clad laminate after being coated with green oil is dried and shaped.

[0016] S9. Perform exposed circuit surface treatment on the aluminum-based copper-clad laminate after drying and forming.

[0017] S10. Perform flying probe testing on the aluminum-based copper-clad board after the circuit surface has been processed.

[0018] S11. Apply pressure to the high-voltage test section of the aluminum-based copper-clad laminate after the flying probe test;

[0019] S12. Place the aluminum-based copper-clad laminate after the pressure test into the vacuum base of the blind hole routing equipment, and then fix the aluminum-based copper-clad laminate by vacuum suction. Then, adjust the step distance of the router cutter of the blind hole routing equipment according to the drawing of the aluminum-based copper-clad laminate, and replace the matching router cutter. Finally, turn on the blind hole routing equipment to router holes in the aluminum-based copper-clad laminate.

[0020] S13. Divide the aluminum-based copper-clad laminate after the milling holes into several aluminum-based copper-clad laminates.

[0021] Preferably, the blind hole drilling device includes a main unit, a power supply located on the main unit, a moving track located above the main unit, a connecting fixed shaft located on the moving track, a control head located on the fixed shaft away from the moving track, a main control switch located on the control head, a slag suction nozzle and the drilling cutter located on the control head near the main unit, a vacuum base located on the main unit near the drilling cutter, a plurality of equidistant suction holes located on the vacuum base, and a gas input port located on the vacuum base and communicating with the plurality of suction holes.

[0022] Preferably, each of the air intake holes is connected to the gas inlet via a gas pipe.

[0023] Preferably, before step S1, the steps include: performing anodizing treatment on the side of the aluminum plate close to the insulating material and the side of the aluminum plate away from the insulating material, respectively.

[0024] Preferably, after step S5 is completed, the following steps are included: performing an appearance inspection on the aluminum-based copper-clad laminate after the dry film is applied; if the appearance inspection is qualified, then proceed to step S6.

[0025] Preferably, after step S6 is completed, the following steps are included: performing a circuit inspection on the etched aluminum-based copper-clad laminate; if the circuit inspection is qualified, then step S7 is performed.

[0026] Preferably, after step S7 is completed and before step S8 is performed, the method further includes the following steps: first, brushing a character layer onto the aluminum-based copper-clad board after brushing the green solder mask layer; then, inspecting the green solder mask layer and the character layer on the aluminum-based copper-clad board after brushing the character layer; if the green solder mask layer and the character layer pass the inspection, then step S8 is performed.

[0027] Preferably, after step S13 is completed, the step further includes cleaning the aluminum-based copper-clad laminate.

[0028] Preferably, after cleaning the aluminum-based copper clad laminate, the process further includes the following steps: inspecting the cleaned aluminum-based copper clad laminate; and packaging the qualified aluminum-based copper clad laminate into a warehouse.

[0029] The present invention also provides an aluminum-based copper clad laminate, characterized in that the aluminum-based copper clad laminate is made by the above-described method for preparing aluminum-based copper clad laminates.

[0030] Compared with the prior art, the aluminum-based copper clad laminate in this invention is fixed by vacuum suction when making holes, which makes the bottom of the aluminum-based copper clad laminate flat when making blind holes. This means that the bonding wires are not affected and do not fall off. It ensures that the tensile strength of the bonding wires meets the requirements, thereby reducing the wear of the aluminum-based copper clad laminate, improving its production efficiency and reducing costs. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 A flowchart illustrating the steps of a method for preparing an aluminum-based copper-clad laminate according to an embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of the cross-sectional structure of the aluminum substrate in a method for preparing an aluminum-based copper clad laminate according to an embodiment of the present invention.

[0034] Figure 3 This is a schematic diagram of the blind hole drilling device in a method for preparing an aluminum-based copper clad laminate according to an embodiment of the present invention.

[0035] Figure 4 This is a schematic diagram of the vacuum base of the blind hole drilling device and the entire aluminum-based copper clad laminate in a method for preparing an aluminum-based copper clad laminate according to an embodiment of the present invention.

[0036] Figure 5 A schematic diagram of a general etching process for aluminum-based copper-clad laminates provided by existing technology;

[0037] Figure 6 A schematic diagram of the structure of a blind hole device for existing technology. Detailed Implementation

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] This invention provides a method for preparing an aluminum-based copper-clad laminate, combined with... Figure 1 As shown, it includes the following steps:

[0040] S1. Hot pressing aluminum plate, insulating material and copper foil to obtain aluminum substrate.

[0041] Among them, combined Figure 2 As shown, the aluminum plate in the aluminum substrate forms an aluminum layer 101, the main component of which is an aluminum-magnesium alloy. Its thickness is generally about 0.5mm-2.0mm. It is formed by hot pressing and bonding with the insulating material. Its main function is to serve as a substrate layer for the circuit, and it can also play a role in heat dissipation.

[0042] The insulating material in the aluminum substrate is epoxy resin or epoxy glass cloth adhesive sheet. The insulating material forms an insulating layer 102, the main component of which is still epoxy resin. Its thickness is generally about 50um-200um. It is formed by hot pressing and bonding with the copper foil and the aluminum plate. Its main function is insulation, so that the copper foil and the aluminum layer form electrical isolation.

[0043] The copper foil in the aluminum substrate forms a copper foil layer 103, which is mainly composed of pure copper and is generally about 2 to 15 ounces thick. It is pressed together with the insulating layer by hot pressing and can form the required circuit through an etching process.

[0044] Before step S1, the steps include: performing anodizing treatment on the side of the aluminum plate close to the insulating material and the side of the aluminum plate away from the insulating material, respectively.

[0045] The entire process can be simply referred to as aluminum substrate.

[0046] S2. Cut the aluminum substrate according to the etching process requirements to obtain an aluminum-based copper-clad laminate.

[0047] Specifically, after the aluminum substrate is unpacked, it is cut into certain sizes according to the etching process requirements to obtain an aluminum-based copper-clad laminate.

[0048] The entire process can be referred to as uncutting.

[0049] S3. A protective film is attached to the side of the aluminum plate away from the insulating material in the aluminum-based copper-clad laminate.

[0050] The protective film is a PUV protective film, which is mainly used to prevent the aluminum plate from being scratched during the production process.

[0051] The entire process can be referred to as "without screen protector".

[0052] S4. Drill positioning holes on the aluminum-based copper-clad laminate after the protective film is applied, according to the route diagram requirements.

[0053] The entire process can be simply referred to as drilling.

[0054] S5. In the aluminum-based copper-clad laminate after drilling, a dry film is attached to the side of the copper foil away from the insulating material.

[0055] Among them, the dry film is a PET photosensitive film. Its main function is to produce a polymerization reaction after being irradiated by ultraviolet light, forming a stable substance that adheres to the board surface, thereby blocking electroplating and etching.

[0056] The entire process can be simply referred to as dry film optical imaging.

[0057] After step S5 is completed, the following steps are included: visually inspecting the aluminum-based copper-clad laminate after the dry film is applied; if the visual inspection is qualified, proceed to step S6; if the visual inspection is qualified, rework or record it as a defective product; to prevent circuit etching errors. This step is referred to as board inspection.

[0058] S6. After the dry film is applied, the aluminum-based copper-clad laminate is exposed for plate making, developed and the protective film in the etched area is removed in sequence, and then etched by chemical solution.

[0059] The chemical solution has a dissolving and corrosive effect, which can create an uneven or perforated effect in areas without a protective film.

[0060] The entire process can be simply referred to as etching.

[0061] After step S6 is completed, the following steps are included: performing a circuit inspection on the etched aluminum-based copper-clad laminate; if the circuit inspection is qualified, proceed to step S7; if the circuit inspection is unqualified, rework or record it as a defective product. This step is referred to as etching inspection.

[0062] S7. Apply a green oil layer to the etched aluminum-based copper-clad board.

[0063] The purpose of applying green paint is to cover up the wiring parts that should not be exposed.

[0064] The entire process is simply referred to as green oil.

[0065] After step S7 is completed and before step S8 is performed, the following steps are included: first, a character layer is brushed onto the aluminum-based copper-clad laminate after the green solder mask layer is applied to facilitate subsequent processing and testing; then, the green solder mask layer and character layer are inspected on the aluminum-based copper-clad laminate after the character layer is applied: if the green solder mask layer and character layer inspection is qualified, step S8 is performed; if the green solder mask layer and character layer inspection is qualified, the product is reworked or recorded as a defective product. These two steps are referred to as character and green solder mask inspection, respectively.

[0066] S8. The aluminum-based copper-clad laminate after being coated with green oil is dried and shaped.

[0067] The entire process is referred to as "unformed".

[0068] S9. Perform exposed circuit surface treatment on the aluminum-based copper-clad laminate after drying and forming.

[0069] The surface treatment of the circuit includes hot air leveling, electroless nickel plating, electroless gold plating, and electroless palladium plating.

[0070] Hot air leveling, also known as copper surface tinning, refers to applying tin to the areas of the aluminum-based copper-clad laminate that need to be soldered, forming a solderable coating layer. This improves reliability during reflow soldering and reduces solder voids.

[0071] Electroless nickel plating involves depositing a nickel layer onto the copper foil surface of an aluminum-based copper-clad laminate. After etching, the copper surface of the aluminum-based copper-clad laminate is relatively rough and uneven due to the grinding process performed on the substrate in the previous step. Nickel metal has a strong passivation ability, which can quickly form an extremely thin passivation film on the surface, making the copper surface smooth. This is particularly beneficial for boards that require bonding processes. Additionally, it can serve as a prelude to gold plating. Generally, gold plating processes require a nickel layer first. The nickel layer acts as a barrier layer, enhancing the bond between nickel and gold and preventing gold from penetrating into the copper layer. The nickel base layer also significantly improves the mechanical strength of the gold layer. Typically, the nickel layer is thicker than the gold layer to reduce the thickness of the gold plating and control costs.

[0072] Chemical gold plating is generally used in conjunction with nickel or palladium plating. Even the commonly mentioned nickel-gold or nickel-palladium-gold plating can prevent oxidation from affecting the bonding of gold, aluminum, and copper wires for some substrates that require bonding processes. Gold is an inert metal, and it can prevent corrosion and blackening of PCBs or aluminum substrates during long-term use, thus ensuring their good electrical performance.

[0073] Electroless palladium plating utilizes palladium metal, which is harder than gold and has excellent thermal conductivity, but is more expensive than gold in the market, making it more costly than nickel-gold plating. However, some still use nickel-palladium-gold plating because palladium has excellent thermal diffusion properties. Electroless gold plating currently suffers from black nickel issues and diffusion after heating. Adding a dense palladium layer as a barrier effectively prevents black nickel and nickel diffusion, and avoids the problem of copper migration to the gold layer. Adding a palladium plating layer also allows for multiple high-temperature reflow solderings without discoloration of the gold surface of the substrate, providing excellent adhesion, especially for products with wire bonding.

[0074] The entire process is referred to as surface treatment.

[0075] S10. Perform flying probe testing on the aluminum-based copper-clad laminate after the circuit surface has been processed.

[0076] The flying probe test, such as the open / short circuit test, is mainly used to detect whether the line is disconnected or short-circuited.

[0077] The entire process is referred to as the open-short circuit test.

[0078] S11. Apply pressure to the high-voltage test section of the aluminum-based copper-clad laminate after the flying probe test.

[0079] The pressure test is also conducted using the flying probe test method described above, mainly to detect whether there is an electrical leakage problem.

[0080] The entire process is referred to as a high-voltage test.

[0081] S12. Place the aluminum-based copper-clad laminate after the pressure test into the vacuum base of the blind hole routing equipment, and then fix the aluminum-based copper-clad laminate by vacuum suction. Then, adjust the step distance of the router cutter of the blind hole routing equipment according to the drawing of the aluminum-based copper-clad laminate, and replace the matching router cutter. Finally, turn on the blind hole routing equipment to router holes in the aluminum-based copper-clad laminate.

[0082] Among them, combined Figure 3 and Figure 4As shown, the blind hole drilling device includes a main unit 201, a power supply 202 disposed on the main unit 201, a moving track 203 disposed above the main unit 202, a connecting fixed shaft 204 disposed on the moving track 203, a control head 205 disposed on the fixed shaft 204 away from the moving track 203, a main control switch 206 disposed on the control head 205, a slag suction nozzle 207 and a drill bit 208 disposed on the control head 205 near the main unit 202, a vacuum base 209 disposed on the main unit 201 near the drill bit 208, a plurality of equidistant suction holes 210 disposed on the vacuum base 209, and a gas inlet 211 disposed on the vacuum base 209 and communicating with the plurality of suction holes 210; the gas inlet 211 can be connected to an external vacuum pump through a pipe to achieve a vacuum suction effect.

[0083] Each of the air intake ports 210 is connected to the gas inlet port 211 via an independent gas pipe.

[0084] In this embodiment, the aluminum-based copper-clad laminate 300 includes several aluminum-based copper-clad laminates 301; there are two vacuum bases 209, and correspondingly, there are two main control switches 206, two slag suction nozzles 207, and two router blades 208; when placing the aluminum-based copper-clad laminate 300 after pressure testing into the vacuum base 209, positioning points need to be selected so that the two aluminum-based copper-clad laminates 300 are respectively placed into the two vacuum bases 209; the replacement router blade can be a 1.33 flat-bottom router blade according to actual needs, such as a blind hole diameter of 1.3mm, with the hole diameter controlled at 1.3±0.1mm, the hole depth at 0.23±0.08mm with the top surface of the insulating layer as the reference surface, and the height difference between any three points at the bottom of the hole not exceeding 0.08mm.

[0085] Before drilling, the process card part number, version number and countersunk head data can be retrieved to check if they are consistent: if they are consistent, the drilling blind hole equipment is activated to drill holes in the aluminum-based copper-clad laminate 300; if they are inconsistent, adjustments are made.

[0086] The entire process is referred to as the blind hole drill.

[0087] S13. Divide the aluminum-based copper-clad laminate after the milling holes into several aluminum-based copper-clad laminates.

[0088] The steps described herein are performed using VCUT or a router.

[0089] The entire process is referred to as VCUT or roulette.

[0090] In addition, after step S13 is completed, the process further includes cleaning the aluminum-based copper-clad laminate to remove impurities or organic contaminants from it. Specifically, this involves placing the aluminum-based copper-clad laminate into a cleaning basket for cleaning. This step is referred to simply as cleaning.

[0091] After cleaning the aluminum-based copper clad laminate, the process includes the following steps: manually inspecting the cleaned aluminum-based copper clad laminate to remove defective products; packaging the qualified aluminum-based copper clad laminate into a warehouse according to regulations; and then shipping the packaged products to a designated location. These three steps are referred to as final inspection, packaging, and shipping, respectively.

[0092] Compared with the prior art, the aluminum-based copper clad laminate in this invention is fixed by vacuum suction when making holes, which makes the bottom of the aluminum-based copper clad laminate flat when making blind holes. This means that the bonding wires are not affected and do not fall off. It ensures that the tensile strength of the bonding wires meets the requirements, thereby reducing the wear of the aluminum-based copper clad laminate, improving its production efficiency and reducing costs.

[0093] In addition, the present invention also provides an embodiment of an aluminum-based copper clad laminate, which is manufactured by the preparation method of the aluminum-based copper clad laminate in the above embodiment. Since the aluminum-based copper clad laminate in this embodiment is manufactured by the preparation method of the aluminum-based copper clad laminate in the above embodiment, it can also achieve the technical effects achieved by the preparation method of the aluminum-based copper clad laminate in the above embodiment, and will not be described in detail here.

[0094] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A method for preparing an aluminum-based copper-clad laminate, characterized in that, The method for preparing the aluminum-based copper-clad laminate includes the following steps: S1. Hot pressing aluminum plate, insulating material and copper foil to obtain aluminum substrate; S2. Cut the aluminum substrate according to the etching process requirements to obtain an aluminum-based copper-clad laminate; S3. A protective film is attached to the side of the aluminum plate away from the insulating material in the aluminum-based copper-clad laminate. S4. Drill positioning holes on the aluminum-based copper-clad laminate after the protective film is applied, according to the route diagram requirements. S5. In the aluminum-based copper-clad laminate after drilling, a dry film is attached to the side of the copper foil away from the insulating material. S6. The aluminum-based copper-clad laminate with dry film is exposed for plate making, developed and the protective film in the etched area is removed in sequence, and then etched by chemical solution. S7. Apply a green oil layer to the etched aluminum-based copper-clad board. S8. The aluminum-based copper-clad laminate after being coated with green oil is dried and shaped. S9. Perform exposed circuit surface treatment on the aluminum-based copper-clad laminate after drying and forming. S10. Perform flying probe testing on the aluminum-based copper-clad board after the circuit surface has been processed. S11. Apply pressure to the high-voltage test section of the aluminum-based copper-clad laminate after the flying probe test; S12. Place the aluminum-based copper-clad laminate after the pressure test into the vacuum base of the blind hole routing equipment, and then fix the aluminum-based copper-clad laminate by vacuum suction. Then, adjust the step distance of the router cutter of the blind hole routing equipment according to the drawing of the aluminum-based copper-clad laminate, and replace the matching router cutter. Finally, turn on the blind hole routing equipment to router holes in the aluminum-based copper-clad laminate. S13. Divide the aluminum-based copper-clad laminate after the milling holes into several aluminum-based copper-clad laminates.

2. The method for preparing aluminum-based copper-clad laminate as described in claim 1, characterized in that, The blind hole drilling device includes a main unit, a power supply located on the main unit, a moving track located above the main unit, a connecting fixed shaft located on the moving track, a control head located at the end of the fixed shaft away from the moving track, a main control switch located on the control head, a slag suction nozzle and a drilling cutter located on the side of the control head near the main unit, a vacuum base located on the side of the main unit near the drilling cutter, a plurality of equidistant suction holes located on the vacuum base, and a gas input port located on the vacuum base and communicating with the plurality of suction holes.

3. The method for preparing aluminum-based copper-clad laminate as described in claim 2, characterized in that, Each of the air intake ports is connected to the gas inlet via a gas pipe.

4. The method for preparing aluminum-based copper-clad laminate as described in claim 1, characterized in that, Before step S1, the steps include: performing anodizing treatment on the side of the aluminum plate close to the insulating material and the side of the aluminum plate away from the insulating material, respectively.

5. The method for preparing aluminum-based copper-clad laminate as described in claim 1, characterized in that, After step S5 is completed, the following steps are included: visual inspection of the aluminum-based copper-clad laminate after the dry film is applied; if the visual inspection is qualified, then step S6 is performed.

6. The method for preparing aluminum-based copper-clad laminate as described in claim 1, characterized in that, After step S6 is completed, the following steps are included: performing circuit inspection on the etched aluminum-based copper-clad laminate; if the circuit inspection is qualified, then proceed to step S7.

7. The method for preparing aluminum-based copper-clad laminate as described in claim 1, characterized in that, After step S7 is completed and before step S8 is performed, the following steps are included: first, apply a character layer to the aluminum-based copper-clad board after applying the green solder mask layer; then, inspect the green solder mask layer and the character layer on the aluminum-based copper-clad board after applying the character layer; if the green solder mask layer and the character layer pass the inspection, then proceed to step S8.

8. The method for preparing aluminum-based copper-clad laminate as described in claim 1, characterized in that, After step S13 is completed, the following step is also included: cleaning the aluminum-based copper-clad laminate.

9. The method for preparing aluminum-based copper-clad laminate as described in claim 8, characterized in that, The process of cleaning the aluminum-based copper clad laminate also includes the following steps: inspecting the cleaned aluminum-based copper clad laminate; and packaging the qualified aluminum-based copper clad laminate into a warehouse.

10. An aluminum-based copper-clad laminate, characterized in that, The aluminum-based copper-clad laminate is manufactured by the method for preparing aluminum-based copper-clad laminate according to any one of claims 1 to 9.

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