A differential line data processing method and device, electronic equipment and storage medium

Abstract

Embodiments of the present application provide a differential line data processing method and device, electronic equipment and storage medium, the method comprises: obtaining the differential line starting layer, the differential line termination layer, the differential line maximum residual copper column requirement value of the differential line on the printed circuit board, and the wiring layer of the printed circuit board, the thickness of each layer of the printed circuit board;According to the differential line starting layer, the differential line termination layer, the wiring layer of the printed circuit board, the thickness of each layer of the printed circuit board, the residual copper column length of the differential line is determined;Judge whether the residual copper column length of the differential line is greater than or equal to the differential line maximum residual copper column requirement value;If the residual copper column length of the differential line is greater than or equal to the differential line maximum residual copper column requirement value, it is determined that the differential line is the target differential line which needs to be back drilling;Output the differential line data and the residual copper column length of the target differential line. Through the above method, the accuracy of the differential line back drilling information can be improved, and the differential line data arrangement workload can be reduced.

Description

Technical Field

[0001] This invention relates to the field of data processing technology, and in particular to a differential line data processing method, apparatus, electronic device, and storage medium. Background Technology

[0002] In multilayer printed circuit boards (PCBs), vias are used to connect signals from one interconnect layer to another. The inner surface of the via is treated with copper plating, making it suitable for signal transmission. However, when signal lines pass through vias to change layers, issues such as… Figure 1 In the scenario depicted, only a portion of the copper plating in the via is used for signal transmission. The excess copper plating (stub) acts like an antenna, radiating signals and interfering with other signals in the surrounding area. In severe cases, this can affect the normal operation of the circuit system. Backdrilling removes this excess copper plating by drilling through a hole, thus eliminating this interference problem.

[0003] With the increase in signal speed, back-drilling is becoming increasingly common on PCBs. Generally, memory controller PCBs have more than 20 layers, with as many as two to three hundred pairs of high-speed traces. To ensure signal quality and save on PCB manufacturing costs, engineers need to visually select which high-speed traces require back-drilling from these pairs. Manually selecting high-speed traces that require back-drilling is prone to errors and wastes time. Summary of the Invention

[0004] In view of the above problems, embodiments of the present invention are proposed to provide a differential line data processing method, apparatus, electronic device and storage medium that overcomes or at least partially solves the above problems.

[0005] To address the aforementioned problems, in a first aspect, embodiments of the present invention disclose a differential line data processing method, the method comprising:

[0006] Obtain differential line data of printed circuit boards, the differential line data including: differential line start layer, differential line end layer, and maximum residual copper pillar requirement value of differential line;

[0007] Obtain the stack-up data of the printed circuit board, the stack-up data including: the wiring layers of the printed circuit board and the thickness of each layer of the printed circuit board.

[0008] The length of the residual copper pillars of the differential line is determined based on the differential line start layer, differential line end layer, trace layer of the printed circuit board, and the thickness of each layer of the printed circuit board.

[0009] Determine whether the length of the residual copper pillar of the differential line is greater than or equal to the maximum required value of the residual copper pillar of the differential line;

[0010] If the length of the residual copper column of the differential line is greater than or equal to the maximum required value of the residual copper column of the differential line, then the differential line is determined to be the target differential line that needs to be back-drilled.

[0011] Output the differential line data of the target differential line and the length of the residual copper pillar.

[0012] Optionally, determining the length of the residual copper pillar of the differential line based on the differential line start layer, differential line end layer, trace layer of the printed circuit board, and the thickness of each layer of the printed circuit board includes:

[0013] Based on the differential line start layer, differential line end layer, and printed circuit board routing layer, the target number of printed circuit board layers through which the residual copper pillars of the differential line pass is calculated.

[0014] The thickness of each layer in the target number of layers is obtained based on the thickness of each layer of the printed circuit board.

[0015] The residual copper column length of the differential line is calculated based on the thickness of each layer in the target layer number.

[0016] Optionally, the method further includes:

[0017] Output the target number of printed circuit board layers through which the residual copper pillars of the target differential line pass.

[0018] Optionally, the differential line data further includes: the bus name corresponding to the differential line; obtaining the differential line data of the printed circuit board includes:

[0019] Obtain the first correspondence between the bus name corresponding to the differential line and the maximum residual copper pillar requirement value of the differential line;

[0020] Based on the bus name corresponding to the differential line and the first correspondence, obtain the maximum residual copper pillar requirement value of the differential line.

[0021] Optionally, the differential line data further includes: the network name of the differential line, and the method further includes:

[0022] Obtain crimp connector data, which includes: crimp connector name, crimp connector fisheye depth, and network name of the differential line connected to the crimp connector; wherein, the fisheye depth is the minimum contact depth between the pin of the crimp connector and the hole wall;

[0023] Based on the network name of the target differential line and the network name of the differential line connected to the crimp connector, the sub-target differential lines in the target differential lines are determined; the sub-target differential lines are the differential lines in the target differential lines that are connected to the crimp connector.

[0024] The fisheye depth of the crimp connector corresponding to the sub-target differential line is taken as the minimum residual copper pillar requirement value of the sub-target differential line.

[0025] Output the minimum residual copper pillar requirement value for the sub-target difference line in the target difference line.

[0026] Optionally, the crimping component data further includes: the crimping connector part number, and the process of obtaining the crimping component data includes:

[0027] Obtain the second correspondence between the crimp connector part number and the fisheye depth;

[0028] The fisheye depth of the crimp connector is obtained based on the crimp connector part number and the second correspondence.

[0029] Optionally, the method further includes:

[0030] Obtain the maximum residual copper pillar length after back drilling;

[0031] The back-drilling depth of the target difference line is determined based on the length of the residual copper column of the target difference line and the length of the maximum residual copper column after back-drilling.

[0032] Output the back-drilling depth of the target difference line.

[0033] Secondly, embodiments of the present invention disclose a differential line data processing apparatus, the apparatus comprising:

[0034] The differential line data acquisition module is used to acquire differential line data of the printed circuit board. The differential line data includes: differential line start layer, differential line end layer, and differential line maximum residual copper pillar requirement value.

[0035] A printed circuit board stack-up data acquisition module is used to acquire the stack-up data of the printed circuit board, the stack-up data including: the wiring layers of the printed circuit board and the thickness of each layer of the printed circuit board.

[0036] The residual copper pillar length determination module is used to determine the residual copper pillar length of the differential line based on the differential line start layer, differential line end layer, printed circuit board trace layer, and the thickness of each layer of the printed circuit board.

[0037] The residual copper pillar length determination module is used to determine whether the residual copper pillar length of the differential line is greater than or equal to the maximum residual copper pillar requirement value of the differential line;

[0038] The target differential line determination module is used to determine the differential line as a target differential line that needs to be back-drilled if the length of the residual copper pillar of the differential line is greater than or equal to the maximum residual copper pillar requirement value of the differential line.

[0039] The output module is used to output the differential line data of the target differential line and the length of the residual copper pillar.

[0040] Optionally, the residual copper pillar length determination module is specifically used to: calculate the target number of printed circuit board layers through which the residual copper pillar of the differential line passes based on the differential line start layer, differential line end layer, and the trace layer of the printed circuit board; obtain the thickness of each layer in the target number of layers based on the thickness of each layer of the printed circuit board; and calculate the length of the residual copper pillar of the differential line based on the thickness of each layer in the target number of layers.

[0041] Optionally, the output module is further configured to: output the target number of printed circuit boards through which the residual copper pillars of the target differential line pass.

[0042] Optionally, the differential line data further includes: the bus name corresponding to the differential line. The differential line data acquisition module is specifically used to: acquire a first correspondence between the bus name corresponding to the differential line and the maximum residual copper pillar requirement value of the differential line; and acquire the maximum residual copper pillar requirement value of the differential line based on the bus name corresponding to the differential line and the first correspondence.

[0043] Optionally, the differential line data further includes: the network name of the differential line, and the differential line data processing module further includes:

[0044] A crimp connector data acquisition module is used to acquire crimp connector data, which includes: crimp connector name, crimp connector fisheye depth, and network name of the differential line connected to the crimp connector; wherein, the fisheye depth is the minimum contact depth between the pin of the crimp connector and the hole wall;

[0045] Sub-target differential line determination module. Used to determine sub-target differential lines within the target differential line based on the network name of the target differential line and the network name of the differential line connected to the crimp connector; the sub-target differential line is the differential line within the target differential line that is connected to the crimp connector;

[0046] The minimum residual copper pillar requirement determination module is used to take the fisheye depth of the crimp connector corresponding to the sub-target differential line as the minimum residual copper pillar requirement value of the sub-target differential line.

[0047] The output module is also used to output the minimum residual copper pillar requirement value of the sub-target differential line in the target differential line.

[0048] Optionally, the crimping component data further includes: a crimping connector part number. The crimping component data acquisition module is specifically used to: acquire a second correspondence between the crimping connector part number and the fisheye depth; and acquire the fisheye depth of the crimping connector based on the crimping connector part number and the second correspondence.

[0049] Optionally, the differential line data processing device further includes:

[0050] The back-drilling depth determination module is used to obtain the maximum residual copper column length after back-drilling; and to determine the back-drilling depth of the target difference line based on the residual copper column length of the target difference line and the maximum residual copper column length after back-drilling.

[0051] The output module is specifically used to output the back-drilling depth of the target differential line.

[0052] Thirdly, the present invention discloses an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the program, implements the steps of the differential line data processing method as described in the first aspect.

[0053] Fourthly, the present invention discloses a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the differential line data processing method as described in the first aspect.

[0054] The embodiments of the present invention have the following advantages:

[0055] This process involves obtaining the differential line's start layer, end layer, and maximum residual copper pillar requirement, as well as the trace layers and thicknesses of each layer on the printed circuit board (PCB). Based on these parameters, the residual copper pillar length of the differential line is determined. It is then checked whether this residual copper pillar length is greater than or equal to the maximum residual copper pillar requirement. If it is, the differential line is identified as a target differential line requiring back-drilling. Finally, the differential line data and residual copper pillar length of the target differential line are output. This method improves the accuracy of differential line back-drilling information and reduces the workload of differential line data processing. Attached Figure Description

[0056] Figure 1 This is a schematic diagram of a residual copper pillar provided in an embodiment of the present invention;

[0057] Figure 2 This is a flowchart of the steps of a differential line data processing method provided in an embodiment of the present invention;

[0058] Figure 3 This is a schematic diagram of differential line data provided in an embodiment of the present invention;

[0059] Figure 4 This is a flowchart of another differential line data processing method provided in an embodiment of the present invention;

[0060] Figure 5 This is a structural block diagram of a differential line data processing device provided in an embodiment of the present invention;

[0061] Figure 6 A structural block diagram of an electronic device provided in an embodiment of the present invention;

[0062] Figure 7 This is a structural block diagram of a computer-readable storage medium provided in an embodiment of the present invention. Detailed Implementation

[0063] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0064] In high-speed multilayer PCBs, signals are transmitted from one interconnect layer to another vias. Vias are generally classified into three types: through-hole vias, blind vias, and buried vias. Blind vias are holes located on the top or bottom surface of the PCB, with a certain depth, used for connecting surface and inner layer traces. Buried vias are connection holes located on inner layers of the PCB and do not extend to the surface. Through-hole vias are holes that pass through the entire PCB and can be used for internal interconnects or as mounting holes for components. Because through-holes are easier to manufacture and less expensive, they are more commonly used in printed circuit boards.

[0065] In the fabrication of multilayer PCBs, such as a 12-layer PCB, if it's necessary to connect layer 1 to layer 9, a through-hole is usually drilled (from layer 1 to layer 12), and then copper is deposited inside the through-hole. This directly connects layer 1 to layer 12. However, only the connection from layer 1 to layer 9 is actually needed; the extra copper pillars from layer 10 to layer 12 are unnecessary. These extra copper pillars would interfere with signal path, so they need to be removed from the reverse side using back drilling (starting from layer 12). This process is called back drilling.

[0066] In related technologies, engineers need to visually select which differential lines on a PCB board require back-drilling. Manually selecting and processing these differential lines is error-prone and time-consuming. Therefore, this invention proposes a differential line data processing method. By inputting the corresponding differential line data and the PCB stack-up data, relevant information about the target differential lines requiring back-drilling can be quickly obtained.

[0067] Reference Figure 2 The diagram illustrates a flowchart of a differential line data processing method provided by an embodiment of the present invention. The method may specifically include the following steps:

[0068] Step 101: Obtain differential line data of the printed circuit board. The differential line data includes: differential line start layer, differential line end layer, and differential line maximum residual copper pillar requirement value.

[0069] Multiple differential lines are laid on a printed circuit board. In this embodiment of the invention, it is necessary to obtain the differential line start layer, differential line end layer, and maximum residual copper pillar requirement value for each differential line on the printed circuit board. For example, if a differential line needs to connect from the first layer to the ninth layer of the printed circuit board, then the differential line start layer is the first layer, and the differential line end layer is the ninth layer. The maximum residual copper pillar requirement value for the differential line is set according to the network signal transmitted by the differential line.

[0070] In one embodiment, the differential line data further includes: the bus name corresponding to the differential line. Then step 101 may specifically include: obtaining a first correspondence between the bus name corresponding to the differential line and the maximum residual copper pillar requirement value of the differential line; obtaining the maximum residual copper pillar requirement value of the differential line based on the bus name corresponding to the differential line and the first correspondence.

[0071] Differential lines transmitting different network signals generally have the same maximum residual copper pillar requirement if the buses they correspond to are the same. Therefore, the first correspondence between the bus name corresponding to the differential line and the maximum residual copper pillar requirement can be stored in advance. After obtaining the bus name corresponding to the differential line, the maximum residual copper pillar requirement can be obtained according to the bus name corresponding to the differential line and the first correspondence.

[0072] Reference Figure 3 This diagram illustrates a differential line data structure. Column A represents the bus name corresponding to the differential line, column B represents the network name of the differential line, column C represents the starting layer of the differential line (top indicates the starting layer is the first layer, bot indicates the starting layer is the last layer), column D represents the ending layer of the differential line, and column E represents the maximum residual copper pillar requirement value for the differential line. The unit of the maximum residual copper pillar requirement value is mil (mil).

[0073] Step 102: Obtain the stack-up data of the printed circuit board, which includes: the trace layers of the printed circuit board and the thickness of each layer of the printed circuit board.

[0074] Printed circuit boards (PCBs) are typically multilayer boards. This step requires obtaining information about each layer of the PCB, including: the routing layers and the thickness of each layer. The routing layers may include: the name of each routing layer and its sequence number.

[0075] Step 103: Determine the length of the residual copper pillars of the differential line based on the differential line start layer, differential line end layer, trace layer of the printed circuit board, and the thickness of each layer of the printed circuit board.

[0076] Once the starting layer and ending layer of the differential line, as well as the trace layers and the thickness of each layer of the printed circuit board are obtained, the length of the residual copper pillars of the differential line can be determined.

[0077] In one embodiment, step 103 may specifically include: calculating the target number of printed circuit board layers through which the residual copper pillars of the differential line pass based on the differential line start layer, differential line end layer, and the trace layers of the printed circuit board; obtaining the thickness of each layer in the target number of layers based on the thickness of each layer of the printed circuit board; and calculating the length of the residual copper pillars of the differential line based on the thickness of each layer in the target number of layers.

[0078] For example, if a PCB board is known to be 18 layers, and a differential line needs to connect from layer 1 to layer 16, then the target number of PCB layers through which the residual copper pillar of the differential line passes can be calculated to be layers 18 to 17. Based on the thickness of each layer of the PCB, the thicknesses of layers 18 and 17 can be obtained. Adding the thicknesses of layers 18 and 17 together gives the length of the residual copper pillar of the differential line.

[0079] Alternatively, if the PCB is an 18-layer board, and a differential line needs to connect from layer 18 to layer 10, then the target number of PCB layers through which the residual copper pillar of the differential line passes can be calculated as layers 1 to 9. Based on the thickness of each layer of the PCB, the thickness of each layer from layer 1 to layer 9 can be obtained. Adding the thicknesses of each layer from layer 1 to layer 9 gives the length of the residual copper pillar of the differential line.

[0080] Step 104: Determine whether the length of the residual copper pillar of the differential line is greater than or equal to the maximum required value of the residual copper pillar of the differential line.

[0081] After obtaining the length of the residual copper pillars of each differential line, it can be determined whether the length of the residual copper pillars of the differential line is greater than or equal to the maximum required value of the residual copper pillars of the differential line.

[0082] Step 105: If the length of the residual copper pillar of the differential line is greater than or equal to the maximum required value of the residual copper pillar of the differential line, then the differential line is determined to be the target differential line that needs to be back-drilled.

[0083] If the length of the residual copper pillars of the differential line is greater than or equal to the maximum required value for residual copper pillars, then the length of the residual copper pillars of the differential line is determined to be too long, which will affect the signal transmission effect, and back-drilling is required. In this case, the differential line with a residual copper pillar length greater than or equal to the maximum required value for residual copper pillars is taken as the target differential line.

[0084] If the length of the residual copper pillars of the differential line is less than the maximum required value of the residual copper pillars of the differential line, then the length of the residual copper pillars of the differential line is within the required range and has little impact on signal transmission. Therefore, back drilling is not required.

[0085] Step 106: Output the differential line data of the target differential line and the length of the residual copper pillar.

[0086] Once the target differential line is determined, the differential line data and the length of the remaining copper pillars can be output. The differential line data of the target differential line includes at least one of the following: the differential line start layer, the differential line end layer, and the maximum required value of the residual copper pillars.

[0087] In this embodiment of the invention, the starting layer, ending layer, and maximum residual copper pillar requirement of the differential line on the printed circuit board (PCB) are obtained, along with the routing layers and thicknesses of each layer of the PCB. Based on these parameters, the residual copper pillar length of the differential line is determined. It is then determined whether the residual copper pillar length is greater than or equal to the maximum residual copper pillar requirement. If the residual copper pillar length is greater than or equal to the maximum residual copper pillar requirement, the differential line is identified as a target differential line requiring back-drilling. Finally, the differential line data and residual copper pillar length of the target differential line are output. This method improves the accuracy of differential line back-drilling information and reduces the workload of differential line data processing.

[0088] Reference Figure 4 The diagram illustrates a flowchart of another differential line data processing method provided by an embodiment of the present invention. The differential line data further includes the network name of the differential line. Therefore, the differential line data processing method may further include the following steps:

[0089] Step 107: Obtain crimp connector data, which includes: crimp connector name, crimp connector fisheye depth, and network name of the differential line connected to the crimp connector; wherein, the fisheye depth is the minimum contact depth between the pin and the hole wall of the crimp connector.

[0090] In printed circuit boards (PCBs), some differential lines are connected to vias via crimp connectors to transmit signals. Crimp connector pins are typically fisheye type. For back-drilling at the crimp connector, the remaining hole wall length after drilling must be greater than the fisheye depth; otherwise, it will affect the contact between the fisheye and the PCB's copper contacts, thus impacting signal transmission.

[0091] Therefore, for differential lines that use crimp connectors to connect through holes to transmit signals, it is also necessary to determine the minimum contact depth between the crimp connector and the through hole, i.e., the fisheye depth.

[0092] In one embodiment, the crimping data further includes: the crimping connector part number, then step 107 further includes: obtaining a second correspondence between the crimping connector part number and the fisheye depth; and obtaining the fisheye depth of the crimping connector based on the crimping connector part number and the second correspondence.

[0093] The crimp connector part number is the model number of the crimp connector. Crimped connectors with the same signal have the same fisheye depth. Therefore, a second correspondence between crimp connector part numbers and fisheye depths can be stored in advance. After obtaining the crimp connector part number, the fisheye depth of the crimp connector can be obtained based on the crimp connector part number and the second correspondence.

[0094] Step 108: Determine the sub-target differential lines in the target differential lines based on the network name of the target differential line and the network name of the differential line connected to the crimp connector; the sub-target differential lines are the differential lines in the target differential lines that are connected to the crimp connector.

[0095] After obtaining the net names of the target differential lines and the differential lines connected by the crimp connectors, the sub-target differential lines connected by the crimp connectors within the target differential lines can be identified. For example, if the target differential lines include: a differential line with net name PCIE1, a differential line with net name PCIE4, and a differential line with net name PCIE5, and the differential lines connected by the crimp connectors include a differential line with net name PCIE4, then the sub-target differential line can be identified as the differential line with net name PCIE4.

[0096] Step 109: The fisheye depth of the crimp connector corresponding to the sub-target differential line is taken as the minimum residual copper pillar requirement value of the sub-target differential line.

[0097] For the sub-target differential line, the length of the remaining hole wall after back drilling needs to be greater than the fisheye depth. Therefore, the fisheye depth of the crimp connector corresponding to the sub-target differential line is taken as the minimum residual copper pillar requirement value of the sub-target differential line.

[0098] Step 110: Output the minimum residual copper pillar requirement value of the sub-target difference line in the target difference line.

[0099] After determining the minimum residual copper pillar requirement for the sub-target difference line, the minimum residual copper pillar requirement for the sub-target difference line in the target difference line can be output simultaneously with the difference line data and residual copper pillar length of the target difference line.

[0100] In one embodiment, the differential line data processing method may further include: obtaining the maximum residual copper pillar length after back drilling; determining the back drilling depth of the target differential line based on the residual copper pillar length of the target differential line and the maximum residual copper pillar length after back drilling; and outputting the back drilling depth of the target differential line.

[0101] The maximum residual copper pillar length after back drilling is a set processing requirement to control the back drilling accuracy of PCB factories. The maximum residual copper pillar length after back drilling can be set based on the PCB factory's processing capacity and the maximum residual copper pillar requirement for differential lines. After calculating the residual copper pillar length of the target differential line, the back drilling depth of the target differential line can be calculated based on the maximum residual copper pillar length after back drilling. For example, if the residual copper pillar length of the target differential line is 39mil and the maximum residual copper pillar length after back drilling is 8mil, then the back drilling depth of the target differential line can be calculated as 39mil - 8mil = 31mil.

[0102] In one embodiment, the output data can be displayed in formats including but not limited to tables, text, and graphics. The output data may include at least one of the following: the network name of the target differential line, the starting layer of the target differential line, the ending layer of the target differential line, the residual copper pillar length of the target differential line, the maximum residual copper pillar requirement value of the target differential line, the target layer number of the target differential line, the number of layers that cannot be drilled through corresponding to the target differential line, the minimum residual copper pillar requirement value of the sub-target differential lines within the target differential line, the connector name connected to the sub-target differential lines, and the maximum residual copper pillar length after back-drilling. The number of layers that cannot be drilled through corresponding to the target differential line is obtained by subtracting one or adding one to the number of layers traversed by the back-drill. For example, if the back-drill needs to traverse layers 1 to 8, then layer 7 is the number of layers that the back-drill cannot traverse corresponding to that differential line; if the back-drill needs to traverse layers 18 to 10, then layer 9 is the number of layers that the back-drill cannot traverse corresponding to that differential line.

[0103] The embodiments of the present invention can reduce the workload of engineers, improve the accuracy of back-drilling information, avoid situations such as exposed or multiple drills, thereby improving signal quality, shortening product design cycle, and enhancing the market competitiveness of storage products.

[0104] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions involved are not necessarily essential to the embodiments of the present invention.

[0105] Reference Figure 5 The diagram shows a structural block diagram of a differential line data processing device provided in an embodiment of the present invention, which may specifically include the following modules:

[0106] The differential line data acquisition module 201 is used to acquire differential line data of the printed circuit board. The differential line data includes: differential line start layer, differential line end layer, and differential line maximum residual copper pillar requirement value.

[0107] The printed circuit board stack-up data acquisition module 202 is used to acquire the stack-up data of the printed circuit board, the stack-up data including: the wiring layers of the printed circuit board and the thickness of each layer of the printed circuit board.

[0108] The residual copper pillar length determination module 203 is used to determine the residual copper pillar length of the differential line based on the differential line start layer, differential line end layer, trace layer of the printed circuit board, and the thickness of each layer of the printed circuit board.

[0109] The residual copper column length determination module 204 is used to determine whether the residual copper column length of the differential line is greater than or equal to the maximum residual copper column requirement value of the differential line;

[0110] The target differential line determination module 205 is used to determine the differential line as a target differential line that needs to be back-drilled if the length of the residual copper pillar of the differential line is greater than or equal to the maximum residual copper pillar requirement value of the differential line.

[0111] Output module 206 is used to output the differential line data of the target differential line and the length of the residual copper pillar.

[0112] Optionally, the residual copper pillar length determination module is specifically used to: calculate the target number of printed circuit board layers through which the residual copper pillar of the differential line passes based on the differential line start layer, differential line end layer, and the trace layer of the printed circuit board; obtain the thickness of each layer in the target number of layers based on the thickness of each layer of the printed circuit board; and calculate the length of the residual copper pillar of the differential line based on the thickness of each layer in the target number of layers.

[0113] Optionally, the output module is further configured to: output the target number of printed circuit boards through which the residual copper pillars of the target differential line pass.

[0114] Optionally, the differential line data further includes: the bus name corresponding to the differential line. The differential line data acquisition module is specifically used to: acquire a first correspondence between the bus name corresponding to the differential line and the maximum residual copper pillar requirement value of the differential line; and acquire the maximum residual copper pillar requirement value of the differential line based on the bus name corresponding to the differential line and the first correspondence.

[0115] Optionally, the differential line data further includes: the network name of the differential line, and the differential line data processing module further includes:

[0116] A crimp connector data acquisition module is used to acquire crimp connector data, which includes: crimp connector name, crimp connector fisheye depth, and network name of the differential line connected to the crimp connector; wherein, the fisheye depth is the minimum contact depth between the pin of the crimp connector and the hole wall;

[0117] Sub-target differential line determination module. Used to determine sub-target differential lines within the target differential line based on the network name of the target differential line and the network name of the differential line connected to the crimp connector; the sub-target differential line is the differential line within the target differential line that is connected to the crimp connector;

[0118] The minimum residual copper pillar requirement determination module is used to take the fisheye depth of the crimp connector corresponding to the sub-target differential line as the minimum residual copper pillar requirement value of the sub-target differential line.

[0119] The output module is also used to output the minimum residual copper pillar requirement value of the sub-target differential line in the target differential line.

[0120] Optionally, the crimping component data further includes: a crimping connector part number. The crimping component data acquisition module is specifically used to: acquire a second correspondence between the crimping connector part number and the fisheye depth; and acquire the fisheye depth of the crimping connector based on the crimping connector part number and the second correspondence.

[0121] Optionally, the differential line data processing device further includes:

[0122] The back-drilling depth determination module is used to obtain the maximum residual copper column length after back-drilling; and to determine the back-drilling depth of the target difference line based on the residual copper column length of the target difference line and the maximum residual copper column length after back-drilling.

[0123] The output module is specifically used to output the back-drilling depth of the target differential line.

[0124] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0125] Reference Figure 6 The diagram shows a structural block diagram of an electronic device 30 provided in an embodiment of the present invention. The electronic device 30 includes:

[0126] The processor 301, the memory 302, and the computer program 3021 stored in the memory 302 and capable of running on the processor 301, when the computer program 3021 is executed by the processor 301, implement the various processes of the above-described reference time determination method embodiment and achieve the same technical effect. To avoid repetition, they will not be described again here.

[0127] Reference Figure 7 The diagram shows a structural block diagram of a computer-readable storage medium 40 provided in an embodiment of the present invention. The computer-readable storage medium 40 stores a computer program 401. When the computer program 401 is executed by a processor, it implements the various processes of the above-described reference time determination method embodiment and can achieve the same technical effect. To avoid repetition, it will not be described again here.

[0128] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0129] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, apparatus, or computer program products. Therefore, embodiments of the present invention can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of the present invention can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0130] Embodiments of the present invention are described with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0131] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0132] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal equipment, causing a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0133] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present invention.

[0134] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0135] The above provides a detailed description of a differential line data processing method, apparatus, electronic device, and storage medium provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method for processing differential line data, characterized in that, include: Obtain differential line data of printed circuit boards, the differential line data including: differential line start layer, differential line end layer, and maximum residual copper pillar requirement value of differential line; Obtain the stack-up data of the printed circuit board, the stack-up data including: the wiring layers of the printed circuit board and the thickness of each layer of the printed circuit board. The length of the residual copper pillars of the differential line is determined based on the differential line start layer, differential line end layer, trace layer of the printed circuit board, and the thickness of each layer of the printed circuit board. Determine whether the length of the residual copper pillar of the differential line is greater than or equal to the maximum required value of the residual copper pillar of the differential line; If the length of the residual copper column of the differential line is greater than or equal to the maximum required value of the residual copper column of the differential line, then the differential line is determined to be the target differential line that needs to be back-drilled. Output the differential line data of the target differential line and the length of the residual copper pillar.

2. The method according to claim 1, characterized in that, The step of determining the residual copper pillar length of the differential line based on the differential line start layer, differential line end layer, printed circuit board trace layer, and the thickness of each layer of the printed circuit board includes: Based on the differential line start layer, differential line end layer, and printed circuit board routing layer, the target number of printed circuit board layers through which the residual copper pillars of the differential line pass is calculated. The thickness of each layer in the target number of layers is obtained based on the thickness of each layer of the printed circuit board. The residual copper column length of the differential line is calculated based on the thickness of each layer in the target layer number.

3. The method according to claim 2, characterized in that, The method further includes: Output the target number of printed circuit board layers through which the residual copper pillars of the target differential line pass.

4. The method according to claim 1, characterized in that, The differential line data also includes: the bus name corresponding to the differential line; obtaining the differential line data of the printed circuit board includes: Obtain the first correspondence between the bus name corresponding to the differential line and the maximum residual copper pillar requirement value of the differential line; Based on the bus name corresponding to the differential line and the first correspondence, obtain the maximum residual copper pillar requirement value of the differential line.

5. The method according to claim 1, characterized in that, The differential line data further includes: the network name of the differential line, and the method further includes: Obtain crimp connector data, which includes: crimp connector name, crimp connector fisheye depth, and network name of the differential line connected to the crimp connector; wherein, the fisheye depth is the minimum contact depth between the pin of the crimp connector and the hole wall; Based on the network name of the target differential line and the network name of the differential line connected to the crimp connector, the sub-target differential lines in the target differential lines are determined; the sub-target differential lines are the differential lines in the target differential lines that are connected to the crimp connector. The fisheye depth of the crimp connector corresponding to the sub-target differential line is taken as the minimum residual copper pillar requirement value of the sub-target differential line. Output the minimum residual copper pillar requirement value for the sub-target difference line in the target difference line.

6. The method according to claim 5, characterized in that, The crimping component data also includes: the crimping connector part number. Obtaining the crimping component data includes: Obtain the second correspondence between the crimp connector part number and the fisheye depth; The fisheye depth of the crimp connector is obtained based on the crimp connector part number and the second correspondence.

7. The method according to claim 1, characterized in that, The method further includes: Obtain the maximum residual copper pillar length after back drilling; The back-drilling depth of the target difference line is determined based on the length of the residual copper column of the target difference line and the length of the maximum residual copper column after back-drilling. Output the back-drilling depth of the target difference line.

8. A differential line data processing device, characterized in that, include: The differential line data acquisition module is used to acquire differential line data of the printed circuit board. The differential line data includes: differential line start layer, differential line end layer, and differential line maximum residual copper pillar requirement value. A printed circuit board stack-up data acquisition module is used to acquire the stack-up data of the printed circuit board, the stack-up data including: the wiring layers of the printed circuit board and the thickness of each layer of the printed circuit board. The residual copper pillar length determination module is used to determine the residual copper pillar length of the differential line based on the differential line start layer, differential line end layer, printed circuit board trace layer, and the thickness of each layer of the printed circuit board. The residual copper pillar length determination module is used to determine whether the residual copper pillar length of the differential line is greater than or equal to the maximum residual copper pillar requirement value of the differential line; The target differential line determination module is used to determine the differential line as a target differential line that needs to be back-drilled if the length of the residual copper pillar of the differential line is greater than or equal to the maximum residual copper pillar requirement value of the differential line. The output module is used to output the differential line data of the target differential line and the length of the residual copper pillar.

9. An electronic device, characterized in that, include: A processor, a memory, and a computer program stored in the memory and capable of running on the processor, wherein the computer program, when executed by the processor, implements the steps of the differential line data processing method as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, A computer program is stored on the computer-readable storage medium, which, when executed by a processor, implements the steps of the differential line data processing method as described in any one of claims 1-7.

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