Electronic device with cover member having differential reinforcement

Abstract

The present disclosure relates to an electronic device having a cover member with differential strengthening. Disclosed are a cover member with differential strengthening for an electronic device. The cover member with differential strengthening includes at least one chemically strengthened zone that improves the cover member's resistance to cracking. One or more of the chemically strengthened zones can cover or at least partially surround a portion of the cover member to be protected from damage.

Description

[0001] Cross-reference to related applications

[0002] This application is a non-provisional application filed on January 19, 2022, entitled “Electronic Devices Having Differently Strengthened Cover Members”, U.S. Provisional Patent Application No. 63 / 300,984, and claims the benefit of that U.S. Provisional Patent Application, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The described embodiments generally relate to reinforced covers for electronic devices. More specifically, this embodiment relates to a cover member that is chemically reinforced to include at least one portion that is chemically reinforced to a greater extent than adjacent portions of the cover member. Background Technology

[0004] Conventional cover components for portable electronic devices can be made of glass and, in some cases, can be provided above a display. Conventional glass cover components can be chemically strengthened by substantially uniform ion exchange across their entire surface. Such uniformly strengthened glass cover components can have symmetrical compressive stress regions on the front and rear surfaces, with tensile stress regions between these compressive stress regions. Summary of the Invention

[0005] The following disclosure relates to differentially strengthened cover members for electronic devices. The cover member may be part of the housing of the electronic device and may be positioned above a display or other component of the electronic device. Differential strengthening of the cover member can provide increased crack resistance to the portion of the cover member to which it is strengthened to a greater extent. Further aspects of this disclosure relate to housings and electronic devices including the cover members described herein.

[0006] In one embodiment, the differentially strengthened cap member includes at least one chemically strengthened region that is chemically strengthened to a greater extent than another chemically strengthened region. The region of the cap member with the greater degree of chemical strengthening may have greater crack resistance than other regions. In some cases, the region of the cap member with the greater degree of chemical strengthening defines a compressive stress distribution extending through the thickness of the cap member.

[0007] In some cases, the area of ​​the cover member with a greater degree of chemical reinforcement includes the window portion of the cover member, which is positioned above the optical components. Providing the window portion with a greater degree of chemical reinforcement can help prevent crack propagation through the window portion.

[0008] In other cases, one or more chemically reinforced regions of the cover member, having a greater degree of chemical reinforcement, at least partially surround another chemically reinforced region of the cover member. For example, the cover member may include a window portion and a set of barrier portions arranged at least partially around the window portion. This set of barrier portions includes chemically reinforced regions having a greater degree of chemical reinforcement than adjacent chemically reinforced regions. In some cases, one or more of the barrier portions have compressive stress regions extending through the thickness of the cover member. In some cases, this set of barrier portions may define a barrier that helps prevent crack propagation from the periphery of the cover member toward the window portion. In other cases, this set of barrier portions may be positioned at thinner portions of the cover member to provide additional protection against cracking to those thinner portions.

[0009] This disclosure provides an electronic device including a housing with a cover member defining an outer surface and an inner surface. The cover member includes: a first chemically reinforced region defining a first stress distribution including a first compressive stress region extending from the outer surface to the inner surface; and a second chemically reinforced region surrounding the first chemically reinforced region and defining a second stress distribution. The second stress distribution includes: a second compressive stress region extending from the outer surface; a third compressive stress region extending from the inner surface; and a tensile stress region located between the second and third compressive stress regions.

[0010] This disclosure also provides an electronic device including a display and a housing, the housing at least partially surrounding the display and including a cover member. The cover member includes: a window portion positioned above the display and having a window stress distribution including: an outer compressive stress region extending from an outer surface of the cover member; an inner compressive stress region extending from an inner surface of the cover member; and a tensile stress region positioned between the outer compressive stress region and the inner compressive stress region; and a set of barrier portions arranged at least partially around the window portion, each barrier portion having a corresponding barrier stress distribution including a compressive stress region extending from the outer surface of the cover member to a depth greater than the depth of the outer compressive stress region of the window stress distribution.

[0011] This disclosure further provides an electronic device including optical components and a housing, the housing including a cover member. The cover member includes a first chemically reinforced region positioned above the optical component and having a first stress distribution, the first stress distribution including a compressive stress region extending from an outer surface of the cover member to a first depth. The cover member also includes a second chemically reinforced region surrounding the first chemically reinforced region and defining a second stress distribution, the second stress distribution including: an outer compressive stress region extending from the outer surface of the cover member to a second depth less than the first depth; an inner compressive stress region extending from an inner surface of the cover member; and a tensile stress region positioned between the outer compressive stress region and the inner compressive stress region. Attached Figure Description

[0012] This disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings, wherein similar reference numerals denote similar elements.

[0013] Figure 1A A front view of an exemplary electronic device including a differentially reinforced cover member is shown.

[0014] Figure 1B It shows Figure 1A Rear view of an electronic device.

[0015] Figure 2A A detailed view of an exemplary electronic device is shown.

[0016] Figure 2B It shows Figure 2A A partial cross-sectional view of an exemplary electronic device.

[0017] Figure 3A A detailed view of an exemplary electronic device is shown.

[0018] Figure 3B It shows Figure 3A A partial cross-sectional view of the equipment.

[0019] Figure 4 A detailed view of an exemplary electronic device is shown.

[0020] Figure 5A A detailed view of an exemplary electronic device is shown.

[0021] Figure 5B A detailed view of an exemplary electronic device is shown.

[0022] Figure 6A , Figure 6B and Figure 6C An example of a cover component is shown.

[0023] Figure 7 A partial cross-sectional view of the cover component is shown.

[0024] Figure 8A The stress distribution extending through the thickness of the cover member is shown.

[0025] Figure 8B Another stress distribution extending through the thickness of the cover member is shown.

[0026] Figure 9 A partial cross-sectional view of the mask applied to the cover component is shown.

[0027] Figure 10A , Figure 10B , Figure 10C and Figure 10D Examples of concentration distributions at different stages of the chemical strengthening process of cap components are shown.

[0028] Figure 11 Another partial cross-sectional view of the mask applied to the cover component is shown.

[0029] Figure 12A , Figure 12B , Figure 12C and Figure 12D An example of concentration distribution at different stages in another process of chemically strengthening cap components is shown.

[0030] Figure 13 A block diagram of a sample electronic device that may include differentially reinforced cover components is shown.

[0031] The use of crosshairs or shading in the accompanying drawings is generally provided to clarify the boundaries between adjacent elements and also to improve the readability of the drawings. Therefore, the presence or absence of crosshairs or shading does not indicate or suggest any preference or requirement for a particular material, material properties, element proportions, element dimensions, commonalities of similar illustrated elements, or any other feature, property, or characteristic of any element shown in the accompanying drawings.

[0032] Additionally, it should be understood that the proportions and dimensions (relative or absolute) of the various features and elements (as well as their sets and groups), and the boundaries, spacing, and positional relationships therebetween, are provided in the accompanying drawings solely to facilitate understanding of the various embodiments described herein, and may therefore be unnecessarily presented or shown for scaling and are not intended to indicate any preference or requirement for the illustrated embodiments to exclude embodiments in conjunction with them. Detailed Implementation

[0033] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a single preferred embodiment. Rather, the embodiments are intended to cover alternatives, modifications, and equivalents that may be included within the scope and spirit of this disclosure and the appended claims.

[0034] The following disclosure relates to differentially strengthened cover members for electronic devices. As used herein, the term "differential strengthening" can be used to refer to glass or glass-ceramic articles with different strengthening zones. The cover member may be part of the housing of an electronic device and may be positioned above a display or other component of the electronic device. Differential strengthening of the cover member can provide increased crack resistance to the portion of the cover member that is strengthened to a greater extent. Further aspects of this disclosure relate to housings and electronic devices that include the cover member described herein.

[0035] In an embodiment, the differentially strengthened cover member includes at least one chemically strengthened region that is chemically strengthened to a greater extent than another chemically strengthened region. The region of the cover member with a greater degree of chemical strengthening may have greater crack resistance than other regions. The region of the cover member with a higher level of chemical strengthening may also help to prevent or redirect crack propagation within the cover, thereby reducing the likelihood that cracks will propagate through functional areas of the cover (such as camera areas, sensor areas, or display areas). The region with a greater degree of chemical strengthening may have a greater compressive depth (e.g., maximum compressive depth), a greater maximum compressive stress, and / or a greater surface compressive stress. In some cases, the region of the cover member with a greater degree of chemical strengthening defines a compressive stress distribution extending through the thickness of the cover member. In other cases, the region of the cover member with a greater degree of chemical strengthening defines a stress distribution including an internal region comprising both compressive stress regions and tensile stress regions, but this stress distribution differs from the stress distribution of the region with a smaller degree of chemical strengthening. Relative to Figures 3A to 5B and Figures 7 to 8B The description of the exemplary stress distribution provided is generally applicable to this document. Each region in the zone can be chemically strengthened by ion exchange, as at least relative to... Figures 2A to 2B and Figures 9 to 12D More detailed description.

[0036] In some cases, the chemically reinforced region of the cover member, with a greater degree of chemical strengthening, includes a window portion of the cover member positioned above the optical component. Providing the window portion with a greater degree of chemical strengthening can help prevent crack propagation through it. The lateral dimension of the chemically reinforced region covering the optical component may depend on the lateral dimension of the optical component. In some cases, the lateral dimension (e.g., diameter) of the chemically reinforced region including the window portion is from about 1 mm to about 5 mm.

[0037] In some cases, one or more chemically reinforced regions of the cover member, having a greater degree of chemical reinforcement, at least partially surround another chemically reinforced region of the cover member. For example, the cover member may include a window portion and one or more barrier portions arranged at least partially around the window portion. Each barrier portion may be located outside the active display region of the display. In some cases, each barrier portion of this set is positioned over an opaque coating along the inner surface of the cover member (which may mask inactive areas of the display). This set of barrier portions includes chemically reinforced regions having a greater degree of chemical reinforcement than adjacent (e.g., adjoining) chemically reinforced regions. In some cases, one or more barrier portions have compressive stress regions extending through the thickness of the cover member. In examples, this set of barrier portions may define a ring around the window portion or another form of barrier that helps prevent cracks from propagating from the periphery (e.g., edge) of the cover member toward the window portion. The barrier portions may be offset from the edges of the cover member. In some cases, the lateral dimensions (e.g., diameter) of the chemically reinforced zone within the barrier portion are about 100 micrometers to about 1 cm, about 500 micrometers to about 5 mm, or about 500 micrometers to about 3 mm.

[0038] In some cases, electronic devices include sensor or camera assemblies that comprise multiple optical components. For example, the sensor assembly may be an optical facial recognition sensor that includes a light diffuser, a point source emitter, and an optical detector. In some examples, the cover member includes two or more window portions positioned above the multiple optical components of the sensor assembly, each of these window portions having a greater degree of chemical reinforcement than adjacent portions of the cover member. In other examples, the cover assembly may include barrier portions disposed around the multiple optical components of the sensor assembly, each of the barrier portions having a greater degree of chemical reinforcement than adjacent portions of the cover member. The barrier portions may define a single ring or separate rings surrounding the optical components.

[0039] The following is for reference Figures 1A to 13 These and other embodiments are discussed. However, those skilled in the art will readily understand that the detailed descriptions given herein with respect to the accompanying drawings are for illustrative purposes only and should not be construed as limiting.

[0040] Figure 1AA front view of an example electronic device including a differentially reinforced cover member is shown. The electronic device may have a housing 105 that includes a differentially reinforced cover member, as described herein. The electronic device 100 may be a mobile phone (also known as a cell phone). In other embodiments, the electronic device 100 may be a notebook computing device (e.g., a laptop computer or laptop computer), a tablet computing device (e.g., a tablet computer), a portable media player, a wearable device, or another type of portable electronic device. The electronic device 100 may also be a desktop computer system, computer component, input device, device, or virtually any other type of electronic product or device component.

[0041] like Figure 1A As shown, the electronic device 100 includes a housing 105, which includes a housing component 110 and a cover 122. The cover 122 may define at least a portion of the front surface 102 and at least a portion of the electronic device, and may be referred to as a front cover. The housing 105 also includes a cover 124 (in... Figure 1B (As shown in the diagram), the cover defines at least a portion of the rear surface 104 of the electronic device and may be referred to as a rear cover. In embodiments, cover 122 and / or cover 124 include differentially reinforced cover members, as described herein.

[0042] In embodiments, cover 122 and / or cover 124 may be in the form of a substantially flat sheet or may define a wavy profile. The shape of the cover member may resemble that of its corresponding cover. For example, cover 122 and / or cover 124 may define a peripheral portion that is not coplanar with respect to the central portion. In some cases, the peripheral portion may define a sidewall of the housing, while the central portion defines a front surface. Figure 6A An example of a cover member with this shape is shown. As another example, a cover such as cover 124 may define surface protrusions (e.g., Figure 1B (as shown), surface recesses and / or one or more curved surfaces. In some cases, one or more curved surfaces may be defined by a bend in the cover and / or at an edge extending between the front and rear surfaces of the cover. In embodiments, covers such as cover 122 or 124 may have a substantially uniform thickness or may vary in thickness. For example, portion 127 of cover 124 may be thicker than another portion 125. Portion 127 defines a top surface 128 and a side surface 129, while portion 125 defines surface 126.

[0043] In some embodiments, cover 122 and / or cover 124 defines a window above an optical component or sensor. In other embodiments, cover 122 and / or cover 124 defines one or more through-holes extending through its thickness to facilitate the positioning of one or more device components. For example, the cover may define a through-hole for positioning a component such as an optical component or another type of sensor. In some cases, front cover 122 may define an opening, such as opening 135, which may be positioned above a speaker or another internal device. Figure 1B The cover 124 may define one or more through holes to allow the positioning of optical components (e.g., optical component 177).

[0044] Cover 122 includes cover member 132, which may be referred to as the front cover member, and cover 124 includes cover member 134, which may be referred to as the rear cover member. Each of covers 122 and 124 may also include one or more coatings applied to its respective cover member. For example, an anti-reflective and / or anti-fouling coating may be applied to the outer surface of the cover member. As another example, a masking or decorative coating may be applied to the inner surface of the cover member. The masking layer may be substantially opaque and may have an optical density of 3 or greater. In another example, one or more of covers 122 and 124 may include a structure along the inner surface of the cover to provide structural support / reinforcement, electrical functionality, thermal functionality, and / or decorative effects. As an example, the structure may be formed of a polymer, laminate, or metallic material. When the cover has a three-dimensional shape, the structure may conform to the three-dimensional portion of the cover.

[0045] Cover members 132 and 134 may extend laterally across their respective covers (such as substantially across the width and length of covers 122 and 124). In some examples, cover member 132 has a thickness from about 0.3 mm to about 0.75 mm or from about 0.5 mm to about 1 mm. In some cases, the thickness of cover member 134 varies. For example, thinner portions of cover members may have a thickness greater than about 0.2 mm and less than about 0.75 mm or from about 0.5 mm to about 1 mm, and thicker portions of cover members may have a thickness greater than about 1 mm and less than or equal to about 2 mm or about 2.5 mm. In some cases, the window portions of the cover members may have sufficient transmittance and clarity for use on optical components of electronic devices.

[0046] In another embodiment, the electronic device may include a one-piece cover member formed from a single piece of material (instead of separate cover members 122 and 124 attached to housing member 110). Such a one-piece cover member may also be referred to as an integral cover member.

[0047] One or more of the cover components 132 and 134 may include or be formed of an ion-exchangeable material. For example, the ion-exchangeable material may be an ion-exchangeable glass, an ion-exchangeable glass-ceramic, or a combination thereof. Relative to Figures 2A to 2B Further descriptions of the ion-exchangeable materials provided are generally applicable to this document and will not be repeated here.

[0048] exist Figure 1A In the example, the electronic device includes a display 172 that is at least partially enclosed or surrounded by a housing 105. For example... Figure 1A As shown, cover 122 is positioned above display 172 and may define a window above display 172. Cover 122 may be coupled to the display. Cover 122 may also be integrated with or coupled to a touch sensor configured to detect or estimate the position of a touch portion along the outer surface of cover 122. The touch sensor may be associated with planar and / or non-planar areas of cover 122. For example, the touch sensor may include an array of capacitive electrodes located beneath cover 122, and in some cases, may be integrated with the display. In some cases, the display may also be at least partially enclosed or surrounded by housing component 110 (which may also be referred to as a housing).

[0049] Electronic devices may also include one or more forward and / or backward components, such as sensors, cameras, etc. Figure 1A In the example, device 100 includes a forward-facing optical component, and a cover 122 (and cover member 132) defines a window above this optical component. The optical component may be part of a sensor assembly, camera assembly, etc. Sensor assemblies, sensor arrays, and camera assemblies are referred to below and in relation to... Figure 13 A further detailed description is provided, and will not be repeated here. In another example, the display may be considered an optical component.

[0050] The housing member 110 may at least partially define a side surface 106 of the electronic device 100 and may include one or more metal members, one or more glass members, or one or more glass-ceramic members. Each of the glass members may be a differentially strengthened member as described herein. Figure 1A In the example, housing member 110 defines all four sides or continuous side surfaces 106 of electronic device 100. Figure 1B It shows Figure 1AA rear view of the electronic device. In some cases, the housing member 110 is formed of a series of metal segments (112a, 112b, 112c, and 112d) separated by dielectric segments (114a, 114b, 114c, and 114d) providing electrical isolation between adjacent metal segments. For example, a dielectric segment (114b) may be provided between a pair of adjacent metal segments (112a, 112c). One or more of the metal segments may be coupled to the internal circuitry of the electronic device 100 and may be used as antennas for transmitting and receiving wireless communications. The segments may be formed of aluminum alloys, titanium alloys, steel, magnesium alloys, or other suitable metallic materials. As used herein, metal-formed members or components may include non-metallic surface coatings, such as anodized layers. The dielectric segment may be formed of one or more dielectric materials such as polymers, glass, or ceramic materials. In another embodiment, housing member 110 may be positioned inside electronic device 100, and one or more of cover 122 or cover 124 may define all or most of the side surface 106 of electronic device.

[0051] Housing component 110 may define one or more openings or ports. Figure 1A and Figure 1B In the example, the metal segment 112c of the housing component 110 defines openings 116 and 117. Opening 116 allows (audio) input or output from device components such as a microphone or speaker. Opening 117 may contain an electrical port or connector. Furthermore, the electronic device 100 may include one or more input devices. Figure 1A and Figure 1B In the example, input devices 152 and 154 are in the form of buttons and extend through additional openings in housing component 110. In some cases, electronic device 100 also includes a support plate and / or other internal structural components for supporting internal electronic circuitry or electronic components.

[0052] In some cases, housing component 110 may include one or more components 115 positioned within a metallic component (e.g., 112a). In some cases, component 115 may provide a window for device component 185, define a portion of a waveguide, and / or allow beam forming or beam guiding functions. Component 115 may include a cover component 136, such as... Figure 1A As shown in the example. For example, component 115 may define an antenna window for transmitting and receiving wireless signals. Component 115 may be configured to transmit wireless signals at one or more of the frequencies previously discussed with respect to device components 181, 183, and 185. For example, component 115 may be configured to transmit wireless signals in a frequency band between about 25 GHz and about 39 GHz.

[0053] In an embodiment, electronic device 100 includes multiple sensing arrays. As mentioned herein, the sensing arrays may include one or more camera components (e.g., a camera array), one or more sensor components (e.g., a sensor array), illumination components, or combinations thereof. A front sensing array 118 includes a front-facing camera component 144 and a front-facing sensor component 146. The front sensing array may also include another sensor component 145, which may in some cases be an ambient light sensor. A rear sensing array 170 includes a rear-facing camera component array and at least one sensor component, as described in more detail below. Illumination components typically include light sources such as floodlights or other emitters capable of enabling various sensing modes such as facial recognition and digital photography. For example, one or more emitters may emit an array of light beams reflected from various parts of the face. These reflected light beams can be used to create a dot map or depth map of the face and for user authentication.

[0054] The sensing array may include one or more optical components, which may also be referred to herein as optical modules. Optical components may include one or more of the following: photodetectors and / or image sensors, associated electronics, one or more optical lenses, optical covers, lens barrels, shields, and associated optical elements. For example, optical components may be camera components, illumination components, or sensor components. The sensing array may define any number of optical components, such as one, two, three, four, five, or six optical components.

[0055] like Figure 1A and Figure 1B As shown, the electronic device 100 includes multiple camera assemblies. For example, the electronic device 100 may include a forward-facing camera assembly 144 and a rearward-facing camera array. Each camera assembly may include a camera component (e.g., Figure 1B The optical component 177 shown is an example. A camera assembly array (also referred to herein as a camera array) typically includes multiple camera components and one or more illumination components. When the camera array includes multiple camera components, each camera component may have a different field of view or other optical characteristics. For example, the camera components may be configured to generate images from visible or infrared light. Multiple camera components may also be referred to as a group of camera components, and in some cases may form a camera component array. In some cases, a camera component includes an optical sensor array and / or optical components such as lenses, filters, or windows. In other cases, a camera component includes an optical sensor array, optical components, and a camera housing surrounding the optical sensor array and the optical components. A camera component may also include a focusing assembly. For example, a focusing assembly may include an actuator for moving a lens of the camera component. In some cases, the optical sensor array may be a complementary metal-oxide-semiconductor (CMOS) array, etc.

[0056] Electronic device 100 may include one or more sensor components. For example... Figure 1A As shown, the electronic device 100 includes one or more forward sensor assemblies 146. The device 100 also includes, as relative to... Figure 1B One or more backward sensor components described in more detail. Sensor components may also be referred to simply as sensors herein. Examples of sensors (components) include, but are not limited to, proximity sensors, light sensors (e.g., ambient light sensors), biometric sensors (e.g., facial or fingerprint recognition sensors or health monitoring sensors), depth sensors, or imaging sensors. Other examples of sensors include microphones or similar audio sensing devices, radio frequency identification chips, touch sensors, force sensors, accelerometers, gyroscopes, magnetometers (such as Hall effect sensors or other magnetic sensors), or similar position / orientation sensing devices. When the sensor is an optical sensor, it may operate within a specific wavelength range, such as the visible light wavelength range, the infrared light wavelength range, or the ultraviolet light wavelength range. In some cases, optical sensors are reflective sensors. The electronic device may also include a processing unit (also called a processor) that calculates values ​​based on signals from the sensor.

[0057] In some cases, one or more sensors may be grouped with one or more camera components. For example, these sensors may be depth sensors (e.g., time-of-flight sensors), ambient light sensors, face recognition sensors, infrared sensors, ultraviolet light sensors, health monitoring sensors, biometric sensors (e.g., fingerprint sensors), etc. These sensors may be located close to one or more optical components of the camera array, such as... Figure 1B As shown. Relative to Figure 13 Further descriptions of the provided sensor components, camera components, and processors are generally applicable herein.

[0058] Furthermore, electronic device 100 may include one or more device components, such as device components 181, 183, and 185, which may be part of a wireless communication system. For example, the wireless communication system may be an RF or IR communication system. In some cases, device components 181, 183, and 185 are antenna transmitting modules that may include one or more antenna assemblies, and are also simply referred to herein as antennas. As previously discussed, components of an RF communication system may include an RF antenna configured to radiate radio frequency (RF) signals. This RF antenna may be configured to operate within one or more desired RF frequency ranges or RF bands. As an example, an RF communication system can operate within a frequency range, such as a "low-frequency band" (e.g., less than 1 GHz, such as about 400 MHz to less than 1 GHz, about 600 MHz to about 900 MHz, or 600 MHz to 700 MHz), a "mid-frequency band" (e.g., about 1 GHz to about 6 GHz, such as about 1 GHz to about 2.6 GHz, about 2 GHz to about 2.6 GHz, about 2.5 GHz to about 3.5 GHz, or about 3.5 GHz to about 1 GHz), or a "high-frequency band" (e.g., about 24 GHz to about 40 GHz, about 57 GHz to about 64 GHz, or about 64 GHz to about 71 GHz). Wireless communication protocols and standards may include established protocols and standards such as IEEE 802.11x, GSM, LTE, CDMA, TDMA, 3G, 4G, 5G, Bluetooth, Bluetooth Low Energy (BLE), ISO / IEC 18000-3, Wi-Fi, Radio Frequency Identification (RFID), Near Field Communication (NFC), Global Positioning System (GPS), or any other target wireless communication protocol or standard (including protocols and / or standards under development).

[0059] In some cases, electronic device 100 may include one or more antennas comprising elements configured to communicate via 5G wireless protocols, including millimeter wave and / or 6 GHz communication signals. 5G communication can be implemented using a variety of different communication protocols. For example, antenna elements may operate in the 24 GHz to 39 GHz band or the 60 GHz band (e.g., 57 GHz-64 GHz or 64 GHz-71 GHz). Furthermore, the specific frequency band of any given 5G implementation may differ from other implementations. For example, different wireless communication providers may use different bands in the millimeter wave spectrum (e.g., one provider may use approximately 28 GHz to implement a 5G communication network, while another provider may use approximately 39 GHz). The antenna array may be configured to allow communication via one or more frequency bands in the bands used to implement 5G communication.

[0060] In some cases, electronic device 100 includes one or more directional antennas (or high-gain antennas). Therefore, the antenna gain of the directional antenna may be highest along a specific direction. The directional antenna may include an array of transceiver elements used to form the shape and orientation of the antenna's radiation pattern (or lobes), and the antenna may be a millimeter-wave antenna. Electronic device 100 may include multiple directional antennas with different primary transmission directions.

[0061] For example, the sensing array 170 may include a plurality of camera assemblies. Each camera assembly may include optical components, such as optical component 177 or optical component 178. Optical component 177 may be at least partially located within an opening in portion 127. Optical component 177 may be a camera component, while optical component 178 may be an illumination component.

[0062] Furthermore, the sensing array 170 may include one or more sensor components, such as sensor component 179. In some embodiments, sensor component 179 may include one or more optical components. For example, the sensor component may include a transmitter component, a receiver component, or both. In some cases, sensor component 179 may measure the distance to a target, such as a lidar sensor component configured to illuminate an object with light and then detect the reflected light to determine or estimate the distance between an electronic device and an object (e.g., a time-of-flight (TOF) sensor). In some examples, sensor component 179 may be positioned below cover member 134 (and cover member 134 may act as a window to sensor component 179). In these examples, the optical characteristics of cover member 134 may be adapted for use with one or more optical components of the sensor component. For example, one or more optical components may operate within one or more specified wavelength ranges, and cover member 134 may be configured to have suitable transmittance / transmittance within these wavelength ranges. In other examples, cover member 134 may define an opening above the sensor component, and an additional cover member may be placed in or above the opening (and act as a window to the sensor component).

[0063] In addition to optical components, portion 127 may also include a sensor assembly 180. For example, the sensor assembly 180 may be a microphone, which may be at least partially located within or below an opening in portion 127. In specific embodiments where portion 127 is used to protect one or more sensor components, portion 127 and / or the protruding areas of portion 127 may be referred to as sensor features, camera features, sensor arrays, camera panels, and / or camera bumps.

[0064] Electronic device 100 may include one or more of the following: processing unit, control circuitry, memory, input / output device, power supply (e.g., battery), charging assembly (e.g., wireless charging assembly), network communication interface, accessories, and sensors. Figure 1B In the example, the back cover assembly 124 is positioned above the device component 182, which can provide wireless charging functionality. (The following is in contrast to...) Figure 13 The components of the sample electronic device are discussed in more detail, and relative to... Figure 13 The descriptions provided are generally applicable to this article.

[0065] Figure 2A An example of an enlarged top view of an electronic device is shown, and it can be shown... Figure 1A Example of detailed area 1-1. Figure 2A In the example, electronic device 200 includes an optical component 273 positioned under a cover 222 and indicated by a dashed line. The cover 222 includes a cover member 232, and a portion 242 of the cover member 232 defines a window for the optical component 273. The portion 242 of the cover member may therefore be referred to as the window portion. The optical component 273 may be an optical component of a camera assembly, sensor assembly, etc.

[0066] Figure 2A The enlarged view shows two chemically strengthened regions 252 and 254. The boundary of region 252 is shown by dashed lines. Chemically strengthened region 252 is surrounded by chemically strengthened region 254. Figure 2A In one example, the chemically reinforced region 252 includes a window portion 242 and extends beyond the window portion 242 at the outer surface of the cover member 232. In another example, the location of the chemically reinforced region 252 may substantially correspond to the location of the window portion 242. Figure 2A The chemically reinforced zone 252 shown is approximately circular on the outer surface of the cover member 232. Figure 2A The shape of the chemically reinforced region 252 shown is exemplary and not limiting, and the chemically reinforced region may be defined at its outer surface as circular, elliptical, including multiple convex corners, or another suitable shape suitable for covering optical components.

[0067] exist Figure 2A In the example, chemically reinforced region 252 is chemically reinforced to a different degree than chemically reinforced region 254. For example, chemically reinforced region 252 can be chemically reinforced to a greater degree than chemically reinforced region 254, and can be configured to protect window portion 242 from cracking in the event of damage to the cover member.

[0068] For example, a chemically strengthened region 252, to a greater extent, may have a greater compression depth, a greater maximum compressive stress, and / or a greater surface compressive stress than a chemically strengthened region 254. In some cases, the chemically strengthened region 252 is in a compressed state over the thickness of the cap member and defines a compressive stress distribution extending through that thickness, while the chemically strengthened region 254 includes an internal region in a tensile state and defines a stress distribution comprising both compressive stress regions and tensile stress regions, such as... Figure 7 The cross-sectional view is schematically shown. In an embodiment, the maximum compressive stress in chemically strengthened region 252 is greater than the maximum compressive stress in chemically strengthened region 254. For example, the maximum compressive surface stress in chemically strengthened region 252 may be greater than the maximum compressive surface stress in chemically strengthened region 254. For example, the maximum compressive surface stress in chemically strengthened region 252 may be at least 5% or at least 10% greater than the maximum compressive surface stress in chemically strengthened region 254. Each of chemically strengthened regions 252 and 254 may be chemically strengthened by ion exchange, as described below and also relative to at least Figures 9 to 12D To describe in more detail.

[0069] Figure 2B It shows Figure 2A A partial cross-sectional view of the device. Device 200 includes a housing 205, and housing 205 includes a front cover 222, a rear cover 224, and a housing component 210. Front cover 222 includes a cover member 232, and rear cover 224 includes a cover member 234. Housing 205 defines an interior cavity 201, and electronic device 200 also includes a display 272 and optical components 273. Device 200 may also include additional components 280 positioned within the interior cavity, as indicated by dashed lines.

[0070] exist Figure 2B In this example, cover member 232 is positioned above both display 272 and optical component 273. Cover member 232 includes chemically reinforced regions 252 and 254. As previously stated relative to... Figure 2A The chemically strengthened region 252 is chemically strengthened to a different degree than the chemically strengthened region 254. Relative to at least Figures 7 to 8B Further descriptions of the different chemically strengthened regions are provided and will not be repeated here. Suitable materials for differentially strengthened cap members are described below, and this description generally applies to this document.

[0071] A chemically reinforced region 252, positioned above optical component 273, extends through the thickness of cover member 232. The boundary of chemically reinforced region 252 is shown in dashed lines. The depiction of the boundary of chemically reinforced region 252 is exemplary and not limiting, and in other examples, the boundary may be curved rather than straight. Chemically reinforced region 252 is surrounded by chemically reinforced region 254. As previously stated relative to... Figure 2A As shown and described, the chemically enhanced region 252 includes a window portion 242, which, for clarity, is located in... Figure 2B Not shown in the image.

[0072] Cover member 232 defines an outer surface 247 and an inner surface 246. In some cases, cover 222 includes a coating 262 along a portion of the inner surface 246, which may be an opaque coating. Coating 262 can be used to mask or obscure internal components of the electronic device to make them invisible. Cover 224 may also include a coating, such as coating 264, along its inner surface. Coating 264 can be used to make internal components of the electronic device invisible and may also provide color or other decorative effects to the electronic device.

[0073] In some cases, the cover member 232 is formed of a glass material and may therefore be referred to as a glass cover member. Typically, the glass cover member is formed of a silica-based glass material. The glass material may have a network structure, such as a silicate-based network structure. As mentioned herein, a “glass cover member” may contain relatively small amounts of impurities or crystalline material, such as 1% or less, 2% or less, or 5% or less by weight of the member. In some embodiments, the glass material comprises aluminosilicate glass. As used herein, aluminosilicate glass includes the elements aluminum, silicon, and oxygen, but may also include other elements. In some embodiments, the glass material comprises a crystallizable glass material.

[0074] In embodiments, the glass material includes ion-exchangeable glass materials, such as alkali metal aluminosilicate glasses (e.g., lithium aluminosilicate glasses). Ion-exchangeable aluminosilicate glasses may contain monovalent or divalent ions that compensate for the charge resulting from the substitution of silicon ions by aluminum ions. Suitable monovalent ions include, but are not limited to, alkali metal ions, such as Li... + Na + Or K + Suitable divalent ions include alkaline earth ions, such as Ca2+. 2+ or Mg 2+ In some implementations, the glass material includes a crystallizable glass material.

[0075] In some cases, during ion exchange, smaller ions in the glass material exchange with larger ions. For example, if the glass material contains sodium ions, these sodium ions can exchange with potassium ions. Similarly, if the glass material contains lithium ions, these lithium ions can be exchanged for sodium ions and / or potassium ions. (As opposed to...) Figure 11 and Figures 12A to 12C To explain in more detail, in some cases, the process of manufacturing the cover component may include the operation of exchanging larger ions in the glass material with smaller ions, followed by the operation of exchanging smaller ions in the glass material with larger ions. The ion exchange operation can occur at temperatures below the strain point of the glass material.

[0076] In other cases, the cover member 232 may be formed of a glass-ceramic material and may be referred to as a glass-ceramic cover member. As mentioned herein, the glass-ceramic material includes one or more crystalline phases (e.g., crystals) formed through the crystallization of a (precursor) glass material. These crystalline phases may contribute to the advantageous mechanical properties of the glass-ceramic material.

[0077] By way of example, glass-ceramic materials can be basic silicates, alkaline earth silicates, aluminosilicates, borosilicates, perovskite glass-ceramics, silica-phosphates, iron silicates, fluorosilicates, phosphates, or glass-ceramic materials from another glass-ceramic composition system. In some embodiments, the glass-ceramic material includes aluminosilicate glass-ceramics or borosilicate glass-ceramics. In addition to the main elements of the glass-ceramic material (e.g., aluminum, silicon, and oxygen for aluminosilicates), the glass-ceramic material may also include other elements. For example, the glass-ceramic material (and the precursor glass) may include elements from the nucleating agent of the glass-ceramic material, such as metal oxides (Ti, Zr) or other suitable oxide materials. Aluminosilicate and borosilicate glass-ceramics may also include monovalent or divalent ions, some of which may compensate for the charge generated due to the introduction of aluminum ions into the material. For example, aluminosilicate glass-ceramics may include alkali metal ions, such as Li… + Or Na + .

[0078] Glass-ceramic materials can form a variety of crystalline phases, and can be used in capping components comprising one or more crystalline phases as described herein. For example, aluminosilicate glasses can form several types of crystalline phases, including β-quartz solid solution crystals, hydrothermal quartz solid solution crystals (β-spodumene solid solution crystals), lithiofeldspar crystals, lithium disilicate crystals, and various other silicates. Other silicates include, but are not limited to, silicates comprising aluminum and optionally other elements such as lithium, sodium, potassium, etc. Examples of such silicates include lithium orthoclase, lithium orthosilicate, (Li, Al, Na) orthosilicate (e.g., α or β lithium octanoate), and lithium metasilicate. Some of these crystalline phases can transform into other crystalline phases. For example, β-quartz solid solution crystals can transform into hydrothermal quartz / β-spodumene crystals. Similarly, mixtures of crystalline phases can be transformed into different mixtures.

[0079] In this embodiment, the glass-ceramic cap component can be chemically strengthened via ion exchange. For example, ion-exchangeable glass or glass-ceramic materials may include monovalent or divalent ions, such as alkali metal ions (e.g., Li). + Na + or K +) or alkaline earth ions (e.g., Ca) 2+ or Mg 2+ The alkali metal ions or alkaline earth ions can exchange with other alkali metal ions or alkaline earth ions. If the glass-ceramic material includes sodium ions, the sodium ions can be exchanged for potassium ions. Similarly, if the glass-ceramic material includes lithium ions, the lithium ions can be exchanged for sodium ions and / or potassium ions. This ion exchange can occur in the glass phase, the crystalline phase, or both. The exchange of smaller ions with larger ions in the glass-ceramic material can form a compressive stress layer along the surface of the glass-ceramic material. The formation of this compressive stress layer can increase the hardness and impact resistance of the glass-ceramic material.

[0080] Figure 3A Another example of an enlarged top view of an electronic device is shown, and it can be shown Figure 1A Another example of detailed area 1-1. Figure 3A In the example, electronic device 300 includes an optical component 373 positioned under a cover 322 and indicated by a dashed line. The cover 322 includes a cover member 332, and a portion 342 of the cover member 332 defines a window for the optical component 373. The portion 342 of the cover member may therefore be referred to as the window portion. The optical component 373 may be an optical component of a camera assembly, sensor assembly, etc.

[0081] Figure 3A The enlarged view shows the three chemically reinforced regions 352, 354, and 356 of the cover member 332. Figure 3A In the example, chemically enhanced region 356 includes window portion 342, and chemically enhanced region 352 surrounds window portion 342. The boundary of chemically enhanced region 352 is shown with dashed lines. Chemically enhanced region 352 is surrounded by chemically enhanced region 354, and chemically enhanced region 352 surrounds chemically enhanced region 356. Furthermore, chemically enhanced region 352 is adjacent to each of chemically enhanced regions 354 and 356.

[0082] exist Figure 3A In the example, chemically strengthened region 352 is chemically strengthened to a different degree than chemically strengthened regions 354 and 356. For example, chemically strengthened region 352 can be chemically strengthened to a greater degree than chemically strengthened regions 354 and 356, and can be configured to deflect cracks away from window portion 342.

[0083] For example, a chemically strengthened region 352, to a greater extent, may have a greater compression depth, a greater maximum compressive stress, and / or a greater maximum surface compressive stress than chemically strengthened regions 354 and 356. In some cases, each of the chemically strengthened regions 354 and 356 includes an internal region under tension and defines a stress distribution that includes both compressive stress regions and tensile stress regions, such as... Figure 7The cross-sectional view is schematically shown. In some cases, the chemically strengthened region 352 is in a compressed state across the thickness of the cover member and defines a compressive stress distribution extending through that thickness. In other cases, the chemically strengthened region 352 defines a stress distribution that includes both compressive stress regions and tensile stress regions. However, the compressive stress region extending from the outer surface of the cover member in the chemically strengthened region 352 may be deeper than the compressive stress regions extending from the outer surface of the cover member in the chemically strengthened regions 354 and / or 356. Alternatively or additionally, the compressive stress region extending from the inner surface of the cover member in the chemically strengthened region 352 may be deeper than the compressive stress regions extending from the inner surface of the cover member in the chemically strengthened regions 354 and / or 356. For example, the depth of one or more compressive stress regions in the chemically strengthened region 352 may be at least 50%, 75%, 100%, 150%, or 200% greater than the depth of the corresponding compressive stress regions in the chemically strengthened regions 354 and / or 356. In some examples, the stress distribution of the chemically strengthened region 352 may be referred to as the first compressive stress distribution or the barrier stress distribution, and the stress distribution of the chemically strengthened region 356 may be referred to as the second compressive stress distribution or the window stress distribution.

[0084] In these cases, the maximum compressive surface stress of the chemically strengthened region 352 may be greater than the maximum compressive surface stress of the chemically strengthened regions 354 and 356. For example, the maximum compressive surface stress of the chemically strengthened region 352 may be at least 5% or at least 10% greater than the maximum compressive surface stress of the chemically strengthened regions 354 and 356. The chemically strengthened regions 354 and 356 may be strengthened similarly or differently. Each of the chemically strengthened regions 352, 354, and 356 may be chemically strengthened by ion exchange, as previously described and also relative to at least Figures 9 to 12D As stated above.

[0085] Figure 3B It shows Figure 3A A partial cross-sectional view of the device. Device 300 includes a housing 305, and housing 305 includes a front cover 322, a rear cover 324, and a housing member 310. Front cover 322 includes a cover member 332, and rear cover 324 includes a cover member 334. Housing 305 defines an inner cavity 301, and electronic device 300 also includes a display 372 and optical components 373. Device 300 may also include additional components 380 positioned within the inner cavity, as indicated by dashed lines. Cover member 332 defines an outer surface 347 and an inner surface 346. Figure 3B As shown, cover 324 includes a coating 364 along its inner surface, which may be similar in function and properties to coating 264.

[0086] exist Figure 3BIn the example, the cover member 332 includes chemically reinforced regions 352, 354, and 356. As previously stated relative to... Figure 3A The chemically strengthened region 352 is chemically strengthened to a different degree than chemically strengthened regions 354 and 356. Relative to... Figures 7 to 8B Further descriptions of the different chemically enhanced regions are provided and will not be repeated here.

[0087] Cover member 332 is positioned above both display 372 and optical component 373. Cover member 332 includes a chemically reinforced region 356 positioned above optical component 373 and extending through the thickness of cover member 332. Cover member 332 also includes a chemically reinforced region 352 surrounding chemically reinforced region 356 and extending through the thickness of cover member. The boundary of chemically reinforced region 352 is shown in dashed lines. The depiction of the boundary of chemically reinforced region 352 is exemplary and not limiting, and in other examples, the boundary may be curved rather than straight. Chemically reinforced region 352 is surrounded by chemically reinforced region 354. As previously stated relative to... Figure 3A As shown and described, the chemically enhanced region 356 includes a window portion 342, which, for clarity, is located in... Figure 3B Not shown in the image.

[0088] Figure 4 Another example of an enlarged top view of an electronic device is shown, and it can be shown Figure 1A Another example of detailed area 1-1. Figure 4 In the example, electronic device 400 includes an optical component 473 positioned under a cover 422 and indicated by a dashed line. The cover 422 includes a cover member 432, and a portion 442 of the cover member 432 defines a window for the optical component 473. Therefore, the portion 442 of the cover member can be referred to as the window portion. The optical component 473 can be an optical component of a camera assembly, sensor assembly, etc.

[0089] Figure 4 The enlarged view shows the barrier portion set 448 of the cover member 432. The boundary of each barrier portion in the barrier portion 448 is shown with dashed lines. Figure 4 In this configuration, the group of barrier portions 448 is arranged at least partially around the window portion 442 of the cover member. The group of barrier portions 448 can also be described as at least partially surrounding the window portion 442. Figure 4 In the example, each barrier portion 448 in this group of barrier portions is spaced apart from the adjacent barrier portion 448.

[0090] Each barrier portion 448 includes a chemically reinforced region 452, which may also be referred to herein as a local chemically reinforced region or simply a region. This group of chemically reinforced regions 452 is surrounded by chemically reinforced regions 454. This group of chemically reinforced regions 452 can also be described as defining “islands” having a greater degree of chemical reinforcement than adjacent regions 454. In an embodiment, adjacent chemically reinforced regions 452 are spaced apart from each other.

[0091] exist Figure 4 In the example, each chemically strengthened region in chemically strengthened region 452 is chemically strengthened to a different degree than chemically strengthened region 454. For example, each chemically strengthened region in chemically strengthened region 452 may be chemically strengthened to a greater degree than chemically strengthened region 454 and may be positioned to help deflect the crack away from window portion 442.

[0092] For example, each chemically strengthened region 452 may have a greater compression depth, a greater maximum compressive stress, and / or a greater surface compressive stress than chemically strengthened region 454. Chemically strengthened region 454 may include an internal region in a tensile state and defines a stress distribution that includes both compressive stress regions and tensile stress regions, such as... Figure 7 The cross-sectional view is schematically shown. In some cases, one or more chemically strengthened regions 452 are in a compressed state across the thickness of the cover member and define a compressive stress distribution extending through that thickness. In other cases, one or more chemically strengthened regions 452 define a stress distribution including both compressive stress regions and tensile stress regions. However, the compressive stress region extending from the outer surface of the cover member in chemically strengthened region 452 may be deeper than the compressive stress region extending from the outer surface of the cover member in chemically strengthened region 454. Alternatively or additionally, the compressive stress region extending from the inner surface of the cover member in chemically strengthened region 452 may be deeper than the compressive stress region extending from the inner surface of the cover member in chemically strengthened region 454. For example, the depth of one or more compressive stress regions in chemically strengthened region 452 may be at least 50%, 75%, 100%, 150%, or 200% greater than the depth of the corresponding compressive stress region in chemically strengthened region 454. In some examples, the stress distribution of each chemically strengthened region in the chemically strengthened region 452 may be referred to as the first compressive stress distribution or the barrier stress distribution, and the stress distribution of the chemically strengthened region 442 may be referred to as the second compressive stress distribution or the window stress distribution.

[0093] In these cases, the maximum compressive surface stress of the chemically strengthened region 452 may be greater than the maximum compressive surface stress of the chemically strengthened region 454. For example, the maximum compressive surface stress of the chemically strengthened region 452 may be at least 5% or at least 10% greater than the maximum compressive surface stress of the chemically strengthened region 454. Each of the chemically strengthened regions 452 and 454 may be chemically strengthened by ion exchange, as previously described and also relative to at least Figures 9 to 12D As stated above.

[0094] Figure 5A Another example of an enlarged top view of electronic device 500 is shown and can be illustrated. Figure 1B Example of detailed area 2-2. Cover 522 includes cover member 532 defining corner portion 544. Figure 5A The enlarged view shows the barrier portion 548 of the cover member 532. The boundary of the barrier portion 548 is shown by dashed lines. Figure 5A In this configuration, the barrier portion 548 is positioned near the corner portion 544 of the cover member. In some cases, the cover member may define multiple corner portions, and the barrier portion may be positioned near each of the multiple corner portions. These barrier portions may be configured to protect the window portion of the cover member positioned above the display. In some embodiments, the cover member 532 defines four corner portions 544.

[0095] The barrier portion 548 includes a chemically reinforced region 552, which may also be referred to herein as a local chemically reinforced region or simply the region. The chemically reinforced region 552 is at least partially surrounded by a chemically reinforced region 554.

[0096] exist Figure 5A In the example, chemically strengthened region 552 is chemically strengthened to a different degree than chemically strengthened region 554. In some cases, chemically strengthened region 552 has a greater degree of chemical strengthening than chemically strengthened region 554 and is positioned to help deflect cracks away from another area of ​​the cover member to be protected. For example, when chemically strengthened region 552 is positioned near corner portion 554, chemically strengthened region 552 can help prevent cracks originating from damage to the corner portion of the cover glass from propagating towards a more central portion of the cover member.

[0097] For example, chemically strengthened region 552 may have a greater compression depth, a greater maximum compressive stress, and / or a greater surface compressive stress than chemically strengthened region 554. Chemically strengthened region 554 may include an internal region in a tensile state and defines a stress distribution that includes both compressive stress regions and tensile stress regions, such as... Figure 7The cross-sectional view is schematically shown. In some cases, one or more chemically strengthened regions 552 are in a compressed state across the thickness of the cover member and define a compressive stress distribution extending through that thickness. In other cases, one or more chemically strengthened regions 552 define a stress distribution including an internal region comprising both compressive stress regions and tensile stress regions. However, the compressive stress region extending from the outer surface of the cover member in chemically strengthened region 552 may be deeper than the compressive stress region extending from the outer surface of the cover member in chemically strengthened region 554. Alternatively or additionally, the compressive stress region extending from the inner surface of the cover member in chemically strengthened region 552 may be deeper than the compressive stress region extending from the inner surface of the cover member in chemically strengthened region 554. For example, the depth of one or more compressive stress regions in chemically strengthened region 552 may be at least 50%, 75%, 100%, 150%, or 200% greater than the depth of the corresponding compressive stress region in chemically strengthened region 554. In some examples, the stress distribution in the chemically reinforced region 552 may be referred to as the barrier stress distribution.

[0098] In these cases, the maximum compressive surface stress of the chemically strengthened region 552 may be greater than the maximum compressive surface stress of the chemically strengthened region 554. For example, the maximum compressive surface stress of the chemically strengthened region 552 may be at least 5% or at least 10% greater than the maximum compressive surface stress of the chemically strengthened region 554. Each of the chemically strengthened regions 552 and 554 may be chemically strengthened by ion exchange, as previously described and also relative to at least Figures 9 to 12D As stated above.

[0099] Figure 5B Another example of an enlarged top view of electronic device 501 is shown and can be illustrated. Figure 1B Another example of detail area 2-2. Cover 523 includes cover member 533 defining corner portions 545. In some embodiments, cover member 533 defines four corner portions 545.

[0100] Figure 5B The enlarged view shows the barrier portion set 549 of the cover member 532. The boundary of each barrier portion in the barrier portion 549 is shown with dashed lines. Figure 5B In this arrangement, the barrier portion 549 is positioned near the corner portion 545 of the cover member 533. For example... Figure 5B As shown, the corner portion 545 defines a curved profile, and the barrier portion 549 is offset inward from the curved profile. In some cases, only a subset of the barrier portion is offset from the curved profile at the edge of the cover member. Figure 5BFour barrier portions 549 are shown arranged near the corner portions, but this example is not limiting, and in other examples, two, three, five, six or more barrier portions 549 may be arranged near the corner portions 545. In some cases, the cover member may define multiple corner portions, and the barrier portions may be positioned near each of the multiple corner portions.

[0101] Each barrier portion 549 includes a chemically reinforced region 553, which may also be referred to herein as a local chemically reinforced region or simply a region. This group of chemically reinforced regions 553 is surrounded by chemically reinforced regions 555.

[0102] exist Figure 5B In the example, each of the chemically strengthened regions 553 is chemically strengthened to a different degree than chemically strengthened region 555. In some cases, one or more chemically strengthened regions 553 have a greater degree of chemical strengthening than chemically strengthened region 555 and are positioned to help deflect cracks away from another area to be protected on the cover member. For example, when the group of chemically strengthened regions 553 is positioned near the corner portion 545 of the cover glass, the group of chemically strengthened regions 553 may help deflect cracks originating from damage to the corner portion of the cover glass. In some cases, the group of chemically strengthened regions 553 is configured to protect the window portion of the cover member positioned above the display.

[0103] For example, each chemically strengthened region 553 may have a greater compression depth and / or a greater surface compressive stress than chemically strengthened region 555. Chemically strengthened region 555 may include an internal region in a tensile state and defines a stress distribution that includes both compressive stress regions and tensile stress regions, such as... Figure 7The cross-sectional view is schematically shown. In some cases, one or more chemically strengthened regions 553 are in a compressed state across the thickness of the cover member and define a compressive stress distribution extending through that thickness. In other cases, one or more chemically strengthened regions 553 define a stress distribution that includes both compressive stress regions and tensile stress regions. However, the compressive stress region extending from the outer surface of the cover member in chemically strengthened region 553 may be deeper than the compressive stress region extending from the outer surface of the cover member in chemically strengthened region 555. Alternatively or additionally, the compressive stress region extending from the inner surface of the cover member in chemically strengthened region 553 may be deeper than the compressive stress region extending from the inner surface of the cover member in chemically strengthened region 555. For example, the depth of one or more compressive stress regions in chemically strengthened region 553 may be at least 50%, 75%, 100%, 150%, or 200% greater than the depth of the corresponding compressive stress region in chemically strengthened region 555. In some examples, the stress distribution of each chemically strengthened region in chemically strengthened region 553 may be referred to as the barrier stress distribution.

[0104] In these cases, the maximum compressive surface stress of one or more of the chemically strengthened regions 553 may be greater than the maximum compressive surface stress of the chemically strengthened region 555. For example, the maximum compressive surface stress of the chemically strengthened region 553 may be at least 5% or at least 10% greater than the maximum compressive surface stress of the chemically strengthened region 555. Each of the chemically strengthened regions 553 and 555 may be chemically strengthened by ion exchange, as previously described and also relative to at least Figures 9 to 12D As stated above.

[0105] Figure 6A The cover component of the electronic device is shown. Figure 6A In this configuration, cover member 632a is positioned to show the inner surface 646 of the cover member. The cover member defines a central portion 642a, a peripheral portion 644, and a transition portion 643 between the central portion and the peripheral portion. In some cases, the transition portion 643 defines a bend in the cover member.

[0106] Figure 6A The barrier portion 648 of the cover member 632a is shown. The boundary of the barrier portion 648 is shown with dashed lines. Figure 6A In the middle, the barrier portion 648 is positioned near the transition portion 643 and the corner 635a of the cover member. Figure 6AIn the example, transition portion 643 defines a bend in the cover member. In some cases, the cover member may include multiple barrier portions positioned near the transition portion at multiple corners and / or sidewalls of the cover member. Cover member 632a has barrier portions 648 positioned near each of the corners 635a. These barrier portions may be configured to protect the window portion of the cover member positioned above the display.

[0107] Each barrier portion 648 includes a chemically reinforced region 652, which may also be referred to herein as a local chemically reinforced region or simply a region. The chemically reinforced region 652 is at least partially surrounded by a chemically reinforced region 654.

[0108] exist Figure 6A In the example, chemically reinforced region 652 is chemically reinforced to a different degree than chemically reinforced region 654. In some cases, chemically reinforced region 652 has a greater degree of chemical reinforcement than chemically reinforced region 654 and can be positioned to protect a portion of the cover member from cracking. For example, when chemically reinforced region 652 is positioned in or near transition portion 643 of the cover member, chemically reinforced region 652 can help prevent transition portion 643 of the cover member from cracking. Since the transition area is likely to be most likely to be subjected to direct impact, positioning chemically reinforced region 652 close to the transition portion can increase the strength of the cover member by preventing cracks at the point of impact. Positioning chemically reinforced region 652 close to the transition portion can help prevent cracks in the peripheral portion from traveling to the central portion. In some cases, chemically reinforced region 652 is configured to protect the window portion of the cover member located above the display.

[0109] For example, chemically strengthened region 652 may have a greater compression depth and / or a greater surface compressive stress than chemically strengthened region 654. In some cases, chemically strengthened region 652 is in a compressed state across the thickness of the cap member and defines a compressive stress distribution extending through that thickness. In these cases, chemically strengthened region 654 may include an internal region in a tensile state and define a stress distribution comprising both compressive stress regions and tensile stress regions, such as... Figure 7 The cross-sectional view is schematically shown. In these cases, the maximum compressive surface stress of the chemically strengthened region 652 may be greater than the maximum compressive surface stress of the chemically strengthened region 654. For example, the maximum compressive surface stress of the chemically strengthened region 652 may be at least 5% or at least 10% greater than the maximum compressive surface stress of the chemically strengthened region 654. More generally, the chemically strengthened region 652 may be similar to that relative to... Figure 5A The chemically enhanced region 552, and the chemically enhanced region 654, can be similar to the one described above. Figure 5A The chemically enhanced region 554. Each of the chemically enhanced regions 652 and 654 can be chemically enhanced by ion exchange, as previously described and also relative to at least Figures 9 to 12D As stated above.

[0110] Figure 6B Another example of a cover member 633b for an electronic device is shown. The cover member 633b defines a central portion 642b and a peripheral portion 645b. The peripheral portion 645b defines a corner 635b and a side 636b.

[0111] exist Figure 6B In the example, the barrier portion 649b is located within the peripheral portion 645b and near the corner 635b and the side 636b. Figure 6B In the example, each barrier portion 649b in this group of barrier portions is spaced apart from the adjacent barrier portion 649b. In some examples, the barrier portions 649b are spaced substantially evenly along the side surface 636b of the cover member. For example, the center-to-center spacing of the barrier portions 649b may be substantially uniform. However, this example is not limiting, and the spacing of the barrier portions 649b can be adjusted as needed. In some cases, the center-to-center spacing of the barrier portions 649b near the corner 635b may be substantially the same as the center-to-center spacing near the side surface 636b, while in other cases, the center-to-center spacing of the barrier portions 649b near the corner 635b may be different (e.g., reduced). Figure 6B In one example, the diameter of the barrier portion 649b is substantially uniform, but in another example, the size of the barrier portion 649b can be adjusted as needed.

[0112] Each barrier portion 649b includes a chemically reinforced region 653b, which may also be referred to herein as a local chemically reinforced region or simply a region. This group of chemically reinforced regions 653b is surrounded by chemically reinforced regions 655b. The chemically reinforced region 653b can be analogous to... Figure 5B The chemically enhanced region 553, and the chemically enhanced region 655b, can be similar to the chemically enhanced region 655b relative to the chemically enhanced region 553. Figure 5B The chemically enhanced region 555 is described above, and for the sake of brevity, this description will not be repeated here.

[0113] Figure 6C Another example of a cover member 633c for an electronic device is shown. The cover member 633c defines a central portion 642c and a peripheral portion 645c. The peripheral portion 645c defines a corner 635c and a side 636c.

[0114] exist Figure 6C In the example, barrier portion 649c is arranged in a pattern defining the center portion 642c. Some barrier portions within barrier portion 649c are also positioned near corner 635c and side 636c. Figure 6CIn the example, each barrier portion 649c in this group of barrier portions is spaced apart from the adjacent barrier portion 649c. In some examples, the barrier portions 649c are spaced substantially evenly and define a substantially uniform center-to-center spacing. However, this example is not limiting, and the spacing of the barrier portions 649c can be adjusted as needed. Figure 6C In one example, the diameter of the barrier portion 649c is substantially uniform, but in another example, the size of the barrier portion 649c can be adjusted as needed.

[0115] Each barrier portion 649c includes a chemically reinforced region 653c, which may also be referred to herein as a local chemically reinforced region or simply a region. This group of chemically reinforced regions 653c is surrounded by chemically reinforced regions 655c. The chemically reinforced region 653c can be analogous to... Figure 5B The chemically enhanced region 553, and the chemically enhanced region 655c, can be similar to the chemically enhanced region 655c relative to the chemically enhanced region 553. Figure 5B The chemically enhanced region 555 is described above, and for the sake of brevity, this description will not be repeated here.

[0116] Figure 7 A partial cross-sectional view of the cover member 732 is shown. For example, Figure 7 It can be passed through Figure 3A and Figure 3B An example of the cross-section of the chemically reinforced region 352. The cover member 732 includes chemically reinforced regions 752, 754, and 756.

[0117] exist Figure 7 In the example, chemically strengthened region 752 is chemically strengthened to a greater extent than chemically strengthened regions 754 and 756. As previously stated, chemically strengthened region 752 may have greater crack resistance than chemically strengthened regions 754 and 756 and may be used to protect one or more portions of the cap. Figure 7 In the image, shading is used to indicate compression areas (also known as compressive stress areas).

[0118] exist Figure 7 In the example, the chemically reinforced region 752 is under compression over the thickness of the cap member 732 and defines a compressive stress region. The chemically reinforced region 754 includes a compressive stress region 784a along the outer surface 747, a compressive stress region 784b along the inner surface 746, and a tensile stress region 794 between the compressive stress regions 784a and 784b. The chemically reinforced region 756 includes a compressive stress region 786a along the outer surface 747, a compressive stress region 786b along the inner surface 746, and a tensile stress region 796 between the compressive stress regions 786a and 786b. Figure 7As shown, the compressive stress region 784a is similar in depth to the compressive stress region 784b, and the compressive stress region 786a is similar in depth to the compressive stress region 786b.

[0119] Figure 8A The stress distribution extending through the thickness of the cover member is shown. For example, Figure 8A It can be shown along Figure 7 An example of the stress distribution of line DD in the chemically reinforced region 752. Figure 8A The vertical solid lines in the diagram indicate the surface of the cover member, and the distance between the vertical solid lines corresponds to the thickness of the cover member.

[0120] Stress distribution 802 indicates that the cover member is under compression along its thickness, and therefore stress distribution 802 can be referred to as compressive stress distribution. For example... Figure 8A As shown, stress distribution 802 has surface compressive stress CS at the surface of the cover member. D Furthermore, it exhibits relatively low compressive stress at the midpoint of the cover member's thickness. Figure 8A In the example, the stress distribution 802 is substantially symmetrical about the midpoint of the thickness of the cover member.

[0121] Figure 8B Another stress distribution extending through the thickness of the cover member is shown. For example, Figure 8B It can be shown along Figure 7 An example of the stress distribution of the line EE in the chemically reinforced region 754. Figure 8B The vertical solid lines in the diagram indicate the surface of the cover member, and the distance between the vertical solid lines corresponds to the thickness of the cover member.

[0122] like Figure 8B As shown, the stress distribution 804 includes compressive stress regions 884a and 884b, and a tensile stress region 894. Compressive stress region 884a may correspond to compressive stress region 784a, compressive stress region 884b may correspond to compressive stress region 784b, and tensile stress region 894 may correspond to tensile stress region 794. The stress distribution 804 has a stress value less than CS at the surface of the cover member. D Surface compressive stress CS E And central tension CT. In Figure 8B In the example, the stress distribution 804 is substantially symmetrical about the midpoint of the thickness of the cover member.

[0123] In other cases, a chemically strengthened zone with a greater degree of chemical reinforcement can be configured to have a deeper compressive stress region than the adjacent chemically strengthened zone, but with a lower central tension. Such a chemically strengthened zone may also have greater crack resistance than the adjacent chemically strengthened zone.

[0124] The differentially strengthened capping member described herein can be chemically strengthened using one or more ion exchange operations. In some embodiments, the ion exchange operation exchanges smaller ions in the capping member with larger ions from a molten salt bath or other external ion source to introduce compressive stress into the capping member. In other embodiments, the ion exchange operation exchanges larger ions in the capping member with smaller ions from a molten salt bath or other external ion source to introduce tensile stress into the capping member. The composition of the capping member prior to any ion exchange operation is referred herein to as the natural composition of the capping member, such as a natural glass composition or a natural glass-ceramic composition. The ion exchange operation can be performed using a bath or other ion source containing one or more ions to be exchanged with the ions in the capping member. Other types of ion sources include pastes that may contain a higher concentration of the ion source to be introduced into the capping member than the ion exchange bath. As an example, the ion source may include one or more of lithium, sodium, and potassium ions. The ion exchange operation is typically performed at a temperature above ambient temperature.

[0125] In some embodiments, a method for differentially strengthening a cap member includes applying a mask to the cap member prior to performing an ion exchange operation. Typically, the mask exposes one or more regions of the cap member while covering other regions. The mask is configured to reduce the ion exchange rate through the mask compared to the ion exchange rate at the exposed regions of the cap member. The mask may be formed from a patterned coating of a metal, oxide material (e.g., silicon oxide), or nitride material (e.g., silicon nitride).

[0126] In some implementations, the mask exposes the area of ​​the glass to be chemically strengthened to a greater extent. Figure 9 A partial cross-sectional view of the mask 962 applied to the cover member 932 is shown. Figure 9 In the example, mask 962 exposes a portion of the outer and inner surfaces (947, 946) of the cover component. Figure 9 In the example, mask 962 is applied to both the outer surface 947 and the inner surface 946.

[0127] exist Figure 9In the example, a greater degree of ion exchange will occur in the chemically strengthened region 952 than in the adjacent masked region 954. In an embodiment, smaller ions in the cap member exchange with larger ions to produce chemical strengthening of the cap. In some cases, a first ion exchange operation is performed such that larger ions introduced from both the outer surface 947 and the inner surface 946 diffuse to the midpoint (thickness) of the cap member in the chemically strengthened region 952. Therefore, the concentration of larger ions at the midpoint of the cap member in the chemically strengthened region 952 can be greater than the concentration present in natural glass. For example, if the first ion exchange exchanges lithium ions with sodium ions in the glass, the sodium (ion) concentration at the midpoint of the cap in the chemically strengthened region 952 can be greater than the sodium concentration present in the natural composition, such as... Figure 10A and Figure 10B As schematically illustrated. During the first ion exchange, some larger ions may diffuse into adjacent shielding regions of the capping member (e.g., region 954), but the concentration of larger ions is generally less than that in the chemically reinforced region 952.

[0128] After the first ion exchange operation, the mask can be removed. For example, a polishing operation can be used to remove the mask.

[0129] A second ion exchange operation can be performed after mask removal. For example, the second ion exchange can exchange sodium ions with potassium ions in the glass. The second ion exchange can form a potassium-rich layer along the outer and inner surfaces of the cover member in region 952 and adjacent region 954. The second ion exchange can also alter the distribution of sodium ions within the cover member. Figure 10C The concentrations of sodium and potassium ions in region 952 after the second ion exchange operation are schematically shown.

[0130] Figure 10A , Figure 10B , Figure 10C and Figure 10D Examples of concentration distributions at different stages of the chemical strengthening process of cap components are shown. Figure 10A , Figure 10B and Figure 10C The concentration distribution shown can represent Figure 9 The concentration distribution of chemically enhanced region 952 is shown. Figure 10D The concentration distribution shown can represent Figure 9 The concentration distribution of chemically enhanced region 954 is shown. Figure 10A , Figure 10B , Figure 10C and Figure 10D The vertical solid lines in the diagram indicate the surface of the cover member, and the distance between the vertical solid lines corresponds to the thickness of the cover member. Furthermore, relative to... Figure 10A , Figure 10B , Figure 10C and Figure 10DAny of the ion exchange operations described herein may be performed using a bath or other ion source containing a mixture of ions (e.g., a mixture of two or more of lithium ions, sodium ions, and potassium ions).

[0131] Figure 10A An example of sodium concentration distribution 1001 prior to the first ion exchange operation is shown. The sodium concentration, as a natural sodium concentration within the cap member, is substantially uniform across the thickness of the cap member. In this example, the natural composition of the cap member also includes lithium and typically includes other elements.

[0132] Figure 10B An example of sodium concentration distribution 1002 after a first ion exchange is shown, in which lithium ions in the cap member are exchanged with sodium ions from a bath or another sodium ion source. Figure 10B As shown, the sodium concentration at the surface of the cover component is greater than the sodium concentration at the midpoint of the thickness in sodium concentration distribution 1002. Figure 10B In the example, the sodium concentration at the midpoint of the thickness is greater than that of the part where the thickness is increased. Figure 10A The sodium concentration distribution 1001 indicates the natural sodium concentration. Due to the exchange of sodium ions with lithium ions in the first ion exchange operation, the total amount of lithium in this region of the cap structure will decrease.

[0133] Figure 10C An example of sodium concentration distribution 1003 after a second ion exchange is shown, in which sodium ions in the glass are exchanged with potassium ions from a bath or another potassium ion source. Figure 10B Compared to sodium concentration distribution 1002, in sodium concentration distribution 1003, the sodium (ion) concentration at the surface is lower at the surface of the cover member. Furthermore, due to additional inward diffusion of sodium ions, the sodium (ion) concentration increases deeper within the cover. Figure 10C An example of potassium concentration distribution 1023 after the second ion exchange is also shown. Due to the exchange of potassium ions with sodium ions in the first ion exchange operation, the total amount of lithium in this region of the cap member (not shown) can be further reduced.

[0134] Figure 10D An example of sodium concentration distribution 1004 in another chemically fortified region is shown. For example, Figure 10D The chemically enhanced region shown may exist in a portion of the capping member that is masked during the first ion exchange and then unmasked during the second ion exchange (e.g., Figure 9 The chemically enhanced region 954 is shown. Figure 10D As shown, the sodium concentration at the midpoint of sodium concentration distribution 1004 is less than Figure 10C The sodium concentration distribution is the sodium concentration at the midpoint of 1003. Figure 10DIn the example, the sodium concentration at the surface of the cover member with sodium concentration distribution 1004 is lower than the sodium concentration at the surface of the cover member with sodium concentration distribution 1003. Figure 10D An exemplary potassium concentration distribution 1024 is also shown. (For example...) Figure 10D As shown in the example, potassium concentration distribution 1024 is similar to concentration distribution 1023; however, this example is not limiting, and in other examples, the potassium concentration at the surface is much lower in concentration distribution 1024 than in concentration distribution 1023. This adjacent chemically reinforced region may also have a higher concentration of lithium (ions) in the inner portion of the cap member. Thus, in Figure 10D Tensile stress zones are generated in the chemically reinforced zone shown.

[0135] In some implementations, the mask covers a greater extent the area of ​​the glass to be chemically strengthened. Figure 11 Another partial cross-sectional view of the mask 1162 applied to the cover member 1132 is shown. Figure 11 In the example, mask 1162 exposes a portion of the outer and inner surfaces (1147, 1146) of the cover component. Figure 11 In the example, mask 1162 is applied to both the outer surface 1147 and the inner surface 146.

[0136] During the first ion exchange operation, where larger ions exchange with smaller ions in the cover member, a greater degree of ion exchange will occur in ion exchange region 1154 than in the adjacent region 1152 covered by the mask. In some cases, the first ion exchange in region 1154 can be performed such that smaller ions introduced from both the outer surface 1147 and the inner surface 1146 diffuse to the midpoint (thickness) of the cover member. Therefore, the concentration of smaller ions at the midpoint of the cover member can be greater than the concentration present in the natural composition of the cover member. For example, if the first ion exchange exchanges sodium ions with lithium ions in the cover member, the concentration of lithium (ions) at the midpoint of the cover can be greater than the concentration of lithium (ions) present in the natural composition of the cover member, such as... Figure 12B As illustrated schematically. After the first ion exchange operation, the mask can be removed. For example, a polishing operation can be used to remove the mask.

[0137] A second ion exchange operation can be performed after mask removal. As an example, the second ion exchange can exchange lithium ions in the glass for sodium ions. As another example, the second ion exchange operation can exchange lithium ions in the glass for potassium ions. Both types of ion exchange can occur during the second ion exchange operation. The second ion exchange operation can form a chemically strengthened layer along the outer and inner surfaces of the cover member. In some examples, a third ion exchange operation exchanges sodium ions in the glass for potassium ions.

[0138] Figure 12A , Figure 12B , Figure 12C and Figure 12D An example of concentration distribution at different stages in another process of chemically strengthening cap components is shown. Figure 12A , Figure 12B and Figure 12C The concentration distribution shown can represent Figure 11 The concentration of region 1154 is shown. Figure 12D The concentration distribution shown can represent Figure 11 The concentration distribution of the chemically enhanced region 1152 is shown. Figure 12A , Figure 12B , Figure 12C and Figure 12D The vertical solid lines in the diagram indicate the surface of the cover member, and the distance between the vertical solid lines corresponds to the thickness of the cover member.

[0139] Figure 12A An example of a sodium concentration distribution 1201 prior to the first ion exchange operation is shown. The sodium concentration, as a natural sodium concentration within the cap member, is substantially uniform across the thickness of the cap member. In some examples, the cap member may also have a natural lithium concentration, which may also be substantially uniform across the thickness of the cap member. Relative to Figure 12A , Figure 12B , Figure 12C and Figure 12D Any of the ion exchange operations described herein may be performed using a bath or other ion source containing a mixture of ions (e.g., a mixture of two or more of lithium ions, sodium ions, and potassium ions).

[0140] Figure 12B An example of sodium concentration distribution 1202 and lithium concentration distribution 1212 after a first ion exchange, in which sodium ions in the cap member are exchanged with lithium ions from a bath or another lithium ion source, is shown. For clarity, lithium concentration distribution 1212 is shown in dashed lines. Figure 12B As shown, the lithium concentration at the surface of the cover member is greater than the lithium concentration at the midpoint of the thickness in lithium concentration distribution 1212. Due to the exchange of sodium ions with lithium ions in the first ion exchange operation, the total amount of sodium in this region of the cover member will decrease, as shown in sodium concentration distribution 1202. Sodium concentration distribution 1202 shows that the decrease in sodium concentration at the surface is greater than the decrease in sodium concentration at the midpoint of the cover member. Figure 12B The sodium concentration distribution 1202 shown is exemplary and not limiting, and in other examples, the sodium concentration distribution may have different sodium concentrations on the surface and / or inside, and therefore may have the same characteristics as... Figure 12B The different shapes shown.

[0141] Figure 12CAn example of lithium concentration distribution 1213 is shown after a second ion exchange, in which sodium and lithium ions in the glass are exchanged with potassium ions from a bath or another potassium ion source. Compared to lithium concentration distribution 1212, in lithium concentration distribution 1213, the lithium (ion) concentration at the surface is reduced at the surface of the cover member. The sodium (ion) concentration in the cover member can also be reduced to a certain extent, an example of which is shown in sodium concentration distribution 1203. Figure 12C An example of potassium concentration distribution 1223 after the second ion exchange is also shown.

[0142] Figure 12D An example of sodium concentration distribution 1204 in another chemically fortified region is shown. For example, Figure 12D The chemically enhanced region shown may exist in a portion of the capping member that is masked during the first ion exchange and then unmasked during the second ion exchange (e.g., Figure 11 The chemically enhanced region 1152 is shown. (e.g., the chemically enhanced region 1152). Figure 12D As shown, the sodium concentration at the midpoint of sodium concentration distribution 1204 is greater than... Figure 12C The sodium concentration distribution is at the midpoint of 1203. This adjacent chemically enhanced region can also have a lower concentration of lithium (ions). Therefore, it is possible to... Figure 12C The chemically enhanced region shown (e.g., Figure 11 Tensile stress zone is generated in the chemically reinforced zone 1154 shown.

[0143] Figure 12D An exemplary potassium concentration distribution 1224 is also shown. (For example...) Figure 12D As shown in the example, potassium concentration distribution 1224 is similar to concentration distribution 1223, but this example is not limiting, and in other examples, the potassium concentration at the surface may be different in concentration distribution 1224 than in concentration distribution 1223.

[0144] Figure 13 A block diagram of a sample electronic device that may include differentially reinforced cover components is shown. Figure 13 The schematic representation depicted in the text can correspond to the above-mentioned examples. Figures 1A to 12D The components of the device depicted in the image. However... Figure 13 It can also refer more generally to other types of electronic devices that include differential enhancement components as described herein.

[0145] In an implementation, electronic device 1300 may include sensor 1320 to provide information about the configuration and / or orientation of the electronic device in order to control the output of the display. For example, when all or part of the visible area of ​​display 1308 is blocked or substantially obscured, a portion of display 1308 may be turned off, disabled, or placed in a low-power state. As another example, display 1308 may be adapted to rotate the display of graphic output based on a change in the orientation of device 1300 (e.g., 90 degrees or 180 degrees) in response to rotation of device 1300.

[0146] Electronic device 1300 also includes a processor 1306 operatively connected to computer-readable storage 1302. Processor 1306 may be operatively connected to storage 1302 via an electronic bus or bridge. Processor 1306 may be implemented as one or more computer processors or microcontrollers configured to perform operations in response to computer-readable instructions. Processor 1306 may include the central processing unit (CPU) of device 1300. Alternatively or additionally, processor 1306 may include other electronic circuitry located within device 1300, including application-specific integrated circuits (ASICs) and other microcontroller devices. Processor 1306 may be configured to perform the functions described in the above examples.

[0147] Memory 1302 may include various types of non-transitory computer-readable storage media, including, for example, read-access memory (RAM), read-only memory (ROM), erasable programmable memory (e.g., EPROM and EEPROM), or flash memory. Memory 1302 is configured to store computer-readable instructions, sensor values, and other persistent software elements.

[0148] Electronic device 1300 may include control circuitry 1310. Control circuitry 1310 may be implemented in a single control unit and need not be implemented as a separate circuit element. As used herein, "control unit" will be used synonymously with "control circuitry". Control circuitry 1310 may receive signals from processor 1306 or from other elements of electronic device 1300.

[0149] like Figure 13As shown, electronic device 1300 includes a battery 1314 configured to provide power to components of electronic device 1300. Battery 1314 may include one or more power storage units connected together to provide an internal power supply. Battery 1314 may be operatively coupled to power management circuitry configured to provide appropriate voltage and power levels for individual components or groups of components within electronic device 1300. Battery 1314 may be configured via the power management circuitry to receive power from an external power source, such as an AC power outlet. Battery 1314 may store the received power, enabling electronic device 1300 to operate for extended periods, ranging from several hours to several days, without connection to an external power source.

[0150] In some embodiments, electronic device 1300 includes one or more input devices 1318. Input device 1318 is a device configured to receive input from a user or environment. For example, input device 1318 may include, for example, a push-button, a touch-activated button, a capacitive touch sensor, a touchscreen (e.g., a touch-sensitive display or force-sensitive display), a capacitive touch button, a dial pad, a crown, etc. In some embodiments, input device 1318 may provide dedicated or primary functions, including, for example, a power button, volume buttons, a home button, a scroll wheel, and a camera button.

[0151] Device 1300 may also include one or more sensors or sensor components 1320, such as force sensors, capacitive sensors, accelerometers, barometers, gyroscopes, proximity sensors, light sensors, etc. In some cases, device 1300 includes a sensor array (also referred to as a sensing array) comprising multiple sensors 1320. For example, a sensor array associated with a protruding feature of a covering member may include an ambient light sensor, a lidar sensor, and a microphone. As previously mentioned relative to... Figure 1BAs discussed, one or more camera components may also be associated with the protruding feature. Sensor 1320 is operatively coupled to processing circuitry. In some embodiments, sensor 1320 may detect deformation and / or changes in configuration of electronic equipment and is operatively coupled to processing circuitry that controls a display based on sensor signals. In some specific embodiments, the output from sensor 1320 is used to reconfigure the display output to correspond to the orientation or folded / unfolded configuration or state of the device. Exemplary sensors 1320 used for this purpose include accelerometers, gyroscopes, magnetometers, and other similar types of positioning / orientation sensing devices. Furthermore, sensor 1320 may include microphones, acoustic sensors, light sensors (including ambient light, infrared (IR) light, ultraviolet (UV) light), optical facial recognition sensors, depth measurement sensors (e.g., time-of-flight sensors), health monitoring sensors (e.g., electrocardiogram (ERG) sensors, heart rate sensors, photoplethysmography (PPG) sensors, pulse oximeters), biometric sensors (e.g., fingerprint sensors), or other types of sensing devices.

[0152] In some embodiments, the electronic device 1300 includes one or more output devices 1304 configured to provide output to a user. The output device 1304 may include a display 1308 that presents visual information generated by the processor 1306. The output device 1304 may also include one or more speakers to provide audio output. The output device 1304 may also include one or more tactile devices configured to generate tactile or haptic outputs along an outer surface of the device 1300.

[0153] Display 1308 may include a liquid crystal display (LCD), a light-emitting diode (LED) display, an LED-backlit LCD display, an organic light-emitting diode (OLED) display, an effective layer organic light-emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, etc. If display 1308 is a liquid crystal display or an electrophoretic ink display, it may also include a backlight component controllable to provide a variable display brightness level. If display 1308 is an organic light-emitting diode or organic electroluminescent display, the brightness of display 1308 can be controlled by modifying the electrical signals provided to the display element. Furthermore, information regarding the configuration and / or orientation of the electronic device can be used to control the output of the display, as described with respect to input device 1318. In some cases, the display is integrated with a touch sensor and / or force sensor to detect touch and / or force applied along the outer surface of device 1300.

[0154] Electronic device 1300 may also include a communication port 1312 configured to transmit and / or receive signals or electrical communications from external devices or individual devices. Communication port 1312 may be configured to be coupled to an external device via a cable, adapter, or other type of electrical connector. In some embodiments, communication port 1312 may be used to couple electronic device 1300 to a host computer.

[0155] The electronic device 1300 may also include at least one accessory 1316, such as a camera, a flash for the camera, or other such device. The camera may be part of a camera array or sensor array that can be connected to other parts of the electronic device 1300, such as control circuitry 1310.

[0156] As used herein, the terms “about,” “approximately,” “substantially,” “similar,” etc., are used to describe relatively small variations, such as + / -10%, + / -5%, + / -2%, or + / -1%. Furthermore, the term “about” may be used with respect to the endpoints of a range to indicate variations of + / -10%, + / -5%, + / -2%, or + / -1% in the endpoint values. Additionally, disclosing a range in which at least one endpoint is described as “about” a specific value includes disclosing a range in which the endpoint is equal to the specific value.

[0157] As used herein, the phrase "one or more of" or "at least one of" following a series of items separated by the terms "and" or "or" modifies the list as a whole, not each member of the list. The phrase "one or more of" or "at least one of" does not require selection of at least one of each of the listed items; rather, it allows for the inclusion of at least one of any item in the list and / or at least one of any combination of items and / or at least one of each item in the list. For example, the phrases "one or more of A, B, and C" or "one or more of A, B, or C" each refer to only A, only B, or only C; any combination of A, B, and C; and / or one or more of each of A, B, and C. Similarly, it should be understood that the order of elements presented with respect to the combined or separate lists provided herein should not be construed as limiting this disclosure to the order provided.

[0158] The following discussion applies to the electronic devices described herein, and its scope extends to devices that can be used to acquire personally identifiable information data. It is well known that the use of personally identifiable information should comply with privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for protecting user privacy. Specifically, personally identifiable information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of authorized use should be clearly explained to the user.

[0159] For illustrative purposes, the foregoing description uses specific names to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Therefore, the foregoing description of specific embodiments described herein is presented for illustrative and descriptive purposes. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the teachings above.

Claims

1. An electronic device, comprising: Optical components; monitor; as well as A housing that at least partially encloses the optical component and includes a cover member defining an outer surface and an inner surface, the cover member comprising: A first chemically reinforced region, defining a first stress distribution, the first stress distribution including a first compressive stress region extending from the outer surface to the inner surface; and A second chemically reinforced region is positioned above the optical component, and the second chemically reinforced region is surrounded by the first chemically reinforced region and defines a second stress distribution, the second stress distribution comprising: A second compressive stress region extends from the outer surface; A third compressive stress region, the third compressive stress region extending from the inner surface; and A tensile stress region, the tensile stress region being located between the second compressive stress region and the third compressive stress region; and A third chemically reinforced region is located at least partially above the display and surrounding the first chemically reinforced region, the third chemically reinforced region defining a third stress distribution different from the first stress distribution.

2. The electronic device according to claim 1, wherein: The cover member defines the front surface of the electronic device; and The optical component is a forward-facing camera.

3. The electronic device according to claim 1, wherein, The maximum compressive surface stress in the first chemically reinforced region is greater than the maximum compressive surface stress in the second chemically reinforced region.

4. The electronic device according to claim 1, wherein: The cover member is formed of glass including lithium; and The first chemically reinforced region has a higher sodium concentration than the tensile stress region of the second chemically reinforced region.

5. The electronic device according to claim 1, wherein, The depth of the second compressive stress region is substantially equal to the depth of the third compressive stress region.

6. An electronic device, comprising: monitor; and A housing that at least partially surrounds the display and includes a cover member comprising: A window portion, positioned above the display and having a window stress distribution, the window stress distribution including: An external compressive stress region extends from the outer surface of the cover member; An internal compressive stress region extending from the inner surface of the cover member; and A tensile stress region, wherein the tensile stress region is located between the outer compressive stress region and the inner compressive stress region; and A set of barrier sections, the set of barrier sections being arranged at least partially around the window portion, each barrier section in the set of barrier sections having a corresponding barrier stress distribution, the barrier stress distribution including a compressive stress region extending from the outer surface of the cover member to a depth greater than the depth of the outer compressive stress region of the window stress distribution.

7. The electronic device according to claim 6, wherein: Each barrier portion in the barrier portion set is offset from the corresponding edge of the cover member; and Each barrier portion in the barrier portion set is spaced apart from the adjacent barrier portion.

8. The electronic device according to claim 7, wherein, The compressive stress region of each corresponding barrier stress distribution extends through the thickness of the cover member.

9. The electronic device according to claim 7, wherein, Each barrier portion in the barrier portion cluster is offset from the corresponding edge by a distance not exceeding 5 mm.

10. The electronic device according to claim 9, wherein, A subset of the barrier portion is offset inward from the curved profile defined by the corner portion of the cover member.

11. The electronic device according to claim 6, wherein, The diameter of each barrier portion in the barrier portion set is greater than or equal to 100 micrometers and less than or equal to 2 mm.

12. The electronic device according to claim 6, wherein, The thickness of the cover member at each barrier portion of the barrier portion set is less than the thickness of the cover member at the window portion.

13. An electronic device, comprising: Optical components; and The housing includes a cover member, the cover member comprising: A window portion, positioned above the optical component and defining a window stress distribution, the window stress distribution comprising: An external compressive stress region extends from the outer surface of the cover member; An internal compressive stress region extending from the inner surface of the cover member; and A tensile stress region, the tensile stress region being located between the outer compressive stress region and the inner compressive stress region; and A set of barrier sections, the set of barrier sections being arranged at least partially around the window portion, each barrier section in the set of barrier sections having a corresponding barrier stress distribution, the barrier stress distribution including a compressive stress region extending from the outer surface of the cover member to a depth greater than the depth of the outer compressive stress region of the window stress distribution.

14. The electronic device according to claim 13, wherein: The cover member defines the rear surface of the electronic device; and The optical components are part of the sensor assembly.

15. The electronic device according to claim 13, wherein, The window portion is at least partially adjacent to the set of barrier portions.

16. The electronic device according to claim 13, wherein: The compressive stress region of each corresponding barrier stress distribution extends through the corresponding thickness of the cover member; and The sodium ion concentration in each of the respective barrier portions of the barrier portion set is lower at the midpoint of the respective thickness than at each of the outer and inner surfaces.

17. The electronic device according to claim 13, wherein, The tensile stress region of the window portion has a greater lithium-ion concentration compared to the tensile stress region of each corresponding barrier portion of the barrier portion set.

18. The electronic device according to claim 13, wherein, The maximum compressive stress in each corresponding barrier portion of the barrier portion set is greater than the maximum compressive stress in the window portion.

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