Immersion cooling system

Abstract

The present invention provides an immersion cooling system comprising a housing, a partition, and a condenser. The housing comprises a bottom plate and a wall. The wall is connected to the bottom plate and cooperates with the bottom plate to define a space configured to hold a cooling liquid. The partition is connected to the wall and divides the space into a first sub-space and a second sub-space. The first sub-space is configured to hold at least one electronic device so that the electronic device is immersed in the cooling liquid. The partition and the bottom plate are at least partially separated from each other. The wall surrounds the condenser, and a vertical projection of the condenser toward the bottom plate at least partially overlaps the second sub-space. The electronic device evaporates a portion of the cooling liquid to form a vapor, and the condenser is configured to condense the vapor into a liquid.

Description

Technical Field

[0001] This invention relates to an immersion cooling system. Background Technology

[0002] In order to effectively prevent large electronic devices from being damaged or having their operating efficiency affected by excessive heat during operation, how to reliably dissipate heat from large electronic devices is undoubtedly a topic of great importance to the industry.

[0003] In immersion cooling systems, users immerse large electronic devices in the coolant within the system to remove the heat generated during operation. Summary of the Invention

[0004] One of the objectives of this invention is to provide an immersion cooling system that can prevent electronic equipment from being damaged by water splashed from different sources inside the enclosure.

[0005] According to one embodiment of the present invention, an immersion cooling system includes a housing, a partition plate, and a condenser. The housing includes a base plate and walls. The walls are connected to the base plate and together define a space configured to contain coolant. The partition plate is connected to the walls and divides the space into a first subspace and a second subspace. The first subspace is configured to contain at least one electronic device, allowing the electronic device to be immersed in the coolant. The partition plate is at least partially separated from the base plate. The walls surround the condenser, and the vertical projection of the condenser toward the base plate at least partially overlaps the second subspace. The electronic device evaporates a portion of the coolant to form vapor, and the condenser is configured to condense the vapor into a liquid state.

[0006] In one or more embodiments of the present invention, the immersion cooling system further includes a moisture detector and a display device. The moisture detector is connected to one of the partitions or walls and located in the second subspace, and is configured to detect the presence of moisture.

[0007] In one or more embodiments of the present invention, the above-described immersion cooling system further includes a display device. The display device is signal-connected to a moisture detector and configured to display whether the moisture detector has detected moisture.

[0008] In one or more embodiments of the present invention, the above-described immersion cooling system further includes a top plate. A wall is connected between the top plate and the bottom plate, and a partition plate is separate from the top plate.

[0009] In one or more embodiments of the present invention, the immersion cooling system further includes at least one support member. The support member is connected between the partition plate and the top plate.

[0010] In one or more embodiments of the present invention, the above-described immersion cooling system further includes at least one support member. The support member is connected between the partition plate and the base plate.

[0011] In one or more embodiments of the present invention, the partition plate includes a first sub-partition plate and a second sub-partition plate, the first sub-partition plate and the second sub-partition plate are connected to each other to form an angle, the first sub-partition plate is separate from the bottom plate, and the second sub-partition plate is connected to the bottom plate.

[0012] In one or more embodiments of the present invention, the immersion cooling system further includes at least one support member. The support member is connected between the first sub-partition plate and the base plate.

[0013] In one or more embodiments of the present invention, the partition plate described above is substantially perpendicular to the base plate.

[0014] In one or more embodiments of the present invention, the condenser described above includes an inlet port, an outlet port, and a main body. The inlet port and the outlet port are respectively connected to the main body. The inlet port is configured to allow cooling water to flow into the main body, and the outlet port is configured to allow cooling water to flow out of the main body. The main body is configured to condense steam into liquid.

[0015] The above-described embodiments of the present invention have at least the following advantages:

[0016] (1) Even if there is some water vapor inside the enclosure, the condenser will condense this existing water vapor into water droplets. As the droplets fall, they will flow into the coolant in the second subspace and accumulate as water. Because of the partition plate, they will not splash into the first subspace. In other words, even if the condenser condenses the water vapor inside the enclosure into water droplets, the electronic equipment housed in the first subspace will not be splashed by these water droplets because of the partition plate. This avoids the electronic equipment coming into contact with water due to the water vapor inside the enclosure, and thus reduces the risk of damage to the electronic equipment.

[0017] (2) If the condenser leaks cooling water for any reason, the leaked cooling water will flow into the coolant in the second subspace and accumulate as water. Because of the partition plate, it will not splash into the first subspace. In other words, even if the condenser leaks cooling water, the electronic equipment housed in the first subspace will not be splashed by the leaking cooling water because of the partition plate. This avoids the electronic equipment coming into contact with cooling water due to the condenser leak, thus reducing the risk of damage to the electronic equipment.

[0018] (3) If water from different sources appears inside the tank, the water will eventually flow back into the coolant located in the second subspace. The water detector can detect the presence of water, and the display device is connected to the water detector to show whether the water detector has detected water. In this way, the user can easily find out whether water from different sources has appeared inside the tank through the display device. Attached Figure Description

[0019] Figure 1 A cross-sectional schematic diagram of an immersion cooling system according to an embodiment of the present invention is shown.

[0020] Figure 2 To show Figure 1 A cross-sectional view along line segment AA;

[0021] Figure 3 A cross-sectional schematic diagram of an immersion cooling system according to another embodiment of the present invention is shown;

[0022] Figure 4 A cross-sectional schematic diagram of an immersion cooling system 100 according to another embodiment of the present invention is shown.

[0023] Figure 5 A cross-sectional schematic diagram of an immersion cooling system according to another embodiment of the present invention is shown.

[0024] Figure 6 A cross-sectional schematic diagram of an immersion cooling system according to another embodiment of the present invention is shown;

[0025] Figure 7 This is a cross-sectional schematic diagram illustrating an immersion cooling system according to another embodiment of the present invention.

[0026] Explanation of icon numbers:

[0027] 100: Immersion Cooling System

[0028] 110: Box

[0029] 111: Base Plate

[0030] 112: Wall

[0031] 120: Divider

[0032] 121: First Sub-Divider

[0033] 122: Second Sub-Divider

[0034] 130: Condenser

[0035] 131: Entry Port

[0036] 132: Export Port

[0037] 133: Main Body

[0038] 140: Moisture Detector

[0039] 150: Display device

[0040] 160: Top plate

[0041] 170: Support component

[0042] 200: Electronic devices

[0043] AA: line segment

[0044] CL: Coolant

[0045] CV: Steam

[0046] CW: Cooling water

[0047] P1, P2: Channels

[0048] SP: Space

[0049] SP1: First Subspace

[0050] SP2: Second Subspace

[0051] W: Moisture

[0052] WV: Water vapor

[0053] θ: included angle Detailed Implementation

[0054] The following description, with reference to the accompanying drawings, illustrates various embodiments of the present invention. For clarity, numerous practical details will be described in conjunction with the accompanying drawings. However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not essential. Furthermore, for the sake of simplicity, some conventionally used structures and components will be shown in the drawings in a simple schematic manner, and in all drawings, the same reference numerals will be used to denote the same or similar components. And, where feasible, features of different embodiments can be applied interchangeably.

[0055] Unless otherwise defined, all terms used herein (including technical and scientific terms) have their ordinary meanings, which are understandable to those skilled in the art. Furthermore, the definitions of the foregoing terms in commonly used dictionaries should be interpreted in the context of this specification as having the meaning consistent with the relevant field of this invention. Unless specifically defined, these terms will not be construed as having idealized or overly formal meanings.

[0056] Please refer to Figures 1-2 . Figure 1 This is a schematic cross-sectional view of an immersion cooling system 100 according to an embodiment of the present invention. Figure 2 To show Figure 1 A cross-sectional view along line segment AA. In this embodiment, as shown... Figures 1-2 As shown, the immersion cooling system 100 includes a housing 110, a partition plate 120, and a condenser 130. The housing 110 includes a base plate 111 and walls 112. Walls 112 are connected to the base plate 111 and together with the base plate 111 define a space SP, which is configured to contain coolant CL. The partition plate 120 is connected to the walls 112 and divides the space SP into a first subspace SP1 and a second subspace SP2, both of which contain coolant CL. Furthermore, the first subspace SP1 is configured to contain at least one electronic device 200, allowing the electronic device 200 to be immersed in the coolant CL for heat dissipation. It is worth noting that the partition plate 120 is separate from the base plate 111, and a channel P1 is defined between the partition plate 120 and the base plate 111. That is, the first subspace SP1 and the second subspace SP2 are connected to each other through the channel P1. Therefore, the coolant CL can flow between the first subspace SP1 and the second subspace SP2 through the channel P1. The condenser 130 is located in the space SP of the housing 110, and the wall 112 surrounds the condenser 130. The vertical projection of the condenser 130 toward the base plate 111 at least partially overlaps the second subspace SP2.

[0057] When the electronic device 200 operates, it generates heat. The heated electronic device 200 evaporates a portion of the coolant CL to form vapor CV. The heated vapor CV rises and leaves the coolant CL. The condenser 130 is configured to condense the vapor CV into a liquid state, thereby restoring the vapor CV to the liquid coolant CL. As described above, since the vertical projection of the condenser 130 toward the base plate 111 at least partially overlaps the second subspace SP2, the coolant CL condensed and restored by the condenser 130 drips and flows back into the coolant CL located in the second subspace SP2 due to its weight. The coolant CL forms a fluid circulation within the space SP of the housing 110 through repeated conversion between liquid and gas states.

[0058] It is worth noting that, since the partition plate 120 at least partially blocks the space between the first subspace SP1 and the second subspace SP2, the coolant CL that is condensed and reduced by the condenser 130 will flow back into the coolant CL in the second subspace SP2 during the dripping process, and will not splash into the first subspace SP1 due to the obstruction of the partition plate 120.

[0059] In this way, even if there is some moisture WV inside the enclosure 110, the condenser 130 will condense this moisture WV into water droplets. As the water droplets fall, they will flow into the coolant CL located in the second subspace SP2 and accumulate as water W. Because of the partition plate 120, they will not splash into the first subspace SP1. In other words, even if the condenser 130 condenses the moisture WV inside the enclosure 110 into water droplets, the electronic equipment 200 housed in the first subspace SP1 will not be splashed by these water droplets because of the partition plate 120. This avoids the electronic equipment 200 coming into contact with water W due to the moisture WV inside the enclosure 110, thus reducing the risk of damage to the electronic equipment 200.

[0060] Furthermore, such as Figure 1 As shown, the condenser 130 includes an inlet port 131, an outlet port 132, and a body 133, with the inlet port 131 and outlet port 132 respectively connected to the body 133. Specifically, the vertical projection of the body 133 toward the base plate 111 at least partially overlaps the second subspace SP2. The inlet port 131 is configured to allow cooling water CW to flow into the body 133, while the outlet port 132 is configured to allow cooling water CW to flow out of the body 133. Through the flow of cooling water CW within the body 133, the body 133 of the condenser 130 is configured to condense vapor CV into a liquid state. In practical applications, the main body 133 of the condenser 130 can be composed of conduits, for example. If the condenser 130 experiences problems such as conduit corrosion or poor contact, causing leakage of cooling water CW, similarly, the leaked cooling water CW from the condenser 130 will flow into the coolant CL located in the second subspace SP2 and accumulate as water W. Because of the barrier plate 120, it will not splash into the first subspace SP1. In other words, even if the condenser 130 leaks cooling water CW, the electronic equipment 200 housed in the first subspace SP1 will not be splashed by the leaking cooling water CW from the condenser 130 due to the barrier plate 120. This avoids the electronic equipment 200 coming into contact with water W (i.e., cooling water CW) due to the condenser 130 leak, thus reducing the risk of damage to the electronic equipment 200.

[0061] In practical applications, the coolant CL can be an insulating dielectric fluid. Since the dielectric fluid and water W are immiscible, and water W is lighter than the dielectric fluid, the water W flowing into the coolant CL in the second subspace SP2 will float on top of the dielectric fluid (i.e., the coolant CL). As a result, water W cannot flow from the second subspace SP2 to the first subspace SP1 through the channel P1 near the bottom plate 111, while the dielectric fluid below the water W can flow from the second subspace SP2 to the first subspace SP1 through channel P1. Therefore, the fluid circulation of the dielectric fluid (i.e., the coolant CL) within the housing 110 remains unobstructed.

[0062] In practical applications, the partition 120 is essentially perpendicular to the base plate 111. Therefore, when the user places the electronic device 200 in the first subspace SP1 or removes the electronic device 200 from the first subspace SP1, the electronic device 200 is less likely to collide with the partition 120, reducing the chance of the electronic device 200 being damaged by collision.

[0063] In addition, such as Figure 1 As shown, the immersion cooling system 100 also includes a top plate 160. A wall 112 is connected between the top plate 160 and the bottom plate 111. A partition plate 120 is separated from the top plate 160, and a channel P2 is defined between the partition plate 120 and the top plate 160. Therefore, the vapor CV formed by the evaporation of coolant CL by the electronic device 200 can flow from the first subspace SP1 to the second subspace SP2 through the channel P2, so that the body 133 of the condenser 130 can condense the vapor CV.

[0064] Furthermore, the immersion cooling system 100 also includes a moisture detector 140 and a display device 150. For example... Figure 1 As shown, a moisture detector 140 is connected to the partition plate 120 and located in the second subspace SP2, and is configured to detect the presence of moisture W. As described above, if moisture W from different sources appears in the housing 110, the moisture W will eventually flow back into the coolant CL located in the second subspace SP2, and the moisture detector 140 can detect the presence of moisture W. Furthermore, a display device 150 is signal-connected to the moisture detector 140 and configured to display whether the moisture detector 140 has detected moisture W. In this way, the user can easily and readily determine whether moisture W from different sources has appeared in the housing 110 through the display device 150.

[0065] Please refer to Figure 3 . Figure 3This is a schematic cross-sectional view of an immersion cooling system 100 according to another embodiment of the present invention. In this embodiment, the immersion cooling system 100 further includes at least one support member 170. The support member 170 is connected between the partition plate 120 and the base plate 111 to enhance the structural strength between the partition plate 120 and the base plate 111. For example, such as Figure 3 As shown, there are multiple support members 170.

[0066] Please refer to Figure 4 . Figure 4 This is a schematic cross-sectional view of an immersion cooling system 100 according to another embodiment of the present invention. In this embodiment, a support member 170 is connected between the partition plate 120 and the top plate 160 to enhance the structural strength between the partition plate 120 and the top plate 160. For example, such as Figure 4 As shown, there are multiple support members 170. In other embodiments, the positions of the support members 170, in addition to those shown... Figure 3 and Figure 4 In addition to the shown location, it can also be connected between the partition plate 120 and the wall 112, depending on the actual situation, to enhance the structural strength between the partition plate 120 and the wall 112.

[0067] Please refer to Figure 5 . Figure 5 This is a schematic cross-sectional view of an immersion cooling system 100 according to another embodiment of the present invention. Depending on the actual situation, such as... Figure 5 As shown, the moisture detector 140 can also be connected to the wall 112 and located in the second subspace SP2, thereby improving the application flexibility of the moisture detector 140.

[0068] Please refer to Figure 6 . Figure 6 This is a schematic cross-sectional view of an immersion cooling system 100 according to another embodiment of the present invention. In this embodiment, as... Figure 6 As shown, the partition plate 120 includes a first sub-partition plate 121 and a second sub-partition plate 122, which are connected to each other to form an angle θ. For example, the angle θ can be 90 degrees, thus corresponding to an L-shaped condenser 130 installed on the wall 112. The first sub-partition plate 121 is separate from the base plate 111, and a channel P1 is defined between the first sub-partition plate 121 and the base plate 111. The second sub-partition plate 122 is connected to the base plate 111.

[0069] Please refer to Figure 7 . Figure 7This is a cross-sectional schematic diagram illustrating an immersion cooling system 100 according to another embodiment of the present invention. In this embodiment, the immersion cooling system 100 further includes at least one support member 170. The support member 170 is connected between the first sub-partition plate 121 and the base plate 111 to enhance the structural strength between the partition plate 120 and the base plate 111. For example, such as Figure 7 As shown, there are multiple support members 170.

[0070] In summary, the technical solution disclosed in the above embodiments of the present invention has at least the following advantages:

[0071] (1) Even if there is some water vapor inside the enclosure, the condenser will condense this existing water vapor into water droplets. As the droplets fall, they will flow into the coolant in the second subspace and accumulate as water. Because of the partition plate, they will not splash into the first subspace. In other words, even if the condenser condenses the water vapor inside the enclosure into water droplets, the electronic equipment housed in the first subspace will not be splashed by these water droplets because of the partition plate. This avoids the electronic equipment coming into contact with water due to the water vapor inside the enclosure, and thus reduces the risk of damage to the electronic equipment.

[0072] (2) If the condenser leaks cooling water for any reason, the leaked cooling water will flow into the coolant in the second subspace and accumulate as water. Because of the partition plate, it will not splash into the first subspace. In other words, even if the condenser leaks cooling water, the electronic equipment housed in the first subspace will not be splashed by the leaking cooling water because of the partition plate. This avoids the electronic equipment coming into contact with cooling water due to the condenser leak, thus reducing the risk of damage to the electronic equipment.

[0073] (3) If water from different sources appears inside the tank, the water will eventually flow back into the coolant located in the second subspace. The water detector can detect the presence of water, and the display device is connected to the water detector to show whether the water detector has detected water. In this way, the user can easily find out whether water from different sources has appeared inside the tank through the display device.

[0074] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the appended claims.

Claims

1. An immersion cooling system, comprising: The enclosure includes: Base plate; and A wall, connected to the base plate, and together with the base plate defining a space configured to accommodate coolant; A partition plate connects the wall and divides the space into a first subspace and a second subspace. The first subspace is configured to accommodate at least one electronic device, which is then immersed in the coolant. The partition plate is at least partially separated from the base plate, and the bottom of the partition plate is below the level of the coolant. At least one support member is connected between the partition plate and the base plate; as well as A condenser, the walls surrounding the condenser, the vertical projection of the condenser toward the base plate at least partially overlapping the second subspace. A moisture detector, connected to one of the partitions or the wall and located in the second subspace, is configured to detect the presence of moisture; The electronic device evaporates a portion of the coolant to form steam, and the condenser is configured to condense the steam into a liquid state. The coolant is an insulating dielectric fluid that is immiscible with water, and the water is lighter than the dielectric fluid.

2. The immersion cooling system according to claim 1, further comprising: A display device is signal-connected to the moisture detector and configured to display whether the moisture detector has detected moisture.

3. The immersion cooling system according to claim 1, further comprising: The top plate, the wall body is connected between the top plate and the bottom plate, and the partition plate is separate from the top plate.

4. The immersion cooling system according to claim 1, wherein the partition plate includes a first sub-partition plate and a second sub-partition plate, the first sub-partition plate and the second sub-partition plate are connected to each other to form an angle, the first sub-partition plate is separate from the bottom plate, and the second sub-partition plate is connected to the bottom plate.

5. The immersion cooling system according to claim 4, further comprising: At least one support member is connected between the first sub-divider plate and the base plate.

6. The immersion cooling system of claim 1, wherein the partition plate is substantially perpendicular to the base plate.

7. The immersion cooling system of claim 1, wherein the condenser includes an inlet port, an outlet port, and a body, the inlet port and the outlet port being respectively connected to the body, the inlet port being configured to allow cooling water to flow into the body, the outlet port being configured to allow the cooling water to flow out of the body, and the body being configured to condense the vapor into a liquid state.

Images