Mounting device, mounting method, and computer-readable storage medium

Abstract

Mounting device, mounting method, and computer-readable storage medium. The mounting device calculates a calibration value that calibrates a difference between a coordinate value calculated based on an overhead image and a coordinate value calculated based on a bottom view image for each assumed placement height of a placement predetermined area of a mounting body to be layered. A calibration control section calculates the calibration value based on an overhead image and a bottom view image output by causing a bottom view imaging unit and an overhead view imaging unit employing a Scheimpflug optical system to image a calibration mark arranged to coincide with the placement height. A mounting control section adjusts the position of a mounting tool so that a contact predetermined surface of the mounting body becomes the placement height, identifies a reference position based on a bottom view image obtained by causing the bottom view imaging unit to image, adjusts the position of the overhead view imaging unit so that a focal plane and the placement height become the same plane, and identifies a target position based on an overhead image obtained by causing the overhead view imaging unit to image the placement predetermined area and the calibration value corresponding to the placement height.

Description

Technical Field

[0001] This invention relates to an installation device, an installation method, and a computer-readable storage medium. Background Technology

[0002] In a conventional bonding device, the position of the workpiece, such as a chip holder, is first confirmed by photographing it from directly above using a camera. Next, the camera is withdrawn, and the head of the bonding tool is moved to directly above the workpiece to perform the bonding operation. Bonding devices with this structure not only require operation time, but also suffer from the accumulation of errors in the movement of the target position. Therefore, it is conceivable to utilize a photographing unit employing a SAM optical system capable of photographing the workpiece from an oblique angle (see, for example, Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2014-179560 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, it has been learned that, due to the structural characteristics of the optical system, the minute displacements of the optical system components caused by temperature changes in the surrounding environment can easily manifest as a planar displacement in the output image. This planar displacement of the output image leads to errors in calculating the target position of the semiconductor chip, thus hindering the accurate mounting of the semiconductor chip in its intended location. Particularly in stacked chip mounting or 2.5D mounting, where other semiconductor chips are superimposed on top of a semiconductor chip mounted on a substrate, the height of the mounting surface of each semiconductor chip varies. In such cases, the issue of varying error amounts for different heights becomes apparent.

[0008] The present invention was made to solve this problem by providing a mounting device, etc., which can accurately determine the target position of each mounting body using a SAM optical system imaging unit even when the ambient temperature changes and even when multiple mounting bodies such as semiconductor chips are stacked, and can place and mount the mounting bodies on the target position on the substrate.

[0009] Technical means to solve the problem

[0010] The mounting apparatus in the first aspect of the present invention includes: a mounting tool for picking up and holding a mounting body, placing it on and mounting it onto a substrate mounted on a stage or a predetermined mounting area set relative to other mounting bodies already mounted on the substrate; a top-view imaging unit for configuring an optical system and imaging element to satisfy the Sham condition, such that a plane parallel to the stage surface of the stage becomes the focal plane, and for taking a top-view image of the predetermined mounting area from the same side as the mounting tool relative to the stage surface; a bottom-view imaging unit for taking a bottom-view image of the mounting body held in the mounting tool state from the opposite side of the top-view imaging unit relative to the stage surface; a calibration control unit for calculating a calibration value to calibrate the difference between the coordinate values ​​calculated based on the top view image output by the top-view imaging unit and the coordinate values ​​calculated based on the bottom view image output by the bottom-view imaging unit; and a mounting control unit. The mounting unit places and installs the mounting body in a predetermined mounting area, ensuring that the reference position of the mounting body on the mounting tool matches the target position in the predetermined mounting area. The calibration control unit calculates the calibration value for each assumed mounting height in the predetermined mounting area based on the calibration marks configured by the top-view and bottom-view imaging units to match the mounting height. The mounting control unit adjusts the position of the mounting tool so that the predetermined contact surface in the mounting body that contacts the predetermined mounting area becomes the mounting height. Based on the bottom-view imaging unit capturing the predetermined contact surface and outputting the bottom-view image, the reference position is identified. The position of the top-view imaging unit is adjusted so that the focal plane and the mounting height are the same plane. Based on the top-view image of the predetermined mounting area captured by the top-view imaging unit and the calibration value corresponding to the mounting height, the target position is identified.

[0011] The second aspect of the present invention is an installation method using a mounting device comprising: a mounting tool for picking up and holding the mounting body, placing it on and mounting it on a substrate mounted on a stage or on a predetermined mounting area set relative to other mounting bodies already mounted on the substrate; a top-view imaging unit for configuring optical systems and imaging elements to satisfy the SAM condition, such that a plane parallel to the stage surface of the stage becomes the focal plane, and for taking top-view images of the predetermined mounting area from the same side as the mounting tool relative to the stage surface; and a bottom-view imaging unit for taking bottom-view images of the mounting body held in the mounting tool state from the opposite side of the stage surface relative to the top-view imaging unit. The installation method includes a calibration control step for calculating coordinate values ​​calculated based on the top-view image output by the top-view imaging unit and coordinate values ​​calculated based on the bottom-view image output by the bottom-view imaging unit. The calibration values ​​are obtained through differential calibration; and the installation control steps involve placing and installing the mounting body in a predetermined mounting area to ensure that the reference position of the mounting body of the installation tool matches the target position of the predetermined mounting area. The calibration control steps calculate the calibration values ​​for each assumed mounting height of the predetermined mounting area based on the calibration marks configured by the top-view and bottom-view imaging units that match the mounting height. The installation control steps adjust the position of the installation tool so that the predetermined contact surface in the mounting body that contacts the predetermined mounting area becomes the mounting height. Based on the bottom-view imaging unit capturing the contact predetermined surface and outputting the bottom-view image, the reference position is identified. The position of the top-view imaging unit is adjusted so that the focal plane and the mounting height are the same plane. Based on the top-view image obtained by the top-view imaging unit capturing the predetermined mounting area and the calibration values ​​corresponding to the mounting height, the target position is identified.

[0012] The third aspect of the present invention includes a computer-readable storage medium storing an installation control program that controls an installation device, the installation device comprising: an installation tool for picking up and holding a mounting body, placing and installing it on a substrate mounted on a stage or in a predetermined placement area relative to other mounting bodies already mounted on the substrate; a top-view imaging unit that configures optical systems and imaging elements to satisfy the Sham condition, such that a plane parallel to the stage surface of the stage becomes the focal plane, and is used to take a top-view image of the predetermined placement area from the same side as the installation tool relative to the stage surface; and a bottom-view imaging unit for taking a bottom-view image of the mounting body held in the installation tool state from the opposite side of the stage surface relative to the top-view imaging unit. The installation control program causes a computer to perform the following steps: a calibration control step, calculating the coordinate values ​​calculated based on the top-view image output by the top-view imaging unit and the coordinate values ​​based on the bottom-view image output by the bottom-view imaging unit. The calibration value is calculated based on the difference in coordinate values ​​obtained from the bottom view image; and the installation control step involves placing and installing the mounting body in a predetermined mounting area so that the reference position of the mounting body of the installation tool matches the target position of the predetermined mounting area. The calibration control step calculates the calibration value for each assumed mounting height of the predetermined mounting area based on the top view image and the bottom view image output by the top view imaging unit and the bottom view imaging unit, which are configured to match the mounting height. The installation control step adjusts the position of the installation tool so that the predetermined contact surface in the mounting body that contacts the predetermined mounting area becomes the mounting height. Based on the bottom view image output by the bottom view imaging unit, the reference position is identified. The position of the top view imaging unit is adjusted so that the focal plane and the mounting height are the same plane. Based on the top view image obtained by the top view imaging unit and the calibration value corresponding to the mounting height, the target position is identified.

[0013] The effects of the invention

[0014] The present invention provides an installation device, etc., which can accurately determine the target position of each mounting body using a SAM optical system, even when the ambient temperature changes, and even when multiple mounting bodies such as semiconductor chips are stacked, and can place and mount the mounting bodies on the target position on the substrate. Attached Figure Description

[0015] Figure 1 This is an overall structural diagram of a flip chip bonding machine that includes the bonding apparatus of this embodiment.

[0016] Figure 2 This is a system structure diagram of the coupling device.

[0017] Figure 3 This is an explanatory diagram used to illustrate the Schahm optical system.

[0018] Figure 4 This diagram shows the situation where the calibration mark, which has been adjusted to the height of the first predetermined plane, is captured by three imaging units.

[0019] Figure 5 This diagram shows the situation where the calibration mark, which has been adjusted to the height of the second predetermined plane, is captured by three shooting units.

[0020] Figure 6 This diagram illustrates the process of a bonding tool picking up a first semiconductor chip.

[0021] Figure 7 This diagram illustrates the situation where the third imaging unit captures images of the first semiconductor chip.

[0022] Figure 8 This is a schematic diagram representing the bottom-view image output by the third camera unit.

[0023] Figure 9 This diagram illustrates the situation where the first and second imaging units capture images of the lead frame, which serves as the mounting area.

[0024] Figure 10 yes Figure 9 A partial 3D view.

[0025] Figure 11 It is a diagram showing the sequence up to calculating the target coordinates on the chip holder on which the first semiconductor chip is mounted based on the first top view image and the second top view image.

[0026] Figure 12 This diagram illustrates the situation where a bonding tool places and bonds a first semiconductor chip to a target location.

[0027] Figure 13 This diagram illustrates the situation where the engagement tool is disengaged.

[0028] Figure 14 This diagram illustrates the situation where the third imaging unit captures images of the second semiconductor chip.

[0029] Figure 15 This is a schematic diagram representing the bottom-view image output by the third camera unit.

[0030] Figure 16 This diagram illustrates the situation where the first and second imaging units capture images of a first semiconductor chip that is disposed in a predetermined area.

[0031] Figure 17 It is a diagram showing the sequence up to calculating the target coordinates on the first semiconductor chip on which the second semiconductor chip is mounted, based on the first top view image and the second top view image.

[0032] Figure 18This diagram illustrates the situation where a bonding tool places and bonds a second semiconductor chip to a target location.

[0033] Figure 19 It is a flowchart illustrating the bonding sequence of semiconductor chips.

[0034] Figure 20 This is a sub-flowchart illustrating the sequence of calibration control steps.

[0035] Figure 21 This is a sub-flowchart illustrating the sequence of engagement control steps.

[0036] Figure 22 This diagram illustrates, in another embodiment, the situation where three imaging units capture images of a calibration mark adjusted to the height of a first predetermined surface.

[0037] Figure 23 This is a flowchart illustrating the bonding sequence of the semiconductor chips in another embodiment.

[0038] Figure 24 This is a diagram illustrating the configuration of the calibration flags in a calibration unit according to yet another embodiment.

[0039] [Explanation of Symbols]

[0040] 100: Connecting device

[0041] 110: Head

[0042] 110a: Focal plane

[0043] 111: Head drive motor

[0044] 120: Joining tool

[0045] 121: Tool drive motor

[0046] 122: Clamp

[0047] 123: Chuck Center

[0048] 124: Heater

[0049] 130: First Shooting Unit

[0050] 131: First Optical System

[0051] 131a: Object-side lens group

[0052] 131b: Image-side lens group

[0053] 132: First imaging element

[0054] 133: Aperture

[0055] 140: Second shooting unit

[0056] 141: Second Optical System

[0057] 142: Second imaging element

[0058] 150: Third shooting unit

[0059] 151: Third Optical System

[0060] 152: Third imaging element

[0061] 170, 170': Calibration unit

[0062] 171: Marker drive motor

[0063] 172: Signboard

[0064] 172a: First marker plate

[0065] 172b: Second marker plate

[0066] 172c: Third signboard

[0067] 173: Calibration Mark

[0068] 173a: First calibration mark

[0069] 173b: Second calibration mark

[0070] 173c: Third calibration mark

[0071] 174: Support Platform

[0072] 175: Pole

[0073] 190: Platform

[0074] 210: Computation and Processing Unit

[0075] 211: Image Acquisition Department

[0076] 212: Drive Control Unit

[0077] 213: Calibration Control Department

[0078] 214: Engagement Control Unit

[0079] 220: Storage Department

[0080] 221: Calibration Data

[0081] 230: Input / output device

[0082] 310: Semiconductor chip

[0083] 310a: First Semiconductor Chip

[0084] 310b: Second semiconductor chip

[0085] 311a, 311b: Chip reference marks

[0086] 320: Chip socket

[0087] 321: Reference Marker

[0088] 322: Unit area

[0089] 323: Stacking reference mark

[0090] 330: Lead Frame

[0091] 330a: First Pre-determined Plane

[0092] 330b: Second Pre-determined Surface

[0093] 500: Chip supply device

[0094] 510: Picking mechanism

[0095] 520: Tilting Mechanism Detailed Implementation

[0096] The present invention will now be described through embodiments thereof, but the invention is not intended to be limited to these embodiments. Furthermore, not all structures described in the embodiments are necessarily means to solve the problem. Additionally, in the figures, where multiple structures with the same or identical structures exist, to avoid clutter, sometimes some are labeled with the same symbols while others are omitted.

[0097] Figure 1This is an overall structural diagram of a flip chip bonding machine including the bonding device 100, which is the mounting device in this embodiment. The flip chip bonding machine mainly includes the bonding device 100 and the chip supply device 500. The chip supply device 500 is a device that places a diced semiconductor chip 310, which serves as a mounting body, on its upper surface and supplies it to the bonding device 100. Specifically, the chip supply device 500 includes a pick-up mechanism 510 and a flipping mechanism 520. The pick-up mechanism 510 is a device that pushes any semiconductor chip 310 placed thereon toward the flipping mechanism 520. The flipping mechanism 520 is a device that attracts and flips the semiconductor chip 310 pushed up by the pick-up mechanism 510, thereby exchanging its vertical direction. In this embodiment, two types of semiconductor chips 310 are prepared: a first semiconductor chip 310a and a second semiconductor chip 310b. The bonding device 100 is an apparatus that uses the bonding tool 120 to pick up a first semiconductor chip 310a or a second semiconductor chip 310b adsorbed in a state flipped by the flipping mechanism 520, and then stacks and bonds them to the lead frame 330. In this embodiment, the first semiconductor chip 310a is placed and bonded to the lead frame 330, and the second semiconductor chip 310b is overlapped and bonded to the first semiconductor chip 310a. The lead frame 330 is an example of a substrate placed on the stage 190.

[0098] The joining device 100 mainly includes a head 110, a joining tool 120, a first imaging unit 130, a second imaging unit 140, a third imaging unit 150, a calibration unit 170, and a stage 190. The head 110 supports the joining tool 120, the first imaging unit 130, and the second imaging unit 140, and can move in the planar and vertical directions via a head drive motor 111. In this embodiment, the planar direction, as shown in the figure, is the horizontal direction defined by the X-axis and Y-axis directions, and the vertical direction (height direction) is the Z-axis direction, which is orthogonal to the X-axis and Y-axis directions.

[0099] The bonding tool 120 can be moved vertically relative to the head 110 via a tool drive motor 121, and can also rotate about the Z-axis. The bonding tool 120 is an example of an installation tool, having a chuck 122 that holds a semiconductor chip 310 at its front end and a heater 124 that heats the semiconductor chip 310 held by the chuck 122. The bonding tool places the semiconductor chip 310 held in the chuck 122 at a predetermined position, applies pressure using the front end of the chuck 122, and heats and bonds it using the heater 124.

[0100] The first imaging unit 130 and the second imaging unit 140 are top-view imaging units for the top-view imaging lead frame 330. The first imaging unit 130 includes a first optical system 131 and a first imaging element 132, and is inclined at the head 110 with its optical axis pointing downwards toward the joining tool 120. The first optical system 131 and the first imaging element 132 are configured to satisfy the Schahm condition so that a plane parallel to the stage surface of the stage 190 becomes the focal plane 110a.

[0101] The second imaging unit 140 includes a second optical system 141 and a second imaging element 142. It is positioned opposite the first imaging unit 130 to the joining tool 120, with its optical axis tilted downwards toward the joining tool 120 at the head 110. The second optical system 141 and the second imaging element 142 are configured to satisfy the Schahm condition, such that a plane parallel to the stage surface of the stage 190 becomes the focal plane 110a. Furthermore, in the following description, the first imaging unit 130 and the second imaging unit 140 are sometimes collectively referred to as the "top-view imaging unit".

[0102] The third imaging unit 150 is a bottom-view imaging unit for photographing the semiconductor chip 310 held in the chuck 122 of the joining tool 120 from a low angle. As shown, if the stage surface of the stage 190 is taken as the dividing surface, the third imaging unit 150 is disposed in the space opposite to the space where the top-view imaging unit is disposed. The third imaging unit 150 includes a third optical system 151 and a third imaging element 152, and is arranged with its optical axis pointing upwards. The third imaging unit 150 is a conventional imaging unit configured such that the third optical system 151 and the third imaging element 152 are orthogonal to the optical axis, and its focal plane 150a is parallel to the light-receiving surface of the third imaging element 152. In the following description, the third imaging unit 150 is sometimes referred to as a "bottom-view imaging unit".

[0103] The calibration unit 170 mainly includes a marker drive motor 171, a marker plate 172, a calibration mark 173, a support platform 174, and a rod 175. The calibration mark 173 is, for example, a reference mark defining the reference position of the intersection of a crosshair. The marker plate 172 is, for example, a thin sheet of glass or transparent resin, on one side of which the calibration mark 173 is printed. That is, the calibration mark 173 can be viewed from either side of the marker plate 172. In this embodiment, the calibration mark 173 is printed on the surface of the marker plate 172 opposite to the surface facing the third imaging unit 150. Furthermore, the marker plate 172 can also be opaque as long as two calibration marks 173 are printed on each side of the marker plate 172 and their reference positions are not offset in the XY direction. In this case, the thickness of the marker plate 172 is set so that the calibration mark 173 facing the third imaging unit 150 converges within the depth of field of the third imaging unit 150. In addition, the calibration mark 173 is not limited to printing; it can also be set by attaching a seal or marking lines on the surface of the mark plate 172.

[0104] A sign drive motor 171 rotates a sign plate 172 about the Z-axis, thereby moving or removing a calibration mark 173 from or near the center of the field of view of the third imaging unit 150. Additionally, the sign drive motor 171 moves a rod 175 forward and backward in the vertical direction. The end of the sign plate 172 is rotatably secured to one end of the rod 175, and a support platform 174 is secured to the other end. The third imaging unit 150 is fixed to the support platform 174. That is, when the sign plate 172 rotates and the calibration mark 173 is placed into the field of view of the third imaging unit 150, the distance between the two is adjusted by the rod 175 so that the calibration mark 173 is always within the focal plane 150a of the third imaging unit 150. Furthermore, the third optical system 151 uses a fixed depth range across the focal plane 150a as the depth of field, so as long as the distance between the two is within the depth of field, offset is permissible.

[0105] The marker drive motor 171 can adjust the height of the calibration mark 173 by moving the lever 175 forward and backward in the height direction, while keeping the focal plane 150a of the third imaging unit 150 on the printed surface of the calibration mark 173. Specifically, the height of the calibration mark 173 is aligned with either the first predetermined surface 330a (the upper surface of the lead frame 330) which serves as the predetermined surface for mounting the first semiconductor chip 310a, or the second predetermined surface 330b (the upper surface of the first semiconductor chip 310a adhered to the lead frame 330) which serves as the predetermined surface for mounting the second semiconductor chip 310b. In other words, the marker drive motor 171 can align the focal plane 150a of the third imaging unit 150 with either the first predetermined surface 330a or the second predetermined surface 330b by moving the lever 175 forward and backward in the height direction. In this case, the calibration mark 173 can also be removed from the field of view of the third imaging unit 150.

[0106] Figure 2 This is a system structure diagram of the joining device 100. The control system of the joining device 100 mainly includes an arithmetic processing unit 210, a storage unit 220, an input / output device 230, a first imaging unit 130, a second imaging unit 140, a third imaging unit 150, a head drive motor 111, a tool drive motor 121, and a mark drive motor 171.

[0107] The arithmetic processing unit 210 is a processor (central processing unit (CPU)) that performs control and program execution processing of the bonding device 100. The processor may also be integrated with an arithmetic processing chip such as an application-specific integrated circuit (ASIC) or a graphics processing unit (GPU). The arithmetic processing unit 210 reads the bonding control program stored in the storage unit 220 and executes various processes related to bonding control.

[0108] Storage unit 220 is a non-volatile storage medium, such as a hard disk drive (HDD). In addition to storing the engagement control program, storage unit 220 can also store various parameter values, functions, lookup tables, etc., used for control or calculation. Storage unit 220 specifically stores calibration data 221. Calibration data 221, specifically described below, is data related to calibration values, which are calibrations performed on the difference between coordinate values ​​calculated based on a top-view image and coordinate values ​​calculated based on a bottom-view image for the same observed object.

[0109] Input / output device 230 includes, for example, a keyboard, mouse, and monitor, and is a device that accepts menu operations performed by the user or provides information prompts to the user. For example, the arithmetic processing unit 210 may also display the acquired top-view or bottom-view image on the monitor, which is one of the input / output devices 230.

[0110] The first imaging unit 130 receives an imaging request signal from the processing unit 210 and performs imaging, sending the first top-view image output by the first imaging element 132 as an image signal to the processing unit 210. The second imaging unit 140 receives an imaging request signal from the processing unit 210 and performs imaging, sending the second top-view image output by the second imaging element 142 as an image signal to the processing unit 210. The third imaging unit 150 receives an imaging request signal from the processing unit 210 and performs imaging, sending the bottom-view image output by the third imaging element 152 as an image signal to the processing unit 210.

[0111] The head drive motor 111 receives a drive signal from the processing unit 210, causing the head 110 to move horizontally and vertically. The tool drive motor 121 receives a drive signal from the processing unit 210, causing the engagement tool 120 to move vertically and rotate around the Z-axis. The sign drive motor 171 receives a drive signal from the processing unit 210, causing the sign plate 172 to rotate and the rod 175 to move forward and backward vertically.

[0112] The arithmetic processing unit 210 also functions as a functional arithmetic unit, performing various calculations according to the processing instructions of the engagement control program. The arithmetic processing unit 210 can function as an image acquisition unit 211, a drive control unit 212, a calibration control unit 213, and an engagement control unit 214. The image acquisition unit 211 sends shooting request signals to the first imaging unit 130, the second imaging unit 140, and the third imaging unit 150, acquiring image signals of a first top-view image, a second top-view image, and a bottom-view image. The drive control unit 212 sends drive signals corresponding to control quantities to the head drive motor 111, the tool drive motor 121, and the marker drive motor 171, thereby moving the head 110, the engagement tool 120, the marker plate 172, and the third imaging unit 150 towards the target position. Additionally, drive signals are sent to the pickup mechanism 510 and the flipping mechanism 520, thereby pushing the semiconductor chip 310, which will become the target, upwards, or attracting and flipping the semiconductor chip 310.

[0113] The calibration control unit 213 controls the image acquisition unit 211 or the drive control unit 212, etc., and thereby calculates the calibration value for each assumed mounting height of the mounting predetermined area based on the top-view image and the bottom-view image output by the top-view imaging unit and the bottom-view imaging unit, which are configured to match the mounting height. Specifically, the calibration control unit 213 adjusts the position of the marker plate 172 so that the calibration mark 173 and the mounting predetermined area of ​​the semiconductor chip 310 are on the same plane, and adjusts the position of the head 110 so that the focal plane 110a of the top-view imaging unit is also on the same plane as the mounting predetermined area. In addition, if the position of the marker plate 172 is adjusted as described above, the focal plane 150a of the bottom-view imaging unit is also on the same plane as the mounting predetermined area, so after the adjustment, the bottom-view imaging unit captures the calibration mark 173.

[0114] The bonding control unit 214 is an example of an installation control unit. Based on the image acquisition unit 211 and the drive control unit 212, a bottom-view image is captured by a bottom-view imaging unit and output to the bonding tool 120, identifying the reference position of the semiconductor chip 310. At this time, the bonding control unit 214 adjusts the position of the bonding tool 120 so that the predetermined contact surface of the semiconductor chip 310 that contacts the predetermined placement area becomes equal to the placement height of the predetermined placement area. Additionally, adjustments are made so that the focal plane 150a of the bottom-view imaging unit also becomes equal to the placement height of the predetermined placement area. Next, the bonding tool 120 places and bonds the semiconductor chip 310 to the predetermined placement area, so that the reference position matches the target position determined based on a top-view image captured by a top-view imaging unit of the predetermined placement area where the semiconductor chip 310 is to be placed and the calibration value. At this time, the engagement control unit 214 adjusts the position of the head 110 so that the focal plane 110a of the overhead shooting unit becomes equal to the mounting height of the predetermined mounting area. The specific control and processing of the calibration control unit 213 and the engagement control unit 214 will be described in detail later.

[0115] Figure 3 This is an explanatory diagram illustrating the Sham optical system used in the first imaging unit 130. The second imaging unit 140 also uses the same Sham optical system, but the Sham optical system of the first imaging unit 130 is described here as representative.

[0116] exist Figure 3In this embodiment, plane S1 is the focal plane 110a parallel to the stage surface of stage 190. Imaginary plane S2 is the plane containing the principal plane of the first optical system 131, which comprises the object-side lens group 131a and the image-side lens group 131b as structural groups. Plane S3 is the plane containing the light-receiving surface of the first imaging element 132. In this embodiment, the Sham optical system includes the first optical system 131 and the first imaging element 132 configured to satisfy the Sham condition. The configuration satisfying the Sham condition means that plane S1, imaginary plane S2, and imaginary plane S3 intersect each other on a common straight line P.

[0117] Aperture 133 is positioned between the object-side lens group 131a and the image-side lens group 131b, restricting the amount of light passing through. The depth of field D can be adjusted by the diameter of aperture 133. P Therefore, as long as the first predetermined surface 330a or the second predetermined surface 330b is within the depth of field, the first imaging unit 130 can capture the following reference mark or stacked reference mark in a focused state. In this sense, the position control that makes the focal surface 110a coincide with the first predetermined surface 330a and the second predetermined surface 330b only needs to be within the depth of field D. P Within the specified range, offset is allowed.

[0118] The second shooting unit 140 has the same structure as the first shooting unit 130 and is symmetrically arranged on the head 110 with respect to the YZ plane containing the central axis of the joining tool 120. Therefore, the second shooting unit 140, like the first shooting unit 130, can also be marked with a focus state shooting mount reference mark or a stacking reference mark. The focal plane of the first shooting unit 130 and the focal plane of the second shooting unit 140 preferably coincide at the focal plane 110a, but even if there is a misalignment, as long as a portion of their depth of field overlaps, they can both be marked with a focus state shooting mount reference mark or a stacking reference mark.

[0119] Furthermore, by employing a camera unit with a SAM optical system, it is possible to observe the bonding tool 120 from directly below at an oblique angle. Therefore, even with the semiconductor chip 310 held above the bonding tool 120 and the bonding tool 120 moved directly above the designated placement area, the designated placement area can be observed using a top-view camera unit. In other words, the bonding tool 120 can be moved directly above the designated placement area, and the target position for placing the semiconductor chip 310 can be determined based on the top-view image output by the top-view camera unit. In this way, only the semiconductor chip 310 needs to be moved from the aforementioned position to the target position, thus significantly suppressing movement of the head 110 and the bonding tool 120, thereby reducing positional shifts associated with movement and shortening preparation time.

[0120] However, it is known that, given the characteristics of the configuration of the optical system or imaging element in the imaging unit employing the Sham optical system, even a slight displacement of the optical system or imaging element due to changes in the ambient temperature will cause the output image to shift in the planar direction. In other words, the image is known to shift due to the temperature of the surrounding environment. This phenomenon causes errors in the target position of the semiconductor chip 310 when determining it based on a top-view image, thus hindering the high-precision bonding of the semiconductor chip to its original target position. Particularly when the bonding tool 120 includes a heater 124 for heating the semiconductor chip 310, the temperature variation around the Sham optical system becomes greater. Furthermore, in stacked chip mounting or 2.5D mounting, where other semiconductor chips are superimposed on top of a semiconductor chip bonded to a substrate, the height of the mounting surface of each semiconductor chip varies. In this case, the issue of varying error amounts for each height becomes apparent.

[0121] Therefore, in this embodiment, a calibration process is performed at a predetermined time point assuming changes in the ambient temperature. For the same object under observation, a calibration value is calculated to calibrate the difference between the coordinate values ​​calculated based on the top view image and the coordinate values ​​calculated based on the bottom view image at each predetermined placement height. Next, in the bonding process where the semiconductor chip 310 is bonded to a target position within the predetermined placement area, the precise target position is determined using any calibration value calculated through the calibration process. The calibration process and the bonding process will be described sequentially below.

[0122] The calibration process is performed by the calibration control unit 213. The calibration control unit 213 first causes the first imaging unit 130, the second imaging unit 140, and the third imaging unit 150 to capture images of the calibration mark 173. Figure 4 This diagram shows the situation where the calibration mark 173, which is adjusted to the height of the first predetermined surface 330a, is captured by three shooting units.

[0123] As shown in the figure, when the calibration control unit 213 starts the calibration process, it drives the mark drive motor 171 via the drive control unit 212, thereby moving the mark plate 172 into the field of view of the third imaging unit 150. When the mark plate 172 moves into the field of view of the third imaging unit 150, the calibration mark 173 provided on the mark plate 172 is located approximately at the center relative to the field of view of the third imaging unit 150, which is fixed on the support platform 174. Furthermore, the calibration control unit 213 drives the mark drive motor 171 to adjust the up and down lever 175 so that the printed surface of the calibration mark 173 is aligned with the first predetermined surface 330a, which is the mounting surface of the first semiconductor chip 310a. At this time, the focal surface 150a of the third imaging unit 150 is also aligned with the first predetermined surface 330a.

[0124] Next, the calibration control unit 213 drives the head drive motor 111 via the drive control unit 212, thereby moving the head 110 so that the focal plane 110a of the top-view imaging unit is aligned with the first predetermined plane 330a and the calibration mark 173 is positioned directly below the joining tool 120. Furthermore, the joining tool 120 is withdrawn to a position that does not enter the field of view of the top-view imaging unit.

[0125] With the components configured as described above, the calibration control unit 213 acquires a first top-view image from the first imaging unit 130, a second top-view image from the second imaging unit 140, and a bottom-view image from the third imaging unit 150 via the image acquisition unit 211. Next, based on the image coordinates of the calibration mark 173 captured in the first and second top-view images, the three-dimensional coordinates (X, Y, Z) of the calibration mark 173 are calculated. hra Y hra Z hra Additionally, based on the image coordinates of the calibration mark 173 captured in the bottom-view image, the three-dimensional coordinates (X, Y, Z) of the calibration mark 173 are calculated. sra Y sra Z sra As long as the overhead camera unit remains unaffected by changes in ambient temperature and maintains the state where the coordinates between the camera units were accurately adjusted in the initial state of the coupling device 100, it should at least become X. hra =X sra Y hra =Y sra .

[0126] However, as described above, when the joining device 100 is first used and some time has passed, the three-dimensional coordinates calculated from the top view image will contain errors due to the temperature changes in the surrounding environment. Therefore, (ΔXa, ΔYa) as said errors are used as the first calibration value for the first predetermined surface 330a. Specifically, the error is expressed in the form of a difference, which can be set as ΔXa = X sra -X hra ΔYa=Y sra -Y hra As long as the first calibration value for the first predetermined surface 330a is calculated in advance as described above, and then an observation object on the first predetermined surface 330a is photographed by the top-view imaging unit, the three-dimensional coordinates calculated based on the top-view image are (X... hta Y hta Z hta Then, the first calibration value can be added to correct it to (X). hta +ΔXa、Y hta +ΔYa、Z htaIt can be said that the corrected coordinate values ​​have no error relative to the coordinate values ​​calculated from the bottom-view image obtained by shooting the same object from a low-angle view using an upward-viewing camera unit. The calibration control unit 213 stores the first calibration value calculated as described above in the storage unit 220 as calibration data 221.

[0127] The calibration control unit 213 then calculates a second calibration value for the second predetermined surface 330b, which is the mounting surface on which the second semiconductor chip 310b is placed. In this embodiment, the second predetermined surface 330b is the upper surface of the first semiconductor chip 310a bonded to the lead frame 330. Figure 5 This diagram shows the situation where the three shooting units are shooting at the calibration mark adjusted to the height of the second predetermined surface 330b.

[0128] The calibration control unit 213 adjusts the calibration by driving the mark drive motor 171 to raise the lever 175, so that the printed surface of the calibration mark 173 is aligned with the mounting surface of the second semiconductor chip 310b, i.e., the second predetermined surface 330b. At this time, the focal plane 150a of the third imaging unit 150 is also aligned with the second predetermined surface 330b. Next, the calibration control unit 213 drives the head drive motor 111 via the drive control unit 212, thereby raising the head 110 so that the focal plane 110a of the top-view imaging unit is aligned with the second predetermined surface 330b.

[0129] With the components configured as described above, the calibration control unit 213 acquires a first top-view image from the first imaging unit 130, a second top-view image from the second imaging unit 140, and a bottom-view image from the third imaging unit 150 via the image acquisition unit 211. Next, based on the image coordinates of the calibration mark 173 captured in the first and second top-view images, the three-dimensional coordinates (X, Y, Z) of the calibration mark 173 are calculated. hrb Y hrb Z hrb Additionally, based on the image coordinates of the calibration mark 173 captured in the bottom-view image, the three-dimensional coordinates (X, Y, Z) of the calibration mark 173 are calculated. srb Y srb Z srb ).

[0130] Similarly, if the calibration value for the second predetermined surface 330b is set as the second calibration value (ΔXb, ΔYb), then it can be set as ΔXb = X srb -X hrb ΔYb=Y srb -Y hrbAs long as the second calibration value for the second predetermined surface 330b is calculated in advance as described above, and then an observation object on the second predetermined surface 330b is photographed by the top-view imaging unit, the three-dimensional coordinates calculated based on the top-view image are (X... htb Y htb Z htb Then, after adding the second calibration value, it can be corrected to (X). htb +ΔXb、Y htb +ΔYb、Z htb It can be said that the corrected coordinate values ​​have no error relative to the coordinate values ​​calculated from the bottom-view image obtained by temporarily photographing the same object using a bottom-view shooting unit. The calibration control unit 213 stores the second calibration value calculated as described above in the storage unit 220 as calibration data 221.

[0131] Before assessing that the ambient temperature may change further and require another calibration process, the calibration data 221 is referenced in the following bonding process. In other words, if it is assessed that another calibration process is required, the calibration control unit 213 repeats the process and updates the calibration value.

[0132] As an example where the evaluation indicates the need for further calibration, consider the timing when the bonding control unit 214 completes bonding a pre-set batch quantity of semiconductor chips 310. Specifically, the calibration control unit 213 may perform calibration processing at the timing when a new batch of semiconductor chips 310 is supplied to the chip supply device 500. For example, the first calibration value may be updated when the first semiconductor chip 310a of the new batch is supplied, and the second calibration value may be updated when the second semiconductor chip 310b of the new batch is supplied.

[0133] Alternatively, the operation time of the joining operation performed by the joining control unit 214 can be used as a standard. For example, it can be specified that calibration processing is performed while the joining operation is continuously performed for 60 minutes. Furthermore, a temperature detection unit that detects the temperature of the overhead camera unit can be provided on the head 110, and the temperature detection unit detects a preset temperature at a certain time. Specifically, multiple temperatures are preset, and calibration processing is performed when the ambient temperature is detected to have changed beyond any of the preset temperatures. By updating the calibration value as described above, the error of the coordinate values ​​calculated from the overhead image can be controlled within a certain range throughout the continuous joining process.

[0134] The bonding process is performed by the bonding control unit 214. The bonding control unit 214 first picks up the semiconductor chip 310 that is the target. Figure 6 This diagram illustrates the situation where the bonding tool 120 picks up the first semiconductor chip 310a.

[0135] The bonding control unit 214 drives the head drive motor 111 via the drive control unit 212, thereby moving the head 110 to the upper part of the chip supply device 500, and driving the tool drive motor 121, thereby lowering the bonding tool 120. Simultaneously, the pick-up mechanism 510 pushes a first semiconductor chip 310a, which is the bonding target, placed in the semiconductor chip 310 of the chip supply device 500 toward the flipping mechanism 520, which attracts the first semiconductor chip 310a and flips it. Next, the lowered bonding tool 120 attracts and picks up the first semiconductor chip 310a via the chuck 122, causing the bonding tool 120 to rise.

[0136] When the sign plate 172 is within the field of view of the third imaging unit 150, the engagement control unit 214 removes the sign plate 172 from the field of view of the third imaging unit 150 before or after the engagement tool 120 picks up the first semiconductor chip 310a. Specifically, the engagement control unit 214 drives the sign drive motor 171 via the drive control unit 212, thereby moving the sign plate 172. Furthermore, when the focal plane 150a of the third imaging unit 150 is not aligned with the first predetermined plane 330a, the drive control unit 212 drives the sign drive motor 171, thereby moving the lever 175 up and down to align the focal plane 150a with the first predetermined plane 330a.

[0137] Next, the bonding control unit 214 causes the third imaging unit 150 to capture images of the first semiconductor chip 310a adsorbed by the bonding tool 120. Figure 7 This diagram illustrates the situation where the third imaging unit 150 captures images of the first semiconductor chip 310a adsorbed onto the bonding tool 120.

[0138] The bonding control unit 214 drives the head drive motor 111 via the drive control unit 212, thereby moving the head 110 so that the focal plane 110a of the top-view imaging unit aligns with the first predetermined plane 330a, and the third imaging unit 150 is positioned directly below the bonding tool 120. Next, the drive tool drive motor 121 lowers the bonding tool 120 so that the contact predetermined plane of the held first semiconductor chip 310a that contacts the lead frame 330 aligns with the first predetermined plane 330a. After this configuration adjustment is completed, the bonding control unit 214 causes the third imaging unit 150 to capture images of the first semiconductor chip 310a held in the bonding tool 120 via the image acquisition unit 211.

[0139] Figure 8This diagram schematically illustrates a bottom-view image captured by the third imaging unit 150 and output from the first semiconductor chip 310a held in the bonding tool 120. Furthermore, each subject image in the diagram is directly labeled with its corresponding subject number for explanation.

[0140] As described above, the bonding tool 120 uses the chuck 122 to pick up and hold the semiconductor chips 310 (first semiconductor chip 310a, second semiconductor chip 310b) prepared by the chip supply device 500. At this time, assuming the bonding tool 120 picks up the center of the semiconductor chip 310 in a predetermined direction, there are actually cases where the semiconductor chip is picked up with an offset. Therefore, the bonding control unit 214 confirms the actual orientation and position of the semiconductor chip 310, identifying the reference position for placing the semiconductor chip 310 on the lead frame 330.

[0141] Figure 8 The bottom-view image shown is an image obtained by the third imaging unit 150 from a bottom-view perspective when photographing the first semiconductor chip 310a. Therefore, the clamp 122 holding the first semiconductor chip 310a is also photographed. Therefore, the engagement control unit 214 calculates the image coordinates of the clamp center 123 by examining the circle that forms the outline of the clamp 122.

[0142] Furthermore, in this embodiment, a chip reference mark 311a is provided on the predetermined contact surface of the first semiconductor chip 310a that contacts the lead frame 330. The bonding control unit 214 calculates the image coordinates of the chip reference mark 311a captured in the bottom view image. The bonding control unit 214 can identify the actual orientation and position of the first semiconductor chip 310a relative to the chuck 122 based on the image coordinates of the chuck center 123 calculated as described above and the image coordinates of the chip reference mark 311a. For example, if the position where the chip reference mark 311a is provided is taken as the reference position for placing the first semiconductor chip 310a in the predetermined placement area of ​​the lead frame 330, the bonding control unit 214 can calculate the three-dimensional coordinates of the reference position of the first semiconductor chip 310a at the time the bottom view image is captured. Therefore, even if the bonding tool 120 or the head 110 moves subsequently, as long as the chuck 122 continues to hold the first semiconductor chip 310a, the three-dimensional coordinates of the reference position can be tracked.

[0143] When the bonding control unit 214 identifies the three-dimensional coordinates of the reference position, the drive tool drive motor 121 raises the bonding tool 120 until the held first semiconductor chip 310a exits the field of view of the overhead imaging unit. Next, the drive head drive motor 111 moves the head 110 so that the bonding tool 120 is subsequently positioned directly above the predetermined placement area for the first semiconductor chip 310a, i.e., the chip holder, and the focal plane 110a of the overhead imaging unit aligns with the first predetermined plane 330a. Furthermore, the raising of the bonding tool 120 and the movement of the head 110 can be performed simultaneously.

[0144] Figure 9 This diagram illustrates the situation where, with the head 110 and the joining tool 120 configured as described above, the first imaging unit 130 and the second imaging unit 140 capture images of the predetermined area mounted on the lead frame 330. Additionally, Figure 10 yes Figure 9 A partial perspective view. In this embodiment, the lead frame 330 will be cut out and housed in a package in the future. Each unit region 322 has a chip holder 320. The chip holder 320 shown is a predetermined mounting area for mounting the first semiconductor chip 310a. In addition, a holder reference mark 321 indicating the reference position is provided in each unit region 322.

[0145] In such Figure 9 and Figure 10 In that configuration, the first imaging unit 130 and the second imaging unit 140 can respectively capture the chip holder 320 and the reference mark 321 contained in the same unit area 322 within their field of view and take pictures in a focused state. The bonding control unit 214 uses the first top view image output by the first imaging unit 130 and the second top view image output by the second imaging unit 140 to calculate the coordinates of the target position where the reference position should match when the first semiconductor chip 310a is placed on the chip holder 320.

[0146] Figure 11 This diagram illustrates the sequence up to calculating the target coordinates of the first semiconductor chip 310a based on the first and second top view images. The first imaging unit 130 captures images of the chip socket 320 from the side of the socket reference mark 321, so that the unit area 322 is captured in the first top view image, which is the output image of the chip socket 320, in a trapezoidal shape expanding towards the socket reference mark 321. Conversely, the second imaging unit 140 captures images of the chip socket 320 from the opposite side of the socket reference mark 321, so that the unit area 322 is captured in the second top view image, which is the output image of the chip socket 320, in a trapezoidal shape narrowing towards the socket reference mark 321.

[0147] The engagement control unit 214 determines the image coordinates (x, y, x) of the base reference mark 321 based on the first top view image. 1k y 1k Additionally, the image coordinates (x, y) of the reference mark 321 are determined based on the second top-view image. 2k y 2k Next, by referring to, for example, a change table that converts image coordinates into three-dimensional coordinates, the marker coordinates (X) of the three-dimensional coordinates serving as the reference mark 321 are calculated based on the image coordinates. k Y k Z k The coordinate values ​​of the marker coordinates are temporary target positions used to calculate the precise target position, and as mentioned above, they are subject to errors due to temperature variations in the surrounding environment. Therefore, corrections are made after reading the first calibration values ​​(ΔXa, ΔYa) from calibration data 221. The corrected marker coordinates (Xa, ΔYa) calculated as described above are expected. k +ΔXa、Y k +ΔYa、Z k The coordinates of the image are not in error relative to the spatial coordinates calculated from the bottom view image.

[0148] Since the relative position of the pre-set target position of the chip holder 320 and the holder reference mark 321 is known, the engagement control unit 214 can determine the corrected mark coordinates (X) based on the target position of the chip holder 320 and the relative position of the chip holder reference mark 321. k +ΔXa、Y k +ΔYa、Z k ) Accurately calculate the coordinates (X) of the target location. Ta Y Ta Z Ta ).

[0149] After determining the coordinates of the target location, the first semiconductor chip 310a is placed and bonded to the target location. Figure 12 This diagram illustrates the situation where the bonding tool 120 places and bonds the first semiconductor chip 310a to the target location.

[0150] As described above, the bonding control unit 214 tracks the movement of the bonding tool 120 or the head 110 to grasp the three-dimensional coordinates of the reference position of the first semiconductor chip 310a, causing the first semiconductor chip 310a to move so that the reference position matches the target position of the chip holder 320. Specifically, the drive control unit 212 drives the head drive motor 111, thereby fine-tuning the position of the head 110 in the XY direction, and drives the tool drive motor 121, thereby fine-tuning the rotation of the bonding tool 120 around the Z-axis. Next, with the X and Y coordinates of the reference position coinciding with the X and Y coordinates of the target position, the bonding tool 120 is lowered to place the first semiconductor chip 310a onto the chip holder 320. Then, the first semiconductor chip 310a is pressed using the front end of the chuck 122 and heated using the heater 124, thus bonding the first semiconductor chip 310a to the chip holder 320.

[0151] In this embodiment, if using Figure 4 As explained, the focal plane 110a of the top-view imaging unit and the printed surface of the calibration mark 173 are aligned with the first predetermined surface 330a, and a first calibration value is calculated. That is, the Z-direction position of the head 110 when calculating the first calibration value is the same as the Z-direction position of the head 110 when the top-view imaging unit captures the chip reference mark 311a. Furthermore, if using... Figure 7 and Figure 8 As explained, the contact predetermined surface of the first semiconductor chip 310a held in the chuck 122 is aligned with the first predetermined surface 330a, and the three-dimensional coordinates of the chip reference mark 311a are calculated. That is, the Z-direction position of the bonding tool 120 when calculating the three-dimensional coordinates of the chip reference mark 311a is the same as the Z-direction position of the bonding tool 120 when the first semiconductor chip 310a is placed on the chip holder 320.

[0152] Therefore, there is no need to consider the potential errors in the actual and identified three-dimensional coordinates relative to the XY directions that might arise from moving the head 110 or engagement tool 120 in the Z direction. For example, in Figure 9 In this state, the bonding tool 120 holds the first semiconductor chip 310a and exits from the field of view of the overhead camera unit. However, there is a possibility that the actual reference position's X and Y coordinates in this state may not be consistent with the X and Y coordinates recognized by the bonding control unit 214 due to factors such as the gaps between components of the moving mechanism of the bonding tool 120. However, as Figure 12In this way, the height of the bonding tool 120 when the first semiconductor chip 310a is placed on the first predetermined surface 330a becomes the same as the height of the bonding tool 120 when the three-dimensional coordinates of the chip reference mark 311a are calculated, and the error factor caused by the moving mechanism is eliminated. That is, the X and Y coordinates of the actual reference position when the first semiconductor chip 310a is placed on the first predetermined surface 330a become consistent with the X and Y coordinates recognized by the bonding control unit 214. From this point of view, when the first calibration value is calculated, it is effective to make the focal surface 110a and the printed surface of the calibration mark 173 consistent with the first predetermined surface 330a; when the three-dimensional coordinates of the chip reference mark 311a are calculated, it is effective to make the contact predetermined surface of the first semiconductor chip 310a consistent with the first predetermined surface 330a.

[0153] Figure 13 This diagram shows the situation where the bonding tool 120 is withdrawn. As shown, after the bonding of the first semiconductor chip 310a is completed, the bonding control unit 214 drives the tool drive motor 121 via the drive control unit 212, thereby causing the bonding tool 120 to rise.

[0154] Next, the bonding control unit 214 begins the process of stacking and bonding the second semiconductor chip 310b to the first semiconductor chip 310a, which has already been bonded. The bonding control unit 214 works in conjunction with... Figure 6 Similarly, the picking of the first semiconductor chip 310a is achieved by the picking mechanism 510 and the flipping mechanism 520 flipping a second semiconductor chip 310b, which is a bonding object, placed in the semiconductor chip 310 of the chip supply device 500, and then picking up the second semiconductor chip 310b by the chuck 122.

[0155] Figure 14 This diagram illustrates the situation where the third imaging unit 150 captures images of the second semiconductor chip 310b adsorbed onto the bonding tool 120. As shown in the diagram, the bonding control unit 214 raises the lever 175 so that the focal plane 150a of the third imaging unit 150 aligns with the predetermined placement surface of the second semiconductor chip 310b, namely the second predetermined surface 330b, thereby making the focal plane 150a and the second predetermined surface 330b consistent.

[0156] Next, the drive head drive motor 111 is driven by the drive control unit 212, thereby moving the head 110 so that the focal plane 110a of the top-view imaging unit aligns with the second predetermined plane 330b, and the third imaging unit 150 is positioned directly below the bonding tool 120. Next, the drive tool drive motor 121 is driven by the drive tool, thereby lowering the bonding tool 120 so that the contact predetermined plane and the second predetermined plane 330b, which are in contact with the first semiconductor chip 310a (which is the object of the stack), are aligned. After this configuration adjustment is completed, the bonding control unit 214, via the image acquisition unit 211, causes the third imaging unit 150 to capture images of the second semiconductor chip 310b held in the bonding tool 120.

[0157] Figure 15 This diagram schematically illustrates a bottom-view image captured by the third imaging unit 150 and output from the second semiconductor chip 310b held in the bonding tool 120. Similar to the first semiconductor chip 310a, the bonding control unit 214 also identifies the adsorption position and orientation relative to the chuck 122 for the second semiconductor chip 310b, thus determining the reference position for placing the second semiconductor chip 310b on the first semiconductor chip 310a.

[0158] The engagement control unit 214 detects the circle that forms the outline of the chuck 122, and thereby calculates the image coordinates of the chuck center 123. Furthermore, in this embodiment, the second semiconductor chip 310b has a chip reference mark 311b provided on the predetermined contact surface that contacts the first semiconductor chip 310a. The engagement control unit 214 calculates the image coordinates of the chip reference mark 311b captured in the bottom view image. Based on the image coordinates of the chuck center 123 and the chip reference mark 311b calculated as described above, the engagement control unit 214 can identify the actual orientation and position of the second semiconductor chip 310b relative to the chuck 122. Therefore, even if the engagement tool 120 or the head 110 subsequently moves, as long as the chuck 122 continues to hold the second semiconductor chip 310b, the three-dimensional coordinates of the reference position can be tracked.

[0159] After the joining control unit 214 identifies the three-dimensional coordinates of the reference position, it drives the tool drive motor 121, thereby raising the joining tool 120 until the second semiconductor chip 310b being held is out of the field of view of the overhead imaging unit. Next, the drive head drive motor 111 moves the head 110 so that the joining tool 120 is then directly above the object on which the second semiconductor chip 310b is placed, namely the first semiconductor chip 310a, and the focal plane 110a of the overhead imaging unit is aligned with the second predetermined plane 330b. Furthermore, the raising of the joining tool 120 and the movement of the head 110 can be performed in parallel.

[0160] Figure 16 This diagram illustrates the situation where, with the head 110 and the bonding tool 120 configured as described above, the first imaging unit 130 and the second imaging unit 140 capture images of a predetermined area on the first semiconductor chip 310a. In this configuration, both the first imaging unit 130 and the second imaging unit 140 can capture the predetermined area on the first semiconductor chip 310a (the target chip) within their field of view and capture images in focus. The bonding control unit 214 uses the first top-view image output by the first imaging unit 130 and the second top-view image output by the second imaging unit 140 to calculate the coordinates of a target position that should align with the reference position when the second semiconductor chip 310b is placed on the first semiconductor chip 310a.

[0161] Figure 17 This diagram illustrates the sequence up to the point where the target coordinates of the second semiconductor chip 310b are calculated based on the first and second top view images. As shown, the first semiconductor chip 310a, which is being stacked, has been bonded to a unit area 322 on the lead frame 330. The stacking reference mark 323, indicating the reference position, is captured on the upper surface of the first semiconductor chip 310a in both the first and second top view images.

[0162] The joining control unit 214 determines the image coordinates (x, y, x) of the stacking reference mark 323 based on the first top view image. 1j y 1j Additionally, the image coordinates (x, y) of the overlay reference mark 323 are determined based on the second top view image. 2j y 2j Next, the marker coordinates (X) of the three-dimensional coordinates of the reference mark 321 are calculated based on the image coordinates. j Y j Z j The coordinate values ​​of the marker coordinates are temporary target positions used to calculate the precise target position, and as mentioned above, they are subject to errors due to temperature variations in the surrounding environment. Therefore, corrections are made after reading the first calibration values ​​(ΔXb, ΔYb) from calibration data 221. The corrected marker coordinates (Xb, ΔYb) calculated as described above are expected to be obtained. j +ΔXb、Y j +ΔYb、Z j The coordinates of the target position on the first semiconductor chip 310a are without error relative to the spatial coordinates calculated from the bottom view image. Since the relative position of the target position on the first semiconductor chip 310a and the stacking reference mark 323 is known, the bonding control unit 214 can determine the corrected mark coordinates (X...) based on the target position. j +ΔXb、Y j +ΔYb、Z j) Accurately calculate the coordinates (X) of the target location. Tb Y Tb Z Tb ).

[0163] After determining the coordinates of the target location, the second semiconductor chip 310b is placed and bonded to the target location. Figure 18 This diagram illustrates the situation where the bonding tool 120 places and bonds the second semiconductor chip 310b to the target position of the first semiconductor chip 310a.

[0164] As described above, the bonding control unit 214 tracks the three-dimensional coordinates of the reference position of the second semiconductor chip 310b relative to the movement of the bonding tool 120 or the head 110, causing the second semiconductor chip 310b to move so that the reference position matches the target position of the first semiconductor chip 310a. Specifically, the drive control unit 212 drives the head drive motor 111, thereby fine-tuning the position of the head 110 in the XY direction, and drives the tool drive motor 121, thereby fine-tuning the rotation of the bonding tool 120 around the Z-axis. Next, with the X and Y coordinates of the reference position coinciding with the X and Y coordinates of the target position, the bonding tool 120 is lowered to place the second semiconductor chip 310b onto the first semiconductor chip 310a. Then, pressure is applied to the second semiconductor chip 310b using the front end of the chuck 122, and heating is applied using the heater 124, thus bonding the second semiconductor chip 310b to the first semiconductor chip 310a.

[0165] In this embodiment, if using Figure 5 As explained, the focal plane 110a of the top-view imaging unit and the printed surface of the calibration mark 173 are aligned with the second predetermined surface 330b, and a second calibration value is calculated. That is, the Z-direction position of the head 110 when calculating the second calibration value is the same as the Z-direction position of the head 110 when the top-view imaging unit captures the chip reference mark 311b. Furthermore, if using... Figure 14 and Figure 15 As explained, the contact predetermined surface of the second semiconductor chip 310b held in the chuck 122 is aligned with the second predetermined surface 330b, and the three-dimensional coordinates of the chip reference mark 311b are calculated. That is, the Z-direction position of the bonding tool 120 when calculating the three-dimensional coordinates of the chip reference mark 311b is the same as the Z-direction position of the bonding tool 120 when the second semiconductor chip 310b is placed on the first semiconductor chip 310a.

[0166] Therefore, there is no need to consider the errors between the actual and identified three-dimensional coordinates relative to the XY directions that may occur when the head 110 or the engagement tool 120 is moved in the Z direction. For example, in Figure 16 In this state, the bonding tool 120 keeps the second semiconductor chip 310b out of the field of view of the overhead camera unit. However, there is a possibility that the actual reference position's X and Y coordinates in this state may not be consistent with the X and Y coordinates recognized by the bonding control unit 214 due to factors such as the gaps between components of the moving mechanism of the bonding tool 120. However, as Figure 18 As shown, the height of the bonding tool 120 when the second semiconductor chip 310b is placed on the second predetermined surface 330b becomes the same as the height of the bonding tool 120 when the three-dimensional coordinates of the chip reference mark 311b are calculated, thus eliminating the error factor caused by the moving mechanism. In other words, the X and Y coordinates of the actual reference position when the second semiconductor chip 310b is placed on the second predetermined surface 330b are consistent with the X and Y coordinates identified by the bonding control unit 214. From this perspective, when calculating the second calibration value, it is effective to make the printing surface of the focal plane 110a and the calibration mark 173 consistent with the second predetermined surface 330b; and when calculating the three-dimensional coordinates of the chip reference mark 311b, it is effective to make the contact predetermined surface of the second semiconductor chip 310b consistent with the second predetermined surface 330b.

[0167] After the bonding of the second semiconductor chip 310b is completed, the bonding control unit 214 drives the tool drive motor 121 via the drive control unit 212, thereby raising the bonding tool 120. When further bonding of new semiconductor chips 310 (first semiconductor chip 310a, second semiconductor chip 310b), it returns to the starting position. Figure 6 The process is repeated in the same state.

[0168] Then, the entire bonding sequence, including the calibration and bonding processes described above, is summarized along the flowchart. Figure 19 This is a flowchart illustrating the bonding sequence of semiconductor chip 310.

[0169] In step S11, the calibration control unit 213 initiates the calibration control step for which calibration processing should be performed. Details will be explained later as a sub-process. Furthermore, if the engagement process begins from an initial state where the coordinates between the imaging units have been accurately adjusted, the initial calibration control step can be skipped.

[0170] When calibration control unit 213 finishes executing the calibration control steps, it proceeds to step S12, and engagement control unit 214 begins the engagement control steps for which engagement processing should be performed. Details will be explained later as a sub-process.

[0171] When the engagement control unit 214 finishes executing the engagement control step, it proceeds to step S13, where the calibration control unit 213 determines whether the state of the engagement device 100 at the specified time point meets the conditions of the preset calibration time point. As the conditions for the preset calibration time point, conditions that are considered to require another calibration process are set. For example, as described above, the number of batches processed, the operation time of the engagement operation, and the temperature detected by the temperature detection unit become candidates for the set conditions.

[0172] In step S13, if the calibration control unit 213 determines that the conditions are met, it returns to step S11. If the conditions are not met, it proceeds to step S14. In step S14, the bonding control unit 214 determines whether all predetermined bonding processes have been completed. If it determines that there are still semiconductor chips 310 that need bonding processes, it returns to step S12; if it determines that all bonding processes have been completed, it ends the series of processes.

[0173] Figure 20 This is a sub-flowchart illustrating the sequence of calibration control steps. The main actions performed in the calibration control steps are... Figure 4 and Figure 5 The process described above. In step S1101, the calibration control unit 213 substitutes "1" into the counter n. Next, in step S1102, the marker plate 172 is moved so that the calibration marker 173 is placed in the center of the field of view of the third imaging unit 150.

[0174] In step S1103, the calibration control unit 213 adjusts the height of the third imaging unit 150 and the calibration mark 173 so that the focal plane 150a of the third imaging unit 150 and the printed surface of the calibration mark 173 are aligned with the nth predetermined surface. For example, the adjustment is made so that if n=1, it is aligned with the first predetermined surface 330a. In the subsequent step S1104, the head 110 is moved so that the printed surface of the calibration mark 173 becomes the focal plane 110a of the first imaging unit 130 and the second imaging unit 140, and the calibration mark 173 is positioned directly below the joining tool 120.

[0175] In step S1105, the calibration control unit 213 causes each imaging unit to capture images via the image acquisition unit 211, acquiring a first top-view image from the first imaging unit 130, a second top-view image from the second imaging unit 140, and a bottom-view image from the third imaging unit 150. Next, in subsequent step S1106, the three-dimensional coordinates of the calibration mark 173 are calculated based on the image coordinates of the images of the calibration mark 173 captured in the first and second top-view images, respectively. The three-dimensional coordinates of the calibration mark 173 are also calculated based on the image of the calibration mark 173 captured in the bottom-view image. The calibration control unit 213 calculates the difference in the XY plane direction of each of the three-dimensional coordinates as described above, using it as the nth calibration value for the nth predetermined surface. The calculated calibration value is stored as calibration data 221 in the storage unit 220.

[0176] The calibration control unit 213 proceeds to step S1107, incrementing the counter n. Next, in step S1108, it checks whether the incremented counter n exceeds the predetermined total number of layers n0. In this embodiment, a first semiconductor chip 310a is bonded to the lead frame 330 to form the first layer, and a second semiconductor chip 310b is bonded to it to form the second layer; therefore, the predetermined total number of layers is "2". If the counter n does not exceed the predetermined total number of layers n0, it returns to step S1103 to calculate the nth calibration value corresponding to the incremented n. If the counter n exceeds the predetermined total number of layers n0, it proceeds to step S1109.

[0177] In step S1109, the calibration control unit 213 moves the marker plate 172, causing the calibration marker 173 to exit the field of view of the third imaging unit 150. After the calibration marker 173 is removed, the process returns to the main flow. Alternatively, the removal of the calibration marker 173 can also be performed in a subsequent bonding process.

[0178] Figure 21 This is a sub-flowchart illustrating the sequence of engagement control steps. In the engagement control steps, the main actions performed are... Figures 6 to 18 The process described. In step S1201, the engagement control unit 214 loads "1" into the counter n.

[0179] In step S1202, the head 110 is moved to the upper part of the chip supply device 500, and the bonding tool 120 is lowered. Next, the nth semiconductor chip, which is placed as the nth layer in the semiconductor chip 310 of the chip supply device 500, is flipped by the pick-up mechanism 510 and the flipping mechanism 520, and the nth semiconductor chip is picked up by the chuck 122. For example, if n=1, the first semiconductor chip 310a is picked up. After picking up the nth semiconductor chip, the bonding tool 120 is raised.

[0180] In step S1203, the bonding control unit 214 adjusts the height of the third imaging unit 150 so that the focal plane 150a of the third imaging unit 150 aligns with the nth predetermined plane. In subsequent step S1204, the head 110 is moved so that the nth predetermined plane becomes the focal plane 110a of the first imaging unit 130 and the second imaging unit 140, and the third imaging unit 150 is positioned directly below the bonding tool 120. Then, in step S1205, the bonding tool 120 is lowered so that the contact predetermined plane of the nth semiconductor chip that contacts the stacked object aligns with the nth predetermined plane.

[0181] After completing this configuration adjustment, in step S1206, the bonding control unit 214 causes the third imaging unit 150 to capture a picture of the predetermined contact surface of the nth semiconductor chip held in the bonding tool 120. Next, in step S1207, the bottom view image output by the third imaging unit 150 is acquired, and the three-dimensional coordinates of the reference position of the nth semiconductor chip are identified based on the image coordinates of the captured chip reference mark, etc.

[0182] In step S1208, the bonding control unit 214 raises the bonding tool 120 to a position where the held nth semiconductor chip is out of the field of view of the overhead imaging unit, and moves the head 110 so that the bonding tool 120 is subsequently directly above the predetermined placement area where the nth semiconductor chip is placed. In the subsequent step S1209, the height of the head 110 is adjusted so that the focal plane 110a of the overhead imaging unit is aligned with the nth predetermined plane.

[0183] After adjusting this configuration, in step S1210, the engagement control unit 214 causes the first imaging unit 130 and the second imaging unit 140 to capture images of the vicinity of the predetermined placement area containing reference marks such as the base reference mark 321 or the stacked reference mark 323. Next, in step S1211, the first top view image output by the first imaging unit 130 and the second top view image output by the second imaging unit 140 are acquired, and the three-dimensional coordinates of the target position are calculated based on the image coordinates of the captured reference marks and the nth calibration value, etc.

[0184] After determining the target position, step S1212 is initiated. The bonding control unit 214 moves the head 110 and the bonding tool 120 to align the reference position of the nth semiconductor chip with the target position, placing the nth semiconductor chip in the predetermined placement area. Then, pressure / heat is applied to the nth semiconductor chip to complete the bonding process. After the bonding of the nth semiconductor chip is completed, the bonding tool 120 is raised.

[0185] The bonding control unit 214 proceeds to step S1213, incrementing the counter n. Next, in step S1214, it is confirmed whether the incremented counter n exceeds the predetermined total number of layers n0. In this embodiment, a first semiconductor chip 310a is bonded to the lead frame 330 to form the first layer, and a second semiconductor chip 310b is bonded to it to form the second layer; therefore, the predetermined total number of layers is "2". If the counter n does not exceed the predetermined total number of layers n0, the process returns to step S1202, where the calculation of the nth calibration value corresponding to the incremented n is performed. If the counter n exceeds the predetermined total number of layers n0, the process returns to the main flow.

[0186] In the embodiment described above, the calibration process and the bonding process are separated. The calibration process is performed when the state of the bonding apparatus 100 meets the conditions of a preset calibration time point. Therefore, the calibration value calculated after one calibration process is performed is stored in the storage unit 220, and in the bonding process performed before the next calibration process, the calibration value is continuously referenced each time. However, the processing order can also be as follows: the calibration process is grouped into a series of bonding processes, and in the processing step of bonding each nth semiconductor chip, the nth calibration value is updated each time. Another embodiment as described above will be described below. Furthermore, in another embodiment below, the structure of the bonding apparatus itself is the same as in the embodiment described above, so its description is omitted, and the part with a different processing order will be mainly described.

[0187] Figure 22 This diagram illustrates, in another embodiment, the case where three imaging units capture images of the calibration mark 173, which is adjusted to the height of the first predetermined surface 330a. In this embodiment, a calibration process for calculating the nth calibration value is performed between the pickup process of the nth semiconductor chip and the imaging process of the nth semiconductor chip performed by the third imaging unit 150.

[0188] More specifically, Figure 22 This indicates the case where the chuck 122 holds the first semiconductor chip 310a, which is the object to be bonded, and then exits the field of view of the overhead imaging unit. The first semiconductor chip 310a held by the chuck 122, as shown by the dashed line, is subsequently mounted and bonded to a predetermined mounting area on the lead frame 330. Other cases are similar. Figure 4 The same applies to the three imaging units shown photographing the calibration mark 173. Specifically, the position of the head 110 is adjusted so that the focal plane 110a of the top-view imaging unit aligns with the first predetermined plane 330a and the printed surface of the calibration mark 173, and the height of the calibration mark 173 is adjusted to align with the first predetermined plane. Furthermore, the calibration mark 173 is positioned near the center of the field of view of each imaging unit.

[0189] The calibration control unit 213 calculates a first calibration value based on the first top-view image, the second top-view image, and the bottom-view image obtained by capturing images with each imaging unit, as described above. After the calibration control unit 213 calculates the first calibration value, the joining control unit 214 then lowers the joining tool 120 to perform the operation. Figure 7 The described process follows the imaging of the first semiconductor chip 310a by the third imaging unit 150. Furthermore, the process of calculating the first calibration value and the process of calculating the reference position of the first semiconductor chip 310a can be reversed. The first calibration value calculated in the calibration process, which is performed synchronously with the bonding process as described above, is limited to the positioning of the first semiconductor chip 310a to be bonded in the bonding process.

[0190] Similarly, in the case of bonding the second semiconductor chip 310b, a calibration process for calculating the second calibration value is performed between the pickup process of the second semiconductor chip 310b and the imaging process of the second semiconductor chip 310b performed by the third imaging unit 150. After the calibration control unit 213 calculates the second calibration value based on the first top view image, the second top view image, and the bottom view image obtained by each imaging unit, it then lowers the bonding tool 120 to perform the bonding process. Figure 14 The processing described is performed after the second semiconductor chip 310b is photographed by the third imaging unit 150. The second calibration value calculated in the calibration process, which is performed synchronously with the bonding process as described above, is limited to the positioning of the second semiconductor chip 310b to be bonded in the bonding process.

[0191] As described above, as long as the calibration control unit 213 and the engagement control unit 214 synchronize the processing of the third imaging unit 150 to capture the nth semiconductor chip, and each imaging unit captures the height-adjusted calibration mark and updates the nth calibration value, the time interval between the point in time to calculate the nth calibration value and the point in time to use the nth calibration value can be shortened. Therefore, more accurate positioning relative to temperature changes in the surrounding environment can be expected.

[0192] Figure 23 This is a flowchart illustrating the bonding sequence of semiconductor chips in other embodiments. (Regarding the use of...) Figures 19 to 21 Processing sequences with the same processing order are labeled with the same step numbers, thus omitting the description of their processing content. As described above, this embodiment incorporates the calibration processing into each bonding process; therefore, the main focus is on describing the processing flow.

[0193] In step S1201, the engagement control unit 214 substitutes "1" into the counter n. Then, in step S1202, the chuck 122 picks up and attaches the nth semiconductor chip, which is placed as the nth layer in the semiconductor chip 310 of the chip supply device 500. The calibration control unit 213 performs step S1102, either before, during, or concurrently with step S1201, moving the marker plate 172 to place the calibration mark 173 into the center of the field of view of the third imaging unit 150.

[0194] Next, in step S1103, the calibration control unit 213 adjusts the height of the third imaging unit 150 and the calibration mark 173 so that the focal plane 150a of the third imaging unit 150 and the printed surface of the calibration mark 173 are aligned with the nth predetermined surface. Then, in step S1104, the head 110 is moved so that the printed surface of the calibration mark 173 becomes the focal plane 110a of the first imaging unit 130 and the second imaging unit 140, and the calibration mark 173 is positioned directly below the joining tool 120.

[0195] In subsequent step S1105, the calibration control unit 213 causes the first imaging unit 130, the second imaging unit 140, and the third imaging unit 150 to perform imaging, and then calculates the nth calibration value in step S1106. After calculating the nth calibration value, the process proceeds to step S1109, whereby the calibration flag 173 is removed from the field of view of each imaging unit.

[0196] After calibration control unit 213 removes calibration flag 173, engagement control unit 214 executes step S1205, which lowers the predetermined contact surface of the nth semiconductor chip to align with the nth predetermined surface. From step S1205 to step S1212, the process is similar to using... Figure 21 The processing order described is the same. Furthermore, in step S1211, the calibration value used in the calculation of determining the target position is the nth calibration value calculated in step S1106, which was performed before step S1205.

[0197] When the engagement control unit 214 proceeds from step S1212 to step S1213, it increments the counter n. Next, in step S1214, it checks whether the incremented counter n exceeds the predetermined total number of stacks n0. If the counter n does not exceed the predetermined total number of stacks n0, it returns to step S1202 to calculate the nth calibration value corresponding to the incremented n. If the counter n exceeds the predetermined total number of stacks n0, it proceeds to step S14.

[0198] When the bonding control unit 214 enters step S14, it determines whether all predetermined bonding processes have been completed. If it determines that there are still semiconductor chips that need to be bonded, it returns to step S1201; if it determines that all bonding processes have been completed, it ends the series of processes.

[0199] In the embodiment described above, in order for each imaging unit to capture the calibration mark 173 under relatively good conditions, the calibration mark 173 is moved to the vicinity of the center of the field of view of each imaging unit. Therefore, during the joining process, it is necessary to remove the calibration mark 173 from the field of view of each imaging unit. In addition, in order to calculate the nth calibration value, it is necessary to align the printed surface of the calibration mark 173 with the nth predetermined surface.

[0200] Therefore, another embodiment that omits the exit operation and height adjustment operation of such calibration mark 173 will be described. Figure 24 This is a diagram illustrating the configuration of the calibration marks of the calibration unit 170' in another embodiment.

[0201] For example, each imaging unit can be configured to always display a calibration mark in the peripheral field of view if it includes an optical system in which peripheral aberrations do not become an error factor in position calculation. In other words, as long as it hardly affects the calculation of calibration values ​​and does not become an obstacle when the third imaging unit 150 captures images of the contact predetermined surface of the semiconductor chip during the bonding process, the calibration mark can also be permanently positioned in the peripheral field of view of each imaging unit.

[0202] The calibration unit 170' fixes a plurality of calibration marks corresponding to the nth predetermined surface in the periphery of the field of view of the third imaging unit 150. Specifically, for example, a first mark plate 172a is fixedly disposed in a region of the periphery of the field of view of the third imaging unit 150 so that its upper surface is aligned with the first predetermined surface, and a first calibration mark 173a is printed on the upper surface. A second mark plate 172b with a second calibration mark 173b printed on it or a third mark plate 172c with a third calibration mark 173c printed on it is also fixedly disposed in a region of the periphery of the field of view of the third imaging unit 150 so that it corresponds to the second predetermined surface and the third predetermined surface, respectively. In addition, the spacing of each calibration mark is adjusted so that the images in the top view and bottom view images captured by each imaging unit do not overlap with each other. In addition, the case where the predetermined total number of layers is "3" has been described here, but the calibration marks are set according to the predetermined total number of layers. By using the calibration unit 170' constructed as described above, the calibration mark removal operation and height adjustment operation can be omitted, thus helping to simplify the structure of the calibration unit and shorten the preparation time required for the connection process.

[0203] Furthermore, in the embodiment described above, the top-view imaging unit includes both the first imaging unit 130 and the second imaging unit 140. However, the top-view imaging unit may also be configured to include three or more imaging units, each employing a Sham optical system. Additionally, in the embodiment described above, the three-dimensional coordinates of the object are calculated using the parallax between the first and second top-view images, but the method is not limited to using the top-view imaging unit to calculate the three-dimensional coordinates. For example, it may be configured to have only one top-view imaging unit employing a Sham optical system, and other auxiliary means may be used. For example, a light-projecting section capable of pattern projection may be provided in the head 110, and the shape of the projection pattern observed on the viewing surface may be analyzed in the top-view image output by the top-view imaging unit to calculate the three-dimensional coordinates of the object. Furthermore, in this embodiment, a flip-chip bonding machine has been described, but it is not limited to this; it can also be applied to die bonding machines, surface mount machines for mounting electronic components onto substrates, and other mounting devices.

Claims

1. An installation device, comprising: The installation tool picks up and holds the mounting body, places it on and installs it on a substrate placed on a stage or on a predetermined placement area set relative to other mounting bodies already installed on the substrate. The overhead shooting unit configures the optical system and shooting element to meet the Sham condition so that a plane parallel to the platform surface of the platform becomes the focal plane, and is used to shoot the predetermined area of ​​the mounting from the same side as the mounting tool relative to the platform surface. An upward-viewing camera unit is used to take an upward-viewing photograph of the mount, which is held in the state of the mounting tool, from the side opposite to the downward-viewing camera unit relative to the platform surface. The calibration control unit calculates a calibration value to calibrate the difference between the coordinate values ​​calculated based on the top view image output by the top view camera unit and the coordinate values ​​calculated based on the bottom view image output by the bottom view camera unit. as well as The installation control unit places and installs the mounting body in the predetermined placement area, so that the reference position of the mounting body on the installation tool matches the target position of the predetermined placement area. The calibration control unit calculates the calibration value for each assumed mounting height of the predetermined mounting area based on the top-view image and the bottom-view image, which are output by the top-view shooting unit and the bottom-view shooting unit respectively, and the calibration marks configured to match the mounting height. The installation control unit adjusts the position of the installation tool so that the predetermined contact surface in the mounting body that contacts the predetermined placement area becomes the placement height. Based on the bottom view image captured by the bottom view imaging unit and output by the bottom view imaging unit, the reference position is identified. The position of the top view imaging unit is adjusted so that the focal plane and the placement height are the same plane. Based on the top view image obtained by the top view imaging unit capturing the predetermined placement area and the calibration value corresponding to the placement height, the target position is identified.

2. The installation device according to claim 1, comprising: The adjustment mechanism adjusts the calibration mark to the corresponding mounting height based on the calculated calibration value.

3. The installation device according to claim 1, wherein... The calibration flags are set in multiple ways corresponding to the assumed mounting height.

4. The mounting device according to any one of claims 1 to 3, wherein The calibration control unit calculates and updates the calibration value of each mounting height whenever the installation control unit completes the installation of a pre-set batch of the mounting bodies.

5. The mounting device according to any one of claims 1 to 3, wherein The calibration control unit calculates and updates the calibration value of each of the mounting heights based on the operation time of the installation operation performed by the installation control unit.

6. The mounting device according to any one of claims 1 to 3, comprising: The temperature detection unit detects the temperature of the overhead camera unit. When the temperature detection unit detects a preset temperature, the calibration control unit calculates and updates the calibration value for each of the mounting heights.

7. The mounting device according to any one of claims 1 to 3, wherein The calibration control unit and the installation control unit simultaneously process the bottom-view shooting unit to photograph the predetermined contact surface of the mounting body, and simultaneously cause the top-view shooting unit and the bottom-view shooting unit to photograph the calibration mark, and calculate the calibration value corresponding to the mounting height of the mounting body.

8. The mounting device according to any one of claims 1 to 3, wherein The overhead shooting unit includes a first shooting unit and a second shooting unit, wherein the first shooting unit and the second shooting unit are adjusted so that their respective focal planes are aligned. The installation control unit identifies the target position by correcting the temporary target position calculated based on the first top-view image of the predetermined area captured by the first imaging unit and output by the second imaging unit and output by the second imaging unit using the calibration value.

9. An installation method, which is an installation method using a mounting body with an installation device, the mounting device comprising: An installation tool picks up and holds the mounting body, places it on and mounts it onto a substrate mounted on a stage or on a predetermined mounting area defined relative to other mounting bodies already mounted on the substrate; a top-view imaging unit configures the optical systems and imaging elements to satisfy the Schahm condition, such that a plane parallel to the stage surface becomes the focal plane, and is used to take a top-view image of the predetermined mounting area relative to the stage surface from the same side as the installation tool; and a bottom-view imaging unit is used to take a bottom-view image of the mounting body held in the mounting tool state from the side opposite to the top-view imaging unit relative to the stage surface. The installation method has the following characteristics: The calibration control step calculates a calibration value to calibrate the difference between the coordinate values ​​calculated based on the top view image output by the top view camera unit and the coordinate values ​​calculated based on the bottom view image output by the bottom view camera unit. as well as The installation control step involves placing and installing the mounting body within the predetermined placement area, ensuring that the reference position of the mounting body on the installation tool aligns with the target position within the predetermined placement area. The calibration control step calculates the calibration value for each assumed mounting height of the predetermined mounting area based on the top-view and bottom-view images output by the top-view and bottom-view imaging units, which are configured to match the mounting height. The installation control steps adjust the position of the installation tool so that the predetermined contact surface in the mounting body that contacts the predetermined placement area becomes the placement height. Based on the bottom view image output by the bottom view imaging unit capturing the predetermined contact surface, the reference position is identified. The position of the top view imaging unit is adjusted so that the focal plane and the placement height are the same plane. Based on the top view image obtained by the top view imaging unit capturing the predetermined placement area and the calibration value corresponding to the placement height, the target position is identified.

10. A computer-readable storage medium storing an installation control program thereon, which controls an installation device, the installation device comprising: An installation tool picks up and holds the mounting body, places it on and mounts it onto a substrate mounted on a stage or on a predetermined mounting area defined relative to other mounting bodies already mounted on the substrate; a top-view imaging unit configures the optical systems and imaging elements to satisfy the Schahm condition, such that a plane parallel to the stage surface becomes the focal plane, and is used to take a top-view image of the predetermined mounting area relative to the stage surface, the same side as the installation tool; and a bottom-view imaging unit is used to take a bottom-view image of the mounting body held in the mounting tool's position relative to the stage surface, opposite to the side of the top-view imaging unit. The installation control program causes the computer to perform the following steps: The calibration control step calculates a calibration value to calibrate the difference between the coordinate values ​​calculated based on the top view image output by the top view camera unit and the coordinate values ​​calculated based on the bottom view image output by the bottom view camera unit. as well as The installation control step involves placing and installing the mounting body within the predetermined placement area, ensuring that the reference position of the mounting body on the installation tool aligns with the target position within the predetermined placement area. The calibration control step calculates the calibration value for each assumed mounting height of the predetermined mounting area based on the top-view and bottom-view images output by the top-view and bottom-view imaging units, which are configured to match the mounting height. The installation control steps adjust the position of the installation tool so that the predetermined contact surface in the mounting body that contacts the predetermined placement area becomes the placement height. Based on the bottom view image output by the bottom view imaging unit capturing the predetermined contact surface, the reference position is identified. The position of the top view imaging unit is adjusted so that the focal plane and the placement height are the same plane. Based on the top view image obtained by the top view imaging unit capturing the predetermined placement area and the calibration value corresponding to the placement height, the target position is identified.

Images