PCB board automatic soldering process based on reversible positioning jig

CN116475521BActive Publication Date: 2026-08-18LUOHE HONGHUANGLAN EIECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202310512366.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-05-09
Publication Date
2026-08-18
Estimated Expiration
2043-05-09

AI Technical Summary

Technical Problem

[0009]发明人通过研究发现:现有的焊线工艺方法中由于定位治具固定设置在焊接平台上,导致定位治具无法便捷换向,进而使得无法实现PCB板的双侧自动焊线工作,将定位治具可拆卸安装在焊接平台上并使用穿钉对其进行固定,换向时,拔出穿钉即可进行换向

Benefits of technology

1. 本申请利用定位治具可拆卸式安装在焊线平台上,由换向装置对一侧焊线后的PCB板进行换向,进而实现PCB板的双侧自动焊线(现有的方法多是将定位治具固定安装在焊线平台上,无法对PCB板实现双侧的自动焊线,如果需要进行双侧焊线的话,需要人工进行PCB板的换向工作,限制了PCB板焊线全自动化程度的实施)。

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Abstract

The application discloses a PCB automatic wire welding process based on a reversible positioning jig, and aims to solve the technical problem that the existing wire welding process method cannot realize automatic wire welding. The wire welding process first places a PCB in a positioning jig which is detachably installed on a wire welding platform; then uses a wire cutting and winding device to insert a lead wire on one side of the PCB in the positioning jig; uses a wire welding device to weld the side of the PCB with the lead wire; after the positioning jig is separated from the wire welding platform, uses a reversing device to rotate the positioning jig to realize the reversing of the PCB; uses the wire cutting and winding device to insert the lead wire on the other side of the PCB; finally, uses the wire welding device to weld the other side of the PCB, thereby completing the double-side wire welding work of the PCB. The wire welding process utilizes the rotation and reversing of the positioning jig, uses the reversing device to realize the reversing work of the PCB, realizes the double-side wire welding work of the PCB, and realizes the automatic wire welding of the PCB.
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Description

Technical Field

[0001] This application relates to the field of LED module wire bonding equipment technology, specifically to an automatic wire bonding process for PCB boards based on a reversible positioning fixture. Background Technology

[0002] LED modules are light-emitting light groups formed by arranging a certain number of light-emitting diodes in a regular pattern and then encapsulating them. They are mainly used to display advertising lettering (acrylic, vacuum-formed) and nighttime signage. Using text or signage as a medium, they are installed on building rooftops or walls, which can show the daytime effect of the signage and also use LEDs as a light source to create an eye-catching effect at night. When combined with an LED lighting application control system, the displayed content of the text or signage can be dynamically controlled via video. LED light source modules have become an important carrier for enterprises to conduct advertising and showcase their self-image.

[0003] Due to its superior cost-effectiveness and ease of use, this type of LED module has gained widespread customer recognition, leading to a continuously expanding market. The production process of LED modules requires soldering corresponding wires onto PCB board pads. An automatic PCB wire bonding machine is the equipment that solders these wires onto the PCB board pads, thus completing the manufacturing of the LED module.

[0004] The inventors know a wiring soldering method and a PCB board soldering structure. The method mainly includes: ① inserting the wiring into the soldering hole on the PCB board from the front side; ② soldering the wiring onto the PCB board; ③ inserting the wiring into a slot on the PCB board so that the wiring is wound to the back side of the PCB.

[0005] This method eliminates the need for applying and removing high-temperature adhesive tape before and after the soldering process, saving time on PCB wiring soldering and reducing production steps (eliminating four steps: applying and removing high-temperature adhesive tape, threading wires, and soldering wires), simplifying production. After soldering, the wires are secured in slots with adhesive to prevent them from loosening at the solder joints and from detaching from the PCB, meeting safety requirements and ensuring high stability.

[0006] However, in the process of implementing the technical solutions in the embodiments of this application, the inventors of this application discovered that the above technical solutions have at least the following technical problems: 1. Since the positioning fixtures of the PCB board are mostly fixed on the soldering table, it is impossible to rotate and change the direction of the fixtures. This means that only one side of the PCB board can be soldered. If the other side of the PCB board needs to be soldered, manual reversal is required, which makes it impossible to achieve automatic soldering of the PCB board.

[0007] 2. The conductors on the PCB board need to be wound around the soldering points, and they are mostly arc-shaped conductors. This process cannot be performed manually, so the winding of the conductors cannot be achieved automatically.

[0008] The information disclosed in this background section is intended only to enhance the understanding of the background technology of this disclosure and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0009] The inventors discovered through research that in existing wire bonding processes, the positioning fixture is fixedly set on the welding platform, which makes it difficult to change the direction of the positioning fixture. This makes it impossible to achieve automatic wire bonding on both sides of the PCB board. The positioning fixture can be detachably installed on the welding platform and fixed with pins. When changing direction, the pins can be pulled out to change the direction.

[0010] In view of at least one of the above technical problems, this disclosure provides an automatic PCB board bonding process based on a reversible positioning fixture. By detachably setting the positioning fixture on the bonding platform, the PCB board is reversible by rotating it using a reversing device, thereby completing the automatic bonding of the PCB board on both sides.

[0011] According to one aspect of this disclosure, an automated wire bonding process for PCB boards based on a reversible positioning fixture is provided, comprising the following steps: (1) Send the PCB board to be soldered into the positioning fixture that can be detachably installed on the soldering platform; (2) The wire is inserted into one side of the PCB board located inside the positioning fixture by the corresponding wire cutting and winding device; (3) Then, the wire bonding device is used to bond the wires on the side of the PCB board where the wires are inserted. (4) After the positioning fixture is removed from the wire bonding platform, the corresponding reversing device rotates the positioning fixture to the set position to realize the reversing of the PCB board; (5) The wire is then inserted onto the other side of the PCB board by the wire cutting and winding device; (6) The wire bonding device is used to bond wires to the other side of the PCB board, thereby completing the double-sided wire bonding work of the PCB board; The positioning fixture includes a support component, a positioning component disposed on the support component, and a wire clamping component that cooperates with the positioning component to fix the wire. The support assembly includes a support plate and a positioning lock block disposed at the bottom of the support plate for installation and positioning. The positioning lock block is used to detachably install the positioning fixture onto the wire bonding platform.

[0012] In some embodiments of this disclosure, a fixing plate is provided on the wire bonding platform, and a positioning slot corresponding to the positioning lock block is provided on the fixing plate. The positioning lock block fits into the positioning slot so that the positioning fixture is installed on the wire bonding platform. The positioning lock block has a through hole, and the positioning slot of the fixing plate has a through hole corresponding to the through hole, so that the through pin passes through the through hole and the through hole to fix the positioning lock block and the fixing plate.

[0013] In some embodiments of this disclosure, one end of the through pin is connected to the end cap of the power pneumatic / hydraulic cylinder, so that the extension and retraction of the power pneumatic / hydraulic cylinder drives the through pin to pull out of the positioning lock block and fixing plate or to penetrate the positioning lock block and fixing plate, thereby realizing the disassembly and assembly of the positioning fixture.

[0014] In some embodiments of this disclosure, the wire cutting and winding device includes a support plate on which: The wire feeding mechanism includes a wire feeding frame slidably mounted on the support plate, a wire support assembly mounted on the wire feeding frame, and a pressing assembly disposed above the wire support assembly; The thread cutting mechanism includes a thread cutting knife holder, an upper thread cutting knife assembly that is vertically slidably disposed on the thread cutting knife holder, and a lower thread cutting knife assembly that is disposed corresponding to the upper thread cutting knife assembly; The winding mechanism includes a winding frame disposed on the support plate, a wire clamp assembly mounted on the winding frame, and a winding assembly mounted on the winding frame; The wire feeding mechanism causes the wire to pass through the wire cutting mechanism and the wire winding mechanism in sequence to the wire welding station. After the wire cutting mechanism cuts the wire, the wire winding mechanism rotates and winds it back.

[0015] In some embodiments of this disclosure, the wire feeder includes a base, a base plate mounted on the base, and a wire feeder plate connected to the base plate via a connecting plate. The wire feeder pneumatic / hydraulic cylinder is connected to the base and drives the sliding of the wire feeder through the base. The wire support assembly is mounted on the wire feeder plate. The wire support assembly includes a support plate slidably mounted on the wire feeding plate via multiple optical axes, a support mounting plate disposed on the support plate, a wire pressing air / hydraulic cylinder mounted on the support mounting plate, and a wire pressing plate mounted on the wire pressing air / hydraulic cylinder; the wire pressing air / hydraulic cylinder presses the wire through the wire pressing plate to prevent the wire from shifting or slipping.

[0016] In some embodiments of this disclosure, the upper cutting blade assembly includes an upper blade mounting plate, a cutting blade mounted on the upper blade mounting plate, and upper stripping blades mounted on both sides of the cutting blade, wherein the top of the cutting blade is higher than the top of the two upper stripping blades. The lower cutting blade assembly includes a lower blade mounting plate, a cutting line corresponding to the cutting blade mounted on the lower blade mounting plate, and lower stripping blades corresponding to the stripping blades mounted on both sides of the cutting line. The upper blade mounting plate is connected to an upper cutting air / hydraulic cylinder, and the lower blade mounting plate is connected to a lower cutting air / hydraulic cylinder. The upper and lower cutting air / hydraulic cylinders drive the upper and lower cutting blade assemblies to cooperate and achieve the cutting action.

[0017] In some embodiments of this disclosure, the wire clamp assembly includes a wire clamp base slidably mounted on the base plate of the winding frame via a second slide rail and a second slider, vertical plates disposed on both sides of the wire clamp base, and a wire clamp plate slidably mounted on the vertical plates via a third slide rail and a third slider. The cable clamp plate is equipped with a front cable clamp main board and a rear cable clamp main board. The front cable clamp main board is equipped with a front cable clamp outer plate and a front cable clamp inner plate. The rear cable clamp main board is equipped with a rear cable clamp inner plate and a rear cable clamp outer plate. A misalignment pneumatic / hydraulic cylinder is provided on one side of the wire clamp base to adjust the lateral position of the wire clamp assembly; The clamp plate is equipped with a lifting air / hydraulic cylinder to adjust the vertical position of the clamp assembly; A downward pressure air / hydraulic cylinder for clamping the wire is correspondingly provided above the wire clamp assembly. A downward pressure plate is provided on the downward pressure air / hydraulic cylinder. The wire clamp assembly and the downward pressure plate cooperate to clamp the wire.

[0018] In some embodiments of this disclosure, the winding assembly includes a winding motor disposed on one side of the winding frame, a first winding arm connected to the output shaft of the winding motor via a bearing, a second winding arm rotatably mounted on the other side of the winding frame corresponding to the first winding arm, and a winding plate connecting the first winding arm and the second winding arm. The winding motor drives the first winding arm to rotate, which in turn causes the second winding arm and the winding plate to rotate. The winding plate supports the wire to achieve the winding action.

[0019] In some embodiments of this disclosure, the wire bonding device includes a wire bonding base, a wire bonding vertical plate that is laterally slidably disposed on the wire bonding base, and a wire bonding mechanism that is vertically slidably disposed on the wire bonding vertical plate. The wire bonding mechanism includes a wire bonding frame and a welding torch mounted on the wire bonding frame.

[0020] In some embodiments of this disclosure, the reversing device includes a reversing frame and a reversing mechanism laterally slidable on the reversing frame. The reversing mechanism includes a reversing seat, a reversing pneumatic / hydraulic cylinder mounted on the reversing seat, a gripper seat mounted on the reversing pneumatic / hydraulic cylinder, and a gripper mounted on the gripper seat for clamping a positioning fixture. The gripper seat is rotatably mounted on the end cover of the reversing pneumatic / hydraulic cylinder so that the gripper drives the rotation of the positioning fixture, thereby realizing the reversing of the PCB board.

[0021] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages: 1. This application utilizes a positioning fixture that is detachably mounted on a wire bonding platform. A reversing device reverses the orientation of the PCB board after wire bonding on one side, thereby achieving automatic wire bonding on both sides of the PCB board (existing methods mostly fix the positioning fixture on the wire bonding platform, which cannot achieve automatic wire bonding on both sides of the PCB board. If double-sided wire bonding is required, manual reversing of the PCB board is necessary, which limits the implementation of fully automated wire bonding on the PCB board).

[0022] 2. This application uses a wire cutting and winding device to automatically wind wires, eliminating the need for manual winding (existing processes often involve manually bending the wires into an arc shape and placing them on the corresponding part of the PCB board, which greatly limits the automation level of PCB board soldering). The wire cutting and winding device includes a support plate and a wire feeding mechanism for conveying wires, a wire cutting mechanism for cutting wires, and a winding mechanism for rotating the winding, all mounted on the support plate. The wire feeding mechanism feeds the wires placed on the wire feeder to the wire cutting mechanism. After being cut by the wire cutting mechanism, the winding mechanism winds the wires and delivers them to the corresponding position on the PCB board, effectively improving the PCB board soldering efficiency. Attached Figure Description

[0023] Figure 1 This is a flowchart of the wire bonding process in one embodiment of this application.

[0024] Figure 2 This is a schematic diagram of the wire cutting and winding device in one embodiment of this application.

[0025] Figure 3 This is a schematic diagram of the wire feeding mechanism in one embodiment of this application.

[0026] Figure 4 for Figure 3 Enlarged view of section A.

[0027] Figure 5 This is a schematic diagram of the wire cutting mechanism in one embodiment of this application.

[0028] Figure 6This is a schematic diagram of the upper cutting knife assembly in one embodiment of this application.

[0029] Figure 7 for Figure 6 Enlarged view of section A.

[0030] Figure 8 This is a schematic diagram of the lower wire cutter assembly in one embodiment of this application.

[0031] Figure 9 This is a schematic diagram of the winding mechanism in one embodiment of this application.

[0032] Figure 10 for Figure 9 Enlarged view of section A.

[0033] Figure 11 This is a schematic diagram of the winding assembly in one embodiment of this application.

[0034] Figure 12 This is a schematic diagram of the positioning fixture in one embodiment of this application.

[0035] Figure 13 This is a schematic diagram of the pressure wire assembly in one embodiment of this application.

[0036] Figure 14 This is a schematic diagram of the structure of the support component in one embodiment of this application.

[0037] Figure 15 This is a schematic diagram of the positioning component in one embodiment of this application.

[0038] Figure 16 for Figure 15 Enlarged view of section A.

[0039] Figure 17 This is a schematic diagram of the structure of the fixing plate in one embodiment of this application.

[0040] Figure 18 This is a schematic diagram of the wire bonding device in one embodiment of this application.

[0041] Figure 19 This is a schematic diagram of the commutation device in one embodiment of this application.

[0042] In the above figures, 1 is the support plate, 2 is the wire feeding mechanism, 3 is the wire cutting mechanism, 4 is the wire winding mechanism, 11 is the base plate, 12 is the connecting plate, 13 is the wire feeding plate, 14 is the first slider, 15 is the first slide rail, 16 is the optical axis, 17 is the support plate, 171 is the wire guide block, 1711 is the wire guide hole, 18 is the wire pressing cylinder, 19 is the wheel frame, 10 is the wire straightening wheel, 110 is the wire, 111 is the wire feeding cylinder, 112 is the wire stripping cylinder, 113 is the mounting plate, 21 is the wire cutting knife holder, 22 is the upper wire cutting knife assembly, 221 is the upper sliding plate, 222 is the upper wire cutting cylinder, and 23 is the lower wire cutting knife assembly. 1 is the lower sliding plate, 232 is the lower cutting cylinder, 24 is the upper blade mounting plate, 241 is the cutting blade, 242 is the upper stripping blade, 25 is the lower blade mounting plate, 251 is the cutting line, 252 is the lower stripping blade, 41 is the winding frame, 42 is the winding assembly, 421 is the winding motor, 422 is the first winding arm, 423 is the winding plate, 424 is the second winding arm, 425 is the proximity switch, 43 is the wire clamp assembly, 431 is the front wire clamp main board, 4311 is the front wire clamp outer plate, 4312 is the front wire clamp inner plate, 4313 is the front wire clamp cylinder, and 432 is the rear wire clamp. Main board, 4321 is the outer plate of the rear wire clamp, 4322 is the inner plate of the rear wire clamp, 44 is the pressing cylinder, 45 is the pressing plate, 46 is the wire clamp base, 47 is the vertical plate, 471 is the misalignment cylinder, 51 is the support assembly, 511 is the support plate, 5111 is the first through hole, 5112 is the positioning hole, 5113 is the second through hole, 5114 is the second bearing baffle, 512 is the positioning lock block, 5121 is the through hole, 52 is the positioning assembly, 521 is the positioning plate, 522 is the positioning piece, 5221 is the solder pad positioning pin, 523 is the wire support plate, 524 is the second guide post. 525 is the wire positioning tooth, 53 is the wire pressing assembly, 531 is the connecting block, 532 is the wire pressing plate, 533 is the first guide post, 5331 is the buffer spring, 5332 is the large-head screw, 534 is the fixing plate, 55 is the first cylinder, 56 is the second cylinder, 61 is the wire bonding seat, 612 is the second synchronous belt module, 623 is the third synchronous belt module, 62 is the wire bonding vertical plate, 63 is the wire bonding frame, 64 is the welding gun, 65 is the solder tube, 71 is the reversing vertical rod, 72 is the reversing horizontal rod, 73 is the reversing seat, 74 is the reversing cylinder, 75 is the gripper seat, and 76 is the gripper. Detailed Implementation

[0043] In the description of this application, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "vertical," "horizontal," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "first," "second," etc., used in this application are used to distinguish the described objects and do not have any sequential or technical meaning. And the terms "connection" and "linkage," unless otherwise specified, include both direct and indirect connections (linkages).

[0044] Unless otherwise specified, the unit modules (components, structures, mechanisms) or sensors involved in the following embodiments are all conventional commercially available products.

[0045] To better understand the technical solution of this application, the above technical solution will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] Example 1 This example discloses an automated PCB bonding process based on a reversible positioning fixture. See [link to documentation]. Figure 1 The workflow is as follows: the PCB board is placed in the positioning fixture—the wire cutting and winding device inserts wires on one side of the PCB board—the wire bonding device bonds the wires on the side of the PCB board with inserted wires—the PCB board is reversed—the wire cutting and winding device inserts wires on the other side of the PCB board—the wire bonding device bonds the wires on the other side of the PCB board with inserted wires. Specifically, it includes the following steps: (1) Place the PCB board into the positioning fixture that can be detachably mounted on the wire bonding platform; like Figure 12 As shown, the positioning fixture mainly includes a support component 51, a positioning component 52 for fixing PCB board pads disposed on the support component 51, and a wire pressing component 53 for fixing wires 110 in cooperation with the positioning component 52; in addition, the support component 511 cooperates with the fixing plate 534 disposed on the wire bonding platform so that the positioning fixture of this application is installed on the wire bonding machine.

[0047] Furthermore, such as Figure 13As shown, the wire pressing assembly 53 is connected to a first cylinder 55, which drives the wire pressing assembly 53 to perform the wire pressing action. When wire bonding is required, the first cylinder 55 supports the wire pressing assembly 53, creating a gap between the wire pressing assembly 53 and the positioning assembly 52 for placing the wire 110. After the wire feeding mechanism 2 feeds the wire 110 into the gap, the first cylinder 55 releases the wire pressing assembly 53, allowing the wire pressing assembly 53 and the positioning assembly 52 to clamp the wire 110, thereby achieving the clamping and positioning of the wire 110.

[0048] like Figure 14 As shown, the support assembly 51 includes a support plate 511 and a positioning lock block 512 for installation and positioning, disposed at the bottom of the support plate 511. The shape of the positioning lock block 512 matches the shape of the positioning groove on the fixing plate 534, and the positioning lock block 512 is provided with a through hole 5121 for installation. A through pin passes through the through hole 5121 and fixes the plate 534 to fix it on the wire bonding machine. In actual operation, the through pin is connected to a power cylinder, which drives the through pin to pass through the positioning lock block 512 or pulls out the through pin. When reversing is required, the power cylinder pulls out the through pin, causing the fixture to disengage from the wire bonding machine, thereby realizing the reversing of the fixture.

[0049] like Figure 15 As shown, the positioning component 52 includes a positioning plate 521 and positioning pieces 522 mounted on both sides of the positioning plate 521. A guide wire 110 support plate is provided on the outer side of each positioning piece 522. Further, as... Figure 16 As shown, the positioning plate 521 is equipped with at least two pad positioning pins 5221 for fixing PCB board pads. The PCB board pads are placed on the positioning plate 521, and the pad positioning pins 5221 are inserted into the slots or holes on the pads to achieve positioning and fixing of the PCB board pads. The positioning piece 522 is provided with a plurality of wire 110 positioning teeth, and there are gaps between adjacent wire 110 positioning teeth for placing wires 110. When a gap appears between the wire pressing assembly 53 and the positioning assembly 52, the wire feeding mechanism 2 places the wire 110 in the gap between the wire 110 positioning teeth to achieve positioning and clamping of the wire 110.

[0050] In addition, the bottom of the positioning plate 521 is connected to a second cylinder 56 via a second guide post 524. The second cylinder 56 supports the positioning plate 521 via the first guide post 533 so that the positioning component 52 can be positioned vertically. When the wire feeding mechanism 2 finishes feeding the wire, the second cylinder 56 supports the positioning component 52 to rise while the first cylinder 55 releases the wire pressing component 53 to descend, thereby clamping the wire 110.

[0051] Furthermore, the wire pressing assembly 53 includes a wire pressing plate 532 for pressing the wire 110, which is interconnected by a connecting block 531 and disposed opposite to the positioning plate 522. The bottom of the connecting block 531 is connected to the first cylinder 55 via a first guide post 533. In addition, a buffer spring 5331 is sleeved on the first guide post 533 and the second guide post 524 to buffer the pushing force of the first cylinder 55 and the second cylinder 56 on the connecting block 531 and the positioning plate 521.

[0052] As a preferred embodiment, the support plate 511 is provided with a first through hole 5111 corresponding to the first guide post 533, and both the support plate 511 and the positioning plate 521 are provided with a second through hole 5113 corresponding to the second guide post 524, so that the support assembly 51, the positioning assembly 52, and the pressure wire assembly 53 are connected together through the first guide post 533 and the second guide post 524.

[0053] Furthermore, the first guide post 533 passes through the positioning plate 521 via a first linear bearing. A first bearing baffle corresponding to the first linear bearing is provided at the bottom of the first through hole 5111 of the positioning plate 521, and a large-head screw 5332 is provided at the bottom of the first guide post 533. The second guide post 524 passes through the support plate 511 via a second linear bearing. A second bearing baffle 5114 corresponding to the second linear bearing is provided at the bottom of the second through hole 5113 of the support plate 511. The arrangement of the first bearing baffle and the second bearing baffle 5114 facilitates the installation of the first and second linear bearings. A large-head screw 5332 is also provided at the bottom of the second guide post 524. Furthermore, a buffer spring 5331 is positioned between the large-head screw 5332 and the first and second linear bearings.

[0054] In addition, such as Figure 17 As shown, the fixing plate 534 is provided with a positioning slot corresponding to the positioning lock block 512. A through hole is provided in the positioning slot so that the through pin passes through the through hole and the positioning lock block 512, and the fixture is installed on the wire bonding machine. Furthermore, the fixing plate 534 is also provided with a positioning post, and the positioning plate 521 is provided with a positioning groove corresponding to the positioning post, so that the fixture fits with the fixing plate 534. In addition, the fixing plate 534 is also provided with a first through hole 5111 or / and a second through hole 5113 corresponding to the first guide post 533 or the second guide post 524. The fixing plate 534 is relatively short, allowing only the second guide post 524 to pass through. Therefore, it is sufficient to provide a second through hole 5113 corresponding to the second guide post 524 on the fixing plate 534. Those skilled in the art can set it according to the actual production situation.

[0055] (2) Use a wire cutting and winding device to insert the wire 110 onto one side of the PCB board located in the positioning fixture; like Figure 2 As shown, the wire cutting and winding device mainly includes a wire feeding mechanism 2, a wire cutting mechanism 3, and a wire winding mechanism 4 installed on the support plate 1. The wire feeding mechanism 2 causes the wire 110 to pass through the wire cutting mechanism 3 and the wire winding mechanism 4 in sequence to the wire welding station. After the wire cutting mechanism 3 cuts the wire 110, the wire winding mechanism 4 rotates and winds the wire.

[0056] The wire feeding mechanism 2 mainly includes a wire feeding frame that slides on the support plate 1, a wire support assembly for supporting the wire 110 installed on the wire feeding frame, and a pressing assembly for pressing the wire above the wire support assembly.

[0057] Furthermore, such as Figure 3 As shown, the wire feeder includes a base, a base plate 11 mounted on the base, and a wire feeder plate 13 connected to the base plate 11 via a connecting plate 12. The wire feeder cylinder 111 is connected to the base and drives the wire feeder to slide through the base. The wire support assembly is mounted on the wire feeder plate 13.

[0058] Furthermore, the bottom of the wire feeder is provided with a first slider 14, and the support plate 1 is provided with a first slide rail 15 corresponding to the first slider 14. The wire feeder slides on the support plate 1 via the first slide rail 15 and the first slider 14. The wire feeder is connected to a wire feeder cylinder 111 and a wire stripping cylinder 112 for providing sliding force. The wire stripping cylinder 112 is a short-stroke cylinder. When the wire stripping blade is in position, the wire stripping cylinder 112 drives the wire feeder to slide slightly, stripping the outer sheath of the wire 110 to facilitate soldering the wire 110 onto the PCB board.

[0059] Preferably, the wire support assembly includes a support plate 17 slidably mounted on the wire feeding plate 13 via multiple optical axes 16, a support mounting plate disposed on the support plate 17, a wire pressing cylinder 18 mounted on the support mounting plate, and a wire pressing plate mounted on the wire pressing cylinder 18; the wire pressing cylinder 18 presses the wire 110 with the wire pressing plate to prevent the wire 110 from shifting or slipping. Further, as... Figure 4 As shown, the support plate 17 is also provided with a plurality of wire guide blocks 171, and the wire guide blocks 171 are provided with a plurality of wire guide holes 1711 corresponding to the wires 110, so as to further prevent the wires 110 from shifting or slipping.

[0060] Furthermore, the inlet side of the support plate 17 is provided with a wire guide plate, which has a plurality of wire hole groups corresponding to the wire 110; the inlet end of the wire feed plate 13 is provided with a wire pulley group, which includes a pulley frame 19 and a plurality of wire-aligning pulleys 10 mounted on the pulley frame 19. The wire hole groups restrict the wire 110 to prevent it from shifting or slipping, and the wire-aligning pulleys 10 ensure the smooth transport of the wire 110, thereby improving the transport efficiency of the wire 110.

[0061] Furthermore, such as Figure 5 As shown, the thread cutting mechanism 3 includes a thread cutting blade holder 21, an upper thread cutting blade assembly 22 vertically slidably disposed on the thread cutting blade holder 21, and a lower thread cutting blade assembly 23 corresponding to the upper thread cutting blade assembly 22; as a preferred embodiment, such as Figure 6 and Figure 7 As shown, the upper wire cutting blade assembly 22 includes an upper blade mounting plate 24, a wire cutting blade 241 mounted on the upper blade mounting plate 241, and upper wire stripping blades 242 mounted on both sides of the wire cutting blade 241. The top of the wire cutting blade 241 is higher than the top of the two upper wire stripping blades 242. The wire cutting blade 241 needs to cut the wire 110, while the wire stripping blades only need to strip the outer sheath of the wire 110. Figure 8 As shown, the lower cutting blade assembly 23 includes a lower blade mounting plate 25, a cutting line 251 corresponding to the cutting blade 241 mounted on the lower blade mounting plate 25, and lower stripping blades 252 corresponding to the stripping blades mounted on both sides of the cutting line 251; the wire 110 is cut by the cooperation of the upper cutting blade assembly 22 and the lower cutting blade assembly 23.

[0062] Furthermore, the upper blade mounting plate 24 is connected to the upper cutting cylinder 222 via the upper sliding plate 221, and the lower blade mounting plate 25 is connected to the lower cutting cylinder 232 via the lower sliding plate 231. This allows the upper cutting blade assembly 22 and the lower cutting blade assembly 23 to drive the cutting action, effectively improving cutting efficiency. The cutting blade holder 21 is equipped with a mounting plate for mounting the upper cutting cylinder 222 and the lower cutting cylinder 232. The upper cutting cylinder 222 and the lower cutting cylinder 232 can be mounted on the mounting plate.

[0063] Furthermore, such as Figure 9As shown, the winding mechanism 4 includes a winding frame 41 disposed on the support plate 1, a wire clamp assembly 43 mounted on the winding frame 41 for fixing the wire 110, and a winding assembly 42 mounted on the winding frame 41 for rotating the winding; further, the wire clamp assembly 43 includes a wire clamp base 46 slidably mounted on the base plate 11 of the winding frame 41 via a second slide rail and a second slider, vertical plates 47 disposed on both sides of the wire clamp base 46, and a wire clamp plate slidably mounted on the vertical plate 47 via a third slide rail and a third slider.

[0064] like Figure 10 As shown, the wire clamp plate is equipped with a front wire clamp main board 431 and a rear wire clamp main board 432. The front wire clamp main board 431 is equipped with a front wire clamp outer plate 4311 and a front wire clamp inner plate 4312. The rear wire clamp main board 432 is equipped with a rear wire clamp inner plate 4322 and a rear wire clamp outer plate 4321. The front wire clamp main board 431, the rear wire clamp main board 432, the front wire clamp outer plate 4311, the rear wire clamp outer plate 4321, the front wire clamp inner plate 4312, and the rear wire clamp inner plate 4322 are provided with protrusions corresponding to the wire 110 for clamping the wire 110. By providing a front clamping cylinder and a rear clamping cylinder, the protrusions of the front wire clamp outer plate 4311 and the front wire clamp inner plate 4312, and the rear wire clamp outer plate 4321 and the rear wire clamp inner plate 4322 are clamped together.

[0065] In addition, such as Figure 11 As shown, a misalignment cylinder 471 is connected to one side of the wire clamp base 46 to adjust the lateral position of the wire clamp assembly 43; a lifting cylinder is connected to the wire clamp plate to adjust the vertical position of the wire clamp assembly 43; during operation, the up, down, left, and right positions of the wire clamp assembly 43 need to be adjusted by the misalignment cylinder 471 and the lifting cylinder to ensure that the wire clamp assembly 43 clamps the wire 110 tightly.

[0066] A pressing cylinder 44 for pressing the wire 110 is correspondingly provided above the wire clamp assembly 43. A pressing plate 45 is provided on the pressing cylinder 44. The wire clamp assembly 43 and the pressing plate 45 work together to press the wire 110. When cutting the wire 110, it is necessary to fix the wire 110 to prevent it from shifting and affecting the cutting work. Therefore, the pressing cylinder 44 and the pressing plate 45 need to work together to press the wire 110 into the wire clamp to ensure the smooth progress of the wire cutting work.

[0067] Furthermore, the winding assembly 42 includes a winding motor 421 disposed on one side of the winding frame 41, a first winding arm 422 connected to the output shaft of the winding motor 421 via bearings, a second winding arm 424 rotatably mounted on the other side of the winding frame 41 corresponding to the first winding arm 422, and a winding plate 423 connecting the first winding arm 422 and the second winding arm 424. The winding motor 421 drives the first winding arm 422 to rotate, thereby causing the second winding arm 424 and the winding plate 423 to rotate. The winding plate 423 supports the wire 110 to achieve the winding action. The winding motor 421 is electrically connected to a proximity switch 425. After the wire cutting and stripping action is completed, the winding motor 421 is brought close to the workstation to perform the winding action.

[0068] In addition, the bottom of the winding frame 41 is slidably mounted on the support plate 1 via the fourth slide rail and the fourth slider, and the winding frame 41 is provided with a sliding cylinder for pushing it to slide along the fourth slide rail, so that the winding mechanism 4 is close to the PCB board station or close to the wire cutting mechanism 3, so as to facilitate wire feeding.

[0069] During wire cutting and winding, the wire 110 passes sequentially through the wire feeding mechanism 2, the wire cutting mechanism 3, and the winding mechanism 4. The wire cutting mechanism 3 strips and cuts the wire. After completion, the wire feeding cylinder 111 drives the wire feeding frame to feed the wire forward, so that the wire 110 passes through the wire cutting mechanism 3 and the winding mechanism 4 again. The downward pressing cylinder 44 of the winding mechanism 4, together with the downward pressing plate 45, clamps the wire 110 in the wire clamp assembly 43. The wire feeding cylinder 111 drives the wire feeding frame to retract, and the wire 110 is stretched. At this time, after the wire cutting mechanism 3 strips and cuts the wire again, the sliding motor of the winding mechanism 4 drives the winding frame 41 to approach the PCB board fixture. The winding motor 421 then winds the wire to complete the wire cutting and winding work. At this time, the winding mechanism 4 again approaches the wire cutting mechanism 3 through the sliding motor.

[0070] (3) Use a wire bonding device to bond wires to the side of the PCB board where the conductor 110 is inserted; such as Figure 18 As shown, the wire bonding device includes a wire bonding base 61, a wire bonding vertical plate 62 slidably disposed on the wire bonding base 61, and a wire bonding mechanism slidably disposed on the wire bonding vertical plate 62. The wire bonding mechanism includes a wire bonding frame 63 and a welding torch 64 mounted on the wire bonding frame 63. The wire bonding vertical plate 62 is slidably disposed on the wire bonding base 61 via a first synchronous belt module, and the wire bonding frame 63 is slidably disposed on the wire bonding vertical plate 62 via a second synchronous belt module 612. The wire bonding frame 63 is also provided with an outlet pipe for providing welding medium, such as a solder outlet pipe 65. The solder outlet of the solder outlet pipe 65 corresponds to the welding torch 64 to facilitate the welding operation of the welding torch 64.

[0071] (4) After the positioning fixture is disengaged from the wire bonding platform, the positioning fixture is rotated using a reversing device to achieve the reversal of the PCB board; such as Figure 19 As shown, the reversing device includes a reversing frame and a reversing mechanism laterally slidable on the reversing frame. The reversing frame includes a reversing vertical rod 71 and a reversing horizontal rod 72 connected to each other. The reversing mechanism includes a reversing seat 73, a reversing cylinder 74 mounted on the reversing seat 73, a gripper seat 75 mounted on the reversing cylinder 74, and a gripper 76 mounted on the gripper seat 75 for clamping a positioning fixture. The gripper seat 75 is rotatably mounted on the end cover of the reversing cylinder 74 so that the gripper 76 drives the rotation of the positioning fixture, thereby realizing the reversing of the PCB board. The gripper seat 75 is connected to a reversing motor through a synchronous belt assembly, and the rotation of the gripper seat 75 is driven by the reversing motor to realize the reversing.

[0072] (5) Use a wire cutting and winding device to insert the wire 110 onto the other side of the PCB board.

[0073] (6) Use a wire bonding device to bond wires to the other side of the PCB board, thereby completing the double-sided wire bonding work of the PCB board.

[0074] Although some preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the invention.

[0075] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this application and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. An automated PCB bonding process based on a reversible positioning fixture, characterized in that, Includes the following steps: (1) Send the PCB board to be soldered into the positioning fixture that can be detachably installed on the soldering platform; (2) The wire is inserted into one side of the PCB board located inside the positioning fixture by the corresponding wire cutting and winding device; (3) Then, the wire bonding device is used to bond the wires on the side of the PCB board where the wires are inserted. (4) After the positioning fixture is removed from the wire bonding platform, the corresponding reversing device rotates the positioning fixture to the set position to realize the reversing of the PCB board; (5) The wire is then inserted onto the other side of the PCB board by the wire cutting and winding device; (6) The wire bonding device is used to bond wires to the other side of the PCB board, thereby completing the double-sided wire bonding work of the PCB board; The positioning fixture includes a support component, a positioning component disposed on the support component, and a wire clamping component that cooperates with the positioning component to fix the wire. The support assembly includes a support plate and a positioning lock block disposed at the bottom of the support plate for installation and positioning. The positioning lock block is used to detachably install the positioning fixture onto the wire bonding platform. A fixing plate is provided on the wire bonding platform. The fixing plate has a positioning slot corresponding to the positioning lock block. The positioning lock block fits into the positioning slot so that the positioning fixture is installed on the wire bonding platform. The positioning lock block has a through hole, and the positioning slot of the fixing plate has a through hole corresponding to the through hole, so that the through pin passes through the through hole and the through hole to fix the positioning lock block and the fixing plate. One end of the through pin is connected to the end cap of the power pneumatic / hydraulic cylinder, so that the extension and retraction of the power pneumatic / hydraulic cylinder drives the through pin to pull out of the positioning lock block and fixing plate or to pass into the positioning lock block and fixing plate, thereby realizing the disassembly and assembly of the positioning fixture.

2. The PCB automatic wire bonding process according to claim 1, characterized in that, The wire cutting and winding device includes a support plate on which the following is mounted: The wire feeding mechanism includes a wire feeding frame slidably mounted on the support plate, a wire support assembly mounted on the wire feeding frame, and a pressing assembly disposed above the wire support assembly; The thread cutting mechanism includes a thread cutting knife holder, an upper thread cutting knife assembly that is vertically slidably disposed on the thread cutting knife holder, and a lower thread cutting knife assembly that is disposed corresponding to the upper thread cutting knife assembly; The winding mechanism includes a winding frame disposed on the support plate, a wire clamp assembly mounted on the winding frame, and a winding assembly mounted on the winding frame; The wire feeding mechanism causes the wire to pass through the wire cutting mechanism and the wire winding mechanism in sequence to the wire welding station. After the wire cutting mechanism cuts the wire, the wire winding mechanism rotates and winds it back.

3. The PCB board automatic wire bonding process according to claim 2, characterized in that, The wire feeder includes a base, a base plate mounted on the base, and a wire feeder plate connected to the base plate via a connecting plate. A wire feeder pneumatic / hydraulic cylinder is connected to the base and drives the wire feeder to slide through the base. The wire support assembly is mounted on the wire feeder plate. The wire support assembly includes a support plate slidably mounted on the wire feeding plate via multiple optical axes, a support mounting plate disposed on the support plate, a wire pressing air / hydraulic cylinder mounted on the support mounting plate, and a wire pressing plate mounted on the wire pressing air / hydraulic cylinder; the wire pressing air / hydraulic cylinder presses the wire through the wire pressing plate to prevent the wire from shifting or slipping.

4. The PCB automatic wire bonding process according to claim 3, characterized in that, The upper cutting blade assembly includes an upper blade mounting plate, a cutting blade mounted on the upper blade mounting plate, and upper stripping blades mounted on both sides of the cutting blade, with the top of the cutting blade higher than the top of the two upper stripping blades. The lower cutting blade assembly includes a lower blade mounting plate, a cutting line corresponding to the cutting blade mounted on the lower blade mounting plate, and lower stripping blades corresponding to the stripping blades mounted on both sides of the cutting line. The upper blade mounting plate is connected to an upper cutting air / hydraulic cylinder, and the lower blade mounting plate is connected to a lower cutting air / hydraulic cylinder. The upper and lower cutting air / hydraulic cylinders drive the upper and lower cutting blade assemblies to cooperate and achieve the cutting action.

5. The PCB automatic wire bonding process according to claim 4, characterized in that, The wire clamp assembly includes a wire clamp base that is slidably mounted on the base plate of the winding frame via a second slide rail and a second slider, vertical plates disposed on both sides of the wire clamp base, and a wire clamp plate that is slidably mounted on the vertical plates via a third slide rail and a third slider. The cable clamp plate is equipped with a front cable clamp main board and a rear cable clamp main board. The front cable clamp main board is equipped with a front cable clamp outer plate and a front cable clamp inner plate. The rear cable clamp main board is equipped with a rear cable clamp inner plate and a rear cable clamp outer plate. A misalignment pneumatic / hydraulic cylinder is provided on one side of the wire clamp base to adjust the lateral position of the wire clamp assembly; The clamp plate is equipped with a lifting air / hydraulic cylinder to adjust the vertical position of the clamp assembly; A downward pressure air / hydraulic cylinder for clamping the wire is correspondingly provided above the wire clamp assembly. A downward pressure plate is provided on the downward pressure air / hydraulic cylinder. The wire clamp assembly and the downward pressure plate cooperate to clamp the wire.

6. The PCB board automatic wire bonding process according to claim 5, characterized in that, The winding assembly includes a winding motor disposed on one side of the winding frame, a first winding arm connected to the output shaft of the winding motor via a bearing, a second winding arm rotatably mounted on the other side of the winding frame corresponding to the first winding arm, and a winding plate connecting the first winding arm and the second winding arm. The winding motor drives the first winding arm to rotate, which in turn causes the second winding arm and the winding plate to rotate. The winding plate supports the wire to achieve the winding action.

7. The PCB board automatic wire bonding process according to claim 1, characterized in that, The wire bonding device includes a wire bonding base, a wire bonding vertical plate that is horizontally slidably disposed on the wire bonding base, and a wire bonding mechanism that is vertically slidably disposed on the wire bonding vertical plate. The wire bonding mechanism includes a wire bonding frame and a welding gun mounted on the wire bonding frame.

8. The PCB automatic wire bonding process according to claim 1, characterized in that, The reversing device includes a reversing frame and a reversing mechanism laterally slidable on the reversing frame. The reversing mechanism includes a reversing seat, a reversing pneumatic / hydraulic cylinder mounted on the reversing seat, a gripper seat mounted on the reversing pneumatic / hydraulic cylinder, and a gripper mounted on the gripper seat for clamping a positioning fixture. The gripper seat is rotatably mounted on the end cover of the reversing pneumatic / hydraulic cylinder so that the gripper drives the rotation of the positioning fixture, thereby realizing the reversing of the PCB board.

Citation Information

Patent Citations

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